Wafer positioning and clamping device

Abstract

The application discloses a wafer positioning and clamping device, which comprises a wafer carrier, a supporting part and a bearing part. The bearing part is arranged on the supporting part, and at least one clamping channel and a plurality of concentricly arranged placing grooves are arranged on the bearing part. The diameters of the plurality of placing grooves gradually increase from inside to outside, so as to bear wafers of different sizes. The clamping channel extends from the outside to the middle of the bearing part, so that the placing grooves are all communicated with the clamping channel. A positioning part is arranged on the bearing part to position the wafer. At least two clamping parts are arranged on the supporting part and correspond to the positions of the clamping channel. The clamping part has a movable clamping end. The clamping end is close to the middle of the bearing part along the clamping channel, cooperates with the positioning part, forms at least three contact points, and clamps the wafer. The clamping end is away from the middle of the bearing part along the clamping channel, so as to release the wafer. The application can adapt to wafers of different sizes and improve the clamping reliability of the wafer.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a wafer positioning and clamping device. Background Technology

[0002] In semiconductor manufacturing, wafer fabrication is a crucial process, involving a series of high-precision and complex steps such as photolithography, etching, deposition, and polishing. To ensure the accuracy and quality of wafer fabrication, reliable clamping devices are essential for securing the wafers during these processes.

[0003] In existing technologies, wafers typically have large diameters, commonly 200mm and 300mm, while their thickness is relatively small. This structural characteristic makes wafers highly susceptible to external forces during processing, potentially leading to deformation or even damage, severely impacting wafer quality and subsequent use. Furthermore, in actual production, wafers of different sizes and models are encountered, placing higher demands on clamping devices. These devices must effectively prevent adverse effects from external forces while adapting to the clamping requirements of different wafer sizes and models. Existing clamping devices often fail to simultaneously meet these requirements in terms of adaptability and reliability.

[0004] Therefore, it is necessary to provide a new wafer positioning and clamping device to solve the above-mentioned problems existing in the prior art. Summary of the Invention

[0005] The technical problem to be solved by this application is to provide a wafer positioning and clamping device that can adapt to wafers of different sizes and improve the reliability of wafer clamping.

[0006] To address the aforementioned technical problems, according to embodiments of this application, a wafer positioning and clamping device is provided, comprising:

[0007] A wafer stage includes a support portion and a carrier portion; the carrier portion is disposed on the support portion, and at least one clamping channel and multiple concentric placement slots are formed on the carrier portion; the diameter of the multiple placement slots increases sequentially from the inside to the outside to support wafers of different sizes; the clamping channel extends from the outside of the carrier portion to the center so that all placement slots are in communication with the clamping channel;

[0008] A positioning part is disposed on the supporting part. The positioning part includes a stationary part and a movable part. The stationary part has an abutting surface for abutting against the plane of the edge of the wafer. The movable part is movably disposed on the supporting part to abut against the notch at the edge of the wafer to position the wafer.

[0009] At least two clamping portions are arranged on the support portion and correspond to positions of the clamping channel; the clamping portion has a movable clamping end; the clamping end is close to the middle portion of the support portion along the clamping channel, cooperates with the positioning portion to form at least three contact points, and clamps the wafer; the clamping end is away from the middle portion of the support portion along the clamping channel to release the wafer.

[0010] By adopting the technical scheme, multiple placement grooves are arranged to adapt to wafers of different diameters; meanwhile, the positioning portion is arranged to position the wafer, and the clamping portion is arranged to clamp the wafer in cooperation with the positioning portion. The positioning portion can move in the clamping channel to adapt to different placement grooves to clamp wafers of different diameters; in addition, multiple wafers can be placed in any placement groove, and the first clamping portion and the second clamping portion can clamp multiple wafers at the same time, facilitating the clamping and transfer process of the wafers.

[0011] According to the embodiments of the present application, the stationary portion is arranged on the support portion; the stationary portion and / or the moving portion cooperates with the clamping portion to form at least three contact points to clamp the wafer.

