Wafer post-processing device

Abstract

The invention discloses a wafer post-processing device. The wafer post-processing device comprises a box body; the clamping assembly is arranged in the box body and can vertically clamp and drive the wafer to rotate; the protection assembly is arranged on the peripheral side of the clamping assembly and comprises a rotary cover and a fixed cover, the rotary cover is connected to the clamping assembly and located on the peripheral side of the wafer to be processed, and the fixed cover is concentrically arranged on the outer side of the rotary cover; a blocking structure is formed on the rotating cover and / or the fixed cover so as to restrain centrifugally scattered fluid from adhering to the surface of the wafer.

Description

[0001] This application is a divisional application of the invention patent application with application number 2023111901284, filed on September 15, 2023. TECHNICAL FIELD

[0002] The application belongs to the technical field of chemical mechanical polishing, and in particular, relates to a wafer post-processing device. BACKGROUND

[0003] The integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry to digitalization and intelligentization. Chips are the carriers of integrated circuits, and chip manufacturing involves integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, cutting and packaging, and testing processes. Among them, chemical mechanical polishing (CMP) is one of the five core processes in the wafer manufacturing process.

[0004] After chemical mechanical polishing, a large amount of particulate matter will be left on the surface of the wafer, so the wafer needs to be cleaned, dried, and other post-processing. Post-processing refers to the cleaning and drying of the wafer after CMP.

[0005] In the prior art, a schematic diagram of a wafer cleaning device 100' is shown in Figure 1 The wafer cleaning device 100' includes a box body 10', the inside of the box body 10' is provided with a clamping mechanism 20' for clamping the wafer vertically, the end of the clamping mechanism 20' is configured with a driving member (not shown) to drive the clamping mechanism 20' and the wafer W clamped thereby to rotate; the wafer cleaning device 100' further includes an inner baffle 30' and an outer baffle 40', wherein the inner baffle 30' rotates synchronously with the clamping mechanism 20', and the outer baffle 40' is arranged on the inner side wall of the box body 10' and located outside the inner baffle 30'.

[0006] When the wafer is cleaned, the clamping mechanism 20' drives the wafer to rotate around the central axis, and a spraying part (not shown) sprays cleaning liquid towards the wafer W. Under the action of centrifugal force, the liquid on the surface of the wafer will be thrown out and splashed on the inner baffle 30' to avoid the splashed liquid from the wafer contaminating the wafer in a large amount and in disorder in the box body 10'.

[0007] Since the inner baffle 30' rotates in the same direction as the wafer W, the outer baffle 40' located on the outer side remains stationary, the liquid splashed from the wafer is received by the inner wall of the inner baffle 30', the relative speed between the splashed liquid and the inner baffle 30' is small, the splashed liquid flows along the inner wall of the inner baffle 30', and then is discharged through the inner baffle liquid discharge port 31' (shown in Figure 2 ).

[0008] Due to the large relative speed between the inner baffle 30' and the outer baffle 40', the liquid droplets ejected from the inner baffle discharge port 31' will impact the inner wall of the outer baffle 40' at a large relative speed, thereby generating splashing droplets, which will be scattered between the inner baffle 30' and the outer baffle 40'. The mist formed inside the box 10' at least has the following adverse effects:

[0009] Firstly, the central part of the inner wall of the top of the outer baffle 40' will accumulate liquid, forming a large number of suspended droplets, as shown in Figure 2 The suspended droplets will extend to the front end of the outer baffle 40' and randomly drop on the outer wall of the inner baffle 30'; if the droplets drop on the outer wall of the stationary inner baffle 30', the droplets may drop on the surface of the wafer W through the front end of the top of the inner baffle 30', thereby affecting the cleaning effect of the wafer;

[0010] Furthermore, the splashing droplets between the inner baffle 30' and the outer baffle 40' will move to the right along with the airflow to the entrance of the gap between the inner baffle 30' and the outer baffle 40', and the splashing droplets will continuously fly out from the entrance and reach the space where the wafer is located. The splashing droplets containing particulate matter may adhere to the surface of the wafer, thereby affecting the cleaning effect of the wafer. SUMMARY

[0011] The embodiment of the present application provides a wafer post-processing device, which aims to at least solve one of the technical problems existing in the prior art.

