Wafer arrangement detection device

Abstract

The invention discloses a wafer arrangement detection device, which effectively facilitates the placement of wafer workpieces, and comprises a support plate, the upper side of the support plate is provided with a rotatable placement rack for placing the workpieces, the rear side of the placement rack is provided with a detection mechanism for detecting the concentricity of wafers, and the wafer arrangement detection device is arranged on the support plate. A power disc is arranged in the middle of the supporting plate, a connecting mechanism is arranged between the power disc and the containing frame, the containing frame is detachably connected with the power disc through the connecting mechanism, and an adjusting mechanism is arranged between the containing frame and the supporting plate. According to the wafer placement rack, the placement position of a wafer can be conveniently detected, the detection precision of the wafer position is improved, a worker can conveniently and automatically adjust the pitching angle of the placement rack, the purpose of conveniently placing a wafer workpiece is achieved, and the detection position can be conveniently adjusted.

Description

Technical Field

[0001] This invention belongs to the field of wafer inspection technology and relates to a wafer alignment inspection device. Background Technology

[0002] A silicon wafer is a wafer used to fabricate silicon semiconductor circuits. It is made by dissolving high-purity polycrystalline silicon, doping it with silicon seed crystals, and then slowly pulling it out to form a cylindrical monocrystalline silicon ingot. Afterward, the silicon ingot is ground, polished, and sliced ​​to form a silicon wafer. Once the wafer is produced, its performance and quality need to be tested to determine if it is up to standard.

[0003] In existing technologies, operators typically place the wafer cassette horizontally into the wafer inspection device. However, during placement, the wafers in the cassette may not be properly positioned, resulting in uneven placement and easy falling of the wafers. This is inconvenient for operators and affects the accuracy of the inspection. Therefore, a wafer alignment inspection device is needed to solve these problems. Summary of the Invention

[0004] To address the above problems, this invention proposes a wafer alignment detection device, which effectively solves the problems in the prior art.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] A wafer alignment inspection device includes a support plate, a rotatable placement rack for placing workpieces on the upper side of the support plate, an inspection mechanism for inspecting the concentricity of wafers on the rear side of the placement rack, a lower side of the inspection mechanism being fixedly connected to the support plate, a rotatable power disk in the middle of the support plate, a connecting mechanism between the power disk and the placement rack, the placement rack being detachably connected to the power disk via the connecting mechanism, and an adjustment mechanism for adjusting the angle of the placement rack between the placement rack and the support plate.

[0007] Preferably, a power groove is provided on the inner side of the middle part of the support plate, and a motor is provided inside the power groove. The output shaft of the motor is fixedly connected to the axis of the power disk.

[0008] Preferably, the detection mechanism includes a vertical rod, a horizontal rod, and a detector. The upper and lower sides of the vertical rod are fixedly connected to the horizontal rod and the support plate, respectively, and the detector is fixedly connected to the lower side of the middle part of the horizontal rod.

[0009] Preferably, the detector is a laser detector, including a laser generator and a laser receiver. The laser generator is fixedly connected to the lower side of the horizontal bar, and the laser receiver is fixedly connected to the upper side of the support plate.

[0010] Preferably, the connecting mechanism includes a fixing block and a fixing sleeve. The fixing block is fixedly connected to the bottom of the placement frame, the fixing sleeve is connected to the upper side of the power plate, a limiting round head is fixedly connected to the lower side of the fixing block, a limiting groove is formed between the fixing block and the limiting round head, and a limiting rod that can move back and forth is provided in the middle of the fixing sleeve. The limiting rod and the limiting groove cooperate with each other to form a limiting structure between the fixing block and the fixing sleeve.

[0011] Preferably, the fixed sleeve has a sliding groove inside, a sliding block is fixedly connected to the middle of the limiting rod, a return spring is provided on the side of the sliding block away from the fixed block, the end of the return spring away from the sliding block abuts against the inner wall of the sliding groove, and an operating handle is fixedly connected to the side of the limiting rod away from the fixed block.

[0012] Preferably, the lower side of the fixed sleeve is fixedly connected with multiple arc-shaped rods, the inside of the power disk is provided with multiple arc-shaped sleeves, each arc-shaped rod is slidably connected inside the corresponding arc-shaped sleeve, the upper side of the power disk is provided with a reset groove, the inside of the reset groove is provided with a reset spring, and the upper and lower ends of the reset spring are fixedly connected to the fixed sleeve and the reset groove, respectively.