[0012] According to the embodiments of the present application, the stationary portion includes multiple stationary positioning members; each stationary positioning member corresponds to a placement groove, and the stationary positioning member is arranged on the side wall of the placement groove; and the end face of the stationary positioning member facing the middle portion of the placement groove is the abutting face.

[0013] According to the embodiments of the present application, the height of each stationary positioning member is lower than the depth of the corresponding placement groove, or equal to the depth of the corresponding placement groove.

[0014] According to the embodiments of the present application, the support portion is provided with a positioning channel extending from the outside of the support portion to the inside of the support portion, penetrating through the multiple stationary positioning members, and communicating with the multiple placement grooves;

[0015] The moving portion is movably arranged in the positioning channel; the moving portion is close to the middle portion of the support portion along the positioning channel to cooperate with the notch of the edge of the wafer to position the wafer.

[0016] According to the embodiments of the present application, the stationary positioning member is provided with a positioning channel extending from the edge of the placement groove to the center of the placement groove;

[0017] The moving portion is movably arranged in the positioning channel; the moving portion is close to the middle portion of the support portion along the positioning channel to cooperate with the notch of the edge of the wafer to position the wafer.

[0018] According to the embodiment of the present application, the end of the moving part is provided with a positioning guide surface, so that the end of the moving part is adapted to the gap of the edge of the wafer;

[0019] Or the end of the moving part is provided with a clamping member, the clamping member has a clamping surface; the moving part moves along the positioning channel towards the middle of the bearing part, so that the clamping member cooperates with the gap of the edge of the wafer to position the wafer.

[0020] According to the embodiment of the present application, the positioning part and the at least two clamping parts are circumferentially spaced apart on the wafer carrier.

[0021] According to the embodiment of the present application, each clamping part corresponds to a clamping channel.

[0022] According to the embodiment of the present application, the placing groove has a contact area and a non-contact area; the contact area is arranged around the non-contact area and the contact area is used to carry the wafer.

[0023] According to the embodiment of the present application, the clamping part is a micrometer. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a schematic view of the main structure of a wafer positioning and clamping device according to an embodiment of the present application;

[0025] Figure 2 It is a schematic view of the main structure of a wafer positioning and clamping device according to an embodiment of the present application; Figure 1 It is an enlarged view of part A;

[0026] Figure 3 It is a schematic view of the connection between the moving part and the bearing part according to an embodiment of the present application;

[0027] Figure 4 It is a schematic view of another connection between the moving part and the bearing part according to an embodiment of the present application.

[0028] REFERENCE NUMERALS:

[0029] 100, wafer carrier; 110, support part; 120, bearing part; 121, positioning channel; 130, placing groove; 131, contact area; 132, non-contact area; 140, clamping channel; 200, positioning part; 210, stationary part; 211, abutting surface; 212, stationary positioning member; 220, moving part; 221, positioning guide surface; 222, clamping member; 223, clamping surface; 300, clamping part; 301, clamping end. DETAILED DESCRIPTION

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects.

[0031] The following is in conjunction with the appendix Figures 1-4 The specific embodiments of the present invention will be further described in detail below.

[0032] An embodiment of the present invention provides a wafer positioning and clamping device for clamping a wafer, wherein the wafer positioning and clamping device includes:

[0033] The wafer stage 100 includes a support portion 110 and a carrier portion 120. The carrier portion 120 is disposed on the support portion 110, and at least one clamping channel 140 and a plurality of concentrically arranged placement slots 130 are formed on the carrier portion 120. The diameter of the plurality of placement slots 130 increases sequentially from the inside to the outside to accommodate wafers of different sizes. The clamping channel 140 extends from the outside of the carrier portion 120 to the center so that all placement slots 130 are in communication with the clamping channel 140.

[0034] A positioning part 200 is provided on the support part 120 to position the wafer;

[0035] At least two clamping portions 300 are provided on the support portion 110 and correspond to the position of the clamping channel 140; the clamping portion 300 has a movable clamping end 301; the clamping end 301 is close to the middle of the support portion 120 along the clamping channel 140 and cooperates with the positioning portion 200 to form at least three contact points to clamp the wafer; the clamping end 301 is away from the middle of the support portion 120 along the clamping channel 140 to release the wafer.