[0012] The first aspect of the embodiment of the present application provides a wafer post-processing device, which comprises:

[0013] a box;

[0014] a clamping assembly arranged in the box, which can vertically clamp and drive the wafer to rotate;

[0015] a protection assembly arranged on the outer periphery of the clamping assembly, which comprises a rotating cover and a fixed cover, the rotating cover is connected to the clamping assembly and located on the outer periphery of the wafer to be processed, and the fixed cover is concentrically arranged on the outer side of the rotating cover;

[0016] The rotating cover and / or the fixed cover are formed with a blocking structure to inhibit the centrifugal flying fluid from adhering to the surface of the wafer.

[0017] In one embodiment, the clamping assembly comprises a clamping disc and a rotating shaft, the clamping disc is connected to the rotating shaft; the rotating cover is fixed to the rotating shaft to rotate synchronously with the clamping disc.

[0018] In one embodiment, the fixed cover is vertically connected to the back plate of the box, and a fixed cover discharge port is arranged below the fixed cover.

[0019] In one embodiment, the outer side wall of the rotating cover and the inner side wall of the fixed cover are provided with corrugated blocking structures, the protrusions of which are staggered in the horizontal direction.

[0020] In one embodiment, the rotating cover comprises a disc body and a rotating cover body, the rotating cover body being arranged at the outer edge of the disc body; the intersection of the disc body and the rotating cover body is provided with a rotating cover liquid outlet.

[0021] In one embodiment, the outer side wall of the rotating cover body is provided with a rotating cover protrusion, the rotating cover protrusion comprising a rotating cover water-facing surface and a rotating cover connecting surface, the rotating cover water-facing surface extending inward from the rotating cover peak point away from the disc body, and the rotating cover connecting surface being located on the other side of the rotating cover peak point and extending inward from the rotating cover peak point.

[0022] In one embodiment, the inner side wall of the fixed cover is provided with a fixed cover protrusion, the fixed cover protrusion comprising a fixed cover water-facing surface and a fixed cover connecting surface, the fixed cover water-facing surface extending outward from the fixed cover peak point toward the back plate, and the fixed cover connecting surface being located on the other side of the fixed cover peak point and extending outward from the fixed cover peak point.

[0023] In one embodiment, the fixed cover peak point is arranged opposite to the rotating cover water-facing surface, and the rotating cover peak point is arranged opposite to the fixed cover water-facing surface.

[0024] In one embodiment, the inner side wall of the rear end of the fixed cover is provided with a fixed cover tapered surface, which is arranged outwardly inclined from the rear end of the fixed cover; the fixed cover tapered surface is connected with the fixed cover water-facing surface of the rear end, and the inclination angle of the fixed cover tapered surface is less than or equal to the inclination angle of the fixed cover water-facing surface.

[0025] In one embodiment, the front end of the fixed cover is provided with a groove, the outer peripheral side of the rotating cover is provided with an annular retaining ring, and the annular retaining ring is arranged in the groove in a clearance; the size and arrangement position of the annular retaining ring are matched with the size and arrangement position of the groove.

[0026] In one embodiment, the outer side wall of the annular retaining ring is a tapered surface, which extends outward from the front end of the annular retaining ring.

[0027] In one embodiment, the number of the fixed cover liquid outlets is multiple, which are arranged at intervals along the length direction of the fixed cover, and the fixed cover liquid outlets are located at the corresponding positions of the troughs of the blocking structures.

[0028] The second aspect of the embodiment of the present application provides a wafer post-processing device, in which a wafer to be processed is arranged horizontally, which comprises:

[0029] a box body;

[0030] A clamping assembly is arranged in the box and capable of horizontally clamping and rotating the wafer;

[0031] A protection assembly is arranged at the outer circumferential side of the clamping assembly, which comprises a rotating cover and a fixed cover, the rotating cover is connected to the clamping assembly and located at the outer circumferential side of the wafer to be processed, and the fixed cover is concentrically arranged at the outer side of the rotating cover.

[0032] The rotating cover and / or the fixed cover are formed with a blocking structure to inhibit the centrifugal flying fluid from splashing back to the wafer surface.

[0033] In one embodiment, the fixed cover is vertically connected to the back plate of the box, and the back plate is provided with a fluid discharge port.

