Wafer post-processing device

Abstract

The invention discloses a wafer post-processing device. The wafer post-processing device comprises a box body; the clamping assembly is arranged in the box body and can vertically clamp and drive the wafer to rotate; the protection assembly is arranged on the peripheral side of the clamping assembly and comprises a rotary cover and a fixed cover, the rotary cover is connected to the clamping assembly and located on the peripheral side of the wafer to be processed, and the fixed cover is concentrically arranged on the outer side of the rotary cover; a blocking structure is formed on the rotating cover and / or the fixed cover so as to restrain centrifugally scattered fluid from adhering to the surface of the wafer.

Description

[0001] This application is a divisional application of the invention patent application filed on September 15, 2023, with application number 2023111901284. Technical Field

[0002] This invention belongs to the field of chemical mechanical polishing technology, and more specifically, relates to a wafer post-processing device. Background Technology

[0003] The integrated circuit industry is the core of the information technology industry, playing a crucial role in promoting the digital and intelligent transformation and upgrading of the manufacturing industry. Chips are the carriers of integrated circuits, and chip manufacturing involves processes such as integrated circuit design, wafer fabrication, wafer processing, electrical measurement, dicing, packaging, and testing. Among these, chemical mechanical polishing (CMP) is one of the five core processes in wafer fabrication.

[0004] After chemical mechanical polishing (CMP), a large amount of particulate matter remains on the surface of the wafer. Therefore, post-processing such as cleaning and drying is required. Post-processing generally refers to the cleaning and drying treatment of the wafer after CMP.

[0005] A schematic diagram of the wafer cleaning apparatus 100' in the prior art is shown below. Figure 1 As shown. The wafer cleaning apparatus 100' includes a housing 10', inside which is a clamping mechanism 20' for vertically clamping the wafer. The end of the clamping mechanism 20' is equipped with a driving member (not shown) to drive the clamping mechanism 20' and the wafer W it clamps to rotate. The wafer cleaning apparatus 100' also includes an inner retaining ring 30' and an outer retaining ring 40', wherein the inner retaining ring 30' rotates synchronously with the clamping mechanism 20', and the outer retaining ring 40' is disposed on the inner side wall of the housing 10' and located outside the inner retaining ring 30'.

[0006] During wafer cleaning, the clamping mechanism 20' drives the wafer to rotate around the central axis, and the spraying part (not shown) sprays cleaning fluid toward the wafer W. Under the action of centrifugal force, the liquid on the wafer surface will be thrown out and splashed onto the inner baffle ring 30', so as to avoid the liquid thrown out by the wafer splashing out in a large amount of disorderly splashing in the box 10' and back-contaminating the wafer.

[0007] Since the inner retaining ring 30' rotates in the same direction as the wafer W, and the outer retaining ring 40' remains stationary, the liquid ejected from the wafer is received by the inner wall of the inner retaining ring 30'. The relative velocity between the ejected liquid and the inner retaining ring 30' is relatively small, and the ejected liquid flows along the inner wall of the inner retaining ring 30', and then exits through the inner retaining ring drain port 31'. Figure 2 (As shown) Discharge.

[0008] Because the relative velocity between the inner baffle ring 30' and the outer baffle ring 40' is relatively high, the droplets ejected from the inner baffle ring drain port 31' will impact the inner wall of the outer baffle ring 40' with a relatively high velocity, thus generating splash droplets that fill the space between the inner baffle ring 30' and the outer baffle ring 40'. The droplets formed inside the housing 10' have at least the following adverse effects:

[0009] First, liquid will accumulate in the center of the inner wall at the top of the outer retaining ring 40', forming a large number of suspended droplets, such as... Figure 2 As shown, the suspended droplets will extend to the front end of the outer baffle ring 40' and randomly drip onto the outer wall of the inner baffle ring 30'; if the droplets fall onto the stationary outer wall of the inner baffle ring 30', the droplets may drip onto the surface of the wafer W through the top front end of the inner baffle ring 30', thereby affecting the cleaning effect of the wafer.

