Power grid detection device and detection method thereof
By using a split aluminum alloy housing and a multi-sensor combination, the power grid detection device solves the problems of insufficient accuracy and real-time performance in existing technologies, and achieves highly reliable power grid condition monitoring and fault diagnosis.
Patent Information
- Application Number
- CN202511089149.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-05
- Publication Date
- 2025-11-18
AI Technical Summary
Existing power grid detection technologies are insufficient in terms of accuracy and real-time performance, and are susceptible to interference, making it difficult to meet the high reliability requirements of modern power grids.
It adopts a split aluminum alloy shell design and integrates a current sensor, voltage sensor, temperature sensor and three-dimensional MEMS vibration sensor. Combined with a data processing module and a communication module, it performs comprehensive diagnosis through parallel FFT algorithm and three-dimensional temperature field model to enhance anti-interference capability and real-time performance.
It improves the accuracy and real-time performance of power grid detection, enhances the device's anti-interference capability, reduces detection costs, and provides accurate fault information to support rapid repair.
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Figure CN120971885A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to power system detection, and in particular to a power grid detection device and a detection method thereof. BACKGROUND
[0002] At present, with the rapid development of smart grid, the complexity and scale of power grid are expanding, and higher requirements are put forward for real-time monitoring and fault diagnosis of power grid operation state. At present, the power grid detection technology has gradually developed from traditional manual inspection to automation and intelligence, and various sensors, data acquisition equipment and analysis algorithms are widely used in power grid monitoring. However, the existing technology still has deficiencies in high-precision detection, real-time performance and anti-interference ability, which is difficult to meet the high reliability requirements of modern power grid. In addition, the diversity and wide distribution of power grid equipment also increase the difficulty and cost of detection.
[0003] For the related technologies in the above, the existing power grid detection technology mainly includes the following means: one is the detection method based on infrared thermal imaging, which judges the operation state by capturing the thermal radiation signal of the equipment, but it is easily affected by the environment temperature; two is the method based on ultrasonic detection, which identifies faults by analyzing the sound signal inside the equipment, but it has high requirements for the internal structure of the equipment; three is the detection method based on current and voltage signals, which judges faults by analyzing the electrical parameters of the power grid, but it has weak anti-interference ability. These methods have their own advantages and disadvantages, and it is difficult to fully cover the needs of power grid detection.
[0004] The main defect of the prior art is that the precision and real-time performance of power grid detection are not good, and the detection system is easy to be disturbed. Therefore, there is an urgent need for a power grid detection device and a detection method thereof. SUMMARY
[0005] The purpose of the present application is to provide a power grid detection device and a detection method thereof to solve the above-mentioned problems.
[0006] In a first aspect, the power grid detection device provided by the present application adopts the following technical scheme: a split type aluminum alloy shell is provided, the shell includes an upper cover plate, a lower base and an intermediate sealing layer, the upper cover plate is provided with staggered trapezoidal fin arrays, a flow guide groove is formed at the root of the fin, an inside integrated communication module mounting groove with buckle positioning structure is arranged, a anti-dropping spring plate is arranged in the groove, the lower base is divided into a sensor cabin and a processor cabin, the two cabins are separated by a shielding partition plate with a honeycomb wave absorbing layer, the sensor cabin is provided with a current sensor, a voltage sensor, a temperature sensor and a three-dimensional MEMS vibration sensor, the processor cabin is provided with a data processing module and a storage unit, the communication module includes a dual-band antenna and a radio frequency chip, the antenna is fixed to the outer edge of the upper cover plate through a ceramic base, and a grounding shielding net is arranged below the base.
[0007] Preferably, the current sensor is fixed to the left side wall of the sensor cabin by an epoxy resin encapsulation support with a pre-tightening bolt, and the Hall element is provided with a periphery permalloy magnetic shield cover, which is aligned with the stepped cable through hole opened at the bottom of the lower base, and the inner wall of the through hole is embedded with a wear-resistant ceramic ring.
[0008] Preferably, the voltage sensor adopts a multi-layer stacked voltage dividing circuit board structure, is vertically fixed to the rear wall of the sensor cabin through a vertical column with damping rubber, and the input end is in contact with the external circuit through a gold-plated spring needle, and the tail of the needle is provided with a limiting stop ring.
[0009] Preferably, the temperature sensor is embedded in a copper heat conduction block on the front wall of the sensor cabin, the back of the heat conduction block is processed into a serpentine cooling flow channel, and the front is provided with a conical temperature measuring boss.