[0013] Preferably, the adjustment mechanism includes a fixed plate and a movable plate. The fixed plate is fixedly connected to the upper side of the support plate, and the movable plate is detachably connected to the lower side of the placement frame. Both ends of the support plate and the movable plate are provided with inclined chamfers.

[0014] Preferably, the placement rack has multiple placement slots inside, and each placement slot has chamfers on both the upper and lower sides of the side closest to the detection mechanism;

[0015] Two stabilizing plates are fixedly connected to the outer side of the placement frame, and a positioning groove is provided in the middle of each stabilizing plate. A reinforcing frame is fixedly connected to the upper side of the placement frame.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The present invention has a rotatable placement rack. By setting the rotatable placement rack, when placing the wafer inside the placement rack, the rear opening of the placement rack faces the rear staff, which facilitates the staff to place the wafer workpiece to be inspected inside.

[0018] 2. The present invention has an adjustment mechanism, which can change the angle of the placement rack so that the opening on its rear side has a certain angle of elevation. In this way, during the placement of the wafer workpiece, the wafer workpiece can slide towards the inside of the placement rack under the action of gravity, thereby reducing the risk of the wafer not being placed in place.

[0019] 3. The present invention has an eccentrically arranged power disk and a placement rack. During the rotation of the power disk, the placement rack can be driven to rotate, so that the wafer workpiece to be tested inside the placement rack tends to move towards the interior of the placement rack. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0021] Figure 2 This is a schematic diagram from the rear side view of the present invention.

[0022] Figure 3 This is a schematic diagram showing the position of the connecting mechanism in this invention.

[0023] Figure 4 This is an exploded structural diagram of the motor location in this invention.

[0024] Figure 5 This is a schematic diagram of the internal structure of the power disk in this invention.

[0025] Figure 6 For the present invention Figure 2 A magnified view of a portion of region A in the middle.

[0026] In the diagram: 1. Support plate; 2. Placement frame; 3. Detection mechanism; 4. Power plate; 5. Connecting mechanism; 6. Adjustment mechanism; 7. Power groove; 8. Motor; 9. Vertical rod; 10. Horizontal rod; 11. Fixing block; 12. Fixing sleeve; 13. Limiting groove; 14. Limiting rod; 15. Sliding groove; 16. Sliding block; 17. Return spring; 18. Operating handle; 19. Arc rod; 20. Arc sleeve; 21. Return groove; 22. Return tension spring; 23. Fixing plate; 24. Moving plate; 25. Inclined chamfer; 26. Placement groove; 27. Stabilizing plate; 28. Positioning groove; 29. ​​Reinforcing frame; 30. Limiting round head. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] The following is in conjunction with the appendix Figures 1 to 6 The specific embodiments of the present invention will be described in further detail below.

[0029] Depend on Figures 1 to 6As shown, the present invention includes a support plate 1. To facilitate the placement of wafer workpieces, a rotatable placement rack 2 for placing workpieces is provided on the upper side of the support plate 1. A detection mechanism 3 for detecting the concentricity of the wafer is provided on the rear side of the placement rack 2. The lower side of the detection mechanism 3 is fixedly connected to the support plate 1. A rotatable power disk 4 is provided in the middle of the support plate 1. A connecting mechanism 5 is provided between the power disk 4 and the placement rack 2. The placement rack 2 is detachably connected to the power disk 4 through the connecting mechanism 5. An adjustment mechanism 6 for adjusting the angle of the placement rack 2 is provided between the placement rack 2 and the support plate 1.

[0030] It should be noted that this device is a component in a wafer inspection apparatus used to place the wafer workpiece to be inspected. For a wafer inspection apparatus, please refer to the wafer inspection apparatus disclosed in publication number CN115655163B.

[0031] It should be noted that the power disk 4 and the placement rack 2 are eccentrically positioned. During the rotation of the power disk 4, the placement rack 2 can be driven to rotate, so that the wafer workpiece to be tested inside the placement rack 2 tends to move towards the inside of the placement rack 2, which can further reduce the risk of wafers not being placed in place.

[0032] In use, by setting a rotatable placement rack 2, when placing a wafer inside the placement rack 2, the rear opening of the placement rack 2 faces the operator, making it convenient for the operator to place the wafer to be inspected inside. During this process, under the action of the adjustment mechanism 6, the angle of the placement rack 2 can be changed, so that the rear opening has a certain angle of elevation. Thus, during the placement of the wafer, the wafer can slide into the placement rack 2 under the action of gravity, thereby reducing the risk of wafers not being placed in place. By setting a connecting mechanism 5, the operator can easily select the appropriate size and model of the placement rack 2 for wafers of different sizes, thus adapting to the inspection of wafers of various sizes.

