Manufacturing method of packaging substrate and manufacturing method of LED chip packaging body

Abstract

The invention discloses a manufacturing method of a packaging substrate. The manufacturing method comprises the following steps: providing an initial substrate; the initial substrate is punched to form a plurality of substrate units and a support connected with the substrate units, the support comprises connecting arms connected with the adjacent substrate units, and each substrate unit comprises a front face, a back face and a side face; a first circuit layer and a second circuit layer are manufactured on the front face and the back face of the substrate unit respectively, the initial substrate is made to form a first substrate, and the first circuit layer and the second circuit layer both extend to the edge of the substrate unit; and manufacturing a third circuit layer connected with the first circuit layer and the second circuit layer on the side surface of the substrate unit to form the packaging substrate. According to the invention, a small-size substrate unit can also be punched in a mechanical punching mode, so that the cost is greatly saved and the efficiency is higher; when the back surface of the packaging substrate is welded, the third circuit layer can increase the welding area so as to improve the welding push-pull force, and the welding effect is good.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a method for manufacturing a packaging substrate and a method for manufacturing an LED chip package. Background Technology

[0002] The circuit board used in MIP-LED packages is typically a BT substrate or a glass substrate. Circuitry is achieved by drilling holes in the circuit board to connect the top and bottom surfaces. However, as package sizes decrease, the required hole size also needs to decrease. Mechanical drilling cannot meet these size requirements, while laser drilling is costly and inefficient. Therefore, there is an urgent need to improve the chip package manufacturing process to increase production efficiency, improve product quality, and reduce production costs. Summary of the Invention

[0003] The purpose of this invention is to provide a method for manufacturing a packaging substrate and a method for manufacturing an LED chip package, so as to improve the production efficiency of the chip package and reduce the production cost.

[0004] To achieve the above objectives, the present invention provides a method for manufacturing a packaging substrate, comprising the following steps: providing an initial substrate; drilling holes in the initial substrate to form a plurality of substrate units and a support connecting the plurality of substrate units, the support including a connecting arm connecting adjacent substrate units, each substrate unit including a front side, a back side, and a side side connecting the front side and the back side, the side side being exposed except for the area connected to the connecting arm; fabricating a first circuit layer and a second circuit layer corresponding to the first circuit layer on the front side and the back side of the substrate unit respectively, such that the initial substrate forms a first substrate, the first circuit layer and the second circuit layer both extending to the edge of the substrate unit; fabricating a third circuit layer connecting the first circuit layer and the second circuit layer on the side side of the substrate unit to form the packaging substrate.

[0005] Preferably, the support and the sides of the plurality of substrate units form a plurality of first through holes, and the step of forming a third circuit layer connecting the first circuit layer and the second circuit layer on the sides of the substrate units to form the packaging substrate includes: providing a mask plate having second through holes corresponding to the first through holes; stacking the mask plate on top of the first substrate such that the second through holes are aligned with the first through holes; and depositing conductive metal in the first through holes by a vapor deposition process to form the third circuit layer connecting the first circuit layer and the second circuit layer on the sides of the substrate units.

[0006] Preferably, the support and the sides of the plurality of substrate units form a plurality of first through holes, and the step of forming a third circuit layer connecting the first circuit layer and the second circuit layer on the sides of the substrate units to form the packaging substrate includes: providing a mask plate having second through holes corresponding to the first through holes; stacking the mask plate on top of the first substrate such that the second through holes are aligned with the first through holes; electroplating conductive metal on the side surfaces of the first circuit layer and the side surfaces of the second circuit layer by an electroplating process, wherein the conductive metal extends and covers the sides of the substrate units to form the third circuit layer connecting the first circuit layer and the second circuit layer.

[0007] Preferably, the first circuit layer includes a positive electrode pad and a negative electrode pad, and the second circuit layer includes a positive electrode connection pad corresponding to the positive electrode pad and a negative electrode connection pad corresponding to the negative electrode pad; there is one positive electrode pad and three negative electrode pads, and there is one positive electrode connection pad and three negative electrode connection pads; or, there are three positive electrode pads and one negative electrode pad, and there are three positive electrode connection pads and one negative electrode connection pad.

