Package substrate manufacturing method and package substrate

Abstract

The invention provides a packaging substrate manufacturing method, and belongs to the technical field of packaging substrates, and the method comprises the steps: providing a substrate which is provided with an insulating film; presetting a plurality of cavity processing areas on the insulating film, wherein each cavity processing area comprises an outer ring area and an inner ring area which are coaxially arranged; processing the outer ring areas one by one by using a first laser ablation process until all the outer ring areas are ablated; and processing the inner ring areas one by one by using a second laser ablation process until all the inner ring areas are ablated. According to the manufacturing method of the package substrate, continuous temperature rise of the protective glass can be inhibited, the risk that volatile substances on the protective glass absorb a large amount of heat to burn the protective glass is reduced, and the problems of cavity position precision deviation and insulating film residue are solved.

Description

Technical Field

[0001] This application relates to the field of packaging substrate technology, and in particular to a method for manufacturing a packaging substrate and a packaging substrate. Background Technology

[0002] In the field of semiconductor packaging substrate technology, the processing quality of the cavity plays a crucial role in the reliability of the entire packaging process and product performance. Currently, laser processing technology, with its advantages of high precision, high efficiency, and non-contact processing, has been widely used in cavity processing. This technology uses the interaction between a high-energy laser beam and the material to achieve precise material removal, thereby forming the required cavity structure.

[0003] However, based on current technology for processing the cavity, it was found that ABF (Ajinomoto deposit film) residue exists after laser processing of the cavity, and defects such as dents / voids are found on one side during the cavity encapsulation process. Through investigation and comparison, it was found that the location of the void defect matches the position offset of the cavity, which is strongly related to the laser processing cavity production process.

[0004] In existing technologies, laser-processed cavities are typically fabricated in a single process using a single program. During continuous processing, a large amount of volatile substances, such as foreign matter, splash onto the surface of the laser protective mirror. As the number of laser holes increases while the energy setting remains constant, the volatile substances adhering to the protective mirror absorb a large amount of heat and burn it, resulting in subtle unevenness on the mirror surface. This causes the laser beam to fail to achieve the specified positional accuracy on the board surface after passing through the protective mirror, ultimately causing a deviation in cavity accuracy. This affects the center matching between the die (chip) and the cavity, resulting in packaging risks. Furthermore, the uniformity of the beam energy is altered due to the burnt protective mirror, leading to a large amount of ABF residue in the cavity. Summary of the Invention

[0005] This application provides a method for manufacturing a packaging substrate, which can suppress the continuous rise in temperature of the protective mirror, reduce the risk of the protective mirror being burned by volatile substances absorbing a large amount of heat, and improve the problems of cavity position displacement and ABF residue.

[0006] This application provides a method for manufacturing a packaging substrate, including: A substrate is provided, wherein an insulating film is disposed on the substrate; Multiple cavity processing areas are pre-set on the insulating film, wherein each cavity processing area includes an outer ring area and an inner ring area arranged coaxially; Using a first laser ablation process, the outer ring areas are processed one by one until all the outer ring areas are ablated. The inner ring region is processed one by one using a second laser ablation process until all the inner ring regions are completed ablation.

[0007] In some embodiments, the laser energy in the second laser ablation process is greater than the laser energy in the first laser ablation process, and / or the laser beam aperture in the second laser ablation process is greater than the laser beam aperture in the first laser ablation process.

[0008] In some embodiments, when the outer ring region is ablated, the laser energy is 2.5-3.5 millijoules, and the laser energy error is less than or equal to 5%; when the inner ring region is ablated, the laser energy is 4.5-5.5 millijoules, and the laser energy error is less than or equal to 5%.

[0009] In some embodiments, when the outer ring region is ablated, the laser beam aperture is 45-60 microns, and the laser beam aperture error is less than or equal to 5%; when the inner ring region is ablated, the laser beam aperture is 80-100 microns, and the laser beam aperture error is less than or equal to 5%.

[0010] In some embodiments, the outer ring region is processed using a first laser ablation process, which includes circumferential ablation of the outer ring region along a preset at least one first closed geometric track; The inner ring region is processed using a second laser ablation process, which includes circumferential ablation of the inner ring region along a preset area scanning track.

