Communication circuit board and electronic equipment

Abstract

The invention provides a communication circuit board and electronic equipment. The communication circuit board comprises a communication difference board and a communication common board, the communication difference board comprises a first PCB and a first communication module arranged on the first PCB, or the communication difference board comprises a second PCB and a second communication module arranged on the second PCB; the communication common board comprises a third PCB and a first radio frequency module arranged on the third PCB, when the third PCB and the first PCB are arranged in a stacked mode and connected, the first radio frequency module is matched and electrically connected with the first communication module, and when the third PCB and the second PCB are arranged in a stacked mode and connected, the first radio frequency module is matched and electrically connected with the second communication module. The communication circuit board and the electronic equipment provided by the invention are beneficial to reducing the cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronics, in particular to a communication circuit board and an electronic device. BACKGROUND

[0002] With the rapid development of electronic devices, users have higher and higher requirements for the communication quality of electronic devices, especially the demand for mobile networks, and the frequency range covered is becoming wider and wider. In order to meet the needs of domestic and overseas frequency bands, the radio frequency scheme has become more and more complex. In the related art, the radio frequency circuit board scheme capable of meeting the needs of domestic and overseas frequency bands needs a higher cost without sacrificing the area of the radio frequency circuit. SUMMARY

[0003] The present application provides a communication circuit board and an electronic device which are beneficial to reduce cost.

[0004] In one aspect, the present application provides a communication circuit board, comprising:

[0005] A communication difference board, the communication difference board comprises a first PCB board and a first communication module arranged on the first PCB board, or the communication difference board comprises a second PCB board and a second communication module arranged on the second PCB board;

[0006] A communication common board, the communication common board comprises a third PCB board and a first radio frequency module arranged on the third PCB board, when the third PCB board and the first PCB board are arranged in a stack and connected, the first radio frequency module is matched with and electrically connected to the first communication module, when the third PCB board and the second PCB board are arranged in a stack and connected, the first radio frequency module is matched with and electrically connected to the second communication module.

[0007] In another aspect, the present application also provides an electronic device, comprising a device body and the communication circuit board, the communication circuit board is arranged in the device body.

[0008] The communication circuit board provided in this application includes a communication differential board and a communication common board. The communication differential board includes a first PCB board and a first communication module mounted on the first PCB board, or the communication differential board includes a second PCB board and a second communication module mounted on the second PCB board. The communication common board includes a third PCB board and a first radio frequency module mounted on the third PCB board. When the third PCB board is stacked and connected to the first PCB board, the first radio frequency module is matched and electrically connected to the first communication module. When the third PCB board is stacked and connected to the second PCB board, the first radio frequency module is matched and electrically connected to the second communication module. That is, the first communication module and the second communication module are set on separate PCB boards, which can ensure that the first communication module and the second communication module have a larger area. At the same time, the first radio frequency module of the communication common board... It can be matched with both the first and second communication modules, meaning the communication shared board can be used by both modules. This allows for the development and testing of both modules using the same third PCB board and first RF module during the development, testing, and production phases. Furthermore, the same production fixture and assembly equipment can be used to manufacture the communication shared board. This eliminates the cost of compatibility design between the first and second communication modules, even when there are significant differences between them—for example, when the first and second communication modules meet domestic and overseas communication needs respectively. It also eliminates the cost of requiring two separate sets of third PCB boards and first RF modules during the development, testing, and production phases. Attached Figure Description

[0009] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below.

[0010] Figure 1 A side view of a communication circuit board provided in an embodiment of this application;

[0011] Figure 2 for Figure 1 A front view schematic diagram of a communication differential board in the communication circuit board shown;

[0012] Figure 3 for Figure 1 A schematic diagram of another front view of the communication difference board in the communication circuit board shown.

[0013] Figure 4 for Figure 1 A schematic diagram of the front structure of a communication common board in the communication circuit board shown;

[0014] Figure 5 for Figure 1Another front view of the communication common board in the communication circuit board is shown in the figure.

[0015] Figure 6 For Figure 1 The communication circuit board also includes a side view of the connection common board.

[0016] Figure 7 For Figure 2 The communication difference board also includes a front view of the first power amplifier integrated module and the first low noise amplifier integrated module.

[0017] Figure 8 For Figure 3 The communication difference board also includes a front view of the second power amplifier integrated module and the second low noise amplifier integrated module.

[0018] Figure 9 For Figure 5 The second radio frequency module in the communication common board includes a front view of the fourth power amplifier integrated module and the third low noise amplifier integrated module.

[0019] Figure 10 For Figure 9 The third low noise amplifier integrated module in the communication common board includes a front view of the first sub low noise amplifier integrated module and the second sub low noise amplifier integrated module.

[0020] Figure 11 A structure diagram of an electronic device provided by the embodiment is shown in the figure.

[0021] Explanation of reference signs:

[0022] Communication circuit board 100; communication difference board 10; communication common board 20; first PCB board 101; first communication module 102; second PCB board 103; second communication module 104; third PCB board 201; first radio frequency module 202; second radio frequency module 203; connection common board 30; first power amplifier integrated module 105; first low noise amplifier integrated module 106; second power amplifier integrated module 107; second low noise amplifier integrated module 108; third power amplifier integrated module 220; diversity reception front end module 221; fourth power amplifier integrated module 230; third low noise amplifier integrated module 231; first sub low noise amplifier integrated module 232; second sub low noise amplifier integrated module 233; electronic device 1000; device body 200. DETAILED DESCRIPTION

[0023] The technical solutions provided in this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the embodiments described in this application are only a portion of the embodiments, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments described in this application without creative effort are within the protection scope of this application.

[0024] In this application, the terms "implementation" and "example" mean that a particular feature, structure, or characteristic described may be included in at least one implementation of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same implementation, nor is it a mutually exclusive, independent, or alternative implementation. Those skilled in the art will explicitly and implicitly understand that the implementations described in this application can be combined with other implementations.

