Light source unit, illumination unit, exposure device, and exposure method

Abstract

The light source unit includes a heat sink and a plurality of light source elements two-dimensionally arranged on a first surface of the heat sink, a plurality of protruding portions are formed on the first surface of the heat sink, and the plurality of protruding portions protrude from the first surface and respectively overlap with at least one of the plurality of light source elements in a plan view.

Description

Technical Field

[0001] It involves light source units, illumination units, exposure devices, and exposure methods. Background Technology

[0002] In recent years, liquid crystal display (LCD) panels have been widely used as display components in personal computers, televisions, and other devices. LCD panels are manufactured by forming the circuit patterns of thin-film transistors on a plate (glass substrate) using photolithography. The apparatus used for this photolithography process employs a photoresist layer exposure device that projects the original pattern formed on a mask onto the plate via a projection optics system.

[0003] Among the various optical devices that include the above-mentioned exposure apparatus, a solution using a light source employing a light-emitting diode has been proposed (for example, Patent Document 1).

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2006-201476 Summary of the Invention

[0007] According to the first disclosure, the light source unit includes: a heat sink; and a plurality of light source elements arranged in two dimensions on a first surface of the heat sink, wherein a plurality of protrusions are formed on the first surface of the heat sink, the plurality of protrusions protruding from the first surface and overlapping with at least one of the plurality of light source elements when viewed from above.

[0008] According to the second disclosure, the illumination unit includes: the aforementioned light source unit; and an illumination optical system that guides light emitted from the light source unit to the irradiated object.

[0009] According to the third disclosure, the illumination unit includes a plurality of the aforementioned light source units; and an illumination optical system comprising a synthesizing optical element for synthesizing light emitted from the plurality of said light source units, the illumination optical system guiding the synthesized light emitted from the synthesizing optical element to an irradiated object.

[0010] According to the fourth disclosure, the exposure apparatus includes: the aforementioned illumination unit; and a projection optical system that projects a patterned image of a mask illuminated by the illumination unit onto a photosensitive substrate.

[0011] According to the fifth disclosure, the exposure method is a method using the above-described exposure apparatus, comprising: illuminating the mask using the illumination unit; and projecting a patterned image of the mask onto a photosensitive substrate using the projection optics system.

[0012] Furthermore, the configuration of the embodiments described later can be appropriately modified, and at least some components can be replaced with other components. Moreover, the configuration of components not particularly limited in its arrangement is not limited to the configuration disclosed in the embodiments, and can be configured in positions that achieve its function. Attached Figure Description

[0013] Figure 1 This is a schematic diagram showing the configuration of the exposure apparatus according to the first embodiment. Figure 2 This is a schematic diagram showing the configuration of the lighting unit. Figure 3 (A) is a top view that roughly shows the structure of the radiator. Figure 3 (B) is Figure 3 AA-line section view of (A). Figure 4 (A) is a top view that schematically shows the first light source array and the second light source array mounted on the heat sink. Figure 4 (B) is Figure 4 Sectional view of line AA of (A), Figure 4 (C) is magnified. Figure 4 The diagram of the part enclosed by circle C1 in (B). Figure 5 (A) is a further amplification Figure 4 The diagram of the part enclosed by circle C1 in (B). Figure 5 (B) is an equivalent circuit diagram of the first light source unit and the second light source unit in the first embodiment. Figure 6 This is a diagram used to illustrate the first and second magnifying optical systems. Figure 7 (A) is a top view showing the heat sink of Modified Example 1 of the first embodiment. Figure 7 (B) is a top view showing the state in which the first light source array and the second light source array are installed on the heat sink in Modified Example 1. Figure 8 (A) is a top view showing the heat sink of Modified Example 2 of the first embodiment. Figure 8 (B) is a top view showing the state in which the first light source array and the second light source array are installed on the heat sink in Modified Example 2. Figure 9 (A) is a top view illustrating the heat sink according to the second embodiment. Figure 9 (B) is Figure 9 AA-line section view of (A). Figure 10 (A) is a top view of the heat sink of Modified Example 1 of the second embodiment. Figure 10 (B) is Figure 10 AA-line section view of (A). Figure 11 (A) is a top view of the heat sink of Modified Example 2 of the second embodiment. Figure 11 (B) is Figure 11 AA-line section view of (A). Figure 12 This is a cross-sectional view illustrating the heat sink according to the third embodiment. Figure 13 This diagram shows the configuration of a preferred lighting unit when using the heat sink of the third embodiment. Figure 14 (A) is a top view that schematically shows the configuration of the heat sink according to the fourth embodiment. Figure 14 (B) is Figure 14 AA-line section view of (A). Figure 15 (A) is a top view schematically showing the state in which the first light source array and the second light source array are installed on the heat sink in the fourth embodiment. Figure 15 (B) is Figure 15 Sectional view of line AA of (A), Figure 15 (C) is magnified. Figure 15 The diagram of the portion enclosed by ellipse C1 in (B). Figure 16 This is an equivalent circuit diagram of the first light source unit and the second light source unit in the fourth embodiment. Figure 17 (A) is a top view schematically showing the configuration of the heat sink in a modified example of the fourth embodiment. Figure 17 (B) is Figure 17 AA-line section view of (A). Figure 18 (A) is a top view schematically showing the state in which the heat sink of the fourth embodiment is equipped with the first light source array and the second light source array. Figure 18 (B) is Figure 18 Sectional view of line AA of (A), Figure 18 (C) is magnified. Figure 18 The diagram of the portion enclosed by ellipse C1 in (B). Figure 19 This is an equivalent circuit diagram of the first light source unit and the second light source unit in a modified example of the fourth embodiment. Detailed Implementation

[0014] First Implementation Method based on Figures 1-6 The exposure apparatus 10 of the first embodiment will be described.

[0015] (Composition of the exposure device) Figure 1 This is a diagram that schematically illustrates the configuration of the exposure apparatus 10 according to the first embodiment.

[0016] Exposure apparatus 10 is a scanning stepper (scanner) that transfers a pattern formed on the mask MSK onto the plate P by driving the mask MSK and the glass substrate (hereinafter referred to as "plate") P in the same direction and at the same speed relative to the projection optical system PL. The plate P is, for example, a rectangular glass substrate for a liquid crystal display device (flat panel display), with at least one side length or diagonal length of 500 mm or more.

[0017] Hereinafter, the direction in which the mask MSK and plate P are driven during scanning exposure (scanning direction) is set as the X-axis direction, the direction in the horizontal plane orthogonal to it is set as the Y-axis direction, the direction orthogonal to the X-axis and Y-axis is set as the Z-axis direction, and the rotation (tilt) directions around the X-axis, Y-axis and Z-axis are set as θx, θy and θz directions respectively.

[0018] The exposure apparatus 10 includes an illumination system IOP, a mask stage MST for holding the mask MSK, a projection optics system PL, a main body 70 supporting these components, a substrate stage PST for holding the plate P, and a control system for these components. The control system provides unified control over all components of the exposure apparatus 10.

[0019] The main body 70 includes a base (vibration damping platform) 71, columns 72A and 72B, an optical platform 73, a support body 74, and a sliding guide 75. The base (vibration damping platform) 71 is positioned on the ground F to dampen vibrations from the ground F and to support columns 72A and 72B. Columns 72A and 72B are each frame-shaped, with column 72A positioned inside column 72B. The optical platform 73 is a flat plate and is fixed to the top of column 72A. The support body 74 is supported on the top of column 72B via the sliding guide 75. The sliding guide 75 includes a pneumatic ball lifter and a positioning mechanism to position the support body 74 (i.e., the mask stage MST described later) relative to the optical platform 73 at an appropriate position in the X-axis direction.

