Glue filling device and glue filling method for proximity sensor

Abstract

The invention discloses a glue filling device and a glue filling method for a proximity sensor, and belongs to the technical field of sensors, the glue filling device comprises a funnel body with a funnel cavity for accommodating glue liquid, a breaking part with a glue filling outlet and a baffle mounted on the funnel body, the breaking part is connected with the funnel body, the glue filling outlet is communicated with the funnel cavity, and the baffle is connected with the funnel cavity. The breaking component is in interference fit with a glue filling hole of the proximity sensor; the baffle is located outside the funnel cavity and used for abutting against the edge of the proximity sensor. When a breaking part is inserted into the glue filling hole, the glue filling outlet is communicated with the glue filling hole, so that a channel used for enabling a glue solution to flow into the glue filling hole is formed through the funnel cavity and the glue filling outlet, and after the glue solution flowing into the glue filling hole is solidified, the baffle is driven to drive the funnel body to rotate, so that the breaking part is broken. Therefore, the breaking part and the funnel body are broken and separated. The technical effects that the glue filling efficiency is improved, the quality consistency is improved, and the cost is reduced are achieved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of sensors, and particularly relates to a glue filling device and a glue filling method for a proximity sensor. BACKGROUND

[0002] The proximity sensor is widely used in industrial automation, automotive electronics and other fields. In order to protect the internal elements of the proximity sensor from the external environment, the proximity sensor needs to be filled with glue. In the prior art, two ways of manual needle tube glue filling and vacuum glue filling are usually used to fill the proximity sensor. The manual needle tube glue filling has low efficiency, needs to fill glue for multiple times, and is unstable in manual operation, which is prone to insufficient glue filling or glue overflow, reduces product yield, and has poor quality consistency. Meanwhile, the manual glue filling is slow and has low efficiency in mass production. The vacuum glue filling has complex equipment and high cost, and needs to be solidified for multiple times, which prolongs the glue filling cycle.

[0003] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. SUMMARY

[0004] The present application solves the technical problems of low glue filling efficiency, poor quality consistency and high cost.

[0005] To solve the above technical problems, the present application provides a glue filling device for a proximity sensor, which comprises a funnel body having a funnel cavity containing glue liquid, a breakable component having a glue filling outlet, and a baffle installed on the funnel body. The breakable component is connected with the funnel body, the glue filling outlet is in communication with the funnel cavity, and the breakable component is in interference fit with a glue filling hole of the proximity sensor. The baffle is located outside the funnel cavity and is used to abut against the edge of the proximity sensor. When the breakable component is inserted into the glue filling hole, the glue filling outlet is in communication with the glue filling hole to form a channel for the glue liquid to flow into the glue filling hole through the funnel cavity and the glue filling outlet. After the glue liquid flowing into the glue filling hole is solidified, the funnel body is rotated by driving the baffle to make the breakable component and the funnel body break and separate, so as to leave the breakable component in the glue filling hole.

[0006] Optionally, the funnel body comprises a tapered portion and a flow guide portion connected with the tapered portion, the flow guide portion is connected with the breakable component, the baffle is installed on the tapered portion, the funnel cavity is arranged in the tapered portion, and the funnel cavity is in communication with the glue filling outlet through the flow guide portion.

[0007] Optionally, the wall thickness of the breakable component is smaller than the wall thickness of the flow guide portion.

[0008] Optionally, the single-side interference of the breakable part and the glue filling hole is 0.02mm to 0.05mm, and the diameter of the glue filling outlet is greater than 2mm.

[0009] Optionally, a plurality of baffles are arranged on the outer wall of the funnel body, and the plurality of baffles are arranged around the glue filling outlet, the baffles are provided with a rounded corner structure towards the side close to the glue filling hole, and the diameter of the glue filling outlet is smaller than the diameter of the glue filling hole.