[0025] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish different objects, not to describe a particular order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, an assembly or device that includes one or more components is not limited to the one or more components listed, but may optionally also include one or more components not listed but inherent to the exemplified product, or one or more components that it should have based on the described function.

[0026] Due to differences in communication frequency bands between domestic and overseas markets, sharing the same PCB board for domestic and export RF circuit boards inevitably sacrifices the area of ​​either the domestic or export RF circuit. Furthermore, the need for compatible design between the domestic and export RF circuits incurs significant costs. While using completely separate PCB boards for domestic and export RF circuit boards can guarantee the area of ​​both, it requires the design, production, and assembly of two sets of RF circuits during development, testing, and manufacturing, increasing costs and wasting resources. Therefore, this application provides a communication circuit board that enables the production of both domestic and export RF circuit boards while avoiding resource waste and reducing costs.

[0027] like Figure 1 As shown, Figure 1 This is a side view of a communication circuit board 100 provided in an embodiment of this application. The communication circuit board 100 includes a communication differential board 10 and a communication common board 20.

[0028] Please refer to Figure 2 and Figure 3 , Figure 2 for Figure 1A schematic diagram of one structure of the communication differential board 10 in the communication circuit board 100 shown. Figure 3 for Figure 1 The diagram shows another structural schematic of the communication differential board 10 in the communication circuit board 100. The communication differential board 10 includes a first PCB board 101 and a first communication module 102 mounted on the first PCB board 101, or the communication differential board 10 includes a second PCB board 103 and a second communication module 104 mounted on the second PCB board 103.

[0029] In one possible embodiment, when the communication differentiation board 10 includes a first PCB board 101 and a first communication module 102 mounted on the first PCB board 101, the communication differentiation board 10 can meet the requirements of domestically sold RF circuit boards. It is understood that the first communication module 102 can support transmission and reception of domestic communication frequency bands. When the communication differentiation board 10 includes a second PCB board 103 and a second communication module 104 mounted on the second PCB board 103, the communication differentiation board 10 can meet the requirements of export-oriented RF circuit boards. It is understood that the second communication module 104 can support transmission and reception of overseas communication frequency bands.

[0030] Of course, in other possible embodiments, when the communication differential board 10 includes a first PCB board 101 and a first communication module 102 mounted on the first PCB board 101, the communication differential board 10 can also be an RF circuit board that meets export requirements. When the communication differential board 10 includes a second PCB board 103 and a second communication module 104 mounted on the second PCB board 103, the communication differential board 10 can also be an RF circuit board that meets domestic sales requirements.

[0031] In the following embodiments of this application, unless otherwise specified, the communication differential board 10 is used as an example where, if it includes a first PCB board 101 and a first communication module 102 mounted on the first PCB board 101, the communication differential board 10 can meet the requirements of domestic RF circuit boards; and if it includes a second PCB board 103 and a second communication module 104 mounted on the second PCB board 103, the communication differential board 10 can meet the requirements of export RF circuit boards. In one possible embodiment, the area of ​​the first PCB board 101 may be equal to the area of ​​the second PCB board 103.

[0032] Among them, such as Figure 2As shown, the first PCB board 101 can be a blank board (Printed Circuit Board, PCB) containing only circuits and pads but no electronic components, or the first PCB board 101 can be a finished board (Printed Circuit Board Assembly, PCBA) on which electronic components are mounted using technologies such as surface mount technology (SMT) and dual in-line-pin package (DIP). In this application, when the first PCB board 101 is a PCBA, the first PCB board 101 can be equipped with baseband chips, power chips, antenna feeds, etc.

[0033] The first communication module 102 can be an RF chip module or a baseband chip module. In embodiments where the first communication module 102 is an RF chip module, it can be an RF transceiver module supporting cellular mobile communication, or it can be an RF transceiver module supporting Wireless Communication Network (WCN), i.e., supporting Wireless Fidelity (WIFI), Bluetooth, Global Positioning System (GPS), or one or more other communication methods. The RF transceiver module is located at the front end of the RF circuit and is used to convert baseband signals to RF signals, as well as to transmit and receive RF signals. In embodiments where the first communication module 102 is a baseband chip module, the communication circuit board 100 is used to address the technical problem of avoiding resource waste and reducing costs when there are significant differences in the main modules of two types of baseband chips (including but not limited to two versions of baseband chips used domestically and overseas). In this case, the first communication module 102 can be a processor module, including but not limited to a Central Processing Unit (CPU). In the following embodiments of this application, unless otherwise specified, the first communication module 102 is exemplified as an RF chip module.

[0034] The first communication module 102 may be mounted on the first PCB board 101, or the first communication module 102 may be assembled on the surface of the first PCB board 101, including but not limited to the first communication module 102 being mounted on the surface of the first PCB board 101 by SMT technology.

[0035] like Figure 3As shown, the second PCB board 103 can be a blank board containing only circuits and pads, but without electronic components, or the second PCB board 103 can be a finished board on which electronic components are mounted using SMT, DIP, or other technologies on a blank board. In this application, when the second PCB board 103 is a PCBA, the second PCB board 103 can be equipped with baseband chips, power chips, antenna feeds, etc.

[0036] The second communication module 104 can be an RF chip module or a baseband chip module. In embodiments where the second communication module 104 is an RF chip module, it can be an RF chip module supporting cellular mobile communication, or it can be an RF chip module supporting WCN, i.e., supporting one or more communication methods such as Wi-Fi, Bluetooth, and GPS. In embodiments where the second communication module 104 is a baseband chip module, the communication circuit board 100 is used to address the technical problem of avoiding resource waste and reducing costs when there are significant differences in the main modules of two types of baseband chips (including but not limited to two versions of baseband chips used domestically and overseas). In this case, the second communication module 104 can be a processor module, including but not limited to a CPU. In the following embodiments of this application, unless otherwise specified, the second communication module 104 is used as an example of an RF chip module.

[0037] The second communication module 104 may be mounted on the second PCB board 103, or the second communication module 104 may be assembled on the surface of the second PCB board 103, including but not limited to the second communication module 104 being mounted on the surface of the second PCB board 103 by SMT technology.

