Chip hotspot heat dissipation method and device based on micro robot

Abstract

The application provides a chip hotspot heat dissipation method and device based on a micro robot. The method comprises the following steps: obtaining the surface temperature distribution and the heat flow density distribution of a chip to locate the chip hotspot position; guiding a cooling medium to flow through the chip, and placing a micro robot suspended in the cooling medium under the action of a magnetic field, and controlling the micro robot to move in the cooling medium to above the hotspot position; determining the initial heat flux change data of the micro robot above the hotspot; and continuously adjusting the magnetic field control parameters according to the initial heat flux change data until the current heat flux change data meets the expected heat dissipation target. The application can accurately locate the chip hotspot position. By controlling the micro robot to move in the cooling medium to the area where the chip hotspot is located, dynamic tracking and heat dissipation of the hotspot are realized; and by continuously adjusting the magnetic field control parameters according to the initial heat flux change data, effective heat dissipation of the chip hotspot is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of microelectronic device thermal management, in particular to a chip hotspot cooling method and device based on micro robots. BACKGROUND

[0002] With the continuous progress of integrated circuit technology, the transistor density has been greatly increased, which has promoted the significant improvement of chip performance, but at the same time, it has brought a serious challenge-the chip power density continues to rise. The heat generated by the chip during operation increases sharply, and the thermal conductivity of the silicon substrate inside the chip is relatively limited, which makes it difficult for heat to quickly and effectively spread out inside the chip, thereby forming high-temperature hot spots inside the chip. The existence of these high-temperature hot spots poses a serious threat to the stable operation and performance of the chip.

[0003] The chip hotspot distribution has the characteristics of dynamic migration, specifically, on the one hand, there are significant differences in heat generation and accumulation in different regions of the chip; on the other hand, the location and intensity of the chip hotspot will change constantly with the conversion of the chip working condition.

[0004] At present, chip cooling technology mainly includes whole passive cooling, whole active cooling and hotspot enhanced cooling. However, the existing cooling method cannot adapt to the problem of dynamic migration of chip hotspots. SUMMARY

[0005] The present application provides a chip hotspot cooling method and device based on micro robots, to solve the defect that the prior art cannot adapt to the dynamic migration of chip hotspots, and to realize efficient cooling of chip hotspots.

[0006] A chip hotspot cooling method based on micro robots, comprising:

[0007] Step one: obtaining the surface temperature distribution of the chip and the heat flux density distribution to locate the chip hotspot position;

[0008] Step two: guiding the cooling medium to flow through the chip, and placing the micro robot suspended in the cooling medium under the action of a magnetic field, and controlling the micro robot to run in the cooling medium to the region where the chip hotspot is located;

[0009] Step three: determining the initial heat flux change of the micro robot in the region where the chip hotspot is located;

[0010] Step four: continuously adjusting the magnetic field control parameters according to the initial heat flux change until the current heat flux change data meets the expected cooling target, to cool the chip hotspot.

[0011] Further, the chip hotspot heat dissipation method based on micro-robot as described above, the step one comprises:

[0012] comparing the surface temperature distribution of the chip with a preset hotspot temperature threshold value , the heat flow density distribution of the chip with a heat flow density threshold value ;

[0013] in the case of and , determining the region where the surface temperature distribution is as a hotspot region;

[0014] determining the chip hotspot position according to the hotspot region.

[0015] Further, the chip hotspot heat dissipation method based on micro-robot as described above, the step two comprises:

[0016] respectively determining the driving force and resistance force suffered by the micro-robot in the magnetic field;

[0017] determining the first rotation speed of the magnetic field according to the driving force and resistance force;

[0018] controlling the micro-robot to move above the hotspot position in the cooling medium according to the first rotation speed.

[0019] Further, the chip hotspot heat dissipation method based on micro-robot as described above, the driving force suffered by the micro-robot in the magnetic field is:

[0020]

[0021] wherein, is the structural shape coefficient of the micro-robot, represents the dynamic viscosity coefficient of the cooling medium, is the self-rotation frequency of the micro-robot, is the equivalent radius of the micro-robot;

[0022] The resistance force suffered by the micro-robot in the magnetic field is:

[0023]

[0024] wherein, is the dynamic viscosity coefficient of the cooling medium, v is the running speed of the micro-robot, and L is the equivalent radius of the micro-robot.

[0025] Further, the chip hotspot heat dissipation method based on micro-robot as described above, the step three comprises:

[0026] determining the heat flux at the hotspot before the micro-robot moves to the hotspot and the heat flux at the hotspot after the micro-robot moves to the hotspot ;

[0027] determining the heat flux change of the micro-robot at the hotspot according to the heat flux and the heat flux , , .

