A color-resistant chemical plating packaging paste, a preparation method and application thereof

Abstract

The application discloses a kind of color resistant plating packaging paste and its preparation method and application, belong to electronic packaging technical field, the color resistant plating packaging paste includes glass powder and organic carrier;The glass powder includes the following components: bismuth oxide, silicon oxide, zinc oxide, additive, zirconium oxide, titanium oxide, aluminum oxide, calcium carbonate;The organic carrier includes resin, and the resin includes that the mass ratio of ethyl cellulose, acrylic resin and polyvinyl butyral resin is 1: (0.4~1.6) : (0.4~1.6);The additive includes that the mass ratio of boric acid and sodium carbonate is (7~10) : (0.5~3).The packaging paste is less than 1% to silver wire resistivity influence, the resistance value influence of thick film resistance is 100Ω / m and 1kΩ / m is less than 1.5%, after chemical nickel-palladium-gold plating, glass glaze surface gloss has no loss, thickness has no loss, with wide application prospect.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic packaging, and particularly relates to a color-resistant plating packaging paste, a preparation method and application thereof. BACKGROUND

[0002] Traditional packaging pastes are divided into medium-temperature packaging pastes (600-650 DEG C) and high-temperature packaging pastes (750-850 DEG C). In the process of manufacturing thick film hybrid integrated circuits, due to the sintering characteristics of the multi-layer structure, the surface packaging glass glaze is required to have the characteristics of low sintering temperature, and is required to be sintered in the temperature range of 600-650 DEG C (i.e. medium-temperature sintering).

[0003] Medium-temperature sintering (600-650 DEG C) requires that the glass paste has a low softening point, and the packaging of the thick film resistor surface also requires that the glass glaze has an influence of <2% on the resistance value of the thick film resistor and the silver line after sintering. For high-density thick film hybrid integrated circuits, the resistance value of the silver line in the ultra-fine line cannot be ignored, and the change in the resistance value and the resistance value precision of the thick film resistor have a great influence on the product performance. Therefore, the influence of the packaging glass glaze on the resistance value of the silver line and the resistance value of the thick film resistor needs to be controlled as small as possible.

[0004] In the thick film hybrid integrated circuit, some products need to be packaged with chips, and the connection between the chip and the circuit is usually performed by gold wire bonding. The silver pad on the packaging substrate has a low yield in the gold wire bonding process, and the plating of nickel-gold or nickel-palladium-gold is usually used to improve the yield of bonding. Therefore, the packaging glass glaze also needs to be not dissolved or corroded in the strong acid and strong reducing environment of plating.

[0005] In view of this, the present application is proposed. SUMMARY

[0006] The present application aims to overcome the deficiencies in the prior art and provide a color-resistant plating packaging paste, a preparation method and application thereof, which has a small influence on the resistance value of the thick film resistor.

[0007] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is as follows:

[0008] A color-resistant plating packaging paste, comprising a glass powder and an organic carrier.

[0009] The glass powder comprises the following components in parts by mass: 50-56 parts of bismuth oxide, 25-29 parts of silicon oxide, 7-10 parts of zinc oxide, 7.5-13 parts of an additive, 0.5-5 parts of zirconium oxide, 0.5-5 parts of titanium oxide, 0.5-3 parts of aluminum oxide, and 0.5-1 part of calcium carbonate.

[0010] The organic carrier includes resin, and the resin includes ethyl cellulose, acrylic resin and polyvinyl butyral resin with a mass ratio of 1: (0.1-0.4): (0.1-0.4).

[0011] The additive includes boric acid and sodium carbonate with a mass ratio of (7-10): (0.5-3).