[0038] The first communication module 102 differs from the second communication module 104. In this embodiment, the main difference between the first communication module 102 and the second communication module 104 is that the frequency bands supported by the first communication module 102 for transmitting and receiving signals are different from those supported by the second communication module 104. The structure of the first PCB board 101 and the structure of the second PCB board 103 may be the same or different.

[0039] like Figure 4 As shown, Figure 4 for Figure 1 This is a schematic diagram of a communication common board 20 in the communication circuit board 100 shown. The communication common board 20 includes a third PCB board 201 and a first radio frequency module 202 mounted on the third PCB board 201.

[0040] In this embodiment of the application, the communication common board 20 can meet the common use of domestic and export RF circuit boards during the development and testing stages, and can also meet the common use of production fixtures and assembly equipment for domestic and export RF circuit boards during the production stage.

[0041] The third PCB board 201 can be a blank board containing only circuitry and pads, but without electronic components; or, the third PCB board 201 can be a finished board on which electronic components are mounted using SMT, DIP, or other technologies on a blank board. In one possible embodiment, the area of ​​the third PCB board 201 can be smaller than the area of ​​the first PCB board 101.

[0042] The first radio frequency (RF) module 202 includes an RF chip module. Specifically, in embodiments where the first communication module 102 and the second communication module 104 are RF chip modules, the first RF module 202 may include at least one RF front-end module; in embodiments where the first communication module 102 and the second communication module 104 are baseband chip modules, the first RF module 202 may include at least one RF transceiver module and / or at least one RF front-end module. The RF front-end module is located between the RF transceiver module and the antenna feed in the RF circuit, and is used to realize the transmission and processing of signals between the RF transceiver module and the antenna radiator.

[0043] The first radio frequency module 202 may be mounted on the third PCB board 201, which means that the first radio frequency module 202 is assembled on the surface of the third PCB board 201, including but not limited to the first radio frequency module 202 being mounted on the surface of the third PCB board 201 by SMT technology.

[0044] Please refer to Figure 2 and Figure 4When the third PCB board 201 is stacked and connected to the first PCB board 101, the first radio frequency module 202 is matched and electrically connected to the first communication module 102. It can be understood that the communication circuit board 100 provided in this application includes a first PCB board 101, a first communication module 102 mounted on the first PCB board 101, a third PCB board 201, and a first radio frequency module 202 mounted on the third PCB board 201. The first PCB board 101 and the third PCB board 201 are stacked and interconnected, and the first communication module 102 is matched and electrically connected to the first radio frequency module 202. The interconnection between the first PCB board 101 and the third PCB board 201 includes, but is not limited to, direct connection or indirect connection. Direct connection methods include, but are not limited to, directly soldering them together, directly bonding them together, directly pressing them together, or bolting them together. Indirect connection methods include, but are not limited to, connecting them to the same PCB board or connecting them to the same dielectric substrate. The electrical connection between the first communication module 102 and the first radio frequency module 202 includes, but is not limited to, direct electrical connection or indirect electrical connection. Direct electrical connection methods include, but are not limited to, directly soldering the electrical connection interfaces of the two components together. Indirect electrical connection methods include, but are not limited to, connecting the electrical connection interfaces of the two components through electrical connection structures such as conductive posts, conductive holes, conductive wires, and electrical connectors. In the embodiment where the first communication module 102 is a radio frequency (RF) chip module, the first communication module 102 is matched with the first RF module 202, meaning that RF signal transmission can be achieved between the first communication module 102 and the first RF module 202. In the embodiment where the first communication module 102 is a baseband chip module, the first communication module 102 is matched with the first RF module 202, meaning that baseband signal transmission can be achieved between the first communication module 102 and the first RF module 202.

[0045] In one possible embodiment, when the third PCB board 201 is stacked and connected to the first PCB board 101, the first communication module 102 can be mounted on the side of the first PCB board 101 opposite to the third PCB board 201, and the first radio frequency module 202 can be mounted on the side of the third PCB board 201 opposite to the first PCB board. Specifically, the stacking of the third PCB board 201 and the first PCB board 101 means that the third PCB board 201 and the first PCB board 101 are arranged opposite each other along the thickness direction of the communication circuit board 100.

[0046] Please refer to Figure 3 and Figure 4When the third PCB board 201 is stacked and connected to the second PCB board 103, the first radio frequency module 202 is matched and electrically connected to the second communication module 104. It can be understood that another communication circuit board 100 provided in this application includes a second PCB board 103, a second communication module 104 mounted on the second PCB board 103, a third PCB board 201, and a first radio frequency module 202 mounted on the third PCB board 201. The second PCB board 103 and the third PCB board 201 are stacked and interconnected, and the second communication module 104 is matched and electrically connected to the first radio frequency module 202. The interconnection between the second PCB board 103 and the third PCB board 201 includes, but is not limited to, direct or indirect connections. The electrical connection between the second communication module 104 and the first radio frequency module 202 includes, but is not limited to, direct or indirect electrical connections. In embodiments where the second communication module 104 is a radio frequency chip module, the matching of the second communication module 104 and the first radio frequency module 202 means that radio frequency signal transmission can be realized between the second communication module 104 and the first radio frequency module 202. In the embodiment where the second communication module 104 is a baseband chip module, the second communication module 104 is matched with the first radio frequency module 202, that is, the second communication module 104 and the first radio frequency module 202 can realize the transmission of baseband signals.

[0047] In one possible embodiment, when the third PCB board 201 and the second PCB board 103 are stacked and connected, the second communication module 104 can be mounted on the side of the second PCB board 103 facing away from the third PCB, and the first radio frequency module 202 can be mounted on the side of the third PCB board 201 facing away from the second PCB. Specifically, the stacking of the third PCB board 201 and the second PCB board 103 means that the third PCB board 201 and the second PCB board 103 are arranged opposite each other along the thickness direction of the communication circuit board 100.

