Cooling equipment and data center

Abstract

The invention discloses cooling equipment and a data center. The cooling equipment comprises a liquid cooling part, the liquid cooling part comprises a first liquid working medium source, a first heat exchanger and a second working medium assembly, and the first liquid working medium source is used for containing a first working medium; the first heat exchanger comprises a first working medium channel and a second working medium channel; the first working medium assembly comprises a first pipeline and a first pump; an inlet port of the first pipeline is connected with a first liquid working medium source, and an outlet port of the first pipeline is connected with an inlet of the first working medium channel; the second working medium assembly comprises a second pipeline, a third pipeline and a second pump; an inlet port of the second pipeline is connected with an outlet of the second working medium channel, and an outlet port of the second pipeline is connected with an inlet of the liquid cooling assembly; an outlet port of the third pipeline is connected with an inlet of the second working medium channel, and an inlet port of the third pipeline is connected with an outlet of the liquid cooling assembly; and the air cooling part comprises a fresh air channel, the fresh air channel is connected with the machine room, and an air cooling assembly is isolated from the liquid cooling part.

Description

[0001] This application claims priority to the Chinese Patent Application No. 202410619720.X, filed on May 17, 2024, entitled “A Liquid Cooling Device”, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of heat dissipation technology, and in particular, to a cooling device and a data center. BACKGROUND

[0003] At present, the cooling device of the data center is relatively single in function. The cooling device either provides cooling liquid or provides cold air (e.g., fresh air). Although this avoids the influence of the cooling liquid cooling component on the cold air, and avoids the influence of the cold air cooling component on the cooling liquid, it is difficult to simultaneously meet the needs of the data center for the cooling liquid and the cold air. If the cooling device for providing the cooling liquid and the cooling device for providing the cold air are deployed at the same time, a relatively large space is required.

[0004] The vigorous development of cloud computing and other technologies puts higher and higher requirements on the capacity of the data center. Generally speaking, the way to expand the capacity of the data center is to increase the number of computing devices in the computer room and to increase the power of the computing devices. The increase in the number and power of the computing devices in the computer room also increases the cooling capacity requirements of the computer room, which increases the demand for cooling liquid and cold air of the computer room. Therefore, it is necessary to deploy a cooling device that can meet the needs of the computer room for cooling liquid and cold air in a relatively limited space. SUMMARY

[0005] The present application provides a cooling device and a data center, which can provide cooling liquid and cold air for the computer room with the same cooling device and ensure the cooling effect of the cooling liquid and the cold air.

[0006] In a first aspect, a cooling device is provided for cooling computing devices in a computer room; wherein the computing devices are connected to the cooling device through liquid cooling assemblies; wherein the cooling device comprises: a liquid cooling part comprising: a first liquid working medium source configured to contain a first working medium; a first heat exchanger comprising a first working medium passage and a second working medium passage; and a first working medium assembly comprising a first pipeline and a first pump; wherein an inlet port of the first pipeline is connected to the first liquid working medium source, and an outlet port of the first pipeline is connected to an inlet of the first working medium passage; under the action of the first pump, the first working medium in the first liquid working medium source enters the first pipeline and then enters the first working medium passage; a second working medium assembly comprising a second pipeline, a third pipeline and a second pump; wherein an inlet port of the second pipeline is connected to an outlet of the second working medium passage, and an outlet port of the second pipeline is connected to an inlet of the liquid cooling assembly; an outlet port of the third pipeline is connected to an inlet of the second working medium passage, and an inlet port of the third pipeline is connected to an outlet of the liquid cooling assembly; under the action of the second pump, the second working medium in the liquid cooling assembly enters the second working medium passage through the third pipeline, and then reenters the liquid cooling assembly through the second working medium passage and the second pipeline; wherein the second working medium in the liquid cooling assembly is configured to absorb heat emitted by the computing devices, and the first working medium in the first working medium passage is configured to absorb heat emitted by the second working medium in the second working medium passage; and an air cooling part comprising an air passage, wherein the air passage is connected to the computer room, and air enters the computer room through the air passage; wherein the air cooling assembly and the liquid cooling part are isolated from each other.

[0007] The cooling device can provide cooling liquid and fresh air at the same time, and can meet the needs of cooling liquid and fresh air in a relatively limited space. Moreover, the liquid cooling part for providing cooling liquid and the air cooling part for providing fresh air are isolated from each other, so that the liquid cooling part does not affect the fresh air, that is, the temperature of the fresh air does not increase due to the liquid cooling part, thereby improving the cooling effect of the fresh air.

[0008] In addition, the cooling device can be deployed in a flexible manner, and can be deployed on the side or top of the computer room. One computer room can be provided with one or more cooling devices, so that sufficient cooling liquid and fresh air can be provided for the computer room.

[0009] When the cooling device is deployed on the side of the computer room, the cooling device can be deployed nearby, and the circulation of the cooling liquid and the fresh air is shortened, so that the cooling liquid and the fresh air can be efficiently provided for the computer room. In particular, for a low-level computer room, compared with deploying the cooling device on the roof, deploying the cooling device on the side greatly shortens the circulation of the cooling liquid, and greatly improves the cooling efficiency.

[0010] In addition, each machine room corresponds to one or more cooling devices, the cooling device corresponding to the machine room provides cooling liquid for the computing devices in the machine room, which can save the coolant distribution unit (CDU), thereby further reducing the cooling liquid circuit and improving the cooling efficiency.

[0011] In a possible implementation, the cooling device further includes: a second heat exchanger, including: a third working medium channel and a fourth working medium channel; wherein the inlet of the third working medium channel is connected with the outlet of the second pipeline, and the outlet of the third working medium channel is connected with the inlet of the third pipeline, so that the second working medium in the second working medium channel enters the third working medium channel through the second pipeline and reenters the second working medium channel through the third working medium channel and the third pipeline; and a first air cooling assembly, including: a fourth pipeline, a fifth pipeline and a third pump; wherein the inlet of the fourth pipeline is connected with the outlet of the air evaporator in the machine room, and the outlet of the fourth pipeline is connected with the inlet of the fourth working medium channel; the inlet of the fifth pipeline is connected with the outlet of the fourth working medium channel, and the outlet of the fifth pipeline is connected with the inlet of the air evaporator; under the action of the third pump, the working medium in the air evaporator enters the fourth working medium channel through the fourth pipeline and reenters the air evaporator through the fourth working medium channel and the fifth pipeline; wherein the second working medium in the third working medium channel is configured to absorb the heat dissipated by the working medium in the fourth working medium channel.