[0012] The glass powder has acid resistance, reduction resistance and an expansion coefficient lower than 7.5*10 -6 / K. The color-resistant plating packaging paste has suitable viscosity and is suitable for being applied on the surface of a product by a screen printing method. After sintering at 600 DEG C (medium temperature), a dense and uniform glass glaze layer is formed. Since the glass powder has high viscosity after melting, the infiltration of silver and resistance is low, so the glass powder can be less infiltrated into the internal part of a silver wire and a thick film resistance, thereby affecting the resistivity and square resistance. Since the content of the acid-resistant component in the glass is low and the content of Si-B-Bi forming a network structure is high, the acid-resistant element is completely wrapped in the network structure and cannot be corroded by acid. Since the glass powder does not contain variable valence elements, the glass powder cannot be reduced in a reduction system, and the resistance to plating is excellent. The packaging paste has an influence of less than 1% on the resistivity of a silver wire and an influence of less than 1.5% on the resistance of a thick film resistance. After electroless nickel-palladium-gold plating, the glass glaze has no loss in gloss and thickness, and has a wide application prospect.

[0013] In the glass powder, bismuth oxide is a main component, forms a skeleton structure with silicon oxide, provides a basic expansion coefficient and softening point, zinc oxide, calcium carbonate and aluminum oxide can significantly improve the chemical stability of the glass powder, improve the resistance to plating and mechanical strength, the addition of sodium carbonate and boric acid significantly improves the softening point and expansion coefficient of the system, promotes glass crystallization, so that the glass powder can be sintered at medium temperature, and the addition of titanium oxide and zirconium oxide improves the acid resistance and corrosion resistance. The interaction between the components in the glass powder affects each other, so that the packaging paste has a medium temperature sintering effect and improves the resistance influence on the thick film paste.

[0014] The resin is suitable for the glass powder, effectively improves the fluidity and stability of the glass powder, improves the resolution of the packaging paste, avoids the infiltration of the glass powder into the internal part of a silver wire and a thick film resistance, and reduces the resistance influence on the thick film resistance paste.

[0015] As a preferred embodiment of the present application, the resin includes ethyl cellulose, acrylic resin and polyvinyl butyral resin with a mass ratio of 1: (0.1-0.2): (0.1-0.2).

[0016] As a preferred embodiment of the present application, the organic carrier comprises resin, solvent, leveling agent, defoaming agent and dispersant in a mass ratio of (8-12):(78-85):(1-3):(1-3):(4-10).

[0017] As a preferred embodiment of the present application, the solvent comprises at least one of terpineol, diethylene glycol dibenzoate, diethylene glycol butyl ether, diethylene glycol butyl ether acetate, dipropylene glycol butyl ether acetate, dipropylene glycol butyl ether, petroleum ether, isophorone, and N,N-dimethylformamide.

[0018] As a preferred embodiment of the present application, the solvent comprises terpineol and diethylene glycol dibenzoate in a mass ratio of 1:(0.2-0.3).

[0019] As a preferred embodiment of the present application, the mass ratio of the glass powder and the organic carrier is (6.5-7.2):(2.8-3.5).

[0020] As a preferred embodiment of the present application, the leveling agent is an acrylate leveling agent.

[0021] As a preferred embodiment of the present application, the defoaming agent is a solvent-free defoaming agent.

[0022] The dispersant is a polymeric phosphate dispersant.

[0023] The present application also provides a preparation method of the color-resistant plating packaging paste.

[0024] The bismuth oxide, silicon oxide, zinc oxide, additive, zirconium oxide, titanium oxide, aluminum oxide and calcium carbonate are mixed uniformly, melted, quenched with water, dried, and ball milled to obtain the glass powder.

[0025] The organic carrier and the glass powder are mixed uniformly and ground to obtain the color-resistant plating packaging paste.

[0026] As a preferred embodiment of the present application, the melting temperature is 1180-1250℃.

[0027] The present application also provides an application of the color-resistant plating packaging paste in the preparation of electronic components.