[0048] The communication circuit board 100 provided in this application includes a communication differential board 10 and a communication common board 20. The communication differential board 10 includes a first PCB board 101 and a first communication module 102 mounted on the first PCB board 101, or the communication differential board 10 includes a second PCB board 103 and a second communication module 104 mounted on the second PCB board 103. The communication common board 20 includes a third PCB board 201 and a first radio frequency module 202 mounted on the third PCB board 201. When the third PCB board 201 is stacked and connected to the first PCB board 101, the first radio frequency module 202 is matched and electrically connected to the first communication module 102. When the third PCB board 201 is stacked and connected to the second PCB board 103, the first radio frequency module 202 is matched and electrically connected to the second communication module 104. That is, the first communication module 102 and the second communication module 104 are set on separate PCB boards, which can ensure that the first communication module 102 and the second communication module 104 have a large area. At the same time, the communication common board... The first radio frequency module 202 of the 20 can be matched with both the first communication module 102 and the second communication module 104. That is, the communication common board 20 can be shared by the first communication module 102 and the second communication module 104. In this way, during the development, testing and production stages, the same third PCB board 201 and the first radio frequency module 202 can be used to develop and test the first communication module 102 and the second communication module 104. The same production fixture and assembly equipment can also be used to produce the communication common board 20. Thus, when there are significant differences between the first communication module 102 and the second communication module 104, such as the first communication module 102 and the second communication module 104 being communication modules that meet domestic and overseas communication needs respectively, the cost of compatibility design for the first communication module 102 and the second communication module 104 is saved, as well as the cost of needing two sets of third PCB boards 201 and first radio frequency modules 202 for the first communication module 102 and the second communication module 104 during the development, testing and production stages is saved.

[0049] Please refer to Figure 4 and Figure 5 In one possible implementation, the third PCB board 201 has a common assembly area and a differential assembly area. The first radio frequency module 202 is mounted in the common assembly area. When the third PCB board 201 is stacked and connected to the first PCB board 101, the differential assembly area is designed to be compatible with the first communication module 102. When the third PCB board 201 is stacked and connected to the second PCB board 103, the communication common board 20 further includes a second radio frequency module 203 mounted in the differential assembly area, and the second radio frequency module 203 is matched and electrically connected to the second communication module 104.

[0050] The electronic components mounted in the shared assembly area can be shared by the communication differential board 10 formed by the first PCB board 101 and the first communication module 102, and by the communication differential board 10 formed by the second PCB board 103 and the second communication module 104. The electronic components mounted in the differential assembly area are exclusively used by the communication differential board 10 formed by the second PCB board 103 and the second communication module 104. In this application, the first radio frequency module 202 can be mounted in the shared assembly area using SMT technology.

[0051] Understandably, in embodiments where the communication circuit board 100 includes a third PCB board 201, a first radio frequency module 202, a first PCB board 101, and a first communication module 102, the differential assembly area of ​​the third PCB board 201 is not equipped with electronic devices for communication, which can be simply understood as an empty mounting area. In this case, the differential assembly area also needs to be designed for circuit compatibility with the first communication module 102 to avoid affecting the signal transmission between the first communication module 102 on the first PCB board 101 and the first radio frequency module 202 on the third PCB board 201, and to avoid affecting the signal transmission between the first radio frequency module 202 on the third PCB board 201 and the antenna feed on the first PCB board 101.

[0052] In an embodiment where the communication circuit board 100 includes a third PCB board 201, a first radio frequency module 202, a second PCB board 103, and a second communication module 104, the second radio frequency module 203 is mounted in a differential assembly area of ​​the third PCB board 201. In this case, the second communication module 104 on the second PCB board 103 is matched and electrically connected to both the first radio frequency module 202 and the second radio frequency module 203 on the third PCB board 201. The electrical connection between the second communication module 104 and the second radio frequency module 203 includes, but is not limited to, direct or indirect electrical connection. In an embodiment where the second communication module 104 is a radio frequency chip module, the matching of the second communication module 104 and the second radio frequency module 203 enables the transmission of radio frequency signals between them. In the embodiment where the second communication module 104 is a baseband chip module, the second communication module 104 is matched with the second radio frequency module 203, that is, the second communication module 104 and the second radio frequency module 203 can realize the transmission of baseband signals.

[0053] In one possible embodiment, the first radio frequency module 202 and the second radio frequency module 203 may be mounted on the same side of the third PCB board 201.

[0054] In this embodiment, the communication sharing board 20 can be shared by the first communication module 102 and the second communication module 104, thereby reducing costs. At the same time, a second communication module with strong communication capabilities, such as the MT6199 transceiver, can be selected to improve communication performance. Alternatively, a first communication module with weaker communication capabilities, such as the MT6197 transceiver, can be selected to further reduce costs.

[0055] like Figure 6 As shown, in one possible implementation, the communication circuit board 100 further includes a connection common board 30. The communication difference board 10, the connection common board 30, and the communication common board 20 are stacked sequentially. The connection common board 30 includes main connection lines and compatible connection lines. When the third PCB board 201 is stacked and connected to the first PCB board 101, the main connection lines include common connection lines, and the common connection lines and the compatible connection lines are used to realize the electrical connection between the first RF module 202 and the first communication module 102. When the third PCB board 201 is stacked and connected to the second PCB board 103, the main connection lines are used to realize the electrical connection between the first RF module 202, the second RF module 203, and the second communication module 104.

[0056] In one possible embodiment, the communication circuit board 100 provided in this application includes a first PCB board 101, a connection common board 30, and a communication common board 20 stacked sequentially. A first communication module 102 is mounted on the first PCB board 101. The connection common board 30 has main connection lines and compatible connection lines. The communication common board 20 includes a third PCB board 201 and a first radio frequency module 202 mounted on the third PCB board 201. In this embodiment, the communication differential board 10 formed by the first PCB board 101 and the first communication module 102 can also be referred to as the main board of the communication circuit board 100, the connection common board 30 can be referred to as the raised board of the communication circuit board 100, and the communication common board 20 can also be referred to as the stacked board of the communication circuit board 100.