[0028] Further, the micro-robot-based chip hotspot heat dissipation method as described above determines the heat flux according to the following formula :

[0029]

[0030] wherein, is the temperature at the hotspot before the micro-robot moves to the hotspot; is the initial temperature of the cooling medium, is the equivalent radius of the micro-robot, is the thermal conductivity of the cooling medium, is the convective heat transfer coefficient at the hotspot before the micro-robot moves to the hotspot; is the Nusselt number before the micro-robot moves to the hotspot; Gr is the Grashof number, and Pr is the Prandtl number;

[0031] determining the heat flux according to the following formula :

[0032]

[0033] wherein, is the temperature at the hotspot after the micro-robot moves to the hotspot; is the convective heat transfer coefficient at the hotspot after the micro-robot moves to the hotspot is the corresponding self-rotation frequency of the micro-robot after it moves to the hotspot and stably rotates, is the kinematic viscosity coefficient of the cooling medium.

[0034] Further, the micro-robot-based chip hotspot heat dissipation method as described above, the step four comprises:

[0035] comparing the initial heat flux change data with the preset heat flux change target value, if the difference between the initial heat flux change data and the heat flux change target value is greater than the preset difference value, then continuously adjusting the magnetic field control parameter until the difference between the current heat flux change data and the heat flux change target value is less than or equal to the preset difference value.

[0036] A micro-robot-based chip hotspot heat dissipation device comprises:

[0037] an acquisition unit configured to acquire a surface temperature distribution of the chip and a heat flux density distribution to locate a chip hotspot position;

[0038] a guiding unit configured to guide a cooling medium to flow through the chip;

[0039] a manipulating unit configured to place a micro-robot suspended in the cooling medium under the action of a magnetic field, and manipulate the micro-robot to run in the cooling medium to a region where the chip hotspot is located;

[0040] a determining unit configured to determine an initial heat flux change of the micro-robot in the region where the chip hotspot is located;

[0041] a heat dissipation unit configured to continuously adjust a magnetic field control parameter according to the initial heat flux change until current heat flux change data meets an expected heat dissipation target, so as to dissipate heat of the chip hotspot.

[0042] The application further provides an electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the micro-robot-based chip hotspot heat dissipation device according to any one of the above when executing the program.

[0043] The application further provides a non-transitory computer readable storage medium having a computer program stored thereon, wherein the computer program is executable on a processor to implement the micro-robot-based chip hotspot heat dissipation device according to any one of the above.

[0044] The micro-robot-based chip hotspot heat dissipation method and device provided by the application can accurately locate the chip hotspot position by acquiring the surface temperature distribution and the heat flux density distribution of the chip, avoiding the blindness in the traditional heat dissipation method. On the other hand, the micro-robot is manipulated to move to the region where the chip hotspot is located by using the magnetic field control parameter, so as to realize dynamic tracking and heat dissipation of the hotspot. On the other hand, the magnetic field control parameter is continuously adjusted according to the initial heat flux change data until the current heat flux change data meets the expected heat dissipation target, so as to achieve the purpose of effectively dissipating heat of the chip hotspot. BRIEF DESCRIPTION OF DRAWINGS

[0045] Figure 1 is a flowchart of the micro-robot-based chip hotspot heat dissipation method provided by the application;

[0046] Figure 2 is a structural schematic diagram of the micro-robot-based chip hotspot heat dissipation device provided by the application;

[0047] Figure 3 is a structural schematic diagram of the electronic device provided by the application. DETAILED DESCRIPTION

[0048] In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions in the present application will be described clearly and completely below with reference to the drawings in the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0049] In today's era of rapid development of science and technology, integrated circuit technology has made great progress, and the transistor density has increased substantially. Although this progress has greatly improved the performance and function of chips, it has also triggered a series of severe challenges, among which the heat generation and heat dissipation of chips are particularly prominent and have become a key factor restricting the further improvement of chip performance.