[0010] Furthermore, the sputtered droplets between the inner baffle ring 30' and the outer baffle ring 40' will be moved to the right by the airflow to the entrance of the gap between the inner baffle ring 30' and the outer baffle ring 40'. The sputtered droplets will continuously fly out from this entrance and reach the space where the front of the wafer is located. The sputtered droplets containing particulate matter may stick back to the wafer surface and affect the wafer cleaning effect. Summary of the Invention

[0011] This invention provides a wafer post-processing apparatus, which aims to at least solve one of the technical problems existing in the prior art.

[0012] A first aspect of the present invention provides a wafer post-processing apparatus, comprising:

[0013] Box;

[0014] The clamping assembly, located in the housing, is capable of vertically clamping and rotating the wafer;

[0015] A protective component is disposed on the outer periphery of the clamping component, comprising a rotating cover and a fixed cover. The rotating cover is connected to the clamping component and located on the outer periphery of the wafer to be processed, and the fixed cover is concentrically disposed on the outside of the rotating cover.

[0016] The rotating cover and / or fixed cover are formed with a blocking structure to prevent centrifugally dispersed fluid from adhering back to the wafer surface.

[0017] In one embodiment, the clamping assembly includes a clamping disk and a rotating shaft, the clamping disk being connected to the rotating shaft; the rotating cover is fixed to the rotating shaft to rotate synchronously with the clamping disk.

[0018] In one embodiment, the fixing cover is vertically connected to the back panel of the box, and a fixing cover drain port is provided below it.

[0019] In one embodiment, the outer wall of the rotating cover and the inner wall of the fixed cover are provided with corrugated blocking structures, and the protrusions of the two are staggered in the horizontal direction.

[0020] In one embodiment, the rotating cover includes a disc and a rotating cover body, the rotating cover body being disposed on the outer edge of the disc; a rotating cover drain port is provided at the junction of the disc and the rotating cover body.

[0021] In one embodiment, the outer wall of the rotating cover is provided with a rotating cover protrusion, the rotating cover protrusion including a rotating cover water-facing surface and a rotating cover connecting surface, the rotating cover water-facing surface extending inward from the peak of the rotating cover away from the disk body, and the rotating cover connecting surface located on the other side of the peak of the rotating cover and extending inward from the peak of the rotating cover.

[0022] In one embodiment, the inner wall of the fixed cover is provided with a fixed cover protrusion, the fixed cover protrusion including a fixed cover water-facing surface and a fixed cover connecting surface, the fixed cover water-facing surface extending outward from the fixed cover peak toward the back plate, and the fixed cover connecting surface located on the other side of the fixed cover peak and extending outward from the fixed cover peak.

[0023] In one embodiment, the peak of the fixed hood is positioned opposite to the water-facing surface of the rotating hood, and the peak of the rotating hood is positioned opposite to the water-facing surface of the fixed hood.

[0024] In one embodiment, the inner wall of the rear end of the fixed cover is provided with a fixed cover conical surface, which is inclined outward from the rear end of the fixed cover; the fixed cover conical surface is connected to the water-facing surface of the rear end of the fixed cover, and the inclination angle of the fixed cover conical surface is less than or equal to the inclination angle of the water-facing surface of the fixed cover.

[0025] In one embodiment, the front end of the fixed cover is provided with a groove, and the outer periphery of the rotating cover is provided with an annular retaining ring, the annular retaining ring being spaced within the groove; the size and position of the annular retaining ring match the size and position of the groove.

[0026] In one embodiment, the outer wall of the annular retaining ring is a conical surface that extends outward from the front end of the annular retaining ring.

[0027] In one embodiment, the number of the fixed cover drain ports is multiple, which are spaced apart along the length of the fixed cover, and the drain ports are located at the corresponding positions of the troughs of the blocking structure.

[0028] A second aspect of the present invention provides a wafer post-processing apparatus, wherein the wafer to be processed is horizontally arranged, comprising:

[0029] Box;

[0030] The clamping assembly, located in the housing, is capable of horizontally clamping and rotating the wafer;

[0031] A protective component is disposed on the outer periphery of the clamping component, comprising a rotating cover and a fixed cover. The rotating cover is connected to the clamping component and located on the outer periphery of the wafer to be processed, and the fixed cover is concentrically disposed on the outside of the rotating cover.

