Wafer electroplating machine

Abstract

The application belongs to the technical field of wafer electroplating, and discloses a wafer electroplating machine, which comprises a hydraulic cylinder and further comprises a support mounted on the movable end of the hydraulic cylinder. The isolation assembly and the wafer are matched to make the bottom of the floating cylinder touch the liquid surface in the electrolytic cell. Since the floating cylinder is hollow, the floating cylinder will float on the liquid surface to stabilize the turbulent liquid surface. The bearing cylinder continues to descend, and the floating cylinder rotates according to the track of the guide groove. After the slot on the floating cylinder rotates to the bottom of the isolation cylinder, the floating cylinder will gradually support the sealing rod according to the track of the guide groove, so that the connecting part at the top of the corrugated pipe is no longer sealed. The overall weight is pressed on the corrugated pipe, the air in the corrugated pipe is extruded and discharged, so that the overall body is lowered. The vibration caused by mechanical friction is reduced, and the vibration is prevented from causing the liquid surface to fluctuate and interfering with the electroplating effect.

Description

Technical Field

[0001] This invention belongs to the field of wafer electroplating technology, specifically a wafer electroplating machine. Background Technology

[0002] A wafer is the fundamental material in semiconductor manufacturing. It is typically made from high-purity single-crystal silicon or other semiconductor materials through cutting and polishing, and is shaped into a circular, thin sheet. Its surface is used to fabricate integrated circuits through processes such as photolithography, etching, and deposition. Electroplating is a key process in wafer manufacturing, primarily aimed at forming metal interconnect layers. These layers connect transistors, resistors, and other components, creating circuit pathways. Electroplating also improves conductivity, enhances reliability, and fills in microstructures.

[0003] During electroplating, the fluid state of the electrolyte directly affects the quality of the plating layer. For example, if the electroplating reaction produces hydrogen gas and the rising bubbles cause turbulence, excessive turbulence on the liquid surface can lead to some parts of the wafer prematurely contacting the electrolyte, resulting in inconsistent plating thickness. This directly affects the quality of subsequent work. In current technology, wafers are usually placed directly into the electrolytic cell using electroplating hooks. If the turbulence on the liquid surface is too great, the quality of the plating layer will drop sharply. Since the quality of the plating layer cannot be directly judged by the human eye, defective wafers remain on the production line for a longer period of time, further reducing the efficiency of the electroplating process. Summary of the Invention

[0004] To address the problems mentioned in the background art, the present invention provides a wafer electroplating machine that solves the problem that excessive liquid surface surging can cause some parts of the wafer to pre-contact the electrolyte, resulting in inconsistent electroplating layer thickness.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a wafer electroplating machine, including a hydraulic cylinder, and further comprising;

[0006] A bracket installed on the movable end of a hydraulic cylinder;

[0007] Guide components and isolation components are located at the bottom of the bracket;

[0008] The isolation assembly includes a support cylinder, inside which a bellows is fixedly installed. The bottom of the support penetrates the support cylinder and the top of the bellows and is fixedly connected to the inside of the bellows. Several sealing rods are circumferentially and angularly movable inside the bellows. The sealing rods are elastically connected to the bellows by springs. A hydraulic rod supports the inside of the bellows. A float cylinder is movably installed inside the support cylinder through a guide groove. The inside of the float cylinder is hollow.

[0009] A bearing plate fitted around the outer periphery of the bearing cylinder;

[0010] Several isolation cylinders that penetrate the bearing plate at equal angles around the circumference;

[0011] A flow diversion component is arranged circumferentially and at equal angles inside the isolation cylinder;

[0012] Several wafers placed on the shunt assembly;

[0013] The guiding component is used to drive the shunt component to drop each wafer one by one;

[0014] A clamping assembly installed at the lower end of the isolation cylinder, the clamping assembly being used to place the wafer.

[0015] Preferably, the guide groove is composed of a threaded groove and a vertical groove, the float is movably engaged inside the bearing cylinder, the spring-supported sealing rod seals the top and bottom of the bellows respectively, and the telescopic end of the hydraulic rod is tightly attached to the top of the bellows.

