Valve body casting production equipment and preparation process thereof

Abstract

The invention discloses valve body casting production equipment and a preparation process thereof, belongs to the technical field of intelligent casting, and solves the problems that when a shot blasting machine in a valve body casting production line is used for carbon steel and stainless steel mixed line production, stainless steel shots are easily polluted by carbon steel shot fragments, carbon steel particles are embedded into a stainless steel matrix under high pressure, and the production efficiency is high. An electrochemical corrosion primary battery is formed, a passive film is damaged to cause pitting corrosion, and corrosion resistance standards of API 600, ASTM A351 and the like are violated; if parameters of a shot blasting process are improper, the sealing surface of the valve seat is cold-hardened, the toughness is reduced, microcracks are induced, and subsequently, a compact sealing surface is easy to expand and leak or a valve body is broken. In the process of producing a casting of the valve body, the surface stress state and near surface defects can be monitored by emitting detection laser to the valve body and analyzing a reflected signal during polishing, and when abnormality is detected, a power supply of the shot blasting machine is immediately cut off, and the shot valve is closed to terminate the machining process.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of intelligent casting, in particular to a valve body casting production equipment and a preparation process thereof. BACKGROUND

[0002] The valve body casting is a key component for controlling fluid on-off and adjusting flow in a pipeline system. The production uses cast iron, cast steel and the like as raw materials. First, a sand mold or a metal mold is adopted to ensure that the size of the mold cavity is accurately matched with the design. Then, the raw materials are put into a furnace for smelting, and the temperature and chemical composition are strictly controlled to ensure the purity and performance of the metal liquid. Subsequently, the qualified metal liquid is poured into the mold cavity, and after cooling and solidification, the pouring riser, the flash is removed, and the surface is cleaned. Finally, defects such as pores and cracks are checked through non-destructive testing, size measurement and the like to ensure that the casting meets the use requirements of pressure resistance, sealing and the like, and is suitable for different industrial conditions.

[0003] Generally, a whole valve body casting production line is needed to produce and process the valve body casting. However, when the carbon steel and stainless steel are mixed in the production line of the valve body casting, the carbon steel shot is easy to contaminate the stainless steel shot. Under high pressure, the carbon steel particles are embedded in the stainless steel matrix to form an electrochemical corrosion primary cell, which destroys the passivation film and causes pitting corrosion, which violates the corrosion resistance standards such as API600, ASTM A351 and the like.

[0004] If the shot blasting process parameters are improper, for example, high projection speed and long shot blasting time, the valve seat sealing surface will be cold-hardened, the toughness will be decreased, and micro-cracks will be induced, which will easily expand to cause sealing surface leakage or valve body rupture.

[0005] The above problems are difficult to detect and handle, and are often found during pressure testing or product testing, which can easily cause batch quality accidents.

[0006] Therefore, a valve body casting production equipment is proposed to solve or alleviate the above problems. SUMMARY

[0007] The purpose of the present application is to solve the problems existing in the prior art, and a valve body casting production equipment and a preparation process thereof are proposed.

