Wafer positioning and clamping device

Abstract

The invention discloses a wafer positioning and clamping device, and the device comprises a wafer carrying platform which comprises a supporting part and a bearing part. The bearing part is arranged on the supporting part, and at least one clamping channel and a plurality of concentrically arranged placing grooves are formed in the bearing part; the diameters of the plurality of placing grooves are sequentially increased from inside to outside so as to bear wafers with different sizes; the clamping channel extends from the outer part of the bearing part to the middle part, so that the placing grooves are communicated with the clamping channel; the positioning part is arranged on the bearing part and is used for positioning the wafer; the at least two clamping parts are arranged on the supporting part and correspond to the clamping channels in position; the clamping part is provided with a movable clamping end; the clamping end is close to the middle part of the bearing part along the clamping channel and is matched with the positioning part to form at least three contact points so as to clamp the wafer; the clamping end is far away from the middle part of the bearing part along the clamping channel so as to loosen the wafer. The wafer clamping device can adapt to wafers of different sizes, and the wafer clamping reliability is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to a wafer positioning and clamping device. BACKGROUND

[0002] In the process of semiconductor manufacturing, the processing of wafers is very important, which needs to go through a series of high-precision and high-complexity steps such as photolithography, etching, deposition and polishing. In these production and processing processes, in order to ensure the precision and quality of wafer processing, a reliable clamping device must be used to fix the wafer. In the prior art, wafers usually have a large diameter, such as 200mm, 300mm, etc., and a relatively small thickness. This structural feature makes the wafer extremely susceptible to external forces during processing, which may cause deformation or even damage, seriously affecting the processing quality and subsequent use of the wafer. In addition, in actual production, wafers of different sizes and models are often encountered, which puts higher requirements on the clamping device, which needs to effectively avoid the adverse effects of external forces on the wafer and adapt to the clamping needs of wafers of different sizes and models. The existing clamping device often cannot meet the above requirements in terms of adaptability and reliability.

[0003] Therefore, it is necessary to provide a new wafer positioning and clamping device to solve the above problems in the prior art. SUMMARY

[0004] The technical problem to be solved by the present application is to provide a wafer positioning and clamping device that can adapt to wafers of different sizes and improve the reliability of wafer clamping.

[0005] To solve the above technical problems, according to an embodiment of the present application, a wafer positioning and clamping device is provided, comprising: A wafer carrier, comprising a support part and a carrying part; the carrying part is arranged on the support part, and at least one clamping channel and a plurality of concentricly arranged placing grooves are arranged on the carrying part; the diameters of the plurality of placing grooves increase from inside to outside, so as to carry wafers of different sizes; the clamping channel extends from the outside to the middle of the carrying part, so that the placing grooves are all in communication with the clamping channel; A positioning part is arranged on the carrying part, and the positioning part comprises a stationary part and a moving part; the stationary part has an abutting surface for abutting with the plane of the edge of the wafer; the moving part is movably arranged on the carrying part to abut with the notch of the edge of the wafer; so as to position the wafer; At least two clamping portions are arranged on the support portion and correspond to positions of the clamping channel; the clamping portions have movable clamping ends; the clamping ends are close to the middle portion of the support portion along the clamping channel, cooperate with the positioning portion to form at least three contact points to clamp the wafer; and the clamping ends are away from the middle portion of the support portion along the clamping channel to release the wafer.

[0006] By adopting the technical scheme, multiple placement grooves are arranged to adapt to wafers of different diameters; meanwhile, the positioning portion is arranged to position the wafer, and the clamping portion is arranged to cooperate with the positioning portion to clamp the wafer. The positioning portion can move in the clamping channel to adapt to different placement grooves to clamp wafers of different diameters; in addition, multiple wafers can be placed in any placement groove, and the first clamping portion and the second clamping portion can cooperate to clamp multiple wafers at the same time, facilitating the clamping and transfer process of the wafers.

[0007] According to the embodiments of the present application, the stationary portion is arranged on the support portion; the stationary portion and / or the moving portion cooperate with the clamping portion to form at least three contact points to clamp the wafer.