[0016] Preferably, the guiding assembly includes a motor and a receiving plate fixed to the bottom of the bracket. The output shaft of the motor is equipped with several push plates at equal angles in the circumferential direction. The top of the receiving plate is equipped with several sets of guide grooves at equal angles in the circumferential direction. Each set of guide grooves has two guide blocks, and a guide block is slidably installed inside each guide block. The bottom of the guide block is elastically connected to the receiving plate through a spring plate. The top of the bearing cylinder is movably engaged with several separation rings at equal angles in the circumferential direction. The separation rings are located on the trajectory of the guide grooves.

[0017] Preferably, the receiving plate is provided with a slot for the sealing rod to enter, the guide groove consists of an inclined groove and a horizontal groove, and the guide block slides inside the guide groove via two metal shafts.

[0018] Preferably, the diversion assembly includes a separator one and a separator two slidably installed inside the isolation cylinder. The separator one is elastically connected to the separator two via a tension spring. The bottom of the separation ring is chamfered and inserted between the separator one and the separator two.

[0019] Preferably, both separator one and separator two are composed of a vertical plate and several horizontal plates distributed at equal intervals. The horizontal plates in separator two are movably inserted through the vertical plate in separator one, and the horizontal plates are staggered. Wafers are placed on the horizontal plates in separator one. The inner side of the horizontal plates in separator two is arc-shaped and fits the inner wall of the isolation cylinder.

[0020] Preferably, the clamping assembly includes a positioning ring elastically connected to the outer periphery of the isolation cylinder by a plurality of spring plates distributed circumferentially at equal angles. The outer periphery of the positioning ring is hinged with a locking rod by a plurality of guide rods distributed circumferentially at equal angles. The locking rod is inserted into the interior of the isolation cylinder and fits with the edge of the wafer.

[0021] Preferably, the isolation assembly further includes wedges installed on the floating cylinder. The wedges are in several groups, and several wedges forming a complete circle are in one group. The diameter of the circle is adapted to the wafer. The floating cylinder has several slots at equal angles around it that are adapted to the isolation cylinder.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0023] This invention, through the coordination of isolation components and wafer structures, allows the float to drift on the surface of the liquid in the electrolytic cell when its bottom touches the liquid surface due to its hollow interior. This stabilizes the turbulence of the liquid. The supporting cylinder continues to descend, and the float rotates along the trajectory of the guide groove. After the groove on the float rotates to the bottom of the isolation cylinder, the float gradually pushes against the sealing rod along the trajectory of the guide groove, causing the connection between the float and the top of the bellows to become unsealed. The overall weight of the device presses down on the bellows, squeezing out the air inside the bellows, thus causing the entire device to descend. This descent by expelling gas reduces vibrations caused by mechanical friction, thereby preventing vibrations from causing fluctuations in the liquid surface and interfering with the electroplating effect.

[0024] This invention, through the coordinated arrangement of guiding components and diversion components, allows the separation ring to rise. As the spring pulls between separator one and separator two, the chamfered portion of the separation ring gradually brings separator one and separator two closer together. At this time, the transverse plate of separator one moves outward, while the transverse plate of separator two moves closer to the axis of the isolation cylinder. When the separation ring completely leaves the diversion component, the wafer falls from separator one onto separator two. When the separation ring is reinstalled between separator one and separator two, both return to their initial state, and separator two extends outward, causing the wafer on it to fall to the top of the clamping component. This reduces the workflow and time required for the robotic arm to grasp the wafer, significantly improving the device's efficiency. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the external structure of the present invention;

[0026] Figure 2 This is a schematic diagram of the external structure of the carrier disk of the present invention;

[0027] Figure 3 This is a schematic diagram of the internal structure of the isolation component of the present invention.