[0010] According to another aspect of the present application, the present application further provides a glue filling method for a proximity sensor, which comprises the glue filling device for the proximity sensor, and further comprises the following steps: aligning the glue filling outlet of the breakable part with the glue filling hole of the proximity sensor, and inserting the breakable part into the glue filling hole by interference fit; pushing the breakable part into the glue filling hole until the baffles contact the edge of the proximity sensor, so that the glue filling outlet communicates with the glue filling hole; injecting glue into the funnel cavity of the funnel body, so that the glue flows into the glue filling hole through the glue filling outlet; after the glue fills the glue filling hole and solidifies in the glue filling hole, driving the baffles to rotate the funnel body, so that the breakable part and the funnel body are broken and separated, and the breakable part is left in the glue filling hole.

[0011] Optionally, the glue comprises epoxy resin, and the funnel body and the breakable part are made of transparent polystyrene material.

[0012] Optionally, the funnel body and the breakable part are made by an integral molding process, and after the breakable part is inserted into the glue filling hole, the glue filling outlet and the glue filling hole are coaxial.

[0013] Optionally, the step of filling the glue into the glue filling hole and solidifying in the glue filling hole comprises the following steps: filling the glue into the glue filling hole; and during the solidification process, the shrinkage gap of the glue in the glue filling hole is automatically filled by the remaining glue in the funnel cavity.

[0014] Optionally, the step of injecting the glue into the funnel cavity of the funnel body comprises the following steps: injecting the glue into the funnel cavity by using a glue injection machine or a syringe, so that the glue flows into the glue filling hole.

[0015] Advantages:

[0016] The application provides a glue filling device for a proximity sensor, a glue solution is accommodated in a funnel cavity of a funnel body, a breaking part and the funnel body are connected to each other, a glue filling outlet is in communication with the funnel cavity, the breaking part is in interference fit with a glue filling hole of the proximity sensor, a baffle is installed on the funnel body, the baffle is located outside the funnel cavity and is used for abutting against an edge of the proximity sensor, when the breaking part is inserted into the inside of the glue filling hole, the glue filling outlet is in communication with the glue filling hole, a channel is formed through the funnel cavity and the glue filling outlet, the channel is used for the glue solution to flow into the inside of the glue filling hole, and after the glue solution flowing into the glue filling hole is solidified, the breaking part is left in the inside of the glue filling hole by driving the baffle to rotate the funnel body, so that the breaking part and the funnel body are broken and separated from each other. In this way, when the breaking part is inserted into the inside of the glue filling hole, the interference fit between the breaking part and the glue filling hole forms a sealed connection, the baffle abutting against the edge of the proximity sensor positions and restricts the funnel body, a directional glue solution transmission channel is formed between the funnel cavity and the glue filling hole, and the glue solution in the funnel cavity can quickly flow into the inside of the glue filling hole through the glue filling outlet. In addition, during the solidification of the glue solution in the glue filling hole, the remaining glue solution in the funnel cavity can automatically fill the shrinkage gap of the glue solution in the glue filling hole due to solidification. After the glue solution in the glue filling hole is completely solidified, the connection between the funnel body and the breaking part generates a shearing stress by rotating the funnel body driven by the baffle, until the breaking part and the funnel body are broken and separated from each other, the breaking part is left in the glue filling hole to form a permanent sealing structure, and the packaging of the glue filling hole is completed. Then, the glue filling is completed at one time, which is beneficial to improve the glue filling efficiency and product qualification rate, and reduce the equipment investment and product individual cost. Thus, the technical effects of improving the glue filling efficiency, improving the consistency of quality and reducing the cost are achieved. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0018] Figure 1 A structural schematic diagram of a glue filling device for a proximity sensor is provided for the embodiments of the present application.

[0019] Figure 2 A structural schematic diagram of a funnel body in a glue filling device for a proximity sensor is provided for the embodiments of the present application.

