Packaging adhesive film

Abstract

The invention discloses a packaging adhesive film 100, which comprises an adhesive film body and surface patterns arranged on at least one surface of the adhesive film body, the surface patterns comprise a first pattern basically extending along a first direction and a second pattern basically extending along a second direction, and the first direction and the second direction intersect at a preset angle alpha, the preset angle alpha is larger than 0 degree and smaller than 180 degrees; the surface patterns comprise at least one first pattern and at least one second pattern. The surface patterns are arranged on the surface of the packaging adhesive film 100, so that the technical problems in the prior art are effectively solved, the adhesive force of the packaging adhesive film 100 on the photovoltaic substrate is increased, and the offset problem occurring in the laying process of the photovoltaic module is reduced.

Description

Technical Field

[0001] This invention relates to photovoltaic encapsulation technology, and in particular to an encapsulation film. Background Technology

[0002] Photovoltaic power generation, as a green energy source, is considered an ideal new energy alternative to thermal power. Photovoltaic modules are the core components in the photovoltaic power generation process.

[0003] Photovoltaic modules typically consist of photovoltaic electrodes and substrates located on both sides of the solar cells. The solar cells and substrates are encapsulated with an encapsulating film. The encapsulating film plays a crucial role in the encapsulation and subsequent use of photovoltaic modules, and its encapsulation quality directly affects the lifespan of the photovoltaic modules.

[0004] However, in the process of implementing the technical solutions in the embodiments of this application, the inventors of this application discovered that the above-mentioned technology has at least the following technical problems:

[0005] The current electro-engraved random embossing patterns on the encapsulating film have poor adhesion to photovoltaic substrates such as glass. They are prone to slippage during production line acceleration. At the same time, the encapsulating film and the grid lines on the multi-busbar cells will also roll and slip, resulting in misalignment during module installation. After lamination, this leads to defects in appearance such as cell misalignment, cell merging, bubbles, and missing adhesive. Summary of the Invention

[0006] This application provides an encapsulating film that solves the problem of offset during module installation in the prior art. It improves the adhesion of the encapsulating film to substrates such as glass during installation, avoids rolling and slipping of the encapsulating film and the grid lines on multi-busbar cells, and ensures the yield rate of photovoltaic module encapsulation.

[0007] This application provides an encapsulating film, including a film body, and the encapsulating film further includes a surface pattern disposed on at least one surface of the film body, the surface pattern including:

[0008] The first pattern extends basically along the first direction;

[0009] The second pattern extends basically along the second direction;

[0010] The first direction and the second direction intersect at a preset angle, which is greater than 0° and less than 180°;

[0011] The surface pattern includes at least one first pattern and at least one second pattern.

[0012] Furthermore, the thickness of the adhesive film body is 0.3-2.0mm, the length of the first pattern is 1-5mm and the width is 0.05-3mm, and the length of the second pattern is 1-5mm and the width is 0.05-3mm.

[0013] Furthermore, when the preset angle is greater than 0° and less than or equal to 90°, the aspect ratio of the first pattern is (1.5-100):1, and the aspect ratio of the second pattern is (1.5-100):1; when the preset angle is greater than 90° and less than 180°, the aspect ratio of the first pattern is (1.5-10):1, and the aspect ratio of the second pattern is (1.5-10):1.

[0014] Furthermore, the first pattern and the second pattern come into contact with each other.

[0015] Furthermore, one end of the first pattern is in contact with one end of the second pattern, one end of the first pattern is in contact with the midpoint of the second pattern, or the midpoint of the first pattern is in contact with the midpoint of the second pattern.

[0016] Furthermore, the first pattern and the second pattern are distributed in a "┌" shape, a "┬" shape, or a "┼" shape.

[0017] Furthermore, the surface pattern includes at least two identical or different pattern units, and adjacent pattern units are interconnected to form a cross-network structure.

[0018] Furthermore, the first pattern and the second pattern are separated from each other.

[0019] Furthermore, the first and second patterns are raised.

[0020] Furthermore, at least one of the first or second patterns is an arc-shaped protrusion, and the maximum height of the arc-shaped protrusion is 0.05-1.5mm.

[0021] Furthermore, at least one of the first or second patterns is a platform-shaped protrusion with a height of 0.05-1.5 mm.

[0022] Furthermore, the encapsulating film includes a first pattern group, which includes a number of first patterns connected end to end along a first direction; each first pattern is an arc-shaped protrusion; along the first direction, the first pattern has a first connecting end, a highest point of the protrusion, and a second connecting end connected in sequence, the height of the highest point of the protrusion is higher than the height of the first connecting end, and the height of the highest point of the protrusion is higher than the height of the second connecting end.