[0011] In some embodiments, the outer ring region is processed using a first laser ablation process, which further includes circumferential ablation of the outer ring region along a preset at least one second closed geometric track; Wherein, the second closed geometric track corresponds to the first closed geometric track one by one, the second closed geometric track coincides with the corresponding first closed geometric track, and the laser action points in the second closed geometric track are staggered with the laser action points in the first closed geometric track; After ablation of the outer ring region along the first closed geometric track, circumferential ablation of the outer ring region along the second closed geometric track is performed; or, Circumferential ablation of the outer ring region along the second closed geometric track and circumferential ablation of the outer ring region along the first closed geometric track are performed synchronously, and are completed at one time through a composite scanning path.

[0012] In some embodiments, the number of laser action points in the second closed geometric track is 60%-85% of the number of laser action points in the first closed geometric track.

[0013] In some embodiments, the cavity processing region is divided into a longitudinal cavity processing region group and a transverse cavity processing region group, the longitudinal cavity processing region group comprises a plurality of cavity processing regions arranged longitudinally at intervals, and the transverse cavity processing region group comprises a plurality of cavity processing regions arranged transversely, and the longitudinal cavity processing region group and the transverse cavity processing region group are not overlapped.

[0014] In some embodiments, the longitudinal cavity processing region group is symmetrically distributed with the transverse center line of the transverse cavity processing region group as the axis of symmetry, and the transverse cavity processing region group is symmetrically distributed with the longitudinal center line of the longitudinal cavity processing region group as the axis of symmetry.

[0015] In some embodiments, the outer ring region is a ramp-shaped side wall structure, and the bottom of the inner ring region is parallel to the surface of the substrate.

[0016] The packaging substrate manufacturing method of the embodiments of the present application divides the cavity processing region into an outer ring region and an inner ring region, processes all the outer ring regions first and then processes the inner ring region, suppresses the continuous temperature rise of the protective mirror, reduces the risk of the volatile substances on the protective mirror absorbing a large amount of heat and burning the protective mirror, improves the problems of cavity position deviation and ABF residue, and ensures the processing production efficiency of the cavity. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0018] Figure 1 It is a flowchart of the packaging substrate manufacturing method of the embodiments of the present application.

[0019] Figure 2 It is a schematic diagram of laser ablation of an outer ring region in the packaging substrate manufacturing method of the embodiments of the present application.

[0020] Figure 3 It is a schematic diagram of the packaging substrate after laser ablation of the outer ring region in the embodiments of the present application.

[0021] Figure 4 It is a schematic diagram of laser ablation of an inner ring region in the packaging substrate manufacturing method of the embodiments of the present application.

[0022] Figure 5 It is a schematic diagram of the packaging substrate after laser ablation of the inner ring region in the embodiments of the present application.

[0023] Figure 6FIG. 1 is a schematic diagram of a packaging substrate manufacturing method according to an embodiment of the present application.

[0024] Reference signs: Substrate 1; insulating film 2; cavity processing area 3; outer ring area 31; inner ring area 32. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person skilled in the art without creative work fall within the protection scope of the present application.

[0026] The packaging substrate manufacturing method provided by the embodiments of the present application can inhibit continuous temperature rise of a protective mirror, reduce the risk of burning the protective mirror due to absorption of a large amount of heat by volatile substances on the protective mirror, and improve the problems of cavity position deviation and ABF residue.

[0027] Reference signs: Figures 1 to 5 , Figure 1 FIG. 1 is a schematic diagram of a packaging substrate manufacturing method according to an embodiment of the present application. Figure 2 FIG. 1 is a schematic diagram of a packaging substrate manufacturing method according to an embodiment of the present application. Figure 3 FIG. 1 is a schematic diagram of a packaging substrate manufacturing method according to an embodiment of the present application. Figure 4 FIG. 1 is a schematic diagram of a packaging substrate manufacturing method according to an embodiment of the present application. Figure 5 FIG. 1 is a schematic diagram of a packaging substrate manufacturing method according to an embodiment of the present application. 10. A substrate 1 is provided, and the substrate 1 is provided with an insulating film 2.