[0020] Figure 3 A structural schematic diagram of a proximity sensor in a glue filling device for a proximity sensor is provided for the embodiments of the present application.

[0021] Figure 4 A structure diagram of a flow guide part in a glue filling device for a proximity sensor is provided for an embodiment of the present application.

[0022] Figure 5 A structure diagram of a baffle in a glue filling device for a proximity sensor is provided for an embodiment of the present application.

[0023] Figure 6 A flow chart of a glue filling method for a proximity sensor is provided for an embodiment of the present application. DETAILED DESCRIPTION

[0024] The embodiments of the present application are described in detail below with reference to the accompanying drawings. The same or similar components are denoted by the same or similar reference numerals throughout the drawings, and repeated description is omitted. The embodiments described below are exemplary and are for the purpose of explanation only, and are not to be understood as limiting the present application.

[0025] In order to make the technical personnel in the art better understand the scheme of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0026] In the embodiments of the present application, at least one means one or more, and multiple means two or more. In the description of the present application, the terms "first", "second", "third", etc. are only used for distinguishing the purposes of description, and cannot be understood as indicating or implying relative importance, nor indicating or implying sequence.

[0027] In the description of the present application, the reference "an embodiment" or "some embodiments" means that the specific features, structures or characteristics described in connection with the embodiment are included in one or more embodiments of the present application. Therefore, in the present description, the terms "include", "contain", "have" and their variants mean "include but not limited to", unless otherwise specifically emphasized. It should be noted that in the embodiments of the present application, the "and / or" description of the associated objects represents that there can be three relationships, for example, A and / or B can represent the existence of A alone, the existence of A and B together, and the existence of B alone.

[0028] It should be noted that, in the embodiments of the present invention, when a component is referred to as being "fixed to" another component, it can be directly on the other component or an intervening component may be present. When a component is considered to be "connected to" another component, it can be directly connected to the other component or an intervening component may be present simultaneously. When a component is considered to be "set on" another component, it can be directly set on the other component or an intervening component may be present simultaneously. Furthermore, in the embodiments of this application, "connection" can also be understood as an electrical connection; the connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components. The terms "vertical," "horizontal," "left," "right," and similar expressions used in the embodiments of the present invention are for illustrative purposes only and are not intended to limit the present invention.

[0029] Embodiment 1 of the present invention provides a potting device for a proximity sensor. Please refer to [link to related document]. Figures 1 to 5 As shown, Figure 1 This is a schematic diagram of a glue-pouring device for a proximity sensor provided in an embodiment of the present invention. Figure 2 This is a schematic diagram of the funnel body in a glue-pouring device for a proximity sensor provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of the structure of a proximity sensor in a glue-pouring device for a proximity sensor according to an embodiment of the present invention. Figure 4 This is a schematic diagram of the flow guide section in a glue-potting device for a proximity sensor provided in an embodiment of the present invention. Figure 5 This is a schematic diagram of the structure of a baffle in a glue-filling device for a proximity sensor provided in an embodiment of the present invention. The glue-filling device for a proximity sensor provided in this embodiment of the present invention includes a funnel body 1, a breakaway component 2, and a baffle 3. The funnel body 1 has a funnel cavity 11 for containing glue. The breakaway component 2 has a glue-filling outlet 21, which is connected to the funnel body 1. The glue-filling outlet 21 communicates with the funnel cavity 11. The breakaway component 2 is press-fitted with the glue-filling hole 41 of the proximity sensor 4. The baffle 3 is installed on the funnel body 1 and is located outside the funnel cavity 11. Plate 3 is used to abut against the edge 42 of proximity sensor 4. When the broken part 2 is inserted into the glue-filling hole 41, the glue-filling outlet 21 is connected to the glue-filling hole 41 to form a channel through the funnel cavity 11 and the glue-filling outlet 21. This channel is used for the glue to flow into the glue-filling hole 41. After the glue flowing into the glue-filling hole 41 is cured, the funnel body 1 is rotated by driving baffle 3 so that the broken part 2 and the funnel body 1 break apart and leave the broken part 2 inside the glue-filling hole 41.