[0028] Figure 4 For the present invention Figure 3 Enlarged view of point A in the middle;

[0029] Figure 5 This is a schematic diagram of the internal structure of the bearing cylinder and the corrugated pipe of the present invention;

[0030] Figure 6This is a cross-sectional diagram of the internal structure of the guiding component and the isolation component;

[0031] Figure 7 This is a schematic cross-sectional view of the internal structure of the isolation cylinder of the present invention;

[0032] Figure 8 This is an exploded view of the disassembled structure of the isolation cylinder and the diversion component of the present invention;

[0033] Figure 9 This is a schematic diagram of the structure and cooperation between the isolation cylinder and the clamping assembly of the present invention.

[0034] In the diagram: 1. Hydraulic cylinder; 2. Bracket; 3. Guide assembly; 31. Motor; 32. Push plate; 33. Receiving plate; 34. Guide groove; 35. Guide block; 36. Separating ring; 37. Spring plate one; 4. Diverting assembly; 41. Separator one; 42. Separator two; 43. Tension spring; 5. Isolation cylinder; 6. Clamping assembly; 61. Positioning ring; 62. Guide rod; 63. Locking rod; 64. Spring plate two; 7. Wafer; 8. Isolation assembly; 81. Bearing cylinder; 82. Floating cylinder; 83. Wedge; 84. Guide groove; 85. Bellows; 86. Hydraulic rod; 87. Sealing rod; 88. Spring; 9. Bearing plate. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] like Figures 1 to 9 As shown, the present invention provides a wafer electroplating machine, including a hydraulic cylinder 1, and further comprising;

[0037] The bracket 2 is installed at the movable end of the hydraulic cylinder 1;

[0038] The guide component 3 and the isolation component 8 are located at the bottom of the bracket 2;

[0039] The isolation assembly 8 includes a support cylinder 81, inside which a bellows 85 is fixedly installed. The bottom of the bracket 2 passes through the support cylinder 81 and the top of the bellows 85 and is fixedly connected to the inside of the bellows 85. Several sealing rods 87 are circumferentially and equiangularly movable inside the bellows 85. The sealing rods 87 are elastically connected to the bellows 85 by springs 88. A hydraulic rod 86 is supported inside the bellows 85. A float cylinder 82 is movably installed inside the support cylinder 81 through a guide groove 84. The inside of the float cylinder 82 is hollow.

[0040] The bearing plate 9 is sleeved on the outer periphery of the bearing cylinder 81;

[0041] Several isolation cylinders 5 are circumferentially and equally angled through the bearing plate 9;

[0042] A diversion component 4 is arranged circumferentially and at equal angles inside the isolation cylinder 5;

[0043] Several wafers 7 are placed on the shunt assembly 4;

[0044] The guide component 3 is used to drive the shunt component 4 to drop each wafer 7 one by one;

[0045] The clamping assembly 6 is installed at the lower end of the isolation cylinder 5 and is used to place the wafer 7.

[0046] The guide groove 84 consists of a threaded groove and a vertical groove. The float cylinder 82 is movably engaged inside the bearing cylinder 81. The spring 88 supports the sealing rod 87 to seal the top and bottom of the bellows 85 respectively. The telescopic end of the hydraulic rod 86 is tightly attached to the top of the bellows 85.

[0047] The isolation assembly 8 also includes wedges 83 mounted on the float cylinder 82. There are several groups of wedges 83, and several wedges 83 forming a complete circle are grouped together. The diameter of the circle is adapted to the wafer 7. Several slots adapted to the isolation cylinder 5 are opened at equal angles around the float cylinder 82.

[0048] Using the above scheme: control the hydraulic rod 86 to retract, and make the hydraulic cylinder 1 control the isolation component 8 to descend through the bracket 2. When the bottom of the float 82 touches the liquid surface in the electrolytic cell, because it is fully enclosed and hollow inside, the float 82 will float on the liquid surface to stabilize the turbulence of the liquid surface.

