Ultrasonic probe and endoscope

Abstract

The invention discloses an ultrasonic probe and an endoscope, and the ultrasonic probe comprises a first signal connection end, a second signal connection end and a transceiving assembly. The transmitting-receiving assembly comprises a piezoelectric element, an acoustic matching layer and a backing layer, the piezoelectric element is provided with an ultrasonic radiation surface, the acoustic matching layer is jointed with the ultrasonic radiation surface, and the backing layer is jointed with the side, opposite to the ultrasonic radiation surface, of the piezoelectric element. The piezoelectric element comprises a first piezoelectric layer and a second piezoelectric layer, the first signal connecting end and the second signal connecting end are electrically connected with the first piezoelectric layer and the second piezoelectric layer respectively, and the first piezoelectric layer and the second piezoelectric layer generate ultrasonic waves of different frequencies respectively and receive corresponding echo signals. Different frequency modes can be switched according to detection requirements, the probe does not need to be replaced, secondary operation on a patient is not needed, operation is convenient, and the universality and practicability of the ultrasonic probe are improved.

Description

Technical Field

[0001] This invention relates to the field of medical devices, and in particular to ultrasonic probes and endoscopes having ultrasonic probes. Background Technology

[0002] A medical endoscopic ultrasound (EUS) is a medical device that combines endoscopy and ultrasound. It uses an endoscope to scan the digestive tract, respiratory tract, or adjacent organs through body cavities, providing ultrasound imaging of lesions in internal cavities or tissues to assist doctors in diagnosing conditions. The EUS probe is the device that transmits and receives ultrasound waves.

[0003] In related technologies, most ultrasound probes only have one frequency. If different ultrasound imaging information is required, probes of different frequencies need to be replaced or secondary testing needs to be performed. This not only prolongs the examination time and increases the complexity of the operation, but also increases the patient's discomfort due to repeated insertions into the cavity. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention proposes an ultrasonic probe, which has the advantages of convenient operation and high practicality.

[0005] The present invention also proposes an endoscope having the above-mentioned ultrasonic probe.

[0006] The ultrasonic probe according to the present invention comprises: First signal connection terminal and second signal connection terminal; A transceiver assembly includes a piezoelectric element, an acoustic matching layer, and a backing layer. The piezoelectric element has an ultrasonic radiating surface. The acoustic matching layer is bonded to the ultrasonic radiating surface. The backing layer is bonded to the side opposite to the ultrasonic radiating surface of the piezoelectric element. The piezoelectric element includes a first piezoelectric layer and a second piezoelectric layer. A first signal connection terminal and a second signal connection terminal are electrically connected to the first piezoelectric layer and the second piezoelectric layer, respectively. The first piezoelectric layer and the second piezoelectric layer generate ultrasonic waves of different frequencies and receive corresponding echo signals.

[0007] The ultrasonic probe according to the present invention has at least the following beneficial effects: the first signal connection terminal and the second signal connection terminal are electrically connected to the first piezoelectric layer and the second piezoelectric layer, respectively, and can transmit electrical signals to the first piezoelectric layer and the second piezoelectric layer, respectively. The first piezoelectric layer and the second piezoelectric layer generate ultrasonic waves of different frequencies and receive corresponding echo signals. Different frequency modes can be switched according to the detection requirements without replacing the probe or performing secondary operations on the patient, making operation convenient and improving the versatility and practicality of the ultrasonic probe. At the same time, the acoustic matching layer can reduce energy loss, allowing more ultrasonic energy to enter the detection object, and enhancing the reception efficiency of the echo signal. The backing layer can reduce the interference of invalid signals from the first piezoelectric layer and the second piezoelectric layer, improving the image clarity.

[0008] According to some embodiments of the ultrasonic probe of the present invention, the first signal connection terminal is a low-frequency signal connection terminal, the first piezoelectric layer is a low-frequency piezoelectric layer, the second signal connection terminal is a high-frequency signal connection terminal, and the second piezoelectric layer is a high-frequency piezoelectric layer.

[0009] According to some embodiments of the ultrasonic probe of the present invention, the first piezoelectric layer is disposed between the second piezoelectric layer and the backing layer, and the acoustic matching layer is bonded to the second piezoelectric layer.

[0010] According to some embodiments of the ultrasonic probe of the present invention, the first signal connection terminal is connected to the first piezoelectric layer through a core wire, and the second signal connection terminal is connected to the second piezoelectric layer through a core wire.