[0032] The rotating cover and / or fixed cover are formed with a blocking structure to prevent centrifugally dispersed fluid from adhering back to the wafer surface.

[0033] In one embodiment, the fixing cover is vertically connected to the back panel of the housing, and the back panel is provided with a fluid outlet.

[0034] The beneficial effects of this invention include:

[0035] a. A corrugated blocking structure is provided on the outer wall of the rotating cover and the inner wall of the fixed cover to allow the droplets to move toward the back plate, suppress the droplets from moving to the front end of the protective component, and prevent the droplets that accumulate at the front end of the rotating cover from falling and affecting the cleaning and drying effect of the wafer.

[0036] b. Set the number and size of the rotary hood drain ports appropriately to suppress the turbulence caused by the relative rotation of the rotary hood and the fixed hood, and to prevent the gas carrying sputtering droplets from escaping through the gap between the rotary hood and the fixed hood and adhering to the wafer surface;

[0037] c. The protective components can be applied to both vertical and horizontal wafer cleaning devices. They can control the movement of fluid to prevent centrifugally dispersed fluid from adhering back to the wafer surface, thus ensuring the post-processing effect of the wafer. Attached Figure Description

[0038] The advantages of the present invention will become clearer and easier to understand through the following detailed description in conjunction with the accompanying drawings, which are merely illustrative and do not limit the scope of protection of the present invention, wherein:

[0039] Figure 1 This is a schematic diagram of a wafer cleaning device in the prior art;

[0040] Figure 2 yes Figure 1 A magnified view of a section at point A in the middle;

[0041] Figure 3 This is a schematic diagram of a wafer post-processing apparatus provided in an embodiment of the present invention;

[0042] Figure 4 yes Figure 3 A magnified view of a section at point B in the middle;

[0043] Figure 5This is a schematic diagram of a rotating cover provided in an embodiment of the present invention;

[0044] Figure 6 This is a schematic diagram of a fixing cover provided in an embodiment of the present invention;

[0045] Figure 7 This is a perspective view of a rotating cover provided in an embodiment of the present invention;

[0046] Figure 8 This is a schematic diagram of a fixing cover provided in another embodiment of the present invention;

[0047] Figure 9 This is a schematic diagram of a wafer post-processing apparatus provided in another embodiment of the present invention. Detailed Implementation

[0048] The technical solutions of the present invention will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of the present invention, used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary, and should not be construed as limiting the implementation of the present invention or the scope of protection of the present invention. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0049] The accompanying drawings in this specification are schematic diagrams used to illustrate the concept of the invention and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of the embodiments of the invention, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0050] In this invention, a wafer (W) is also called a substrate, with the same meaning and practical function. The term "comprising" and similar expressions should be understood as open-ended inclusion, i.e., "including but not limited to". The term "based on" should be understood as "at least partially based on". The term "one embodiment" or "this embodiment" should be understood as "at least one embodiment". The terms "first", "second", etc., may refer to different or the same objects and are used only to distinguish the objects referred to, without implying a specific spatial order, temporal order, order of importance, etc., of the objects referred to. In some embodiments, values, processes, selected items, determined items, devices, apparatuses, means, parts, components, etc., are referred to as "best", "lowest", "highest", "minimum", "maximum", etc. It should be understood that such descriptions are intended to indicate that a selection can be made from a number of available functional options, and that such selection is not necessarily better, lower, higher, smaller, larger, or otherwise preferred than other options in any other respect or in all respects.

[0051] Figure 3 This is a schematic diagram of a wafer post-processing apparatus 100 provided in an embodiment of the present invention. The wafer post-processing apparatus 100 includes:

[0052] The housing 10 has an opening (not shown) on its top, through which a robotic arm can pick up and place wafers to be processed.

[0053] A clamping assembly 20 is disposed in the housing 10, which can vertically clamp and drive the wafer to rotate. Specifically, the clamping assembly 20 includes a clamping disk 21 and a rotating shaft 22. The rotating shaft 22 is disposed perpendicular to the back plate 11 of the housing 10, and the clamping disk 21 is disposed at the end of the rotating shaft 22. The clamping disk 21 has a circular disk-shaped structure, and its outer periphery is provided with claws to clamp the wafer to be processed. The other end of the rotating shaft 22 is provided with a drive motor (not shown) to drive the clamping disk 21 and the wafer it clamps to rotate synchronously.