[0010] Preferably, the three-dimensional MEMS vibration sensor includes an X / Y / Z axis silicon micro gyroscope and a piezoelectric accelerometer, which is installed on the side of the shielding partition through a threaded fastener with a pre-tightening gasket, and the vibration signal is input into the DSP coprocessor of the microprocessor after being amplified by a programmable gain amplifier and filtered by a 24-order band-pass filter.
[0011] Preferably, the microprocessor mainboard of the data processing module is suspended in the center of the processor cabin through a four-point silica gel damping support, the support includes a universal joint adjusting mechanism, the storage unit adopts a guide rail type SSD module located on the right side of the mainboard, and a self-cleaning contact is arranged at the interface.
[0012] Preferably, the bottom of the lower base is provided with a terminal row with a stress release structure for connecting power grid cables, the upper cover plate and the lower base are connected through anti-loose bolts with torque marks, and the interface of the sensor cabin and the processor cabin is provided with a fluorine rubber sealing ring, and the external power supply cable is connected through a waterproof connector with an O-shaped sealing ring.
[0013] In a second aspect, the power grid detection method provided by the present application adopts the following technical scheme: comprising the following steps: S1: loosen the anti-loose bolts with torque marks of the lower base, and press the power grid cable to the terminal row with a stress release structure after passing through the stepped cable through hole; S2: adjust the pressure of the voltage sensor needle with a torque screwdriver, so that it maintains a contact force of 0.5-1N with the circuit and is locked through the limiting stop ring; S3: use a clamp with pressure feedback to attach the copper heat conduction block to the surface of the device to be measured, and ensure that the conical temperature measuring boss is in full contact; S4: connect the external power supply cable through a waterproof connector with an O-shaped sealing ring, and lock the shell bolts in diagonal order after confirming that the fluorine rubber sealing rings of each cabin are not twisted.
[0014] Preferably, the microprocessor adopts a parallel FFT algorithm to analyze the current harmonic characteristics, combines the voltage sag criterion recorded with a time stamp, and a three-dimensional temperature field model to make comprehensive diagnosis, and sends an alarm signal when an abnormal parameter is detected and judges the fault type and location.
[0015] In summary, the present application includes at least one of the following beneficial technical effects: 1. In the assembly, the upper cover plate, the lower base and the middle sealing layer are prepared first, and they are combined together according to the design requirements, ensuring that the components are connected tightly and sealed well. This split design facilitates subsequent installation, maintenance and replacement of internal components. The aluminum alloy material has good heat dissipation performance and mechanical strength, which can effectively protect the internal components and prevent damage due to external impact or overheating. The device generates heat during operation, and the fin array increases the heat dissipation area of the upper cover plate. The flow guide groove helps to guide air flow, allowing heat to dissipate more quickly, ensuring that the device does not overheat during long-term operation and affecting performance. When installing the communication module, it is inserted into the installation slot and fixed by the buckle positioning structure. The anti-drop spring can prevent the communication module from falling during use, making it easy to install, remove and maintain the communication module. The sensor compartment is used to install various sensors, and the processor compartment is used to install data processing modules and other components. The shielding partition with a honeycomb wave-absorbing layer can effectively absorb electromagnetic interference signals, reducing electromagnetic interference between the sensor compartment and the processor compartment, and improving the anti-interference ability of the device. The current sensor, voltage sensor, temperature sensor and three-dimensional MEMS vibration sensor are installed in the sensor compartment, realizing the monitoring of multiple parameters of the power grid. The data processing module in the processor compartment processes the data collected by the sensors, and the storage unit is used to store the data. The dual-band antenna can support different communication frequency bands, improving the flexibility and reliability of communication. The antenna is fixed to the outer edge of the upper cover plate through the ceramic base, which has good insulation performance and mechanical strength. The grounding shield net below the base can effectively reduce the influence of external electromagnetic interference on the antenna, ensuring the quality of communication. The epoxy resin packaging has good insulation performance and mechanical strength, which can protect the current sensor. The permalloy magnetic shield around the Hall element can effectively shield external magnetic field interference due to its high magnetic permeability and low coercive force, improving the accuracy of current measurement. The power grid cable is inserted through the stepped cable perforation, and the stepped design facilitates the insertion and fixation of the cable. The wear-resistant ceramic ring embedded in the inner wall of the perforation can reduce the friction between the cable and the inner wall of the perforation, prolonging the service life of the cable and the device. The voltage sensor is vertically fixed to the rear wall of the sensor compartment through the column with damping rubber. The multi-layer stacked voltage divider circuit board structure can effectively attenuate high-voltage signals while reducing the size of the device. The column with damping rubber can act as a shock absorber, reducing the influence of external vibration on the voltage sensor. The voltage sensor input end is in contact with the external circuit through a gold-plated spring needle. Gold plating can improve the conductivity and stability of the contact. The spring needle facilitates the connection and removal of the cable, and the limiting collar at the tail of the needle can prevent the needle from being