[0011] According to some embodiments of the ultrasonic probe of the present invention, the first signal connection terminal and the second signal connection terminal are provided with a core wire connection point on the side facing the transceiver assembly, and the core wire connection point is used to concentrate the signal transmission path of the first signal connection terminal and the second signal connection terminal.

[0012] According to some embodiments of the ultrasonic probe of the present invention, a ground wire is connected between the core wire junction point and the backing layer.

[0013] According to some embodiments of the ultrasonic probe of the present invention, the outer surface of the transceiver assembly is provided with a protective layer.

[0014] According to some embodiments of the ultrasonic probe of the present invention, the protective layer is made of epoxy resin.

[0015] According to some embodiments of the ultrasonic probe of the present invention, the first piezoelectric layer and the second piezoelectric layer are piezoelectric composite material parts.

[0016] The endoscope according to the present invention includes the ultrasonic probe described in the present invention.

[0017] The endoscope according to the present invention has at least the following beneficial effects: the integrated dual-frequency ultrasound probe can quickly switch between low-frequency and high-frequency modes through the first and second signal connection terminals, and can complete deep penetration and superficial high-definition imaging in a single examination without the need to replace the probe or perform secondary operations, which greatly improves the examination efficiency, reduces patient discomfort, cavity damage and cross-infection risk, optimizes the medical experience and has significant practicality.

[0018] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the structure of the ultrasonic probe according to an embodiment of the present invention.

[0020] Explanation of icon numbers: First signal connection terminal 100; Second signal connection terminal 200; Core wire 300; High-frequency core wire 310; Low-frequency core wire 320; Core wire connection point 330; Ground wire 340; Transceiver component 400; piezoelectric element 410; first piezoelectric layer 411; second piezoelectric layer 412; acoustic matching layer 420; backing layer 430. Detailed Implementation

[0021] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0022] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0023] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0024] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0025] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0026] As the core carrier of ultrasound transduction in endoscopes, the ultrasound probe uses piezoelectric elements to generate ultrasound waves driven by electrical signals. These waves penetrate the mucosal surface of cavities to reach deep tissues, such as the submucosa and muscular layer of the gastrointestinal wall, or adjacent organs like the liver, pancreas, and prostate. Simultaneously, it receives echo signals reflected from these tissues, converts them into electrical signals, and processes them to form tomographic images. In related technologies, most ultrasound probes only have one frequency. If different ultrasound imaging information is required, probes of different frequencies must be used or secondary testing must be performed. This not only prolongs the examination time and increases the complexity of the operation, but repeated insertions into cavities also increase patient discomfort.

[0027] Therefore, such as Figure 1The image shows the ultrasonic probe proposed in this invention, comprising: a first signal connection terminal 100, a second signal connection terminal 200, and a transceiver assembly 400. The transceiver assembly 400 includes a piezoelectric element 410, an acoustic matching layer 420, and a backing layer 430. The piezoelectric element 410 has an ultrasonic radiating surface. The acoustic matching layer 420 is bonded to the ultrasonic radiating surface. The acoustic matching layer 420 can reduce energy loss, allowing more ultrasonic energy to enter the object being detected, while simultaneously enhancing the reception efficiency of the echo signal. The backing layer 430 is bonded to the side opposite to the ultrasonic radiating surface of the piezoelectric element 410. The backing layer 430 can absorb back-side clutter, reduce invalid signal interference, ensure that the received echo is mainly a front-reflected signal, and improve image clarity. The piezoelectric element 410 includes a first piezoelectric layer 411 and a second piezoelectric layer 412. A first signal connection terminal 100 and a second signal connection terminal 200 are electrically connected to the first piezoelectric layer 411 and the second piezoelectric layer 412, respectively. The first piezoelectric layer 411 and the second piezoelectric layer 412 generate ultrasonic waves of different frequencies and receive corresponding echo signals. Different frequency modes can be switched according to detection needs without replacing the probe or performing secondary operations on the patient, making operation convenient and improving the versatility and practicality of the ultrasonic probe.

[0028] In some embodiments of the present invention, such as Figure 1 As shown, the first signal connection terminal 100 is a low-frequency signal connection terminal, and the first piezoelectric layer 411 is a low-frequency piezoelectric layer. The first signal connection terminal 100 is used to transmit the electrical signal driving the first piezoelectric layer 411, such as an excitation pulse of 5MHz to 12MHz. The second signal connection terminal 200 is a high-frequency signal connection terminal, and the second piezoelectric layer 412 is a high-frequency piezoelectric layer. The second signal connection terminal 200 is used to transmit the electrical signal driving the second piezoelectric layer 412, such as an excitation pulse of 12MHz to 30MHz. The first piezoelectric layer 411 and the second piezoelectric layer 412 are driven independently, which can realize low-frequency imaging and high-frequency imaging simultaneously in the same probe, thereby balancing detection depth and resolution and improving imaging quality.