[0008] According to the embodiments of the present application, the stationary portion includes multiple stationary positioning members; each stationary positioning member corresponds to a placement groove, and the stationary positioning member is arranged on the side wall of the placement groove; and the end face of the stationary positioning member facing the middle portion of the placement groove is the abutting face.

[0009] According to the embodiments of the present application, the height of each stationary positioning member is lower than the depth of the corresponding placement groove, or equal to the depth of the corresponding placement groove.

[0010] According to the embodiments of the present application, the support portion is provided with a positioning channel extending from the outside of the support portion to the inside of the support portion, penetrating through the multiple stationary positioning members, and communicating with the multiple placement grooves; The moving portion is movably arranged in the positioning channel; the moving portion is close to the middle portion of the support portion along the positioning channel to cooperate with the notch of the edge of the wafer to position the wafer.

[0011] According to the embodiments of the present application, the stationary positioning member is provided with a positioning channel extending from the edge of the placement groove to the center of the placement groove; The moving portion is movably arranged in the positioning channel; the moving portion is close to the middle portion of the support portion along the positioning channel to cooperate with the notch of the edge of the wafer to position the wafer.

[0012] According to the embodiment of the present application, the end of the moving part is provided with a positioning guide surface, so that the end of the moving part is adapted to the gap of the edge of the wafer; or the end of the moving part is provided with a clamping member, the clamping member has a clamping surface; the moving part moves along the positioning channel towards the middle of the supporting part, so that the clamping member cooperates with the gap of the edge of the wafer to position the wafer.

[0013] According to the embodiment of the present application, the positioning part and the at least two clamping parts are circumferentially spaced on the wafer carrier.

[0014] According to the embodiment of the present application, each clamping part corresponds to a clamping channel.

[0015] According to the embodiment of the present application, the placing groove has a contact area and a non-contact area; the contact area is arranged around the non-contact area and the contact area is used to carry the wafer.

[0016] According to the embodiment of the present application, the clamping part is a micrometer. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a schematic diagram of the main structure of a wafer positioning and clamping device according to an embodiment of the present application; Figure 2 It is a schematic diagram of the main structure of a wafer positioning and clamping device according to an embodiment of the present application; Figure 1 It is an enlarged view of part A; Figure 3 It is a schematic diagram of the connection between the moving part and the supporting part according to an embodiment of the present application; Figure 4 It is a schematic diagram of the connection between the moving part and the supporting part according to another embodiment of the present application.

[0018] Reference signs: 100, wafer carrier; 110, supporting part; 120, supporting part; 121, positioning channel; 130, placing groove; 131, contact area; 132, non-contact area; 140, clamping channel; 200, positioning part; 210, stationary part; 211, abutting surface; 212, stationary positioning member; 220, moving part; 221, positioning guide surface; 222, clamping member; 223, clamping surface; 300, clamping part; 301, clamping end. DETAILED DESCRIPTION

[0019] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below. Obviously, the described embodiments are only some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts should fall into the scope of the present application. Unless otherwise defined, the technical terms or scientific terms used herein should be understood as their common meanings to those of ordinary skill in the art to which the present application belongs. The terms such as "comprise" and like terms used herein mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects.

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Figures 1-4 The specific embodiments of the present application will be further described in detail.

[0021] The embodiments of the present application provide a wafer positioning and clamping device for clamping a wafer, wherein the wafer positioning and clamping device comprises: The wafer carrier 100 comprises a support part 110 and a bearing part 120. The bearing part 120 is arranged on the support part 110. The bearing part 120 is provided with at least one clamping channel 140 and a plurality of concentrically arranged placement grooves 130. The diameters of the plurality of placement grooves 130 gradually increase from inside to outside, so as to carry wafers of different sizes. The clamping channel 140 extends from the outside of the bearing part 120 to the middle part, so that the placement grooves 130 are all in communication with the clamping channel 140. The positioning part 200 is arranged on the bearing part 120, so as to position the wafer. The at least two clamping parts 300 are arranged on the support part 110 and correspond to the positions of the clamping channel 140. The clamping part 300 has a movable clamping end 301. The clamping end 301 is arranged along the clamping channel 140 to approach the middle part of the bearing part 120, cooperates with the positioning part 200, and forms at least three contact points, so as to clamp the wafer. The clamping end 301 is arranged along the clamping channel 140 to move away from the middle part of the bearing part 120, so as to release the wafer.