[0030] Wherein, the inside of the funnel cavity 11 has a space to contain glue liquid, the baffle 3 can be in contact with the edge 42 of the proximity sensor 4, such as the baffle 3 abutting against the edge 42 of the proximity sensor 4 which is protruded from the glue pouring hole 41. When the breakable part 2 is inserted into the glue pouring hole 41 of the proximity sensor 4, the baffle 3 can be horizontally positioned by abutting against the edge 42 of the proximity sensor 4, preventing tilting.

[0031] Wherein, in actual operation, when the breakable part 2 is inserted into the glue pouring hole 41 of the proximity sensor 4, the glue pouring outlet 21 is in communication with the glue pouring hole 41, so that the funnel cavity 11 and the glue pouring outlet 21 form a directional channel together for glue liquid to flow into the inside of the glue pouring hole 41. After the glue liquid flows into the glue pouring hole 41 and solidifies, the baffle 3 is operated by manual or driving device, driving the funnel body 1 to rotate around the axis of the glue pouring hole 41, which will cause shear stress at the connection point between the breakable part 2 and the funnel body 1, resulting in the breakable part 2 and the funnel body 1 being broken and separated from each other, permanently leaving the breakable part 2 in the glue pouring hole 41, completing the sealing packaging. In addition, anti-slip patterns can also be provided on the baffle 3 to improve the safety and convenience of operation.

[0032] Wherein, the funnel cavity 11 of the funnel body 1 can be a conical structure to accelerate the flow of glue liquid and reduce residue. The volume of the funnel cavity 11 can be adjusted according to the amount of glue liquid required to adapt to the size of the glue pouring hole 41 of the proximity sensor 4. In addition, a weak area can also be provided at the connection point between the breakable part 2 and the funnel body 1, such as a neck structure with a reduced diameter, so that the shear stress is concentrated at this point when rotating, that is, the fracture occurs at this point rather than inside the glue pouring hole 41.

[0033] Wherein, when the breakable part 2 with interference fit is inserted into the glue pouring hole 41, the channel from the funnel cavity 11 through the glue pouring outlet 21 to the glue pouring hole 41 can form a one-way non-backflow path, such as glue liquid rapidly flowing into the glue pouring hole 41 under the action of gravity, while the remaining glue liquid in the funnel cavity 11 automatically fills the gap when the glue liquid shrinks during solidification, through the continuous connectivity of the channel and the surface tension of the material, no air bubbles or shrinkage holes will be generated.

[0034] In the embodiment, the glue liquid is contained in the funnel cavity 11 of the funnel body 1, the breaking part 2 and the funnel body 1 are connected to each other, the glue pouring outlet 21 is communicated with the funnel cavity 11, the breaking part 2 is in interference fit with the glue pouring hole 41 of the proximity sensor 4, the baffle 3 is installed on the funnel body 1, the baffle 3 is located outside the funnel cavity 11, the baffle 3 is used to abut against the edge 42 of the proximity sensor 4, when the breaking part 2 is inserted into the inside of the glue pouring hole 41, the glue pouring outlet 21 is communicated with the glue pouring hole 41, to form a channel for the glue liquid to flow into the inside of the glue pouring hole 41 through the funnel cavity 11 and the glue pouring outlet 21, and after the glue liquid flowing into the glue pouring hole 41 is solidified, the breaking part 2 is left in the inside of the glue pouring hole 41 by driving the baffle 3 to rotate the funnel body 1, so that the breaking part 2 and the funnel body 1 are broken and separated from each other. In this way, when the breaking part 2 is inserted into the inside of the glue pouring hole 41, the interference fit between the breaking part 2 and the glue pouring hole 41 forms a sealed connection, the abutment of the baffle 3 against the edge 42 of the sensor positions and constrains the funnel body 1, forming a directional glue liquid transmission channel between the funnel cavity 11 and the glue pouring hole 41, and the glue liquid in the funnel cavity 11 can quickly flow into the inside of the glue pouring hole 41 through the glue pouring outlet 21. And in the solidification process of the glue liquid in the glue pouring hole 41, the remaining glue liquid in the funnel cavity 11 can automatically fill the shrinkage gap of the glue liquid in the glue pouring hole 41 due to solidification. After the glue liquid in the glue pouring hole 41 is completely solidified, the connection between the funnel body 1 and the breaking part 2 will generate shear stress by rotating the funnel body 1 driven by the baffle 3, until the breaking part 2 and the funnel body 1 are broken and separated from each other, leaving the breaking part 2 in the glue pouring hole 41 to form a permanent sealed structure, completing the packaging of the glue pouring hole 41. Then, the glue pouring is completed at one time, which is beneficial to improve the glue pouring efficiency and product qualification rate, and reduce the equipment investment and product individual cost. Thus, the technical effects of improving the glue pouring efficiency, improving the consistency of quality, and reducing the cost are achieved.

