Substrate conveying and aligning equipment

Abstract

The invention relates to substrate conveying and aligning equipment, which is suitable for conveying and aligning a square substrate and comprises a conveying cavity, at least one processing cavity and at least one feeding and discharging cavity, and the conveying cavity is connected with the processing cavity and the feeding and discharging cavity. A mechanical arm is located in the conveying cavity and used for driving the substrate to move along a radial path and a circumferential path of a rotating axis so as to convey the substrate among the conveying cavity, the processing cavity and the feeding and discharging cavity. A first sensing unit and a second sensing unit are arranged on the radial path, a third sensing unit is arranged on the circumferential path, and sensing data transmitted by the first sensing unit, the second sensing unit and the third sensing unit are received through the controller so as to obtain deflection data of the substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate conveying and aligning apparatus, which can be used to convey and align a square substrate. BACKGROUND

[0002] Semiconductor packaging technology is a very important part of semiconductor manufacturing, which is mainly responsible for connecting the manufactured wafer with external circuits and providing protection. The traditional semiconductor packaging technology is to cut the wafer into single dies after the wafer manufacturing is completed, and then package these single dies.

[0003] As the size of the wafer gradually approaches the physical limit, advanced packaging technology begins to play an increasingly important role. The goal of advanced packaging is not only to protect and connect, but also to improve the overall performance, functional density, power efficiency and heat dissipation capacity of the wafer through innovative packaging structures.

[0004] Advanced packaging processes mainly include wafer-level packaging (WLP) and panel-level packaging (PLP). The biggest difference between wafer-level packaging and traditional packaging is that wafer-level packaging is first completed on the whole wafer, and then cut into single elements. Because the size of the package is almost equal to the size of the die, wafer-level packaging realizes true wafer-level packaging, which can greatly reduce the volume and cost.

[0005] Wafer-level packaging also includes fan-in wafer-level packaging (Fan-in WLP) and fan-out wafer-level packaging (Fan-out WLP), in which the I / O solder balls of fan-in wafer-level packaging are all within the die area, while the I / O solder balls of fan-out wafer-level packaging extend outside the die. The number of I / O solder balls of fan-out wafer-level packaging can be greater than that of fan-in wafer-level packaging (Fan-in WLP), and is suitable for wafers with high I / O numbers, which has become the current mainstream wafer-level packaging technology.

[0006] Fan-out panel-level packaging (FOPLP) is a further evolution of fan-out wafer-level packaging, and its main goal is to reduce costs and improve production efficiency. The basic concept of fan-out panel-level packaging is similar to that of fan-out wafer-level packaging, both of which fan out I / O solder balls to the outside of the die. The main difference between the two is that fan-out wafer-level packaging uses a circular wafer as a carrier substrate, while fan-out panel-level packaging uses a square carrier substrate.

[0007] Specifically, the fan-out panel level package is to arrange the dies on a large square panel first, and then to perform molding, re-distribution layer (RDL) and solder ball setting. Since the area of the square panel is larger than that of the circular wafer, more dies can be packaged in a single production. In addition, the utilization of the square panel is higher, which can reduce the waste of the cutting edge of the circular wafer and improve the production efficiency.

[0008] As described in the prior art, the fan-out panel level package (FOPLP) has the advantages of high utilization and reducing the waste of the cutting edge of the circular wafer, and improving the production efficiency compared with the conventional semiconductor package or other advanced packages. The conventional process equipment is mainly designed to transport and align the circular wafer, and cannot be completely applied to the square substrate. The accuracy of the substrate alignment directly affects the subsequent processes. For example, in the process of film deposition, if the placement of the substrate in the deposition chamber is skewed, the uniformity of the film deposition will be greatly affected, and the yield of the packaging process will be reduced. SUMMARY

[0009] To solve the above problems, one object of the present application is to provide a substrate transport and alignment device which can be used to align the square substrate and accurately transport the square substrate into the processing chamber for subsequent processes, such as transporting the substrate into the deposition chamber for thin film deposition.