[0012] The cooling device can provide cooling liquid and fresh air at the same time, and further improve the cooling effect of the machine room. In addition, when the cooling device is deployed on the side of the machine room, it is not necessary to use the roof space to deploy the device for providing cooling liquid, nor is it necessary to use the roof space to deploy the device for providing cold air, so that the heat dissipation of the machine room can be freed from the dependence on the roof space, or in other words, the roof space does not affect the liquid cooling of the machine room, nor does it affect the air cooling of the machine room.

[0013] In a possible implementation, an adjusting valve is arranged on the outlet of the second pipeline, and the adjusting valve is configured to adjust the proportion between the second working medium output to the liquid cooling assembly and the second working medium output to the third working medium channel.

[0014] The liquid cooling and the air cooling share the cooling liquid output by the second pipeline. By adjusting the proportion between the cooling liquid for liquid cooling and the cooling liquid for air cooling through the adjusting valve, the cooling effects of liquid cooling and air cooling can be flexibly adjusted to meet different heat dissipation requirements.

[0015] In a possible implementation, the air cooling part further comprises: a second liquid working medium source configured to contain a third working medium; a third heat exchanger comprising a fifth working medium channel and a sixth working medium channel; a third working medium assembly comprising a sixth pipeline and a fourth pump; wherein the inlet port of the sixth pipeline is connected with the second liquid working medium source, and the outlet port of the sixth pipeline is connected with the inlet of the fifth working medium channel; under the action of the fourth pump, the third working medium in the second liquid working medium source enters the sixth pipeline and then enters the fifth working medium channel through the sixth pipeline; the second air cooling assembly comprises: a seventh pipeline, an eighth pipeline and a fifth pump; wherein the inlet port of the seventh pipeline is connected with the outlet of the air evaporator in the machine room, and the outlet port of the seventh pipeline is connected with the inlet of the sixth working medium channel; the inlet port of the eighth pipeline is connected with the outlet of the sixth working medium channel, and the outlet of the eighth pipeline is connected with the inlet of the air evaporator; under the action of the fifth pump, the working medium in the air evaporator enters the sixth working medium channel through the seventh pipeline and then reenters the air evaporator through the sixth working medium channel and the eighth pipeline; wherein the fourth working medium in the fifth working medium channel is configured to absorb the heat emitted by the working medium in the sixth working medium channel.

[0016] In this implementation, the air cooling has an independent cooling liquid source, and does not need to share the cooling liquid with the liquid cooling, so that the air cooling effect can be improved, and the influence of the air cooling on the liquid cooling effect can be avoided.

[0017] In a possible implementation, the cooling device further comprises: a first cold source connected with the outlet of the first working medium channel through a ninth pipeline and connected with the first liquid working medium source through a tenth pipeline; wherein the first working medium in the first working medium channel enters the first cold source through the ninth pipeline, and then reenters the first liquid working medium source through the tenth pipeline after being cooled by the first cold source.

[0018] In this implementation, the cooling device further comprises a cold source capable of cooling the working medium output by the first heat exchanger, so that the working medium can be recycled.

[0019] In a possible implementation, the first cold source comprises: a filler, a spraying assembly located above or on the side of the filler, an air outlet located on one side of the filler, an air extraction assembly located at the air outlet, a fresh air inlet located on the other side of the filler, and a liquid collection assembly located below the filler; wherein the spraying assembly is connected with the ninth pipeline, and the first working medium in the first working medium channel enters the spraying assembly through the ninth pipeline and is sprayed onto the filler under the action of the spraying assembly; under the action of the air extraction assembly, the external air reaches the filler through the fresh air inlet and passes through the filler to absorb the heat of the first working medium on the filler; wherein the air outlet is configured to discharge the air absorbing the heat of the first working medium on the filler to the outside; the liquid collection assembly is connected with the tenth pipeline, and the first working medium on the filler falls into the liquid collection assembly and then reenters the first liquid working medium source through the tenth pipeline.

[0020] In this implementation, the first cold source can achieve a better cooling effect, and the heat absorbed by the working medium can be discharged to the outside, achieving the final discharge of heat.

[0021] In a possible implementation, the outlet of the first working medium channel is connected to the second cold source through an eleventh pipeline, and the first liquid working medium source is connected to the second cold source through a twelfth pipeline; wherein a part of the first working medium in the first working medium channel enters the second cold source through the eleventh pipeline, and after being cooled by the second cold source, enters the first liquid working medium source again through the twelfth pipeline; another part of the first working medium in the first working medium channel enters the first cold source through the ninth pipeline, and after being cooled by the first cold source, enters the first liquid working medium source again through the tenth pipeline.

[0022] In this implementation, an additional cold source can also be provided for the cooling device, so that in the case that the cold source carried by the cooling device itself cannot meet the heat dissipation demand of the machine room, the cooling capacity of the cooling device is improved through the additional cold source to meet the heat dissipation demand of the machine room.

[0023] In a possible implementation, the air-cooled part further comprises a ventilation valve arranged at the junction of the cooling device and the machine room, wherein the ventilation valve is in communication with the air outlet of the fresh air channel, and when the ventilation valve is in an open state, fresh air enters the interior of the machine room through the fresh air channel and the ventilation valve.

[0024] In this implementation, whether fresh air flows into the machine room can be controlled through the ventilation valve, so that when the outside temperature is high, the fresh air with high temperature can be prevented from flowing into the machine room.