[0050] With the sharp rise in transistor density, chip power density continues to rise, and the contradiction between heat generation and heat dissipation becomes increasingly acute. Due to the limited thermal conductivity of the silicon substrate itself, when the chip generates a large amount of heat, the heat is difficult to quickly spread inside the chip, thereby forming a high-temperature hot spot in the local area. These chip hot spot problems are not simply a phenomenon of excessively high temperature, but involve complex electro-thermal-mechanical coupling. This complex coupling can cause a series of serious consequences. It can accelerate the electromigration phenomenon inside the chip, causing atomic migration of metal wires, and thus may cause circuit open or short circuit failures; it can also cause thermal stress in the chip, which can cause thermal stress cracking when the thermal stress exceeds the material's bearing limit, thereby damaging the structural integrity of the chip; at the same time, the local high temperature can cause the performance of the transistor to degrade, affecting the normal working state of the chip; in addition, the chip will trigger a frequency reduction mechanism for self-protection, which will undoubtedly directly reduce the computing power of the chip and seriously affect the performance of the chip in actual application. From the perspective of spatial distribution of chip power consumption, it presents a high degree of complexity. Chip hot spots are usually dispersedly distributed at the level of hundreds of microns, and the location and intensity of these hot spots are not fixed, but will dynamically change with the conversion of chip working conditions, having the characteristics of significant spatial non-uniformity and temporal dynamic change. That is, the location of the hot spot on the chip is not fixed during the working process of the chip, but will move between different areas over time, i.e., the hot spot location dynamically migrates. This puts forward very high requirements for the heat dissipation technology of the chip, which needs to be able to respond to the changes of the hot spot in real time and accurately.

[0051] Currently, chip cooling technology mainly includes bulk passive cooling, bulk active cooling and hotspot enhanced cooling. However, the existing chip cooling technology has obvious limitations in dealing with the dynamic migration of hotspot position. In order to solve this problem, the application adopts the method of guiding the cooling medium to flow through the chip, and then using the magnetic field to control the motion of the chiral micro robot to the hotspot position, and under the action of the magnetic field, the chiral micro robot rotates to achieve the purpose of stirring the cooling medium, so as to realize the effect of effectively dissipating heat to the chip hotspot.

[0052] In the embodiment of the application, the micro robot is a magnetic particle with chiral characteristics, and the size is usually micron or nanometer level, preferably: the diameter of the magnetic particle is 20-100 μm. The asymmetric structure of the chiral micro robot is the key to its chiral characteristics and specific functions. Common asymmetric structures include spiral shape, tadpole tail and the like. Taking the spiral structure as an example: the spiral structure is a typical asymmetric structure, similar to the double helix of DNA or the thread of a screw. This structure has the characteristics of continuous and spiral extension, and the parameters such as pitch and spiral radius will affect the performance of the micro robot. When the spiral chiral micro robot is in the cooling medium and is driven by the external magnetic field, it will produce rotary motion like a propeller. Due to the chirality of the spiral structure, the rotary motion will be converted into linear motion. For example, under the driving of a uniform magnetic field, the magnetic spiral micro robot can move to the local hotspot position of the chip in a linear motion.

[0053] When the micro robot moves to the local hotspot position, the local hotspot removes heat from the cooling medium on one hand to prevent heat accumulation in the hotspot area; on the other hand, the cooling medium above the hotspot forms a liquid cooling pool relative to the hotspot, which provides a stable environment for the movement and heat exchange of the micro robot. The magnetic micro robot forms local hotspot rotational convection in the liquid cooling pool by its own rotary motion, thereby accelerating the uniform diffusion of heat to the surrounding cooling medium, further enhancing the heat dissipation effect.

[0054] Figure 1 is the flowchart of the chip hotspot heat dissipation method based on micro robot provided by the application, as shown in Figure 1 The method comprises the following steps:

[0055] Step 1: Obtain the surface temperature distribution and heat flux density distribution of the chip to locate the chip hotspot position.

[0056] Specifically, the application adopts a high-precision infrared thermal imaging system to measure the full-field temperature of the chip surface to obtain the surface temperature distribution of the chip. The system can capture the infrared radiation energy of different positions on the chip surface, and then convert it into temperature data to form a temperature distribution image of the chip surface. Moreover, the system is equipped with a macro optical lens, which can realize The spatial resolution of the level and the temperature resolution of 0.1K are used to ensure that the hotspot distribution of the micron level can be accurately captured. By obtaining the surface temperature distribution of the chip, the temperature change of different positions on the chip surface can be accurately captured, which provides basic data for subsequent hotspot positioning, thereby improving the positioning accuracy of the hotspot position.

[0057] In addition, based on the power consumption distribution of the chip and the heat conduction theory, the heat flux density distribution of the chip surface is calculated by the Fourier law. The heat flux density reflects the intensity of heat transfer at each point on the chip surface, and is an important basis for positioning the hotspot position. The heat flux density distribution is calculated according to formula (1):

[0058]

[0059] Wherein, k is the thermal conductivity of the chip material.