[0034] The beneficial effects of the present application include:

[0035] a. The outer side wall of the rotating cover and the inner side wall of the fixed cover are provided with a corrugated blocking structure, so that the liquid droplets move towards the direction of the back plate, and the liquid droplets are inhibited from moving to the front end of the protection assembly, avoiding the liquid droplets accumulated at the front end of the rotating cover from falling and affecting the cleaning and drying effect of the wafer;

[0036] b. The number and size of the liquid discharge ports of the rotating cover are reasonably arranged to inhibit the disturbance caused by the relative rotation of the rotating cover and the fixed cover, and to inhibit the gas carrying the sputtering mist from escaping through the gap between the rotating cover and the fixed cover and adhering to the wafer surface;

[0037] c. The protection assembly can be applied to the wafer vertical cleaning device and the wafer horizontal cleaning device, which can control the movement of the fluid to inhibit the centrifugal flying fluid from splashing back to the wafer surface, and ensure the post-processing effect of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0038] The advantages of the present application will become more apparent and more easily understood from the following detailed description, which is only illustrative and not restrictive of the scope of the present application, and in which:

[0039] Figure 1 is a schematic diagram of a wafer cleaning device in the prior art;

[0040] Figure 2 is Figure 1 is a partial enlarged view of A in FIG. 1;

[0041] Figure 3 is a schematic diagram of a wafer post-processing device provided by an embodiment of the present application;

[0042] Figure 4 is Figure 3 is a partial enlarged view of B in FIG. 2;

[0043] Figure 5is a schematic view of a rotating cover provided by an embodiment of the present application;

[0044] Figure 6 is a schematic view of a fixed cover provided by an embodiment of the present application;

[0045] Figure 7 is a perspective view of a rotating cover provided by an embodiment of the present application;

[0046] Figure 8 is a schematic view of a fixed cover provided by another embodiment of the present application;

[0047] Figure 9 is a schematic view of a wafer post-processing device provided by another embodiment of the present application. DETAILED DESCRIPTION

[0048] The technical solutions of the present application will be described in detail below with reference to specific embodiments and the accompanying drawings. The embodiments described herein are specific and concrete embodiments of the present application, which are used to illustrate the concept of the present application; all the descriptions are explanatory and exemplary, and should not be understood as limiting the embodiments of the present application and the protection scope of the present application. In addition to the embodiments described herein, those skilled in the art can also employ other technical solutions that are obvious based on the content disclosed in the claims and the specification of the present application, which include technical solutions that make any obvious substitutions and modifications to the embodiments described herein.

[0049] The drawings of the present specification are schematic views, which assist in illustrating the concept of the present application, and schematically represent the shape of each part and the relationship between the parts. It should be understood that, in order to clearly show the structure of each component of the embodiments of the present application, the drawings are not drawn according to the same scale, and the same reference numerals are used to represent the same parts in the drawings.

[0050] In this invention, a wafer (W) is also called a substrate, with the same meaning and practical function. The term "comprising" and similar expressions should be understood as open-ended inclusion, i.e., "including but not limited to". The term "based on" should be understood as "at least partially based on". The term "one embodiment" or "this embodiment" should be understood as "at least one embodiment". The terms "first", "second", etc., may refer to different or the same objects and are used only to distinguish the objects referred to, without implying a specific spatial order, temporal order, order of importance, etc., of the objects referred to. In some embodiments, values, processes, selected items, determined items, devices, apparatuses, means, parts, components, etc., are referred to as "best", "lowest", "highest", "minimum", "maximum", etc. It should be understood that such descriptions are intended to indicate that a selection can be made from a number of available functional options, and that such selection is not necessarily better, lower, higher, smaller, larger, or otherwise preferred than other options in any other respect or in all respects.

[0051] Figure 3 This is a schematic diagram of a wafer post-processing apparatus 100 provided in an embodiment of the present invention. The wafer post-processing apparatus 100 includes:

[0052] The housing 10 has an opening (not shown) on its top, through which a robotic arm can pick up and place wafers to be processed.

[0053] A clamping assembly 20 is disposed in the housing 10, which can vertically clamp and drive the wafer to rotate. Specifically, the clamping assembly 20 includes a clamping disk 21 and a rotating shaft 22. The rotating shaft 22 is disposed perpendicular to the back plate 11 of the housing 10, and the clamping disk 21 is disposed at the end of the rotating shaft 22. The clamping disk 21 has a circular disk-shaped structure, and its outer periphery is provided with claws to clamp the wafer to be processed. The other end of the rotating shaft 22 is provided with a drive motor (not shown) to drive the clamping disk 21 and the wafer it clamps to rotate synchronously.