compressed too much, ensuring the stability of the contact force. The temperature sensor is embedded in the copper heat-conducting block on the front wall of the sensor compartment. The copper heat-conducting block has good heat-conducting performance and can quickly transfer the temperature of the equipment to be measured to the temperature sensor. The serpentine cooling channel on the back of the heat-conducting block can reduce the temperature of the heat-conducting block through circulating cooling liquid, preventing the temperature from being too high and affecting the measurement accuracy of the temperature sensor.The conical temperature measuring boss arranged on the front surface of the heat conducting block can increase the contact area with the equipment to be measured, and improve the accuracy of temperature measurement, through the above contents and structures, the anti-interference ability of the detection system is enhanced, and the complex power grid environment is adapted, the heat dissipation capacity is optimized, and the detection cost is reduced. 2. The three-dimensional MEMS vibration sensor comprises an X / Y / Z-axis silicon micro gyroscope and a piezoelectric accelerometer, the silicon micro gyroscope and the piezoelectric accelerometer can measure the angular velocity and acceleration of three axes respectively, so as to comprehensively monitor the vibration condition of the power grid equipment, the vibration signal is adjusted by the programmable gain amplifier according to the intensity of the vibration signal, the 24-order band-pass filter can effectively filter out the noise signal and improve the quality of the vibration signal, then the vibration signal is input into the DSP coprocessor of the microprocessor for fast and accurate processing and analysis, the four-point silica gel damping support can effectively reduce the influence of external vibration on the microprocessor mainboard, the universal joint adjusting mechanism contained in the support facilitates the installation and debugging of the microprocessor mainboard, so that it is in a horizontal state, the self-cleaning contact arranged at the interface can prevent dust and impurities from entering the interface, and ensure the stability of data transmission, when connecting the power grid cable, the cable is pressed to the terminal row after being inserted through the stepped cable perforation, the stress release structure can effectively release the stress of the cable, prevent the cable from being damaged due to excessive stress, the upper cover plate and the lower base are connected by the anti-loose bolt with torque mark, the torque mark can prevent the bolt from loosening, and ensure the sealing and stability of the device, the fluorine rubber sealing ring can ensure the sealing between the cabins, prevent moisture and dust from entering, and affect the performance of the device, the waterproof joint with O-shaped sealing ring can effectively prevent moisture from entering the device, and ensure the normal operation of the device, through the above contents and structures, the precision and real-time performance of the power grid detection are improved; 3. Loosen the torque-identified locknut of the lower base, pass the power grid cable through the stepped cable through-hole, and crimp the cable to the terminal row with a stress release structure according to the specified crimping process. Check whether the cable connection is firm and whether there is a loose or short-circuit phenomenon, ensure the reliable connection of the power grid cable and the device, adjust the voltage sensor needle pressure using a torque screwdriver, and the appropriate contact force can ensure good electrical connection between the voltage sensor and the line while avoiding damage to the needle or the line due to excessive contact force. Lock the contact force stability through the limiting stop ring, and use a special clamp with pressure feedback to attach the copper heat-conducting block to the surface of the device under test. The special clamp with pressure feedback can monitor the pressure of the clamp on the copper heat-conducting block in real time, ensuring good thermal contact between the copper heat-conducting block and the device under test and improving the accuracy of temperature measurement. Ensure that the conical temperature measurement boss is in complete contact with the device under test to accurately measure the temperature. Connect the external power cable through a waterproof joint with an O-ring, and check whether the joint connection is tight and whether there is a water leakage phenomenon. After confirming that the fluororubber sealing ring in each cabin is not twisted, lock the shell bolts in diagonal order to make the shell force evenly distributed and ensure the sealing and stability of the shell. After the device is running normally, real-time acquisition of the current, voltage, temperature, and vibration parameters of the power grid is performed, the microprocessor uses a parallel FFT algorithm to analyze the current harmonic characteristics, which can accurately detect the harmonic components in the current, combined with voltage sag criteria with timestamp recording, which can determine whether voltage sag and other abnormal conditions occur, and a three-dimensional temperature field model can analyze the temperature distribution of the power grid equipment. Through the comprehensive analysis of these information, the running state of the power grid is comprehensively diagnosed, and when abnormal parameters are detected, the device sends an alarm signal in time to remind relevant personnel to pay attention, and according to the preset fault diagnosis rules, the fault type and location are determined to provide accurate fault information for maintenance personnel to quickly repair and handle, ensuring the safe and stable operation of the power grid. According to the above method, the cost is further reduced, and through detection and real-time criterion analysis, accurate fault information can be provided for workers to quickly repair and handle, ensuring the safe and stable operation of the power grid. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 is a workflow schematic diagram of the present application; Figure 2 is an installation process schematic diagram of the present application. DETAILED DESCRIPTION
[0017] The following will be described in detail in combination with the accompanying Figure 1 - the accompanying Figure 2 , the present application will be further described in detail.