[0008] Preferably, the substrate unit is a rectangular planar structure, a circular planar structure, a circular cup shape, or a rectangular cup shape.

[0009] Preferably, the substrate units are arranged in a matrix, and the support and the sides of the substrate units form a plurality of first through holes, wherein the first through holes between the four substrate units forming the smallest rectangular unit are cross-shaped.

[0010] Preferably, after the step of forming a third circuit layer connecting the first circuit layer and the second circuit layer on the side of the substrate unit to form the packaging substrate, the method further includes: cutting the packaging substrate along the position between adjacent substrate units to form a separate mounting substrate.

[0011] The present invention also provides a method for manufacturing an LED chip package, comprising a package substrate obtained by the above-described method for manufacturing a package substrate, wherein the package substrate includes a first surface on which the front side of a substrate unit is located and a second surface opposite to the first surface, and the method for manufacturing the LED chip package includes the following steps: fixing LED chips on a first circuit layer of the substrate unit of the package substrate to form a plurality of LED chips on the package substrate; forming a package layer on the first surface that covers the plurality of LED chips and covers the first surface to form the LED chip package.

[0012] Preferably, the LED chip includes three sub-chips emitting different colors of light, and the first circuit layer includes a positive electrode pad and a negative electrode pad; there is one positive electrode pad and three negative electrode pads, and the negative electrodes of the three sub-chips are respectively connected to the three negative electrode pads one-to-one, and the positive electrodes of the three sub-chips are all connected to the positive electrode pads; or, there are three positive electrode pads and one negative electrode pad, and the positive electrodes of the three sub-chips are respectively connected to the three positive electrode pads one-to-one, and the negative electrodes of the three sub-chips are all connected to the negative electrode pads.

[0013] Preferably, after forming a plurality of LED chips and an encapsulation layer covering the first surface to form the LED chip package, the method further includes: cutting along the positions between substrate units on the LED chip package to form individual LED chip package units.

[0014] Compared with existing technologies, this invention first forms several substrate units by drilling holes in the initial substrate, exposing the sides of the substrate units. Then, the first circuit layer on the front, the second circuit layer on the back, and the third circuit layer on the side are fabricated on the substrate units. Since the substrate units are formed by drilling holes first, and electrical connections are achieved through the third circuit layer on the sidewalls, each substrate unit can share the drilled holes. The size of the holes can be relatively large, reducing the requirements for hole opening accuracy. This allows small-sized substrate units to be drilled using mechanical drilling, greatly saving costs and increasing efficiency. Moreover, when soldering the back of the packaging substrate, the third circuit layer on the side can be combined with the second circuit layer on the back to achieve the soldering of each sub-circuit layer in the second circuit layer. The increase in soldering area can improve the push-pull force of soldering, resulting in better soldering effect. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the initial substrate in an embodiment of the present invention.

[0016] Figure 2 This is a schematic diagram of the structure after drilling holes in the initial substrate to form a substrate unit, according to an embodiment of the present invention.

[0017] Figure 3 This is a schematic diagram of the structure after the first and second circuit layers are formed on the substrate unit according to an embodiment of the present invention.

[0018] Figure 4 This is a schematic diagram of the structure after the third circuit layer is formed on the substrate unit according to an embodiment of the present invention.

[0019] Figure 5 This is a schematic diagram of the structure for cutting the packaging substrate according to an embodiment of the present invention.

[0020] Figure 6This is a schematic diagram of the structure of cutting the packaging substrate to form a separate mounting substrate according to an embodiment of the present invention.

[0021] Figure 7 This is a schematic diagram of the structure after a third circuit layer is formed on a substrate unit in another embodiment of the present invention.

[0022] Figure 8 This is a schematic diagram of a circular substrate unit with a planar structure formed by drilling holes in an initial substrate, according to another embodiment of the present invention.

[0023] Figure 9 This is a schematic diagram of the structure after the LED chip is mounted on the packaging substrate in an embodiment of the present invention.

[0024] Figure 10 This is a schematic diagram of the structure of forming an LED chip package by fabricating a packaging layer on a packaging substrate in an embodiment of the present invention.

[0025] Figure 11 This is a schematic diagram of the LED chip package being cut in an embodiment of the present invention.