[0028] The glass powder of the present application has the advantages of acid resistance, reduction resistance, and an expansion coefficient lower than 7.5*10-6 / ℃. -6The color-resistant plating packaging paste has suitable viscosity, and is suitable for being applied on the surface of a product by a screen printing method. After sintering at 600 DEG C (medium temperature), a dense and uniform glass glaze layer is formed. Since the glass powder has high viscosity after melting, the wettability of silver and resistors is low, so that the glass powder can be less infiltrated into the internal part of the silver wire and the thick film resistor, and affect the resistivity and square resistance. Since the content of the acid-resistant component in the glass is low, and the content of Si-B-Bi forming a network structure is high, the acid-resistant element is completely wrapped in the network structure, and cannot be corroded by acid. At the same time, since the glass powder does not contain variable elements, it cannot be reduced in a reducing system, and has excellent plating resistance. The packaging paste has an influence of less than 1% on the resistivity of the silver wire, and an influence of less than 1.5% on the resistance value of the thick film resistor with a square resistance of 100 Ω / m and 1 kΩ / m. After electroless nickel-palladium-gold plating, the glass glaze surface has no loss of gloss and thickness, and has a wide application prospect. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 Printed for resolution test.

[0030] Figure 2 Printed for silver resistivity test. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be clearly and completely described below. Obviously, the described embodiments are some embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0032] In the present application, the technical features described in an open form include a closed technical scheme composed of listed features, and also include an open technical scheme containing listed features.

[0033] In the present application, if no special description is provided, the numerical range is regarded as continuous, and includes the minimum value and the maximum value of the range, and each value between the minimum value and the maximum value. Further, when the range refers to an integer, each integer between the minimum value and the maximum value of the range is included. In addition, when multiple ranges are provided to describe a feature or a characteristic, the ranges can be combined. In other words, unless otherwise specified, all the ranges disclosed herein should be understood as including any and all sub-ranges falling within the range.

[0034] In the present application, the specific dispersion and stirring treatment method is not particularly limited.

[0035] The components and raw materials used in the embodiments and comparative examples of the present application are commercially available unless otherwise specified, and the components and raw materials used in each parallel experiment are the same.

[0036] The acrylic resin is from Nanbenhua Cheng, and the model number is ER2600.

[0037] The polyvinyl butyral resin is from Jishui Chemical, and the model number is BM-2.

[0038] The following examples are provided to facilitate an understanding of the present application. The provision of these examples is not intended to limit the scope of the claims.

[0039] Example 1

[0040] A color-resistant plating packaging paste includes glass powder and an organic carrier in a mass ratio of 7:3.

[0041] The glass powder includes the following components in parts by mass: 50 parts of bismuth oxide, 29 parts of silicon oxide, 7 parts of zinc oxide, 10 parts of boric acid, 3 parts of sodium carbonate, 0.5 parts of zirconium oxide, 5 parts of titanium oxide, 0.5 parts of aluminum oxide, and 1 part of calcium carbonate.

[0042] The organic carrier includes resin, solvent, leveling agent, defoaming agent, and dispersant in a mass ratio of 10:80:2:2:6. The resin includes ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:0.2:0.1. The solvent includes terpineol and diethylene glycol dibenzoate in a mass ratio of 1:0.25.

[0043] The leveling agent is an acrylate leveling agent BYK3500.

[0044] The defoaming agent is a solvent-free defoaming agent BYK1794.

[0045] The dispersant is a polymeric phosphate dispersant BYK110.

[0046] The preparation method of the color-resistant plating packaging paste includes the following steps:

[0047] (1) Mix bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide, and calcium carbonate uniformly, melt at 1200°C, quench the molten slurry with water, dry, and ball mill to D50 of 1.5 μm to obtain glass powder;

[0048] (2) Add solvent, leveling agent, defoaming agent, and dispersant to a stirring tank in proportion, stir uniformly, then warm up to 60°C, stir uniformly, add resin, stir uniformly, and obtain an organic carrier;

[0049] (3) the organic carrier and the glass powder are mixed uniformly, and after three-roll grinding, a color-resistant plating packaging paste is obtained.