[0028] 20. A plurality of cavity processing areas 3 are pre-set on the insulating film 2, wherein each cavity processing area 3 comprises an outer ring area 31 and an inner ring area 32 arranged coaxially.

[0029] 30. A first laser ablation process is used to process the outer ring areas 31 one by one until ablation of all the outer ring areas 31 is completed.

[0030] 40. A second laser ablation process is used to process the inner ring areas 32 one by one until ablation of all the inner ring areas 32 is completed.

[0031] It should be noted that by dividing the cavity processing area 3 into the outer ring area 31 and the inner ring area 32, and processing the outer ring area 31 one by one and then processing the inner ring area 32 one by one, the risk of the volatile substances such as impurities on the protective mirror absorbing a large amount of heat in a short time and burning the protective mirror is avoided, and the problems of cavity position deviation and ABF residue are improved.

[0032] The packaging substrate 1 manufacturing method of the embodiment of the present application divides the cavity processing area 3 into the outer ring area 31 and the inner ring area 32, and processes all the outer ring areas 31 first and then processes the inner ring areas 32, thereby suppressing the continuous increase of the temperature of the protective mirror, reducing the risk of the volatile substances such as impurities on the protective mirror absorbing a large amount of heat in a short time and burning the protective mirror, and improving the problems of cavity position deviation and ABF residue.

[0033] In some embodiments, the laser energy in the second laser ablation process is greater than the laser energy in the first laser ablation process, and / or the laser beam aperture in the second laser ablation process is greater than the laser beam aperture in the first laser ablation process.

[0034] In some specific embodiments, when the outer ring area 31 is ablated, the laser energy is 2.5-3.5 mJ (for example, 2.5 mJ, 2.75 mJ, 3.0 mJ, 3.25 mJ, 3.5 mJ), and the laser energy error is less than or equal to 5%; when the inner ring area 32 is ablated, the laser energy is 4.5-5.5 mJ (for example, 4.5 mJ, 4.75 mJ, 5.0 mJ, 5.25 mJ, 5.5 mJ), and the laser energy error is less than or equal to 5%.

[0035] In some specific embodiments, when the outer ring area 31 is ablated, the laser beam aperture is 45-60 microns (for example, 45 microns, 50 microns, 55 microns, 60 microns), and the laser beam aperture error is less than or equal to 5%; when the inner ring area 32 is ablated, the laser beam aperture is 80-100 microns (for example, 80 microns, 85 microns, 90 microns, 95 microns, 100 microns), and the laser beam aperture error is less than or equal to 5%.

[0036] It should be noted that the processing accuracy of the outer ring area 31 affects the processing accuracy of the entire cavity, and by using smaller laser energy and / or laser beam aperture in the outer ring area 31, the continuous increase of the temperature of the protective mirror is further suppressed, and the accuracy of the processing of the outer ring area 31 is ensured; after the processing accuracy of the outer ring area 31 is ensured, even if the temperature of the protective mirror continues to rise during the processing of the inner ring area 32, it will not affect the position accuracy of the cavity, therefore, by using larger laser energy and / or laser beam aperture in the inner ring area 32, the processing efficiency of the inner ring area 32 is improved, so as to improve the production efficiency of the substrate 1.

[0037] In some embodiments, referring to Figure 2 and Figure 3 , the outer ring region 31 is processed using a first laser ablation process, including performing a surrounding ablation on the outer ring region 31 along a preset at least one first closed geometric track. For example, in one example, referring to Figure 2 , a plurality of rectangular first closed geometric tracks are preset, the rectangular first closed geometric tracks have the same geometric center point and are arranged in order from inside to outside, and the spacing between two adjacent first closed geometric tracks is less than the diameter of the laser beam when the outer ring region 31 is ablated.

[0038] Further, in some embodiments, the outer ring region 31 is processed using the first laser ablation process, further including performing a surrounding ablation on the outer ring region 31 along a preset at least one second closed geometric track; wherein the second closed geometric track corresponds to the first closed geometric track one by one, the second closed geometric track coincides with the corresponding first closed geometric track, and the laser action points in the second closed geometric track are staggered with the laser action points in the first closed geometric track.