[0026] Figure 12 This is a schematic diagram of the structure of an LED chip packaging unit formed by cutting the LED chip package body in an embodiment of the present invention. Detailed Implementation

[0027] To illustrate the technical content, structural features, and effects of the present invention in detail, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0028] like Figures 1 to 12 As shown, an embodiment of the present invention provides a method for manufacturing a packaging substrate, comprising the following steps:

[0029] S1. Provide an initial substrate 10; specifically, such as Figure 1 As shown, the initial substrate 10 is an insulating bare board, and the initial substrate 10 is generally made of ceramic substrate or glass substrate.

[0030] S2. Drill holes in the initial substrate 10 to form a plurality of substrate units 1 and a support 2 connecting the plurality of substrate units 1. The support 2 includes connecting arms 21 connecting adjacent substrate units 1. Each substrate unit 1 includes a front side 101, a back side, and a side side 102 connecting the front side 101 and the back side. The side side 102 is exposed except for the area connected to the connecting arm 21; specifically, as shown in the example. Figure 2As shown, by drilling holes in the initial substrate 10 to form several substrate units 1 with the required structure and spacing, all substrate units 1 on the initial substrate 10 are interconnected by a support 2. The substrate units 1 are arranged in a matrix array on the initial substrate 10. Each substrate unit 1 can be a rectangular planar structure. Several first through holes 3 are formed between the support 2 and the side 102 of the substrate units 1. The first through holes 3 between the four substrate units 1 that form the smallest rectangular unit 10a are cross-shaped. Figure 2 As shown, the four substrate units 1 in the smallest rectangular unit 10a are the first substrate 20 unit 11, the second substrate unit 12, the third substrate unit 13, and the fourth substrate unit 14, which together form the first through hole 3. Additionally, the first through hole 3 located at the edge of the initial substrate 10 can also be T-shaped or L-shaped. Drilling can be done mechanically or with laser. While laser drilling offers higher precision and allows for smaller hole diameters, it is also more expensive. Compared to existing packaging substrates of similarly small size, this embodiment of the invention, due to the larger size of the first through hole 3, allows mechanical drilling to meet the precision requirements, significantly saving costs and increasing drilling efficiency. Of course, in some other embodiments of the invention, the substrate unit 1 can also be a circular structure with a planar structure, such as... Figure 8 As shown; the substrate unit 1a can also be in the shape of a circular cup or a rectangular cup, and the specific shape is not limited and can be selected according to actual needs.

[0031] S3. A first circuit layer 4 and a second circuit layer corresponding to the first circuit layer 4 are respectively fabricated on the front side 101 and the back side of the substrate unit 1, so that the initial substrate 10 forms the first substrate 20, and both the first circuit layer 4 and the second circuit layer extend to the edge of the substrate unit 1; specifically, as shown in the figure Figure 3 and combined Figure 9 As shown, the first circuit layer 4 extends to the edge of the front side 101 of the substrate unit 1, and the second circuit layer extends to the edge of the back side of the substrate unit 1 to facilitate connection and conduction with the third circuit layer 5 formed on the side side 102 of the substrate unit 1 in step S4. The first circuit layer 4 is used to connect the LED chip 7, and the second circuit layer is used to connect with external circuits. When the LED chip 7 includes three sub-chips emitting different colors of light, for example, when the LED chip 7 includes a red photonic chip 72, a green photonic chip 73, and a blue photonic chip 71, the first circuit layer 4 includes a positive electrode pad 44 and a negative electrode pad, and the second circuit layer includes a positive electrode connection pad corresponding to the positive electrode pad 44 and a negative electrode connection pad corresponding to the negative electrode pad. There is one positive electrode pad 44 and three negative electrode pads, and there is one positive electrode connection pad and three negative electrode connection pads. The negative electrodes of the three sub-chips are respectively mounted on different negative electrode pads, and the positive electrodes of the three sub-chips are all electrically connected to the positive electrode pad 44 to form a common anode structure. Figure 3 As shown, the negative electrode pads include a first negative electrode pad 41, a second negative electrode pad 42, and a third negative electrode pad 43. The first negative electrode pad 41, the second negative electrode pad 42, and the third negative electrode pad 43 occupy three corners of the substrate unit 1, respectively. The positive electrode pad 44 occupies the other corner. The negative electrode connection pads include the first negative electrode connection pad, the second negative electrode connection pad, and the third negative electrode connection pad. Of course, the specific shape design of the first circuit layer 4 and the second circuit layer can be determined according to the arrangement pattern of the three sub-chips. It should be noted that in some other embodiments of the present invention, three positive electrode pads 44 and one negative electrode pad can be set to form a common cathode structure. There are three positive electrode connection pads and one negative electrode connection pad. Correspondingly, the positive electrodes of the three sub-chips are respectively installed on three different positive electrode pads 44, and the negative electrodes of the three sub-chips are electrically connected to the negative electrode pads to form a common cathode structure. In some other embodiments of the present invention, there can also be one positive electrode pad and one negative electrode pad, and there can be one positive electrode connection pad and one negative electrode connection pad, that is, the case of only one chip being installed.