[0020] The illumination system IOP is positioned above the main body 70. The illumination system IOP illuminates the mask MSK with illumination light IL. The detailed configuration of the illumination system IOP will be described later.

[0021] The mask stage MST is supported by a support 74. A patterned surface with a circuit pattern is fixed on the mask stage MST by, for example, vacuum adsorption (or electrostatic adsorption). Figure 1The mask MSK is the lower surface of the mask. The mask stage MST is driven, for example, by a drive system including a linear motor in the scanning direction (X-axis direction) with a specified stroke, and is slightly driven in the non-scanning directions (Y-axis direction and θz direction).

[0022] The position information (including rotation information in the θz direction) of the mask stage MST in the XY plane is measured by an interferometer system. The interferometer system measures the position of the mask stage MST by illuminating a measuring beam onto a moving mirror (or a mirror-processed reflective surface (not shown)) located at one end of the mask stage MST and receiving the reflected light from the moving mirror. The measurement results are supplied to a control device (not shown), which drives the mask stage MST via a drive system according to the measurement results from the interferometer system.

[0023] The projection optical system PL is supported on the optical platform 73 below the mask stage MST (on the -Z side). The projection optical system PL is configured similarly to, for example, the projection optical system disclosed in U.S. Patent No. 5,729,331, including a plurality (e.g., seven) of projection optical units 100 (multi-lens projection optical units) arranged in an alternating pattern to form an image field with the Y-axis as its long side. Here, four projection optical units 100 are arranged at predetermined intervals in the Y-axis direction, and the remaining three projection optical units 100 are separated from the four projection optical units 100 towards the +X side and arranged at predetermined intervals in the Y-axis direction. Each of the plurality of projection optical units 100 may, for example, use a projection optical unit that forms an upright image using a system of equal magnification with both sides telecentric. Furthermore, the plurality of projection areas of the alternatingly arranged projection optical units 100 are collectively referred to as the exposure area.

[0024] When the illumination area on the mask MSK is illuminated by the illumination light IL from the illumination system IOP, the illumination light IL transmitted through the mask MSK forms a projected image (partially upright image) of the circuit pattern of the mask MSK in the illumination area (exposure area (conjugate with the illumination area)) on the plate P disposed on the image plane side of the projection optics system PL via the projection optics system PL. Here, a resist (sensor) is coated on the surface of the plate P. The mask stage MST and the substrate stage PST are driven synchronously, that is, the mask MSK is driven in the scanning direction (X-axis direction) relative to the illumination area (illumination light IL), and the plate P is driven in the same scanning direction relative to the exposure area (illumination light IL), thereby exposing the plate P and transferring the pattern of the mask MSK onto the plate P.

[0025] The substrate stage PST is positioned on a base (vibration damping platform) 71 below (on the -Z side) of the projection optical system PL. The substrate P is held on the substrate stage PST via a substrate holder (not shown).

[0026] The position information (including rotation information (rotation in the θz direction, pitch in the θx direction, and roll in the θy direction)) of the substrate stage PST in the XY plane is measured by an interferometer system. The interferometer system measures the position of the substrate stage PST by illuminating a measuring beam from the optical platform 73 onto a moving mirror (or a mirror-processed reflective surface (not shown)) located at the end of the substrate stage PST and receiving the reflected light from the moving mirror. The measurement results are supplied to a control device (not shown), which drives the substrate stage PST according to the measurement results of the interferometer system.

[0027] In the exposure apparatus 10, alignment measurements (e.g., EGA) are performed before exposure, and the results are used to expose the board P in the following sequence. First, the mask stage MST and the substrate stage PST are driven synchronously along the X-axis direction according to the instructions of the control device. This performs a scan exposure of the first exposure area on the board P. After the scan exposure of the first exposure area is completed, the control device moves (steps) the substrate stage PST to the position corresponding to the second exposure area. Then, the second exposure area is scan exposed. Similarly, the control device transfers the pattern of the mask MSK to all exposure areas on the board P by repeating the stepping between exposure areas of the board P and the scan exposure of the exposure areas.

[0028] (Composition of the IOP of the lighting system) Next, the configuration of the lighting system IOP in this embodiment will be described. The lighting system IOP includes multiple lighting units 90, each corresponding to a plurality of projection optical units 100 included in the projection optical system PL. Figure 2 This is a diagram that roughly shows the configuration of the lighting unit 90.

[0029] The lighting unit 90 includes a first light source unit OPU1, a second light source unit OPU2, and an lighting optical system 80.

[0030] (Composition of the light source unit) The first light source unit OPU1 includes a heat sink 40, a first light source array 20A, and a first magnifying optical system 30A, while the second light source unit OPU2 includes a heat sink 40, a second light source array 20B, and a second magnifying optical system 30B.

[0031] Figure 3 (A) is a top view that schematically shows the configuration of the radiator 40. Figure 3 (B) is Figure 3(A) is a cross-sectional view along line AA. In this embodiment, the heat sink 40 has a rectangular planar shape. In the following description, the long side direction of the heat sink 40 will be defined as the X1 direction, the short side direction as the Y1 direction, and the thickness direction as the Z1 direction. The X1 direction, Y1 direction, and Z1 direction are orthogonal to each other.

[0032] In this embodiment, the heat sink 40 is made of a metal such as copper and is a microchannel heat sink with a thickness of 7 mm or less.

[0033] The radiator 40 internally has a flow channel 402 for refrigerant to pass through, a refrigerant inlet 403 for supplying refrigerant to the flow channel 402, and a refrigerant outlet 404 for discharging refrigerant passing through the flow channel 402. Figure 3 In (A), the flow channel 402 is indicated by a dashed line. In this embodiment, the flow channel 402 extends meanderingly inside the heat sink 40.

[0034] like Figure 3 As shown in (B), the heat sink 40 has a first surface 40a and a second surface 40b facing each other. A plurality of protrusions 401 are formed on the first surface 40a, protruding from the first surface 40a and extending along the Y1 direction. In this embodiment, each protrusion 401 is a part of the heat sink 40. That is, the protrusion 401 is made of a metal such as copper. The protrusion 401 can be formed, for example, by etching the first surface 40a of the heat sink 40 using a photoresist patterned by a photolithography process as a mask. Alternatively, the protrusion 401 can be formed by machining the first surface 40a of the heat sink 40.

[0035] An insulating layer 41 and a wiring layer 42 are sequentially formed on the first surface 40a on both sides of each protrusion 401 in the X1 direction. The insulating layer 41 is, for example, an insulating material such as a prepreg. The wiring layer 42 is, for example, a metal foil such as copper foil.

[0036] Figure 4 (A) is a top view schematically showing the state in which the first light source array 20A and the second light source array 20B are mounted on the heat sink 40. Figure 4 (B) is Figure 4 Sectional view of line AA of (A), Figure 4 (C) is magnified. Figure 4 The diagram shows the portion enclosed by circle C1 in (B). Additionally, Figure 5 (A) is a further amplification Figure 4 The diagram shows the portion enclosed by circle C1 in (B). Furthermore, in... Figure 4 (B) Figure 4 (C) and Figure 5The shaded lines of LED chips 23A and 23B, which will be described later, are omitted in (A).