[0035] As an embodiment, the funnel body 1 comprises a tapered portion 12 and a flow guide portion 13, the flow guide portion 13 is connected to the tapered portion 12, and the flow guide portion 13 is connected to the breaking part 2, the baffle 3 is installed on the tapered portion 12, the funnel cavity 11 is arranged in the inside of the tapered portion 12, and the funnel cavity 11 is communicated with the glue pouring outlet 21 through the flow guide portion 13. The funnel cavity 11 of the tapered portion 12 can expand the temporary storage volume of the glue liquid, and the cooperation of the funnel cavity 11 and the straight cylinder structure of the flow guide portion 13 can form a wide-to-narrow flow channel, accelerating the directional flow of the glue liquid, to avoid the interruption of glue pouring due to insufficient flowability. At the same time, the baffle 3 is fixed on the tapered portion 12, and when rotating, the torque transmission is more efficient, realizing the separation of the funnel body 1 and the breaking part 2 at the preset breaking point.

[0036] In some embodiments, the wall thickness of the breakable part 2 is less than that of the flow guide part 13, and the thinning arrangement of the breakable part 2 relative to the flow guide part 13 forms a stress concentration area at the connection. When the rotating baffle 3 is rotated, shear stress is preferentially concentrated in the weak area of the breakable part 2, so as to avoid accidental breakage of the flow guide part 13 or the funnel body 1, improve the controllability of the breakage position, leave the breakable part 2 in the glue pouring hole 41 to form a permanent seal, reduce the material cost of the breakable part 2, and does not affect the structural strength of the flow guide part 13.

[0037] In some embodiments, the single-side interference amount of the breakable part 2 and the glue pouring hole 41 is 0.02mm to 0.05mm, and the diameter of the glue pouring outlet 21 is greater than 2mm. The interference amount of 0.02mm to 0.05mm can form a micro-deformation seal between the breakable part 2 and the glue pouring hole 41 after the breakable part 2 is inserted into the glue pouring hole 41, so as to avoid reverse leakage of glue, and at the same time, realize smooth insertion of the breakable part 2 into the glue pouring hole 41 and improve the sealing performance. The diameter of the glue pouring outlet 21 greater than 2mm can adapt to the minimum flow area requirement of high-viscosity glue, improve the stability of the glue flow rate, and avoid the situation that the glue pouring is easily blocked.