[0032] S4. A third circuit layer 5, connecting the first circuit layer 4 and the second circuit layer, is formed on the side 102 of the substrate unit 1 to form a package substrate 30. Specifically, as shown... Figure 4 As shown, the third circuit layer 5 enables the electrical conduction of the first circuit layer 4 and the second circuit layer to achieve electrical conduction between the LED chip 7 and the external circuit.

[0033] In this embodiment of the invention, the initial substrate 10 is first perforated to form several substrate units 1 and expose the side surface 102 of the substrate unit 1. Then, the first circuit layer 4 of the front side 101, the second circuit layer of the back side, and the third circuit layer 5 of the side surface 102 are fabricated on the substrate unit 1. Since the substrate unit 1 is formed by perforation first and the electrical connection is achieved through the third circuit layer 5 of the side wall, each substrate unit 1 can share the perforated hole. The size of the perforation can be relatively large, reducing the hole opening accuracy requirements. This allows small-sized substrate units 1 to be perforated by mechanical perforation, which greatly saves costs and is more efficient.

[0034] In this embodiment of the invention, a plurality of first through holes 3 are formed between the support 2 and the side surfaces 102 of a plurality of substrate units 1. Step S4, which involves forming a third circuit layer 5 on the side surfaces 102 of the substrate units 1 to connect the first circuit layer 4 and the second circuit layer to form a package substrate 30, includes:

[0035] S41. A mask plate is provided, and the mask plate is provided with a second through hole corresponding to the first through hole 3. The first through hole 3 and the second through hole have the same size. Specifically, in this embodiment of the invention, the first through hole 3 and the second through hole are set to have the same size. In some other embodiments, the size of the second through hole may also be smaller than the size of the first through hole 3. Any setting of the size of the second through hole that can electrically connect the first circuit layer 4 and the second circuit layer of each substrate unit 1 is acceptable.

[0036] S42. Stack the mask plate on top of the first substrate 20 and align the second through hole with the first through hole 3.

[0037] S43. Conductive metal is electroplated onto the side surfaces of the first circuit layer 4 and the second circuit layer using an electroplating process. The conductive metal extends and covers the side surface 102 of the substrate unit 1 to form a third circuit layer 5 connecting the first circuit layer 4 and the second circuit layer. Specifically, as shown... Figure 4 As shown, since the first and second circuit layers are metal and extend to the edge of the substrate unit 1, a third circuit layer 5 can be formed by electroplating metal on the side surfaces of the first and second circuit layers. The third circuit layer 5 includes a first sub-circuit layer 51 connecting the first negative electrode pad 41 and the first negative electrode connection pad, a second sub-circuit layer 52 connecting the second negative electrode pad 42 and the second negative electrode connection pad, a third sub-circuit layer 53 connecting the third negative electrode pad 43 and the third negative electrode connection pad, and a fourth sub-circuit layer 54 connecting the positive electrode pad 44 and the positive electrode connection pad. The first sub-circuit layer 51, the second sub-circuit layer 52, the third sub-circuit layer 53, and the fourth sub-circuit layer 54 each cover the corresponding corner of the substrate unit 1 to improve the connection effect between the third circuit layer 5 and the first and second circuit layers. In addition, there is a gap between adjacent third circuit layers 5. Therefore, since the side of the third circuit layer 5 is exposed, when soldering using the back of the packaging substrate 30, the packaging substrate 30 is generally soldered onto the circuit board. The third circuit layer 5 on the side can be combined with the second circuit layer on the back to achieve the soldering of each sub-circuit layer in the second circuit layer. Increasing the soldering area can improve the push-pull force of the soldering and result in a better soldering effect.