[0036] In some embodiments, the bearing part 120 is arranged on the support part 110, which can be arranged by bonding, bolting or integrally formed, without limitation, as long as the support part 110 can support the bearing part 120 and no relative movement occurs between the two. In some specific embodiments, in order to facilitate the support of the bearing part 120, the support part 110 is arranged in a plate shape, which can be a circular plate shape or a polygonal plate shape, without limitation, as long as it can support the bearing part 120. The bearing part 120 can be circular or polygonal, without limitation, as long as it can support the wafer.

[0037] In some embodiments, in order to be able to bear wafers of different sizes, a placing groove 130 is also provided on the bearing part 120; wherein the diameter of each placing groove 130 is different. Specifically, in order to facilitate the placement of the wafer, the placing groove 130 is arranged in a circular shape, and a plurality of placing grooves 130 are arranged concentrically, that is, the axes of a plurality of placing grooves 130 coincide with each other. In order to facilitate the placement of the wafer, a plurality of placing grooves 130 are arranged to gradually move away from the bottom of the bearing part 120 from the inside to the outside; at the same time, the diameters of a plurality of placing grooves 130 gradually increase from the inside to the outside, which is convenient for placing wafers of different sizes; for example, the uppermost placing groove 130 can place a larger size wafer, the wafer placed in the middle placing groove 130 has a smaller size, and the wafer placed in the bottom placing groove 130 has the smallest size.

[0038] In some embodiments, after the wafer is placed in the placing groove 130, the wafer needs to be positioned and clamped; wherein, in order to facilitate the positioning of the wafer, a positioning part 200 is arranged on the bearing part 120, and the positioning part 200 is used for positioning the wafer. Specifically, the positioning part 200 includes a stationary part 210 and a moving part 220;

[0039] The stationary part 210 is arranged on the bearing part 120, and the stationary part 210 has an abutting surface 211 for abutting with the plane of the edge of the wafer;

[0040] The moving part 220 is movably arranged on the bearing part 120 to abut with the notch of the edge of the wafer;

[0041] The stationary part 210 and / or the moving part 220 cooperate with the clamping part 300 to form at least three contact points to clamp the wafer.

[0042] In some embodiments, since part of the edge of the wafer has a flat part and part of the edge of the wafer has a notch; in order to be able to position wafers of different shapes, the positioning part 200 is arranged to include a stationary part 210 and a moving part 220.

[0043] In some specific embodiments, the stationary part 210 is arranged on the bearing part 120, which can be arranged by bonding, bolting or one-piece forming, etc., and is not limited here, as long as no relative movement occurs between the two. Specifically, the stationary part 210 can be in the form of a plate, a block, or other shapes, and is not limited here, as long as it can position the wafer. More specifically, the stationary part 210 has an abutting surface 211, which is the end surface of the stationary part 210 facing the wafer, and the abutting surface 211 is a plane for contacting the planar part of the edge of the wafer to position the wafer. It is worth noting that the contact between the abutting surface 211 and the planar part of the edge of the wafer is defined as a contact point.

[0044] In some specific embodiments, the movable part 220 is movably arranged on the bearing part 120, and the end of the movable part 220 can extend to the outside of the stationary part 210, so as to contact the notch of the edge of the wafer to position the wafer. When the edge of the wafer is planar, the movable part 220 does not extend to the outside of the stationary part 210, and at this time the stationary part 210 is used to position the wafer; when the edge of the wafer has a notch, the movable part 220 extends to the outside of the stationary part 210, and at this time the movable part 220 is used to position the wafer. In order to achieve accurate positioning of wafers of different shapes.