[0025] In a second aspect, a data center is provided, comprising at least one machine room and at least one cooling device provided in the first aspect, wherein the machine room comprises at least one computing device, and the at least one computing device is connected to the at least one cooling device through the liquid cooling assembly.

[0026] In a possible implementation, the at least one machine room is a plurality of machine rooms arranged from top to bottom, and the at least one cooling device is a plurality of cooling devices, wherein each machine room of the plurality of machine rooms corresponds to at least one of the plurality of cooling devices, the cooling device corresponding to the machine room is arranged at the side of the machine room, and the computing device in the machine room is connected to the cooling device corresponding to the machine room through the liquid cooling assembly.

[0027] The beneficial effects of the second aspect can refer to the beneficial effects of the first aspect described above, and will not be described here again. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 FIG. 1 is a schematic diagram of a data center structure;

[0029] Figure 2 A structural diagram of a data center provided by an embodiment of the present application;

[0030] Figure 3 A structural diagram of a cooling device provided by an embodiment of the present application;

[0031] Figure 4 A structural diagram of a cooling device provided by an embodiment of the present application;

[0032] Figure 5 A structural diagram of a cooling device provided by an embodiment of the present application;

[0033] Figure 6 A structural diagram of a cooling device provided by an embodiment of the present application;

[0034] Figure 7 A structural diagram of a cooling device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0035] The schemes provided by the embodiments of the present application will be described below with reference to the drawings. In the embodiments of the present application, “multiple” refers to two or more than two, and “multiple types” refers to two or more than two types. “First”, “second”, and the like are only used to distinguish similar objects, and do not necessarily describe a specific order or number of objects.

[0036] In order to facilitate understanding of the schemes provided by the embodiments of the present application, the technical terms that may be involved in the embodiments of the present application are introduced first.

[0037] Data center (DC): also known as physical data center, usually composed of multiple layers of computer rooms.

[0038] Computer room: a space for deploying computing devices. In order to ensure the normal operation of the computing devices, the computer room has certain requirements for the physical environment (such as temperature, power supply, floor, fire protection system, etc.). Among them, the computing devices deployed in the computer room are usually servers.

[0039] Working substance: also known as heat transfer medium, a medium for realizing heat transfer. Common working substances include water, freon, etc.

[0040] Working substance channel: a channel for the flow of working substance in a heat exchanger, etc. Among them, the working substance channel in the heat exchanger is usually a coil pipe.

[0041] Power device: refers to a device in a computing device that needs to be cooled. Common power devices include processors, memories, etc. Among them, the processor can be a central processing unit (CPU), a graphics processing unit (GPU), etc. The memory can be a memory.

[0042] Inlet port: is one end port of a pipeline, specifically the port into the pipeline, i.e. the port through which the fluid (such as liquid or gas) enters the pipeline.

[0043] Outlet port: is one end port of a pipeline, specifically the port out of the pipeline, i.e. the port through which the fluid in the pipeline leaves the pipeline.

[0044] There are mainly two kinds of cooling devices for cooling computing devices in a machine room, namely liquid cooling devices and air cooling devices. Common liquid cooling devices include coolant distribution units (CDUs), CDU required cold sources, etc. Common air cooling devices include air handling units (AHUs), etc. Liquid cooling devices are used to deliver coolant to liquid cooling components in computing devices, and the coolant in the liquid cooling components absorbs the heat generated by the power devices such as processors and memories in the computing devices to cool the power devices. Air cooling devices are used to output cool air to the machine room to achieve heat dissipation of the power devices through indirect heat exchange between air and air.

[0045] In related technologies, as shown in Figure 1 , the data center is a multi-story building, each floor of which is used as a machine room, and the CDU required cold source is deployed on the roof, and the AHU is deployed on the side of the machine room. In order to meet the needs of cloud computing and other technologies, the number and power of computing devices in the machine room are increasing, resulting in an increasing demand for coolant. The roof space is relatively limited and shared by each floor of the machine room in the data center, making it difficult to deploy a CDU required cold source that can meet the demand.

[0046] In addition, as shown in Figure 1 , in order to achieve the average distribution of coolant in multiple machine rooms, a CDU is provided in each machine room. The CDU required cold source supplies coolant to the computing devices in each machine room through the CDU, resulting in a long working fluid circuit and affecting the cooling effect.

[0047] And the air cooling device deployed on the side of the machine room can only deliver cool air to the machine room, i.e. only indirect heat exchange between air and air can be achieved. The heat exchange capacity of air and air is weak, and it is difficult to meet the cooling demand of the computing device.

[0048] Therefore, the embodiments of the present application provide a cooling device 100 and a data center. The data center includes multiple machine rooms 200, and one or more cooling devices 100 are deployed in each machine room 200.

[0049] In some embodiments, the cooling device 100 can be deployed on the top of the machine room 200 or on the top of the data center.

[0050] In some embodiments, as shown in FIG. 1, the multiple machine rooms 200 are arranged in sequence from bottom to top. For example, the main structure of the data center is a multi-story building, and each floor is used as a machine room 200. In this embodiment, the cooling device 100 can be deployed on the side of the machine room. Figure 2

[0051] The machine room 200 is deployed with multiple computing devices 210. The computing device 210 is a physical computing device, such as a server. In some embodiments, multiple racks are deployed in the machine room 200, and each rack is used to deploy one or more computing devices in the multiple computing devices 210. As shown in FIG. 2, the computing device 210 has a liquid cooling assembly 211. The liquid cooling assembly 211, also known as a liquid cooling loop, has a liquid cooling working medium that can absorb the heat emitted by the power devices of the computing device 210. In some embodiments, the liquid cooling assembly 211 can be a liquid cooling plate. Figure 3

[0052] Each machine room 200 corresponds to at least one of the multiple cooling devices 100, and different machine rooms 200 correspond to different cooling devices 100. In some embodiments, as shown in FIG. 1, the cooling device 100 corresponding to the machine room 200 is deployed on the side of the machine room 200, so that each machine room 200 and the cooling device 100 can be arranged nearby, and do not need to occupy the roof space of the data center. Moreover, unlike the roof space of the data center, the side space of the machine room 200 is exclusively occupied by the machine room 200, and is not shared by multiple machine rooms 200. Each machine room 200 has side space that can be used to deploy the cooling device 100 corresponding to the machine room 200. Therefore, no matter how many floors of machine rooms there are in the data center, there is enough space to deploy the cooling device 100. Figure 2

[0053] The cooling device 100 corresponding to the machine room 200 is used to cool the computing device 210 in the machine room 200. The cooling device 100 can deliver cooling liquid to the liquid cooling assembly of the computing device 210 in the machine room 200, the liquid cooling assembly of the computing device 210 receives the working medium delivered by the cooling device 100, and absorbs the heat emitted by the computing device 210 using the liquid working medium, thereby cooling the computing device 210.