[0038] In this embodiment of the invention, in step S2, holes can be further drilled at the positions on the substrate unit 1 where the positive electrode pad 44 and the negative electrode pad are formed, and in step S3, a circuit layer is formed in the holes to increase the reliability of the electrical connection between the positive electrode pad 44 and the negative electrode pad.

[0039] In some other specific embodiments of the present invention, a plurality of first through holes 3 are formed between the support 2 and the side surfaces 102 of a plurality of substrate units 1. Step S4, which involves forming a third circuit layer 5 on the side surfaces 102 of the substrate units 1 to connect the first circuit layer 4 and the second circuit layer to form a package substrate 30, includes:

[0040] S401. A mask plate is provided, and the mask plate is provided with a second through hole corresponding to the first through hole 3; specifically, the first through hole 3 and the second through hole have the same size.

[0041] S402, stack the mask plate on top of the first substrate 20 and align the second through hole with the first through hole 3.

[0042] S403. Conductive metal is deposited in the first through-hole 3 using a vapor deposition process to form a third circuit layer 5 on the side 102 of the substrate unit 1, connecting the first circuit layer 4 and the second circuit layer. Specifically, as shown... Figure 2 , Figure 3 and Figure 7 As shown, the conductive metal filling the first through-hole 3 in the smallest rectangular unit 10a is the first conductive metal 6. The first conductive metal 6 is electrically connected to the third negative electrode pad 43 and the third negative electrode connection pad in the unit 11 of the first substrate 20. The first conductive metal 6 is also electrically connected to the second negative electrode pad 42 and the second negative electrode connection pad in the second substrate unit 12. The first conductive metal 6 is also electrically connected to the positive electrode pad 44 and the positive electrode connection pad in the third substrate unit 13. The first conductive metal 6 is also electrically connected to the first negative electrode pad 41 and the first negative electrode connection pad in the fourth substrate unit 14. Subsequently, it is only necessary to cut the conductive metal along the middle position of the adjacent substrate unit 1 to form separate third circuit layers 5. Therefore, the fabrication of all third circuit layers 5 can be completed by one conductive metal deposition, which is a very ingenious design.

[0043] In this embodiment of the invention, after step S4, which involves forming a third circuit layer 5 connecting the first circuit layer 4 and the second circuit layer on the side surface 102 of the substrate unit 1 to form a package substrate 30, the method further includes:

[0044] S5. Cut the encapsulation substrate 30 along the position between adjacent substrate units 1 to form a separate mounting substrate 100. Specifically, as shown... Figures 5 to 6As shown, the encapsulation substrate 30 is cut along lines b and c at the midpoint between adjacent substrate units 1 to form a separate mounting substrate 100, which can be used to independently mount LED chips 7. During the cutting process, the connecting arm 21 protruding from the third circuit layer 5 can also be cut off. In addition, since the side of the third circuit layer 5 of each mounting substrate 100 is exposed, when soldering using the back of the mounting substrate 100, the side of the third circuit layer 5 can be combined with the back of the second circuit layer to achieve the soldering of each sub-circuit layer in the second circuit layer. The increase in soldering area can improve the push-pull force of soldering and result in a better soldering effect.