[0010] The substrate transport and alignment device of the present application mainly comprises a transport chamber, at least one processing chamber and at least one in-out chamber, wherein the processing chamber is connected to the transport chamber and the in-out chamber. A robot arm is arranged in the transport chamber to move a substrate along a radial path and a circumferential path of the rotation axis of the robot arm to transport the substrate between the in-out chamber, the transport chamber and the processing chamber.

[0011] At least one first sensing unit and at least one second sensing unit can be arranged between the transport chamber and the processing chamber and the in-out chamber to sense the substrate moving along the radial path. In addition, at least one third sensing unit is arranged in the transport chamber to sense the substrate moving along the circumferential path to locate the center of the substrate in the skewed position. Then, the position of the substrate can be adjusted according to the center of the substrate in the skewed position, and the substrate can be transported to a specific position of the processing chamber.

[0012] One object of the present application is to provide a substrate transport and alignment device which only needs to arrange at least one sensing unit on the transport chamber to align the square substrate. The present application can complete the transport and alignment of the square substrate without increasing too much cost, and greatly improve the yield of the packaging process.

[0013] To achieve the above object, the present application provides a substrate conveying and aligning apparatus, which comprises: a conveying chamber; at least one processing chamber connected to the conveying chamber; at least one loading / unloading chamber connected to the conveying chamber; a robot located in the conveying chamber, the robot comprising a rotating axis and being used to drive a substrate to move along a radial path and a circumferential path of the rotating axis, so as to transfer the substrate between the conveying chamber, the processing chamber and the loading / unloading chamber; at least one first sensing unit and at least one second sensing unit used to sense the substrate moving along the radial path; at least one third sensing unit located in the conveying chamber and used to sense the substrate moving along the circumferential path; and a controller coupled to the first sensing unit, the second sensing unit and the third sensing unit, wherein the controller calculates a skew data of the substrate according to sensing data transmitted by the first sensing unit, the second sensing unit and the third sensing unit.

[0014] In at least one embodiment of the substrate conveying and aligning apparatus, the conveying chamber comprises a plurality of connecting gates, the processing chamber and the loading / unloading chamber are connected through the connecting gates, the first sensing unit and the second sensing unit are located at the connecting gates and used to sense the substrate passing through the connecting gates, and the third sensing unit is used to sense the substrate moving in the conveying chamber.

[0015] In at least one embodiment of the substrate conveying and aligning apparatus, the controller is coupled to the robot, and the controller controls the robot to adjust the position of the substrate according to the skew data of the substrate.

[0016] In at least one embodiment of the substrate conveying and aligning apparatus, the substrate is square, the first sensing unit and the second sensing unit are used to sense a first sensing point and a second sensing point of the substrate, and the third sensing unit is used to sense a third sensing point of the substrate.

[0017] In at least one embodiment of the substrate conveying and aligning apparatus, the controller calculates a center of the substrate according to the first sensing point, the second sensing point and the third sensing point.

[0018] In at least one embodiment of the substrate conveying and aligning apparatus, the controller calculates a radial skew data of the substrate according to the first sensing point and the second sensing point.

[0019] In at least one embodiment of the substrate conveying and aligning apparatus, the controller calculates the skew data of the substrate according to the radial skew data and the third sensing point.

[0020] The third sensing unit includes a transmitting unit and a receiving unit. The transmitting unit and the receiving unit are disposed on a first sidewall of the conveying chamber. A reflecting unit is disposed on a second sidewall of the conveying chamber. The transmitting unit is configured to project a light beam to the reflecting unit. The receiving unit is configured to receive the light beam reflected by the reflecting unit.

[0021] The third sensing unit includes a transmitting unit and a receiving unit. The transmitting unit is disposed on a first sidewall of the conveying chamber. The receiving unit is disposed on a second sidewall of the conveying chamber. The transmitting unit is configured to generate a light beam. The receiving unit is configured to receive the light beam generated by the transmitting unit.