[0054] The wafer post-processing apparatus 100 also includes a spraying section ( Figure 3 (Not shown), which is disposed outside the clamping assembly 20 to spray fluid, such as cleaning fluid, nitrogen and / or IPA vapor, toward the rotating wafer to treat the surface of the wafer and obtain a wafer with a cleanliness level that meets the requirements.

[0055] Figure 3 In the illustrated embodiment, the wafer post-processing apparatus 100 further includes a protective component disposed in the housing 10 and located on the outer periphery of the clamping component 20, to control the fluid centrifugally ejected from the wafer surface and to suppress or prevent the fluid from splashing back onto the wafer surface in a disorderly manner.

[0056] Further, the protection assembly comprises a rotating cover 30 and a fixed cover 40; wherein the rotating cover 30 is arranged at the outer circumferential side of the clamping disc 21, and the rotating cover 30 is fixed to the rotating shaft 22 of the clamping assembly 20; the fixed cover 40 is concentrically arranged at the outer side of the rotating cover 30, and specifically, the fixed cover 40 is vertically arranged at the back plate 11 of the box body 10.

[0057] In the present application, the fixed cover 40 is connected to the box body 10, that is, the fixed cover 40 is stationary; while the rotating cover 30 rotates synchronously with the clamping disc 21; in order to avoid interference between the rotating cover 30 and the fixed cover 40, a gap is arranged between the rotating cover 30 and the fixed cover 40, as shown in Figure 4 .

[0058] Figure 5 is a schematic view of the rotating cover 30 provided by an embodiment of the present application, and the rotating cover 30 comprises a disc body 31 and a rotating cover body 32; wherein the rotating cover body 32 is arranged at the outer edge of the disc body 31. Specifically, the rotating cover body 32 extends from the outer edge of the disc body 31 to the front end, so as to form a single-end opening cavity which covers the clamping disc 21.

[0059] Further, the intersection between the disc body 31 and the rotating cover body 32 is provided with a rotating cover liquid discharge port 33. During wafer cleaning, the fluid, such as droplets, falling into the single-end opening cavity can move towards the rear end of the rotating cover 30 through the rotating cover liquid discharge port 33 and be discharged to the outside of the single-end opening cavity.

[0060] Figure 6 is a schematic view of the fixed cover 40 provided by an embodiment of the present application, and the fixed cover 40 is a ring structure, and the lower portion of the fixed cover 40 is provided with a fixed cover liquid discharge port 41 for discharging the fluid falling into the inside of the fixed cover 40. The fixed cover liquid discharge port 41 is arranged through along the circumferential direction of the fixed cover 40; in some embodiments, the arc length of the fixed cover liquid discharge port 41 is 10-30 mm, and the fixed cover liquid discharge port 41 is arranged in the length direction of the fixed cover 40. During wafer post-processing, the fixed cover 40 is relatively stationary, and the droplets entering the fixed cover 40 will gather at the bottom of the inner side wall of the fixed cover 40 under the action of gravity, and the fixed cover liquid discharge port 41 arranged below can timely discharge the liquid.

[0061] Figure 3 In the embodiment shown, in order to inhibit or prevent the centrifugally scattered fluid from re-staining the wafer surface and affecting the cleaning effect of the wafer, the rotating cover 30 and / or the fixed cover 40 is formed with a blocking structure.

[0062] Further, the outer side wall of the rotating cover 30 and the inner side wall of the fixed cover 40 are provided with a corrugated blocking structure, as shown in Figure 4 , the protrusions of the two are arranged staggered along the horizontal direction, so as to control the movement of the fluid entering between the rotating cover 30 and the fixed cover 40, and inhibit or prevent the fluid containing particles from entering the space where the wafer is located through the gap between the two, thereby causing secondary pollution.

[0063] Figure 4 In particular, the outer side wall of the rotating cover 32 is provided with rotating cover protrusions 32A, and the rotating cover protrusions 32A are horizontally arranged along the length direction of the rotating cover 32.

[0064] Further, the rotating cover protrusions 32A include rotating cover water-facing surfaces 32A-1 and rotating cover connecting surfaces 32A-2. The rotating cover water-facing surfaces 32A-1 extend inward from the rotating cover peak points 32B away from the disc 31, and the rotating cover connecting surfaces 32A-2 are located on the other side of the rotating cover peak points 32B and extend inward from the rotating cover peak points 32B. The rotating cover peak points 32B refer to the high points of the outer side wall of the rotating cover 30. It can be understood that adjacent rotating cover peak points 32B can not be in the same plane, that is, the heights of adjacent rotating cover peak points 32B can be different, so as to adjust the air flow between the rotating cover 30 and the fixed cover 40, and prevent the air flow disturbance from escaping from the front end of the protection assembly. In the present application, “inward” and “outward” are relative to the center line of the protection assembly; toward the center line of the protection assembly, it is toward “inward”; away from the center line of the protection assembly, it is toward “outward”.