[0054] The wafer post-processing apparatus 100 also includes a spraying section ( Figure 3 (Not shown), which is disposed outside the clamping assembly 20 to spray fluid, such as cleaning fluid, nitrogen and / or IPA vapor, toward the rotating wafer to treat the surface of the wafer and obtain a wafer with a cleanliness level that meets the requirements.

[0055] Figure 3 In the illustrated embodiment, the wafer post-processing apparatus 100 further includes a protective component disposed in the housing 10 and located on the outer periphery of the clamping assembly 20, to control the fluid centrifugally ejected from the wafer surface and to suppress or prevent the fluid from splashing back onto the wafer surface in a disorderly manner.

[0056] Furthermore, the protective assembly includes a rotating cover 30 and a fixed cover 40; wherein, the rotating cover 30 is disposed on the outer periphery of the clamping disk 21, and the rotating cover 30 is fixed to the rotating shaft 22 of the clamping assembly 20; the fixed cover 40 is concentrically disposed on the outer side of the rotating cover 30, specifically, the fixed cover 40 is vertically disposed on the back plate 11 of the housing 10.

[0057] In this invention, the fixed cover 40 is connected to the housing 10, meaning the fixed cover 40 remains stationary; while the rotating cover 30 rotates synchronously with the clamping plate 21; to avoid interference between the rotating cover 30 and the fixed cover 40, a gap is provided between them, such as... Figure 4 As shown.

[0058] Figure 5 This is a schematic diagram of a rotating cover 30 provided in an embodiment of the present invention. The rotating cover 30 includes a disk body 31 and a rotating cover body 32, wherein the rotating cover body 32 is disposed on the outer edge of the disk body 31. Specifically, the rotating cover body 32 extends from the outer edge of the disk body 31 toward the front end to form a single-end open cavity covering the clamping disk 21.

[0059] Furthermore, a rotating cover drain port 33 is provided at the junction of the disk body 31 and the rotating cover body 32. During wafer cleaning, fluid, such as droplets, falling into the single-end open-mouth chamber can move towards the rear end of the rotating cover 30 through the rotating cover drain port 33 and be discharged to the outside of the single-end open-mouth chamber.

[0060] Figure 6 This is a schematic diagram of a fixing cover 40 provided in one embodiment of the present invention. The fixing cover 40 has an annular structure, and a fixing cover drain port 41 is disposed at its lower part to discharge fluid flowing inside the fixing cover 40. The fixing cover drain port 41 is arranged through the circumference of the fixing cover 40; in some embodiments, the arc length of the fixing cover drain port 41 is 10-30mm, and it is spaced apart along the length of the fixing cover 40. During wafer post-processing, the fixing cover 40 is relatively stationary, and the droplets entering the fixing cover 40 will collect at the bottom of the inner sidewall of the fixing cover 40 under the action of gravity. The fixing cover drain port 41 located at the bottom can discharge the liquid in a timely manner.

[0061] Figure 3 In the illustrated embodiment, in order to suppress or prevent centrifugally dispersed fluid from adhering back to the wafer surface and affecting the wafer cleaning effect, the rotating cover 30 and / or the fixed cover 40 are formed with a blocking structure.

[0062] Furthermore, the outer wall of the rotating cover 30 and the inner wall of the fixed cover 40 are provided with corrugated blocking structures, such as... Figure 4 As shown, the protrusions of the two are staggered in the horizontal direction to control the movement of fluid entering between the rotating cover 30 and the fixed cover 40, and to suppress or prevent fluid containing particulate matter from entering the space where the wafer is located through the gap between the two and causing secondary pollution.

[0063] Figure 4 In the rotating cover 32, the outer side wall is provided with rotating cover protrusions 32A. There are multiple rotating cover protrusions 32A, which are arranged horizontally along the length of the rotating cover 32.