[0008] In order to achieve the above purpose, the technical scheme adopted by the present application is as follows: A valve body casting production equipment, comprising a core making machine, a molding machine, an induction electric arc furnace, an automatic pouring machine, a vibrating shakeout machine and a shot blasting cleaning machine arranged in sequence, and further comprising a safety detection system arranged in the shot blasting cleaning machine, wherein the safety detection system comprises a power supply module, a speckle interference stress monitoring module, a lock-in thermal imaging monitoring module and a central safety arbitration and execution unit. The power supply output end of the power supply module provides working electric energy for each module. The speckle interferential stress monitoring module is used for emitting dual-frequency laser to the valve body to be measured, receiving the reflected speckle field, and outputting a voltage signal representing the stress gradient of the valve body surface after photoelectric conversion, coherent demodulation and processing, calculation and outputting a voltage signal representing the stress gradient of the valve body surface, comparing the voltage signal with a first threshold voltage, and outputting a first alarm signal when the first threshold voltage is exceeded. The phase-locked thermal imaging monitoring module is used for emitting modulated infrared laser to the valve body to be measured, receiving the radiated infrared signal, and extracting and outputting a phase angle signal representing the phase delay of the near-surface of the valve body after photoelectric conversion and phase-locked processing of the infrared signal, comparing the phase angle signal with a preset phase angle window, and outputting a second alarm signal when the phase angle window is exceeded. The first alarm signal input end of the central safety arbitration and execution unit is electrically connected with the first alarm signal output end of the speckle interferential stress monitoring module, and the second alarm signal input end of the central safety arbitration and execution unit is electrically connected with the second alarm signal output end of the phase-locked thermal imaging monitoring module. The power supply control output end of the central safety arbitration and execution unit is electrically connected with the power supply circuit of the main motor in the shot blasting machine, and the gas path control output end of the central safety arbitration and execution unit is electrically connected with the control gas path of the pneumatic projectile valve in the shot blasting machine, and the central safety arbitration and execution unit is used for cutting off the power supply of the main motor in the shot blasting machine and closing the pneumatic projectile valve in the shot blasting machine when receiving the first alarm signal or the second alarm signal.

[0009] Preferably, the speckle interference stress monitoring module comprises a dual-frequency laser source module, the dual-frequency laser source module comprises a first MAX3643 laser drive chip, a second MAX3643 laser drive chip, a first TEC temperature control chip MAX1978, a second TEC temperature control chip MAX1978, a MAX2754 voltage controlled oscillator, an ADF4110 phase-locked loop frequency synthesizer, a reference crystal oscillator, a first distributed feedback laser tube, a second distributed feedback laser tube, a first current limiting resistor, and a second current limiting resistor; the power supply end of the first MAX3643 laser drive chip is used to connect a +5V power supply, and the ground end is grounded, the laser drive output end of the first MAX3643 laser drive chip is connected with the first end of the first current limiting resistor, the second end of the first current limiting resistor is connected with the anode of the first distributed feedback laser tube, the cathode of the first distributed feedback laser tube is grounded, and the modulation input end of the first distributed feedback laser tube is suspended, the power supply end of the second MAX3643 laser drive chip is used to connect a +5V power supply, and the ground end is grounded, the laser drive output end of the second MAX3643 laser drive chip is connected with the first end of the second current limiting resistor, the second end of the second current limiting resistor is connected with the anode of the second distributed feedback laser tube, the cathode of the second distributed feedback laser tube is grounded, and the modulation input end of the second distributed feedback laser tube is connected with the output end of the MAX2754 voltage controlled oscillator, the power supply end of the MAX2754 voltage controlled oscillator is used to connect a +5V power supply, and the ground end is grounded, the control voltage input end of the MAX2754 voltage controlled oscillator is connected with the radio frequency output end of the ADF4110 phase-locked loop frequency synthesizer, the output end of the MAX2754 voltage controlled oscillator is feedback connected with the radio frequency input end of the ADF4110 phase-locked loop frequency synthesizer, the power supply end of the ADF4110 phase-locked loop frequency synthesizer is connected with a +5V power supply, and the ground end is grounded, the reference clock input end of the ADF4110 phase-locked loop frequency synthesizer is connected with the output end of the reference crystal oscillator, the power supply positive end of the first TEC temperature control chip MAX1978 is connected with a +5V power supply, the power supply negative end is connected with a-15V power supply, and the ground end is grounded, the first output end and the second output end of the first TEC temperature control chip MAX1978 are respectively connected with two ends of the built-in thermoelectric cooler of the first distributed feedback laser tube, the power supply positive end of the second TEC temperature control chip MAX1978 is connected with a +5V power supply, the power supply negative end is connected with a-15V power supply, and the ground end is grounded, and the first output end and the second output end of the second TEC temperature control chip MAX1978 are respectively connected with two ends of the built-in thermoelectric cooler of the second distributed feedback laser tube.