[0057] In another possible embodiment, the communication circuit board 100 provided in this application includes a second PCB board 103, a connection common board 30, and a communication common board 20 stacked sequentially. A second communication module 104 is mounted on the second PCB board 103. The connection common board 30 has main connection lines and compatible connection lines. The communication common board 20 includes a third PCB board 201 and a first radio frequency module 202 mounted on the third PCB board 201. In this embodiment, the communication difference board 10 formed by the second PCB board 103 and the second communication module 104 can also be referred to as the main board of the communication circuit board 100, the connection common board 30 can be referred to as the stepping board of the communication circuit board 100, and the communication common board 20 can also be referred to as the stacked board of the communication circuit board 100.

[0058] In this embodiment of the application, the shared connection board 30 can meet the needs of sharing between domestic and export RF circuit boards during the development and testing stages, and can also meet the needs of sharing production fixtures and assembly equipment between domestic and export RF circuit boards during the production stage.

[0059] Primary connection lines can include PCB traces, pads, and conductive vias. Compatible connection lines can include PCB traces, pads, and conductive vias. Common connection lines can include PCB traces, pads, and conductive vias.

[0060] In the embodiment where the communication difference board 10 includes a second PCB board 103 and a second communication module 104, the main connection line serves to connect the first RF module 202, the second RF module 203, and the second communication module 104, while the compatibility connection line is idle. In the embodiment where the communication difference board 10 includes a first PCB board 101 and a first communication module 102, the compatibility connection line and the shared connection line in the main connection line serve to connect the first RF module 202 and the first communication module 102, while the remaining connection lines in the main connection line other than the shared connection line are idle.

[0061] In this embodiment, the common connection board 30 can be shared by the first communication module 102 and the second communication module 104. Thus, during the development, testing, and production stages, the same common connection board 30 can be used to develop and test the first communication module 102 and the second communication module 104. The same production fixture and assembly equipment can also be used to produce the common connection board 30. This saves the cost of compatibility design for the first communication module 102 and the second communication module 104, and the cost of two sets of third PCB boards 201 and first RF modules 202 required for the first communication module 102 and the second communication module 104 during the development, testing, and production stages. It also saves the cost of two sets of electrical connection boards required for the first communication module 102 and the second communication module 104 during the development, testing, and production stages. Furthermore, the design of the shared connection board 30 in this embodiment can be based on the electrical connection between the first RF module 202, the second RF module 203 and the second communication module 104. On this basis, a compatible design for the electrical connection between the first RF module 202 and the first communication module 102 can be made. That is, the design of the compatible connection line is carried out on the basis of the completion of the main connection line design. In this way, while meeting the electrical connection design of the domestic and foreign RF circuit boards, the design difficulty of the shared connection board 30 can be reduced, as well as the complexity of the electrical connection line on the shared connection board 30 can be reduced.

[0062] In one possible implementation, the first communication module 102 includes a first radio frequency transceiver. The second communication module 104 includes a second radio frequency transceiver. The first radio frequency module 202 includes a first radio frequency front-end module, and the second radio frequency module 203 includes a second radio frequency front-end module.

[0063] Understandably, in this embodiment, the first communication module 102 and the second communication module 104 are both radio frequency (RF) chip modules. In this embodiment, the first RF transceiver is used to convert baseband signals to RF signals in domestic communication frequency bands. The second RF transceiver is used to convert baseband signals to RF signals in overseas communication frequency bands. The first RF front-end module may include a power amplifier (PA) module, a low-noise amplifier (LNA) module, etc. The second RF front-end module may include a power amplifier (PA) module, a low-noise amplifier (LNA) module, etc. When the communication difference board 10 includes a first PCB board 101 and a first communication module 102, the first RF front-end module is used to transmit RF signals between the first RF transceiver and the antenna feed on the first PCB board 101. When the communication difference board 10 includes a second PCB board 103 and a second communication module 104, the first RF front-end module is used to transmit RF signals between the second RF transceiver and the antenna feed on the second PCB board 103.

[0064] The communication circuit board 100 of this embodiment can realize the design of a common communication board 20 and / or a common connection board 30 for domestic and export RF circuit boards during the development and testing phases, as well as the design of common production fixtures and assembly equipment for the common communication board 20 and the common connection board 30 in domestic and export RF circuit boards.

[0065] In one possible implementation, such as Figure 7 As shown, when the communication difference board 10 includes the first PCB board 101 and the first communication module 102, the communication difference board 10 also includes a first power amplifier integrated module 105 and / or a first low noise amplifier integrated module 106 mounted on the first PCB board 101. The first power amplifier integrated module 105 is electrically connected to the transmitting end of the first radio frequency transceiver, and the first low noise amplifier integrated module 106 is electrically connected to the receiving end of the first radio frequency transceiver.

[0066] The first power amplifier integrated module 105 can be an integrated module formed by integrating a power amplifier (PA) with one or more of a switch, filter, duplexer, LNA, etc. In one possible embodiment, the first power amplifier integrated module 105 can be a power amplifier module with integrated duplexer (PAMID). The first power amplifier integrated module 105 is located in the transmit path of the radio frequency signal transmission path and is used to receive the radio frequency signal transmitted by the first radio frequency transceiver and perform integrated functions such as amplification, frequency band switching, and transmit / receive isolation. The first power amplifier integrated module 105 can be mounted on the first PCB board 101 by assembling the first power amplifier integrated module 105 onto the surface of the first PCB board 101, including but not limited to mounting the first power amplifier integrated module 105 onto the surface of the first PCB board 101 using SMT technology. The first power amplifier integrated module 105 is electrically connected to the transmitter of the first radio frequency transceiver through, but not limited to, a connection common board 30.