[0033] Furthermore, by Figures 1 to 6 As shown, in order to make the conveying of wafer workpieces more stable, a power groove 7 is provided on the inner side of the middle part of the support plate 1. A motor 8 is provided inside the power groove 7, and the output shaft of the motor 8 is fixedly connected to the axis of the power disk 4.

[0034] It should be noted that the motor 8 is fixedly connected in the power slot 7. The motor 8 is a servo motor 8. The support plate 1 is also equipped with a controller, such as a PLC controller, which is existing technology. It can limit the start and stop time, rotation speed, rotation direction and limit number of rotations of the motor 8. In another embodiment, the motor 8 can be connected to the rotating shaft of the power disk 4 through a reducer.

[0035] Furthermore, by Figures 1 to 6As shown, in order to facilitate the detection of the placement position of the wafer, the detection mechanism 3 includes a vertical rod 9, a horizontal rod 10 and a detector. The upper and lower sides of the vertical rod 9 are fixedly connected to the horizontal rod 10 and the support plate 1, respectively, and the detector is fixedly connected to the lower side of the middle part of the horizontal rod 10.

[0036] Furthermore, by Figures 1 to 6 As shown, in order to improve the detection accuracy of wafer position, the detector is a laser detector, including a laser generator and a laser receiver. The laser generator is fixedly connected to the lower side of the horizontal rod 10, and the laser receiver is fixedly connected to the upper side of the support plate 1.

[0037] It should be noted that the laser generator and laser receiver are existing technologies. When the wafer is completely placed inside the placement rack 2 and the required positional accuracy for detection is met, the laser emitted by the laser generator can be directly received by the laser receiver, thereby determining that the wafer is in place. When the wafer is not completely placed, the wafer will block the laser emitted by the laser generator, thus preventing the laser receiver from receiving the laser signal and issuing an alarm signal to indicate that the wafer is not in place.

[0038] It should be further noted that, in another embodiment, the detector also includes a second sensor. The second sensor is disposed between the support plate 1 and the placement rack 2, and is used to detect whether the bottom plane of the placement rack 2 is parallel to the upper plane of the placement rack 2, so that the operator can determine whether the placement rack 2 is horizontal, thereby ensuring that the wafer workpiece inside is in a horizontal state;

[0039] In addition, the support plate 1 is equipped with an alarm unit, which is electrically connected to the controller. The alarm unit includes an indicator light and a buzzer. When the laser receiver and the second sensor, which are electrically connected to the controller, detect an abnormality in the posture of the wafer and the placement rack 2 (such as the wafer not being placed in place or the placement rack 2 not being in a horizontal state), they will issue a photoelectric alarm to alert the staff that there is an abnormality.

[0040] In use, the detector can be easily installed by setting the vertical rod 9 and the horizontal rod 10. The vertical rod 9 and the support plate 1 are detachably connected by bolts. Specifically, a waist-shaped groove is opened on the support plate 1 at the position corresponding to the vertical rod 9. The vertical rod 9 is detachably connected to the support plate 1 by bolts through the waist-shaped groove. This not only facilitates the maintenance of the detector, but also facilitates the adjustment of the position of the vertical rod 9 and the horizontal rod 10, thereby facilitating the adjustment of the positional accuracy of the detector.

[0041] Furthermore, by Figures 1 to 6As shown, to facilitate switching between different models of the placement rack 2, the connecting mechanism 5 includes a fixing block 11 and a fixing sleeve 12. The fixing block 11 is fixedly connected to the bottom of the placement rack 2, and the fixing sleeve 12 is connected to the upper side of the power plate 4. A limiting round head 30 is fixedly connected to the lower side of the fixing block 11. A limiting groove 13 is provided between the fixing block 11 and the limiting round head 30. A limiting rod 14 that can move back and forth is provided in the middle of the fixing sleeve 12. The limiting rod 14 and the limiting groove 13 cooperate with each other to form a limiting structure between the fixing block 11 and the fixing sleeve 12. The fixing block 11 is square. When the fixing block 11 and the fixing sleeve 12 are engaged, the limiting groove 13 and the fixing block 11 cooperate with each other to limit the rotation of the fixing block 11.

[0042] Furthermore, by Figures 1 to 6 As shown, in order to facilitate operation by the staff, a sliding groove 15 is provided inside the fixed sleeve 12, a sliding block 16 is fixedly connected to the middle of the limiting rod 14, a return spring 17 is provided on the side of the sliding block 16 away from the fixed block 11, the end of the return spring 17 away from the sliding block 16 abuts against the inner wall of the sliding groove 15, and an operating handle 18 is fixedly connected to the side of the limiting rod 14 away from the fixed block 11.

