Electric connector and power module

Abstract

The invention relates to the technical field of chip packaging, in particular to an electric connecting piece and a power module, the electric connecting piece comprises a connecting main body, one side of the connecting main body is bent downwards to form more than one first connecting pin, and the other side of the connecting main body is bent downwards to form a plurality of second connecting pins. Each first connecting pin is used for being connected with a circuit carrier used in cooperation with the corresponding electric connecting piece. Each second connecting pin is used for being connected with a chip used in cooperation with the corresponding electric connecting piece. Due to the fact that the second connecting pins are symmetrically arranged about the center line of the connecting body, efficient parallel connection of the chips is achieved, the current paths of the chips are effectively balanced, and the current sharing performance is improved. A through groove is formed in each second connecting pin. The plastic melt can flow through the through groove to abut against the lower portion of the second connecting pin, so that the connecting strength of the second connecting pin and the plastic packaging material is improved, and the possibility of the plastic packaging layering phenomenon can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip packaging, and in particular to an electrical connector and a power module. BACKGROUND

[0002] When packaging a power module with multiple chips, the multiple chips are connected in parallel using leads or copper sheets, and then the chips and leads / copper sheets are encapsulated. However, the electrical connection is realized by relying on leads, the layout is relatively messy, and the reliability of the connection is poor. Therefore, it is gradually tending to realize the electrical connection by means of copper sheets.

[0003] The existing copper sheet is formed with a first connecting pin and a second connecting pin. The first connecting pin is used to connect with a substrate. The second connecting pin is used to connect with a chip. The reliability and conductivity of the connection can be improved.

[0004] The prior art in the above has the following defects: when realizing the electrical connection by means of copper sheets, the current path balance is poor, which causes the parasitic parameter distribution to be uneven, additional switching loss and electromagnetic interference are generated under high frequency, and the electrical performance and reliability of the power module are restricted. SUMMARY

[0005] In order to improve the current sharing performance, make the parasitic parameter distribution uniform, and improve the electrical performance and reliability of the power module, the present application provides an electrical connector and a power module.

[0006] The first object of the present application is to provide an electrical connector, which adopts the following technical solution: An electrical connector, comprising: A connecting body, one side of which is bent to form one or more first connecting pins, and the other side of which is bent to form a plurality of second connecting pins; the plurality of second connecting pins are symmetrically arranged about the center line of the connecting body; a through groove is formed on each second connecting pin; each first connecting pin is used to connect with a circuit carrier used in cooperation with the electrical connector; and each second connecting pin is used to connect with a chip used in cooperation with the electrical connector.

[0007] By adopting the technical scheme, the plurality of chips are efficiently connected in parallel, the current paths of the plurality of chips are effectively balanced, the current sharing performance is improved, the parasitic parameter distribution is relatively uniform, the switching loss and electromagnetic interference are reduced at high frequency, and the electrical performance and reliability of the power module are improved. The through grooves are formed on each second connecting pin. The plastic melt can flow through the through grooves to the lower side of the second connecting pin, ensuring the flowability and filling property of the plastic sealing melt, increasing the connection strength between the second connecting pin and the plastic sealing material, and being beneficial to reducing the possibility of plastic sealing layering. Meanwhile, the through grooves are beneficial to releasing the stress of the second connecting pin during the solidification of the plastic sealing material, and thus are beneficial to reducing the possibility of plastic sealing layering.

[0008] The application is further provided that: the middle part of the connecting body is formed with a plurality of flow guide strips; the plurality of flow guide strips are symmetrically arranged about the center line of the connecting body; and each adjacent two second connecting pins share one flow guide strip.

[0009] By adopting the technical scheme, the current sharing performance is further improved.

[0010] The application is further provided that: a plurality of through grooves are formed on each second connecting pin; and the plurality of through grooves are arranged in pairs in parallel.

[0011] By adopting the technical scheme, the plastic sealing layering resistance performance is further improved.

[0012] The application is further provided that: the extension direction of each through groove is the same as the extension direction of the corresponding second connecting pin.

[0013] By adopting the technical scheme, the plastic sealing layering resistance performance is guaranteed.

[0014] The application is further provided that: the ratio of the length of each through groove to the length of the corresponding second connecting pin is equal to or greater than 4 / 5.

[0015] By adopting the technical scheme, the plastic sealing layering resistance performance is guaranteed.