[0065] Further, the inner side wall of the fixed cover 40 is provided with fixed cover protrusions 40A, and the fixed cover protrusions 40A include fixed cover water-facing surfaces 40A-1 and fixed cover connecting surfaces 40A-2. The fixed cover water-facing surfaces 40A-1 extend outward from the fixed cover peak points 40B toward the back plate 11, and the fixed cover connecting surfaces 40A-2 are located on the other side of the fixed cover peak points 40B and extend outward from the fixed cover peak points 40B. The fixed cover peak points 40B refer to the high points of the inner side wall of the fixed cover 40. It can be understood that the heights of adjacent fixed cover peak points 40B can be different, so as to adjust the air flow between the rotating cover 30 and the fixed cover 40.

[0066] Further, the inner side wall of the rear end of the fixed cover 40 is provided with a fixed cover tapered surface 40C, which extends outwardly and obliquely from the rear end of the fixed cover 40, as shown in FIG. 4. Figure 4

[0067] Further, the fixed cover tapered surface 40C is connected with the fixed cover water-facing surface 40A-1 of the rear end to form a continuous liquid guiding surface. Figure 4 ​In the illustrated embodiment, the angle of inclination of the conical surface 40C of the stationary shield is less than or equal to the angle of inclination of the water-facing surface 40A-1 of the stationary shield. Here, the angle of inclination of the conical surface 40C of the stationary shield is the included angle (taking the acute angle) formed with respect to the center line of the protection assembly. In some embodiments, the angle of inclination of the conical surface 40C of the stationary shield is 15-45°, and the angle of inclination of the water-facing surface 40A-1 of the stationary shield is 35-75°. In some embodiments, the angle of inclination of the conical surface 40C of the stationary shield is less than the angle of inclination of the water-facing surface 40A-1 of the stationary shield. In this way, the length of the conical surface 40C of the stationary shield can be made relatively large, and the disc body 31 of the rotating shield 30 can be made to be relatively far away from the back plate 11 of the box body 10, which to some extent avoids the liquid on the back plate 11 from re-attaching to the rotating shield 30, thereby improving the post-processing effect of the wafer.

[0068] In the present application, when describing the protection assembly, "rear end" and "front end" are used with respect to the back plate 11 of the box body 10; the direction close to the back plate 11 is the "rear end"; correspondingly, the direction away from the back plate 11 is the "front end".

[0069] Figure 4 In the present application, the peak point 40B of the stationary shield is arranged opposite to the water-facing surface 32A-1 of the rotating shield, and the peak point 32B of the rotating shield is arranged opposite to the water-facing surface 40A-1 of the stationary shield. In this way, the movement of the liquid droplets entering between the rotating shield 30 and the stationary shield 40 away from the back plate 11 can be effectively inhibited, and the liquid droplets containing particles re-attaching to the wafer surface can be avoided, thereby ensuring the post-processing effect of the wafer.

[0070] During the post-processing of the wafer, the rotating shield 30 and the wafer W rotate around the rotating shaft 22 of the clamping assembly 20 at the same angular velocity, that is, the angular velocity and the rotating direction of the rotating shield 30 and the wafer W are the same; and the stationary shield 40 remains stationary. The liquid thrown off from the wafer surface is received by the inner side wall of the rotating shield 30, and then the liquid is discharged through the rotating shield liquid discharge port 33 and gathered at the rear end of the peak point 32B of the rotating shield. Figure 4 In the present application, the arrowed dashed line is used to generally indicate the movement direction of the fluid, liquid droplets or mist droplets.

[0071] Under the action of centrifugal force, the liquid droplets gathered at the peak point 32B of the rotating shield are thrown outward and received by the water-facing surface 40A-1 of the stationary shield. Since the water-facing surface 40A-1 at the rear end of the stationary shield and the conical surface 40C of the stationary shield form a continuous liquid guide surface, most of the liquid discharged from the rotating shield liquid discharge port 33 moves along the liquid guide surface towards the back plate 11 of the box body 10, and under the action of gravity, moves to the lower side of the stationary shield 40, and is then discharged through the stationary shield liquid discharge port 41.