[0038] In some embodiments, the number of baffle plates 3 is multiple, the multiple baffle plates 3 are arranged at intervals on the outer wall of the funnel body 1, and the multiple baffle plates 3 are arranged around the glue pouring outlet 21. The baffle plate 3 is provided with a rounded corner structure 31 on the side close to the glue pouring hole 41, that is, at least part of the side close to the glue pouring hole 41 of the baffle plate 3 is in an arc curved surface shape, and the diameter of the glue pouring outlet 21 is less than that of the glue pouring hole 41. After the multiple baffle plates 3 are arranged at intervals around the glue pouring outlet 21, the stress distribution of the funnel body 1 is uniform, so as to avoid deflection of the funnel body 1 during rotation, make the breakable part 2 bear pure shear stress, and improve the breakage success rate. At the same time, the rounded corner structure 31 can avoid scratching the surface of the sensor, and the rounded corner structure 31 and the edge 42 of the proximity sensor 4 are matched with each other, and in addition, the diameter of the glue pouring outlet 21 is less than that of the glue pouring hole 41, so as to form a gap buffer zone, release micro-strain during rotation breakage, and avoid cracking of the glue solidified in the glue pouring hole 41.

[0039] In order to make a detailed description of the glue pouring method for the proximity sensor provided by the present application, the above-mentioned embodiment one has made a detailed description of the glue pouring device for the proximity sensor, and based on the same inventive concept, the present application also provides a glue pouring method for the proximity sensor, which is described in detail in embodiment two.

[0040] Please refer to Figure 6 as shown, Figure 6is a flow chart of a glue filling method for a proximity sensor provided by an embodiment of the present application. Embodiment two of the present application provides a glue filling method for a proximity sensor, the glue filling method for a proximity sensor comprises the glue filling device for a proximity sensor described above, and further comprises the following steps:

[0041] In step S100, the glue filling outlet 21 of the breakable part 2 is aligned with the glue filling hole 41 of the proximity sensor 4, and the breakable part 2 is inserted into the glue filling hole 41 in an interference fit;

[0042] Specifically, in the initial stage of installation, the operator can align the glue filling outlet 21 of the breakable part 2 with the glue filling hole 41 of the proximity sensor 4, and then apply an axial force to insert the breakable part 2 into the glue filling hole 41 in an interference fit, so as to realize the straight-line communication path of the glue filling outlet 21 and the glue filling hole 41, and provide a flow channel for the directional flow of the glue. At the same time, the breakable part 2 is inserted into the glue filling hole 41 in an interference fit, which causes the outer wall of the breakable part 2 to be slightly deformed with the inner wall of the glue filling hole 41, preventing glue leakage and forming an effective seal.

[0043] In step S200, the breakable part 2 is pushed to insert into the glue filling hole 41 until the baffle 3 contacts the edge 42 of the proximity sensor 4, so that the glue filling outlet 21 communicates with the glue filling hole 41;

[0044] The funnel body 1 and the breakable part 2 are made by an integral molding process, and after the breakable part 2 is inserted into the glue filling hole 41, the glue filling outlet 21 and the glue filling hole 41 are coaxial.

[0045] Specifically, by continuously pushing the breakable part 2 to move axially until the baffle 3 contacts the edge 42 of the sensor, the glue filling outlet 21 will be in complete communication with the glue filling hole 41 at this time. The contact between the baffle 3 and the edge 42 of the sensor can form a mechanical limit to eliminate the risk of axial overload applied by the operator and improve the consistency of the glue filling depth. At the same time, the funnel body 1 and the breakable part 2 are made by an integral molding process, which is conducive to improving the continuous smoothness of the inner wall of the glue flow channel and improving the glue flow rate. After the glue filling outlet 21 and the glue filling hole 41 are coaxial, a stability boundary is provided when the glue is injected to prevent shaking and leakage.

[0046] In step S300, glue is injected into the funnel cavity 11 of the funnel body 1, so that the glue flows into the glue filling hole 41 through the glue filling outlet 21;

[0047] The glue includes epoxy resin, and the funnel body 1 and the breakable part 2 are made of transparent polystyrene material. The injection of glue into the funnel cavity 11 of the funnel body 1 includes injecting the glue into the funnel cavity 11 by using a glue injection machine or a syringe, so that the glue flows into the glue filling hole 41.