[0060] The surface temperature distribution and the preset hotspot temperature threshold, and the heat flux density distribution and the heat flux density threshold are compared in the application. When the temperature threshold and the heat flux density threshold conditions are met at the same time, the region is determined as the hotspot region, and the position coordinates of the hotspot are positioned based on the hotspot region.

[0061] Specifically, the hotspot temperature threshold and the heat flux density threshold are set, the surface temperature distribution of the chip is compared with the preset temperature threshold , and the heat flux density distribution is compared with the heat flux density threshold ; in the case of and , the region where the surface temperature distribution is determined as the hotspot region; according to the hotspot region, the position coordinates of the hotspot are obtained by coordinate positioning algorithm .

[0062] In the implementation of the application, the position coordinates of the hotspot can be obtained by coordinate positioning algorithm, and the specific method is as follows:

[0063] Firstly, the infrared thermal imaging system is calibrated to determine the proportional relationship between the image pixel coordinates of the infrared thermal imaging image and the actual size of the chip corresponding to the surface image. Assuming that the number of pixels in the x direction of the image is Nx, and the actual length of the chip corresponding is Lx, then the actual length represented by each pixel in the x direction is Δx = Lx / Nx; similarly, in the y direction, if the number of pixels is Ny, and the actual width of the chip is Ly, then the actual length represented by each pixel in the y direction is Δy = Ly / Ny. For the z coordinate, since the infrared thermal imaging can usually only measure the temperature distribution of the surface of the object, in this case the z coordinate is generally defaulted to the plane where the chip surface is located, i.e. z = 0.

[0064] Determine the hot pixel coordinates: find the point with the highest temperature, i.e. the hot spot, in the infrared thermal imaging image, and record its pixel coordinates (i, j) in the image.

[0065] Calculate the actual coordinates of the hot spot: according to the correspondence established above, convert the pixel coordinates to actual coordinates. The actual coordinates of the hot spot in the x direction is x = i*Δx, and the actual coordinates in the y direction is y = j*Δy, z = 0. Thus, the coordinates of the hot spot position of the chip are calculated as .

[0066] Step two: guide the cooling medium to flow through the chip, and place the micro-robot suspended in the cooling medium in the magnetic field, and control the micro-robot to move in the cooling medium to the upper side of the hot spot position.

[0067] Specifically, the driving force and the resistance of the micro-robot in the magnetic field are determined respectively; according to the driving force and the resistance, the first rotating speed of the magnetic field is determined; according to the first rotating speed, the micro-robot is controlled to move in the cooling medium to the upper side of the hot spot position.

[0068] Among them, the magnetic field used in the present application is composed of three groups of orthogonal Helmholtz coils. The magnetic field adjusts the strength and direction of the magnetic field by controlling the current size and direction in the coil to produce a spatially uniform rotating magnetic field , and then adjusts the running speed and direction of the micro-robot according to the strength and direction of the rotating magnetic field. Among them, the rotating magnetic field is:

[0069] (2)

[0070] Among them, is the amplitude of the magnetic field in each direction, is the rotational angular frequency of the rotating magnetic field, which is used to describe the speed of the rotating magnetic field, determines the rate of change of the magnetic field direction with time, and affects the motion state of the micro robot in the magnetic field, such as the rotational frequency. When the rotational angular frequency changes, the magnetic torque acting on the micro robot changes, and in turn the rotation and motion speed of the micro robot changes. Therefore, the rotational angular frequency is the magnetic field generated by the Helmholtz coil, which represents a key attribute of the rotational motion of the magnetic field. The rotational angular frequency can be converted into the rotational frequency of the magnetic field . is the initial phase of the rotating magnetic field. The initial phase determines the state of the rotating magnetic field at the initial time. When the Helmholtz coil works to generate a rotating magnetic field, this initial state affects the subsequent change process of the magnetic field, and the initial force and motion trend of the micro robot in the magnetic field. For example, different initial phases may cause the micro robot to start rotating motion from different directions.

[0071] Here, The calculation formula is as follows:

[0072] (3)

[0073] wherein, is the radius of the Helmholtz coil, is the distance from a point on the axis to the axis, is the number of turns of the coil, is the current intensity passing through the coil, is the magnetic permeability in vacuum, and is .

[0074] In the embodiments of the present application, the micro robot is a magnetic particle with a tail. When the micro robot contains magnetic material inside or on the surface, it will generate driving force and resistance under the action of the rotating magnetic field.