[0037] like Figure 4 As shown in (A), the first light source array 20A includes a plurality of light sources arranged in two dimensions on the first surface 40a of the heat sink 40 (in Figure 4 (A) contains 5×5 LED (Light Emitting Diode) chips 23A. The number of LED chips 23A can be changed as needed.

[0038] Each LED chip 23A is configured to coincide with any one of the plurality of protrusions 401 when viewed from above. In other words, each protrusion 401 coincides with at least one of the plurality of LED chips 23A when viewed from above.

[0039] like Figure 5 As shown in (A), each LED chip 23A has a light-emitting portion 231A, a packaging substrate 232 for holding the light-emitting portion 231A, an anode-side electrode 233, and a cathode-side electrode 234. The packaging substrate 232 has electrical insulation properties and is made of ceramic such as aluminum nitride with high thermal conductivity.

[0040] like Figure 4 (C) and Figure 5 As shown in (A), each LED chip 23A is connected to the protrusion 401 and the wiring layer 42 via solder 44. Figure 5 As shown in (A), in this embodiment, the total thickness (height) H1 of the insulating layer 41 and the total thickness (height) H2 of the wiring layer 42 is equal to the height H3 of the protrusion 401. That is, the distance from the upper surface of the protrusion 401 to the first surface 40a is equal to the distance from the upper surface of the wiring layer 42 to the first surface 40a. In other words, the surface of the protrusion 401 opposite to the LED chip 23A and the surface of the wiring layer 42 opposite to the LED chip 23A are on the same plane. Accordingly, the adhesion between the LED chip 23A and the wiring layer 42 and the protrusion 401 can be improved. Furthermore, the total thickness H1 of the insulating layer 41 and the total thickness H2 of the wiring layer 42 may not be exactly the same as the height H3 of the protrusion 401, and there may be a difference in the degree of manufacturing error between the total thickness H1 of the insulating layer 41 and the total thickness H2 of the wiring layer 42 and the height H3 of the protrusion 401.

[0041] In this embodiment, adjacent LED chips 23A in the X1 direction are connected in series by wiring layer 42, such as in Figure 4 As indicated by arrow AR1 in (B), current flows through wiring layer 42 and LED chip 23A, for example, in the -X1 direction.

[0042] Figure 5(B) is an equivalent circuit diagram of the first light source unit OPU1 and the second light source unit OPU2 in the first embodiment. Figure 5 As shown in (B), the LED chip 23A, which is connected in series by the wiring layer 42, is connected to the control board 26 via the connector 25. The control board 26 controls the current value supplied to the LED chip 23A, etc.

[0043] like Figure 4 As shown in (A), the LED chips 23A are arranged at a spacing of P1, where P1 is the distance between the centers of adjacent LED chips 23A.

[0044] As described above, each of the multiple LED chips 23A has a light-emitting portion 231A, and the peak wavelength of the light emitted from the light-emitting portion 231A is in the range of 380 to 390 nm. That is, the light-emitting portion 231A is an ultraviolet LED (UV LED). The peak wavelength of the light emitted from the light-emitting portion 231A is preferably 385 nm. The light-emitting surface of the light-emitting portion 231A is square, and the length of one side is a1. The Z1 direction is approximately parallel to the optical axis of the light emitted from the light-emitting portion 231A.

[0045] The second light source array 20B includes multiple (in) two-dimensionally arranged on the first surface 40a of the heat sink 40. Figure 4 (A) contains 5×5 LED chips 23B. The number of LED chips 23B can be changed as needed.

[0046] Each LED chip 23B is configured to coincide with any one of the plurality of protrusions 401 when viewed from above. In other words, each protrusion 401 coincides with at least one of the plurality of LED chips 23B when viewed from above.

[0047] like Figure 5 As shown in (A), each LED chip 23B has a light-emitting part 231B, a packaging substrate 232 for holding the light-emitting part 231B, an anode side electrode 233, and a cathode side electrode 234.

[0048] like Figure 4 As shown in (C), each LED chip 23B is connected to the protrusion 401 and the wiring layer 42 via solder 44. Figure 5 As shown in (A), in this embodiment, the total thickness (height) H1 of the insulating layer 41 and the thickness (height) H2 of the wiring layer 42 are equal to the height H3 of the protrusion 401. That is, the distance from the upper surface of the protrusion 401 to the first surface 40a is equal to the distance from the upper surface of the wiring layer 42 to the first surface 40a. Accordingly, the adhesion between the LED chip 23B and the wiring layer 42 and the protrusion 401 can be improved. In this embodiment, LED chips 23B adjacent to each other in the X1 direction are connected in series by the wiring layer 42, such as... Figure 4 As indicated by arrow AR1 in (B), current flows through wiring layer 42 and LED chip 23B, for example, in the -X1 direction. Figure 5 As shown in (B), the LED chip 23B, which is connected in series by the wiring layer 42, is connected to the control board 26 via the connector 25. The control board 26 controls the current value supplied to the LED chip 23B, etc.

[0049] like Figure 4 As shown in (A), LED chips 23B are arranged at a spacing of P2, where P2 is the distance between the centers of adjacent LED chips 23B. The arrangement spacing P1 of LED chips 23A and the arrangement spacing P2 of LED chips 23B can be the same or different.

[0050] As described above, each of the multiple LED chips 23B has a light-emitting portion 231B, and the peak wavelength of the light emitted from the light-emitting portion 231B is in the range of 360 to 370 nm. That is, the light-emitting portion 231B is a UC LED. The peak wavelength of the light emitted from the light-emitting portion 231B is preferably 365 nm. The light-emitting surface of the light-emitting portion 231B is square, and the length of one side is a2. The length a2 of one side of the light-emitting surface of the light-emitting portion 231B can be the same as or different from the length a1 of one side of the light-emitting surface of the light-emitting portion 231A.

[0051] When the temperature of LED chips 23A and 23B rises, the brightness of the light emitted from the light-emitting portion 231A of LED chip 23A and the brightness of the light emitted from the light-emitting portion 231B of LED chip 23B decrease. In other words, the luminous efficiency of LED chips 23A and 23B decreases as the temperature rises.

[0052] In this embodiment, such as Figure 4 As shown in (B), the LED chip 23A is directly mounted on the heat sink 40. Therefore, compared to the case where the LED chips 23A are arranged on a substrate and the substrate with the arranged LED chips 23A is mounted on the heat sink, the LED chips 23A can be cooled more effectively. Thus, the reduction in brightness of the light emitted from the first light source array 20A can be suppressed. Furthermore, compared to the case where the substrate with the arranged LED chips 23A is mounted on the heat sink, the dimension of the first light source unit OPU1 in the Z1 direction can be reduced.

[0053] Similarly, since the LED chip 23B is directly mounted on the heat sink 40, the LED chip 23B can be cooled more effectively compared to mounting the substrate on the heat sink. Therefore, the reduction in brightness of the light emitted from the second light source array 20B can be suppressed. Furthermore, the size of the second light source unit OPU2 in the Z1 direction can be reduced.

[0054] Next, the first magnifying optical system 30A and the second magnifying optical system 30B will be described. Figure 6 This diagram is used to explain the first magnifying optical system 30A and the second magnifying optical system 30B respectively provided by the first light source unit OPU1 and the second light source unit OPU2.