[0045] This invention also discloses a method for manufacturing an LED chip package, including a package substrate 30 obtained by the above-described method for manufacturing a package substrate 30. The package substrate 30 includes a first surface 301 where the front surface 101 of the substrate unit 1 is located and a second surface opposite to the first surface 301. The method for manufacturing the LED chip package includes the following steps:

[0046] S10. LED chips 7 are fixed on the first circuit layer 4 of the substrate unit 1 of the packaging substrate 30 so that a plurality of LED chips 7 are formed on the packaging substrate 30; specifically, as shown in the figure Figure 9 As shown, the LED chip 7 includes three sub-chips emitting different colors of light. These three sub-chips can be designated as red sub-chip 72, green sub-chip 73, and blue sub-chip 71. The first circuit layer 4 includes a positive electrode pad 44 and three negative electrode pads. There is one positive electrode pad 44 and three negative electrode pads. The negative electrodes of the three sub-chips are connected to the three negative electrode pads respectively, and the positive electrodes of the three sub-chips are all connected to the positive electrode pad 44. Figure 3 , Figure 4 and combined Figure 9 As shown, the red photonic chip 72 is mounted upright on the positive pad 44 and electrically connected to the third negative pad 43 via leads. The green photonic chip 73 is mounted flip-chip on the second negative pad 42 and the positive pad 44 and electrically connected to them. The blue photonic chip 71 is mounted flip-chip on the first negative pad 41 and the positive pad 44 and electrically connected to them. It should be noted that the red photonic chip 72, green photonic chip 73, and blue photonic chip 71 can be connected to the circuit layer 4 using either a flip-chip or upright mounting method; the specific connection method is not limited. The LED chip 7 can be transferred first using a nozzle pick-and-place method, a pin transfer method, and / or a mass transfer method, and then die bonding is completed using laser soldering or reflow soldering.

[0047] S20. A plurality of LED chips 7 and an encapsulation layer 8 covering the first surface 301 are formed on the first surface 301 to form an LED chip 7 package. Specifically, as shown in the figure... Figure 10 As shown, the encapsulation layer 8 is used to protect the LED chip 7.

[0048] In this embodiment of the invention, step S20, forming a plurality of LED chips 7 and an encapsulation layer 8 covering the first surface 301 on the first surface 301, includes:

[0049] S201. A tank is provided, and an encapsulation material is provided in the tank; specifically, a release film is laid at the bottom of the tank, and then liquid encapsulation material is injected into the tank. The encapsulation material includes one or more of fluorocarbon resin, epoxy adhesive, epoxy resin, silicone and silicone resin, and the encapsulation material also includes one or more of black dye and black toner.

[0050] S202, The first surface 301 of the packaging substrate 30 is oriented toward the tank and immersed in the packaging material.

[0051] S203. Curing the encapsulation material to form the encapsulation layer 8. Specifically, heating and pressurizing are used to cure the encapsulation material to form the encapsulation layer 8.

[0052] In some other embodiments of the present invention, step S20, forming a plurality of LED chips 7 and an encapsulation layer 8 covering the first surface 301, includes:

[0053] S2001. A protective film is provided, the protective film including a soft adhesive layer; specifically, the bottom layer of the protective film is an OCA (Optically Clear Adhesive) soft adhesive layer.

[0054] S2002, The protective film is attached to the first surface 301 so that the soft adhesive layer covers the LED chip 7 and the gap between the LED chips 7.

[0055] S2003, Curing the soft adhesive layer to form the encapsulation layer 8.

[0056] In this embodiment of the invention, after step S20, which involves forming a package of LED chips 7 covering a plurality of LED chips 7 and an encapsulation layer 8 covering the first surface 301 to form an LED chip 7 package, the method further includes:

[0057] S30. Cut along the positions between the substrate units 1 on the LED chip 7 package to form individual LED chip 7 package units 1000. Specifically, as shown... Figures 11 to 12 As shown, the LED chip 7 package body is cut along the e-line and f-line at the middle position between the substrate units 1 to form individual LED chip 7 package units 1000.

[0058] The above-disclosed examples are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, any equivalent variations made in accordance with the claims of the present invention shall still fall within the scope of the present invention.

Claims

1. A method for manufacturing a packaging substrate, characterized in that, Includes the following steps: Provide an initial substrate; The initial substrate is punched to form a plurality of substrate units and a support connecting the plurality of substrate units. The support includes a connecting arm connecting adjacent substrate units. Each substrate unit includes a front side, a back side, and a side side connecting the front side and the back side. The side side is exposed except for the area connected to the connecting arm. A first circuit layer and a second circuit layer corresponding to the first circuit layer are respectively formed on the front and back sides of the substrate unit, so that the initial substrate forms a first substrate, and both the first circuit layer and the second circuit layer extend to the edge of the substrate unit. A third circuit layer connecting the first circuit layer and the second circuit layer is formed on the side of the substrate unit to form the packaging substrate.