[0067] The first low-noise amplifier integrated module 106 can be an integrated module formed by integrating an LNA with one or more of a switch, filter, duplexer, etc. In one possible embodiment, the first low-noise amplifier integrated module 106 can be a low-noise amplifier front-end module (LFEM). The first low-noise amplifier integrated module 106 is located in the receiving path of the radio frequency signal transmission path, and is used to filter and amplify the radio frequency signal fed back from the antenna feed before transmitting it to the first radio frequency transceiver. The first low-noise amplifier integrated module 106 can be mounted on the surface of the first PCB board 101, including but not limited to the first low-noise amplifier integrated module 106 being mounted on the surface of the first PCB board 101 using SMT technology. The first low-noise amplifier integrated module 106 and the receiving end of the first radio frequency transceiver are electrically connected through, but not limited to, a common connection board 30.

[0068] In another possible implementation, such as Figure 8 As shown, when the communication difference board 10 includes a second PCB board 103 and a second communication module 104, the communication difference board 10 also includes a second power amplifier integrated module 107 and / or a second low noise amplifier integrated module 108 mounted on the second PCB board 103. The second power amplifier integrated module 107 is electrically connected to the transmitting end of the second radio frequency transceiver, and the second low noise amplifier integrated module 108 is electrically connected to the receiving end of the second radio frequency transceiver.

[0069] The second power amplifier integrated module 107 can be an integrated module formed by integrating a power amplifier (PA) with one or more of a switch, filter, duplexer, LNA, etc. In one possible embodiment, the second power amplifier integrated module 107 can be a PAMID. The second power amplifier integrated module 107 is located in the transmit path of the radio frequency signal transmission path and is used to receive the radio frequency signal transmitted by the second radio frequency transceiver and perform integrated functions such as amplification, frequency band switching, and transmit / receive isolation. The second power amplifier integrated module 107 can be mounted on the second PCB board 103 by assembling the second power amplifier integrated module 107 onto the surface of the second PCB board 103, including but not limited to mounting the second power amplifier integrated module 107 onto the surface of the second PCB board 103 using SMT technology. The second power amplifier integrated module 107 is electrically connected to the transmitter of the second radio frequency transceiver through, but not limited to, a connection common board 30.

[0070] The second low-noise amplifier integrated module 108 can be an integrated module formed by integrating an LNA with one or more of a switch, filter, duplexer, etc. In one possible embodiment, the second low-noise amplifier integrated module 108 can be an LFEM. The second low-noise amplifier integrated module 108 is located in the receiving path of the radio frequency signal transmission path and is used to filter and amplify the radio frequency signal fed back from the antenna feed before transmitting it to the second radio frequency transceiver. The second low-noise amplifier integrated module 108 can be mounted on the surface of the second PCB board 103, including but not limited to the second low-noise amplifier integrated module 108 being mounted on the surface of the second PCB board 103 using SMT technology. The second low-noise amplifier integrated module 108 and the receiving end of the second radio frequency transceiver are electrically connected through, but not limited to, a common connection board 30.

[0071] The signal amplification frequency band supported by the first power amplifier integrated module 105 may be the same as or different from the signal amplification frequency band supported by the second power amplifier integrated module 107. Similarly, the signal filtering and amplification frequency band supported by the first low-noise amplifier integrated module 106 may be the same as or different from the signal filtering and amplification frequency band supported by the second low-noise amplifier integrated module 108.

[0072] When the communication circuit board 100 of this embodiment is used as a domestic sales RF circuit board, the first power amplifier integrated module 105 and / or the first low-noise amplifier integrated module 106 can be directly electrically connected to the antenna feed on the first PCB board 101 without passing through the connection common board 30, thus reducing insertion loss and enhancing RF performance. When the communication circuit board 100 of this embodiment is used as an export sales RF circuit board, the second power amplifier integrated module 107 and / or the second low-noise amplifier integrated module 108 can be directly electrically connected to the antenna feed on the second PCB board 103 without passing through the connection common board 30, thus reducing insertion loss and enhancing RF performance.

[0073] In one possible implementation, the first power amplifier integrated module 105 is a Cbeta Power Amplifier Integrated Module (CBPA MID), and the first low-noise amplifier integrated module 106 is a Cbeta Low-Noise Amplifier Integrated Module (CBLFEM). The second power amplifier integrated module 107 is a Cbeta Power Amplifier Integrated Module (CBPAMID), and the second low-noise amplifier integrated module 108 is a Cbeta Low-Noise Amplifier Integrated Module (CBLFEM).

[0074] Ultra-high frequency (UHF) includes frequency bands greater than 3 GHz. For example, UHF may include the N77 band (3.3 GHz to 4.2 GHz), the N78 band (3.3 GHz to 3.8 GHz), and the N79 band (4.4 GHz to 5.0 GHz).

[0075] Understandably, in this embodiment, the first power amplifier integrated module 105 is used to realize integrated functions such as amplification, frequency band switching, and transmit / receive isolation of ultra-high frequency signals. The first low-noise amplifier integrated module 106 is used to realize filtering and amplification of ultra-high frequency signals. The second power amplifier integrated module 107 is used to realize integrated functions such as amplification, frequency band switching, and transmit / receive isolation of ultra-high frequency signals. The second low-noise amplifier integrated module 108 is used to realize filtering and amplification of ultra-high frequency signals.

[0076] Since the UHF signals in China are the same as those overseas, and the insertion loss of the line has a significant impact on the UHF signal, the first power amplifier integrated module 105 and / or the first low noise amplifier integrated module 106 are mounted on the first PCB board 101, and the second power amplifier integrated module 107 and / or the second low noise amplifier integrated module 108 are mounted on the second PCB board 103. This approach can balance cost and RF performance, thereby optimizing the overall performance.

[0077] In one possible implementation, such as Figure 9As shown, the first RF front-end module includes a third power amplifier integrated module 220 and / or a diversity receiver front-end module 221. The diversity receiver front-end module 221 is used to process the received signals from the diversity antenna. The second RF front-end module includes a fourth power amplifier integrated module 230 and / or a third low-noise amplifier integrated module 231.

[0078] Understandably, the third power amplifier integrated module 220 and the diversity receiver front-end module 221 (DIFEM) are shared modules between the first communication module 102 and the second communication module 104. The fourth power amplifier integrated module 230 and the third low-noise amplifier integrated module 231 are only used as radio frequency front-end circuit modules for realizing radio frequency signal transmission between the second communication module 104 and the antenna feed.