[0023] Furthermore, there are multiple first pattern groups, which are arranged at intervals along the second direction, with adjacent first pattern groups being staggered.

[0024] Furthermore, the encapsulating film also includes a second pattern group, which passes through each of the first pattern groups in sequence to form a mesh structure.

[0025] Furthermore, there are multiple second pattern groups, and the two connecting ends of the second pattern in each second pattern group respectively contact the middle of the first pattern in two first pattern groups, and are inserted at the connection of two adjacent first patterns in at least one first pattern group.

[0026] Furthermore, the encapsulating film also includes a plurality of first pattern groups, each first pattern group including a plurality of first patterns arranged at intervals along a first direction, and the plurality of first patterns arranged at intervals along a second direction.

[0027] The encapsulating film also includes multiple second pattern groups, each second pattern group including multiple second patterns arranged along a second direction, and the multiple groups of second patterns are arranged at intervals along a first direction;

[0028] Each second pattern group is positioned between two adjacent first pattern groups.

[0029] The technical solution provided in this application has at least the following advantages:

[0030] This application effectively solves the technical problems in the prior art by setting surface patterns on the surface of the encapsulating film, thereby increasing the adhesion of the encapsulating film to the photovoltaic substrate, avoiding rolling and slippage between the encapsulating film and the grid lines on the multi-busbar solar cell, and reducing the offset problem that occurs during the installation of photovoltaic modules. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the encapsulating film in one implementation of this application;

[0032] Figure 2 This is a schematic diagram of the encapsulating film in another implementation of this application;

[0033] Figure 3 This is a schematic diagram of the encapsulating film in another implementation of this application;

[0034] Figure 4 This is a schematic diagram of the encapsulating film in another implementation of this application;

[0035] Figure 5 This is a schematic diagram of the encapsulating film in another implementation of this application;

[0036] Figure 6 This is a longitudinal cross-sectional view of the first pattern in one implementation of this application;

[0037] Figure 7 This is a longitudinal section diagram of the first pattern in another implementation of this application;

[0038] Figure 8 This is a longitudinal section diagram of the first pattern in another implementation of this application;

[0039] Figure 9 This is a schematic diagram of the encapsulating film in another implementation of this application;

[0040] Figure 10 This is a schematic diagram of the encapsulating film in another implementation of this application;

[0041] Figure 11 This is a schematic diagram of the encapsulating film in another implementation of this application.

[0042] In the figure: encapsulating film 100, first direction 101, second direction 102, preset angle α, thickness H, height L, length a, width b; film body 11, surface pattern 12, first pattern 121, second pattern 122. Detailed Implementation

[0043] To enable those skilled in the art to better understand the present invention, the technical solutions in specific embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described in the embodiments of the present application can be combined with each other. The present application will now be described in detail with reference to the embodiments.

[0044] This application provides an encapsulating film 100, which solves the problem of poor appearance of the module after installation due to poor adhesion between the encapsulating film and the photovoltaic substrate in the prior art. It avoids the encapsulating film from rolling and sliding with the grid lines on the multi-busbar solar cell. The surface pattern 12 on the surface of the encapsulating film 100 ensures that the encapsulating film 100 does not shift during the installation of the photovoltaic module.

[0045] The embodiments in this application provide an encapsulating film 100, specifically a photovoltaic encapsulating film. For example... Figure 1As shown, it includes a film body 11 and a surface pattern 12 disposed on at least one surface of the film body 11. The surface pattern 12 includes at least two identical or different pattern units. Specifically, the pattern units include a first pattern 121 and a second pattern 122. The first pattern 121 extends substantially along a first direction 101; the second pattern 122 extends substantially along a second direction 102. The first direction 101 and the second direction 102 intersect at a predetermined angle α, which is greater than 0° and less than 180°. Providing the surface pattern 12 on the surface of the encapsulation film 100 can increase the adhesion between the encapsulation film 100 and the substrate during component placement, solving the problem of poor adhesion and easy displacement of the encapsulation film and substrate in the prior art. Simultaneously, adding the surface pattern 12 can also increase the peel performance between the encapsulation film 100 and the mold after molding, ensuring the integrity of the encapsulation film 100 after peeling, solving the problem of difficult peeling of the encapsulation film after molding in the prior art. The surface pattern 12 includes at least one pattern unit composed of a first pattern 121 and a second pattern 122. The first pattern 121 and the second pattern 122 are basically stripes. The first pattern 121 extends basically along the first direction 101, and the second pattern 122 extends basically along the second direction 102. The included angle between the first direction 101 and the second direction 102 is a preset angle α. The preset angle α only needs to satisfy that the first direction 101 and the second direction 102 are not parallel or coincident with each other. Generally speaking, while ensuring the technical effect, the first direction 101 and the second direction 102 are set to be basically perpendicular.