[0075] Here, the driving force experienced by the micro robot in the magnetic field is:

[0076]

[0077] wherein, is the structural shape coefficient of the micro robot, represents the dynamic viscosity coefficient of the cooling medium, is the self-rotational frequency of the micro robot, is the equivalent radius of the micro robot.

[0078] The Stokes resistance experienced by the micro robot in the magnetic field is:

[0079]

[0080] in, denoted as the dynamic viscosity coefficient of the cooling medium, v as the operating speed of the microrobot, and L as the equivalent radius of the microrobot.

[0081] When a chiral microrobot's asymmetric structure (such as a spiral or tadpole-shaped tail) rotates under a uniform rotating magnetic field, the interaction between the structural asymmetry and the fluid generates a propulsive force in a specific direction. In this application, since the rotational Reynolds number is much less than 1, the applicability conditions of Stokes' drag theory are met. The propulsive force generated in a specific direction by the interaction between the structural asymmetry and the fluid when the chiral microrobot rotates under a uniform rotating magnetic field is essentially the reaction force of the fluid on the rotating structure. In this case, Stokes' drag theory can be used to approximate the calculation of this propulsive force.

[0082] when At that time, the microrobot accelerates forward.

[0083] when When the time is right, the microrobot moves forward at a constant speed v.

[0084] when When that happens, the microrobot rotates in place.

[0085] In this case, in order for the microrobot to move to the hot spot under the influence of the magnetic field, it is necessary to ensure that: .

[0086] when At that time, there were:

[0087]

[0088] The critical spin frequency of the microrobot can then be determined according to formula (7). for:

[0089]

[0090] Then: Assume the operating speed of the microrobot is The corresponding rotation frequency of the microrobot is Assume the microrobot's operating speed is... The corresponding rotation frequency of the microrobot is To ensure Therefore, it is necessary to ensure the self-rotation frequency of the microrobot. .

[0091] Furthermore, when the magnetic microrobot is placed in a magnetic field, its rotational frequency will eventually approach the rotational frequency of the magnetic field. In this case, it is assumed that the rotational frequency of the magnetic microrobot... equal to the rotation frequency of the magnetic field , i.e. . Therefore, only when the rotation frequency of the magnetic field , the microrobot will run, and when , the microrobot will spin in place. For this purpose, the present application sets a speed to determine the self-rotation frequency of the microrobot, and determines the rotation frequency of the magnetic field corresponding to the self-rotation frequency of the microrobot. Therefore, the present application only needs to ensure that the rotation frequency of the magnetic field determined indirectly through the running speed of the microrobot is correct. When the rotation frequency of the magnetic field is determined, the driving force and the resistance of the microrobot in the magnetic field can be determined respectively by formula (4) and (5), and then the running speed of the microrobot can be determined according to the driving force and the resistance of the microrobot in the magnetic field.

[0092] The present application controls the microrobot to run to the region where the chip hotspot is located according to the following formula:

[0093]

[0094] wherein, is the target position of the microrobot, is the current position of the microrobot, is the initial speed of the microrobot. is the motion time of the microrobot, is the acceleration of the microrobot, which is 0 when the microrobot advances at a constant speed.

[0095] Here, the acceleration of the microrobot in the magnetic field is obtained by the following method:

[0096]

[0097] wherein, is the density of the microrobot, is the volume of the microrobot, is the acceleration of the microrobot in the magnetic field; F is the resultant force of the microrobot in the magnetic field, is the driving force of the microrobot in the magnetic field; is the resistance of the microrobot in the rotating magnetic field.

[0098] The present application can be determined by monitoring the position information of the microrobot in real time and comparing it with the specified position coordinates above the hotspot. Common monitoring methods include microscopic imaging technology combined with image recognition algorithm, or magnetic field positioning technology. Assuming that the specified position coordinates above the hotspot are (x, y, z), the real-time position coordinates of the microrobot obtained by the monitoring means are . The distance between the two is calculated An allowable error range △d is set, and when d≤△d, it is considered that the micro robot has moved to the hotspot position.

[0099] Step three: determine the initial heat flux change data of the micro robot above the hotspot.

[0100] Specifically, the heat flux change (Δq) is the difference in heat transfer per unit area per unit time at the chip hotspot before and after the movement of the micro robot, that is:

[0101]

[0102] wherein, is the heat flux at the hotspot before the movement of the micro robot to the hotspot, is the heat flux at the hotspot after the movement of the micro robot to the hotspot.