[0022] In some embodiments, the bearing part 120 is arranged on the support part 110. The arrangement mode can be adhesion, bolt fixation or integral molding, which is not limited herein. The support part 110 can support the bearing part 120 and the relative movement between the two parts will not occur. In some specific embodiments, in order to facilitate the support of the bearing part 120, the support part 110 is in the form of a plate, which can be a circular plate or a polygonal plate, which is not limited herein, as long as the support part 110 can support the bearing part 120. The bearing part 120 can be circular or polygonal, which is not limited herein, as long as the bearing part 120 can carry the wafer.

[0023] In some embodiments, in order to be able to carry different sizes of wafers, a placing groove 130 is also provided on the carrying part 120; wherein the diameter of each placing groove 130 is different. Specifically, in order to facilitate the placement of the wafer, the placing groove 130 is circular, and a plurality of placing grooves 130 are concentrically arranged, that is, the axes of a plurality of placing grooves 130 coincide with each other. In order to facilitate the placement of the wafer, a plurality of placing grooves 130 are gradually away from the bottom of the carrying part 120 from inside to outside; at the same time, the diameters of a plurality of placing grooves 130 gradually increase from inside to outside, which is convenient for placing wafers of different sizes; for example, the uppermost placing groove 130 can place a larger size wafer, the wafer placed in the middle placing groove 130 is smaller in size, and the wafer placed in the bottom placing groove 130 is the smallest in size.

[0024] In some embodiments, after the wafer is placed in the placing groove 130, the wafer needs to be positioned and clamped; wherein, in order to facilitate the positioning of the wafer, a positioning part 200 is provided on the carrying part 120, and the positioning part 200 is used for positioning the wafer. Specifically, the positioning part 200 includes a stationary part 210 and a moving part 220; The stationary part 210 is provided on the carrying part 120, and the stationary part 210 has an abutting surface 211 for abutting with the plane of the edge of the wafer; The moving part 220 is movably provided on the carrying part 120 to abut with the notch of the edge of the wafer; The stationary part 210 and / or the moving part 220 cooperate with the clamping part 300 to form at least three contact points to clamp the wafer.

[0025] In some embodiments, since part of the edge of the wafer has a flat part and part of the edge of the wafer has a notch; in order to be able to position wafers of different shapes, the positioning part 200 is provided to include a stationary part 210 and a moving part 220.

[0026] In some specific embodiments, the stationary part 210 is provided on the carrying part 120, which can be provided in a manner of bonding, bolt fixing or one-piece forming, etc., which is not limited here, as long as the relative motion between the two does not occur. Specifically, the stationary part 210 can be in the form of a plate, a block, or other shapes, which is not limited here, as long as it can position the wafer. More specifically, the stationary part 210 has an abutting surface 211, which is the end surface of the stationary part 210 facing the wafer, and the abutting surface 211 is a plane for contacting the flat part of the edge of the wafer, thereby achieving positioning of the wafer. It is worth noting that the contact between the abutting surface 211 here and the flat part of the edge of the wafer is defined as one contact point.

[0027] In some specific embodiments, the moving part 220 is movably arranged on the bearing part 120, and the end of the moving part 220 can extend to the outside of the stationary part 210, so as to be able to contact the notch of the edge of the wafer to position the wafer. When the edge of the wafer is a plane, the moving part 220 does not extend to the outside of the stationary part 210, at which time the stationary part 210 is used to position the wafer; when the edge of the wafer has a notch, the moving part 220 extends to the outside of the stationary part 210, at which time the moving part 220 is used to position the wafer. In order to achieve accurate positioning of wafers of different shapes.

[0028] In some embodiments, after the wafer is positioned, the wafer needs to be clamped. Therefore, at least two clamping parts 300 are arranged on the support part 110; in order to facilitate clamping of the clamping part 300, a clamping channel 140 is formed on the bearing part 120; wherein the clamping channel 140 extends from the outside of the bearing part 120 to the middle part to make the placement groove 130 communicate with the clamping channel 140; at the same time, the clamping part 300 corresponds to the position of the clamping channel 140; so that the clamping part 300 can contact the edge of the wafer in any placement groove 130 during movement in the clamping channel 140, thereby clamping the wafer. At the same time, the clamping part 300 cooperates with the positioning part 200 to form at least three contact points to improve the stability of wafer clamping. During wafer clamping, the clamping end 301 of the clamping part 300 moves along the clamping channel 140 towards the direction close to the middle part of the bearing part 120, thereby clamping the wafer; the clamping end 301 of the clamping part 300 moves along the clamping channel 140 towards the direction away from the middle part of the bearing part 120, thereby releasing the wafer.