[0029] It should be noted that the ultrasound waves generated by the first piezoelectric layer 411 have stronger penetrating power, capable of penetrating the entire wall of the digestive tract and deep tissues such as the mediastinum, clearly displaying the structural relationships of the submucosa, muscularis propria, and surrounding organs. This makes it suitable for scenarios such as tumor invasion depth assessment and deep lesion screening. The ultrasound waves generated by the second piezoelectric layer 412 have a shorter wavelength and higher lateral resolution, accurately capturing superficial details such as the morphology of microvessels and glandular structures in the mucosa, making it particularly suitable for the identification of early lesions such as early-stage digestive tract cancers and micropolyps.

[0030] The high-frequency piezoelectric layer needs to emit shorter wavelengths, placing higher demands on energy transfer. If the high-frequency signal needs to penetrate other layers before reaching the acoustic matching layer 420, energy loss will occur due to multi-interface reflections. Furthermore, the low-frequency piezoelectric layer emits sound waves with longer wavelengths and stronger penetration, but the back-radiated clutter, i.e., the clutter propagating towards the backing layer 430, attenuates slowly and can easily cause interference if not fully absorbed. Therefore, in some embodiments of the present invention, such as... Figure 1 As shown, the first piezoelectric layer 411 is disposed between the second piezoelectric layer 412 and the backing layer 430, and the acoustic matching layer 420 is bonded to the second piezoelectric layer 412. That is, the acoustic matching layer 420 is directly bonded to the high-frequency piezoelectric layer, reducing interference from the intermediate medium, and allowing the high-frequency piezoelectric layer to be directly coupled to the tissue under test through the acoustic matching layer 420, ensuring effective transmission and reception of high-frequency signals. The first piezoelectric layer 411 is disposed between the second piezoelectric layer 412 and the backing layer 430, meaning that the low-frequency piezoelectric layer is indirectly coupled to the acoustic matching layer 420 through the high-frequency piezoelectric layer. Because low-frequency sound waves have strong penetrating power, the energy loss when passing through the high-frequency piezoelectric layer is small, and deep tissue detection can still be achieved. Ineffective sound waves radiated by the side of the first piezoelectric layer 411 facing the backing layer 430 can be quickly absorbed because they are adjacent to the backing layer 430, reducing interference caused by clutter reflected from inside the probe, thereby optimizing both high-frequency resolution and low-frequency depth within the same probe.

[0031] In some embodiments of the present invention, such as Figure 1 As shown, the first signal connection terminal 100 is connected to the first piezoelectric layer 411 via a core wire 300, and the second signal connection terminal 200 is connected to the second piezoelectric layer 412 via a core wire 300. The core wire 300 includes a high-frequency core wire 310 and a low-frequency core wire 320. The first signal connection terminal 100 is connected to the first piezoelectric layer 411 via the low-frequency core wire 320, and the second signal connection terminal 200 is connected to the second piezoelectric layer 412 via the high-frequency core wire 310. This allows for optimization of the transmission paths for low-frequency and high-frequency signals respectively, reducing signal crosstalk, ensuring the integrity and stability of low-frequency and high-frequency signals, and further improving imaging quality.

[0032] In some embodiments of the present invention, such as Figure 1As shown, the first signal connection terminal 100 and the second signal connection terminal 200 have a core wire connection point 330 on the side facing the transceiver component 400. The core wire connection point 330 is used to centralize the signal transmission path between the first signal connection terminal 100 and the second signal connection terminal 200. The low-frequency core wire 320 is connected to the first signal connection terminal 100 through the core wire connection point 330, and the high-frequency core wire 310 is connected to the second signal connection terminal 200 through the core wire connection point 330. The core wire connection point 330 centralizes the signal transmission path between the first signal connection terminal 100 and the second signal connection terminal 200, reduces the scattered wiring of the core wire 300 inside the probe, thereby shortening the wiring length, reducing signal loss and crosstalk, and improving the stability and consistency of signal transmission.