[0018] Example 1: A power grid detection device, referring to Figures 1-2, including split type aluminum alloy shell, the shell includes upper cover plate, lower base and intermediate sealing layer, the upper cover plate is provided with staggered array of trapezoidal heat dissipation fins, the fin root is provided with flow guide groove, the inner side is integrated with buckle positioning structure communication module installation slot, the slot is arranged with anti-drop spring, the lower base is divided into sensor cabin and processor cabin, the two cabins are separated by shielding partition plate with honeycomb wave absorbing layer, the sensor cabin is provided with current sensor, voltage sensor, temperature sensor and three-dimensional MEMS vibration sensor, the processor cabin is provided with data processing module and storage unit, the communication module contains double frequency band antenna and radio frequency chip, the antenna is fixed on the outer edge of the upper cover plate through the ceramic base, and the grounding shielding net is arranged below the base.
[0019] Specifically, in assembly, the upper cover plate, the lower base and the intermediate sealing layer are prepared, and they are combined together according to the design requirements, to ensure that the components are connected tightly and sealed well, and the split type design facilitates subsequent installation, maintenance and replacement of internal components of the device, the aluminum alloy material has good heat dissipation performance and mechanical strength, which can effectively protect the internal components and prevent damage due to external collision or overheating, heat is generated during device operation, the heat dissipation fin array increases the heat dissipation area of the upper cover plate, the flow guide groove helps to guide air flow, so that heat can be dissipated more quickly, to ensure that the device will not be affected in performance due to overheating during long time operation, when installing the communication module, it is clamped into the installation slot and fixed through the buckle positioning structure, the anti-drop spring can prevent the communication module from falling off during use, facilitating installation, disassembly and maintenance of the communication module, the sensor cabin is used to install various sensors, and the processor cabin is used to install data processing modules and other components, the shielding partition plate with honeycomb wave absorbing layer can effectively absorb electromagnetic interference signals, reduce electromagnetic interference between the sensor cabin and the processor cabin, and improve the anti-interference ability of the device, the current sensor, the voltage sensor, the temperature sensor and the three-dimensional MEMS vibration sensor are installed in the sensor cabin respectively, to realize monitoring of multiple parameters of the power grid, the data processing module in the processor cabin processes the data collected by the sensor, the storage unit is used to store data, the double frequency band antenna can support different communication frequency bands, to improve the flexibility and reliability of communication, the antenna is fixed on the outer edge of the upper cover plate through the ceramic base, the ceramic base has good insulation performance and mechanical strength, and the grounding shielding net below the base can effectively reduce the influence of external electromagnetic interference on the antenna, to ensure communication quality.
[0020] The current sensor is fixed to the left side wall of the sensor cabin through an epoxy resin packaging support with a pre-tightening bolt, a permalloy magnetic shielding cover is arranged around the Hall element, and a stepped cable through hole is formed in the bottom of the lower base, and a wear-resistant ceramic ring is embedded in the inner wall of the through hole.
[0021] Specifically, the epoxy resin package has good insulation performance and mechanical strength, can protect the current sensor, the permalloy magnetic shield cover arranged outside the Hall element, since the permalloy has high magnetic permeability and low coercive force, can effectively shield external magnetic field interference, improve the accuracy of current measurement, the power cable is passed through the stepped cable perforation, the stepped design facilitates the penetration and fixation of the cable, and the wear-resistant ceramic ring embedded in the inner wall of the perforation can reduce the friction between the cable and the inner wall of the perforation, prolong the service life of the cable and the device.
[0022] The voltage sensor adopts a multilayer stacked voltage dividing circuit board structure, is vertically fixed on the rear wall of the sensor cabin through a vertical column with damping rubber, and an input end is in contact with an external circuit through a gold-plated spring contact pin.
[0023] Specifically, the voltage sensor is vertically fixed on the rear wall of the sensor cabin through a vertical column with damping rubber, and a multilayer stacked voltage dividing circuit board structure can effectively attenuate high-voltage signals while reducing the volume of the device. The vertical column with damping rubber can play a damping role, reducing the influence of external vibration on the voltage sensor. The input end of the voltage sensor is in contact with the external circuit through a gold-plated spring contact pin. The gold plating process can improve the conductivity and stability of the contact. The spring contact pin facilitates the connection and disconnection of the cable. The limiting stop ring at the tail of the contact pin can prevent the contact pin from being compressed too much, ensuring the stability of the contact force.