[0050] Example 2

[0051] A color-resistant plating packaging paste comprises glass powder and an organic carrier in a mass ratio of 7:3.

[0052] The glass powder comprises the following components in parts by mass: 56 parts of bismuth oxide, 25 parts of silicon oxide, 10 parts of zinc oxide, 7 parts of boric acid, 0.5 parts of sodium carbonate, 5 parts of zirconium oxide, 0.5 parts of titanium oxide, 3 parts of aluminum oxide, and 0.5 parts of calcium carbonate.

[0053] The organic carrier comprises resin, solvent, leveling agent, defoaming agent, and dispersant in a mass ratio of 10:80:2:2:6. The resin comprises ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:0.2:0.1. The solvent comprises terpineol and diethylene glycol dibenzoate in a mass ratio of 1:0.25.

[0054] The leveling agent is an acrylate leveling agent BYK3500.

[0055] The defoaming agent is a solvent-free defoaming agent BYK1794.

[0056] The dispersant is a polymeric phosphate dispersant BYK110.

[0057] The preparation method of the color-resistant plating packaging paste comprises the following steps:

[0058] (1) bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide, and calcium carbonate are uniformly mixed, melted at 1200°C, quenched with water, dried, and ball milled to D50 of 1.5 μm to obtain glass powder;

[0059] (2) the solvent, leveling agent, defoaming agent, and dispersant are added to a stirring tank in proportion, stirred uniformly, then heated to 60°C, stirred uniformly, the resin is added, and stirred uniformly to obtain an organic carrier;

[0060] (3) the organic carrier and the glass powder are mixed uniformly, and after three-roll grinding, a color-resistant plating packaging paste is obtained.

[0061] Example 3

[0062] A color-resistant plating packaging paste comprises glass powder and an organic carrier in a mass ratio of 7:3.

[0063] The glass powder comprises the following components by mass fraction: 50 parts of bismuth oxide, 29 parts of silicon oxide, 7 parts of zinc oxide, 10 parts of boric acid, 3 parts of sodium carbonate, 0.5 parts of zirconium oxide, 5 parts of titanium oxide, 0.5 parts of aluminum oxide, and 1 part of calcium carbonate.

[0064] The organic carrier comprises resin, solvent, leveling agent, defoaming agent, and dispersant in a mass ratio of 10:80:2:2:6. The resin comprises ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:0.1:0.2. The solvent comprises terpineol and diethylene glycol dibenzoate in a mass ratio of 1:0.25.

[0065] The leveling agent is an acrylate leveling agent BYK3500.

[0066] The defoaming agent is a solvent-free defoaming agent BYK1794.

[0067] The dispersant is a polymeric phosphate dispersant BYK110.

[0068] The preparation method of the color-resistant plating packaging paste comprises the following steps:

[0069] (1) uniformly mix bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide, and calcium carbonate, melt at 1200°C, water quench the molten slurry, dry, and ball mill to D50 of 1.5μm to obtain a glass powder;

[0070] (2) add solvent, leveling agent, defoaming agent, and dispersant into a stirring tank in proportion, stir uniformly, then heat to 60°C, stir uniformly, add resin, stir uniformly, and obtain an organic carrier;

[0071] (3) uniformly mix the organic carrier and the glass powder, pass through three-roll grinding to obtain a color-resistant plating packaging paste.

[0072] Example 4

[0073] A color-resistant plating packaging paste comprises a glass powder and an organic carrier in a mass ratio of 7:3.

[0074] The glass powder comprises the following components by mass fraction: 50 parts of bismuth oxide, 29 parts of silicon oxide, 7 parts of zinc oxide, 10 parts of boric acid, 3 parts of sodium carbonate, 0.5 parts of zirconium oxide, 5 parts of titanium oxide, 0.5 parts of aluminum oxide, and 1 part of calcium carbonate.

[0075] The organic carrier comprises resin, solvent, leveling agent, defoaming agent, and dispersant in a mass ratio of 10:80:2:2:6. The resin comprises ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:0.4:0.2. The solvent comprises terpineol and diethylene glycol dibenzoate in a mass ratio of 1:0.25.