[0043] In use, when the fixed sleeve 12 and the fixed block 11 are in the engagement state, the end of the limiting rod 14 is inside the sliding groove 15. The limiting rod 14 and the sliding groove 15 cooperate to limit the vertical direction of the fixed block 11. The limiting groove 13 and the fixed block 11 cooperate to limit the horizontal rotation of the fixed block 11. At this time, the placement frame 2 is fixed relative to the fixed sleeve 12. When it is necessary to disassemble the placement frame 2, the operating handle 18 can be pulled. At this time, the operating handle 18 drives the limiting rod 14 to move. The return spring 17 stores force, so that the limiting rod 14 is disengaged from the sliding groove 15, and the fixed block 11 can be taken out from the inside of the fixed sleeve 12. When the fixed block 11 is put into the inside of the fixed sleeve 12, under the action of the limiting round head 30, the fixed block 11 can be pushed directly downward to make the limiting rod 14 engage with the limiting groove 13.

[0044] Furthermore, by Figures 1 to 6 As shown, in order to automatically adjust the angle of the placement rack 2 and thus facilitate the placement of wafer workpieces, multiple arc-shaped rods 19 are fixedly connected to the lower side of the fixed sleeve 12. Multiple arc-shaped sleeves 20 are provided inside the power disk 4. Each arc-shaped rod 19 is slidably connected inside the corresponding arc-shaped sleeve 20. A reset groove 21 is provided on the upper side of the power disk 4. A reset spring 22 is provided inside the reset groove 21. The upper and lower ends of the reset spring 22 are fixedly connected to the fixed sleeve 12 and the reset groove 21, respectively.

[0045] Furthermore, by Figures 1 to 6As shown, in order to facilitate the adjustment of the pitch angle of the placement rack 2, the adjustment mechanism 6 includes a fixed plate 23 and a movable plate 24. The fixed plate 23 is fixedly connected to the upper side of the support plate 1, and the movable plate 24 is detachably connected to the lower side of the placement rack 2. Both ends of the support plate 1 and the movable plate 24 are provided with inclined chamfers 25.

[0046] It should be noted that the movable plate 24 is detachably connected to the bottom of the placement frame 2 by bolts. When needed, the placement frame 2 can be removed by bolts and the movable plate 24 of appropriate height can be replaced, thereby adjusting the pitch angle of the placement frame 2.

[0047] It should be noted that the center of the arc of the arc sleeve 20 and the arc of the arc rod 19 are on the same axis. This axis coincides with the short side of the placement frame 2 and the support plate 1 that are in contact with each other. When the movable frame and the fixed plate 23 cooperate to lift the placement frame 2 upward, the placement frame 2 can rotate relative to this axis, so that the bottom of the placement frame 2 can always be in contact with the placement plate, thereby enhancing the stability of the placement frame 2.

[0048] In use, by setting the arc rod 19, when the placement rack 2 is at the position of placing the wafer (the back opening of the placement rack 2 is on the side of the worker), the moving plate 24 and the fixed plate 23 cooperate with each other to support the placement rack 2. Under the action of the tilt chamfer 25, the pitch angle of the placement rack 2 can be smoothly transitioned during the cooperation and disengagement of the moving plate 24 and the fixed plate 23, reducing the probability of wafer damage.

[0049] Furthermore, by Figures 1 to 6 As shown, in order to increase the service life of the device, the inside of the placement rack 2 is provided with multiple placement slots 26, and each placement slot 26 has chamfers on the upper and lower sides of the side closest to the detection mechanism 3.

[0050] Two stabilizing plates 27 are fixedly connected to the outer side of the placement rack 2. Each stabilizing plate 27 has a positioning groove 28 in the middle. A reinforcing frame 29 is fixedly connected to the upper side of the placement rack 2.

[0051] In use, the chamfered edges make it easier to place wafers inside different placement slots 26. When the placement rack 2 is in a horizontal working state or a restricted state, the stabilizing plate 27 is used to support the entire placement rack 2 to increase its stability. The reinforcing frame 29 not only improves the overall strength of the placement rack 2, but also serves as a handle for easy handling and replacement. The positioning slot 28 facilitates the positioning of the placement rack 2 relative to the wafer inspection device, thus making it easier for operators to operate.