[0055] like Figure 6 As shown, the first magnifying optical system 30A is a magnifying optical system for forming magnified images of the light-emitting portions 231A of each LED chip 23A onto a predetermined surface PP. The first magnifying optical system 30A includes a plurality of lens portions 31A arranged in a manner corresponding to the arrangement of the LED chips 23A. Each lens portion 31A is a telecentric optical system that magnifies the projection of the light-emitting portion 231A at a magnification M1 of at least (the arrangement interval P1 of the LED chips 23B) / (the length a1 of one side of the light-emitting surface of the light-emitting portion 231A). Furthermore, in Figure 6 In order to make the accompanying drawings clear, only four LED chips 23A (23B) arranged in a row along the Y1 direction are shown.

[0056] The second magnifying optical system 30B is a magnifying optical system used to form magnified images of the light-emitting portions 231B of each LED chip 23B onto a predetermined surface PP. The second magnifying optical system 30B includes a plurality of lens portions 31B arranged in a manner corresponding to the arrangement of the LED chips 23B. Each lens portion 31B is an optical system that magnifies the projection of the light-emitting portions 231B at a magnification of at least (the arrangement interval P2 of the LED chips 23A) / (the length a2 of one side of the light-emitting surface of the light-emitting portion 231B) by two telecentric lenses.

[0057] In this embodiment, lens units 31A and 31B each have four plano-convex lenses, but are not limited thereto. For example, lens units 31A and 31B may have two or three biconvex lenses. In addition, lens units 31A and 31B may have both plano-convex lenses and biconvex lenses.

[0058] (Composition of the illumination optical system 80) Back Figure 2 The illumination optical system 80 includes a first focusing optical system 81A, a second focusing optical system 81B, a second dichroic mirror DM2, an imaging optical system 83, a fly-eye lens FEL, and a focusing optical system 84, all of which are configured with a first dichroic mirror DM1.

[0059] The first focusing optical system 81A forms a pupil of the magnified image of the light-emitting part 231A formed by the first magnifying optical system 30A. That is, the position of the pupil is the rear focal point of the first focusing optical system 81A. The first focusing optical system 81A has a first dichroic mirror DM1 midway through the optical path, which reflects at least a portion of the light with a peak wavelength of 385nm. Accordingly, the light beam is incident on the second dichroic mirror DM2. Alternatively, the first focusing optical system 81A may be configured without the first dichroic mirror DM1. In this case, the configuration is such that the light beam is incident on the second dichroic mirror DM2 by appropriately adjusting the arrangement of the first light source unit OPU1 and the arrangement of each lens in the first focusing optical system 81A. Furthermore, the first focusing optical system 81A may consist of a single lens or a lens group containing multiple lenses.

[0060] The second condensing optical system 81B forms the pupil of the magnified image of the light-emitting part 231B formed by the second magnifying optical system 30B. That is, the position of the rear focal point of the second condensing optical system 81B is the position of the pupil. The second condensing optical system 81B can be composed of a single lens or a lens group containing multiple lenses.

[0061] The second dichroic mirror DM2 allows at least a portion of light with a peak wavelength of 385 nm to pass through and reflects at least a portion of light with a peak wavelength of 365 nm. Accordingly, a composite image is formed in which the pupil image formed by the first focusing optical system 81A and the pupil image formed by the second focusing optical system 81B are superimposed.

[0062] In this embodiment, the second dichroic mirror DM2 superimposes the pupil image formed by the first condensing optical system 81A and the pupil image formed by the second condensing optical system 81B to form a composite image. Specifically, the second dichroic mirror DM2 is positioned at the rear focal point of both the first condensing optical system 81A and the second condensing optical system 81B. Accordingly, the second dichroic mirror DM2 is Köhler illuminated by light emitted from the first light source unit OPU1 and the second light source unit OPU2. By performing Köhler illumination, the illuminance variation of the beam of the pupil image formed by the first condensing optical system 81A and the illuminance variation of the beam of the pupil image formed by the second condensing optical system 81B can be reduced. Furthermore, not limited to the configuration of this embodiment, it can also be configured to perform critical illumination such that the first condensing optical system 81A and the second condensing optical system 81B form images of the first light source unit OPU1 and the second light source unit OPU2 on the second dichroic mirror DM2, respectively.

[0063] The illumination unit 90 is provided with a detector DT10 for monitoring light with a peak wavelength of 385nm, a detector DT20 for monitoring light with a peak wavelength of 365nm, and a detector DT30 for monitoring light with a peak wavelength of 385nm and light with a peak wavelength of 365nm.

[0064] Specifically, detector DT10 detects the illuminance of light with a peak wavelength of 385 nm reflected by the first dichroic mirror DM1. Detector DT20 detects the illuminance of light with a peak wavelength of 365 nm reflected by the second dichroic mirror DM2. Detector DT30 detects the illuminance of 385 nm light accidentally reflected by the second dichroic mirror DM2 and the illuminance of 365 nm light accidentally transmitted by the second dichroic mirror DM2.

[0065] The detection results of detectors DT10 to DT30 are output to the control board 26. Based on the detection results of detectors DT10 to DT30, the control board 26 controls the current supplied to the LED chips 23A and 23B of the first light source unit OPU1 and the second light source unit OPU2, respectively.

[0066] The imaging optical system 83 is an optical system that projects the composite image synthesized by the second dichroic mirror DM2 onto the telecentric sides of the incident end of the fly-eye lens FEL at an equal magnification. Furthermore, the imaging optical system 83 can also reduce the size of the composite image synthesized by the second dichroic mirror DM2 and project it onto the incident end of the fly-eye lens FEL.

[0067] A fly-eye lens (FEL) is constructed, for example, by arranging multiple lens elements with positive refractive power in a dense, longitudinal and transverse manner with their optical axes parallel to the reference optical axis AX. Each lens element constituting the fly-eye lens (FEL) has a rectangular cross-section similar to the shape of the illumination field to be formed on the mask MSK (and consequently the shape of the exposure area to be formed on the plate P).

[0068] Therefore, the light beam incident on the fly-eye lens FEL is wavefront-splitting by multiple lens assemblies, forming a light source image at or near the rear focal plane (emission surface) of each lens assembly. That is, a substantial surface light source, i.e., a secondary light source, composed of multiple light source images, is formed at or near the rear focal plane (emission surface) of the fly-eye lens FEL. The light beam from the secondary light source formed at or near the rear focal plane (emission surface) of the fly-eye lens FEL is incident on the aperture stop 85 disposed nearby. Furthermore, in this embodiment, the rear focal plane (emission surface) of the fly-eye lens FEL is optically conjugate with the first light source array 20A and the second light source array 20B.

[0069] The aperture stop 85 is positioned approximately conjugate optically to the entrance pupil plane of the projection optical system PL, and has a variable opening for defining a range that facilitates illumination of the secondary light source. Furthermore, by varying the opening diameter of the variable opening, the aperture stop 85 sets the value σ (the ratio of the aperture of the secondary light source image on the pupil plane of the projection optical system to the opening diameter on that pupil plane) that determines the illumination conditions to a desired value. Light from the secondary light source passing through the aperture stop 85 is focused by the focusing optical system 84, and then superimposedly illuminates the mask MSK, which forms a predetermined pattern.

[0070] Furthermore, the wavelengths of the light emitted by the first light source unit OPU1 and the second light source unit OPU2 are not limited to the wavelengths mentioned above. They can also be appropriately combined to form the first light source unit OPU1 and the second light source unit OPU2 by emitting LED chips with peak wavelengths in the range of 360 to 440 nm.