[0022] The first sidewall and the second sidewall of the conveying chamber are respectively provided with at least one setting hole. The transmitting unit and the receiving unit of the third sensing unit are respectively disposed in the setting holes of the first sidewall and the second sidewall through an adapter. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 A top view of an embodiment of the substrate conveying and aligning device of the present application;

[0024] Figure 2 A top view of another embodiment of the substrate conveying and aligning device of the present application;

[0025] Figure 3 A sectional view of an embodiment of the conveying chamber and the sensing unit of the substrate conveying and aligning device of the present application;

[0026] Figure 4 A sectional view of another embodiment of the conveying chamber and the sensing unit of the substrate conveying and aligning device of the present application;

[0027] Figure 5 A sectional view of another embodiment of the conveying chamber and the sensing unit of the substrate conveying and aligning device of the present application;

[0028] Figure 6 A schematic view of an embodiment of the substrate in the ideal position and the skewed position;

[0029] Figure 7 A schematic view of another embodiment of the substrate in the ideal position and the skewed position.

[0030] REFERENCE SIGNS

[0031] 10: substrate conveying and aligning device

[0032] 11: conveying chamber

[0033] 111: Connecting gate

[0034] 113: First sidewall

[0035] 115: Second sidewall

[0036] 117: Setting a hole

[0037] 119: Adapter

[0038] 12: Substrate

[0039] 121: Ideal Position

[0040] 123: Deviation position

[0041] 13: Processing the cavity

[0042] 131: Location point

[0043] 141: First sensing unit

[0044] 143: Second sensing unit

[0045] 145: Third sensing unit

[0046] 1451: Launching Unit

[0047] 1453: Receiving Unit

[0048] 1455: Reflection Unit

[0049] 15: Inlet and outlet chambers

[0050] 17: Robotic Arm

[0051] 171: Rotation axis

[0052] 173: Radial path

[0053] 175: Circumferential Path

[0054] 19: Controller

[0055] A: First sensing point

[0056] A': First sensing point

[0057] α: Angle

[0058] B: Second sensing point

[0059] B': Second sensing point

[0060] C: Third sensing point

[0061] C': Third sensing point

[0062] Drc: Spacing

[0063] Dro': Spacing

[0064] F: Angle

[0065] L: Beam

[0066] O: Center

[0067] O': Center

[0068] P: Spacing

[0069] Pa: Spacing

[0070] Pb: Spacing

[0071] T: Angle

[0072] T': Angle

[0073] W: Width. Detailed Implementation

[0074] Figure 1 and Figure 2 This is a top view of an embodiment of the substrate conveying and alignment device of the present invention. As shown in the figure, the substrate conveying and alignment device 10 mainly includes a conveying cavity 11, at least one processing cavity 13, at least one loadlock chamber 15, and a robotic arm 17. The processing cavity 13 and the loadlock chamber 15 are connected to the conveying cavity 11, and the robotic arm 17 is located inside the conveying cavity 11 and is used to drive a substrate 12 to be transferred between the loadlock chamber 15, the conveying cavity 11, and the processing cavity 13.

[0075] The substrate 12 described in this invention can be a carrier substrate used in fan-out panel-level packaging (FOPLP), and its shape is square. The area of ​​the square substrate 12 can be larger than that of a circular wafer, and the square substrate 12 has a higher utilization rate, which can reduce the waste of the circular wafer cutting edge and help improve production efficiency. The substrate conveying and alignment equipment 10 described in this invention is particularly suitable for conveying and aligning square substrates 12.

[0076] The robotic arm 17 includes a rotating shaft 171. The robotic arm 17 is used to drive the substrate 12, which is carried or held, to move along a radial path 173 and a circumferential path 175 of the rotating shaft 171, so as to transfer the substrate 12 between the conveying cavity 11, the processing cavity 13 and the infeed and discharge cavity 15.

[0077] At least one first sensing unit 141 and at least one second sensing unit 143 are used to sense the substrate 12 displaced along the radial path 173. For example, the first sensing unit 141 and the second sensing unit 143 may be located on the radial path 173 of the rotation axis 171. At least one third sensing unit 145 is disposed in the transport cavity 11 and is used to sense the substrate 12 displaced along the circumferential path 175. For example, the third sensing unit 145 may be located on the circumferential path 175 of the rotation axis 171.