[0064] Further, the rotating shield protrusion 32A includes a rotating shield water-facing surface 32A-1 and a rotating shield connecting surface 32A-2. The rotating shield water-facing surface 32A-1 extends inward from the rotating shield peak point 32B away from the disk body 31, while the rotating shield connecting surface 32A-2 is located on the other side of the rotating shield peak point 32B and extends inward from the rotating shield peak point 32B. The rotating shield peak point 32B refers to the highest point of the outer wall of the rotating shield 30. It is understood that adjacent rotating shield peak points 32B may not be in the same plane, i.e., the heights of adjacent rotating shield peak points 32B may be different, to regulate the airflow between the rotating shield 30 and the fixed shield 40, preventing airflow disturbances from escaping from the front end of the protective assembly. In this invention, when describing the protective assembly, the terms "inner side" and "outer side" are relative to the centerline of the protective assembly; facing the centerline of the protective assembly is "inner side," and away from the centerline of the protective assembly is "outer side."

[0065] Furthermore, the inner wall of the fixed cover 40 is provided with a fixed cover protrusion 40A, which includes a fixed cover water-facing surface 40A-1 and a fixed cover connecting surface 40A-2. The fixed cover water-facing surface 40A-1 extends outward from the fixed cover peak point 40B toward the back plate 11, and the fixed cover connecting surface 40A-2 is located on the other side of the fixed cover peak point 40B and extends outward from the fixed cover peak point 40B. The fixed cover peak point 40B refers to the highest point of the inner wall of the fixed cover 40. It is understood that the heights of adjacent fixed cover peak points 40B can be different to adjust the airflow between the rotating cover 30 and the fixed cover 40.

[0066] Furthermore, the inner wall of the rear end of the fixing cover 40 is provided with a fixing cover conical surface 40C, which extends obliquely outward from the rear end of the fixing cover 40, such as... Figure 4 As shown.

[0067] Furthermore, the conical surface 40C of the fixed cover is connected to the water-facing surface 40A-1 of the rear fixed cover to form a continuous liquid guiding surface. Figure 4In the illustrated embodiment, the tilt angle of the fixed cover conical surface 40C is less than or equal to the tilt angle of the fixed cover water-facing surface 40A-1. Here, the tilt angle of the fixed cover conical surface 40C is the included angle (acute angle) formed relative to the centerline of the protective assembly. In some embodiments, the tilt angle of the fixed cover conical surface 40C is 15–45°, while the tilt angle of the fixed cover water-facing surface 40A-1 is 35–75°. In some embodiments, the tilt angle of the fixed cover conical surface 40C is less than the tilt angle of the fixed cover water-facing surface 40A-1. This arrangement allows for a larger length dimension corresponding to the fixed cover conical surface 40C, and the disk 31 of the rotating cover 30 is further away from the back plate 11 of the housing 10. This, to a certain extent, prevents liquid on the back plate 11 from re-adhering to the rotating cover 30, thereby improving the post-processing effect of the wafer.

[0068] In this invention, when describing the protective components, the terms "rear end" and "front end" are used relative to the back plate 11 of the housing 10; the direction closer to the back plate 11 is the "rear end"; correspondingly, the direction farther away from the back plate 11 is the "front end".

[0069] Figure 4 In this configuration, the fixed shield peak 40B is positioned opposite to the water-facing surface 32A-1 of the rotating shield, and the rotating shield peak 32B is positioned opposite to the water-facing surface 40A-1 of the fixed shield. This configuration effectively suppresses the movement of droplets entering between the rotating shield 30 and the fixed shield away from the backplate 11, thereby preventing droplets containing particulate matter from re-adhering to the wafer surface and ensuring the post-processing effect of the wafer.

[0070] During wafer post-processing, the rotating cover 30 and the wafer W rotate around the axis 22 of the clamping assembly 20 at the same angular velocity, that is, the angular velocity and rotation direction of the rotating cover 30 and the wafer W are the same; while the fixed cover 40 remains stationary. The liquid splashed off the wafer surface is received by the inner wall of the rotating cover 30, and then the liquid is discharged through the rotating cover drain port 33 and collects at the rear rotating cover peak point 32B. Figure 4 In this context, dashed lines with arrows are used to roughly indicate the direction of movement of fluids, droplets, or mist.