[0046] As one implementation, the thickness H of the encapsulant film body 11 is 0.3-2.0 mm. The encapsulant film 100 has raised structures. If the thickness H of the encapsulant film body 11 is set as in existing encapsulant films without raised structures, the adhesive content of the film will inevitably be too high. This will not only increase production costs, but also reduce the bonding strength after the module is encapsulated, affecting the module's lifespan. To ensure that the adhesive content in the encapsulant film 100 meets the requirements for photovoltaic module encapsulation, the thickness H of the encapsulant film body 11 needs to be adjusted accordingly. For encapsulant films 100 with more raised structures, the thickness H of the encapsulant film body 11 needs to be appropriately reduced. Alternatively, the thickness H of the encapsulant film body 11 can be set according to actual production needs. A thickness H range of 0.3-2.0 mm is a suitable range for this application, as it meets the adhesive content requirements of the encapsulant film 100 while minimizing production costs and improving production efficiency.

[0047] As one implementation, the length 'a' of the first pattern 121 is 1-5 mm and the width 'b' is 0.05-3 mm; the length 'a' of the second pattern 122 is 1-5 mm and the width 'b' is 0.05-3 mm. Furthermore, the dimensions of the first pattern 121 and the second pattern 122 are limited to ensure that they have a certain length 'a' and width 'b', thereby enhancing the contact area between the encapsulating film 100 and the substrate. This ensures the adhesion between the encapsulating film 100 and the substrate during installation, preventing slippage and other problems. The dimensions of the first pattern 121 and the second pattern 122 should not be too large. If the first pattern 121 and the second pattern 122 are too large, the number of first patterns 121 and second patterns 122 per unit area of ​​the encapsulating film 100 will be small. During encapsulation, the contact area between the encapsulating film 100 and the substrate will be small, reducing the adhesion of the encapsulating film 100 to the substrate. This means the problem of the encapsulating film 100 easily slipping will remain unresolved. The size of the first pattern 121 and the second pattern 122 should not be too small. If the first pattern 121 and the second pattern 122 are too small, there will be a large number of the first pattern 121 and the second pattern 122 per unit area of ​​the encapsulating film 100, which will increase the difficulty of peeling the encapsulating film 100 from the film roller and will have an adverse effect on the integrity of the encapsulating film 100.

[0048] As one implementation method, when the preset angle is greater than 0° and less than or equal to 90°, the aspect ratio of the first pattern is (1.5-100):1 and the aspect ratio of the second pattern is (1.5-100):1; when the preset angle is greater than 90° and less than 180°, the aspect ratio of the first pattern is (1.5-10):1 and the aspect ratio of the second pattern is (1.5-10):1. When the angle between the first and second patterns is greater than 90°, the space occupied by the pattern unit composed of the first and second patterns is larger. If the aspect ratio of the first and second patterns is still large at this time, the area ratio of the pattern within the unit film area will be smaller, reducing the contact area between the encapsulation film and the substrate. This will reduce the adhesion between the encapsulation film and the substrate during installation and easily cause slippage and other problems. Therefore, when the angle between the first and second patterns is large, the first pattern or the aspect ratio of the first pattern should be limited to a small range to ensure the contact area between the encapsulation film and the substrate during installation and to ensure the adhesion between the two.

[0049] As one implementation method, the first pattern 121 and the second pattern 122 are in contact with each other. When set up, the first pattern 121 and the second pattern 122 can directly contact each other to form an intersection or crosspoint. When the first pattern 121 and the second pattern 122 are in contact and form an intersection or crosspoint, the first pattern 121 and the second pattern 122 are connected and mutually supportive, increasing the structural stability of the first pattern 121 and the second pattern 122, making it less prone to positional shifts or other situations that could reduce the yield rate.