[0078] like Figure 1 As shown, the first sensing unit 141 and the second sensing unit 143 may be located between the conveying cavity 11 and the inlet / outlet cavity 15, and / or between the conveying cavity 11 and the processing cavity 13, wherein the processing cavity 13 may be a thin film deposition cavity, such as an atomic layer deposition cavity, a chemical vapor deposition cavity, or a physical vapor deposition cavity. The first sensing unit 141 and the second sensing unit 143 may be used to sense the substrate 12 conveyed between the conveying cavity 11 and the inlet / outlet cavity 15, for example, to sense the edge of the substrate 12, and may be used to sense the substrate 12 conveyed between the conveying cavity 11 and the processing cavity 13.

[0079] In one embodiment of the present invention, the conveying cavity 11 may include a plurality of connecting gates 111, wherein the connecting gates 111 may be arranged around the conveying cavity 11. The processing cavity 13 and the inlet / outlet cavity 15 may be connected to the conveying cavity 11 via the connecting gates 111, such that the processing cavity 13 and the inlet / outlet cavity 15 are arranged around the conveying cavity 11. Depending on the number of connecting gates 111, processing cavity 13 and / or inlet / outlet cavity 15 of the conveying cavity 11, the top view shape of the conveying cavity 11 may be approximately quadrilateral, heptagonal or octagonal, etc.

[0080] The first sensing unit 141 and the second sensing unit 143 may be disposed on each of the connecting gates 111 of the conveying cavity 11 and used to sense the substrate 12 passing through the connecting gates 111. In different embodiments, the first sensing unit 141 and the second sensing unit 143 may be disposed on the connecting gates 111 of the conveying cavity 11 connecting to the inlet and outlet cavities 15.

[0081] In practical applications, when the robotic arm 17 moves the substrate 12 between the conveying cavity 11 and the infeed / outfeed cavity 15, or between the conveying cavity 11 and the processing cavity 13, the robotic arm 17 will move the substrate 12 along the radial path 173 and through the connecting gate 111, the first sensing unit 141 and the second sensing unit 143 provided on the connecting gate 111 will sense the substrate 12 passing through.

[0082] like Figure 2As shown, after the robotic arm 17 transports the substrate 12 from the infeed / outfeed cavity 15 or the processing cavity 13 to the transport cavity 11, the robotic arm 17 will move the substrate 12 along the circumferential path 175 within the transport cavity 11, and the third sensing unit 145 disposed within the transport cavity 11 will sense the passage of the substrate 12. For example, the robotic arm 17 can remove the substrate 12 from the infeed / outfeed cavity 15 and rotate the substrate 12 along the circumferential path 175 within the transport cavity 11 to transport the substrate 12 to the front of the processing cavity 13.

[0083] For ease of explanation, Figure 2 Multiple third sensing units 145 are provided in the conveying cavity 11, but in actual application, the number of third sensing units 145 can be one. As long as the robotic arm 17 moves the substrate 12 along the circumferential path 175 in the conveying cavity 11, the third sensing unit 145 can sense the edge of the substrate 12.

[0084] like Figure 3 , Figure 4 and Figure 5 As shown, the first sensing unit 141, the second sensing unit 143, and the third sensing unit 145 may include a transmitting unit 1451 and a receiving unit 1453. When the optical path between the transmitting unit 1451 and the receiving unit 1453 is not blocked, the receiving unit 1453 can receive the light beam L emitted by the transmitting unit 1451. When the optical path between the transmitting unit 1451 and the receiving unit 1453 is blocked by the substrate 12, the receiving unit 1453 cannot receive the light beam L emitted by the transmitting unit 1451, so that the first sensing unit 141, the second sensing unit 143, and the third sensing unit 145 can be used to sense the position of the substrate 12. For example, the first sensing unit 141, the second sensing unit 143, and the third sensing unit 145 can be used to sense the edge of the square substrate 12.

[0085] In one embodiment of the present invention, such as Figure 3 As shown, the transmitting unit 1451 and the receiving unit 1453 of the third sensing unit 145 can be disposed on the same side wall of the conveying cavity 11. Specifically, the transmitting unit 1451 and the receiving unit 1453 can be disposed on the first side wall 113 of the conveying cavity 11, and a reflecting unit 1455 is disposed on the second side wall 115 of the conveying cavity 11. The first side wall 113 and the second side wall 115 can be two facing side walls, for example, the first side wall 113 can be the upper side wall, and the second side wall 115 can be the lower side wall. The transmitting unit 1451 is used to project the light beam L onto the reflecting unit 1455, and the receiving unit 1453 is used to receive the light beam L reflected by the reflecting unit 1455.