[0079] The third power amplifier integrated module 220 can be an integrated module formed by integrating a power amplifier (PA) with one or more of a switch, filter, duplexer, LNA, etc. The third power amplifier integrated module 220 is located in the transmit path of the radio frequency signal transmission path. In one possible embodiment, the third power amplifier integrated module 220 can be a PAMID. The third power amplifier integrated module 220 is mounted on the third PCB board 201, meaning it can be assembled onto the surface of the third PCB board 201, including but not limited to mounting the third power amplifier integrated module 220 onto the surface of the third PCB board 201 using SMT technology. The diversity receiving front-end module 221 can include devices such as LNA, filter, and switch. The diversity receiving front-end module 221 is located in the receive path of the radio frequency signal transmission path. The diversity receiving front-end module 221 is mainly responsible for multi-antenna diversity reception signal processing, improving communication stability and data rate through a receive link independent of the main antenna.

[0080] The fourth power amplifier integrated module 230 can be an integrated module formed by integrating a PA with one or more of a switch, filter, duplexer, LNA, etc., or it can be a standalone PA module. The fourth power amplifier integrated module 230 is located in the transmit path of the RF signal transmission path. The fourth power amplifier integrated module 230 can be mounted on the surface of the third PCB board 201, including but not limited to mounting the fourth power amplifier integrated module 230 onto the surface of the third PCB board 201 using SMT technology. The third low-noise amplifier integrated module 231 can be an integrated module formed by integrating an LNA with one or more of a switch, filter, duplexer, etc. In one possible embodiment, the third low-noise amplifier integrated module 231 can be an LFEM. The third low-noise amplifier integrated module 231 is located in the receive path of the RF signal transmission path and is used to filter and amplify the RF signal fed back from the antenna feed before transmitting it to the second RF transceiver. The third low-noise amplifier integrated module 231 may be mounted on the third PCB board 201, or the third low-noise amplifier integrated module 231 may be assembled on the surface of the third PCB board 201, including but not limited to the third low-noise amplifier integrated module 231 being mounted on the surface of the third PCB board 201 by SMT technology.

[0081] This embodiment allows for the sharing of the third power amplifier integrated module 220 and / or the diversity receiving front-end module 221 between the two communication circuit boards 100. The cooperation between the fourth power amplifier integrated module 230 and the third power amplifier integrated module 220 facilitates the implementation of dual-transmission functionality of the communication circuit board 100 when the communication differential board 10 includes the second PCB board 103 and the second communication module 104. The third low-noise amplifier integrated module 231 and the diversity receiving front-end module 221 facilitate the processing of received signals from the main antenna and diversity antenna when the signal differential board includes the second PCB board 103 and the second communication module 104.

[0082] Please refer to Figure 9 and Figure 10 In one possible implementation, the fourth power amplifier integrated module 230 cooperates with the third power amplifier integrated module 220 and / or the second power amplifier integrated module 107 to achieve dual-transmission functionality. The third low-noise amplifier integrated module 231 includes a first sub-low-noise amplifier integrated module 232 and a second sub-low-noise amplifier integrated module 233, which are used to implement the received signal processing of the multiple-input multiple-output antenna.

[0083] In one possible embodiment, the third power amplifier integrated module 220 is a low-mid-high frequency power amplifier integrated module (LMH PAMID).

[0084] The low, mid, and high frequency bands (MHB) include low, mid, and high frequencies. Low frequency (LB) encompasses bands below 1 GHz. For example, LB can include the B5 band (uplink 824MHz–849MHz; downlink 869MHz–894MHz), the B8 band (uplink 880MHz–915MHz; downlink 925MHz–960MHz), the B20 band (uplink 832MHz–862MHz; downlink 791MHz–821MHz), and the B28 band (uplink 703MHz–748MHz; downlink 758MHz–803MHz). Mid and high frequency (MHB) bands include mid and high frequencies. Mid frequency ranges from 1710MHz to 2170MHz. For example, intermediate frequencies can include the B1 band (uplink 1.92GHz–1.98GHz; downlink 2.11GHz–2.17GHz), the B2 band (uplink 1.85GHz–1.91GHz; downlink 1.93GHz–1.99GHz), the B3 band (uplink 1.71GHz–1.785GHz; downlink 1.805GHz–1.88GHz), the B4 band (uplink 1.71GHz–1.755GHz; downlink 2.11GHz–2.155GHz), the B34 band (2.01GHz–2.025GHz), and the B39 band (1.88GHz–1.92GHz). High frequencies include 2300MHz–2690MHz. For example, high frequencies can include the B7 band (uplink 2.5GHz to 2.57GHz; downlink 2.62GHz to 2.69GHz), the B38 band (2.57GHz to 2.62GHz), the B40 band (2.3GHz to 2.4GHz), and the B41 band (2.49GHz to 2.69GHz).

[0085] The third power amplifier integrated module 220 is used to realize integrated functions such as amplification of low-frequency, intermediate-frequency, and high-frequency signals, frequency band switching, and transmit / receive isolation. Since the domestic low, intermediate, and high-frequency signals are basically not shared with those overseas, the third power amplifier integrated module 220 is mounted on the third PCB board 201, which allows the domestic and overseas RF circuit boards to share the third power amplifier integrated module 220.

[0086] The fourth power amplifier integrated module 230 can be an E-UTRAN New Radio Dual Connectivity (ENDC) PA. In this embodiment, the fourth power amplifier integrated module 230, in conjunction with the third power amplifier integrated module 220, can achieve dual transmission of low, medium, and high frequency signals. The fourth power amplifier integrated module 230, in conjunction with the second power amplifier integrated module 107, can achieve dual transmission of ultra-high frequency signals.

[0087] In one possible embodiment, the third low-noise amplifier integrated module 231 is a mid-to-high frequency low-noise amplifier integrated module.