[0072] However, a small amount of liquid moves towards the front end of the protection assembly. Specifically, the small amount of liquid moves to the peak point 40B of the fixed cover at the rear end and accumulates to form a large droplet; then, under the action of gravity, the large droplet falls to the water-facing surface 32A-1 of the rotating cover, and since the water-facing surface 32A-1 of the rotating cover is inclined towards the back plate 11 of the box 10, the droplet will flow towards the peak point 32B of the rotating cover and be centrifugally thrown to the water-facing surface 40A-1 of the fixed cover again, thereby forming a tendency to move towards the rear end of the protection assembly.

[0073] Figure 4 In the present application, the number of the rotating cover protrusions 32A and the fixed cover protrusions 40A is multiple, which are arranged from the rear end to the front end along the length direction of the protection assembly to prevent the small amount of liquid from moving towards the front end of the protection assembly. That is, by step-by-step blocking, the droplet is prevented from moving towards the front end of the protection assembly through the gap between the rotating cover 30 and the fixed cover 40, and the droplet is caused to move towards the rear end of the protection assembly, thereby inhibiting or preventing the liquid containing particles from moving to the front end of the protection assembly and back to the surface of the wafer, and further ensuring the post-processing effect of the wafer.

[0074] Preferably, the number of the rotating cover protrusions 32A and the fixed cover protrusions 40A is 2-4, which are arranged along the length direction of the protection assembly. It can be understood that the number of the rotating cover protrusions 32A and the fixed cover protrusions 40A can also be other numbers.

[0075] In the present application, the front end of the fixed cover 40 is provided with a groove 42, and the rotating cover 30 is correspondingly provided with an annular stop ring 34, as shown in Figure 4 The annular stop ring 34 is arranged in the interior of the groove 42 with a gap.

[0076] Further, the size and arrangement position of the annular stop ring 34 are matched with the size and arrangement position of the groove 42, so that there is a gap between them, thereby inhibiting or preventing the annular stop ring 34 from interfering with the groove 42 to affect the cleaning and drying treatment of the wafer.

[0077] Figure 4 In the embodiment shown, the outer side wall of the annular stop ring 34 is a tapered surface, which extends outward from the front end of the annular stop ring 34, so that the gap between the outer side wall of the annular stop ring 34 and the inner side wall of the groove 42 gradually decreases from front to back, so that the gas outside the single-end opening chamber has a speed component to enter the gap, thereby inhibiting the disturbance caused by the relative rotation of the rotating cover 30 and the fixed cover 40, and inhibiting or preventing the gas carrying the sputtering mist from escaping through the gap between the rotating cover 30 and the fixed cover 40 to adhere to the surface of the wafer.

[0078] In the present application, the number of the fixed cover liquid discharge ports 41 located below the fixed cover 40 is multiple, as shown in Figure 6As shown, the fixed cover liquid discharge ports 41 are arranged at intervals along the length direction of the fixed cover 40, and the fixed cover liquid discharge ports 41 are located at positions corresponding to the wave troughs of the blocking structure, so that the liquid droplets are gathered at the low places of the fixed cover 40 and are conveniently discharged. In the present application, the wave trough of the fixed cover 40 refers to the concave part formed by the adjacent fixed cover protrusions 40A. Figure 4 In the present application, the wave trough of the fixed cover 40 refers to the concave part formed by the fixed cover water-facing surface 40A-1 and the fixed cover joint surface 40A-2 of the adjacent fixed cover protrusion 40A.

[0079] Figure 3 In the embodiment shown, the inner side wall of the rotating cover 30 has a centrifugal guiding effect, and when the rotating cover 30 rotates, the gas flow will move from the rotating cover liquid discharge port 33 to the back plate 11 of the box body 10. Therefore, the number and size of the rotating cover liquid discharge port 33 need to be controlled to avoid excessive gas being discharged through the rotating cover liquid discharge port 33 to the space between the rotating cover 30 and the fixed cover 40, and the sputtering mist droplets being carried from the front end of the gap between the two to the space where the wafer is located. That is, the amount of fluid transported through the rotating cover liquid discharge port 33 needs to be matched with the exhaust structure configured by the wafer post-processing device 100, so that the exhaust structure can timely exhaust the fluid transported through the rotating cover liquid discharge port 33, so as to inhibit or prevent excessive fluid from moving towards the front end of the protection assembly.