[0071] For example, the peak wavelength of the light emitted from the light-emitting portion 231A of the LED chip 23A can be in the range of 400 to 410 nm. For example, the first light source unit OPU1 may be configured to emit light with a peak wavelength of 405 nm and the second light source unit OPU2 may emit light with a peak wavelength of 365 nm. Alternatively, the first light source unit OPU1 may be configured to emit light with a peak wavelength of 395 nm and the second light source unit OPU2 may emit light with a peak wavelength of 385 nm. The combination of the wavelengths of the light emitted from the first light source unit OPU1 and the second light source unit OPU2 is not limited to these examples. Furthermore, when the combination of the wavelengths of the light emitted from the first light source unit OPU1 and the second light source unit OPU2 is set to a combination other than that of this first embodiment, it is preferable to appropriately change the material of the dichroic mirror according to the wavelength used.

[0072] As detailed above, the first light source unit OPU1 includes a heat sink 40 and a plurality of LED chips 23A arranged in two dimensions on a first surface 40a of the heat sink 40. A plurality of protrusions 401 are formed on the first surface 40a of the heat sink 40, each protruding from the first surface 40a and overlapping at least one of the plurality of LED chips 23A when viewed from above. Therefore, the LED chips 23A can be directly mounted on the heat sink 40, and compared to the case where a substrate on which the LED chips 23A are arranged is mounted on the heat sink, the LED chips 23A can be cooled more effectively. Thus, the reduction in brightness of the light emitted from the first light source unit OPU1 can be suppressed. Furthermore, compared to the case where a substrate on which the LED chips 23A are arranged is mounted on the heat sink, the dimension of the first light source unit OPU1 in the Z1 direction can be reduced.

[0073] Furthermore, in the first embodiment described above, the protrusion 401 extends along the Y1 direction, but the protrusion 401 may also extend along the X1 direction. When the protrusion 401 extends along the X1 direction, adjacent LED chips 23A in the Y1 direction are connected in series, and adjacent LED chips 23B in the Y1 direction are connected in series.

[0074] (Variation Example 1) Figure 7 (A) is a top view showing the radiator 40A of the modified example 1 of the first embodiment. Figure 7 (B) is a top view showing the state in which the first light source array 20A and the second light source array 20B are installed on the heat sink 40A in Modified Example 1.

[0075] like Figure 7 As shown in (A), the heat sink 40A has a plurality of protrusions (pillars) 401A on the first surface 40a that protrude from the first surface 40a and are separated from each other. The plurality of protrusions 401A coincide with the LED chip 23A when viewed from above.

[0076] In Modification 1, the protrusion 401A has a circular planar shape, but the planar shape of the protrusion 401A can also be an ellipse, a square, or a pentagon, etc. The other configurations are the same as in the first embodiment, so detailed descriptions are omitted.

[0077] Alternatively, the LED chip 23A can be directly mounted to the heat sink 40A using mutually separate protrusions as in Modified Example 1. Accordingly, compared to mounting a substrate with multiple LED chips 23A arranged on a heat sink, the LED chip 23A can be cooled more effectively, and the size of the first light source unit OPU1 in the Z1 direction can be reduced.

[0078] (Variation Example 2) Figure 8 (A) is a top view showing the radiator 40B of Modified Example 2 of the first embodiment. Figure 8 (B) is a top view showing the state in which the first light source array 20A and the second light source array 20B are installed on the heat sink 40B in Modified Example 2.

[0079] like Figure 8 As shown in (A), the radiator 40B has a plurality of protrusions (pillars) 401A that protrude from the first surface 40a and are separated from each other, and a plurality of protrusions 401 that protrude from the first surface 40a and extend along the Y1 direction.

[0080] Multiple protrusions 401A overlap with multiple LED chips 23A when viewed from above. Each protrusion 401 overlaps with one of the multiple LED chips 23A when viewed from above. Figure 8 In (A), protrusions 401A and 401 are alternately arranged in the X1 direction, but the arrangement of protrusions 401A and 401 is not limited to... Figure 8 (A). For example, multiple protrusions 401A may be provided together on the +X1 side, and multiple protrusions 401 may be provided together on the -X1 side. In addition, the number of protrusions 401 may be one or more. Other configurations are the same as in the first embodiment, so detailed descriptions are omitted.

[0081] As in Modification 2, the protrusions 401A that overlap with each of the multiple LED chips 23A when viewed from above can be combined with each of the multiple LED chips 23A when viewed from above.

[0082] Furthermore, in Modification 2, the protrusion 401 extends along the Y1 direction, but it can also extend along the X1 direction. In this case, adjacent LED chips 23A in the Y1 direction are connected in series.

[0083] Second Implementation Method Figure 9 (A) is a top view illustrating the radiator 40C of the second embodiment. Figure 9 (B) is Figure 9 AA-line section view of (A).

[0084] The radiator 40C has a flow channel 402A extending along the X1 direction, through which refrigerant flows from a refrigerant inlet 403A located at one end of the radiator 40C in the X1 direction toward a refrigerant outlet 404A located at the other end of the radiator 40C in the X1 direction.

[0085] In this embodiment, the heat sink 40C has multiple flow channels 402A corresponding to each row of the LED chip 23A, but it is also possible to have one flow channel 402A for each row of the LED chip 23A.

[0086] The radiator 40C has five protrusions 401 on its first surface 40a, extending along the Y1 direction and separated in the X1 direction. These five protrusions 401 are sequentially named protrusion 401a, protrusion 401b, protrusion 401c, protrusion 401d, and protrusion 401e from the end where the refrigerant inlet 403A is located. When the widths of each of the protrusions 401a, 401b, 401c, 401d, and 401e in the X1 direction are defined as Wa, Wb, Wc, Wd, and We, respectively, Wa < Wb < Wc < Wd < We. That is, in the second embodiment, the closer to the refrigerant inlet 403A, the narrower the width of the protrusion 401 in the X1 direction.

[0087] As in Figure 9 As indicated by arrow AR2 in (B), the refrigerant flows in the -X1 direction within the flow channel 402A. Therefore, the closer the refrigerant is to the refrigerant inlet 403A, the higher the cooling effect of the refrigerant on the LED chip 23A. On the other hand, the closer the protrusion 401 is to the refrigerant inlet 403A, the narrower its width in the X1 direction. Therefore, the closer the protrusion 401 is to the refrigerant inlet 403A, the lower its cooling effect on the LED chip 23A. Therefore, by arranging a narrow protrusion 401 with low cooling effect in the X1 direction near the refrigerant inlet 403A where the refrigerant has a high cooling effect on the LED chip 23A, and arranging a wide protrusion 401 with high cooling effect in the X1 direction near the refrigerant outlet 404A where the refrigerant has a low cooling effect on the LED chip 23A, it is possible to reduce the uneven cooling of the LED chip 23A and achieve approximately uniform cooling of the LED chip 23A.

[0088] (Variation Example 1) Figure 10 (A) is a top view of the heat sink 40D of Modified Example 1 of the second embodiment. Figure 10 (B) is Figure 10 AA-line section view of (A).

[0089] In Modification 1, the first surface 40a of the heat sink 40D is provided with a protrusion 401A that protrudes from the first surface 40a and coincides with the LED chip 23A when viewed from above. In Modification 1, the planar shape of the protrusion 401A is square.

[0090] like Figure 10 (A) and Figure 10 As shown in (B), the protrusions 401A located closest to the refrigerant inlet 403A are designated as protrusions 401Aa, and sequentially designated as protrusions 401Ab, 401Ac, 401Ad, and 401Ae in the -X direction. When the lengths of one side of each of the protrusions 401Aa, 401Ab, 401Ac, 401Ad, and 401Ae are La, Lb, Lc, Ld, and Le, respectively, La < Lb < Lc < Ld < Le. Therefore, in Modified Example 1, the closer to the end where the refrigerant inlet 403A is located, the smaller the area of ​​the upper surface of the protrusion 401A. Other configurations are the same as in the second embodiment, so detailed descriptions are omitted.