[0016] The application is further provided that: each second connecting pin has one or more bending parts.

[0017] By adopting the technical scheme, the plastic sealing layering resistance performance is effectively improved.

[0018] The application is further provided that: a through hole is formed in the middle part of the connecting body.

[0019] By adopting the technical scheme, the connection strength between the connecting body and the plastic sealing material is increased, and the possibility of the plastic sealing layering phenomenon is reduced.

[0020] The application is further provided as follows: The buffer structure is installed in the through hole.

[0021] By adopting the technical scheme, the buffer structure is used to absorb the stress generated in the plastic sealing process, and the possibility of the plastic sealing layering is further reduced.

[0022] The application is further provided as follows: the buffer structure comprises: The capsule is installed in the through hole; The rigid node rings are arranged in the capsule in multiple rows and columns; each rigid node ring is connected with the plurality of flexible connection belts, and each flexible connection belt is located on the tangent line of the rigid node ring; The flexible filler is filled between the plurality of flexible connection belts; The rigid filler is filled in each rigid node ring.

[0023] By adopting the technical scheme, the local density can be increased to absorb the stress generated in the plastic sealing process.

[0024] The second object of the application is to provide a power module, which adopts the following technical scheme: The power module comprises a circuit carrier, a plurality of chips and an electrical connection; the plurality of chips are installed on the circuit carrier in pairs; each first connecting pin of the connecting body is connected with the circuit carrier; and each second connecting pin of the connecting body is connected with the corresponding chip.

[0025] In summary, the beneficial technical effects of the application are as follows: 1. Since the plurality of second connecting pins are symmetrically arranged about the center line of the connecting body, the high-efficiency parallel connection of the plurality of chips is realized, the current paths of the plurality of chips are effectively balanced, the current sharing performance is improved, the parasitic parameter distribution is relatively uniform, the switching loss and electromagnetic interference are reduced at high frequency, and the electrical performance and reliability of the power module are improved. The through groove is formed on each second connecting pin. The plastic melt can flow through the through groove to the lower side of the second connecting pin, ensuring the flowability and filling property of the plastic sealing melt, increasing the connection strength between the second connecting pin and the plastic sealing material, and reducing the possibility of the plastic sealing layering phenomenon. Meanwhile, in the plastic sealing material curing process, the through groove is beneficial to the stress release of the second connecting pin, and the possibility of the plastic sealing layering phenomenon is reduced; 2. The extension direction of each through slot is the same as the extension direction of the corresponding second connecting pin, and the ratio of the length of each through slot to the length of the corresponding second connecting pin is equal to or greater than 4 / 5, so as to ensure good anti-plastic delamination performance; 3. The through hole is formed in the middle of the connecting body, which not only increases the connection strength of the connecting body and the plastic package material, but also helps to reduce the possibility of delamination phenomenon; 4. The buffer structure is installed in the through hole, which can absorb the stress generated during the plastic packaging process, further reducing the possibility of plastic delamination. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a structural schematic diagram of a first embodiment of an electrical connector; Figure 2 is a structural schematic diagram of a second embodiment of an electrical connector; Figure 3 is a structural schematic diagram of a third embodiment of an electrical connector; Figure 4 is a structural schematic diagram of a fourth embodiment of an electrical connector; Figure 5 is Figure 4 is a structural schematic diagram of a fifth embodiment of an electrical connector; Figure 6 is a structural schematic diagram of a sixth embodiment of an electrical connector; Figure 7 is a structural schematic diagram of a seventh embodiment of an electrical connector; Figure 8 is a structural schematic diagram of an eighth embodiment of an electrical connector; Figure 9 is a structural schematic diagram of an eighth embodiment of an electrical connector; Figure 10 is a structural schematic diagram of an embodiment of a power module.

[0027] Reference signs: 110, connecting body; 111, first connecting pin; 1111, mounting hole; 112, second connecting pin; 1121, through slot; 1122, bending part; 113, center line; 114, flow guide strip; 115, through hole; 120, buffer structure; 121, capsule; 122, rigid node ring; 123, flexible connecting band; 124, flexible filler; 125, rigid filler; 200, circuit carrier; 300, chip. DETAILED DESCRIPTION

[0028] The following will be described in detail in combination with the accompanying Figures 1-10 The present application is further described in detail.