[0076] The leveling agent is an acrylate leveling agent BYK3500.

[0077] The defoaming agent is a solvent-free defoaming agent BYK1794.

[0078] The dispersing agent is a polymeric phosphate dispersing agent BYK110.

[0079] The preparation method of the color-resistant plating packaging paste comprises the following steps:

[0080] (1) uniformly mix bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide, and calcium carbonate, melt at 1200°C, water quench the molten slurry, dry, and ball mill to D50 of 1.5μm to obtain a glass powder;

[0081] (2) add solvent, leveling agent, defoaming agent, and dispersing agent into a stirring tank in proportion, stir uniformly, then heat to 60°C, stir uniformly, add resin, stir uniformly, and obtain an organic carrier;

[0082] (3) uniformly mix the organic carrier and the glass powder, and obtain a color-resistant plating packaging paste after three-roll grinding.

[0083] Example 5

[0084] A color-resistant plating packaging paste comprises a glass powder and an organic carrier in a mass ratio of 7:3.

[0085] The glass powder comprises the following components in mass parts: 50 parts of bismuth oxide, 29 parts of silicon oxide, 7 parts of zinc oxide, 10 parts of boric acid, 3 parts of sodium carbonate, 0.5 parts of zirconium oxide, 5 parts of titanium oxide, 0.5 parts of aluminum oxide, and 1 part of calcium carbonate.

[0086] The organic carrier comprises resin, solvent, leveling agent, defoaming agent, and dispersing agent in a mass ratio of 10:80:2:2:6. The resin comprises ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:0.2:0.4. The solvent comprises terpineol and diethylene glycol dibenzoate in a mass ratio of 1:0.25.

[0087] The leveling agent is an acrylate leveling agent BYK3500.

[0088] The defoaming agent is a solvent-free defoaming agent BYK1794.

[0089] The dispersing agent is a polymeric phosphate dispersing agent BYK110.

[0090] The preparation method of the color-resistant plating packaging paste comprises the following steps:

[0091] (1) Bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide, calcium carbonate are mixed uniformly, melted at 1200℃, the molten slurry is water quenched, dried, ball milled to D50 of 1.5μm, to obtain glass powder;

[0092] (2) The solvent, leveling agent, defoaming agent, dispersing agent are added into the stirring tank in proportion, stirred uniformly, then heated to 60℃, stirred uniformly, the resin is added, stirred uniformly, to obtain the organic carrier;

[0093] (3) The organic carrier and glass powder are mixed uniformly, after three roll grinding, to obtain the color resistant plating packaging paste.

[0094] Example 6

[0095] A color resistant plating packaging paste, comprising glass powder and organic carrier in a mass ratio of 7:3.

[0096] The glass powder comprises the following components in mass fraction: 50 parts of bismuth oxide, 29 parts of silicon oxide, 7 parts of zinc oxide, 10 parts of boric acid, 3 parts of sodium carbonate, 0.5 parts of zirconium oxide, 5 parts of titanium oxide, 0.5 parts of aluminum oxide, 1 part of calcium carbonate.

[0097] The organic carrier comprises resin, solvent, leveling agent, defoaming agent and dispersing agent in a mass ratio of 10:80:2:2:6. The resin comprises ethyl cellulose, acrylic resin and polyvinyl butyral resin in a mass ratio of 1:0.2:0.1. The solvent is terpineol.

[0098] The leveling agent is acrylate leveling agent BYK3500.

[0099] The defoaming agent is solvent-free defoaming agent BYK1794.

[0100] The dispersing agent is polymeric phosphate dispersing agent BYK110.