[0071] Under centrifugal force, the droplets that converge at the peak point 32B of the rotating shroud are thrown outward and received by the water-facing surface 40A-1 of the fixed shroud. Since the water-facing surface 40A-1 and the conical surface 40C of the fixed shroud form a continuous liquid guiding surface at the rear end of the fixed shroud 40, most of the liquid discharged from the drain port 33 of the rotating shroud moves towards the back plate 11 of the tank 10 along this liquid guiding surface, and moves under the action of gravity to the bottom of the fixed shroud 40, and is then discharged through the drain port 41 of the fixed shroud.

[0072] However, a small amount of liquid may move towards the front end of the protective assembly. Specifically, the small amount of liquid moves to the fixed hood peak 40B at the rear end and accumulates there to form a large droplet. Then, under the action of gravity, the large droplet falls onto the rotating hood's water-facing surface 32A-1. Since the rotating hood's water-facing surface 32A-1 is inclined towards the back plate 11 of the housing 10, the droplet will flow towards the rotating hood peak 32B and be centrifugally thrown back onto the fixed hood's water-facing surface 40A-1, thus creating a tendency to move towards the rear end of the protective assembly.

[0073] Figure 4 In this design, there are multiple rotating cover protrusions 32A and fixed cover protrusions 40A, which are arranged along the length of the protective assembly from the rear end to the front end to prevent trace amounts of liquid from moving towards the front end of the protective assembly. That is, through step-by-step blocking, droplets are prevented from moving towards the front end of the protective assembly through the gap between the rotating cover 30 and the fixed cover 40, and are instead directed towards the rear end of the protective assembly. This suppresses or prevents liquid containing particulate matter from moving to the front end of the protective assembly and then adhering to the wafer surface, thereby ensuring the post-processing effect of the wafer.

[0074] Preferably, the number of rotating cover protrusions 32A and fixed cover protrusions 40A is 2 to 4, which are arranged along the length of the protective assembly. It is understood that the number of rotating cover protrusions 32A and fixed cover protrusions 40A may also be other.

[0075] In this invention, the front end of the fixed cover 40 is provided with a groove 42, while the rotating cover 30 is correspondingly provided with an annular retaining ring 34, such as... Figure 4 As shown, the annular retaining ring 34 is positioned inside the groove 42.

[0076] Furthermore, the size and position of the annular retaining ring 34 are matched with the size and position of the groove 42, so that there is a gap between the two, which suppresses or prevents the annular retaining ring 34 from interfering with the groove 42 and affecting the cleaning and drying process of the wafer.

[0077] Figure 4 In the embodiment shown, the outer wall of the annular baffle 34 is a conical surface that extends outward from the front end of the annular baffle 34, so that the gap between the outer wall of the annular baffle 34 and the inner wall of the groove 42 gradually decreases from front to back. This allows the gas outside the single-end opening chamber to have a velocity component that enters the gap, thereby suppressing the turbulence caused by the relative rotation of the rotating cover 30 and the fixed cover 40, and suppressing or preventing the gas carrying sputtering droplets from escaping through the gap between the rotating cover 30 and the fixed cover 40 and adhering to the wafer surface.

[0078] In this invention, the number of fixed cover drain ports 41 located below the fixed cover 40 is multiple, such as... Figure 6As shown, the fixed covers 40 are spaced apart along their length, and the drain outlet 41 of the fixed cover is located at the position corresponding to the trough of the blocking structure, so that the droplets gather at the lower part of the fixed cover 40 for easy discharge. In this invention, the trough of the fixed cover 40 refers to the recess formed by adjacent fixed cover protrusions 40A. Figure 4 In the middle, the trough of the fixed cover 40 is the concave part formed by the water-facing surface 40A-1 of the fixed cover and the fixed cover connecting surface 40A-2 of the adjacent fixed cover protrusion 40A.