[0050] One implementation is that one end of the first pattern 121 is in contact with one end of the second pattern 122, one end of the first pattern 121 is in contact with the midpoint of the second pattern 122, or the midpoint of the first pattern 121 is in contact with the midpoint of the second pattern 122. Specifically, the contact between the first pattern 121 and the second pattern 122 can be one end of the first pattern 121 in contact with one end of the second pattern 122, or one end of either the first pattern 121 or the second pattern 122 can be in contact with any point of the other pattern except its endpoints. Alternatively, any point of the first pattern 121 (excluding its endpoints) can be in contact with any point of the second pattern 122 (excluding its endpoints).

[0051] As one implementation method, the first pattern 121 and the second pattern 122 are in contact with each other in a "┬" shape (e.g., Figure 2 As shown), they are distributed in a "┌" shape (as shown). Figure 3 (as shown) or distributed in a "┼" shape (such as...) Figure 4 (As shown). For the sake of simplicity in mold design, in this implementation, the first pattern 121 and the second pattern 122 are arranged to contact each other and form an intersection or cross point. Specifically, the first pattern 121 and the second pattern 122 can be arranged as follows: one end of the first pattern 121 contacts one end of the second pattern 122, or one end of the first pattern 121 contacts the midpoint of the second pattern 122, or the midpoint of the first pattern 121 contacts the midpoint of the second pattern 122. The mutual arrangement of the first pattern 121 and the second pattern 122 allows them to support each other, ensuring the structural integrity of the first pattern 121 and the second pattern 122 during the manufacturing process.

[0052] As one implementation method, such as Figure 5 As shown, adjacent pattern units are interconnected, making the surface pattern 12 a cross-network structure. When the first pattern 121 and the second pattern 122 are in contact with each other, adjacent first patterns 121 can directly contact each other end to end, and adjacent second patterns 122 can also directly contact each other end to end, ultimately forming a surface pattern 12 with a cross-network structure.

[0053] As one implementation, the first pattern 121 and the second pattern 122 are separated from each other. The first pattern 121 and the second pattern 122 can also be in a separate state, without contact with each other.

[0054] As one implementation method, the first pattern 121 and the second pattern 122 are raised. The encapsulating film 100 needs to be bonded to a substrate made of materials such as glass before the photovoltaic module is encapsulated. In the existing technology, the modules are developing towards larger sizes, and the encapsulating film and substrate are also developing towards larger sizes. In the actual production process of bonding the encapsulating film to the substrate, the edges of the encapsulating film are often bonded to the substrate first. One problem is that after the edges of the film are bonded to the substrate, a large amount of air remains in some areas between the encapsulating film and the substrate and cannot be expelled in time. The existing technology uses a vacuum method to expel this air, but due to the trend of modules developing towards larger sizes, if only a vacuum method is used to expel air, the air expulsion efficiency is low. Furthermore, as the vacuuming continues and the encapsulating film and the substrate are continuously bonded, some air will still remain in areas far from the vacuuming device, such as the center of the substrate, and cannot be completely expelled. There are air bubbles between the encapsulating film and the substrate. The presence of these air bubbles will affect the quality of the photovoltaic module after lamination, reducing the quality and lifespan of the photovoltaic module. A certain protrusion structure is provided on the adhesive film body 11, and there is a certain gap between the protrusion structure. These gaps can provide a gas exhaust channel for the gas during the bonding process between the encapsulation adhesive film 100 and the substrate, so as to completely exhaust the air and ensure the bonding effect between the adhesive film and the substrate. On the other hand, it can also reduce the slippage of the adhesive film on the substrate.

[0055] As one implementation method, such as Figure 6 As shown, at least one of the first pattern 121 or the second pattern 122 is a platform-shaped protrusion, and the height L of the platform-shaped protrusion is 0.2-1.5mm.

[0056] As one implementation method, such as Figure 7 As shown, at least one of the first pattern 121 or the second pattern 122 is a cuboid protrusion, and the height L of the cuboid protrusion is 0.2-1.5mm.

[0057] As one implementation method, such as Figure 8 As shown, at least one of the first pattern 121 or the second pattern 122 is an arc-shaped protrusion, and the maximum height L of the arc-shaped protrusion is 0.2-1.5mm.

[0058] The top surfaces of the first pattern 121 and the second pattern 122 can be horizontal or curved surfaces with a certain curvature. The height L of the first pattern 121 and the second pattern 122 should not be too high; otherwise, due to the presence of missing adhesive areas in the pattern layer formed by the first pattern 121 and the second pattern 122, the encapsulating film 100 will have excessive adhesive deficiency, affecting the adhesion of the encapsulating film 100 during subsequent component encapsulation. The height L of the first pattern 121 and the second pattern 122 should preferably not exceed the thickness H of the film body 11.