[0103] The heat flux change directly reflects the degree of strengthening of heat transfer at the hotspot by the movement of the micro robot. By comparing the heat flux before and after the intervention of the micro robot (q1 and q2), the improvement in the heat transfer capacity of the micro robot can be quantitatively evaluated. A positive heat difference (Δq>0) indicates that the micro robot has strengthened the heat dissipation, and more heat has been taken away by the cooling medium; a negative heat difference (Δq<0) may mean an abnormal operation (such as the micro robot not working effectively, etc.). Here, the heat flux at the hotspot before the movement of the micro robot to the hotspot is

[0104] It is calculated according to the following formula:

[0105]

[0106] wherein, is the temperature at the hotspot before the movement of the micro robot to the hotspot; is the initial temperature of the cooling medium, i.e. the temperature of the cooling medium before it dissipates heat from the hotspot, which can be approximately regarded as a relatively stable reference temperature. is the convective heat transfer coefficient at the hotspot before the movement of the micro robot to the hotspot; is the equivalent radius, is the fluid thermal conductivity, is the convective heat transfer coefficient at the hotspot before the movement of the micro robot to the hotspot; is the Nusselt number before the movement of the micro robot to the hotspot; Gr is the Grashof number, Pr is the Prandtl number, is the fluid specific heat capacity corresponding to the cooling medium, is the dynamic viscosity coefficient, is the thermal conductivity.

[0107] Here, the heat flux at the hotspot after the movement of the micro robot to the hotspot is ​The initial heat flux change is calculated according to the following formula:

[0108]

[0109] wherein, is the temperature at the hot spot after the micro-robot moves to the hot spot; is the convective heat transfer coefficient at the hot spot after the micro-robot moves to the hot spot; is the rotating Reynolds number, is the Nusselt number after the micro-robot moves to the hot spot, Pr is the Prandtl number, is the corresponding self-rotation frequency of the micro-robot after the micro-robot moves to the hot spot and stably rotates, is the kinematic viscosity coefficient of the cooling medium.

[0110] According to the formula (11)-(19), when the rotation frequency of the micro-robot is determined, the initial heat flux change of the micro-robot in the region where the chip hot spot is located can be determined. When the micro-robot is in the rotating magnetic field, the rotation frequency of the micro-robot gradually approaches the rotation frequency of the magnetic field, so as long as the rotation frequency of the rotating magnetic field is controlled, the initial heat flux change of the micro-robot in the region where the hot spot is located can be determined. When the initial heat flux change does not meet the heat dissipation requirement, the rotation frequency of the magnetic field can be continuously adjusted until the initial heat flux change meets the expected heat exchange efficiency, so as to realize effective heat dissipation of the chip.

[0111] It should be noted that when adjusting the rotation frequency of the magnetic field, the rotation frequency of the magnetic field should be less than the critical rotation frequency of the magnetic field, and the critical rotation frequency of the magnetic field is equal to the critical self-rotation frequency of the micro-robot .

[0112] Step four: according to the initial heat flux change, continuously adjust the magnetic field control parameter until the current heat flux change data meets the expected heat dissipation target, so as to effectively dissipate heat of the chip hot spot.

[0113] Specifically, in the embodiment of the application, the magnetic field control parameter is the rotation frequency of the rotating magnetic field. The initial heat flux change is compared with the preset heat flux change threshold value, if the difference between the initial heat flux change and the heat flux change threshold value is greater than the preset difference value, the magnetic field control parameter is continuously adjusted until the difference between the current heat flux change and the heat flux change target value is less than or equal to the preset difference value, then the effective heat dissipation of the chip hot spot is realized.

[0114] The method provided by the application firstly, by acquiring the surface temperature distribution and heat flux density distribution of the chip, the hot spot position of the chip can be accurately positioned, so that the micro robot can accurately move to the hot spot for heat dissipation, and the blindness in the traditional heat dissipation method can be avoided. Then, the micro robot is controlled to move to the hot spot above by using the magnetic field control parameter, so that the dynamic tracking and heat dissipation of the hot spot are realized. Moreover, the micro robot is controlled to rotate in place in the hot spot area by using the magnetic field control parameter, so that the micro robot can stir the cooling medium, so as to accelerate the heat transfer from the chip hot spot area to the cooling medium, and the heat dissipation efficiency is effectively improved. On the other hand, by comparing the initial heat flux change data with the preset heat flux change target value, the magnetic field control parameter is adjusted to maximize the heat flux change, so as to further enhance the heat dissipation effect. The dynamic adjustment mechanism ensures that the heat dissipation system can respond to the change of the chip heat generation in real time, and maintains high heat dissipation performance.