[0045] In some embodiments, after the wafer is positioned, it needs to be clamped. Therefore, at least two clamping parts 300 are arranged on the support part 110; in order to facilitate clamping by the clamping part 300, a clamping channel 140 is formed on the bearing part 120; wherein the clamping channel 140 extends from the outside to the middle of the bearing part 120 so that each placement groove 130 is in communication with the clamping channel 140; at the same time, the clamping part 300 corresponds to the position of the clamping channel 140; so that the clamping part 300 can contact the edge of the wafer in any placement groove 130 during movement in the clamping channel 140, thereby clamping the wafer. At the same time, the clamping part 300 cooperates with the positioning part 200 to form at least three contact points to improve the stability of wafer clamping. During wafer clamping, the clamping end 301 of the clamping part 300 moves along the clamping channel 140 towards the middle of the bearing part 120, thereby clamping the wafer; the clamping end 301 of the clamping part 300 moves along the clamping channel 140 away from the middle of the bearing part 120, thereby releasing the wafer.

[0046] In some specific embodiments, the clamping part 300 is a micrometer, so as to control the extension length of the clamping part 300, thereby more accurately positioning the wafer.

[0047] In some specific embodiments, two clamping parts 300 are arranged as an example, and the two clamping parts 300 are symmetrically arranged about the positioning part 200, so that the wafer is stably stressed when clamped.

[0048] In some more specific embodiments, the angle between two adjacent clamping portions 300 is 120°; the angle between any clamping portion 300 and the positioning portion 200 is 120°; so that the stress of the wafer when clamped is stable.

[0049] In some specific embodiments, each clamping portion 300 corresponds to a clamping channel 140, so as to facilitate the movement of the clamping portion 300.

[0050] In some specific embodiments, a plurality of clamping portions 300 correspond to a clamping channel 140, so as to facilitate the movement of the clamping portion 300.

[0051] In some embodiments, the stationary portion 210 includes a plurality of stationary positioning members 212; each stationary positioning member 212 corresponds to a placement slot 130, and the stationary positioning member 212 is arranged on the side wall of the placement slot 130, and the end face of the stationary positioning member 212 facing the middle part of the placement slot 130 is the abutting face 211.

[0052] In some embodiments, since a plurality of placement slots 130 are arranged concentrically, each placement slot 130 is used to place wafers with different diameters, in order for the stationary portion 210 to be able to position the wafers in each placement slot 130, each stationary positioning member 212 is arranged to position one placement slot 130, so as to independently position the wafers in each placement slot 130. Specifically, the stationary positioning member 212 is fixedly arranged in the placement slot 130, and the arrangement mode can be adhesion, clamping or integral molding, etc., which is not limited here, as long as the stationary positioning member 212 can position the wafers in the placement slot 130.

[0053] In some specific embodiments, the height of the stationary positioning member 212 is lower than the depth of the placement slot 130 where it is located, so as to facilitate the placement of the wafer; the wafer is kept stable after being placed in the placement slot 130, and the problem of unstable placement of the wafer caused by the height of the stationary positioning member 212 being higher than the depth of the placement slot 130 where it is located is improved.

[0054] In some specific embodiments, the height of the stationary positioning member 212 is the same as the depth of the placement slot 130 where it is located, so as to facilitate the placement of the wafer; the wafer is kept stable after being placed in the placement slot 130, and the problem of unstable placement of the wafer caused by the height of the stationary positioning member 212 being higher than the depth of the placement slot 130 where it is located is improved.

[0055] In some embodiments, the position of each stationary positioning member 212 in the corresponding placement slot 130 is different, that is, there is an angle between two adjacent stationary positioning members 212.

[0056] In some embodiments, each of the stationary positioning members 212 has the same position in the corresponding placement slot 130, i.e. there is no included angle between two adjacent stationary positioning members 212.

[0057] More specifically, in order to facilitate the positioning of the wafer by the stationary positioning members 212, the abutting surface 211 is defined as the surface of the stationary positioning member 212 that is perpendicular to the end surface in the placement slot 130. The planar portion of the edge of the wafer placed in the corresponding placement slot 130 abuts against the abutting surface 211 in the placement slot 130, thereby completing the positioning of the wafer.

[0058] The carrying portion 120 is provided with a positioning channel 121 extending from the outside of the carrying portion 120 to the inside of the carrying portion 120, penetrating through the plurality of stationary positioning members 212, and communicating with the plurality of placement slots 130.