[0010] Preferably, the speckle interference stress monitoring module further comprises a locked pixel CMOS sensor module, the locked pixel CMOS sensor module comprising a CMOS image sensor, an LVDS serializer, an SI52111 clock generator; a pixel power supply end of the CMOS image sensor is connected with a +3.3V power supply, an input and output power supply end thereof is connected with a +3.3V power supply, a pixel ground end thereof is grounded, an input and output ground end of the CMOS image sensor is grounded, a main clock input end of the CMOS image sensor is connected with a clock output end of the SI52111 clock generator, a pixel data output end thereof is respectively connected with a data input end of the LVDS serializer, a power supply end of the LVDS serializer is connected with a +3.3V power supply, a ground end thereof is grounded, a pixel clock output end thereof is connected with a pixel clock input end of the CMOS image sensor, and a low-voltage differential signal output positive end and a low-voltage differential signal output negative end thereof output serial data.

[0011] Preferably, the speckle interferometry stress monitoring module further comprises a coherent demodulation and processing module, the coherent demodulation and processing module comprising a LVDS deserializer, a first AD834 analog multiplier, a first OPA2180 operational amplifier, an AD8302 analog computing chip, an ADG1406 analog multiplexer, a first diode, a second OPA2180 operational amplifier; the low-voltage differential signal input positive terminal and the low-voltage differential signal input negative terminal of the LVDS deserializer receive the output signal of the LVDS serializer, the power supply end of the LVDS deserializer is connected to +3.3V, and the grounding end is grounded; the parallel data output end of the LVDS deserializer is connected to the first Y input end of the first AD834 analog multiplier; the power supply of the first AD834 analog multiplier is connected to a 5V power supply, the grounding end is grounded, the first X input end is connected to a sinusoidal reference signal, and the output end is connected to the inverting input end of the first OPA2180 operational amplifier; the power supply of the first OPA2180 operational amplifier is connected to a 15V power supply, the non-inverting input end is grounded through a first resistor, a first feedback capacitor is connected in parallel between the inverting input end and the output end of the first OPA2180 operational amplifier, and the output end of the first OPA2180 operational amplifier outputs an in-phase component signal; the power supply end of the AD8302 analog computing chip is connected to a +5V power supply, and the grounding end is grounded; the first input end of the AD8302 analog computing chip receives the in-phase component signal; the second input end of the AD8302 analog computing chip receives a signal representing a quadrature component; the amplitude output end of the AD8302 analog computing chip outputs an amplitude signal; the power supply end of the ADG1406 analog multiplexer is connected to a +15V power supply, and the grounding end is grounded; the analog input end of the ADG1406 analog multiplexer receives amplitude signals from multiple channels; the address input end of the ADG1406 analog multiplexer is connected to an address bus; the output end of the ADG1406 analog multiplexer is connected to the anode of the first diode; the cathode of the first diode is grounded through a holding capacitor; the cathode of the first diode is connected to the non-inverting input end of the second OPA2180 operational amplifier; and the output end of the second OPA2180 operational amplifier outputs a maximum amplitude voltage signal.

[0012] Preferably, the speckle interference stress monitoring module further comprises a stress amplitude comparator module, the stress amplitude comparator module comprises an LT1016 voltage comparator, an AD5680 digital-to-analog converter, a first RS latch CD4043; the power supply end of the LT1016 voltage comparator is connected to a 15V power supply, the non-inverting input end of the LT1016 voltage comparator receives a maximum amplitude voltage signal, the inverting input end of the LT1016 voltage comparator is connected to the output voltage end of the AD5680 digital-to-analog converter, the power supply end of the AD5680 digital-to-analog converter is connected to a +5V power supply, and the ground end is grounded, the serial data input end, the serial clock input end and the chip selection end of the AD5680 digital-to-analog converter are connected to a PLC controller in the shot blasting machine, the output end of the LT1016 voltage comparator is connected to the set input end of the first RS latch CD4043, the power supply positive end of the first RS latch CD4043 is connected to a +5V power supply, and the power supply negative end is grounded, and the output end of the first RS latch CD4043 outputs a first alarm signal.