[0054] ​​​The above example introduces the relationship between the cooling device 100 and the computer room 200 in the data center. Next, the example introduces the structure and function of the cooling device 100.

[0055] Referring to Figure 3 , the cooling device 100 includes a liquid working medium source 111, a heat exchanger 120A, a primary working medium assembly, and a secondary working medium assembly. Among them, the liquid working medium source 111, the heat exchanger 120A, the primary working medium assembly, and the secondary working medium assembly belong to the liquid cooling part of the cooling device 100. Through the liquid working medium source 111, the heat exchanger 120A, the primary working medium assembly, and the secondary working medium assembly, the cooling device 100 can deliver low-temperature working medium A1 to the corresponding computer room 200. The computer equipment 210 can be used to liquid cooling heat dissipation of the computer equipment 210. Among them, the working medium A1 can be a liquid working medium, such as water, etc.

[0056] The liquid working medium source 111 contains the working medium A1. Among them, the working medium A1 in the liquid working medium source 111 is a low-temperature working medium A1, which is used to absorb heat in the heat exchange process. The working medium A1 in the liquid working medium source 111 can also be called a cooling working medium A1. In some embodiments, the liquid working medium source 111 can be a water collecting tray.

[0057] The heat exchanger 120A is used to realize the heat exchange between the working medium A1 and the working medium A2. The heat exchanger 120A can be a liquid-liquid plate heat exchanger, for example. As Figure 3 shown, the heat exchanger 120A includes a working medium channel 121 and a working medium channel 122. Among them, the working medium A2 in the working medium channel 122 dissipates heat, and the working medium A1 in the working medium channel 121 is used to absorb the heat dissipated by the working medium A2 in the working medium channel 122. Among them, the working medium A1 and the working medium A2 can be the same or different. For example, the working medium A2 can be water or freon.

[0058] The primary working medium assembly can also be called the first working medium assembly, which includes a pipeline 131 and a pump 141. As Figure 3 shown, the inlet port of the pipeline 131 is connected with the outlet of the liquid working medium source 111, so that the working medium A1 in the liquid working medium source 111 can enter the pipeline 131. The outlet port of the pipeline 131 is connected with the working medium channel 121, so that the working medium A1 in the pipeline 131 can enter the working medium channel 121.

[0059] When the cooling device 100 works, the pump 141 can be started. Under the action of the pump 141, the working medium A1 in the liquid working medium source 111 enters the pipeline 131 through the inlet port of the pipeline 131, and after being transmitted through the pipeline 131, enters the working medium channel 121 through the outlet port of the pipeline 131 and the inlet of the working medium channel 121.

[0060] In some embodiments, the pump 141 can be a centrifugal pump. In some embodiments, the pump 141 is disposed on the pipe 131.

[0061] The secondary-side working medium assembly, which can also be referred to as a second working medium assembly, includes the pipe 132, the pipe 133, and the pump 142. The inlet port of the pipe 132 is connected to the outlet of the working medium channel 122, so that the working medium A2 in the working medium channel 122 can enter the pipe 132. The outlet port of the pipe 132 is connected to the inlet of the liquid cooling assembly 211, so that the working medium A2 in the pipe 132 can enter the liquid cooling assembly 211. The inlet port of the pipe 133 is connected to the outlet of the liquid cooling assembly 211, so that the working medium A2 in the liquid cooling assembly 211 can enter the pipe 133. The outlet port of the pipe 133 is connected to the inlet of the working medium channel 122, so that the working medium A2 in the pipe 133 can enter the working medium channel 122. In this way, the pipe 132, the liquid cooling assembly 211, the pipe 133, and the working medium channel 122 form a loop of the working medium A2.

[0062] When the cooling device 100 is in operation, the pump 142 can be turned on. Under the action of the pump 142, the working medium A2 in the liquid cooling assembly 211 enters the working medium channel 122 through the pipe 133, and enters the liquid cooling assembly 211 again through the working medium channel 122 and the pipe 132.

[0063] In the cooling device 100, the working medium A2 in the liquid cooling assembly 211 absorbs the heat emitted by the power devices of the computing device 210, and becomes a high-temperature working medium. The high-temperature working medium enters the working medium channel 122 through the pipe 133, and emits heat to the working medium A1 in the working medium channel 121. The working medium A1 in the working medium channel 121 absorbs the heat emitted by the working medium A2 in the working medium channel 122, so that the working medium A2 in the working medium channel 122 becomes a low-temperature working medium A2. The low-temperature working medium A2 enters the liquid cooling assembly 211 again through the pipe 132, and can again absorb the heat emitted by the power devices of the computing device 210. In this way, the cooling or heat dissipation of the computing device 210 is achieved.

[0064] In some embodiments, the pump 142 can be a centrifugal pump. In some embodiments, the pump 142 is disposed on the pipe 132. In some embodiments, the pump 142 is disposed on the pipe 133.

[0065] The cooling device 100 can include a fresh air assembly, so that the cooling device 100 can provide fresh air in addition to the cooling liquid and the cold air. The fresh air assembly belongs to the air cooling part of the cooling device 100, and is isolated from the liquid cooling part described above, so that the fresh air passing through the fresh air assembly is not affected by the liquid cooling part, i.e., the liquid cooling part does not raise or lower the fresh air in the fresh air assembly. Fresh air refers to outside air or outside air after treatment. Figure 3As shown, the fresh air assembly of the cooling device 100 may include a fresh air duct 171. The fresh air duct 171 is connected to the computer room 200, and fresh air can enter the computer room 200 through the fresh air duct 171. Thus, the fresh air assembly can provide fresh air to the computer room 200.