[0029] In some specific embodiments, the clamping part 300 is a micrometer, so as to control the extension length of the clamping part 300, thereby more accurately positioning the wafer.

[0030] In some specific embodiments, taking two clamping parts 300 as an example, the two clamping parts 300 are symmetrically arranged about the positioning part 200, so that the stress of the wafer when clamped is stable.

[0031] In some more specific embodiments, the included angle between the two adjacent clamping parts 300 is 120°; the included angle between any clamping part 300 and the positioning part 200 is 120°; so that the stress of the wafer when clamped is stable.

[0032] In some specific embodiments, each clamping part 300 corresponds to a clamping channel 140, so as to facilitate the movement of the clamping part 300.

[0033] In some specific embodiments, a plurality of clamping parts 300 correspond to one clamping channel 140, so as to facilitate the movement of the clamping part 300.

[0034] In some embodiments, the stationary part 210 comprises a plurality of stationary positioning members 212; each stationary positioning member 212 corresponds to one placement slot 130, and the stationary positioning member 212 is arranged on the side wall of the placement slot 130. The end face of the stationary positioning member 212 directly opposite to the middle part of the placement slot 130 is the abutting face 211.

[0035] In some embodiments, since the plurality of placement slots 130 are arranged concentrically, each placement slot 130 is used to place wafers with different diameters. In order for the stationary part 210 to position the wafers in each placement slot 130, each stationary positioning member 212 is arranged to position one placement slot 130, thereby performing an independent positioning process on the wafers in each placement slot 130. Specifically, the stationary positioning member 212 is fixedly arranged in the placement slot 130, and the arrangement mode can be adhesion, clamping or integral molding, etc., which is not limited herein, as long as the stationary positioning member 212 can position the wafers in the placement slot 130.

[0036] In some specific embodiments, the height of the stationary positioning member 212 is lower than the depth of the placement slot 130 where the stationary positioning member 212 is arranged, so as to facilitate the placement of the wafers; and the wafers are kept stable after being placed in the placement slot 130, thereby improving the problem of unstable placement of the wafers caused by the height of the stationary positioning member 212 being higher than the depth of the placement slot 130 where the stationary positioning member 212 is arranged.

[0037] In some specific embodiments, the height of the stationary positioning member 212 is the same as the depth of the placement slot 130 where the stationary positioning member 212 is arranged, so as to facilitate the placement of the wafers; and the wafers are kept stable after being placed in the placement slot 130, thereby improving the problem of unstable placement of the wafers caused by the height of the stationary positioning member 212 being higher than the depth of the placement slot 130 where the stationary positioning member 212 is arranged.

[0038] In some embodiments, the positions of each stationary positioning member 212 in the corresponding placement slot 130 are different, i.e., the adjacent two stationary positioning members 212 have an included angle therebetween.

[0039] In some embodiments, the positions of each stationary positioning member 212 in the corresponding placement slot 130 are the same, i.e., the adjacent two stationary positioning members 212 do not have an included angle therebetween.

[0040] More specifically, in order to facilitate the positioning of the wafers by the stationary positioning member 212, the end face of the stationary positioning member 212 directly opposite to the middle part of the placement slot 130 is defined as the abutting face 211, and the planar part of the edge of the wafer placed in the corresponding placement slot 130 abuts against the abutting face 211 in the placement slot 130, thereby completing the positioning of the wafer.

[0041] The positioning passage 121 is formed on the bearing part 120, extends from the outside of the bearing part 120 to the inside of the bearing part 120, penetrates the plurality of stationary positioning members 212, and is in communication with the plurality of placing grooves 130. The moving part 220 is movably arranged in the positioning passage 121, and is arranged at the middle part of the bearing part 120 along the positioning passage 121 to cooperate with the notch of the edge of the wafer to position the wafer.