[0013] Preferably, the phase-locked thermal imaging monitoring module comprises an infrared laser driving module, the infrared laser driving module comprises a high-power MOS transistor and a direct digital synthesizer; the power supply end of the direct digital synthesizer is connected to a positive five-volt power supply, the digital ground end of the direct digital synthesizer is grounded, the analog output end of the direct digital synthesizer is connected to the input end of a filter amplification circuit composed of an operational amplifier, the output end of the filter amplification circuit is connected to the gate of the high-power MOS transistor, the drain of the high-power MOS transistor is connected to the anode of an infrared laser diode array through a third current limiting resistor, the source of the high-power MOS transistor is grounded, and the cathode of the infrared laser diode array is connected to a laser driving power supply.

[0014] Preferably, the phase-locked thermal imaging monitoring module further comprises a refrigeration infrared sensor module, the refrigeration infrared sensor module comprises a refrigeration infrared sensor and an ADA4817 pre-operational amplifier; the video signal output end of the refrigeration infrared sensor is connected to the non-inverting input end of the ADA4817 pre-operational amplifier, the power supply of the ADA4817 pre-operational amplifier is connected to a 15V power supply, and the output end of the ADA4817 pre-operational amplifier outputs an analog video signal.

[0015] Preferably, the phase-locked thermal imaging monitoring module further comprises a phase-locked processing module, the phase-locked processing module comprises a second AD834 analog multiplier, an LTC1068 switched capacitor filter and an analog coordinate rotation digital computer; the power supply of the second AD834 analog multiplier is connected with a 5V power supply, the first Y input end of the second AD834 analog multiplier receives an analog video signal, the first X input end of the second AD834 analog multiplier is connected with a modulated sinusoidal reference signal, the output end of the second AD834 analog multiplier is connected with the input end of the LTC1068 switched capacitor filter, the power supply of the LTC1068 switched capacitor filter is connected with a 5V power supply, the output end of the LTC1068 switched capacitor filter outputs an in-phase component signal, the X input end of the analog coordinate rotation digital computer receives the in-phase component signal, the Y input end of the analog coordinate rotation digital computer receives a signal representing a quadrature component, and the phase output end of the analog coordinate rotation digital computer outputs a phase angle signal.

[0016] Preferably, the phase-locked thermal imaging monitoring module further comprises a phase angle comparator module, the phase angle comparator module comprises a first voltage comparator in an LM393 dual voltage comparator, a second voltage comparator in the LM393 dual voltage comparator, a CD4081 AND gate, a second RS latch CD4043, a first precision potentiometer and a second precision potentiometer; the non-inverting input end of the first voltage comparator in the LM393 dual voltage comparator receives a phase angle signal, the wiper of the first precision potentiometer is connected with the inverting input end of the first voltage comparator in the LM393 dual voltage comparator, the non-inverting input end of the second voltage comparator in the LM393 dual voltage comparator receives the phase angle signal, the wiper of the second precision potentiometer is connected with the inverting input end of the second voltage comparator in the LM393 dual voltage comparator, the first input end of the CD4081 AND gate is connected with the output end of the first voltage comparator in the LM393 dual voltage comparator, the second input end of the CD4081 AND gate is connected with the output end of the second voltage comparator in the LM393 dual voltage comparator, the output end of the CD4081 AND gate is connected with the set input end of the second RS latch CD4043, and the output end of the second RS latch CD4043 outputs a second alarm signal.