[0091] As in Figure 10As shown by arrow AR2 in (B), the refrigerant flows in the -X1 direction within the flow channel 402A. Therefore, the closer the refrigerant is to the refrigerant inlet 403A, the higher the cooling effect of the refrigerant on the LED chip 23A. On the other hand, the closer the protrusion 401A is to the refrigerant inlet 403A, the smaller the area of ​​its upper surface. Therefore, the closer the protrusion 401A is to the refrigerant inlet 403A, the lower its cooling effect on the LED chip 23A. Therefore, by arranging a protrusion 401A with a small upper surface area and low cooling effect near the refrigerant inlet 403A where the refrigerant has a high cooling effect on the LED chip 23A, and arranging a protrusion 401A with a large upper surface area and high cooling effect near the refrigerant outlet 404A where the refrigerant has a low cooling effect on the LED chip 23A, it is possible to reduce the uneven cooling of the LED chip 23A and achieve approximately uniform cooling of the LED chip 23A. Furthermore, the planar shape of the protrusion 401A can also be other shapes such as a circle.

[0092] (Variation Example 2) Figure 11 (A) is a top view of the radiator 40E, which is an example of a modified embodiment 2 of the second embodiment. Figure 11 (B) is Figure 11 AA-line section view of (A).

[0093] like Figure 11 As shown in (A), the heat sink 40E has protrusions (pillars) 401A on the first surface 40a that overlap with a plurality of LED chips 23A when viewed from above, and protrusions 401 extending along the Y1 direction that overlap with each of the plurality of LED chips 23A when viewed from above.

[0094] The protrusion 401A has a square planar shape with one side length L. The width of the protrusion 401 in the X1 direction is W. In this embodiment, the length L of one side of the protrusion 401A is equal to the width W of the protrusion 401 in the X1 direction. Therefore, the area of ​​the upper surface of the protrusion 401A is smaller than the area of ​​the upper surface of the protrusion 401.

[0095] The protrusions 401A and 401 are arranged in sequence from the end side where the refrigerant inlet 403A is located toward the other end side where the refrigerant outlet 404A is located. Other configurations are the same as in the second embodiment, so detailed descriptions are omitted.

[0096] As mentioned earlier, the area of ​​the upper surface of protrusion 401A is smaller than the area of ​​the upper surface of protrusion 401. Therefore, the cooling effect of protrusion 401A on LED chip 23A is lower than the cooling effect of protrusion 401 on LED chip 23A. On the other hand, as in Figure 11As shown by arrow AR2 in (B), the refrigerant flows in the -X1 direction in the flow channel 402A. Therefore, the closer the position is to the refrigerant inlet 403A, the higher the cooling effect of the refrigerant on the LED chip 23A.

[0097] Therefore, by arranging a protrusion 401A with a small upper surface area and low cooling effect near the refrigerant inlet 403A where the refrigerant has a high cooling effect on the LED chip 23A, and arranging a protrusion 401 with a large upper surface area and high cooling effect near the refrigerant outlet 404A where the refrigerant has a low cooling effect on the LED chip 23A, the uneven cooling of the LED chip 23A can be reduced, and the LED chip 23A can be cooled approximately uniformly. Furthermore, the planar shape of the protrusion 401A can also be other shapes such as a circle.

[0098] Third Implementation Method Figure 12 This is a cross-sectional view illustrating the heat sink 40F according to the third embodiment. Figure 12 As shown, the radiator 40F has an internal space 410 and a working fluid 411 held in the internal space 410. The internal space 410 is disposed between the first surface 40a and the flow channel 402A. That is, in the radiator 40E, a vapor chamber is formed between the first surface 40a and the flow channel 402A.

[0099] The working fluid 411, held within the internal space 410, evaporates due to heat from the LED chip 23A. As indicated by arrow AR3, the evaporated working fluid 411 diffuses heat by moving within the internal space 410. The diffused working fluid 411 is cooled and liquefied by a refrigerant flowing in the flow channel 402A. In this way, the working fluid 411 can cool the heat sources (LED chips 23A and 23B) through repeated vaporization and liquefaction.

[0100] The heat spreader has high thermal conductivity and a planar shape, allowing it to dissipate heat quickly and over a large area. Therefore, compared to heat sinks without a heat spreader, heat sink 40F can effectively cool LED chip 23A.

[0101] The other components are the same as those of the radiator 40C in the second embodiment, so detailed descriptions are omitted. Furthermore, the radiators 40, 40A to 40E in the first and second embodiments and their variations may also have a heat spreader.

[0102] Figure 13 This diagram illustrates the preferred configuration of the lighting unit 90A when using the heat sink 40F of the third embodiment. In the case where the LED chip is directly mounted on a heat sink equipped with a heat spreader, such as... Figure 13As shown, it is preferable to set the light-emitting surface of the light-emitting part 231A of LED chip 23A and the light-emitting surface of the light-emitting part 231B of LED chip 23B to the gravity direction side, so that the liquefied working fluid 411 moves towards the LED chip 23A and 23B side due to gravity.

[0103] Therefore, the illumination optical system 80A of the illumination unit 90A includes a third condensing optical system 81C, a fourth condensing optical system 81D comprising a third dichroic mirror DM3, a second dichroic mirror DM2, an imaging optical system 83, a fly-eye lens FEL, and a condensing optical system 84.

[0104] The third focusing optical system 81C forms the pupil of the magnified image of the light-emitting part 231A formed by the first magnifying optical system 30A. That is, the position of the pupil is the position of the rear focal point of the third focusing optical system 81C. The arrangement of the first light source unit OPU1 and the arrangement of each lens of the third focusing optical system 81C are adjusted so that the light beam is incident on the second dichroic mirror DM2.

[0105] The fourth focusing optical system 81D forms a pupil of the magnified image of the light-emitting part 231B formed by the second magnifying optical system 30B. That is, the position of the pupil is the rear focal point of the fourth focusing optical system 81D. The fourth focusing optical system 81D has a third dichroic mirror DM3 midway through the optical path, which reflects at least a portion of the light with a peak wavelength of 365nm. Accordingly, the light beam is incident on the second dichroic mirror DM2.

[0106] The composition and function of the second dichroic mirror DM2, imaging optical system 83, fly-eye lens FEL, and condensing optical system 84 are similar to those of the other components. Figure 2 Since they are the same, detailed explanations are omitted.

[0107] Fourth Implementation Method In the first to third embodiments, multiple LED chips 23A and multiple LED chips 23B are connected in series by wiring layer 42, but multiple LED chips 23A and multiple LED chips 23B can also be connected in parallel by wiring layer 42.

[0108] Figure 14 (A) is a top view schematically showing the configuration of the heat sink 40G according to the fourth embodiment. Figure 14 (B) is Figure 14 AA-line section view of (A).

[0109] like Figure 14As shown in (A), a plurality of protrusions 401 are formed on the first surface 40a of the heat sink 40G, protruding from the first surface 40a and extending along the Y1 direction. An insulating layer 41 and a wiring layer 42 are sequentially formed on the first surface 40a on both sides of each protrusion 401 in the X1 direction. The insulating layer 41 and the wiring layer 42 extend along the Y1 direction.