[0059] The moving portion 220 is movably arranged in the positioning channel 121. The moving portion 220 is arranged to approach the middle portion of the carrying portion 120 along the positioning channel 121, and cooperates with the notch of the edge of the wafer to position the wafer.

[0060] In some embodiments, the moving portion 220 is arranged to facilitate the positioning of the wafer with the notch in the edge.

[0061] In some specific embodiments, the carrying portion 120 is provided with a positioning channel 121 facilitating the movement of the moving portion 220. The positioning channel 121 extends from the outside of the carrying portion 120 to the inside of the carrying portion 120, and communicates with the plurality of placement slots 130. That is, the moving portion 220 can approach or move away from the middle portion of the carrying portion 120 in the positioning channel 121, thereby moving to the position of the corresponding placement slot 130 to position the wafer in the corresponding placement slot 130.

[0062] The moving portion 220 can be plate-shaped or block-shaped, which is not limited herein. The main purpose is that the moving portion 220 can move in the positioning channel 121 to cooperate with the notch of the edge of the wafer to position the wafer.

[0063] In some more specific embodiments, in order for the mobile part 220 and the stationary positioning member 212 to be able to cooperate with each other, the positioning channel 121 is arranged to extend through a plurality of stationary positioning members 212 while extending from the outside of the bearing part 120 to the inside of the bearing part 120; that is, it can be understood that the relative positions of each stationary positioning member 212 in the corresponding placement slot 130 are the same, and therefore only one positioning channel 121 is needed to enable one mobile part 220 to cooperate with a plurality of stationary positioning members 212 to achieve positioning of wafers of different shapes. For example, when a wafer with a notched edge is placed in the uppermost placement slot 130, the mobile part 220 is controlled to move to the position of the stationary positioning member 212 in the uppermost placement slot 130, and the mobile part 220 is caused to cooperate with the notch of the edge of the wafer to achieve positioning; when a wafer with a notched edge is placed in the lowermost placement slot 130, the mobile part 220 is controlled to move to the position of the stationary positioning member 212 in the lowermost placement slot 130, and the mobile part 220 is caused to cooperate with the notch of the edge of the wafer to achieve positioning.

[0064] The stationary positioning member 212 is provided with a positioning channel 121 extending from the edge of the placement slot 130 towards the center of the placement slot 130;

[0065] The mobile part 220 is movably arranged in the positioning channel 121, and the mobile part 220 is arranged to move along the positioning channel 121 towards the middle of the bearing part 120 to cooperate with the notch of the edge of the wafer to achieve positioning of the wafer.

[0066] In some embodiments, in addition to the positioning channel 121 being arranged on the bearing part 120, the positioning channel 121 can also be arranged on the stationary positioning member 212; since the position of the clamping part 300 is fixed, in order to ensure the stability of the clamping of the wafer, the relative positions of each stationary positioning member 212 in the corresponding placement slot 130 are the same; at this time, the positioning channel 121 arranged on each stationary positioning member 212, the corresponding mobile part 220 and the corresponding stationary positioning member 212 have the same positional relationship; only one set is taken as an example here. The positioning channel 121 on the stationary positioning member 212 extends from the edge of the placement slot 130 towards the center of the placement slot 130 and penetrates the placement slot 130 where it is located; at the same time, the mobile part 220 is movably arranged in the positioning channel 121 and can move towards or away from the middle of the bearing part 120 in the positioning channel 121. After a wafer with a notched edge is placed in the corresponding placement slot 130, the mobile part 220 in the placement slot 130 is controlled to move, and the mobile part 220 is caused to cooperate with the notch of the edge of the wafer to achieve positioning.

[0067] In some embodiments, the height of the mobile part 220 is lower than the height of the stationary positioning member 212.

[0068] In some embodiments, the height of the moving part 220 is the same as the height of the stationary positioning member 212.