[0080] Figure 7 is a perspective view of the rotating cover 30 provided by an embodiment of the present application, and the number of rotating cover liquid discharge ports 33 is 2-20; preferably, the number of rotating cover liquid discharge ports 33 is 8-16.

[0081] Further, the length of the rotating cover liquid discharge port 33 is 10-50 mm; preferably, the length of the rotating cover liquid discharge port 33 is 20-30 mm, so as to control the amount of fluid transported through the rotating cover liquid discharge port 33.

[0082] The width of the rotating cover liquid discharge port 33 is 1-6 mm; preferably, the width of the rotating cover liquid discharge port 33 is 2-4 mm, so as to control the amount of fluid transported through the rotating cover liquid discharge port 33, so that the amount of fluid transported is matched with the exhaust structure configured by the wafer post-processing device 100.

[0083] Figure 8 is a schematic view of the fixed cover 40 provided by another embodiment of the present application, and the rotating cover liquid discharge port 33 is arranged obliquely, and the inner side wall of the rotating cover liquid discharge port 33 is arc-shaped, so as to facilitate smooth discharge of the fluid. Specifically, the rotating cover liquid discharge port 33 extends obliquely outward from the front end to the rear end, the fluid moves along the inner side wall of the rotating cover 30 to the rear end, and is discharged towards the back plate 11 of the box body 10 through the rotating cover liquid discharge port 33.

[0084] As an aspect of the embodiment, the inclination angle of the rotating cover liquid discharge port 33 relative to the horizontal plane is 25-55° (taking the acute angle); preferably, the inclination angle of the rotating cover liquid discharge port 33 relative to the horizontal plane is 30-45°, so as to reasonably adjust the resistance of the fluid and control the fluid delivery amount via the rotating cover liquid discharge port 33.

[0085] In some embodiments, the inclination angles of adjacent rotating cover liquid discharge ports 33 are different, for example, the difference between the inclination angles of adjacent rotating cover liquid discharge ports 33 is 5-25°, so as to adjust the resistance of the fluid and make the fluid delivery amount via the rotating cover liquid discharge port 33 match the exhaust amount configured by the wafer post-processing device 100.

[0086] Meanwhile, the present application also provides a wafer post-processing device 110, a schematic diagram of which is shown in Figure 9 The wafer post-processing device 110 includes a box body 10, a clamping assembly 20, and a protection assembly, and a spraying part (not shown) is arranged above the clamping assembly 20. The structures of the above components are substantially the same as those of the embodiment shown in Figure 3 and will not be described here again. The difference between the two embodiments is that the clamping assembly 20 horizontally clamps the wafer and drives the wafer to rotate.

[0087] Further, the protection assembly is arranged on the outer circumferential side of the clamping assembly 20, and the protection assembly includes a rotating cover 30 and a fixed cover 40. The rotating cover 30 is connected to the clamping assembly 20 and located on the outer circumferential side of the wafer to be processed. The fixed cover 40 is concentrically arranged on the outside of the rotating cover 30.

[0088] Figure 9 Further, the rotating cover 30 and / or the fixed cover 40 are formed with a blocking structure to inhibit or prevent the centrifugally scattered fluid from re-staining the wafer surface.

[0089] Further, the fixed cover 40 is vertically connected to the back plate 11 of the box body 10, and the back plate 11 is configured with a fluid discharge port 12. The fluid discharge port 12 can not only discharge liquid but also have the function of discharging exhaust gas. In order to ensure good discharge effect, the number of fluid discharge ports 12 is multiple, which can be dispersedly and penetratingly arranged on the back plate 11, so as to timely discharge the exhaust gas and waste liquid to the outside of the box body 10.

[0090] Further, the rotating cover 30 and / or the fixed cover 40 are configured with a corrugated blocking structure to inhibit liquid or mist from re-staining the wafer surface via the gap between the two. The technical solution of the corrugated blocking structure is the same as that of the embodiment shown in Figure 3 The corrugated blocking structure can avoid the gas carrying the sputtering mist in the gap between the rotating cover 30 and the fixed cover 40 from overflowing to the space where the wafer is located, so as to obtain good wafer post-processing effect, and will not be described here again.