[0017] The application further provides a valve body casting preparation process, which is processed by the valve body casting production equipment. Step S1: providing working electric energy for the speckle interference stress monitoring module, the phase-locked thermal imaging monitoring module and the central safety arbitration and execution unit by the independent linear power module; Step S2: emitting two laser beams with a stable frequency difference to the measured valve body by the double-frequency laser source module of the speckle interference stress monitoring module; Step S3: receiving the laser speckle field reflected by the measured valve body through the lock pixel CMOS sensor module of the speckle interference stress monitoring module, and performing photoelectric conversion and in-chip modulation to output image data; Step S4: demodulating and processing the image data through the coherent demodulation and processing module of the speckle interference stress monitoring module, calculating and outputting a voltage signal representing the stress gradient of the valve body surface; Step S5: comparing the voltage signal with a first threshold voltage through the stress amplitude comparator module of the speckle interference stress monitoring module, and if the first threshold voltage is exceeded, outputting a first alarm signal, and the decision condition is that the maximum phase gradient value is greater than the stress gradient threshold value determined through process experiment; Step S6: emitting the infrared laser modulated by a specific frequency to the measured valve body through the infrared laser driving module of the phase-locked thermal imaging monitoring module; Step S7: receiving the infrared signal radiated by the measured valve body through the refrigeration infrared sensor module of the phase-locked thermal imaging monitoring module and converting it into an analog video signal; Step S8: processing the analog video signal through the phase-locked processing module of the phase-locked thermal imaging monitoring module, extracting and outputting a phase angle signal representing the near-surface defect of the valve body; Step S9: comparing the phase angle signal with a preset phase angle window through the phase angle comparator module of the phase-locked thermal imaging monitoring module, and if the phase angle window is exceeded, outputting a second alarm signal, and the decision condition is that the phase angle signal is less than the lower limit of the normal phase angle range or greater than the upper limit of the normal phase angle range; Step S10: receiving the first alarm signal and / or the second alarm signal through the central safety arbitration and execution unit, and directly cutting off the power supply of the main motor of the shot blasting machine and closing the pneumatic projectile valve.

[0018] The present application has the following beneficial effects: In the process of producing valve body castings, the surface stress state and near-surface defects can be monitored by emitting detection laser to the valve body and analyzing the reflected signal during polishing, and the processing process is terminated by cutting off the power supply of the shot blasting machine and closing the projectile valve immediately when an abnormality is detected. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0020] Figure 1 The structure diagram of the present application; Figure 2 The structure block diagram of the safety detection system in the present application.

[0021] Fig. 1, core making machine; 2, molding machine; 3, induction electric arc furnace; 4, automatic pouring machine; 5, vibrating knockout machine; 6, shot blasting machine; 7, power module; 8, speckle interference stress monitoring module; 801, dual-frequency laser source module; 802, lock pixel CMOS sensor module; 803, coherent demodulation and processing module; 804, stress amplitude comparator module; 9, phase-locked thermal imaging monitoring module; 901, infrared laser driving module; 902, refrigeration infrared sensor module; 903, phase-locked processing module; 904, phase angle comparator module; 10, central safety arbitration and execution unit. DETAILED DESCRIPTION