[0042] In some embodiments, the moving part 220 is arranged to facilitate positioning of the wafer with the notch on the edge.

[0043] In some specific embodiments, the positioning passage 121 is formed on the bearing part 120 to facilitate movement of the moving part 220, wherein the positioning passage 121 extends from the outside of the bearing part 120 to the inside of the bearing part 120 and is in communication with the plurality of placing grooves 130, that is, the moving part 220 can move towards or away from the middle part of the bearing part 120 in the positioning passage 121, so as to be moved to the position corresponding to the placing groove 130 to position the wafer in the corresponding placing groove 130.

[0044] The moving part 220 can be plate-shaped or block-shaped, which is not limited herein, and the main purpose is that the moving part 220 can move in the positioning passage 121 to cooperate with the notch of the edge of the wafer to position the wafer.

[0045] In some more specific embodiments, in order to enable the moving part 220 and the stationary positioning member 212 to cooperate with each other, the positioning passage 121 is arranged to extend from the outside of the bearing part 120 to the inside of the bearing part 120 while penetrating the plurality of stationary positioning members 212; that is, it can be understood that the relative positions of each stationary positioning member 212 in the corresponding placing groove 130 are the same, and therefore only one positioning passage 121 is needed to enable one moving part 220 to cooperate with the plurality of stationary positioning members 212 to position wafers of different shapes. For example, when the wafer with the notch on the edge is placed in the uppermost placing groove 130, the moving part 220 is controlled to move to the position of the stationary positioning member 212 in the uppermost placing groove 130, and the moving part 220 is caused to cooperate with the notch of the edge of the wafer to position the wafer; when the wafer with the notch on the edge is placed in the lowermost placing groove 130, the moving part 220 is controlled to move to the position of the stationary positioning member 212 in the lowermost placing groove 130, and the moving part 220 is caused to cooperate with the notch of the edge of the wafer to position the wafer.

[0046] The positioning passage 121 is formed on the stationary positioning member 212 and extends from the edge of the placing groove 130 towards the center of the placing groove 130. The mobile part 220 is movably arranged in the positioning channel 121, and the mobile part 220 is arranged close to the middle part of the bearing part 120 along the positioning channel 121 to cooperate with the notch of the edge of the wafer to position the wafer.

[0047] In some embodiments, in addition to the positioning channel 121 arranged on the bearing part 120, the positioning channel 121 can also be arranged on the stationary positioning member 212; since the position of the clamping part 300 is fixed, in order to ensure the stability of the wafer clamping, the relative position of each stationary positioning member 212 in the corresponding placement groove 130 is the same; at this time, the positioning channel 121 arranged on each stationary positioning member 212, the position relationship between the corresponding mobile part 220 and the corresponding stationary positioning member 212 is the same; only one group is taken as an example here. The positioning channel 121 on the stationary positioning member 212 extends from the edge of the placement groove 130 towards the center of the placement groove 130 and penetrates the placement groove 130 where it is located; at the same time, the mobile part 220 is movably arranged in the positioning channel 121 and can move close to or away from the middle part of the bearing part 120 in the positioning channel 121. When the wafer with the notch on the edge is placed in the corresponding placement groove 130, the mobile part 220 in the placement groove 130 is controlled to move, so that the mobile part 220 cooperates with the notch of the edge of the wafer to position the wafer.

[0048] In some embodiments, the height of the mobile part 220 is lower than the height of the stationary positioning member 212.

[0049] In some embodiments, the height of the mobile part 220 is the same as the height of the stationary positioning member 212.

[0050] In some specific embodiments, when the positioning channel 121 is arranged on the bearing part 120, the mobile part 220 can be manually controlled to move in the positioning channel 121; or a driving member such as an electric cylinder or a pneumatic cylinder is arranged on the support part 110, and the driving member is connected with the mobile part 220 to drive the mobile part 220 to move in the positioning channel 121 when the driving part is started. When the positioning channel 121 is arranged on the stationary positioning member 212, since the thickness of the stationary positioning member 212 is low, it is not suitable to install a driving member, so the mobile part 220 can be manually controlled to move in the positioning channel 121, and in order to ensure that the position of the mobile part 220 does not deviate, a certain resistance is arranged between the side wall of the mobile part 220 and the inner wall of the positioning channel 121; it can be understood that the mobile part 220 and the positioning channel 121 are in transition fit, since the force applied to the mobile part 220 when controlling the mobile part 220 to move is greater than the force applied to the mobile part 220 by the wafer, the mobile part 220 can be manually controlled to move, and the reaction force of the wafer on the mobile part 220 cannot drive the wafer to move, thereby ensuring the stability of the wafer clamping.