[0091] At the same time, the upper end of the protection assembly is also provided with an annular stop ring 34 and a groove 42 to inhibit the turbulence caused by the relative rotation of the rotating cover 30 and the fixed cover 40, and to inhibit or prevent the gas carrying the sputtering mist from escaping through the gap between the rotating cover 30 and the fixed cover 40 to adhere to the wafer surface.

[0092] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be appropriately combined in any one or more embodiments or examples.

[0093] Although the embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made thereto without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A wafer post-processing apparatus, characterized in that, include: Box; The clamping assembly, located in the housing, vertically clamps and drives the wafer to rotate; A protective component is disposed on the outer periphery of the clamping component, comprising a rotating cover and a fixed cover. The rotating cover is connected to the clamping component and located on the outer periphery of the wafer to be processed, and the fixed cover is concentrically disposed on the outside of the rotating cover. The front end of the fixed cover is provided with a groove, and the rotating cover is correspondingly provided with an annular retaining ring. The rotating cover and the fixed cover are formed with a blocking structure to prevent centrifugally dispersed fluid from adhering back to the wafer surface; The fixed cover is vertically connected to the back plate of the box, and a drain port for the fixed cover is provided below it; the outer side wall of the rotating cover and the inner side wall of the fixed cover are provided with corrugated blocking structures, and the protrusions of the two are staggered in the horizontal direction. The rotating cover includes a disc body and a rotating cover body, with the rotating cover body disposed on the outer edge of the disc body; multiple rotating cover drain ports are provided at the junction of the disc body and the rotating cover body; a rotating cover protrusion is provided on the outer side wall of the rotating cover body, the rotating cover protrusion including a rotating cover water-facing surface and a rotating cover connecting surface, the rotating cover water-facing surface extending inward from the peak of the rotating cover away from the disc body, and the rotating cover connecting surface located on the other side of the peak of the rotating cover and extending inward from the peak of the rotating cover; The heights of adjacent rotating hood peaks differ to regulate the airflow between the rotating and fixed hoods, preventing airflow disturbances between them from escaping from the front of the protective assembly.

2. The wafer post-processing apparatus as described in claim 1, characterized in that, The water-facing surface and the conical surface of the fixed cover at the rear end of the fixed cover form a continuous liquid guiding surface. The liquid discharged from the drain port of the rotating cover moves towards the back plate of the box along the liquid guiding surface and moves to the bottom of the fixed cover under the action of gravity, and then is discharged through the drain port of the fixed cover.

3. The wafer post-processing apparatus as described in claim 2, characterized in that, The fluid delivery rate through the rotary hood drain port is matched with the exhaust structure configured in the wafer post-processing unit, so that the exhaust structure can promptly discharge the fluid delivered through the rotary hood drain port to suppress or prevent the fluid from moving toward the front end of the protective component.

4. The wafer post-processing apparatus as described in claim 3, characterized in that, The number of drain ports of the rotating hood is 8 to 16.

5. The wafer post-processing apparatus as described in claim 3, characterized in that, The length of the rotary hood drain port is 20-30 mm to control the fluid delivery rate through the rotary hood drain port.

6. The wafer post-processing apparatus as described in claim 1, characterized in that, The drain port of the rotating hood is inclined, and the inner sidewall of the drain port is rounded to allow the fluid to drain smoothly.

7. The wafer post-processing apparatus as described in claim 6, characterized in that, The tilt angle of the rotary hood drain port relative to the horizontal plane is 30-45° to adjust the fluid resistance and control the fluid delivery through the rotary hood drain port.

8. The wafer post-processing apparatus as described in claim 1, characterized in that, The difference in tilt angle between adjacent rotary hood drain ports is 5-25° to adjust the fluid resistance so that the fluid delivery through the rotary hood drain ports matches the exhaust volume configured in the wafer post-processing unit.

9. The wafer post-processing apparatus as described in claim 1, characterized in that, The outer wall of the annular baffle is a conical surface that extends outward from the front end of the annular baffle, so that the gap between the outer wall of the annular baffle and the inner wall of the groove gradually decreases from front to back. This allows the gas outside the single-end open mouth chamber to have a velocity component that enters the gap, thereby suppressing the turbulence caused by the relative rotation of the rotating cover and the fixed cover.

10. The wafer post-processing apparatus as claimed in claim 1, characterized in that, The blocking structure includes multiple fixed cover protrusions and rotating cover protrusions, arranged from the rear end to the front end along the length of the protective assembly, to prevent liquid from moving towards the front end of the protective assembly.

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