[0029] Reference Figure 1The embodiment of the application discloses an electric connector, which comprises a connecting body 110. One side of the connecting body 110 is bent downward to form one or more first connecting pins 111, and the other side is bent downward to form a plurality of second connecting pins 112. It should be noted that the bottom surface of each first connecting pin 111 and the bottom surface of each second connecting pin 112 should be lower than the bottom surface of the connecting body 110 in the vertical direction. Each first connecting pin 111 is used to connect with a circuit carrier 200 used in a cooperating electric connector. Each second connecting pin 112 is used to connect with a chip 300 used in the cooperating electric connector. Signals or currents are conducted from each chip 300 to the circuit carrier 200 (substrate) through the corresponding second connecting pin 112, the connecting body 110 and the first connecting pin 111. Since the plurality of second connecting pins 112 are symmetrically arranged about the center line 113 of the connecting body 110, not only the efficient parallel connection of the plurality of chips 300 is realized, but also the current paths of the plurality of chips 300 are effectively balanced, and the current sharing performance is improved. The parasitic parameters (parasitic capacitance, parasitic inductance) are relatively uniformly distributed, the switching loss and electromagnetic interference are reduced at high frequency, and the electrical performance and reliability of the power module are improved. A through groove 1121 is formed on each second connecting pin 112. The plastic melt can flow through the through groove 1121 to the lower side of the second connecting pin 112, ensuring the flowability and filling property of the plastic sealing melt, increasing the connection strength of the second connecting pin 112 and the plastic sealing material, and being beneficial to reducing the possibility of the occurrence of the plastic sealing delamination. At the same time, the through groove 1121 is beneficial to the stress release of the second connecting pin 112 during the solidification process of the plastic sealing material, and is further beneficial to reducing the possibility of the occurrence of the plastic sealing delamination. Overall, the reliability of the power module is improved from the two dimensions of physical connection and electrical performance.

[0030] Preferably, the first connecting pin 111 is one, and the second connecting pin 112 is three.

[0031] Preferably, the electric connector is made by an integral molding process, and the production efficiency is high.

[0032] Preferably, the material of the electric connector is copper, copper alloy or copper-containing composite material, which has the conductivity and heat dissipation property required for adapting to the packaging structure of the chip 300.

[0033] Preferably, the second connecting pin 112 is connected with the chip 300 in a silver sintering, copper sintering or solder welding manner.

[0034] Preferably, an installation hole 1111 for connecting with the circuit carrier 200 is formed on each first connecting pin 111. The installation hole 1111 can be a round hole, a semicircular hole or a waist-shaped hole.

[0035] Reference Figure 1 and Figure 2A plurality of flow bars 114 are formed in the middle of the connecting body 110. The plurality of flow bars 114 are symmetrically arranged about the center line 113 of the connecting body 110. Adjacent ends of every two adjacent second connecting pins 112 are respectively connected with the same flow bar 114 to share one flow bar 114. In this way, the current sharing performance can be further improved. It should be noted that the flow bar 114 can be two, three, four or more, which can conduct current and signal.

[0036] Referring to Figure 3 A plurality of through grooves 1121 are formed on each second connecting pin 112. The plurality of through grooves 1121 are arranged in pairs in parallel. In this way, the anti-plastic delamination performance can be further improved.

[0037] Preferably, two, three or more through grooves 1121 can be formed on each second connecting pin 112.

[0038] Referring to Figure 1 And Figure 2 The extension direction of each through groove 1121 is the same as the extension direction of the corresponding second connecting pin 112. Moreover, the ratio of the length of each through groove 1121 to the length of the corresponding second connecting pin 112 is equal to or greater than 4 / 5, so as to guarantee good anti-plastic delamination performance.

[0039] Referring to Figure 1 And Figure 2 Each second connecting pin 112 has one or more bending portions 1122. The middle portion of each second connecting pin 112 can be bent away from the circuit carrier 200 to form a bending portion 1122 in the middle portion of each second connecting pin 112. Alternatively, the end portion of each second connecting pin 112 can be bent away from the circuit carrier 200 to form a bending portion 1122 in the end portion of each second connecting pin 112. The bending portion 1122 is beneficial to release stress and thus improve the anti-plastic delamination performance.

[0040] Preferably, each second connecting pin 112 can have one, two or more bending portions 1122. Each bending portion 1122 is in the shape of a fold line or an arc line.