[0033] In some embodiments of the present invention, such as Figure 1 As shown, a ground wire 340 is connected between the core wire junction point 330 and the backing layer 430. The ground wire 340 provides a unified, low-impedance grounding loop for the first signal connection terminal 100 and the second signal connection terminal 200, further reducing electromagnetic coupling and crosstalk between the low-frequency core wire 320 and the high-frequency core wire 310, ensuring the transmission stability of the low-frequency signal and the high-frequency signal respectively, and suppressing the interference of external noise on the imaging signal, thereby improving the imaging quality.

[0034] Understandably, in some application scenarios, when voltage is applied to the second signal connection terminal 200, the high-frequency core wire 310 and ground wire 340 input energy to the second piezoelectric layer 412. The second piezoelectric layer 412 converts electrical energy into mechanical energy. The high-frequency ultrasonic waves generated by the second piezoelectric layer 412 towards the acoustic matching layer 420 are efficiently released to the object being tested due to the acoustic impedance characteristics matched to the object, such as human tissue. Ineffective sound waves radiated by the second piezoelectric layer 412 towards the acoustic backing are absorbed by the backing layer 430, avoiding noise interference. When there are defects inside the object being tested, some high-frequency ultrasonic waves will be reflected by the defect point to form echoes. The echoes return to the second piezoelectric layer 412 through the acoustic matching layer 420. The second piezoelectric layer 412 converts mechanical energy into electrical energy and transmits it to the external processing system. Finally, a clear defect image is reconstructed through algorithms. The characteristics of high-frequency mode are: the longitudinal wave detection distance is short, but because the wavelength of the high-frequency signal is short, the imaging clarity is high, making it suitable for the detection of shallow and minute defects.

[0035] When a voltage is applied to the first signal connection terminal 100, the electrical signal is transmitted to the first piezoelectric layer 411 through the low-frequency core wire 320 and the ground wire 340. The first piezoelectric layer 411 converts electrical energy into mechanical energy. The low-frequency ultrasonic waves generated by the side of the first piezoelectric layer 411 facing the second piezoelectric layer 412 are released to the object being tested through the second piezoelectric layer 412 and the acoustic matching layer 420 in sequence. The ineffective sound waves radiated by the side of the first piezoelectric layer 411 facing the backing layer 430 are absorbed by the backing layer 430. The low-frequency echoes reflected by internal defects in the object being tested return to the first piezoelectric layer 411 through the acoustic matching layer 420 and the second piezoelectric layer 412. The first piezoelectric layer 411 converts the echo signal into electrical energy and transmits it to an external system for image formation via an algorithm. The characteristics of this low-frequency mode are: long longitudinal wave detection distance, which can penetrate deeper tissues; however, due to the long wavelength of the low-frequency signal, the imaging clarity is relatively low, making it suitable for the detection of deep tissue defects. With its dual-frequency switchable settings, the probe can flexibly select high-frequency or low-frequency mode according to the detection needs, enabling comprehensive detection of defects from superficial to deep and from minute to macroscopic without the need to replace the probe, significantly improving the ease of operation and the applicability of detection.

[0036] In some embodiments of the present invention, the end face of the probe that contacts the object being tested is sealed by a protective layer, thereby preventing the intrusion of moisture and contaminants. A protective layer is provided on the outer surface of the transceiver assembly 400 to prevent mechanical scratches, chemical corrosion, and penetration of bodily fluids, thus extending the probe's service life.

[0037] In some embodiments of the present invention, the protective layer is made of epoxy resin. Epoxy resin has excellent acoustic impedance matching performance, which can reduce the reflection loss of sound waves at the probe. After curing, the epoxy resin forms a dense, non-porous sealing layer that is waterproof and moisture-proof, preventing the piezoelectric element 410 from failing due to moisture. At the same time, it has good mechanical strength and chemical corrosion resistance, ensuring that the end face remains intact and stable during repeated contact and disinfection, thus extending the service life of the probe.

[0038] Specifically, in some embodiments of the present invention, the protective layer can be a medical-grade silicone rubber component that can tightly wrap around the surface of the equipment to form a protective film. This film is resistant to high and low temperatures, has strong insulation properties, and is non-allergenic when in contact with human tissue, effectively isolating it from bodily fluid erosion. The protective layer can also be a polyimide coating, medical-grade polyurethane elastomer, or fluoropolymer, etc., and different materials can be flexibly selected according to the specific application scenario and requirements.