[0110] like Figure 15 (A) ~ Figure 15 As shown in (C), it is a top view that schematically shows the state in which the first light source array 20A and the second light source array 20B are installed on the heat sink 40G. Figure 15 (B) is Figure 15 Sectional view of line AA of (A), Figure 15 (C) is magnified. Figure 15 The diagram shows the portion enclosed by ellipse C1 in (B). Additionally, Figure 16 This is an equivalent circuit diagram of the first and second light source units in the fourth embodiment.

[0111] like Figure 15 As shown in (A), each protrusion 401 coincides with at least one of the plurality of LED chips 23A when viewed from above. Figure 15 As shown in (C), each LED chip 23A is connected to the protrusion 401 and the wiring layer 42 via solder 44.

[0112] like Figure 15 (A) ~ Figure 15 As shown in (C), the anode-side electrodes 233 of a plurality of adjacent LED chips 23A in the Y1 direction are electrically connected via a wiring layer 42 provided on the +X1 side of the protrusion 401. Furthermore, the cathode-side electrodes 234 of a plurality of adjacent LED chips 23A in the Y1 direction are electrically connected via a wiring layer 42 provided on the -X1 side of the protrusion 401. Accordingly, as Figure 16 As shown, multiple adjacent LED chips 23A in the Y1 direction are connected in parallel by wiring layer 42.

[0113] In this way, multiple LED chips 23A adjacent in the Y1 direction can also be connected in parallel. The same applies to multiple LED chips 23B. Other configurations are the same as in the first embodiment, so detailed descriptions are omitted. Furthermore, in the fourth embodiment, multiple (two) wiring layers 42 are formed on one insulating layer 41 disposed between adjacent protrusions 401 in the X1 direction, but this is not a limitation. Insulating layers 41 may also be provided corresponding to the multiple (two) wiring layers 42 disposed between adjacent protrusions 401 in the X1 direction.

[0114] (Variation example) Figure 17(A) is a top view schematically showing the configuration of the radiator 40H in a modified example of the fourth embodiment. Figure 17 (B) is Figure 17 AA-line section view of (A).

[0115] like Figure 17 As shown in (A), a plurality of protrusions 401 are formed on the first surface 40a of the heat sink 40H, protruding from the first surface 40a and extending along the Y1 direction. In addition, an insulating layer 41 and a wiring layer 42 are sequentially formed on the first surface 40a on the +X1 side of each protrusion 401. The insulating layer 41 and the wiring layer 42 extend along the Y1 direction.

[0116] Figure 18 (A) is a top view schematically showing the state in which the first light source array 20A and the second light source array 20B are installed on the heat sink 40H in the modified example of the fourth embodiment. Figure 18 (B) is Figure 18 Sectional view of line AA of (A), Figure 18 (C) is magnified. Figure 18 The diagram shows the portion enclosed by ellipse C1 in (B). Additionally, Figure 19 This is an equivalent circuit diagram of the first and second light source units in a modified example of the fourth embodiment.

[0117] like Figure 18 As shown in (A), each protrusion 401 coincides with at least one of the plurality of LED chips 23A when viewed from above. Figure 18 As shown in (C), each LED chip 23A is connected to the protrusion 401 and the wiring layer 42 via solder 44.

[0118] like Figure 18 (A) ~ Figure 18 As shown in (C), the anode-side electrodes 233 of a plurality of adjacent LED chips 23A in the Y1 direction are electrically connected via a wiring layer 42 provided on the +X1 side of the protrusion 401. Furthermore, the cathode-side electrodes 234 of a plurality of adjacent LED chips 23A in the Y1 direction are electrically connected via the protrusion 401 and connected to a reference potential via the protrusion 401. Accordingly, Figure 19 As shown, multiple adjacent LED chips 23A in the Y1 direction are connected in parallel by protrusion 401 and wiring layer 42.

[0119] Similarly, multiple adjacent LED chips 23A in the Y1 direction can be connected in parallel. The same applies to multiple LED chips 23B. Other configurations are the same as in the first embodiment, so detailed descriptions are omitted.

[0120] Furthermore, in the above embodiments and their variations, the case where the first light source array 20A and the second light source array 20B are respectively mounted on heat sinks 40, 40A to 40H having the same configuration has been described, but this is not a limitation. The configuration of the heat sink with the first light source array 20A mounted may differ from the configuration of the heat sink with the second light source array 20B mounted. For example, the first light source array 20A may be mounted on the heat sink 40 of the first embodiment, and the second light source array 20B may be mounted on the heat sink 40C of the second embodiment.

[0121] Furthermore, in the above embodiments and their modifications, the radiator has internal flow channels 402, 402A for refrigerant circulation, but is not limited to this. The radiator may also be a finned radiator, for example. Additionally, the radiator may not be a microchannel radiator. Furthermore, in the above embodiments and their modifications, the refrigerant inlets 403, 403A and refrigerant outlets 404, 404A are located on the side of the radiator, but they may also be located on the first surface 40a or the second surface 40b of the radiator.

[0122] Furthermore, in the above embodiments and their variations, the thickness of the heat sink is 7 mm or less. However, the thickness of the heat sink in this specification refers to the length from the upper surface of the protrusion 401 and / or protrusion 401A formed on the first surface 40a of the heat sink to the second surface 40b. For example, in apparatuses for forming wiring layers on substrates, there are cases where the upper limit of the thickness of the substrate that can be moved is limited to about 7 mm, and sometimes it is impossible to form a wiring layer on a thick substrate. However, by setting the thickness of the heat sink to 7 mm or less, the wiring layer is easily formed on the heat sink. In addition, when there are no manufacturing limitations on the light source unit, the thickness of the heat sink can be 7 mm or more.

[0123] Furthermore, the length from the upper surface of protrusion 401 and / or protrusion 401A to the first surface 40a (the height H3 of protrusion 401 and / or protrusion 401A) is preferably 500 μm or less, and more preferably 150 to 200 μm. For example, when the height H3 of protrusion 401 and / or protrusion 401A is 200 μm, the thickness (height) H1 of insulating layer 41 can be set to 130 μm, and the thickness (height) H2 of wiring layer 42 can be set to 70 μm. Additionally, the thickness of insulating layer 41 can also be smaller than the thickness of wiring layer 42.

[0124] Furthermore, in the above embodiments and their variations, the cases where protrusions 401 and 401A are constituted as part of the heat sink have been described, but this is not a limitation. For example, protrusions 401 and 401A may also be components different from the heat sink (components separate from the heat sink) that contact the first surface 40a of the heat sink. That is, protrusions 401 and 401A may be formed by fixing (welding, bonding) a component different from the heat sink to the first surface 40a. In this case, protrusions 401 and 401A may be formed of the same material as the heat sink or of a different material. Furthermore, when protrusions 401 and 401A are formed of a material different from the heat sink, protrusions 401 and 401A are preferably made of a metal with high thermal conductivity.

[0125] Furthermore, in the above embodiments and their variations, the illumination units 90 and 90A include a first light source unit OPU1, a second light source unit OPU2, and an illumination optical system 80 and 80A including a second dichroic mirror DM2, but are not limited thereto. For example, the illumination units 90 and 90A may only have either the first light source unit OPU1 or the second light source unit OPU2. In this case, the illumination optical system 80 and 80A can have any configuration as long as it can provide a light guiding mask MSK emitted from either the first light source unit OPU1 or the second light source unit OPU2.

[0126] Furthermore, in the first and fourth embodiments and their variations described above, the flow channel 402 has a meandering shape; however, the flow channel 402A in the second embodiment can also be applied to the first and fourth embodiments and their variations. Additionally, the heat sinks 40G and 40H in the fourth embodiment and its variations can also have the heat spreader described in the third embodiment.