[0024] The temperature sensor is embedded in a copper heat-conducting block on the front wall of the sensor cabin, the back surface of the heat-conducting block is processed into a serpentine cooling flow channel, and the front surface is provided with a conical temperature measurement boss.
[0025] Specifically, the temperature sensor is embedded in a copper heat-conducting block on the front wall of the sensor cabin. The copper heat-conducting block has good heat-conducting performance and can quickly transfer the temperature of the device to be measured to the temperature sensor. The serpentine cooling flow channel processed on the back surface of the heat-conducting block can reduce the temperature of the heat-conducting block through circulating cooling liquid, preventing the temperature from being too high to affect the measurement accuracy of the temperature sensor. The conical temperature measurement boss provided on the front surface of the heat-conducting block can increase the contact area with the device to be measured, improving the accuracy of temperature measurement.
[0026] The three-dimensional MEMS vibration sensor includes an X / Y / Z-axis silicon micro gyroscope and a piezoelectric accelerometer, which are installed on the side of the shielding partition plate through a threaded fastener with a pre-tightening gasket. The vibration signal is input into the DSP coprocessor of the microprocessor after being amplified by a programmable gain amplifier and filtered by a 24th order band-pass filter.
[0027] Specifically, the three-dimensional MEMS vibration sensor includes X / Y / Z axis silicon micro-gyroscopes and piezoelectric accelerometers, which can measure the angular velocity and acceleration of three axes respectively, thereby comprehensively monitoring the vibration of power grid equipment, the vibration signal is adjusted by a programmable gain amplifier according to the intensity of the vibration signal, a 24-order band-pass filter can effectively filter out noise signals and improve the quality of the vibration signal, and then input the DSP coprocessor of the microprocessor for fast and accurate processing and analysis.
[0028] The microprocessor mainboard of the data processing module is suspended in the center of the processor cabin through a four-point silica gel damping support, the support includes a universal joint adjusting mechanism, the storage unit adopts a guide rail type SSD module located on the right side of the mainboard, and self-cleaning contacts are arranged at the interface.
[0029] Specifically, the four-point silica gel damping support can effectively reduce the influence of external vibration on the microprocessor mainboard, the universal joint adjusting mechanism contained in the support facilitates the installation and debugging of the microprocessor mainboard, so that it is in a horizontal state, and the self-cleaning contacts arranged at the interface can prevent dust and impurities from entering the interface, thereby ensuring the stability of data transmission.
[0030] The lower base is provided with a terminal row with a stress release structure for connecting power grid cables, the upper cover plate and the lower base are connected through anti-loose bolts with torque marks, the interface of the sensor cabin and the processor cabin is provided with a fluorine rubber sealing ring, and the external power supply cable is connected through a waterproof connector with an O-shaped sealing ring.
[0031] Specifically, when connecting the power grid cable, the cable is pressed to the terminal row after passing through the stepped cable perforation, the stress release structure can effectively release the stress of the cable, and prevent the cable from being damaged due to excessive stress, the upper cover plate and the lower base are connected through anti-loose bolts with torque marks, the torque marks can prevent the bolts from loosening, thereby ensuring the sealing and stability of the device, the fluorine rubber sealing ring can ensure the sealing between the cabins, prevent moisture and dust from entering, and affect the performance of the device, and the waterproof connector with the O-shaped sealing ring can effectively prevent moisture from entering the device, thereby ensuring the normal operation of the device.