[0052] In use, this invention firstly involves setting up a rotatable placement rack 2, so that when placing a wafer inside the placement rack 2, the rear opening of the placement rack 2 faces the operator, making it convenient for the operator to place the wafer to be inspected inside. During this process, under the action of the adjustment mechanism 6, the angle of the placement rack 2 can be changed, so that the rear opening has a certain angle of elevation. Thus, during the placement of the wafer, the wafer can slide towards the inside of the placement rack 2 under the action of gravity, thereby reducing the risk of the wafer not being placed in place. By setting up the connecting mechanism 5, the operator can easily select the appropriate size and model of the placement rack 2 for wafers of different sizes, thus adapting to the inspection of wafers of various sizes.

[0053] This invention features a novel structure, ingenious design, and simple and convenient operation. This design effectively facilitates the placement of wafer workpieces, makes the transport of wafer workpieces more stable, facilitates the detection of the wafer placement position, improves the detection accuracy of the wafer position, and allows operators to automatically adjust the pitch angle of the placement rack 2, thereby achieving the goal of convenient placement of wafer workpieces and convenient adjustment of the detection position.

[0054] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer alignment detection device, comprising a support plate, characterized in that: The upper side of the support plate is provided with a rotatable placement rack for placing workpieces. The rear side of the placement rack is provided with a detection mechanism for detecting the concentricity of the wafer. The lower side of the detection mechanism is fixedly connected to the support plate. The middle part of the support plate is provided with a rotatable power disk. A connecting mechanism is provided between the power disk and the placement rack. The placement rack is detachably connected to the power disk through the connecting mechanism. An adjustment mechanism for adjusting the angle of the placement rack is provided between the placement rack and the support plate.

2. The wafer alignment detection device according to claim 1, characterized in that: A power groove is provided on the inner side of the middle part of the support plate, and a motor is provided inside the power groove. The output shaft of the motor is fixedly connected to the axis of the power disk.

3. The wafer alignment detection device according to claim 1, characterized in that: The detection mechanism includes a vertical rod, a horizontal rod, and a detector. The upper and lower sides of the vertical rod are fixedly connected to the horizontal rod and the support plate, respectively, and the detector is fixedly connected to the lower side of the middle part of the horizontal rod.

4. The wafer alignment detection device according to claim 3, characterized in that: The detector is a laser detector, including a laser generator and a laser receiver. The laser generator is fixedly connected to the lower side of the horizontal bar, and the laser receiver is fixedly connected to the upper side of the support plate.

5. The wafer alignment detection device according to claim 1, characterized in that: The connecting mechanism includes a fixing block and a fixing sleeve. The fixing block is fixedly connected to the bottom of the placement frame, and the fixing sleeve is connected to the upper side of the power plate. A limiting round head is fixedly connected to the lower side of the fixing block. A limiting groove is formed between the fixing block and the limiting round head. A limiting rod that can move back and forth is provided in the middle of the fixing sleeve. The limiting rod and the limiting groove cooperate with each other to form a limiting structure between the fixing block and the fixing sleeve.

6. The wafer alignment detection device according to claim 5, characterized in that: The fixed sleeve has a sliding groove inside, and a sliding block is fixedly connected to the middle of the limiting rod. A return spring is provided on the side of the sliding block away from the fixed block. The end of the return spring away from the sliding block abuts against the inner wall of the sliding groove. An operating handle is fixedly connected to the side of the limiting rod away from the fixed block.

7. The wafer alignment detection device according to claim 5, characterized in that: The lower side of the fixed sleeve is fixedly connected with multiple arc-shaped rods, and the inside of the power plate is provided with multiple arc-shaped sleeves. Each arc-shaped rod is slidably connected inside the corresponding arc-shaped sleeve. The upper side of the power plate is provided with a reset groove, and the inside of the reset groove is provided with a reset spring. The upper and lower ends of the reset spring are fixedly connected to the fixed sleeve and the reset groove, respectively.

8. The wafer alignment detection device according to claim 1, characterized in that: The adjustment mechanism includes a fixed plate and a movable plate. The fixed plate is fixedly connected to the upper side of the support plate, and the movable plate is detachably connected to the lower side of the placement frame. Both ends of the support plate and the movable plate are provided with inclined chamfers.

9. The wafer alignment detection device according to claim 1, characterized in that: The placement rack has multiple placement slots inside, and each placement slot has chamfers on the upper and lower sides of the side closest to the detection mechanism. Two stabilizing plates are fixedly connected to the outer side of the placement frame, and a positioning groove is provided in the middle of each stabilizing plate. A reinforcing frame is fixedly connected to the upper side of the placement frame.

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