[0127] Furthermore, the above-described light source unit is described as a unit used in an exposure apparatus for manufacturing liquid crystal display devices (flat panel displays), but it can also be used as a light source unit in an exposure apparatus for manufacturing semiconductor devices by exposing silicon wafers.

[0128] The above-described embodiments are preferred embodiments of the present invention. However, they are not limited thereto, and various modifications can be made without departing from the spirit of the present invention.

[0129] Explanation of reference numerals in the attached figures 10 Exposure apparatus 20A First Light Source Array 20B Second Light Source Array 40a First page 40b Second Surface 23A and 23B LED chips Radiators 40, 40A, 40B, 40C, 40D, 40E, 40F, 40G, 40H 80, 80A Illumination Optical System 90, 90A lighting units 100 projection optical units 231A, 231B Light-emitting parts 233 Anode-side electrode 234 Cathode-side electrode 401, 401A protrusions 402, 402A flow channels 403, 403A refrigerant inlet 404, 404A refrigerant outlet DM2 Second Dichroic Mirror MSK mask OPU1 First Light Source Unit OPU2 Second Light Source Unit PL projection optical system P Glass substrate.

Claims

1. A light source unit, characterized in that, include: heat sink; as well as Multiple light source elements are arranged in a two-dimensional pattern on the first surface of the heat sink. A plurality of protrusions are formed on the first surface of the heat sink, and the plurality of protrusions protrude from the first surface and coincide with at least one of the plurality of light source elements when viewed from above.

2. The light source unit according to claim 1, characterized in that, The plurality of light source elements include: A plurality of first light source elements arranged along a first direction; and A plurality of second light source elements are arranged along the first direction, and are separated from the plurality of first light source elements in a second direction orthogonal to the first direction. The plurality of protrusions includes: A first protrusion extends along the first direction and coincides with each of the plurality of first light source elements when viewed from above; as well as The second protrusion extends along the first direction and coincides with each of the plurality of second light source elements when viewed from above.

3. The light source unit according to claim 2, characterized in that, The plurality of first light source elements and the plurality of second light source elements, wherein the first light source elements and the second light source elements that are adjacent in the second direction are connected in series.

4. The light source unit according to claim 1, characterized in that, An insulating layer is formed on the first surface of the heat sink. A wiring layer is formed on top of the insulating layer. The height of at least one of the plurality of protrusions is equal to the combined thickness of the insulating layer and the wiring layer.

5. The light source unit according to claim 2, characterized in that, Multiple insulating layers are formed on the first surface of the heat sink. Multiple wiring layers are formed on the multiple insulating layers, The plurality of wiring layers includes a first wiring layer and a second wiring layer that extend along the first direction and are respectively disposed on both sides of the first protrusion when viewed from above. The cathode-side electrodes of the plurality of first light source elements adjacent in the first direction are electrically connected via the first wiring layer. The anode-side electrodes of the plurality of first light source elements adjacent in the first direction are electrically connected via the second wiring layer.

6. The light source unit according to claim 2, characterized in that, Multiple insulating layers are formed on the first surface of the heat sink. Multiple wiring layers are formed on the multiple insulating layers, The plurality of wiring layers includes a third wiring layer that extends along the first direction and is disposed between the first protrusion and the second protrusion when viewed from above. The cathode-side electrodes of the plurality of first light source elements adjacent in the first direction are electrically connected via the first protrusion. The anode-side electrodes of the plurality of first light source elements adjacent in the first direction are electrically connected via the third wiring layer.

7. The light source unit according to any one of claims 2, 3, 5, and 6, characterized in that, The radiator has a flow channel extending along the second direction, inside which refrigerant flows from a refrigerant inlet located at one end of the radiator in the second direction toward a refrigerant outlet located at the other end in the second direction. The second protrusion and the first protrusion are arranged in this order from one end toward the other end. The width of the second protrusion in the second direction is smaller than the width of the first protrusion in the second direction.

8. The light source unit according to claim 1, characterized in that, The plurality of protrusions are separated from each other and are positioned to overlap with the plurality of light source elements when viewed from above.

9. The light source unit according to claim 8, characterized in that, The radiator has a flow channel extending along a first direction, inside which refrigerant flows from a refrigerant inlet located at one end of the radiator in the first direction toward a refrigerant outlet located at the other end of the first direction. The area of ​​the upper surface of the plurality of protrusions is smaller the closer it is to one end.

10. The light source unit according to claim 1, characterized in that, The plurality of light source elements include: A plurality of first light source elements arranged along a first direction; and A plurality of second light source elements are arranged along the first direction, and are separated from the plurality of first light source elements in a second direction orthogonal to the first direction. The plurality of protrusions includes: A first protrusion, extending along the first direction and coinciding with each of the plurality of first light source elements when viewed from above; and Multiple second protrusions, which overlap with the multiple second light source elements when viewed from above.

11. The light source unit according to claim 10, characterized in that, The radiator has a flow channel extending along the second direction, inside which refrigerant flows from a refrigerant inlet located at one end of the radiator in the second direction toward a refrigerant outlet located at the other end in the second direction. The width of each of the plurality of second protrusions in the second direction is approximately the same as the width of the first protrusion in the second direction. The plurality of second protrusions and the first protrusion are arranged in this order from one end toward the other end.

12. The light source unit according to any one of claims 1 to 11, characterized in that, The radiator has an internal space and a working fluid that is held within the internal space.

13. The light source unit according to any one of claims 1 to 12, characterized in that, The plurality of protrusions are formed by a portion of the heat sink.

14. The light source unit according to any one of claims 1 to 13, characterized in that, The radiator is a microchannel radiator.

15. The light source unit according to any one of claims 1 to 14, characterized in that, The multiple light source elements are multiple LED elements.

16. The light source unit according to any one of claims 1 to 15, characterized in that, The peak wavelength of the light emitted from the plurality of light source elements is in the range of 360 to 370 nm.

17. The light source unit according to any one of claims 1 to 15, characterized in that, The peak wavelength of the light emitted from the plurality of light source elements is in the range of 380 to 390 nm.

18. The light source unit according to any one of claims 1 to 15, characterized in that, The peak wavelength of the light emitted from the plurality of light source elements is in the range of 400 to 410 nm.

19. The light source unit according to any one of claims 1 to 18, characterized in that, The light source unit is the light source unit used in the exposure device.

20. A lighting unit, characterized in that, include: The light source unit according to any one of claims 1 to 19; as well as An illumination optical system that guides the light emitted from the light source unit to the irradiated object.

21. A lighting unit, characterized in that, include: The light source unit according to any one of claims 1 to 19; as well as An illumination optical system comprising a combining optical element for combining light emitted from a plurality of said light source units, the illumination optical system guiding the combined light emitted from said combining optical element to an irradiated object.

22. An exposure apparatus, characterized in that, include: The lighting unit as described in claim 20 or claim 21; as well as A projection optics system that projects a patterned image of a mask illuminated by the illumination unit onto a photosensitive substrate.

23. The exposure apparatus according to claim 22, characterized in that, The length of at least one side or the diagonal length of the photosensitive substrate is 500 mm or more.

24. An exposure method, comprising using the exposure apparatus of claim 22 or claim 23, characterized in that it includes: The mask is illuminated using the illumination unit; as well as The pattern image of the mask is projected onto the photosensitive substrate using the projection optics system.

Images