[0086] In one embodiment of the present invention, such as Figure 4As shown, the transmitting unit 1451 and receiving unit 1453 of the third sensing unit 145 can be disposed on two facing sidewalls of the conveying cavity 11. Specifically, the transmitting unit 1451 can be disposed on the first sidewall 113 of the conveying cavity 11, and the receiving unit 1453 can be disposed on the second sidewall 115 of the conveying cavity 11, wherein the first sidewall 113 and the second sidewall 115 can be two facing sidewalls, for example, the first sidewall 113 can be the upper sidewall, and the second sidewall 115 can be the lower sidewall. The light beam L generated by the transmitting unit 1451 passes through the space inside the conveying cavity 11 and is projected onto the receiving unit 1453.

[0087] In practical applications, the transmitting unit 1451, the receiving unit 1453, and / or the reflecting unit 1455 can be disposed outside the transport cavity 11, and the light beam L is projected, reflected, and received through the light-transmitting portion disposed on the transport cavity 11. In different embodiments, the reflecting unit 1455 can be disposed inside the transport cavity 11. For example, the reflecting unit 1455 can be a coated or polished surface located on the inner surface of the second sidewall 115 of the transport cavity 11.

[0088] like Figure 5 As shown, the transmitting unit 1451 and the receiving unit 1453 can be disposed inside the conveying cavity 11. For example, at least one mounting hole 117 is provided on the first side wall 113 and the second side wall 115 of the conveying cavity 11, and the transmitting unit 1451 and the receiving unit 1453 are respectively mounted on the mounting holes 117 of the first side wall 113 and the second side wall 115 via an adapter 119. In different embodiments, the reflecting unit 1455 can also be mounted on the mounting hole 117 of the first side wall 113 or the second side wall 115 via the adapter 119.

[0089] The arrangement of the transmitting unit 1451 and the receiving unit 1453 described above is merely one embodiment of the present invention and is not a limitation of the scope of the claims. In practical applications, as long as the optical paths of the transmitting unit 1451 emitting the light beam L and the receiving unit 1453 receiving the light beam L are located on the displacement path of the substrate 12, the position of the substrate 12 can be sensed by the transmitting unit 1451 and the receiving unit 1453. Furthermore, the first sensing unit 141 and the second sensing unit 143 can also be arranged on the transport cavity 11 in the same manner as the third sensing unit 145 described above.

[0090] In one embodiment of the present invention, the substrate conveying and alignment device 10 may include a controller 19, wherein the controller 19 is coupled to a first sensing unit 141, a second sensing unit 143, a third sensing unit 145 and / or a robotic arm 17. The controller 19 may receive sensing data from the first sensing unit 141, the second sensing unit 143 and the third sensing unit 145, and perform calculations on the received sensing data to generate skew data of the substrate 12. In addition, the controller 19 may control the robotic arm 17 to adjust the position of the substrate 12 according to the skew data.

[0091] Figure 6 This is a schematic diagram of an embodiment of the substrate of the present invention in both ideal and skewed positions. Please refer to the accompanying diagram. Figure 1 The embodiments of the present invention mainly through Figure 1 The first sensing unit 141 and the second sensing unit 143 sense the substrate 12 that is displaced on the radial path 173. Based on the position of the substrate 12 placed on the robotic arm 17, it can be distinguished as an ideal position 121 and an skewed position 123.

[0092] Ideal position 121 means that the substrate 12 is placed in a preset position of the robotic arm 17, which can smoothly transfer the substrate 12 from the transport cavity 11 to the processing cavity 13 and place the substrate 12 in a preset position in the processing cavity 13, such as making the center O' of the substrate 12 overlap with the positioning point 131 of the processing cavity 13.