[0069] In some specific embodiments, when the positioning channel 121 is formed on the bearing part 120, the moving part 220 can be manually controlled to move in the positioning channel 121; or a driving member, such as an electric cylinder or a pneumatic cylinder, is arranged on the support part 110, and the driving member is connected with the moving part 220 to drive the moving part 220 to move in the positioning channel 121 when the driving part is started. When the positioning channel 121 is formed on the stationary positioning member 212, the stationary positioning member 212 has a low thickness and is not suitable for installing the driving member, so the moving part 220 can be manually controlled to move in the positioning channel 121, and in order to ensure that the position of the moving part 220 does not deviate, a certain resistance is arranged between the side wall of the moving part 220 and the inner wall of the positioning channel 121; it can be understood that a transition fit is arranged between the moving part 220 and the positioning channel 121, and since the force applied to the moving part 220 when the moving part 220 is controlled to move is greater than the force applied to the moving part 220 by the wafer, the moving part 220 can be manually controlled to move, and the reaction force of the wafer on the moving part 220 cannot drive the wafer to move, thereby ensuring the stability of the wafer clamping.

[0070] In some embodiments, the end of the moving part 220 is provided with a positioning guide surface 221, so that the end of the moving part 220 is adapted to the gap of the edge of the wafer;

[0071] or the end of the moving part 220 is provided with a clamping member 222, and the clamping member 222 has a clamping surface 223; the moving part 220 moves along the positioning channel 121 towards the middle part of the bearing part 120, so that the clamping member 222 cooperates with the gap of the edge of the wafer to position the wafer.

[0072] In some embodiments, since the gap of the edge of the wafer is small and usually has a "V" shape, in order to adapt the moving part 220 to the gap of the edge of the wafer, the end of the moving part 220 is provided with a positioning guide surface 221. Specifically, the end of the moving part 220 is provided with at least two positioning guide surfaces 221, so that the width of the end of the moving part 220 gradually decreases along the direction close to the wafer, thereby adapting to the gap of the edge of the wafer, so as to realize the positioning of the wafer after the moving part 220 contacts the gap of the edge of the wafer.

[0073] In some embodiments, a clamping member 222 can also be arranged at the end of the moving part 220, which can be arranged by adhesion, clamping or integral forming, etc., and is preferably detachable, for example, by adhesion, so as to facilitate replacement of the clamping member 222. Specifically, the clamping member 222 has a clamping surface 223, so that the end of the clamping member 222 can be adapted to the notch in the edge of the wafer. During positioning of the wafer, the moving part 220 moves in the positioning channel 121 towards the middle of the supporting part 120, so that the end of the moving part 220 or the end of the clamping member 222 moves towards the wafer, thereby clamping the wafer and achieving positioning of the wafer.

[0074] In some embodiments, the positioning part 200 and the at least two clamping parts 300 are arranged on the wafer supporting table 100 in a circumferential direction.

[0075] In some specific embodiments, in order to facilitate stable clamping of the wafer, the pressure applied by each contact point to the wafer needs to be substantially the same, so as to ensure stability of clamping of the wafer. Specifically, taking two clamping parts 300 as an example, the positioning part 200 and the two clamping parts 300 are arranged on the wafer supporting table 100 in an axial direction. More specifically, the positioning part 200 and the two clamping parts 300 are arranged on the wafer supporting table 100 in an axial direction uniformly.

[0076] In some more specific embodiments, under the premise of having the positioning part 200 and the two clamping parts 300, the angle between the two adjacent clamping parts 300 is set as a first angle, and the angle between any clamping part 300 and the positioning part 200 is set as a second angle. The first angle is the same as the second angle, i.e., the angle between any two of the positioning part 200 and the two clamping parts 300 is 60°.

[0077] In some embodiments, the placing groove 130 has a contact area 131 and a non-contact area 132. The contact area 131 is arranged around the non-contact area 132 and is used to support the wafer.