[0066] like Figure 3 As shown, the fresh air assembly can specifically consist of a fresh air duct 171 and a ventilation valve 172. The air inlet of the fresh air duct 171 is connected to the outside air, and the air outlet of the fresh air duct 171 is connected to the ventilation valve 172. The ventilation valve 172 is located at the junction of the cooling equipment 100 and the machine room 200. When the ventilation valve 172 is open, the air outlet of the fresh air duct 171 is connected to the air inside the machine room 200, allowing outside air (i.e., fresh air) to enter the machine room 200 through the fresh air duct 171 and the ventilation valve 172.

[0067] In one example, outside air can be processed in the fresh air duct 171, and the processed outside air flows into the computer room 200 as fresh air. In one example, the processing of outside air can include filtration, drying, humidification, cooling, etc.

[0068] Continue reading Figure 3 The computer room 200 is also equipped with an exhaust valve 173. The exhaust valve 173 is located at the interface between the computer room 200 and the outside air. When the exhaust valve 173 is open, the air inside the computer room 200 can be discharged into the outside air. In this way, the exchange of indoor and outdoor air in the computer room 200 can be achieved through the fresh air assembly and the exhaust valve 173.

[0069] Emergency ventilation can be achieved through the fresh air assembly. When the liquid-cooled components (e.g., pump 142) and / or the air-cooled components (e.g., pump 143) in the cooling equipment 100 fail, the ventilation valve 172 and the exhaust valve 173 are opened to allow outside air to enter the computer room 200 and to allow the air in the computer room 200 to be exhausted to the outside.

[0070] In some embodiments, such as Figure 3 As shown, the cooling device 100 also includes a heat exchanger 120B and an air-cooling assembly. Furthermore, an evaporator 220 is installed within the computer room 200. Through the heat exchanger 120B, the air-cooling assembly, and the evaporator 220, the cooling device 100 can provide cool air to the corresponding computer room 200 to dissipate heat from the computing equipment within the computer room 200. Details are as follows.

[0071] like Figure 3As shown, the heat exchanger 120B includes a working medium passage 123 and a working medium passage 124. The inlet of the working medium passage 123 and the outlet port of the pipeline 132 are connected, so that the working medium A2 in the working medium passage 122 enters the working medium passage 123 through the pipeline 132. The outlet of the working medium passage 123 and the inlet end of the pipeline 133 are connected, so that the working medium A2 in the working medium passage 123 can enter the pipeline 133 and then enter the working medium passage 122.

[0072] The air cooling assembly includes a pipeline 134, a pipeline 135 and a pump 143. The inlet port of the pipeline 134 and the outlet of the air evaporator 220 in the machine room 200 are connected, and the outlet port of the pipeline 134 and the inlet of the working medium passage 124 are connected, so that the working medium in the air evaporator 220 which absorbs the heat in the machine room 200 can enter the working medium passage 124 through the pipeline 134. The inlet port of the pipeline 135 and the outlet of the working medium passage 124 are connected, and the outlet port of the pipeline 135 and the inlet of the air evaporator 220 are connected, so that the working medium in the working medium passage 124 which has been heat exchanged can enter the air evaporator 220 again through the pipeline 135.

[0073] When the cooling device 100 works, the pump 143 is started. Under the action of the pump 143, the working medium in the air evaporator 220 which absorbs the heat in the machine room 200 enters the working medium passage 124 through the pipeline 134. The working medium in the working medium passage 124 releases heat, and the working medium A2 in the working medium passage 123 absorbs the heat released by the working medium in the working medium passage 124, so that the high-temperature working medium in the working medium passage 124 becomes low-temperature working medium, and the low-temperature working medium enters the air evaporator again through the pipeline 135.

[0074] In one example of the embodiment, the working medium in the air evaporator 220 is variable-phase working medium, such as Freon. In one example of the embodiment, the pump 143 is a centrifugal pump. In one example of the embodiment, the pump 143 is arranged on the pipeline 135. In one example of the embodiment, the pump 143 is arranged on the pipeline 134.

[0075] The inlet of the working medium passage 123 and the inlet of the liquid cooling assembly 211 are both connected to the outlet port of the pipeline 132, that is, the working medium A2 in the pipeline 132 is divided into the working medium passage 123 and the liquid cooling assembly 211. If more working medium A2 is sent to the working medium passage 123, the air cooling assembly can provide cooler air to the machine room 200. Correspondingly, the liquid cooling assembly 211 can not get enough working medium A2, which affects the liquid cooling effect. If more working medium A2 is sent to the liquid cooling assembly 211, the liquid cooling assembly 211 can get enough working medium A2, which can produce better liquid cooling effect. Correspondingly, the temperature of the air provided by the air cooling assembly to the machine room 200 can be too high, which affects the air cooling effect.

[0076] In one example of this embodiment, such as Figure 3 As shown, to achieve different liquid cooling or air cooling effects, a regulating valve 161 can be installed at the outlet of pipe 132. The regulating valve 161 can adjust the ratio between the working fluid A2 supplied to the liquid cooling assembly and the working fluid A2 supplied to the working fluid channel 123. When liquid cooling is required, the regulating valve 161 controls the pipe 132 to supply more working fluid A2 to the liquid cooling assembly 211. When air cooling is required, the regulating valve 161 controls the pipe 132 to supply more working fluid A2 to the working fluid channel 123.

[0077] In one example of this embodiment, such as Figure 3 As shown, the air-cooled assembly also includes a compressor 151. The compressor 151 can convert the heat carried by the phase change working fluid in the pipeline 134 into mechanical energy, so as to further promote the heat dissipation of the working fluid, reduce the working fluid temperature, and thus provide the air evaporator 220 with a lower temperature working fluid.