[0093] The skewed position 123 indicates that the substrate 12 has not been placed in the preset position of the robotic arm 17. If the robotic arm 17 does not align and correct the position of the substrate 12, the substrate 12 will not be able to be placed in the preset position of the processing cavity 13. For example, the center O of the substrate 12 may not overlap with the positioning point 131 of the processing cavity 13.

[0094] The first sensing unit 141 and the second sensing unit 143 can be used to sense the coordinates of the first sensing point A and the second sensing point B of the substrate 12 at the skew position 123, wherein the first sensing point A and the second sensing point B are located at the edge of the substrate 12. For example, the coordinates of the first sensing point A and the second sensing point B can be the sensing data described in the previous embodiment. After the controller 19 calculates the coordinates of the first sensing point A and the second sensing point B, it can obtain a radial skew data of the substrate 12 at the skew position 123. For example, the radial skew data can be the angle α of the substrate 12 at the skew position 123 in the radial skew.

[0095] In one embodiment of the present invention, the distance between the first sensing point A and the second sensing point B on the radial path, such as the distance in the Y direction, can be calculated from the coordinates (Xa, Ya) of the first sensing point A and the coordinates (Xb, Yb) of the second sensing point B. If the distance between the first sensing unit 141 and the second sensing unit 143 is the spacing P, the radial tilt angle α of the substrate 12 can be calculated using the following formula:

[0096]

[0097] In another embodiment of the present invention, the distance Pa between the first sensing point A and the first sensing point A' can be calculated from the coordinates (Xa,Ya) of the first sensing point A and the coordinates (Xa',Ya') of the first sensing point A', and the distance Pb between the second sensing point B and the second sensing point B' can be calculated from the coordinates (Xb,Yb) of the second sensing point B and the coordinates (Xb',Yb') of the second sensing point B'. The first sensing point A' and the second sensing point B' can be the coordinates of the substrate 12 located at the ideal position 121 sensed by the first sensing unit 141 and the second sensing unit 143.

[0098] Then, based on the spacing Pa, the spacing Pb, and the spacing P between the first sensing unit 141 and the second sensing unit 143, the radial deflection angle α of the substrate 12 is calculated using the following formula:

[0099]

[0100] Figure 7 This is a schematic diagram of another embodiment of the substrate of the present invention in both ideal and skewed positions. Please refer to the accompanying diagram. Figure 2 The embodiments of the present invention mainly through Figure 2 The third sensing unit 145 senses the edge of the substrate 12 and can distinguish between the ideal position 121 and the skewed position 123 based on the position of the substrate 12 placed on the robotic arm 17.

[0101] During the process of the robotic arm 17 moving the substrate 12 along the radial path 173, the first sensing unit 141 and the second sensing unit 143 will sense the coordinates of the first sensing point A and the second sensing point B of the substrate 12 at the skewed position 123. The first sensing point A' and the second sensing point B' are the coordinates of the substrate 12 at the ideal position 121 sensed by the first sensing unit 141 and the second sensing unit 143, where the coordinates of the first sensing point A' and the second sensing point B' can be known.

[0102] During the process of the robotic arm 17 moving the substrate 12 along the circumferential path 175, the third sensing unit 145 senses the coordinates of the third sensing point C of the substrate 12 at the skewed position 123. The third sensing point C' is the coordinate of the substrate 12 at the ideal position 121 sensed by the third sensing unit 145, and the coordinates of the third sensing point C' can be known. The first sensing point A / A', the second sensing point B / B', and the third sensing point C / C' can be the sensing data described in the previous embodiments.

[0103] In one embodiment of the present invention, the coordinates of the first sensing point A', the second sensing point B' and the third sensing point C' can be measured in advance. For example, before the actual transport and alignment of the substrate 12, the substrate 12 can be placed in the ideal position 121 of the robotic arm 17, and then the robotic arm 17 can drive the substrate 12 to move in the radial path 173 and the circumferential path 175, and the first sensing unit 141, the second sensing unit 143 and the third sensing unit 145 can sense the coordinates of the first sensing point A', the second sensing point B' and the third sensing point C' of the substrate 12 located in the ideal position 121.