[0079] Figure 3 In the illustrated embodiment, the inner wall of the rotating shroud 30 has a centrifugal guiding function. When the rotating shroud 30 rotates, the airflow moves from the rotating shroud drain port 33 towards the back plate 11 of the housing 10. Therefore, it is necessary to control the number and size of the rotating shroud drain ports 33 to prevent excessive gas from being discharged through the rotating shroud drain ports 33 into the space between the rotating shroud 30 and the fixed shroud 40, and from escaping into the wafer space carrying sputtered droplets from the front end of the gap between the two. That is, the fluid delivery through the rotating shroud drain ports 33 needs to be matched with the exhaust structure configured in the wafer post-processing apparatus 100, so that the exhaust structure can discharge the fluid delivered through the rotating shroud drain ports 33 in a timely manner, thereby suppressing or preventing excessive fluid from moving towards the front end of the protective components.

[0080] Figure 7 This is a perspective view of a rotating cover 30 provided in an embodiment of the present invention. The number of rotating cover drain ports 33 is 2 to 20; preferably, the number of rotating cover drain ports 33 is 8 to 16.

[0081] Furthermore, the length of the rotary hood drain port 33 is 10-50 mm; preferably, the length of the rotary hood drain port 33 is 20-30 mm, so as to control the amount of fluid transported through the rotary hood drain port 33.

[0082] The width of the rotary hood drain port 33 is 1 to 6 mm; preferably, the width of the rotary hood drain port 33 is 2 to 4 mm, so as to control the fluid delivery through the rotary hood drain port 33 and match the fluid delivery with the exhaust structure configured in the wafer post-processing apparatus 100.

[0083] Figure 8 This is a schematic diagram of a fixed cover 40 provided in another embodiment of the present invention. The rotating cover drain port 33 is inclined, and the inner sidewall of the rotating cover drain port 33 is rounded to facilitate smooth fluid discharge. Specifically, the rotating cover drain port 33 extends outward from the front end to the rear end, and the fluid moves along the inner sidewall of the rotating cover 30 to the rear end and is discharged towards the back plate 11 of the housing 10 through the rotating cover drain port 33.

[0084] As one aspect of this embodiment, the tilt angle of the rotating hood drain port 33 relative to the horizontal plane is 25 to 55° (acute angle); preferably, the tilt angle of the rotating hood drain port 33 relative to the horizontal plane is 30 to 45°, so as to reasonably adjust the resistance of the fluid and control the amount of fluid transported through the rotating hood drain port 33.

[0085] In some embodiments, the tilt angles of adjacent rotating hood drain ports 33 are different, for example, the difference in tilt angles of adjacent rotating hood drain ports 33 is 5-25°, in order to adjust the fluid resistance so that the fluid delivery through the rotating hood drain ports 33 matches the exhaust volume configured in the wafer post-processing apparatus 100.

[0086] Meanwhile, the present invention also provides a wafer post-processing apparatus 110, the schematic diagram of which is shown below. Figure 9 As shown, the wafer post-processing apparatus 110 includes: a housing 10, a clamping assembly 20, and a protective assembly. A spray section (not shown) is disposed above the clamping assembly 20. The structure of the above components is similar to... Figure 3 The embodiments shown are largely the same and will not be described again here. The difference between the two embodiments is that the clamping assembly 20 horizontally clamps the wafer and drives the wafer to rotate.

[0087] Furthermore, a protective component is disposed on the outer periphery of the clamping component 20. The protective component includes a rotating cover 30 and a fixed cover 40. The rotating cover 30 is connected to the clamping component 20 and located on the outer periphery of the wafer to be processed. The fixed cover 40 is concentrically disposed on the outside of the rotating cover 30.

[0088] Figure 9 In the process, the rotating cover 30 and / or the fixed cover 40 are formed with a blocking structure to suppress or prevent centrifugally dispersed fluid from adhering back to the wafer surface.

[0089] Furthermore, the fixed cover 40 is vertically connected to the back plate 11 of the housing 10, and the back plate 11 is provided with a fluid outlet 12. The fluid outlet 12 can not only drain liquid, but also serve as an exhaust port. In order to ensure good discharge effect, there are multiple fluid outlets 12, which can be distributed and connected on the back plate 11 to discharge waste gas and waste liquid to the outside of the housing 10 in a timely manner.