[0059] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0060] Example 1

[0061] like Figure 1 As shown, an encapsulating film 100 includes a film body 11. One surface of the film body 11 has a surface pattern 12, and the surface pattern 12 and the film body 11 are integrally formed. The surface pattern 12 includes pattern units composed of a first pattern 121 and a second pattern 122. The first pattern 121 extends along a first direction 101, and the second pattern 122 extends along a second direction 102. The first direction 101 and the second direction 102 are perpendicular to each other, i.e., the included angle between the first direction 101 and the second direction 102 is a preset angle α, which is 90°. The first pattern 121 and the second pattern 122 are distributed in a non-contact, "┬"-shaped pattern. The first pattern 121 is a strip-shaped protrusion with an arc-shaped longitudinal section along the first direction 101 (e.g., ...). Figure 7 As shown, the second pattern 122 has an arc-shaped strip-like protrusion along the second direction 102 in its longitudinal section, which is the same as the first pattern 121. The thickness H of the adhesive film body 11 is 0.3 mm, the length a of the first pattern 121 is 1.0 mm, the width b of the first pattern 121 is 0.05 mm, the height L of the first pattern 121 is 0.05 mm, the length a of the second pattern 122 is 1.0 mm, the width b of the second pattern 122 is 0.05 mm, and the height L of the second pattern 122 is 0.05 mm.

[0062] Example 2

[0063] like Figure 2As shown, an encapsulating film 100 includes a film body 11. One surface of the film body 11 is provided with a surface pattern 12, and the surface pattern 12 and the film body 11 are integrally formed. The surface pattern 12 includes pattern units composed of a first pattern 121 and a second pattern 122. The first pattern 121 extends along a first direction 101, and the second pattern 122 extends along a second direction 102. The first direction 101 and the second direction 102 are perpendicular to each other, i.e., the included angle between the first direction 101 and the second direction 102 is a preset angle α, which is 90°. The first pattern 121 and the second pattern 122 are arranged in a contacting "┬" shape. The first pattern 121 is a strip-shaped protrusion with an arc-shaped longitudinal section along the first direction 101 (e.g., ...). Figure 7 As shown, the second pattern 122 has an arc-shaped strip-like protrusion along the second direction 102 in its longitudinal section, which is the same as the first pattern 121. The thickness H of the adhesive film body 11 is 1.0 mm, the length a of the first pattern 121 is 5.0 mm, the width b of the first pattern 121 is 3.0 mm, the height L of the first pattern 121 is 1.5 mm, the length a of the second pattern 122 is 5.0 mm, the width b of the second pattern 122 is 3.0 mm, and the height L of the second pattern 122 is 1.5 mm.

[0064] Example 3

[0065] like Figure 3 As shown, an encapsulating film 100 includes a film body 11. One surface of the film body 11 is provided with a surface pattern 12, and the surface pattern 12 and the film body 11 are integrally formed. The surface pattern 12 includes pattern units composed of a first pattern 121 and a second pattern 122. The first pattern 121 extends along a first direction 101, and the second pattern 122 extends along a second direction 102. The first direction 101 and the second direction 102 are perpendicular to each other, i.e., the included angle between the first direction 101 and the second direction 102 is a preset angle α, which is 90°. The first pattern 121 and the second pattern 122 are arranged in a contacting "┌" shape. The first pattern 121 is a strip-shaped protrusion with an arc-shaped longitudinal section along the first direction 101 (e.g., ...). Figure 7 As shown, the second pattern 122 has an arc-shaped strip-like protrusion along the second direction 102 in its longitudinal section, which is the same as the first pattern 121. The thickness H of the adhesive film body 11 is 1.5 mm, the length a of the first pattern 121 is 2.0 mm, the width b of the first pattern 121 is 0.1 mm, the height L of the first pattern 121 is 0.1 mm, the length a of the second pattern 122 is 2.0 mm, the width b of the second pattern 122 is 0.1 mm, and the height L of the second pattern 122 is 0.1 mm.