[0088] Understandably, both the first sub-low noise amplifier integrated module 232 and the second sub-low noise amplifier integrated module 233 can be MHB LFEM (MIMO). The first sub-low noise amplifier integrated module 232 and the second sub-low noise amplifier integrated module 233 work together to realize the received signal processing of the mid-to-high frequency multi-input multi-output antenna.

[0089] The communication common board 20 of this embodiment can realize the transmission processing of low, medium and high frequency radio frequency signals, the signal reception processing of diversity antennas, and when used as an export radio frequency circuit board, it can also realize the dual transmission function in the ENDC scenario, as well as the signal reception processing of medium and high frequency multi-input multi-output antennas.

[0090] like Figure 11 As shown, Figure 11 This is a schematic diagram of an electronic device 1000 provided in an embodiment of this application. The electronic device 1000 can be a mobile phone, a tablet, a wearable device, or other device with wireless communication capabilities. In this embodiment, the electronic device 1000 is taken as a mobile phone. The electronic device 1000 includes a device body 200 and a communication circuit board 100 as described in any of the above embodiments, wherein the communication circuit board 100 is disposed within the device body 200.

[0091] In one possible embodiment, the device body 200 may include a display screen and a housing. The display screen and the housing enclose a receiving space. A communication circuit board 100 is disposed within the receiving space. In embodiments where the electronic device 1000 includes only a motherboard, the communication circuit board 100 may be the motherboard of the electronic device 1000. In embodiments where the electronic device 1000 includes both a motherboard and a sub-board, the communication circuit board 100 may serve as either the motherboard or a sub-board of the electronic device 1000.

[0092] The features mentioned above in the specification, claims, and drawings can be combined in any way as long as they are meaningful within the scope of this application. The advantages and features described for the communication circuit board 100 are applied accordingly to the electronic device 1000.

[0093] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application, and such improvements and refinements are also considered to be within the protection scope of this application.

Claims

1. A communication circuit board, characterized in that, include: A communication differential board, the communication differential board including a first PCB board and a first communication module mounted on the first PCB board, or the communication differential board including a second PCB board and a second communication module mounted on the second PCB board; A communication common board includes a third PCB board and a first radio frequency module mounted on the third PCB board. When the third PCB board and the first PCB board are stacked and connected, the first radio frequency module is matched and electrically connected to the first communication module. When the third PCB board and the second PCB board are stacked and connected, the first radio frequency module is matched and electrically connected to the second communication module.

2. The communication circuit board according to claim 1, characterized in that, The third PCB board has a common assembly area and a differential assembly area, and the first radio frequency module is disposed in the common assembly area. When the third PCB board and the first PCB board are stacked and connected, the differential assembly area is designed to be compatible with the first communication module. When the third PCB board and the second PCB board are stacked and connected, the communication common board further includes a second radio frequency module disposed in the differential assembly area, and the second radio frequency module is matched and electrically connected to the second communication module.

3. The communication circuit board according to claim 2, characterized in that, The communication circuit board further includes a connection common board. The communication difference board, the connection common board, and the communication common board are stacked sequentially. The connection common board includes a main connection line and a compatible connection line. The main connection line includes a common connection line. When the third PCB board is stacked and connected to the first PCB board, the common connection line and the compatible connection line are used to realize the electrical connection between the first RF module and the first communication module. When the third PCB board is stacked and connected to the second PCB board, the main connection line is used to realize the electrical connection between the first RF module, the second RF module, and the second communication module.

4. The communication circuit board according to claim 2, characterized in that, The first communication module includes a first radio frequency transceiver, the second communication module includes a second radio frequency transceiver, the first radio frequency module includes a first radio frequency front-end module, and the second radio frequency module includes a second radio frequency front-end module.

5. The communication circuit board according to claim 4, characterized in that, When the communication difference board includes the first PCB board and the first communication module, the communication difference board further includes a first power amplifier integrated module and / or a first low-noise amplifier integrated module mounted on the first PCB board. The first power amplifier integrated module is electrically connected to the transmitting end of the first RF transceiver, and the first low-noise amplifier integrated module is electrically connected to the receiving end of the first RF transceiver. When the communication difference board includes a second PCB board and a second communication module, the communication difference board further includes a second power amplifier integrated module and / or a second low-noise amplifier integrated module mounted on the second PCB board. The second power amplifier integrated module is electrically connected to the transmitting end of the second RF transceiver, and the second low-noise amplifier integrated module is electrically connected to the receiving end of the second RF transceiver.

6. The communication circuit board according to claim 5, characterized in that, The first power amplifier integrated module is an ultra-high frequency power amplifier integrated module, and the first low noise amplifier integrated module is an ultra-high frequency low noise amplifier integrated module; the second power amplifier integrated module is an ultra-high frequency power amplifier integrated module, and the second low noise amplifier integrated module is an ultra-high frequency low noise amplifier integrated module.

7. The communication circuit board according to claim 5, characterized in that, The first radio frequency front-end module includes a third power amplifier integrated module and / or a diversity receiver front-end module, wherein the diversity receiver front-end module is used to implement the received signal processing of the diversity antenna; the second radio frequency front-end module includes a fourth power amplifier integrated module and / or a third low-noise amplifier integrated module.

8. The communication circuit board according to claim 7, characterized in that, The fourth power amplifier integrated module works in conjunction with the third power amplifier integrated module and / or the second power amplifier integrated module to achieve dual-transmission functionality. The third low-noise amplifier integrated module includes a first sub-low-noise amplifier integrated module and a second sub-low-noise amplifier integrated module. The first sub-low-noise amplifier integrated module and the second sub-low-noise amplifier integrated module are used to implement the received signal processing of the multiple-input multiple-output antenna.

9. The communication circuit board according to claim 7, characterized in that, The third power amplifier integrated module is a low-to-medium-frequency power amplifier integrated module; the third low-noise amplifier integrated module is a medium-to-high-frequency low-noise amplifier integrated module.

10. An electronic device, characterized in that, It includes a device body and a communication circuit board according to any one of claims 1 to 9, wherein the communication circuit board is disposed within the device body.

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