[0115] Figure 2 is a structural schematic diagram of a chip hot spot heat dissipation device based on a micro robot provided by the application, as Figure 2 shown, the device comprises:

[0116] The acquisition unit 201 is used for acquiring the surface temperature distribution and heat flux density distribution of the chip to locate the hot spot position of the chip.

[0117] The guide unit 202 is used for guiding the cooling medium to flow through the chip.

[0118] The control unit 203 is used for placing the micro robot suspended in the cooling medium under the action of the magnetic field, and controlling the micro robot to run to the area where the chip hot spot is located in the cooling medium.

[0119] The determination unit 204 is used for determining the initial heat flux change of the micro robot in the area where the chip hot spot is located.

[0120] The heat dissipation unit 205 is used for adjusting the magnetic field control parameter according to the initial heat flux change until the current heat flux change data meets the expected heat dissipation target, so as to dissipate heat from the chip hot spot.

[0121] Figure 3 An example of an entity structure schematic diagram of an electronic device is shown in Figure 3As shown, the electronic device can include a processor 310, a communications interface 320, a memory 330, and a communications bus 340, wherein the processor 310, the communications interface 320, and the memory 330 communicate with each other through the communications bus 340. The processor 310 can call the logic instructions in the memory 330 to execute the micro-robot-based chip hotspot heat dissipation method, which includes:

[0122] Step one: obtain the surface temperature distribution of the chip and the heat flow density distribution to locate the chip hotspot position;

[0123] Step two: guide the cooling medium to flow through the chip, and place the micro-robot suspended in the cooling medium in the action of a magnetic field, and control the micro-robot to run in the cooling medium to the chip hotspot area;

[0124] Step three: determine the initial heat flux change of the micro-robot in the chip hotspot area;

[0125] Step four: continuously adjust the magnetic field control parameters according to the initial heat flux change until the current heat flux change data meets the expected heat dissipation target to dissipate heat from the chip hotspot.

[0126] In addition, the logic instructions in the memory 330 described above can be implemented in the form of a software function unit and sold or used as an independent product, which can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application or the part of the prior art that essentially contributes or the part of the technical solutions can be embodied in the form of a software product, which is stored in a storage medium and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk, and various storage medium that can store program codes.

[0127] On the other hand, the present application also provides a computer program product, which includes a computer program, and the computer program can be stored on a non-transitory computer readable storage medium, and the computer program can be executed by a processor to enable a computer to execute the micro-robot-based chip hotspot heat dissipation method provided by the above-mentioned methods, which includes:

[0128] Step one: obtaining the surface temperature distribution of the chip and heat flow density distribution to locate the chip hotspot position;

[0129] Step two: guiding the cooling medium to flow through the chip, and placing the micro-robot suspended in the cooling medium under the action of a magnetic field, and controlling the micro-robot to run in the cooling medium to the chip hotspot area;

[0130] Step three: determining the initial heat flux change of the micro-robot in the chip hotspot area;

[0131] Step four: continuously adjusting the magnetic field control parameters according to the initial heat flux change until the current heat flux change data meets the expected heat dissipation target, so as to dissipate heat for the chip hotspot.

[0132] In another aspect, the present application also provides a non-transitory computer readable storage medium having a computer program stored thereon, the computer program being executed by a processor to implement the micro-robot-based chip hotspot heat dissipation method provided by the above method, the method comprising:

[0133] Step one: obtaining the surface temperature distribution of the chip and heat flow density distribution to locate the chip hotspot position;

[0134] Step two: guiding the cooling medium to flow through the chip, and placing the micro-robot suspended in the cooling medium under the action of a magnetic field, and controlling the micro-robot to run in the cooling medium to the chip hotspot area;

[0135] Step three: determining the initial heat flux change of the micro-robot in the chip hotspot area;

[0136] Step four: continuously adjusting the magnetic field control parameters according to the initial heat flux change until the current heat flux change data meets the expected heat dissipation target, so as to dissipate heat for the chip hotspot.

[0137] The device embodiments described above are only schematic, wherein the units shown as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, i.e., they can be located in one place, or distributed on multiple network units. Part or all of the modules can be selected to achieve the purpose of the present embodiment scheme according to actual needs. Those skilled in the art can understand and implement it without creative labor.