[0049] As the support cylinder 81 continues to descend, the float cylinder 82 is pressed into the interior of the support cylinder 81 and rotates preferentially according to the trajectory of the guide groove 84. However, at this time, the amplitude of the liquid surface churning has already decreased. After the groove on the float cylinder 82 rotates to the bottom of the isolation cylinder 5, the float cylinder 82 will contact the vertical groove according to the trajectory of the guide groove 84 and stop rotating. Instead, it gradually pushes against the sealing rod 87, so that the connection between it and the top of the bellows 85 is no longer sealed. The weight of the entire device presses on the bellows 85, and the air inside the bellows 85 is squeezed out, thereby causing the whole device to descend. Descending by venting gas will reduce the vibration caused by mechanical friction, thereby preventing the vibration from causing the liquid surface to fluctuate and interfering with the electroplating effect.

[0050] As the device continues to descend, the clamping component 6 pulls the wafer 7 into the electrolyte, at which point the liquid level will not fluctuate too much.

[0051] After electroplating is completed, the hydraulic cylinder 1 is controlled to rise and detach from the liquid surface, and the hydraulic rod 86 is controlled to push the bellows 85 back to the initial position for subsequent repeating work.

[0052] like Figures 1-9 As shown, the guide assembly 3 includes a motor 31 and a receiving plate 33 fixed to the bottom of the bracket 2. The output shaft of the motor 31 is equipped with several push plates 32 at equal angles in the circumferential direction. The top of the receiving plate 33 is equipped with several sets of guide grooves 34 at equal angles in the circumferential direction. Each set of guide grooves 34 has two guide blocks 35 that are slidably installed inside. The bottom of the guide block 35 is elastically connected to the receiving plate 33 through a spring plate 37. The top of the bearing cylinder 81 is movably engaged with several separation rings 36 at equal angles in the circumferential direction. The separation rings 36 are located on the track of the guide grooves 34.

[0053] The receiving plate 33 is provided with a slot for the sealing rod 87 to enter. The guide groove 34 consists of an inclined groove and a horizontal groove. The guide block 35 slides inside the guide groove 34 via two metal shafts.

[0054] Using the above scheme: After the electroplating work is completed, the support 2 and the device are raised by the hydraulic cylinder 1. The device is removed from the liquid surface, the motor 31 is started, and its output shaft drives the push plate 32 to rotate and push the guide block 35 to move. The guide block 35 gradually pushes the separation ring 36 to rise through the trajectory of the guide groove 34. The separation ring 36 is no longer inserted in the diversion assembly 4. The diversion assembly 4 then lowers several wafers 7 at the same time, so that the next wafer 7 can continue to be electroplated. This reduces the time for the robot to grab the wafer 7 and increases the working efficiency of the device.

[0055] When the push plate 32 disengages from the guide block 35, the spring plate 37 pulls the guide block 35 back to its initial position so that the guide block 35 can be pushed again in the future.

[0056] like Figures 1-9 As shown, the diversion assembly 4 includes a first separator 41 and a second separator 42 that are slidably installed inside the isolation cylinder 5. The first separator 41 is elastically connected to the second separator 42 via a tension spring 43 (the two ends of the tension spring are fixed to the vertical plates of the first separator 41 and the second separator 42 respectively). The bottom of the separation ring 36 is chamfered and inserted between the first separator 41 and the second separator 42.

[0057] Both separator 1 (41) and separator 2 (42) consist of a vertical plate and several horizontal plates that are evenly distributed. The horizontal plates in separator 2 (42) are movably inserted through the vertical plate in separator 1 (41). The horizontal plates are staggered. The wafer 7 is placed on the horizontal plates in separator 1 (41). The inner side of the horizontal plates in separator 2 (42) is arc-shaped and fits the inner wall of the isolation cylinder 5.

[0058] Using the above scheme: After the separation ring 36 rises, due to the tension spring 43 pulling between separator 1 41 and separator 2 42, the chamfered part of the separation ring 36 causes separator 1 41 and separator 2 42 to gradually approach each other. At this time, the transverse plate of separator 1 41 moves outward, while the transverse plate of separator 2 42 moves towards the axis of the isolation cylinder 5. When the separation ring 36 completely leaves the shunt assembly 4, each wafer 7 falls from separator 1 41 onto separator 2 42.