[0078] In some embodiments, in order to facilitate the placement of wafers of different sizes, the placement slots 130 are divided into contact areas 131 and non-contact areas 132; specifically, if there is only one placement slot 130, the bottom of the placement slot 130 is flat, so the entire bottom surface of the placement slot 130 can be in contact with the wafer, and thus the entire bottom surface of the placement slot 130 is a contact area 131; in order to prevent the wafer from being difficult to remove due to the wafer being attached to the entire bottom surface of the placement slot 130, a hole or slot can be formed on the bottom surface of the placement slot 130 to form a non-contact area 132, thereby reducing the possibility that the wafer will be difficult to remove due to the wafer being attached to the entire bottom surface of the placement slot 130. In the present embodiment, in order to facilitate understanding, the two adjacent placement slots 130 are defined as a first slot and a second slot, i.e., a second slot is formed on the bottom surface of the first slot, so the portion of the bottom surface of the first slot where the second slot is formed is a non-contact area 132, and the area where the second slot is not formed is a contact area 131; the contact area 131 and the non-contact area 132 of the second slot continue to form other slots on the bottom surface, and the principles are the same as those of the first slot; it is worth noting that when the second slot is the bottommost slot, a slot can still be formed on the bottom surface of the second slot to form a non-contact area 132, and the slot formed on the bottom surface of the second slot is no longer used to place a wafer.

[0079] In some specific embodiments, the contact area needs to have sufficient support for the wafer, and the positioning channel 121 and the clamping channel 140 are formed on the carrier 120; therefore, the area of the contact area in each placement slot 130 needs to be greater than the area of the positioning channel 121 and the area of the clamping channel 140 in the placement slot 130.

[0080] In some specific embodiments, the diameter of the end of the clamping portion 300 is greater than the distance from the bottom surface of the first slot to the bottom surface of the second slot, so that the clamping portion 300 can be in contact with the wafer placed in any one of the placement slots 130.

[0081] The implementation principle of the wafer positioning and clamping device is as follows: different diameter wafers are placed in corresponding placement grooves 130; after the wafer is placed, the first clamping part 300 is first controlled to move towards the wafer to realize positioning of the wafer; specifically, when the edge of the wafer is a plane, the position of the moving part 220 is fixed, and the end of the moving part 220 does not extend to the outside of the abutting surface 211, at this time, the abutting surface 211 of the stationary positioning piece 212 can abut against the plane of the edge of the wafer, thereby realizing positioning of the wafer; when the edge of the wafer has a notch, the moving part 220 is controlled to move, so that the end of the moving part 220 extends to the outside of the abutting surface 211, at this time, the end of the moving part 220 can be engaged with the notch of the edge of the wafer to realize clamping, thereby realizing positioning of the wafer; after the wafer is positioned, the clamping part 300 is controlled to move towards the wafer, thereby forming at least three contact points to complete clamping of the wafer; when wafers of different sizes are encountered, the wafer can be clamped, which can effectively avoid the adverse effects of external force on the wafer, can adapt to the clamping requirements of wafers of different sizes, and can clamp multiple wafers at the same time during transportation. That is, the core function of the positioning part 200 is to preliminarily position the wafer to be clamped. Through the abutting surface 211 or the moving part 220, it can be adapted to wafers with a flat edge or wafers with a notch. When the wafer is placed on the wafer carrier 100, the clamping piece 222 can be embedded in the notch of the edge of the wafer, thereby quickly and accurately realizing preliminary positioning of the wafer. In addition, the clamping part 300 adopts a micrometer structure, which can accurately adjust the degree of rotation according to the size of the wafer, thereby stably clamping wafers of different sizes. The micrometer has high-precision adjustment characteristics, which can ensure accurate control of the clamping force, avoid displacement of the wafer due to loose clamping, or damage to the wafer due to tight clamping. At the same time, the wafer carrier 100 is provided with a groove, i.e., a clamping channel 140, in the direction of rotation of the clamping part 300; when clamping a small-size wafer, the clamping part 300 can have enough space to rotate and will not be blocked by the wafer carrier 100, ensuring smooth clamping operation. Through the positioning part 200 corresponding to the wafer, the preliminary positioning of the wafer can be quickly realized, providing an accurate reference for subsequent clamping operation, improving the efficiency and precision of the overall operation. At the same time, the clamping part 300 adopts a micrometer structure, which can accurately adjust the degree of rotation according to the size of the wafer, cooperate with different step surfaces on the wafer carrier 100 and the groove, so that the device can stably clamp wafers of different sizes, greatly enhancing the versatility of the device. The high-precision adjustment characteristics of the micrometer can accurately control the clamping force, avoiding the problems of loose clamping or tight clamping, effectively preventing displacement, deformation or damage of the wafer due to external force during processing, and ensuring the processing quality of the wafer.