[0066] Example 4

[0067] like Figure 4As shown, an encapsulating film 100 includes a film body 11. One surface of the film body 11 has a surface pattern 12, and the surface pattern 12 and the film body 11 are integrally formed. The surface pattern 12 includes pattern units composed of a first pattern 121 and a second pattern 122. The first pattern 121 extends along a first direction 101, and the second pattern 122 extends along a second direction 102. The first direction 101 and the second direction 102 are perpendicular to each other, i.e., the included angle between the first direction 101 and the second direction 102 is a preset angle α, which is 90°. The first pattern 121 and the second pattern 122 are arranged in a "┼" shape, and the first pattern 121 is a strip-shaped protrusion with an arc-shaped longitudinal section along the first direction 101 (e.g., ...). Figure 7 As shown, the second pattern 122 has an arc-shaped strip-like protrusion along the second direction 102 in its longitudinal section, which is the same as the first pattern 121. The thickness H of the adhesive film body 11 is 2.0 mm, the length a of the first pattern 121 is 3.0 mm, the width b of the first pattern 121 is 0.5 mm, the height L of the first pattern 121 is 0.4 mm, the length a of the second pattern 122 is 3.0 mm, the width b of the second pattern 122 is 0.5 mm, and the height L of the second pattern 122 is 0.4 mm.

[0068] Example 5

[0069] like Figure 5 As shown, an encapsulating film 100 includes a film body 11. One surface of the film body 11 has a surface pattern 12, and the surface pattern 12 and the film body 11 are integrally formed. The surface pattern 12 includes pattern units composed of a first pattern 121 and a second pattern 122. The first pattern 121 extends along a first direction 101, and the second pattern 122 extends along a second direction 102. The first direction 101 and the second direction 102 are perpendicular to each other, i.e., the included angle between the first direction 101 and the second direction 102 is a preset angle α, which is 90°. The first pattern 121 and the second pattern 122 are arranged in a "┼" shape, and the first pattern 121 is a strip-shaped protrusion with a rectangular longitudinal section along the first direction 101 (e.g., ...). Figure 7 As shown, the second pattern 122, in its longitudinal section along the second direction 102, is a rectangular strip-shaped protrusion identical to the first pattern 121. Adjacent pattern units are interconnected, making the surface pattern 12 a cross-network structure. The thickness H of the adhesive film body 11 is 2.0 mm, the length a of the first pattern 121 is 4.0 mm, the width b of the first pattern 121 is 2.5 mm, and the height L of the first pattern 121 is 1.5 mm. The length a of the second pattern 122 is 4.0 mm, the width b of the second pattern 122 is 2.5 mm, and the height L of the second pattern 122 is 1.5 mm.

[0070] Example 6

[0071] like Figure 9 As shown, an encapsulating film 100 includes a second pattern group, which sequentially replaces each of the first pattern group to form a mesh structure.

[0072] The second pattern group forms a mesh structure with the first pattern group. This interwoven pattern layout helps reduce the shrinkage rate of the encapsulating film during heat treatment because the mesh structure can provide additional support, restrict the free shrinkage of the encapsulating film during heating, thereby maintaining the shape stability of the encapsulating film, reducing the dimensional changes and internal stress of the component after encapsulation, and improving the long-term stability and reliability of the component.

[0073] There are multiple second pattern groups. The two connecting ends of the second pattern 122 of each second pattern group are respectively in contact with the middle of the first pattern 121 of two first pattern groups, and are inserted at the connection of at least one first pattern group of two adjacent first patterns 121.

[0074] Specifically, the second pattern group contacts the center of the first pattern group in a specific manner and is inserted at the connection of adjacent patterns in the first pattern group. This design not only increases the complexity of the encapsulation film surface and improves the anti-slip performance, but also allows the encapsulation film to more effectively disperse the force when under pressure, avoiding deformation caused by unidirectional stress, ensuring the flatness of the component during the encapsulation process. At the same time, it also helps to reduce the shrinkage rate of the encapsulation film itself, reduce the internal stress of the component, and improve the encapsulation quality and the durability of the component.

[0075] The encapsulating film also includes a plurality of first pattern groups, each first pattern group including a plurality of first patterns 121 arranged at intervals along a first direction, and the plurality of first patterns 121 arranged at intervals along a second direction.

[0076] The encapsulating film also includes a plurality of second pattern groups, each of which includes a plurality of second patterns 122 arranged along a second direction, and the plurality of second patterns 122 are arranged at intervals along a first direction.

[0077] Each second pattern group is positioned between two adjacent first pattern groups.

[0078] The encapsulating film comprises multiple first and second pattern groups arranged in an orderly, staggered pattern. This composite pattern design comprehensively considers the requirements for anti-slip properties, stress dispersion, and shrinkage control. On one hand, the staggered pattern increases the friction between the encapsulating film and the substrate, significantly enhancing anti-slip performance. On the other hand, the formation of the mesh structure helps to evenly distribute the stress generated during the encapsulation process, reducing the risk of stress concentration. Furthermore, the orderly pattern layout also plays a positive role in controlling the shrinkage rate of the encapsulating film, reducing component size changes caused by heat shrinkage, and improving the overall encapsulation quality and component reliability.