[0032] The implementation principle of the embodiment of the application is as follows: in assembly, the upper cover plate, the lower base and the middle sealing layer are prepared first, and they are combined together according to the design requirements, to ensure that the components are connected tightly and sealed well; the split design facilitates subsequent installation, maintenance and replacement of internal components; the aluminum alloy material has good heat dissipation performance and mechanical strength, can effectively protect the internal components, and prevent damage due to external impact or overheating; heat is generated during device operation, the heat dissipation fin array increases the heat dissipation area of the upper cover plate, and the flow guide groove helps to guide air flow, so that heat can be dissipated more quickly, ensuring that the device will not be affected by overheating during long-term operation; when the communication module is installed, it is clamped into the installation slot and fixed through the buckle positioning structure; the anti-falling spring can prevent the communication module from falling off during use, facilitating installation, disassembly and maintenance of the communication module; the sensor cabin is used to install various sensors, and the processor cabin is used to install data processing modules and other components; the shielding partition plate with a honeycomb wave-absorbing layer can effectively absorb electromagnetic interference signals, reduce electromagnetic interference between the sensor cabin and the processor cabin, and improve the anti-interference ability of the device; the current sensor, voltage sensor, temperature sensor and three-dimensional MEMS vibration sensor are installed in the sensor cabin respectively, to realize monitoring of multiple parameters of the power grid; the data processing module in the processor cabin processes the data collected by the sensors; the storage unit is used to store data; the dual-band antenna can support different communication frequency bands, improving the flexibility and reliability of communication; the antenna is fixed to the outer edge of the upper cover plate through the ceramic base, the ceramic base has good insulation performance and mechanical strength, the grounding shielding net below the base can effectively reduce the influence of external electromagnetic interference on the antenna, ensuring the communication quality; the epoxy resin package has good insulation performance and mechanical strength, and can protect the current sensor; the permalloy magnetic shielding cover arranged around the Hall element can effectively shield external magnetic field interference due to the high magnetic permeability and low coercive force of permalloy, improving the accuracy of current measurement; the power grid cable is passed through the stepped cable perforation, the stepped design facilitates the insertion and fixation of the cable, and the wear-resistant ceramic ring embedded in the inner wall of the perforation can reduce the friction between the cable and the inner wall of the perforation, prolonging the service life of the cable and the device; the voltage sensor is vertically fixed to the rear wall of the sensor cabin through the column with damping rubber, the multi-layer stacked voltage dividing circuit board structure can realize effective attenuation of high-voltage signals, while reducing the size of the device; the column with damping rubber can play a damping role, reducing the influence of external vibration on the voltage sensor; the voltage sensor input end is in contact with the external circuit through the gold-plated spring thimble, the gold plating process can improve the conductivity and stability of the contact, the spring thimble facilitates the connection and disconnection of the cable, and the limiting collar at the tail of the thimble can prevent the thimble from being compressed too much, ensuring the stability of the contact force; the temperature sensor is embedded in the copper heat-conducting block on the front wall of the sensor cabin, the copper heat-conducting block has good heat-conducting performance and can quickly transfer the temperature of the device under test to the temperature sensor; the serpentine cooling flow channel processed on the back of the heat-conducting block can reduce the temperature of the heat-conducting block through circulating cooling liquid,The conical temperature measuring boss arranged on the front surface of the heat conduction block can increase the contact area with the equipment to be measured, improve the accuracy of temperature measurement, and enhance the anti-interference ability of the detection system, adapt to complex power grid environment, optimize the heat dissipation capacity, and the device itself is convenient to disassemble and maintain according to the design of the split shell, and the detection cost is reduced. The three-dimensional MEMS vibration sensor comprises an X / Y / Z axis silicon micro gyroscope and a piezoelectric accelerometer, and the silicon micro gyroscope and the piezoelectric accelerometer can measure the angular velocity and acceleration of the three axes respectively, so as to comprehensively monitor the vibration of the power grid equipment. The vibration signal is adjusted according to the strength of the vibration signal through the programmable gain amplifier, the 24-order band-pass filter can effectively filter out the noise signal, improve the quality of the vibration signal, and then input the DSP coprocessor of the microprocessor for fast and accurate processing and analysis. The four-point silica gel damping support can effectively reduce the influence of external vibration on the microprocessor mainboard, and the universal joint adjusting mechanism contained in the support is convenient for the installation and debugging of the microprocessor mainboard, so that it is in a horizontal state. The self-cleaning contact arranged at the interface can prevent dust and impurities from entering the interface and ensure the stability of data transmission. When connecting the power grid cable, the cable is pressed into the terminal block after passing through the stepped cable perforation, and the stress release structure can effectively release the stress of the cable to prevent the cable from being damaged due to excessive stress. The upper cover plate and the lower base are connected through the anti-loose bolt with torque mark, the torque mark can prevent the bolt from loosening, and the sealing property and stability of the device are ensured. The fluorine rubber sealing ring can ensure the sealing property between the cabins, prevent moisture and dust from entering, and affect the performance of the device. The waterproof joint with O-shaped sealing ring can effectively prevent moisture from entering the device, and ensure the normal operation of the device. Through the above contents and structures, the precision and real-time performance of the power grid detection are improved.
[0033] Embodiment 2: A power grid detection method, referring to Figures 1-2 , comprising the following steps: S1: unscrew the anti-loose bolt with torque mark of the lower base, pass the power grid cable through the stepped cable perforation, and press it to the terminal block of the stress release structure; S2: adjust the voltage sensor needle pressure with a torque screwdriver, so that it maintains 0.5-1N contact force with the line and is locked through the limiting check ring; S3: use the clamp with pressure feedback to attach the copper heat conduction block to the surface of the equipment to be measured, and ensure that the conical temperature measuring boss is in complete contact; S4: connect the external power supply cable through the waterproof joint with O-shaped sealing ring, and lock the shell bolts in diagonal order after confirming that the fluorine rubber sealing rings of the cabins are not twisted.