[0101] The preparation method of the color resistant plating packaging paste comprises the following steps:

[0102] (1) Bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide, calcium carbonate are mixed uniformly, melted at 1200℃, the molten slurry is water quenched, dried, ball milled to D50 of 1.5μm, to obtain glass powder;

[0103] (2) The solvent, leveling agent, defoaming agent, dispersing agent are added into the stirring tank in proportion, stirred uniformly, then heated to 60℃, stirred uniformly, the resin is added, stirred uniformly, to obtain the organic carrier;

[0104] (3) The organic carrier and glass powder are mixed uniformly, after three roll grinding, to obtain the color resistant plating packaging paste.

[0105] Example 7

[0106] A color-resistant plating packaging paste comprises glass powder and organic carrier in a mass ratio of 7:3.

[0107] The glass powder comprises the following components in parts by mass: 50 parts of bismuth oxide, 29 parts of silicon oxide, 7 parts of zinc oxide, 10 parts of boric acid, 3 parts of sodium carbonate, 0.5 parts of zirconium oxide, 5 parts of titanium oxide, 0.5 parts of aluminum oxide, and 1 part of calcium carbonate.

[0108] The organic carrier comprises resin, solvent, leveling agent, defoaming agent, and dispersant in a mass ratio of 10:80:2:2:6. The resin comprises ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:0.2:0.1. The solvent is diethylene glycol dibenzoate.

[0109] The leveling agent is an acrylate leveling agent BYK3500.

[0110] The defoaming agent is a solvent-free defoaming agent BYK1794.

[0111] The dispersant is a polymeric phosphate dispersant BYK110.

[0112] The preparation method of the color-resistant plating packaging paste comprises the following steps:

[0113] (1) uniformly mix bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide, and calcium carbonate, melt at 1200°C, water quench the molten slurry, dry, and ball mill to D50 of 1.5μm to obtain glass powder;

[0114] (2) add solvent, leveling agent, defoaming agent, and dispersant into a stirring tank in proportion, stir uniformly, then heat to 60°C, stir uniformly, add resin, stir uniformly, and obtain organic carrier;

[0115] (3) uniformly mix the organic carrier and the glass powder, and pass through three-roll grinding to obtain the color-resistant plating packaging paste.

[0116] Example 8

[0117] A color-resistant plating packaging paste comprises glass powder and organic carrier in a mass ratio of 7:3.

[0118] The glass powder comprises the following components in parts by mass: 50 parts of bismuth oxide, 29 parts of silicon oxide, 7 parts of zinc oxide, 10 parts of boric acid, 3 parts of sodium carbonate, 0.5 parts of zirconium oxide, 5 parts of titanium oxide, 0.5 parts of aluminum oxide, and 1 part of calcium carbonate.

[0119] The organic carrier includes resin, solvent, leveling agent, defoaming agent and dispersant with a mass ratio of 10:80:2:2:6. The resin includes ethyl cellulose, acrylic resin and polyvinyl butyral resin with a mass ratio of 1:0.2:0.1. The solvent includes terpineol and diethylene glycol butyl ether with a mass ratio of 1:0.25.

[0120] The leveling agent is an acrylate leveling agent BYK3500.

[0121] The defoaming agent is a solvent-free defoaming agent BYK1794.

[0122] The dispersant is a polymeric phosphate dispersant BYK110.

[0123] The preparation method of the color-resistant plating packaging paste includes the following steps:

[0124] (1) uniformly mix bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide and calcium carbonate, melt at 1200°C, water quench the molten slurry, dry, ball mill to D50 of 1.5μm, and obtain glass powder;

[0125] (2) add solvent, leveling agent, defoaming agent and dispersant into a stirring tank in proportion, stir uniformly, then heat to 60°C, stir uniformly, add resin, stir uniformly, and obtain organic carrier;

[0126] (3) uniformly mix the organic carrier and the glass powder, pass through three-roll grinding, and obtain color-resistant plating packaging paste.

[0127] Comparative Example 1

[0128] Comparative Example 1 is different from Example 1 in that the proportion of the glass powder is different, and other aspects are the same.