[0104] In another embodiment of the present invention, at least one positioning mark may be provided on the robotic arm 17. During the displacement of the robotic arm 17 along the radial path 173 and the circumferential path 175 within the conveying cavity 11, the first sensing unit 141, the second sensing unit 143, and the third sensing unit 145 will respectively sense the coordinates of the positioning mark of the robotic arm 17. Then, the coordinates of the first sensing point A', the second sensing point B', and the third sensing point C' of the substrate 12 located at the ideal position 121 can be calculated from the coordinates of the positioning mark.

[0105] In another embodiment of the present invention, the distance P between the first sensing unit 141 and the second sensing unit 143 is known, and the width W of the substrate 12 is known. If the coordinates of the center O' of the substrate 12 located at the ideal position 121 are defined as (0,0), then the coordinates of the first sensing point A' will be (-W / 2,P / 2), and the coordinates of the second sensing point B' will be (-W / 2,-P / 2).

[0106] If the distance between the first sensing point A and the first sensing point A' is spacing Pa, and the distance between the second sensing point B and the second sensing point B' is spacing Pb, then the coordinates of the first sensing point A will be (-W / 2+Pa, P / 2), and the coordinates of the second sensing point B will be (-W / 2+Pb, -P / 2).

[0107] Furthermore, the distance between the rotation axis 171 of the robotic arm 17 and the third sensing point C of the substrate 12 located at the skew position 123 is the spacing Drc, and the distance between the rotation axis 171 of the robotic arm 17 and the center O' of the substrate 12 located at the ideal position 121 is the spacing Dro'. The angle between the rotation axis 171 of the robotic arm 17 and the center O' of the substrate 12 and the third sensing point C is angle T, and the angle between the rotation axis 171 of the robotic arm 17 and the center O' of the substrate 12 and the third sensing point C' is angle T'. The coordinates of the third sensing point C can be derived as follows:

[0108] C=(Drc cos(T)-Dro ′ ,Drcsin(T))

[0109] The slope Mab between the first sensing point A and the second sensing point B is the same as the slope of the angle F between the first sensing point A and the substrate 12, where angle F is the angle between the third sensing point C and the first sensing point A. The slopes Mab and Mfa are as follows:

[0110]

[0111] Because the line segment formed by the angle F between the third sensing point C and the substrate 12 is perpendicular to the line segment formed by the first sensing point A and the second sensing point B:

[0112]

[0113] From the above formula, we can derive:

[0114] Mfc(Xf-Xc)=Yf-Yc

[0115] Mfa(Xf-Xa)=Mab(Xf-Xa)=Yf-Ya

[0116] The coordinates of angle F of substrate 12 can be obtained from the above two simultaneous equations:

[0117]

[0118]

[0119] because so:

[0120]

[0121] Then, the coordinates of the center O of the substrate 12 located at the skew position 123 can be calculated from the size and shape of the substrate 12. The coordinates of the center O can be defined as the skew data of the substrate 12. For example, when the substrate 12 is square, the coordinates of the center O of the substrate 12 located at the skew position 123 are:

[0122]

[0123] Finally, the substrate 12 located at the skewed position 123 can be corrected by using the coordinates of the center O' of the substrate 12 located at the ideal position 121 and the center O of the substrate 12 located at the skewed position 123. For example, the controller 19 can adjust the position of the substrate 12 located at the skewed position 123 by using the robotic arm 17 so that the center O of the substrate 12 located at the skewed position 123 overlaps with the center O' of the substrate 12 located at the ideal position 121. Alternatively, the controller 19 can place the center O of the substrate 12 located at the skewed position 123 on the positioning point 131 of the processing cavity 13 based on the coordinates of the center O' of the substrate 12 located at the ideal position 121 and the center O of the substrate 12 located at the skewed position 123.

[0124] In practical applications, the above calculations can be performed by the controller 19. The controller 19 can calculate the deflection data of the substrate 12 located at the deflection position 123 based on the first sensing point A / A', the second sensing point B / B', and the third sensing point C / C'. For example, the deflection data could be the center O of the substrate 12 located at the deflection position 123. In one embodiment of the present invention, the controller 19 can calculate the radial deflection data of the substrate 12 based on the first sensing point A / A' and the second sensing point B / B'. Then, it can calculate the deflection data of the substrate 12 based on the radial deflection data and the third sensing point C / C'.