[0041] Referring to Figure 1 And Figure 2 A through hole 115 is formed in the middle of the connecting body 110. The plastic melt can flow through the through hole 115 to the lower side of the connecting body 110, guaranteeing the flowability and filling property of the plastic melt, increasing the connection strength of the connecting body 110 and the plastic, and being beneficial to reduce the possibility of the occurrence of the plastic delamination phenomenon. Meanwhile, the connecting body 110 is beneficial to release stress during the solidification of the plastic, and thus is beneficial to reduce the possibility of the occurrence of the plastic delamination phenomenon.

[0042] In the first embodiment, as shown in Figure 1 , three second connecting pins 112 are located on the same line so that the through hole 115 is relatively small.

[0043] In the second embodiment, as shown in Figure 2 , the middle second connecting pin 112 is not located on the same line with the two side second connecting pins 112 so that the size of the through hole 115 is larger, further improving the anti-plastic delamination performance.

[0044] Preferably, the number of through holes 115 can be one or more than two, and the shape can be circular, square, oval or polygon, which is not communicated with the through slot 1121.

[0045] In the fourth embodiment, referring to Figure 4 and Figure 5 , the electrical connector further comprises a buffer structure 120. The buffer structure 120 is installed in the through hole 115 for absorbing the stress generated during the plastic packaging process, further reducing the possibility of plastic delamination. Specifically, the buffer structure 120 comprises a capsule 121, a rigid node ring 122, a flexible connecting belt 123, a flexible filler 124 and a rigid filler 125. The capsule 121 is fixedly installed in the through hole 115. A plurality of rigid node rings 122 are arranged in multiple rows and columns in the capsule 121. Each rigid node ring 122 is connected with a plurality of flexible connecting belts 123, and each flexible connecting belt 123 is located on the tangent line of the rigid node ring 122. The flexible filler 124 is filled between the plurality of flexible connecting belts 123. The rigid filler 125 is filled in each rigid node ring 122.

[0046] In the fifth embodiment, referring to Figure 6 , the electrical connector comprises two connecting bodies 110 and three second connecting pins 112. The two connecting bodies 110 are arranged side by side. One end of each connecting body 110 is formed with a first connecting pin 111. The three second connecting pins 112 are located on the same line. The adjacent ends of each adjacent two second connecting pins 112 are connected to the other end of one connecting body 110, respectively. Each connecting body 110 is formed with a through hole 115. Each second connecting pin 112 is formed with a through slot 1121.

[0047] In the sixth embodiment, referring to Figure 7 , the electrical connector comprises a connecting body 110. The middle part of the connecting body 110 is bent to form a first connecting pin 111, and the opposite sides are bent to form three second connecting pins 112, respectively. Each second connecting pin 112 is formed with a through slot 1121.

[0048] In the seventh embodiment, referring to Figure 8The electrical connector comprises a connecting body 110. One side of the connecting body 110 is bent to form a first connecting pin 111, and the opposite ends are bent to form second connecting pins 112. Each second connecting pin 112 is formed with a through slot 1121.

[0049] In the eighth embodiment, referring to Figure 9 The electrical connector comprises a connecting body 110. The middle part of the connecting body 110 is bent to form two second connecting pins 112, and the opposite ends are bent to form first connecting pins 111. The connecting body 110 is formed with four through holes 115. Each second connecting pin 112 is formed with a through slot 1121.

[0050] The implementation principle of the embodiment is that, since the plurality of second connecting pins 112 are symmetrically arranged about the center line 113 of the connecting body 110, not only is the efficient parallel connection of the plurality of chips 300 achieved, but also the current paths of the plurality of chips 300 are effectively balanced, the current sharing performance is improved, the junction temperature and aging risk of the chip 300 are reduced, and the thermal stability is improved. Compared with the form of electrical connection relying on lead wires, the through-flow capacity is stronger, the connection reliability is higher, and the risk of falling off of the solder joint is avoided. The through slot 1121 is formed on each second connecting pin 112, which reduces the possibility of plastic encapsulation delamination. The overall layout is more compact, and the risk of plastic encapsulation delamination is also reduced. The overall layout is also more symmetrical, which reduces the impedance and avoids uneven parasitic parameters.