[0078] In some embodiments, such as Figure 3 As shown, the cooling device 100 also includes a cold source 180A. The cold source 180A is used to cool the working medium A1 output from the working medium channel 121 and to transport the cooled working medium A1 to the liquid working medium source 111. Specifically, the outlet of the working medium channel 121 is connected to the inlet of the cold source 180A via a pipe 139, allowing the working medium A1 in the working medium channel 121 to enter the cold source 180A through the pipe 139 for cooling. The outlet of the cold source 180A is connected to the inlet of the liquid working medium source 111 via a pipe 1310, allowing the cooled working medium A1 to enter the liquid working medium source 111 through the pipe 1310.

[0079] In one example of this embodiment, the cold source 180A can be a cold tower, such as an open-type cold tower or a closed-type cold tower. In another example of this embodiment, the cold source 180A can be a dry cooler.

[0080] In another example of this embodiment, the cold source 180A can cool the working fluid A1 through gas-liquid heat conversion. For example... Figure 4 As shown, the cold source 180A includes a packing material 181, a spray assembly 182, a gas outlet 183, an exhaust assembly 184, a fresh air inlet 185, and a liquid collection assembly 186.

[0081] The filler 181 is used to increase the gas-liquid contact area so that the gas can fully absorb the heat from the liquid. For example, the filler 181 can be wood, asbestos cement, cement mesh, plastic, fiberglass, ceramics, etc.

[0082] The spray assembly 182 includes a plurality of spray heads connected to the outlet end of the pipe 139 so as to receive the working medium A1 in the pipe 139 and spray the working medium A1 to the packing 181. In one example, as shown in Figure 4 FIG. 2, the spray assembly 182 is located above the packing 181. In this example, the working medium A1 sprayed by the spray assembly 182 can flow through the packing 181 from top to bottom under the action of gravity. In one example, the spray assembly 182 can be on the side of the packing 181, such as the left side, the right side, the front side, the back side, or the periphery, etc. In this example, the working medium A1 sprayed by the spray assembly 182 can flow through the packing 181 in a horizontal or nearly horizontal direction under the action of inertia.

[0083] The gas outlet 183 and the fresh air inlet 185 are both passages between the inside of the cooling device 100 and the outside. The gas outlet 183 and the fresh air inlet 185 are arranged on the two sides of the packing 181, respectively. For example, the gas outlet 183 is arranged above the packing 181, and the fresh air inlet 185 is arranged below the packing 181. For another example, the gas outlet 183 is arranged on the left side of the packing 181, and the fresh air inlet 185 is arranged on the right side of the packing 181. And so on, which will not be listed one by one here.

[0084] As shown in Figure 4 , the gas outlet 183 is provided with an air extraction assembly 184. The air extraction assembly 184 and the gas outlet 183 are located on the same side of the packing 181. Under the action of the air extraction assembly 184, the outside air entering the cooling device 100 through the fresh air inlet 185 flows through the packing 181 and is then discharged to the outside through the gas outlet 183. In this process, the air flowing through the packing 181 promotes the evaporation of the working medium A1 on the packing 181, thereby discharging heat to the gas. That is, the air passing through the packing 181 contains high-temperature gaseous working medium, so that the high-temperature gaseous working medium is discharged to the outside, and thus the heat emitted by the power device of the computing device 210 is discharged to the outside.

[0085] The working medium A1 on the packing 181 is changed into the cooling working medium A1 by evaporation or the like. The liquid collection assembly 186 located below the packing 181 collects the cooling working medium A1. The liquid collection assembly 186 is connected to the inlet port of the pipe 1310, so that the cooling working medium A1 collected by the liquid collection assembly 186 can enter the liquid working medium source 111 through the pipe 1310.

[0086] The above examples introduce the use of the cooling device 100 to use the same liquid working medium source to perform liquid cooling and air cooling on the computing device 210. In another example, the cooling device 100 can also use different liquid working medium sources to perform liquid cooling and air cooling on the computing device 210. Next, the use of different liquid working medium sources will be introduced in combination with Figure 5 .

[0087] As shown in Figure 5 , the cooling device 100 further includes a liquid working medium source 112, a pipeline 136, and a pump 144. The liquid working medium source 112, the pipeline 136, the pump 144, and the air-cooling assembly described above form an air-cooling part of the cooling device 100, which is isolated from the liquid-cooling part of the cooling device 100. The inlet port of the pipeline 136 is connected to the liquid working medium source 112, and the outlet port of the pipeline 136 is connected to the inlet of the working medium channel 123 of the heat exchanger 120B. When the cooling device 100 is in operation, the pump 144 can be turned on. Under the action of the pump 144, the working medium A3 in the liquid working medium source 112 enters the pipeline 136 through the inlet port of the pipeline 136, and then enters the working medium channel 123 through the outlet port of the pipeline 136 and the inlet of the working medium channel 123 after being transported through the pipeline 136. The working medium A3 in the working medium channel 123 absorbs the heat emitted by the working medium in the working medium channel 124 of the heat exchanger 120B, so that the high-temperature working medium in the working medium channel 124 becomes a low-temperature working medium, which then enters the air evaporator 220 through the pipeline 135, thereby providing cool air for the computer room 200 and achieving air cooling of the computer room 200.

[0088] The implementation of the liquid working medium source 112 can refer to the description of the liquid working medium source 111 above, and the pump 144 can refer to the description of the pump 141 above. In some embodiments, the pump 144 is arranged on the pipeline 136.

[0089] In some embodiments, as shown in Figure 5 , the cooling device 100 further includes a cold source 180B. The cold source 180B is used to cool the working medium A3 flowing out of the working medium channel 123. The inlet of the cold source 180B is connected to the outlet of the working medium channel 123 through a pipeline 137, so that the working medium A3 in the working medium channel 130 can enter the cold source 180B through the pipeline 137. The outlet of the cold source 180B is connected to the inlet of the liquid working medium source 112 through a pipeline 138. Thus, the working medium A3 cooled by the cold source 180B can enter the liquid working medium source 112 through the pipeline 138.