[0082] While the embodiments of the application have been illustrated and described in detail, it will be readily apparent to those skilled in the art that various modifications and changes can be made to the embodiments without departing from the scope and spirit of the application, as described in the claims. Moreover, the application described is not limited in its application to the details set forth in the description or illustrated in the drawings. The application is capable of other embodiments and of being practiced or carried out in various ways.

Claims

1. A wafer positioning and clamping device, characterized by, The application relates to a wafer carrier (100) comprising a support part (110) and a bearing part (120); the bearing part (120) is arranged on the support part (110), and at least one clamping channel (140) and a plurality of concentricly arranged placing grooves (130) are arranged on the bearing part (120); the diameters of the plurality of placing grooves (130) gradually increase from inside to outside to bear wafers of different sizes; the clamping channel (140) extends from the outside to the middle of the bearing part (120) to make the placing grooves (130) communicate with the clamping channel (140); a positioning part (200) arranged on the bearing part (120); the positioning part (200) comprises a static part (210) and a moving part (220); the static part (210) has an abutting surface (211) for abutting with the plane of the edge of the wafer; the moving part (220) is movably arranged on the bearing part (120) to abut with the notch of the edge of the wafer; the wafer is positioned; the static part (210) comprises a plurality of static positioning members (212); each static positioning member (212) corresponds to one placing groove (130), and the static positioning member (212) is arranged on the side wall of the placing groove (130); the end surface of the static positioning member (212) facing the middle part of the placing groove (130) is the abutting surface (211); a positioning channel (121) is arranged on the bearing part (120); the positioning channel (121) extends from the outside of the bearing part (120) to the inside of the bearing part (120), penetrates through the plurality of static positioning members (212) and communicates with the plurality of placing grooves (130); the moving part (220) is movably arranged in the positioning channel (121); the moving part (220) is close to the middle part of the bearing part (120) along the positioning channel (121) and cooperates with the notch of the edge of the wafer to position the wafer; at least two clamping parts (300) are arranged on the support part (110) and correspond to the positions of the clamping channels (140); the clamping part (300) has a movable clamping end (301); the clamping end (301) is close to the middle part of the bearing part (120) along the clamping channel (140) and cooperates with the positioning part (200) to form at least three contact points to clamp the wafer; the clamping end (301) is away from the middle part of the bearing part (120) along the clamping channel (140) to release the wafer. The static part (210) is arranged on the bearing part (120); the static part (210) and / or the moving part (220) cooperates with the clamping part (300) to form at least three contact points to clamp the wafer.

2. The wafer positioning and chucking apparatus of claim 1, wherein, The height of each static positioning member (212) is lower than the depth of the corresponding placing groove (130) or is equal to the depth of the corresponding placing groove (130).

3. The wafer positioning and chucking apparatus of claim 1, wherein, ​ 4. The wafer positioning and chucking apparatus of claim 1, wherein, An end of the moving part (220) is provided with a positioning guide surface (221) to adapt the end of the moving part (220) to the gap of the edge of the wafer; Or an end of the moving part (220) is provided with a clamping piece (222) having a clamping surface (223); the moving part (220) moves along the positioning channel (121) towards the middle of the bearing part (120) to make the clamping piece (222) cooperate with the gap of the edge of the wafer to position the wafer.

5. The wafer positioning and chucking apparatus of claim 1, wherein, The positioning part (200) and at least two clamping parts (300) are circumferentially spaced on the wafer carrier (100).

6. The wafer positioning and chucking apparatus of claim 1, wherein, Each clamping part (300) corresponds to a clamping channel (140).

7. The wafer positioning and chucking apparatus of claim 1, wherein, The placing groove (130) has a contact area (131) and a non-contact area (132); the contact area (131) is arranged around the non-contact area (132) and the contact area (131) is used to carry the wafer.

8. The wafer positioning and chucking apparatus of claim 1, wherein, The clamping part (300) is a micrometer.

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