2. The method for manufacturing a packaging substrate as described in claim 1, characterized in that, The step of forming a plurality of first through holes between the support and the sides of the plurality of substrate units, and forming a third circuit layer connecting the first circuit layer and the second circuit layer on the sides of the substrate units to form the packaging substrate includes: A mask plate is provided, wherein the mask plate is provided with a second through hole corresponding to the first through hole; The mask is stacked on top of the first substrate and the second through hole is aligned with the first through hole; Conductive metal is deposited in the first through-hole using a vapor deposition process to form the third circuit layer connecting the first circuit layer and the second circuit layer on the side of the substrate unit.

3. The method for manufacturing a packaging substrate as described in claim 1, characterized in that, The step of forming a plurality of first through holes between the support and the sides of the plurality of substrate units, and forming a third circuit layer connecting the first circuit layer and the second circuit layer on the sides of the substrate units to form the packaging substrate includes: A mask plate is provided, wherein the mask plate is provided with a second through hole corresponding to the first through hole; The mask is stacked on top of the first substrate and the second through hole is aligned with the first through hole; Conductive metal is electroplated on the side surfaces of the first and second circuit layers using an electroplating process. The conductive metal extends and covers the side surfaces of the substrate unit to form the third circuit layer connecting the first and second circuit layers.

4. The method for manufacturing a packaging substrate as described in claim 1, characterized in that, The first circuit layer includes a positive electrode pad and a negative electrode pad, and the second circuit layer includes a positive electrode connection pad corresponding to the positive electrode pad and a negative electrode connection pad corresponding to the negative electrode pad; The positive electrode pad is one, the negative electrode pad is three, and the positive electrode connection pad is one and the negative electrode connection pad is three; or, the positive electrode pad is three, the negative electrode pad is one, and the positive electrode connection pad is three and the negative electrode connection pad is one.

5. The method for manufacturing a packaging substrate as described in claim 1, characterized in that, The substrate unit is rectangular with a planar structure, circular with a planar structure, circular cup-shaped, or rectangular cup-shaped.

6. The method for manufacturing a packaging substrate as described in claim 5, characterized in that, The substrate units are arranged in a matrix, and the support and the sides of the substrate units form a plurality of first through holes. The first through holes between the four substrate units that form the smallest rectangular unit are cross-shaped.

7. The method for manufacturing a packaging substrate as described in claim 1, characterized in that, After the step of forming a third circuit layer connecting the first circuit layer and the second circuit layer on the side surface of the substrate unit to form the packaging substrate, the method further includes: The packaging substrate is cut along the position between adjacent substrate units to form a separate mounting substrate.

8. A method for manufacturing an LED chip package, characterized in that, The packaging substrate includes a packaging substrate manufactured by the method of any one of claims 1 to 6, wherein the packaging substrate includes a first surface containing the front side of the substrate unit and a second surface opposite to the first surface, and the method of manufacturing the LED chip package includes the following steps: An LED chip is fixed on the first circuit layer of the substrate unit of the packaging substrate so that a plurality of LED chips are formed on the packaging substrate. A plurality of LED chips and an encapsulation layer covering the first surface are formed to form the LED chip package.

9. The method for manufacturing an LED chip package as described in claim 8, characterized in that, The LED chip includes three sub-chips that emit different colors of light, and the first circuit layer includes a positive electrode pad and a negative electrode pad. There is one positive electrode pad and three negative electrode pads. The negative electrodes of the three sub-chips are respectively connected to the three negative electrode pads, and the positive electrodes of the three sub-chips are all connected to the positive electrode pads; or, there are three positive electrode pads and one negative electrode pad. The positive electrodes of the three sub-chips are respectively connected to the three positive electrode pads, and the negative electrodes of the three sub-chips are all connected to the negative electrode pads.

10. The method for manufacturing an LED chip package as described in claim 8, characterized in that, After the step of forming a plurality of LED chips and an encapsulation layer covering the first surface to form the LED chip package, the method further includes: Cut along the positions between the substrate units on the LED chip package to form individual LED chip package units.

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