[0090] The implementation of the cold source 180B can refer to the description of the cold source 180A above, which will not be described here.

[0091] In some embodiments, the data center can further include one or more cold sources 180C. The cold source 180C is arranged outside the cooling device 100. In one example, as shown in Figure 6 , the cold source 180C is arranged on the roof of the data center to make full use of the space around the data center, and the cold source 180C is arranged near the cooling device 100. In another example, the cold source 180C can also be arranged around the data center, such as on the empty land around the data center.

[0092] The cold source 180C can be used to cool the liquid working medium in the cooling device 100, such as the working medium A1 or the working medium A3. In one example, the same cold source 180C can be used to cool the liquid working medium in the cooling devices 100 corresponding to multiple machine rooms 200. In another example, one cold source 180C corresponds to one machine room 200, and one machine room 200 can correspond to at least one cold source 180C. The cold source 180C corresponding to the machine room 200 is only used to cool the liquid working medium in the cooling device 100 corresponding to the machine room 200.

[0093] In one example, the cold source 180C is used to cool the working medium A1 of the liquid working medium source 111. As shown in FIG. 13, the cold source 180C is connected to the outlet of the working medium passage 121 through the pipe 1311, and the cold source 180C is connected to the inlet of the liquid working medium source 111 through the pipe 1312. In one example, the pipe 1311 is connected to the outlet of the working medium passage 121 through the pipe 139. Specifically, the inlet port of the pipe 1311 is connected to the outlet port of the pipe 139, and the outlet port of the pipe 139 is connected to the working medium passage 121, so that the inlet port of the pipe 1311 is connected to the outlet of the working medium passage 121. The outlet port of the pipe 1311 is connected to the inlet of the cold source 180C. Thus, a part of the working medium A1 in the working medium passage 121 can enter the cold source 180C through the pipe 1311, so that the cold source 180C cools the part of the working medium A1. The working medium A1 cooled by the cold source 180C enters the liquid working medium source 111 through the pipe 1312. Another part of the working medium A1 in the working medium passage 121 enters the cold source 180A through the pipe 139, so that the cold source 180A cools the part of the working medium A1. The working medium A1 cooled by the cold source 180A enters the liquid working medium source 111 through the pipe 1310. Figure 6 In this way, the cold source 180C and the cold source 180A can be used to cool the liquid working medium in the cooling device 100, which improves the cooling effect of the liquid working medium, and further improves the cooling effect of the cooling device 100 on the computing device 310.

[0094] In some embodiments, the data center can also include one or more external cold sources. The external cold source can provide additional low-temperature working medium for the heat exchanger 120A, which can also be used to absorb the heat of the working medium A2 in the working medium passage 122, thereby improving the cooling effect of the working medium A2 in the working medium passage 122. For example, the external cold source can be arranged on the roof of the data center or around the data center.

[0095] Through the above structure, the cooling device 100 can have the following three working modes.

[0096]

[0097] ​Fresh air mode: Open ventilation valve 172 and exhaust valve 173, and turn off pump 143 or stop supplying working fluid to evaporator 220. In fresh air mode, outside air enters the computer room 200, and the air in the computer room 200 is exhausted to the outside, realizing the exchange of indoor and outdoor air in the computer room 200.

[0098] Full return air mode: Close ventilation valve 172, start pump 143, and provide working fluid to evaporator 220. In full return air mode, cooling equipment 100 provides cool air to computer room 200.

[0099] Mixed air mode: Ventilation valve 172 and exhaust valve 173 are opened, pump 143 is started, and working fluid is provided to the air evaporator 220. In mixed air mode, cool air can be provided to the computer room 200, and air exchange between the indoor and outdoor air in the computer room 200 can be realized.

[0100] In some embodiments, such as Figure 7 As shown, a waste heat recovery device 190 is installed on the pipeline 133. Under the action of the waste heat recovery device 190, the working fluid A2 in the pipeline 133 can perform work or dissipate heat to reduce the heat of the working fluid A2. In one example, the waste heat recovery device 190 can be an adsorption refrigeration device.

[0101] In summary, the cooling equipment provided in this application embodiment can simultaneously provide coolant and fresh air, meeting the coolant and fresh air requirements of a computer room within a relatively limited space. Furthermore, the liquid-cooled portion providing coolant and the air-cooled portion providing fresh air are isolated from each other, ensuring that the liquid-cooled portion does not affect the fresh air; that is, the temperature of the fresh air does not increase due to the liquid-cooled portion, thereby improving the cooling effect of the fresh air.

[0102] In addition, this cooling device can directly deliver coolant to the liquid cooling components in the computing device without going through the CDU, reducing the number of heat exchange stages, improving cooling efficiency, and facilitating the application of low case temperature processors in the future.

[0103] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of this application.

Claims

1. A cooling device, characterized in that, The cooling device is used to cool computing devices in a computer room; wherein the computing devices are connected to the cooling device via liquid cooling components; wherein the cooling device includes: The liquid cooling section includes: a first liquid working fluid source, a first heat exchanger, and a second working fluid assembly, wherein... The first liquid working fluid source is used to contain the first working fluid; The first heat exchanger includes a first working fluid channel and a second working fluid channel; The first working fluid assembly includes a first pipeline and a first pump; wherein the inlet port of the first pipeline is connected to the first liquid working fluid source, and the outlet port of the first pipeline is connected to the inlet of the first working fluid channel; under the action of the first pump, the first working fluid in the first liquid working fluid source enters the first pipeline and enters the first working fluid channel through the first pipeline; The second working fluid assembly includes a second pipeline, a third pipeline, and a second pump. The inlet of the second pipeline is connected to the outlet of the second working fluid channel, and the outlet of the second pipeline is connected to the inlet of the liquid cooling assembly. The outlet of the third pipeline is connected to the inlet of the second working fluid channel, and the inlet of the third pipeline is connected to the outlet of the liquid cooling assembly. Under the action of the second pump, the second working fluid in the liquid cooling assembly enters the second working fluid channel through the third pipeline, and then re-enters the liquid cooling assembly through the second working fluid channel and the second pipeline. The second working fluid in the liquid cooling assembly is used to absorb the heat emitted by the computing device, and the first working fluid in the first working fluid channel is used to absorb the heat emitted by the second working fluid in the second working fluid channel. The air-cooled section includes a fresh air duct connected to the computer room, through which fresh air enters the computer room. The air-cooled components are isolated from the liquid-cooled section.