[0039] It should be noted that the first closed geometric track and the second closed geometric track both refer to a continuous path connected at the head and tail, including but not limited to a circle, an ellipse, a rectangle, a polygon, and other arbitrary closed geometric shapes, which can be realized by a galvanometer control of a laser scanning system or a motion platform programming.

[0040] It should be further noted that after the surrounding ablation on the outer ring region 31 along the first closed geometric track, there may be a situation of insufficient or uneven ablation in some local areas. By performing a surrounding ablation on the outer ring region 31 along the second closed geometric track, the remaining part of the insulating film 2 can be further removed, and the ablation of the outer ring region 31 can be more uniform and complete, thereby improving the processing quality.

[0041] Optionally, in some embodiments, after the surrounding ablation on the outer ring region 31 along the first closed geometric track, a surrounding ablation on the outer ring region 31 along the second closed geometric track is performed.

[0042] It should be noted that by separating the surrounding ablation on the outer ring region 31 along the first closed geometric track and the surrounding ablation on the outer ring region 31 along the second closed geometric track, after the surrounding ablation on the outer ring region 31 along the first closed geometric track, the outer ring region 31 after ablation can be detected, and according to the detection result, the ablation parameters of the second closed geometric track can be adjusted and optimized accordingly to correct possible problems in the ablation process along the first closed geometric track, improve the quality of the product, and avoid excessive ablation.

[0043] Optionally, in other embodiments, the circumferential ablation of the outer ring region 31 along the second closed geometric track is performed synchronously with the circumferential ablation of the outer ring region 31 along the first closed geometric track, and is completed at one time through a composite scanning path.

[0044] It should be noted that the circumferential ablation of the outer ring region 31 along the first closed geometric track and the circumferential ablation of the outer ring region 31 along the second closed geometric track are completed at one time through a composite scanning path, without the need for multiple positioning and calibration, simplifying the process flow, reducing the processing time, thereby improving the production efficiency, and through the composite scanning path, the uniformity of ablation can be further ensured, which is beneficial to improve the product quality.

[0045] In some specific embodiments, the number of laser action points in the second closed geometric track is 60%-85% (for example, 60%, 65%, 70%, 75%, 80%, 85%) of the number of laser action points in the first closed geometric track, which ensures the ablation effect while avoiding excessive ablation.

[0046] In some embodiments, referring to Figure 4 and Figure 5 , the inner ring region 32 is processed using a second laser ablation process, including circumferential ablation of the inner ring region 32 along a preset surface scanning track. It should be noted that after ensuring the processing accuracy of the outer ring region 31, processing the inner ring region 32 will not affect the position accuracy of the cavity, and thus, circumferential ablation of the inner ring region 32 along the preset surface scanning track uses a conventional surface scanning circumferential ablation method in the art, directly using a mature and general track planning mode, without the need for additional design of the scanning track.

[0047] In some embodiments, the cavity processing region 3 is divided into a longitudinal cavity processing region 3 group and a transverse cavity processing region 3 group, the longitudinal cavity processing region 3 group includes a plurality of cavity processing regions 3 arranged longitudinally, and the transverse cavity processing region 3 group includes a plurality of cavity processing regions 3 arranged transversely, and the longitudinal cavity processing region 3 group and the transverse cavity processing region 3 group do not overlap.

[0048] Further, in some embodiments, the longitudinal cavity processing region 3 group is symmetrically distributed with the transverse center line of the transverse cavity processing region 3 group as the axis of symmetry, and the transverse cavity processing region 3 group is symmetrically distributed with the longitudinal center line of the longitudinal cavity processing region 3 group as the axis of symmetry.

[0049] It should be noted that by dividing the cavity processing region 3 into two groups in the longitudinal and transverse directions, and arranging them without overlap, it is beneficial to sequentially process each cavity in order, avoiding confusion and repeated operations during processing, reducing the idle time of the equipment, and thereby improving the overall processing efficiency.

[0050] The embodiment of the present application further provides a packaging substrate 1, which is processed by the packaging substrate 1 processing method of any one of the above embodiments.

[0051] The packaging substrate 1 of the embodiment of the present application divides the cavity processing area 3 into the outer ring area 31 and the inner ring area 32, processes all the outer ring areas 31 first and then processes the inner ring areas 32, suppresses the continuous increase of the temperature of the protective mirror, reduces the risk that the volatile substances such as impurities on the protective mirror absorb a large amount of heat in a short time and burn the protective mirror, improves the problems of cavity position deviation and ABF residue, and improves the quality of the packaging substrate 1.