[0090] Furthermore, the rotating cover 30 and / or the fixed cover 40 are configured with a corrugated blocking structure to prevent liquid or droplets from adhering back to the wafer surface through the gap between them. The technical solution of the corrugated blocking structure is similar to... Figure 3 As shown in the embodiment, the corrugated barrier structure can prevent gas carrying sputtering droplets from overflowing into the wafer space through the gap between the rotating cover 30 and the fixed cover 40, so as to obtain good wafer post-processing effect, which will not be described in detail here.

[0091] Meanwhile, the upper end of the protective component is also equipped with an annular retaining ring 34 and a groove 42 to suppress the turbulence caused by the relative rotation of the rotating cover 30 and the fixed cover 40, and to suppress or prevent the gas carrying sputtering droplets from escaping through the gap between the rotating cover 30 and the fixed cover 40 and adhering to the wafer surface.

[0092] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0093] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer post-processing apparatus, characterized in that, include: Box; The clamping assembly, located in the housing, vertically clamps and drives the wafer to rotate; A protective component is disposed on the outer periphery of the clamping component, comprising a rotating cover and a fixed cover. The rotating cover is connected to the clamping component and located on the outer periphery of the wafer to be processed, and the fixed cover is concentrically disposed on the outside of the rotating cover. The front end of the fixed cover is provided with a groove, and the rotating cover is correspondingly provided with an annular retaining ring. The rotating cover and the fixed cover are formed with a blocking structure to prevent centrifugally dispersed fluid from adhering back to the wafer surface; The fixed cover is vertically connected to the back plate of the box, and a drain port for the fixed cover is provided below it; the outer side wall of the rotating cover and the inner side wall of the fixed cover are provided with corrugated blocking structures, and the protrusions of the two are staggered in the horizontal direction. The rotating cover includes a disc body and a rotating cover body, the rotating cover body being disposed on the outer edge of the disc body; a rotating cover drain port is provided at the junction of the disc body and the rotating cover body; a rotating cover protrusion is provided on the outer side wall of the rotating cover body, the rotating cover protrusion including a rotating cover water-facing surface and a rotating cover connecting surface, the rotating cover water-facing surface extending inward from the peak point of the rotating cover away from the disc body, and the rotating cover connecting surface being located on the other side of the peak point of the rotating cover and extending inward from the peak point of the rotating cover; The drain port of the fixed cover is arranged through the circular direction of the fixed cover and is located at the position corresponding to the trough of the blocking structure, so that the droplets gather at the lower part of the fixed cover and are discharged.

2. The wafer post-processing apparatus as described in claim 1, characterized in that, The arc length of the drain port of the fixed cover is 10-30mm.

3. The wafer post-processing apparatus as described in claim 1, characterized in that, The fixed cover has multiple drainage ports, which are spaced apart along the length of the fixed cover.

4. The wafer post-processing apparatus as described in claim 1, characterized in that, The blocking structure includes multiple fixed cover protrusions and rotating cover protrusions, arranged from the rear end to the front end along the length of the protective assembly, to prevent liquid from moving towards the front end of the protective assembly.

5. The wafer post-processing apparatus as described in claim 4, characterized in that, The protrusions of the rotating cover are arranged horizontally along the length of the rotating cover body.

6. The wafer post-processing apparatus as described in claim 4, characterized in that, The fixed cover protrusion includes a water-facing surface and a connecting surface. The water-facing surface extends outward from the peak of the fixed cover toward the back plate, and the connecting surface is located on the other side of the peak of the fixed cover and extends outward from the peak of the fixed cover.

7. The wafer post-processing apparatus as described in claim 6, characterized in that, The inner wall of the rear end of the fixed cover is provided with a fixed cover conical surface, which extends obliquely outward from the rear end of the fixed cover.

8. The wafer post-processing apparatus as described in claim 7, characterized in that, The inclination angle of the conical surface of the fixed cover is 15 to 45°.

9. The wafer post-processing apparatus as described in claim 7, characterized in that, The inclination angle of the water-facing surface of the fixed cover is 35° to 75°.

10. The wafer post-processing apparatus as described in claim 9, characterized in that, The inclination angle of the conical surface of the fixed cover is smaller than the inclination angle of the water-facing surface of the fixed cover.

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