[0079] In some embodiments of this application, the thickness H of the adhesive film body 11 is 1.5 mm, the length a of the first pattern 121 is 3.0 mm, the width b of the first pattern 121 is 2.0 mm, the height L of the first pattern 121 is 1.0 mm, the length a of the second pattern 122 is 3.0 mm, the width b of the second pattern 122 is 2.0 mm, and the height L of the second pattern 122 is 1.0 mm.

[0080] Example 7

[0081] like Figure 10 As shown, an encapsulating film 100 includes a film body 11. One surface of the film body 11 has a surface pattern 12, and the surface pattern 12 and the film body 11 are integrally formed. The surface pattern 12 includes a pattern unit composed of a first pattern 121 and a second pattern 122. The first pattern 121 extends along a first direction 101, and the second pattern 122 extends along a second direction 102. The included angle between the first direction 101 and the second direction 102 is a preset angle α, which is 135°. One end of the first pattern 121 is in contact with one end of the second pattern 122. The first pattern 121 is a strip-shaped protrusion with an arc-shaped longitudinal section along the first direction 101 (e.g., ...). Figure 7 As shown, the second pattern 122 has an arc-shaped strip-like protrusion along the second direction 102 in its longitudinal section, which is the same as the first pattern 121. The thickness H of the adhesive film body 11 is 1.5 mm, the length a of the first pattern 121 is 3.0 mm, the width b of the first pattern 121 is 1.5 mm, the height L of the first pattern 121 is 0.8 mm, the length a of the second pattern 122 is 3.0 mm, the width b of the second pattern 122 is 1.5 mm, and the height L of the second pattern 122 is 0.8 mm.

[0082] Example 8

[0083] like Figure 11 As shown, an encapsulating film 100 includes a film body 11, one surface of which is provided with a surface pattern 12, and the surface pattern 12 and the film body 11 are integrally formed. It also includes a first pattern group, which comprises multiple first patterns connected end-to-end along a first direction; each first pattern is an arc-shaped protrusion; along the first direction, each first pattern has a first connecting end, a highest point of the protrusion, and a second connecting end connected in sequence, the height of the highest point of the protrusion being higher than the height of the first connecting end, and the height of the highest point of the protrusion being higher than the height of the second connecting end.

[0084] In some embodiments of this application, there are multiple first pattern groups, which are arranged at intervals along the second direction, with adjacent first pattern groups being staggered.

[0085] The second pattern group forms a mesh structure with the first pattern group. This interwoven pattern layout helps reduce the shrinkage rate of the encapsulating film during heat treatment because the mesh structure can provide additional support, restrict the free shrinkage of the encapsulating film during heating, thereby maintaining the shape stability of the encapsulating film, reducing the dimensional changes and internal stress of the component after encapsulation, and improving the long-term stability and reliability of the component.

[0086] In some embodiments of this application, the first pattern 121 extends along the first direction 101, and the second pattern 122 extends along the second direction 102. The included angle between the first direction 101 and the second direction 102 is a preset angle α, which is 135°. One end of the first pattern 121 is in contact with one end of the second pattern 122. The first pattern 121 is a strip-shaped protrusion with an arc-shaped longitudinal section along the first direction 101 (e.g., Figure 8 As shown, the second pattern 122, in its longitudinal section along the second direction 102, is an arc-shaped strip-like protrusion identical to the first pattern 121. The first pattern 121 and the second pattern 122 cooperate to form a structure similar to fiber warp and weft weaving. The thickness H of the adhesive film body 11 is 1.5 mm, the length a of the first pattern 121 is 3.0 mm, the width b of the first pattern 121 is 1.5 mm, the maximum height L of the first pattern 121 is 0.8 mm, the length a of the second pattern 122 is 3.0 mm, the width b of the second pattern 122 is 1.5 mm, and the maximum height L of the second pattern 122 is 0.8 mm.

[0087] By setting a first pattern group, wherein the first pattern is an arc-shaped protrusion connected end to end along a first direction, this design can significantly increase the friction coefficient of the encapsulation film surface. Especially at the moment of contact with the photovoltaic substrate, it can immediately provide a strong gripping force, effectively preventing the encapsulation film from slipping on the high-speed production line, ensuring the precise laying of the module, and greatly improving the encapsulation efficiency and the positioning accuracy of the module.