[0052] In the description of the present application, it should be understood that terms such as "first", "second" and the like are only used to distinguish similar objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.

[0053] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0054] It should be understood that the terms "thickness", "upper", "lower", "left", "right", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0055] The principles and implementation modes of the present application are described by using specific examples in this paper, and the above description of the embodiments is only used to help understand the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation mode and application range will be changed, and the above description of the present application should not be understood as a limitation.

Claims

1. A method for fabricating a package substrate, the method comprising: include: A substrate is provided, wherein an insulating film is disposed on the substrate; Multiple cavity processing areas are pre-set on the insulating film, wherein each cavity processing area includes an outer ring area and an inner ring area arranged coaxially; Using a first laser ablation process, the outer ring areas are processed one by one until all the outer ring areas are ablated. Using a second laser ablation process, the inner ring regions are processed one by one until all the inner ring regions are ablated.

2. The method of claim 1, wherein The laser energy in the second laser ablation process is greater than the laser energy in the first laser ablation process, and / or the laser beam aperture in the second laser ablation process is greater than the laser beam aperture in the first laser ablation process.

3. The method of claim 2, wherein When ablation is performed on the outer ring region, the laser energy is 2.5 mJ to 3.5 mJ, and the laser energy error is less than or equal to 5%. When ablation is performed on the inner ring region, the laser energy is 4.5 mJ to 5.5 mJ, and the laser energy error is less than or equal to 5%.

4. The method of claim 2, wherein When ablation is performed on the outer ring region, the laser beam aperture is 45-60 micrometers, and the laser beam aperture error is less than or equal to 5%. When ablation is performed on the inner ring region, the laser beam aperture is 80-100 micrometers, and the laser beam aperture error is less than or equal to 5%.

5. The method of manufacturing a package substrate according to any one of claims 1 to 4, wherein The outer ring region is processed using a first laser ablation process, including circumferential ablation of the outer ring region along at least one preset first closed geometric trajectory. The inner ring region is processed using a second laser ablation process, including circumferential ablation of the inner ring region along a preset surface scanning trajectory.

6. The method of claim 5, wherein The outer ring region is processed using a first laser ablation process, which further includes circumferential ablation of the outer ring region along at least one preset second closed geometric trajectory. Wherein, the second closed geometric trajectory corresponds one-to-one with the first closed geometric trajectory, the second closed geometric trajectory coincides with the corresponding first closed geometric trajectory, and the laser action point in the second closed geometric trajectory is staggered with the laser action point in the first closed geometric trajectory; After performing circumferential ablation of the outer region along the first closed geometric trajectory, perform circumferential ablation of the outer region along the second closed geometric trajectory; or... The ablation of the outer ring region along the second closed geometric trajectory is performed simultaneously with the ablation of the outer ring region along the first closed geometric trajectory, and is completed in one go through a composite scanning path.

7. The method for manufacturing a packaging substrate according to claim 6, characterized in that, The number of laser action points in the second closed geometric trajectory is 60%-85% of the number of laser action points in the first closed geometric trajectory.

8. The method for manufacturing a packaging substrate according to claim 1, characterized in that, The cavity processing area is divided into a longitudinal cavity processing area group and a transverse cavity processing area group. The longitudinal cavity processing area group includes multiple cavity processing areas arranged at intervals along the longitudinal direction, and the transverse cavity processing area group includes multiple cavity processing areas arranged along the transverse direction. The longitudinal cavity processing area group and the transverse cavity processing area group do not overlap.

9. The method for manufacturing a packaging substrate according to claim 8, characterized in that, The longitudinal cavity processing area group is symmetrically distributed with the transverse centerline of the transverse cavity processing area group as the axis of symmetry, and the transverse cavity processing area group is symmetrically distributed with the longitudinal centerline of the longitudinal cavity processing area group as the axis of symmetry.

10. A packaging substrate, characterized in that, The packaging substrate is prepared by the manufacturing method according to any one of claims 1 to 9.

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