[0129] The glass powder of the present comparative example includes the following components in mass parts: 40 parts of bismuth oxide, 40 parts of silicon oxide, 5 parts of zinc oxide, 12 parts of boric acid, 5 parts of sodium carbonate, 0.2 parts of zirconium oxide, 6 parts of titanium oxide, 0.2 parts of aluminum oxide, and 2 parts of calcium carbonate.

[0130] Comparative Example 2

[0131] Comparative Example 2 is different from Example 1 in that the proportion of the glass powder is different, and other aspects are the same.

[0132] The glass powder of the present comparative example includes the following components in mass parts: 65 parts of bismuth oxide, 20 parts of silicon oxide, 12 parts of zinc oxide, 4 parts of boric acid, 2 parts of sodium carbonate, 6 parts of zirconium oxide, 0.2 parts of titanium oxide, 4 parts of aluminum oxide, and 0.4 parts of calcium carbonate.

[0133] Comparative Example 3

[0134] Comparative Example 3 differs from Example 1 in that Comparative Example 3 does not contain boric acid and sodium carbonate, and is otherwise identical.

[0135] The glass powder of this comparative example comprises the following components in parts by mass: 50 parts of bismuth oxide, 29 parts of silicon oxide, 7 parts of zinc oxide, 0.5 parts of zirconium oxide, 5 parts of titanium oxide, 0.5 parts of aluminum oxide, and 1 part of calcium carbonate.

[0136] Comparative Example 4

[0137] Comparative Example 4 differs from Example 1 in that Comparative Example 4 uses an equivalent amount of boron oxide instead of boric acid and sodium carbonate, and is otherwise identical.

[0138] The glass powder of this comparative example comprises the following components in parts by mass: 50 parts of bismuth oxide, 29 parts of silicon oxide, 7 parts of zinc oxide, 13 parts of boron oxide, 0.5 parts of zirconium oxide, 5 parts of titanium oxide, 0.5 parts of aluminum oxide, and 1 part of calcium carbonate.

[0139] Comparative Example 5

[0140] Comparative Example 5 differs from Example 1 in that the glass powder is different (other components are used instead of boric acid and sodium carbonate), and is otherwise identical.

[0141] The glass powder of this comparative example comprises the following components in parts by mass: 50 parts of bismuth oxide, 29 parts of silicon oxide, 7 parts of zinc oxide, 10 parts of magnesium oxide, 3 parts of tungsten oxide, 0.5 parts of zirconium oxide, 5 parts of titanium oxide, 0.5 parts of aluminum oxide, and 1 part of calcium carbonate.

[0142] Comparative Example 6

[0143] Comparative Example 6 differs from Example 1 in that the resin is different (the total amount of resin is unchanged), and is otherwise identical.

[0144] The resin of this comparative example comprises acrylic resin and polyvinyl butyral resin in a mass ratio of 0.65:0.65.

[0145] Comparative Example 7

[0146] Comparative Example 7 differs from Example 1 in that the resin is different (the total amount of resin is unchanged), and is otherwise identical.

[0147] The resin of this comparative example comprises ethyl cellulose and polyvinyl butyral resin in a mass ratio of 1:0.2.

[0148] Comparative Example 8

[0149] Comparative Example 8 differs from Example 1 in that the resin is different (the total amount of resin is unchanged), and is otherwise identical.

[0150] The resin described in the present comparative example includes ethyl cellulose and acrylic resin in a mass ratio of 1:0.1.

[0151] Test Example

[0152] Resolution test: The present application adopts a screen printing method, the screen is designed as a 420-mesh polyester screen, the glue thickness is 10 microns, the screen tension is 25 N, the printed line is designed as a line width of 80 μm / 80 μm, 100 μm / 100 μm, 120 μm / 120 μm, 150 μm / 150 μm, 180 μm / 180 μm, 250 μm / 250 μm. The test pattern is shown in Figure 1 . The test is based on the line edge being neat and the line being not connected. The minimum line width and line spacing of the line edge being neat and the line being not connected is the resolution of the paste.