[0088] Multiple first pattern groups are arranged at intervals along the second direction, and adjacent first pattern groups are staggered. This design can evenly distribute stress to a larger area when the encapsulation film is subjected to external force through the interlaced pattern structure, avoiding damage or deformation of the encapsulation film caused by local stress concentration, enhancing the stability of the encapsulation film under high temperature and high pressure environment, and improving the encapsulation quality.

[0089] No problems of encapsulation film slippage or cell displacement were found when the encapsulation films prepared in Examples 1-8 were used to prepare photovoltaic module lamination.

[0090] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. An encapsulating film, comprising a film body, characterized in that, The encapsulating film also includes: A surface pattern is provided on at least one surface of the adhesive film body, the surface pattern including: The first pattern extends basically along the first direction; The second pattern extends basically along the second direction; The first direction and the second direction intersect at a preset angle, wherein the preset angle is greater than 0° and less than 180°; The surface pattern includes at least one first pattern and at least one second pattern; The thickness of the adhesive film body is 0.3-2.0 mm, the length of the first pattern is 1-5 mm and the width is 0.05-3 mm, and the length of the second pattern is 1-5 mm and the width is 0.05-3 mm.

2. The encapsulating film according to claim 1, characterized in that: If the preset angle is greater than 0° and less than or equal to 90°, then the aspect ratio of the first pattern is (1.5-100):1, and the aspect ratio of the second pattern is (1.5-100):

1. If the preset angle is greater than 90° and less than 180°, then the aspect ratio of the first pattern is (1.5-10):1, and the aspect ratio of the second pattern is (1.5-10):

1.

3. The encapsulating film according to claim 1, characterized in that: The first pattern and the second pattern are in contact with each other.

4. The encapsulating film according to claim 3, characterized in that: One end of the first pattern is in contact with one end of the second pattern, one end of the first pattern is in contact with the midpoint of the second pattern, or the midpoint of the first pattern is in contact with the midpoint of the second pattern.

5. The encapsulating film according to claim 4, characterized in that: The first pattern and the second pattern are distributed in a "┌" shape, a "┬" shape, or a "┼" shape.

6. The encapsulating film according to claim 3, characterized in that: The surface pattern includes at least two identical or different pattern units, and adjacent pattern units are connected to each other to form a cross network structure.

7. The encapsulating film according to claim 1, characterized in that: The first pattern and the second pattern are separate from each other.

8. The encapsulating film according to claim 1, characterized in that: The first pattern and the second pattern are raised.

9. The encapsulating film according to claim 8, characterized in that: At least one of the first pattern or the second pattern is an arc-shaped protrusion, and the maximum height of the arc-shaped protrusion is 0.05-1.5mm.

10. The encapsulating film according to claim 1, characterized in that: At least one of the first pattern or the second pattern is a platform-shaped protrusion, and the height of the platform-shaped protrusion is 0.05-1.5mm.

11. The encapsulating film according to claim 1, characterized in that: The encapsulating film includes a first pattern group, which includes a plurality of first patterns connected end to end along the first direction; each of the first patterns is an arc-shaped protrusion; along the first direction, the first pattern has a first connecting end, a highest point of the protrusion and a second connecting end connected in sequence, the height of the highest point of the protrusion is higher than the height of the first connecting end and the height of the highest point of the protrusion is higher than the height of the second connecting end.

12. The encapsulating film according to claim 11, characterized in that: There are multiple first pattern groups, and the multiple first pattern groups are arranged at intervals along the second direction, with adjacent first pattern groups being staggered.

13. The encapsulating film according to claim 12, characterized in that: The encapsulating film also includes a second pattern group, which passes through each of the first pattern groups in sequence to form a mesh structure.

14. The encapsulating film according to claim 13, characterized in that: The second pattern group consists of multiple groups, and the two connecting ends of the second pattern of each second pattern group respectively contact the middle of the first pattern of two first pattern groups, and are inserted at the connection of two adjacent first patterns of at least one first pattern group.

15. The encapsulating film according to claim 1, characterized in that: The encapsulating film further includes a plurality of first pattern groups, each first pattern group including a plurality of first patterns arranged at intervals along the first direction, and the plurality of first patterns arranged at intervals along the second direction. The encapsulating film further includes a plurality of second pattern groups, each of which includes a plurality of second patterns arranged along the second direction, and the plurality of second patterns are arranged at intervals along the first direction. Each of the second pattern groups is arranged between two adjacent first pattern groups.

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