[0051] In some embodiments, the end of the moving part 220 is provided with a positioning guide surface 221, so that the end of the moving part 220 is adapted to the gap of the edge of the wafer; or the end of the moving part 220 is provided with a clamping part 222, the clamping part 222 has a clamping surface 223; the moving part 220 moves along the positioning channel 121 towards the middle of the bearing part 120, so that the clamping part 222 cooperates with the gap of the edge of the wafer to position the wafer.

[0052] In some embodiments, since the gap of the edge of the wafer is small, usually in the shape of "V", in order for the moving part 220 to be adapted to the gap of the edge of the wafer, the end of the moving part 220 is provided with a positioning guide surface 221. Specifically, the end of the moving part 220 is provided with at least two positioning guide surfaces 221, so that the width of the end of the moving part 220 gradually decreases along the direction close to the wafer, thereby adapting to the gap of the edge of the wafer, so as to realize the positioning of the wafer after the moving part 220 contacts the gap of the edge of the wafer.

[0053] In some embodiments, the clamping part 222 can also be provided at the end of the moving part 220, which can be attached, clamped or integrally formed, etc., and here the detachable connection is preferred, for example, the detachable connection by adhesion, so as to facilitate the replacement of the clamping part 222. Specifically, the clamping part 222 has a clamping surface 223, so that the end of the clamping part 222 can be adapted to the gap in the edge of the wafer. During the positioning of the wafer, the moving part 220 moves in the positioning channel 121 along the direction close to the middle of the bearing part 120, so that the end of the moving part 220 or the end of the clamping part 222 moves towards the wafer, thereby clamping the wafer to realize the positioning of the wafer.

[0054] In some embodiments, the positioning part 200 and the at least two clamping parts 300 are circumferentially spaced on the wafer table 100.

[0055] In some specific embodiments, in order to facilitate the stable clamping of the wafer, it is necessary to make the pressure applied by each contact point on the wafer substantially the same, so as to ensure the stability of the clamping of the wafer; specifically, taking two clamping parts 300 as an example, the positioning part 200 and the two clamping parts 300 are axially spaced on the wafer table 100; more specifically, the positioning part 200 and the two clamping parts 300 are uniformly axially spaced on the wafer table 100.

[0056] In some more specific embodiments, under the premise of having the positioning part 200 and the two clamping parts 300, the angle between the adjacent two clamping parts 300 is set as a first angle, and the angle between any clamping part 300 and the positioning part 200 is set as a second angle; the first angle is the same as the second angle; that is, the angle between any two of the positioning part 200 and the two clamping parts 300 is 60°.

[0057] In some embodiments, the placing groove 130 has a contact area 131 and a non-contact area 132; the contact area 131 is arranged around the non-contact area 132 and the contact area 131 is used to support the wafer.

[0058] In some embodiments, in order to facilitate the placement of wafers of different sizes, the placing groove 130 is divided into a contact area 131 and a non-contact area 132; specifically, if there is only one placing groove 130, the bottom of the placing groove 130 is flat, at this time the entire bottom surface of the placing groove 130 can be in contact with the wafer, so at this time the entire bottom surface of the placing groove 130 is the contact area 131; and in order to prevent the wafer from being bonded to the entire bottom surface of the placing groove 130, causing the wafer to be difficult to take out, a hole or groove can be opened on the bottom surface of the placing groove 130 to form a non-contact area 132, thereby reducing the possibility that the wafer is bonded to the entire bottom surface of the placing groove 130, causing the wafer to be difficult to take out. In the present embodiment, in order to facilitate understanding, the two adjacent placing grooves 130 are defined as a first groove and a second groove, that is, a second groove is opened on the bottom surface of the first groove, at this time the part of the bottom surface of the first groove where the second groove is opened is the non-contact area 132, and the area where the second groove is not opened is the contact area 131; and the second groove bottom continues to open other grooves, and the principles of the contact area 131 and the non-contact area 132 are the same as the first groove. It is worth noting that when the second groove is the bottommost groove, a groove can still be opened on the bottom surface of the second groove to form a non-contact area 132, at this time the groove opened on the bottom surface of the second groove is no longer used to place the wafer.