[0125] The method described above, which measures first sensing point A, second sensing point B, third sensing point C, first sensing point A', second sensing point B', and third sensing point C' using first sensing unit 141, second sensing unit 143, and third sensing unit 145 to calculate the coordinate difference between the center O of substrate 12 located at skew position 123 and the center O' of substrate 12 located at ideal position 121, is merely one embodiment of the present invention and is not a limitation of the scope of the claims of the present invention. In different embodiments, different methods can also be used to process the data measured by first sensing unit 141, second sensing unit 143, and third sensing unit 145, and calculate the coordinate difference between substrate 12 located at skew position 123 and substrate 12 located at ideal position 121, and then the robotic arm 17 can be used to compensate or calibrate substrate 12 located at skew position 123.

[0126] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. All equivalent variations and modifications made in accordance with the shape, structure, features and spirit described in the claims of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A substrate conveying and alignment device, characterized in that, include: One delivery cavity; At least one processing chamber is connected to the delivery chamber; At least one inlet / outlet chamber is connected to the conveying chamber; A robotic arm is located in the conveying cavity. The robotic arm includes a rotating shaft and is used to drive a substrate to move along a radial path and a circumferential path along the rotating shaft, so as to transfer the substrate between the conveying cavity, the processing cavity and the inlet / outlet cavity. At least one first sensing unit and at least one second sensing unit are used to sense the substrate displaced along the radial path; At least one third sensing unit is located in the delivery cavity and is used to sense the substrate that is displaced along the circumferential path; and A controller is coupled to the first sensing unit, the second sensing unit and the third sensing unit, wherein the controller calculates a bias data of the substrate based on the sensing data transmitted by the first sensing unit, the second sensing unit and the third sensing unit.

2. The substrate conveying and alignment device as described in claim 1, characterized in that, The conveying cavity includes multiple connecting gates, which connect the processing cavity and the inlet / outlet cavity. The first sensing unit and the second sensing unit are located at the connecting gates and are used to sense the substrate passing through the connecting gates, while the third sensing unit is used to sense the displacement of the substrate within the conveying cavity.

3. The substrate conveying and alignment equipment as described in claim 1, characterized in that, The controller is coupled to the robotic arm and controls the robotic arm to adjust the position of the substrate based on the skew data of the substrate.

4. The substrate conveying and alignment device as described in claim 1, characterized in that, The substrate is square. The first sensing unit and the second sensing unit are used to sense a first sensing point and a second sensing point on the substrate, and the third sensing unit is used to sense a third sensing point on the substrate.

5. The substrate conveying and alignment device as described in claim 4, characterized in that, The controller calculates a center of the substrate based on the first sensing point, the second sensing point, and the third sensing point.

6. The substrate conveying and alignment device as described in claim 4, characterized in that, The controller calculates a radial skew data of the substrate from the first sensing point and the second sensing point.

7. The substrate conveying and alignment device as described in claim 6, characterized in that, The controller calculates the deflection data of the substrate based on the radial deflection data and the third sensing point.

8. The substrate conveying and alignment device as described in claim 1, characterized in that, The third sensing unit includes a transmitting unit and a receiving unit. The transmitting unit and the receiving unit are disposed on a first side wall of the conveying cavity, and a reflecting unit is disposed on a second side wall of the conveying cavity. The transmitting unit is used to project a light beam onto the reflecting unit, and the receiving unit is used to receive the light beam reflected by the reflecting unit.

9. The substrate conveying and alignment device as described in claim 1, characterized in that, The third sensing unit includes a transmitting unit and a receiving unit. The transmitting unit is disposed on a first side wall of the conveying cavity, and the receiving unit is disposed on a second side wall of the conveying cavity. The transmitting unit is used to generate a light beam, and the receiving unit is used to receive the light beam generated by the transmitting unit.

10. The substrate conveying and alignment device as described in claim 9, characterized in that, At least one mounting hole is provided on the first sidewall and the second sidewall of the delivery cavity, and the transmitting unit and the receiving unit of the third sensing unit are respectively mounted on the mounting holes of the first sidewall and the second sidewall via an adapter.

Images