[0138] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0139] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip hotspot heat dissipation method based on microrobots, characterized in that, include: Step 1: Obtain the surface temperature distribution of the chip and heat flux density distribution To locate the hot spots on the chip; Step 2: Guide the cooling medium to flow through the chip, and place the microrobot suspended in the cooling medium under the influence of a magnetic field, maneuvering the microrobot in the cooling medium to the area where the chip's hot spot is located; the microrobot is a magnetic particle with chiral characteristics; Step 3: Determine the initial heat flux change of the microrobot in the region where the chip hotspot is located; Step 4: Based on the initial heat flux change, continuously adjust the magnetic field control parameters until the current heat flux change data meets the expected heat dissipation target, so as to dissipate heat from the chip hotspots; Step one includes: The surface temperature distribution of the chip With preset hotspot temperature threshold Heat flux density distribution of the chip With heat flux density threshold Compare; exist and In this case, determine the surface temperature distribution The area in question is a hotspot. Based on the hotspot area, determine the location of the chip hotspot.

2. The chip hotspot heat dissipation method based on microrobots according to claim 1, characterized in that, Step two includes: Determine the driving force and resistance experienced by the microrobot in the magnetic field; The first rotational speed of the magnetic field is determined based on the driving force and resistance. Based on the first rotational speed, the microrobot is manipulated to move in the cooling medium to above the hot spot location.

3. The chip heat dissipation method according to claim 2, characterized in that, The driving force on the microrobot in the magnetic field is: ； in, This represents the structural shape factor of the microrobot. Indicates the dynamic viscosity coefficient of the cooling medium. The self-rotation frequency of the microrobot Let be the equivalent radius of the microrobot; The resistance experienced by the microrobot in the magnetic field is: ； in, Let v be the dynamic viscosity coefficient of the cooling medium, and v be the operating speed of the microrobot. Let be the equivalent radius of the microrobot.

4. The chip hotspot heat dissipation method based on microrobots according to claim 1, characterized in that, Step three includes: Before the microrobot moves to the hotspot, the heat flux at the hotspot is determined. And the heat flux at the hotspot after the microrobot moves to the hotspot. ; According to the heat flux and heat flux Determine the heat flux changes of the microrobot at the hot spot. , .

5. The chip hotspot heat dissipation method based on microrobots according to claim 4, characterized in that, The heat flux is determined according to the following formula. : ； in, The temperature at the hotspot before the microrobot moves to it; The initial temperature of the cooling medium. Let be the equivalent radius of the microrobot. The thermal conductivity of the cooling medium The convective heat transfer coefficient at the hot spot before the microrobot moves to the hot spot; Let be the Nusselt number before the microrobot moves to the hot spot; Gr is the Grashof number, and Pr is the Prandtl number; The heat flux is determined according to the following formula. : ； in, The temperature at the hotspot after the microrobot moves to it; The convective heat transfer coefficient at the hot spot after the microrobot moves to the hot spot; The rotation frequency corresponding to the microrobot after it reaches the hotspot and rotates stably. Let L be the kinematic viscosity coefficient of the cooling medium, and L be the equivalent radius of the microrobot.

6. The chip hotspot heat dissipation method based on microrobots according to claim 4, characterized in that, Step four includes: The initial heat flux change data is compared with the preset heat flux change target value. If the difference between the initial heat flux change data and the heat flux change target value is greater than the preset difference, the magnetic field control parameters are continuously adjusted until the difference between the current heat flux change data and the heat flux change target value is less than or equal to the preset difference.

7. A chip hotspot heat dissipation device based on a microrobot, characterized in that, include: Acquisition unit, used to acquire the surface temperature distribution of the chip. and heat flux density distribution To locate the hot spots on the chip; The guiding unit is used to guide the cooling medium to flow through the chip; The control unit is used to place the microrobot suspended in the cooling medium under the influence of a magnetic field and control the microrobot to move to the area where the chip hot spot is located in the cooling medium. The determining unit is used to determine the initial heat flux change of the microrobot in the region where the chip hotspot is located; The heat dissipation unit is used to continuously adjust the magnetic field control parameters according to the initial heat flux change until the current heat flux change data meets the expected heat dissipation target, so as to dissipate heat from the chip hot spots. The acquisition unit is also used for: The surface temperature distribution of the chip With preset hotspot temperature threshold Heat flux density distribution of the chip With heat flux density threshold Compare; in and In this case, determine the surface temperature distribution The area in question is a hotspot. Based on the hotspot area, determine the location of the chip hotspot.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the chip hotspot heat dissipation method based on microrobots as described in any one of claims 1 to 6.

9. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the chip hotspot heat dissipation method based on microrobots as described in any one of claims 1 to 6.

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