2. The cooling device according to claim 1, characterized in that, The cooling device also includes: The second heat exchanger includes a third working fluid channel and a fourth working fluid channel; wherein the inlet of the third working fluid channel is connected to the outlet of the second pipeline, and the outlet of the third working fluid channel is connected to the inlet of the third pipeline, so that the second working fluid in the second working fluid channel enters the third working fluid channel through the second pipeline, and then re-enters the second working fluid channel through the third working fluid channel and the third pipeline. The first air-cooled assembly includes a fourth pipe, a fifth pipe, and a third pump. The inlet of the fourth pipe is connected to the outlet of the air evaporator in the machine room, and the outlet of the fourth pipe is connected to the inlet of the fourth working fluid channel. The inlet of the fifth pipe is connected to the outlet of the fourth working fluid channel, and the outlet of the fifth pipe is connected to the inlet of the air evaporator. Under the action of the third pump, the working fluid in the air evaporator enters the fourth working fluid channel through the fourth pipe, and then re-enters the air evaporator through the fourth working fluid channel and the fifth pipe. The second working fluid in the third working fluid channel is used to absorb the heat emitted by the working fluid in the fourth working fluid channel.

3. The cooling device according to claim 2, characterized in that, A regulating valve is provided at the outlet of the second pipeline. The regulating valve is used to adjust the ratio between the second working fluid supplied to the liquid cooling assembly and the second working fluid supplied to the third working fluid channel.

4. The cooling device according to claim 1, characterized in that, The air-cooling section also includes: The second liquid working fluid source is used to contain the third working fluid; The third heat exchanger includes the fifth and sixth working fluid channels; The third working fluid assembly includes a sixth pipeline and a fourth pump; wherein, the inlet port of the sixth pipeline is connected to the second liquid working fluid source, and the outlet port of the sixth pipeline is connected to the inlet of the fifth working fluid channel; under the action of the fourth pump, the third working fluid in the second liquid working fluid source enters the sixth pipeline and then enters the fifth working fluid channel through the sixth pipeline; The second air-cooled assembly includes a seventh pipe, an eighth pipe, and a fifth pump. The inlet of the seventh pipe is connected to the outlet of the air evaporator in the machine room, and the outlet of the seventh pipe is connected to the inlet of the sixth working fluid channel. The inlet of the eighth pipe is connected to the outlet of the sixth working fluid channel, and the outlet of the eighth pipe is connected to the inlet of the air evaporator. Under the action of the fifth pump, the working fluid in the air evaporator enters the sixth working fluid channel through the seventh pipe, and then re-enters the air evaporator through the sixth working fluid channel and the eighth pipe. The fourth working medium in the fifth working medium channel is used to absorb the heat emitted by the working medium in the sixth working medium channel.

5. The cooling device according to any one of claims 1-4, characterized in that, The cooling device also includes: The first cold source is connected to the outlet of the first working fluid channel via the ninth pipeline and to the first liquid working fluid source via the tenth pipeline. The first working fluid in the first working fluid channel enters the first cold source through the ninth pipeline, and after being cooled by the first cold source, it re-enters the first liquid working fluid source through the tenth pipeline.

6. The cooling device according to claim 5, characterized in that, The first cold source includes: packing material, a spray assembly located above or to the side of the packing material, a gas outlet located on one side of the packing material, an exhaust assembly located at the gas outlet, a fresh air inlet located on the other side of the packing material, and a liquid collection assembly located below the packing material. The spraying assembly is connected to the ninth pipeline. The first working medium in the first working medium channel enters the spraying assembly through the ninth pipeline and is sprayed onto the filler under the action of the spraying assembly. Under the action of the exhaust assembly, outside air reaches and passes through the packing material through the fresh air inlet to absorb the heat of the first working medium on the packing material; wherein, the gas outlet is used to discharge the air that has absorbed the heat of the first working medium on the packing material to the outside. The liquid collection assembly is connected to the tenth pipeline. The first working fluid on the packing falls into the liquid collection assembly and then re-enters the first liquid working fluid source through the tenth pipeline.

7. The cooling device according to claim 5 or 6, characterized in that, The outlet of the first working fluid channel is connected to the eleventh pipeline and the second cold source, and the first liquid working fluid source is connected to the second cold source through the twelfth pipeline. Specifically, a portion of the first working fluid in the first working fluid channel enters the second cold source through the eleventh pipeline, and after being cooled by the second cold source, it re-enters the first liquid working fluid source through the twelfth pipeline; another portion of the first working fluid in the first working fluid channel enters the first cold source through the ninth pipeline, and after being cooled by the first cold source, it re-enters the first liquid working fluid source through the tenth pipeline.

8. The cooling device according to any one of claims 1-7, characterized in that, The air-cooling section also includes: A ventilation valve is installed at the junction of the cooling equipment and the computer room. The ventilation valve is connected to the air outlet of the fresh air duct. When the ventilation valve is open, fresh air enters the computer room through the fresh air duct and the ventilation valve.

9. A data center, characterized in that, It includes at least one computer room and at least one cooling device as described in any one of claims 1-8, wherein the computer room includes at least one computing device, the at least one computing device being connected to the at least one cooling device via a liquid cooling assembly.

10. The data center according to claim 9, characterized in that, The at least one computer room is a plurality of computer rooms arranged sequentially from top to bottom, and the at least one cooling device is a plurality of cooling devices. Each of the plurality of computer rooms corresponds to at least one of the plurality of cooling devices. The cooling device corresponding to the computer room is located on the side of the computer room, and the computing devices in the computer room are connected to the cooling device corresponding to the computer room through liquid cooling components.

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