[0034] Specifically, loosen the torque-identified locknut of the base, pass the power grid cable through the stepped cable through-hole, and press the cable to the terminal row with a stress release structure according to the specified crimping process. Check whether the cable connection is firm and whether there is a loose or short circuit phenomenon, ensure the reliable connection of the power grid cable and the device, adjust the voltage sensor needle pressure using a torque screwdriver, and appropriate contact force can ensure good electrical connection between the voltage sensor and the line, while avoiding damage to the needle or line due to excessive contact force. Locking through the limiting stop ring ensures the stability of the contact force, and the special clamp with pressure feedback is used to attach the copper heat-conducting block to the surface of the device under test. The special clamp with pressure feedback can monitor the pressure of the clamp on the copper heat-conducting block in real time, ensuring good thermal contact between the copper heat-conducting block and the device under test, and improving the accuracy of temperature measurement. Ensure that the conical temperature measurement boss is in complete contact with the device under test to accurately measure the temperature. Connect the external power cable through a waterproof joint with an O-ring, and check whether the joint connection is tight and whether there is a water leakage phenomenon. After confirming that the fluororubber sealing ring in each cabin is not twisted, lock the shell bolts in diagonal order to evenly distribute the stress on the shell and ensure the sealing and stability of the shell.
[0035] The microprocessor analyzes the current harmonic characteristics using a parallel FFT algorithm, combines voltage sag criteria with time stamp records and a three-dimensional temperature field model for comprehensive diagnosis, and issues an alarm signal and judges the fault type and location when abnormal parameters are detected.
[0036] Specifically, after the device is running normally, the current, voltage, temperature, and vibration parameters of the power grid are collected in real time, the microprocessor analyzes the current harmonic characteristics using a parallel FFT algorithm, which can accurately detect the harmonic components in the current, combines voltage sag criteria with time stamp records to determine whether the voltage has dropped abnormally, and a three-dimensional temperature field model can analyze the temperature distribution of the power grid equipment. By comprehensively analyzing these information, the running state of the power grid is diagnosed, and when abnormal parameters are detected, the device issues an alarm signal in time to remind relevant personnel, and according to the preset fault diagnosis rules, the fault type and location are judged to provide accurate fault information for maintenance personnel to quickly repair and ensure the safe and stable operation of the power grid.
[0037] The implementation principle of the embodiment of the application is that the torque-identified anti-loosening bolt of the lower base is loosened, the power grid cable is passed through the stepped cable perforation, the cable is crimped to the terminal row with a stress release structure according to the specified crimping process, it is checked whether the cable connection is firm, whether there is loosening or short circuit phenomenon, the reliable connection of the power grid cable and the device is ensured, the voltage sensor needle pressure is adjusted using a torque screwdriver, appropriate contact force can ensure good electrical connection between the voltage sensor and the line, while avoiding damage to the needle or the line due to excessive contact force. The stability of the contact force is ensured by locking the limiting check ring, the copper heat-conducting block is attached to the surface of the device to be measured using a special clamp with pressure feedback, the special clamp with pressure feedback can monitor the pressure of the clamp on the copper heat-conducting block in real time, ensuring good thermal contact between the copper heat-conducting block and the device to be measured, and improving the accuracy of temperature measurement. Ensure that the conical temperature measurement boss completely contacts the device to be measured in order to accurately measure the temperature, connect the external power cable through the waterproof joint with an O-shaped sealing ring, check whether the joint connection is tight and whether there is water leakage phenomenon. After confirming that the fluororubber sealing ring of each cabin is not twisted, tighten the shell bolts in diagonal order to make the shell force evenly distributed, ensuring the sealing and stability of the shell, after the device is running normally, the current, voltage, temperature and vibration parameters of the power grid are collected in real time, the microprocessor uses parallel FFT algorithm to analyze the current harmonic characteristics, which can accurately detect the harmonic components in the current, combined with the voltage sag criterion with timestamp recording, whether the voltage appears sudden drop and other abnormal conditions can be judged, the three-dimensional temperature field model can analyze the temperature distribution of the power grid equipment, through the comprehensive information, the running state of the power grid is comprehensively diagnosed, when abnormal parameters are detected, the device sends an alarm signal in time to remind the relevant personnel, and according to the preset fault diagnosis rule, the fault type and position are judged to provide accurate fault information for the maintenance personnel to quickly repair and process, to ensure the safe and stable operation of the power grid. According to the above method, the cost is further reduced, and through detection and real-time criterion analysis, accurate fault information can be provided for the workers to quickly repair and process, to ensure the safe and stable operation of the power grid.