[0153] Resistivity influence test: as shown in Figure 2 , a layer of the above glass paste is printed on the silver line for silver resistivity test, after sintering, the silver resistance value before and after sintering (600℃, 10 min) of the glass paste is tested, so as to calculate the influence of sintering of the glass paste on the silver resistivity, the resistance value change rate = 100*(resistance value after sintering-resistance value before sintering) / resistance value before sintering.

[0154] Sheet resistance influence test: a layer of the above glass paste is printed on the thick film resistance paste sheet for sheet resistance test, after sintering (600℃, 1 h), the thick film resistance value before and after sintering of the glass paste is tested, so as to calculate the influence of sintering of the glass paste on the sheet resistance of the resistance paste, the resistance value change rate = 100*(resistance value after sintering-resistance value before sintering) / resistance value before sintering.

[0155] Plating resistance test: after the sintered sample sheet is cleaned in an oil removal tank, activated in an activation tank, and electrolessly plated in a plating tank according to the standard plating process, whether the color and gloss of the glass layer on the sample sheet change and whether the 3M tape is peeled off are observed. If none of the above changes, the plating resistance is good, otherwise the plating resistance is poor.

[0156] Table 1

[0157]

[0158] As can be seen from Table 1, the packaging paste described in the present application has an influence on the silver line resistivity of <1%, an influence on the resistance value of the thick film resistance with a resistance of 100Ω / m and 1kΩ / m of <1.5%, no loss of gloss and thickness of the glass glaze after electroless plating of nickel-palladium-gold, and has a wide application prospect and high resolution.

[0159] It should be pointed out finally that the above embodiments are only used to illustrate the technical solutions of the present application but not to limit the protection scope of the present application, and although the present application has been described in detail with reference to the preferred embodiments, it should be appreciated by those skilled in the art that the technical solutions of the present application can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present application.

Claims

1. A color-resistant plating encapsulation paste, characterized by, The glass powder and the organic carrier; The glass powder comprises the following components by mass: 50-56 parts of bismuth oxide, 25-29 parts of silicon oxide, 7-10 parts of zinc oxide, 7.5-13 parts of additives, 0.5-5 parts of zirconium oxide, 0.5-5 parts of titanium oxide, 0.5-3 parts of aluminum oxide, and 0.5-1 part of calcium carbonate; The organic carrier comprises resin, solvent, leveling agent, defoaming agent and dispersant in a mass ratio of (8-12):(78-85):(1-3):(1-3):(4-10), the resin comprises ethyl cellulose, acrylic resin and polyvinyl butyral resin in a mass ratio of 1:(0.1-0.2):(0.1-0.2), the solvent comprises terpineol and diethylene glycol dibenzoate in a mass ratio of 1:(0.2-0.3); The additives comprise boric acid and sodium carbonate in a mass ratio of (7-10):(0.5-3).

2. The color-resistant plating packaging paste according to claim 1, wherein, The mass ratio of the glass powder and the organic carrier is (6.5-7.2):(2.8-3.5).

3. The color-resistant plating packaging paste according to claim 1, wherein, The leveling agent is an acrylate leveling agent; The defoaming agent is a solvent-free defoaming agent; The dispersant is a polymeric phosphate dispersant.

4. The method of preparing a color-resistant plating sealing paste according to any one of claims 1 to 3, characterized in that, The method comprises the following steps: The bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide and calcium carbonate are mixed uniformly, melted, quenched with water, dried, and ball-milled to obtain the glass powder; The organic carrier and the glass powder are mixed uniformly and ground to obtain the color-resistant plating packaging paste.

5. The method of claim 4, wherein the color-resistant plating encapsulation paste is prepared by mixing the color-resistant plating encapsulation paste composition of claim 1 with a solvent. The melting temperature is 1180-1250℃.

6. Use of the color-resistant plating packaging paste according to any one of claims 1-3 in the preparation of electronic components.

Images