[0048] Specifically, the epoxy resin glue solution is injected into the funnel cavity 11, and the glue injection tool can adopt a glue injection machine or a syringe. According to the actual needs of glue filling, the injection pressure of the glue injection machine and the injection speed of the syringe can be set. The funnel body 1 and the breaking component 2 are both made of transparent polystyrene, which facilitates observation of the filling state of the glue solution. Through the transparent material, the operator can visually confirm that the glue solution completely fills the glue filling hole 41, which is beneficial to realize no bubbles and improve the qualified rate.

[0049] Step S400, after the glue solution fills the glue filling hole 41 and solidifies in the glue filling hole 41, the baffle 3 is driven to rotate the funnel body 1 to make the breaking component 2 and the funnel body 1 break and separate, so as to leave the breaking component 2 in the glue filling hole 41.

[0050] In some embodiments, the glue solution fills the glue filling hole 41, and in the solidification process, the remaining glue solution in the funnel cavity 11 automatically fills the shrinkage gap of the glue solution in the glue filling hole 41.

[0051] Specifically, after the glue solution in the glue filling hole 41 solidifies, the baffle 3 can also be held to apply a rotating torque to drive the funnel body 1 to rotate, so that the breaking component 2 and the funnel body 1 break and separate, that is, the torque is converted into a neck shear stress, and breaks at the preset point. In the solidification process, the excess glue solution in the funnel cavity 11 will automatically fill the shrinkage gap. For example, the glue solution in the funnel cavity 11 compensates the volume difference through gravity to eliminate the shrinkage gap generated during the packaging process due to the solidification of the original glue solution, so as to realize no micropore in the glue filling hole 41 after completing a glue filling.

[0052] The application provides a glue filling method for a proximity sensor, by aligning the glue filling outlet 21 of the breakable part 2 with the glue filling hole 41 of the proximity sensor 4, and inserting the breakable part 2 into the glue filling hole 41 in an interference fit; pushing the breakable part 2 into the glue filling hole 41 until the baffle 3 and the edge 42 of the proximity sensor 4 are in contact with each other, so that the glue filling outlet 21 and the glue filling hole 41 are in communication with each other; injecting glue into the funnel cavity 11 of the funnel body 1, so that the glue flows into the inside of the glue filling hole 41 through the glue filling outlet 21; after the glue fills the glue filling hole 41 and solidifies in the glue filling hole 41, driving the baffle 3 to rotate the funnel body 1, so that the breakable part 2 and the funnel body 1 are broken and separated, and the breakable part 2 is left in the glue filling hole 41. In this way, when the breakable part 2 is inserted into the inside of the glue filling hole 41, the interference fit between the breakable part 2 and the glue filling hole 41 forms a sealed connection, and the abutment of the baffle 3 against the edge 42 of the sensor positions and constrains the funnel body 1, forming a directional glue transmission channel between the funnel cavity 11 and the glue filling hole 41, and the glue in the funnel cavity 11 can quickly flow into the inside of the glue filling hole 41 through the glue filling outlet 21. And during the solidification of the glue in the glue filling hole 41, the remaining glue in the funnel cavity 11 can automatically fill the shrinkage gap caused by the solidification of the glue in the glue filling hole 41. After the glue in the glue filling hole 41 is completely solidified, rotating the funnel body 1 by the baffle 3 will cause shear stress at the connection between the funnel body 1 and the breakable part 2, until the breakable part 2 and the funnel body 1 are broken and separated, leaving the breakable part 2 in the glue filling hole 41 to form a permanent sealing structure, completing the packaging of the glue filling hole 41. Then, the glue filling is completed at one time, which is beneficial to improve the glue filling efficiency and product qualification rate, and reduce the equipment investment and product individual cost. Thus, the technical effects of improving the glue filling efficiency, improving the consistency of quality, and reducing the cost are achieved.