[0059] In some specific embodiments, the contact area needs to have sufficient support force on the wafer, and the positioning channel 121 and the clamping channel 140 are opened on the supporting part 120; therefore, it is also necessary to set the area of the contact area in each placing groove 130 to be greater than the area of the positioning channel 121 and the area of the clamping channel 140 in the placing groove 130.

[0060] In some specific embodiments, the diameter of the end of the clamping part 300 is greater than the distance from the bottom surface of the first groove to the bottom surface of the second groove, so that the clamping part 300 can be in contact with the wafer placed in any one of the placing grooves 130.

[0061] The implementation principle of the wafer positioning and clamping device is as follows: different diameter wafers are placed in corresponding placement grooves 130; after the wafer is placed, the first clamping part 300 is first controlled to move towards the wafer to realize positioning of the wafer; specifically, when the edge of the wafer is a plane, the position of the moving part 220 is fixed, and the end of the moving part 220 does not extend to the outside of the abutting surface 211, at this time, the abutting surface 211 of the stationary positioning piece 212 can abut against the plane of the edge of the wafer, thereby realizing positioning of the wafer; when the edge of the wafer has a notch, the moving part 220 is controlled to move, so that the end of the moving part 220 extends to the outside of the abutting surface 211, at this time, the end of the moving part 220 can be engaged with the notch of the edge of the wafer to realize clamping, thereby realizing positioning of the wafer; after the wafer is positioned, the clamping part 300 is controlled to move towards the wafer, thereby forming at least three contact points to complete clamping of the wafer; when wafers of different sizes are encountered, the wafer can be clamped, which can effectively avoid the adverse effects of external force on the wafer, can adapt to the clamping requirements of wafers of different sizes, and can clamp multiple wafers at the same time during transportation. That is, the core function of the positioning part 200 is to preliminarily position the wafer to be clamped. Through the abutting surface 211 or the moving part 220, it can be adapted to wafers with a flat edge or wafers with a notch. When the wafer is placed on the wafer carrier 100, the clamping piece 222 can be embedded in the notch of the edge of the wafer, thereby quickly and accurately realizing preliminary positioning of the wafer. In addition, the clamping part 300 adopts a micrometer structure, which can accurately adjust the degree of rotation according to the size of the wafer, thereby stably clamping wafers of different sizes. The micrometer has high-precision adjustment characteristics, which can ensure accurate control of the clamping force, avoid displacement of the wafer due to loose clamping, or damage to the wafer due to tight clamping. At the same time, the wafer carrier 100 is provided with a groove, i.e., a clamping channel 140, in the direction of rotation of the clamping part 300; when clamping a small-size wafer, the clamping part 300 can have enough space to rotate and will not be blocked by the wafer carrier 100, ensuring smooth clamping operation. Through the positioning part 200 corresponding to the wafer, the preliminary positioning of the wafer can be quickly realized, providing an accurate reference for subsequent clamping operation, improving the efficiency and precision of the overall operation. At the same time, the clamping part 300 adopts a micrometer structure, which can accurately adjust the degree of rotation according to the size of the wafer, cooperate with different step surfaces on the wafer carrier 100 and the groove, so that the device can stably clamp wafers of different sizes, greatly enhancing the versatility of the device. The high-precision adjustment characteristics of the micrometer can accurately control the clamping force, avoiding the problems of loose clamping or tight clamping, effectively preventing displacement, deformation or damage of the wafer due to external force during processing, and ensuring the processing quality of the wafer.

[0062] While the embodiments of the application have been illustrated and described in detail, it will be readily apparent to those skilled in the art that various modifications and changes can be made to the embodiments without departing from the scope and spirit of the application, as described in the claims. Moreover, the application described is not limited in its application to the details set forth in the description or illustrated in the drawings. The application is capable of other embodiments and of being practiced or carried out in various ways.