[0059] When the separation ring 36 is repositioned between separator 1 41 and separator 2 42, both return to their initial state. Separator 2 42 extends outward, and the bottommost wafer 7 falls onto the top of the clamping assembly 6, thereby reducing the workflow and time required for the robotic arm to grasp the wafer 7 and greatly improving the efficiency of the device. During this process, the remaining wafers fall sequentially down onto the horizontal plate of separator 1 41.

[0060] like Figures 1-9 As shown, the clamping assembly 6 includes a positioning ring 61 elastically connected to the outer periphery of the isolation cylinder 5 by a plurality of spring plates 64 distributed circumferentially at equal angles. The outer periphery of the positioning ring 61 is hinged with a locking rod 63 by a plurality of guide rods 62 distributed circumferentially at equal angles. The locking rod 63 is inserted into the interior of the isolation cylinder 5 and fits with the edge of the wafer 7.

[0061] Using the above method: After the wafer 7 is electroplated, the operator presses the positioning ring 61, which pushes the locking rod 63 outward through the guide rod 62, so as not to contact the wafer 7. At this time, the wafer 7 is in a relaxed state. After being caught from the bottom, it is manually placed on each set of wedges 83 at the top of the floating cylinder 82 to achieve the purpose of pre-draining water. The electroplated layer on it will also solidify as quickly as possible to prevent scratches caused by subsequent contact.

[0062] Working principle and usage process of this invention:

[0063] The hydraulic rod 86 is controlled to retract, and the hydraulic cylinder 1 controls the isolation assembly 8 to descend through the bracket 2. When the bottom of the float 82 touches the liquid surface in the electrolytic cell, the float 82 will float on the liquid surface to stabilize the turbulence of the liquid surface because its interior is hollow.

[0064] As the support cylinder 81 continues to descend, the float cylinder 82 rotates preferentially according to the trajectory of the guide groove 84. However, at this time, the amplitude of the liquid surface churning has already decreased. After the groove on the float cylinder 82 rotates to the bottom of the isolation cylinder 5, the float cylinder 82 will stop rotating according to the trajectory of the guide groove 84. Instead, it will gradually push against the sealing rod 87, so that the connection between it and the top of the bellows 85 is no longer sealed. The weight of the entire device presses on the bellows 85, and the air inside the bellows 85 is squeezed out, thereby causing the whole device to descend.

[0065] As the device continues to descend, the clamping assembly 6 pulls the wafer 7 into the electrolyte. After electroplating is completed, the device is raised and removed from the liquid surface by the hydraulic cylinder 1, and the hydraulic rod 86 is controlled to push the bellows 85 back to the initial position for subsequent repeating.

[0066] The motor 31 drives the pusher plate 32 to rotate and push the guide block 35 to move. The guide block 35 gradually pushes the separation ring 36 to rise through the trajectory of the guide groove 34.

[0067] Because the separator 41 and the separator 42 are pulled by the tension spring 43, the chamfered part of the separation ring 36 causes the separator 41 and the separator 42 to gradually approach each other. At this time, the transverse plate of the separator 41 moves outward, while the transverse plate of the separator 42 moves towards the axis of the isolation cylinder 5. When the separation ring 36 completely leaves the shunt assembly 4, the wafer 7 falls from the separator 41 onto the separator 42.

[0068] When the separation ring 36 is re-inserted between the first separator 41 and the second separator 42, both return to their initial state, the second separator 42 extends outward, and the wafer 7 on it falls to the top of the clamping assembly 6.

[0069] After the wafer 7 has been electroplated, press the positioning ring 61 so that it pushes the locking rod 63 outward through the guide rod 62 so as not to contact the wafer 7. At this time, the wafer 7 is in a relaxed state and needs to be manually placed on each set of wedges 83 at the top of the floating cylinder 82.