[0053] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the application and not to limit it. Although the application has been described in detail with reference to the examples, those skilled in the art should understand that the technical solutions of the application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the application, and they should be covered in the scope of the claims of the application.

Claims

1. A dispensing device for proximity sensors, characterized in that, The glue-dispensing device includes a funnel body with a funnel cavity for receiving glue, a break-off component with a glue-dispensing outlet, and a baffle mounted on the funnel body. The break-off component is connected to the funnel body, and the glue-dispensing outlet communicates with the funnel cavity. The break-off component is interference-fitted with a glue-dispensing hole of a proximity sensor. The baffle is located outside the funnel cavity and is used to abut against the edge of the proximity sensor. When the break-off component is inserted into the glue-dispensing hole, the glue-dispensing outlet communicates with the glue-dispensing hole to form a channel for glue to flow into the glue-dispensing hole through the funnel cavity and the glue-dispensing outlet. After the glue flowing into the glue-dispensing hole solidifies, the funnel body is rotated by driving the baffle, causing the break-off component and the funnel body to break apart, thereby leaving the break-off component inside the glue-dispensing hole.

2. The potting apparatus for a proximity sensor according to claim 1, characterized in that, The funnel body includes a conical portion and a flow guide portion connected to the conical portion. The flow guide portion is connected to the break-off component. The baffle is installed on the conical portion. The funnel cavity is disposed inside the conical portion. The funnel cavity is connected to the glue outlet through the flow guide portion.

3. The potting apparatus for a proximity sensor according to claim 2, characterized in that, The wall thickness of the broken component is less than the wall thickness of the guide portion.

4. The potting apparatus for a proximity sensor according to claim 1, characterized in that, The interference fit between the broken component and the glue-filling hole on one side is 0.02mm to 0.05mm, and the diameter of the glue-filling outlet is greater than 2mm.

5. The potting apparatus for a proximity sensor according to claim 1, characterized in that, The number of baffles is multiple, and the multiple baffles are arranged at intervals on the outer wall of the funnel body, and the multiple baffles are arranged around the glue outlet. The baffles have a rounded corner structure on the side closer to the glue hole, and the diameter of the glue outlet is smaller than the diameter of the glue hole.

6. A potting method for proximity sensors, characterized in that, The potting method for proximity sensors includes the potting apparatus for proximity sensors as described in any one of claims 1 to 5, and further includes... Align the glue outlet of the broken component with the glue hole of the proximity sensor, and insert the broken component into the glue hole with an interference fit; Push the broken component into the glue-filling hole until the baffle contacts the edge of the proximity sensor, so that the glue-filling outlet communicates with the glue-filling hole; Inject adhesive into the funnel cavity of the funnel body so that the adhesive flows into the glue filling hole through the glue filling outlet; After the adhesive fills the filling hole and solidifies inside, the baffle is driven to rotate the funnel body, so that the broken part and the funnel body break apart, leaving the broken part inside the filling hole.

7. The potting method for a proximity sensor according to claim 6, characterized in that, The adhesive includes epoxy resin, and both the funnel body and the broken part are made of transparent polystyrene.

8. The potting method for a proximity sensor according to claim 6, characterized in that, The funnel body and the broken component are manufactured using an integral molding process, and after the broken component is inserted into the glue-filling hole, the glue-filling outlet and the glue-filling hole are coaxial.

9. The potting method for a proximity sensor according to claim 6, characterized in that, The process of filling and curing the glue into the glue-filling hole includes filling the glue-filling hole with glue; during the curing process, the remaining glue in the funnel cavity automatically fills the shrinkage gap of the glue in the glue-filling hole.

10. The potting method for a proximity sensor according to claim 6, characterized in that, The process of injecting adhesive into the funnel cavity of the funnel body includes using a glue injector or syringe to inject the adhesive into the funnel cavity so that the adhesive flows into the glue filling hole.

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