[0039] In some embodiments of the present invention, such as Figure 1As shown, the first piezoelectric layer 411 and the second piezoelectric layer 412 are piezoelectric composite material components. The piezoelectric composite material is composed of a piezoelectric phase and a polymer phase. The piezoelectric phase can be piezoelectric ceramic particles or fibers, and the polymer phase can be epoxy resin or silicone rubber. The piezoelectric properties can be flexibly controlled by adjusting the ratio and structure of the two phases. The use of piezoelectric composite material components for the first piezoelectric layer 411 and the second piezoelectric layer 412 can effectively reduce acoustic impedance mismatch and improve the conversion efficiency between electricity and sound. Simultaneously, it possesses both a high electromechanical coupling coefficient and low acoustic attenuation characteristics, enabling better transmission and reception sensitivity for both low-frequency and high-frequency signals, further improving imaging resolution and detection depth.

[0040] In some embodiments of the present invention, such as Figure 1 As shown, the core of the acoustic matching layer 420 is matching acoustic impedance. The acoustic matching layer 420 can use epoxy resin as a matrix, incorporating high-density inorganic powders such as alumina, tungsten powder, lead powder, and cerium oxide, thereby precisely adjusting the acoustic impedance to the intermediate value between the piezoelectric material and human tissue. The backing layer 430 is a composite material, typically using a polymer material as the matrix and adding acoustic attenuators to enhance ultrasonic absorption. The matrix material can be epoxy resin, polyurethane, or silicone rubber, etc., possessing good formability and a certain degree of elasticity, facilitating processing into the shape required by the probe. The acoustic attenuator filler can be tungsten powder, iron powder, graphite, or silicon carbide, etc. The acoustic attenuator absorbs ultrasonic waves through particle scattering and damping, adjusting the acoustic impedance of the backing layer 430 to reduce interface reflection.

[0041] An endoscope according to an embodiment of the present invention includes an ultrasonic probe according to an embodiment of the present invention.

[0042] According to the endoscope of the present invention, by using the ultrasonic probe of the present invention, the integrated dual-frequency ultrasonic probe can quickly switch between low-frequency and high-frequency modes through the first signal connection terminal 100 and the second signal connection terminal 200. A single examination can complete deep penetration and superficial high-definition imaging without the need to replace the probe or perform secondary operations, which greatly improves the examination efficiency, reduces patient discomfort, cavity damage and cross-infection risk, optimizes the medical experience and has significant practicality.

[0043] Other configurations and operations of the endoscopes according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0044] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. An ultrasonic probe, characterized in that, include: First signal connection terminal and second signal connection terminal; A transceiver assembly includes a piezoelectric element, an acoustic matching layer, and a backing layer. The piezoelectric element has an ultrasonic radiating surface. The acoustic matching layer is bonded to the ultrasonic radiating surface. The backing layer is bonded to the side opposite to the ultrasonic radiating surface of the piezoelectric element. The piezoelectric element includes a first piezoelectric layer and a second piezoelectric layer. A first signal connection terminal and a second signal connection terminal are electrically connected to the first piezoelectric layer and the second piezoelectric layer, respectively. The first piezoelectric layer and the second piezoelectric layer generate ultrasonic waves of different frequencies and receive corresponding echo signals.

2. The ultrasonic probe according to claim 1, characterized in that: The first signal connection terminal is a low-frequency signal connection terminal, and the first piezoelectric layer is a low-frequency piezoelectric layer. The second signal connection terminal is a high-frequency signal connection terminal, and the second piezoelectric layer is a high-frequency piezoelectric layer.

3. The ultrasonic probe according to claim 2, characterized in that: The first piezoelectric layer is disposed between the second piezoelectric layer and the backing layer, and the acoustic matching layer is bonded to the second piezoelectric layer.

4. The ultrasonic probe according to claim 1, characterized in that: The first signal connection terminal is connected to the first piezoelectric layer via a core wire, and the second signal connection terminal is connected to the second piezoelectric layer via a core wire.

5. The ultrasonic probe according to claim 4, characterized in that: The first signal connection terminal and the second signal connection terminal are provided with a core wire connection point on the side facing the transceiver component. The core wire connection point is used to concentrate the signal transmission path between the first signal connection terminal and the second signal connection terminal.

6. The ultrasonic probe according to claim 5, characterized in that: A ground wire is connected between the core wire junction and the backing layer.

7. The ultrasonic probe according to claim 1, characterized in that: The outer surface of the transceiver component is provided with a protective layer.

8. The ultrasonic probe according to claim 7, characterized in that: The protective layer is made of epoxy resin.

9. The ultrasonic probe according to claim 1, characterized in that: The first piezoelectric layer and the second piezoelectric layer are piezoelectric composite material parts.

10. An endoscope, characterized in that: Includes the ultrasonic probe as described in any one of claims 1 to 9.

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