Claims

1. A wafer positioning and clamping device, characterized in that, include: A wafer stage (100) includes a support portion (110) and a carrier portion (120); the carrier portion (120) is disposed on the support portion (110), and at least one clamping channel (140) and a plurality of concentrically arranged placement slots (130) are formed on the carrier portion (120); the diameter of the plurality of placement slots (130) increases sequentially from the inside to the outside to support wafers of different sizes; the clamping channel (140) extends from the outside of the carrier portion (120) to the center so that the placement slots (130) are all connected to the clamping channel (140); A positioning part (200) is provided on the supporting part (120). The positioning part (200) includes a stationary part (210) and a moving part (220). The stationary part (210) has an abutting surface (211) for abutting against the plane of the edge of the wafer. The moving part (220) is movably provided on the supporting part (120) to abut against a notch on the edge of the wafer to position the wafer. At least two clamping portions (300) are provided on the support portion (110) and correspond to the position of the clamping channel (140); the clamping portion (300) has a movable clamping end (301); the clamping end (301) is located along the clamping channel (140) near the middle of the support portion (120) and cooperates with the positioning portion (200) to form at least three contact points to clamp the wafer; the clamping end (301) is located along the clamping channel (140) away from the middle of the support portion (120) to release the wafer.

2. The wafer positioning and clamping device according to claim 1, characterized in that, The stationary part (210) is disposed on the support part (120); the stationary part (210) and / or the moving part (220) cooperate with the clamping part (300) to form at least three contact points to clamp the wafer.

3. The wafer positioning and clamping device according to claim 2, characterized in that, The stationary part (210) includes a plurality of stationary positioning members (212); each stationary positioning member (212) corresponds to one placement groove (130), and the stationary positioning member (212) is disposed on the side wall of the placement groove (130), and the end face of the stationary positioning member (212) facing the middle of the placement groove (130) is the abutment surface (211).

4. The wafer positioning and clamping device according to claim 3, characterized in that, The height of each of the stationary positioning elements (212) is lower than or equal to the depth of the corresponding placement groove (130).

5. The wafer positioning and clamping device according to claim 3, characterized in that, The support part (120) is provided with a positioning channel (121), which extends from the outside of the support part (120) to the inside of the support part (120), passes through multiple stationary positioning members (212), and communicates with multiple placement slots (130); The movable part (220) is movably disposed in the positioning channel (121); the movable part (220) moves along the positioning channel (121) close to the middle of the support part (120) and engages with the notch at the edge of the wafer to position the wafer.

6. The wafer positioning and clamping device according to claim 3, characterized in that, The stationary positioning member (212) has a positioning channel (121) extending from the edge of the placement groove (130) toward the center of the placement groove (130); The movable part (220) is movably disposed in the positioning channel (121). The movable part (220) moves along the positioning channel (121) close to the middle of the support part (120) to cooperate with the notch at the edge of the wafer to position the wafer.

7. The wafer positioning and clamping device according to claim 5 or 6, characterized in that, The end of the moving part (220) is provided with a positioning guide surface (221) so that the end of the moving part (220) is adapted to the notch at the edge of the wafer; Alternatively, the end of the moving part (220) may be provided with a snap-fit ​​member (222), the snap-fit ​​member (222) having a snap-fit ​​surface (223); the moving part (220) moves along the positioning channel (121) toward the center of the bearing part (120) so that the snap-fit ​​member (222) engages with the notch at the edge of the wafer to position the wafer.

8. The wafer positioning and clamping device according to claim 1, characterized in that, The positioning part (200) and at least two clamping parts (300) are circumferentially spaced on the wafer stage (100).

9. The wafer positioning and clamping device according to claim 1, characterized in that, Each of the clamping parts (300) corresponds to one of the clamping channels (140).

10. The wafer positioning and clamping device according to claim 1, characterized in that, The placement slot (130) has a contact area (131) and a non-contact area (132); the contact area (131) is arranged around the non-contact area (132) and the contact area (131) is used to support the wafer.

11. The wafer positioning and clamping device according to claim 1, characterized in that, The clamping part (300) is a micrometer.

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