[0070] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0071] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer electroplating machine, comprising a hydraulic cylinder (1), characterized in that, Also includes: A bracket (2) is installed on the movable end of the hydraulic cylinder (1); The guide assembly (3) and the isolation assembly (8) are located at the bottom of the bracket (2); The isolation assembly (8) includes a support cylinder (81), a bellows (85) is fixedly installed inside the support cylinder (81), the bottom of the bracket (2) passes through the support cylinder (81) and the top of the bellows (85) and is fixedly connected to the inside of the bellows (85), a number of sealing rods (87) are circumferentially and equiangularly movable inside the bellows (85), the sealing rods (87) are elastically connected to the bellows (85) by springs (88), a hydraulic rod (86) is supported inside the bellows (85), and a float cylinder (82) is movably installed inside the support cylinder (81) through a guide groove (84), the inside of the float cylinder (82) is hollow; A bearing plate (9) is fitted around the outer periphery of the bearing cylinder (81); Several isolation cylinders (5) are circumferentially and equally angled through the bearing plate (9); Diversion components (4) are arranged at equal angles around the circumference inside the isolation cylinder (5); Several wafers (7) are placed on the shunt assembly (4); The guiding component (3) is used to drive the shunt component (4) to drop each wafer (7) one by one; A clamping assembly (6) is installed at the lower end of the isolation cylinder (5). The clamping assembly (6) is used to place the wafer (7). The clamping assembly (6) includes a positioning ring (61) elastically connected to the outer periphery of the isolation cylinder (5) by a plurality of spring plates (64) distributed circumferentially at equal angles. A locking rod (63) is hinged to the outer periphery of the positioning ring (61) by a plurality of guide rods (62) distributed circumferentially at equal angles. The locking rod (63) is inserted into the interior of the isolation cylinder (5) and fits with the edge of the wafer (7).

2. The wafer electroplating machine according to claim 1, characterized in that: The guide groove (84) is composed of a threaded groove and a vertical groove. The float cylinder (82) is movably engaged inside the bearing cylinder (81). The spring (88) supports the sealing rod (87) to seal the top and bottom of the bellows (85) respectively. The telescopic end of the hydraulic rod (86) is tightly attached to the top of the bellows (85).

3. The wafer electroplating machine according to claim 1, characterized in that: The guiding component (3) includes a motor (31) and a receiving plate (33) fixed to the bottom of the bracket (2). The output shaft of the motor (31) is equipped with several push plates (32) at equal angles in the circumferential direction. The top of the receiving plate (33) is equipped with several sets of guide grooves (34) at equal angles in the circumferential direction. Each set of guide grooves (34) has two guide blocks (35) and guide blocks (35) are slidably installed inside. The bottom of the guide blocks (35) is elastically connected to the receiving plate (33) through a spring sheet (37). The top of the bearing cylinder (81) is movably engaged with several separation rings (36) at equal angles in the circumferential direction. The separation rings (36) are located on the trajectory of the guide grooves (34).

4. The wafer electroplating machine according to claim 3, characterized in that: The receiving plate (33) is provided with a slot for the sealing rod (87) to enter. The guide groove (34) consists of an inclined groove and a horizontal groove. The guide block (35) slides inside the guide groove (34) via two metal shafts.

5. The wafer electroplating machine according to claim 4, characterized in that: The diversion assembly (4) includes a first separator (41) and a second separator (42) which are slidably installed inside the isolation cylinder (5). The first separator (41) is elastically connected to the second separator (42) by a tension spring (43). The bottom of the separation ring (36) is chamfered and inserted between the first separator (41) and the second separator (42).

6. The wafer electroplating machine according to claim 5, characterized in that: Both separator one (41) and separator two (42) are composed of a vertical plate and several horizontal plates that are evenly distributed. The horizontal plates in separator two (42) are movably inserted through the vertical plate in separator one (41). The horizontal plates are staggered. A wafer (7) is placed on the horizontal plates in separator one (41). The inner side of the horizontal plates in separator two (42) is arc-shaped and fits the inner wall of the isolation cylinder (5).

7. The wafer electroplating machine according to claim 1, characterized in that: The isolation component (8) also includes wedges (83) installed on the floating cylinder (82). The wedges (83) are in several groups and several wedges (83) forming a complete circle are in a group. The diameter of the circle is adapted to the wafer (7). The floating cylinder (82) has several slots that are adapted to the isolation cylinder (5) at equal angles in the circumference.

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