[0051] Referring to Figure 10The embodiment of the application further discloses a power module, which comprises the circuit carrier 200, the plurality of chips 300 and the electric connector. The plurality of chips 300 are installed on the circuit carrier 200 in parallel. Each first connecting pin 111 of the connecting body 110 is connected with the circuit carrier 200. Each second connecting pin 112 of the connecting body 110 is connected with the corresponding chip 300. The signal or current is conducted from each chip 300 to the circuit carrier 200 through the corresponding second connecting pin 112, the connecting body 110 and the first connecting pin 111. Since the plurality of second connecting pins 112 are symmetrically arranged about the center line 113 of the connecting body 110, not only the efficient parallel connection of the plurality of chips 300 is realized, but also the current path of the plurality of chips 300 is effectively balanced, and the current sharing performance is improved. The parasitic parameter distribution is relatively uniform, the switching loss and electromagnetic interference are reduced at high frequency, and the electrical performance and reliability of the power module are improved. The through groove 1121 is formed on each second connecting pin 112. The plastic melt can flow through the through groove 1121 to the lower side of the second connecting pin 112, which guarantees the flowability and filling property of the plastic sealing melt, increases the connection strength between the second connecting pin 112 and the plastic sealing material, and is beneficial to reducing the possibility of the plastic sealing delamination. Meanwhile, during the solidification process of the plastic sealing material, the through groove 1121 is beneficial to the stress release of the second connecting pin 112, and is further beneficial to reducing the possibility of the plastic sealing delamination. Overall, the reliability of the power module is improved from the two dimensions of physical connection and electrical performance.

[0052] The embodiments of the specific implementation are the preferred embodiments of the application, and do not limit the protection scope of the application, so that: equivalent changes made according to the structure, shape, principle of the application should be covered within the protection scope of the application. The embodiment of the application discloses an electric connector and a feeding and discharging device.

Claims

1. An electrical connector, characterized in that, include: The connecting body (110) is bent on one side to form one or more first connecting pins (111) and bent on the other side to form multiple second connecting pins (112); the multiple second connecting pins (112) are symmetrically arranged about the center line (113) of the connecting body (110); each second connecting pin (112) has a through groove (1121); each first connecting pin (111) is used to connect with a circuit carrier (200) used with an electrical connector; each second connecting pin (112) is used to connect with a chip (300) used with an electrical connector.

2. The electrical connector according to claim 1, characterized in that, A plurality of guide strips (114) are formed in the middle of the connecting body (110); the plurality of guide strips (114) are symmetrically arranged about the center line (113) of the connecting body (110); each pair of adjacent second connecting pins (112) shares one guide strip (114).

3. The electrical connector according to claim 1, characterized in that, Each of the second connection pins (112) has a plurality of through slots (1121) formed thereon; the plurality of through slots (1121) are arranged in parallel pairs.

4. The electrical connector according to claim 3, characterized in that, The extension direction of each of the through slots (1121) is the same as the extension direction of the corresponding second connection pin (112).

5. The electrical connector according to claim 4, characterized in that, The ratio of the length of each through slot (1121) to the length of the corresponding second connection pin (112) is equal to or greater than 4 / 5.

6. The electrical connector according to claim 1, characterized in that, Each of the second connection pins (112) has one or more bends (1122).

7. The electrical connector according to claim 1, characterized in that, A through hole (115) is formed in the middle of the connecting body (110).

8. The electrical connector according to claim 7, characterized in that, Also includes: A buffer structure (120) is installed inside the through hole (115).

9. The electrical connector according to claim 8, characterized in that, The buffer structure (120) includes: The capsule (121) is installed inside the through hole (115); There are multiple rigid node rings (122) arranged in multiple rows and columns inside the capsule (121); each rigid node ring (122) is connected to multiple flexible connecting strips (123), and each flexible connecting strip (123) is located on the tangent of the rigid node ring (122); Flexible filler (124) is filled between the plurality of the flexible connecting strips (123); Rigid filler (125) is filled in each of the rigid node rings (122).

10. A power module, characterized in that, The device includes a circuit carrier (200), a plurality of chips (300), and an electrical connector as described in any one of claims 1 to 9; the plurality of chips (300) are mounted side by side on the circuit carrier (200); each of the first connection pins (111) of the connection body (110) is connected to the circuit carrier (200); and each of the second connection pins (112) of the connection body (110) is connected to the corresponding chip (300).

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