[0038] The embodiments of the specific implementation are the preferred embodiments of the application, not limited to the protection scope of the application, wherein the same parts are indicated by the same reference numerals. Therefore: any equivalent changes made according to the structure, shape, principle of the application should be covered by the protection scope of the application.
Claims
1. A power grid detection device, characterized in that, The device includes a split aluminum alloy housing, comprising an upper cover, a lower base, and an intermediate sealing layer. The upper cover has an array of staggered trapezoidal heat dissipation fins with guide grooves at the base of the fins and an integrated communication module mounting slot with a snap-fit positioning structure on the inner side. Anti-detachment spring clips are arranged in the slots. The lower base is divided into a sensor compartment and a processor compartment, which are separated by a shielding partition with a honeycomb-shaped wave-absorbing layer. The sensor compartment contains a current sensor, a voltage sensor, a temperature sensor, and a three-dimensional MEMS vibration sensor. The processor compartment contains a data processing module and a storage unit. The communication module includes a dual-band antenna and an RF chip. The antenna is fixed to the outer edge of the upper cover by a ceramic base, and a grounding shielding mesh is arranged below the base.
2. The power grid detection device according to claim 1, characterized in that, The current sensor is fixed to the left side wall of the sensor compartment by an epoxy resin encapsulation bracket with pre-tightening bolts. A permalloy magnetic shield is set around its Hall element, which is aligned with the stepped cable through hole opened at the bottom of the lower base. A wear-resistant ceramic ring is embedded in the inner wall of the through hole.
3. The power grid detection device according to claim 1, characterized in that, The voltage sensor adopts a multi-layer stacked voltage divider circuit board structure and is vertically fixed to the rear wall of the sensor compartment by a column with damping rubber. The input end contacts the external circuit through a gold-plated spring pin, and a limit ring is provided at the tail of the pin.
4. The power grid detection device according to claim 1, characterized in that, The temperature sensor is embedded in a copper heat-conducting block on the front wall of the sensor compartment. A serpentine cooling channel is machined on the back of the heat-conducting block, and a conical temperature measuring boss is provided on the front.
5. A power grid detection device according to claim 1, characterized in that, The three-dimensional MEMS vibration sensor includes silicon micro gyroscopes and piezoelectric accelerometers along the X / Y / Z axes. It is mounted on the side of the shielding partition by threaded fasteners with pre-tightening washers. The vibration signal is input to the DSP coprocessor of the microprocessor after being a programmable gain amplifier and a 24th-order bandpass filter.
6. The power grid detection device according to claim 1, characterized in that, The microprocessor motherboard of the data processing module is suspended in the center of the processor compartment by a four-point silicone shock-absorbing bracket. The bracket includes a universal joint adjustment mechanism. The storage unit adopts a rail-mounted SSD module located on the right side of the motherboard, and self-cleaning contacts are provided at the interface.
7. A power grid detection device according to claim 1, characterized in that, The lower base is equipped with a terminal block with a stress relief structure for connecting power grid cables. The upper cover and the lower base are connected by anti-loosening bolts with torque markings. The interface between the sensor compartment and the processor compartment is equipped with a fluororubber sealing ring. The external power supply cable is connected through a waterproof connector with an O-ring.
8. A power grid detection method, based on the power grid detection device according to claims 1-7, characterized in that, Includes the following steps: S1: Loosen the anti-loosening bolts with torque markings on the lower base, pass the power grid cable through the stepped cable through hole, and then crimp it to the terminal block with stress relief structure; S2: Use a torque screwdriver to adjust the voltage sensor pin pressure to maintain a contact force of 0.5-1N with the circuit and lock it in place with the limit ring; S3: Use a clamp with pressure feedback to attach the copper heat-conducting block to the surface of the device under test, ensuring that the conical temperature measuring boss is in full contact; S4: Connect the external power supply cable through the waterproof connector with O-ring seal. After confirming that the fluororubber seals in each compartment are not twisted, tighten the shell bolts in diagonal order.
9. A power grid detection method according to claim 8, characterized in that, The microprocessor uses a parallel FFT algorithm to analyze current harmonic characteristics, and combines a voltage drop criterion with timestamp records and a three-dimensional temperature field model for comprehensive diagnosis. When abnormal parameters are detected, an alarm signal is issued and the fault type and location are determined.