[0022] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0024] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0025] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0026] In addition, the terms "first", "second", "third" and the like are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0027] In the description of the present application, it is also necessary to explain that, unless otherwise explicitly specified and limited, the terms "arrange", "install", "connect", "connect" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0028] A valve body casting production equipment, as shown in Figure 1 , comprises a core making machine 1, a molding machine 2, an induction arc furnace 3, an automatic pouring machine 4, a vibrating knockout machine 5, and a shot blasting machine 6 arranged in sequence, as shown in Figure 2 , further comprising a safety detection system arranged in the shot blasting machine 6, the safety detection system comprising a power supply module, a speckle interference stress monitoring module 8, a phase-locked thermal imaging monitoring module 9, and a central safety arbitration and execution unit 10; The power output end of the power supply module provides working power for each module; The speckle interference stress monitoring module 8 is used to emit double-frequency laser to the measured valve body and receive the reflected speckle field, and after photoelectric conversion, coherent demodulation and processing, calculation and output of a voltage signal representing the stress gradient of the valve body surface, the voltage signal is compared with a first threshold voltage, and when the first threshold voltage is exceeded, a first alarm signal is output; The phase-locked thermal imaging monitoring module 9 is used to emit modulated infrared laser to the measured valve body and receive the infrared signal radiated thereby, and after photoelectric conversion and phase-locked processing of the infrared signal, a phase angle signal representing the phase delay of the near-surface of the valve body is extracted and output, and the phase angle signal is compared with a preset phase angle window, and when the phase angle window is exceeded, a second alarm signal is output; The first alarm signal input end of the central safety arbitration and execution unit 10 is electrically connected with the first alarm signal output end of the speckle interference stress monitoring module 8, and the second alarm signal input end of the central safety arbitration and execution unit 10 is electrically connected with the second alarm signal output end of the phase-locked thermal imaging monitoring module 9; The power control output end of the central safety arbitration and execution unit 10 is electrically connected with the power loop of the main motor in the shot blasting machine 6, and the gas path control output end of the central safety arbitration and execution unit 10 is electrically connected with the control gas path of the pneumatic projectile valve in the shot blasting machine 6, and the central safety arbitration and execution unit 10 is used to cut off the power of the main motor in the shot blasting machine 6 and close the pneumatic projectile valve in the shot blasting machine 6 when the first alarm signal or the second alarm signal is received.

[0029] The speckle interference stress monitoring module 8 comprises a dual-frequency laser source module 801, which comprises a first MAX3643 laser drive chip, a second MAX3643 laser drive chip, a first TEC temperature control chip MAX1978, a second TEC temperature control chip MAX1978, a MAX2754 voltage-controlled oscillator, an ADF4110 phase-locked loop frequency synthesizer, a reference crystal oscillator, a first distributed feedback laser tube, a second distributed feedback laser tube, a first current limiting resistor, and a second current limiting resistor; the power supply end of the first MAX3643 laser drive chip is connected to a +5V power supply, and the ground end is grounded; the laser drive output end of the first MAX3643 laser drive chip is connected to the first end of the first current limiting resistor, the second end of the first current limiting resistor is connected to the anode of the first distributed feedback laser tube, the cathode of the first distributed feedback laser tube is grounded, and the modulation input end of the first distributed feedback laser tube is suspended; the power supply end of the second MAX3643 laser drive chip is connected to a +5V power supply, and the ground end is grounded; the laser drive output end of the second MAX3643 laser drive chip is connected to the first end of the second current limiting resistor, the second end of the second current limiting resistor is connected to the anode of the second distributed feedback laser tube, the cathode of the second distributed feedback laser tube is grounded, and the modulation input end of the second distributed feedback laser tube is connected to the output end of the MAX2754 voltage-controlled oscillator; the power supply end of the MAX2754 voltage-controlled oscillator is connected to a +5V power supply, and the ground end is grounded; the control voltage input end of the MAX2754 voltage-controlled oscillator is connected to the radio frequency output end of the ADF4110 phase-locked loop frequency synthesizer; the output end of the MAX2754 voltage-controlled oscillator is feedback connected to the radio frequency input end of the ADF4110 phase-locked loop frequency synthesizer; the power supply end of the ADF4110 phase-locked loop frequency synthesizer is connected to a +5V power supply, and the ground end is grounded; the reference clock input end of the ADF4110 phase-locked loop frequency synthesizer is connected to the output end of the reference crystal oscillator; the power supply positive end of the first TEC temperature control chip MAX1978 is connected to a +5V power supply, the power supply negative end is connected to a -15V power supply, and the ground end is grounded; the first output end and the second output end of the first TEC temperature control chip MAX1978 are respectively connected to the two ends of the built-in thermoelectric cooler of the first distributed feedback laser tube; the power supply positive end of the second TEC temperature control chip MAX1978 is connected to a +5V power supply, the power supply negative end is connected to a -15V power supply, and the ground end is grounded; the first output end and the second output end of the second TEC temperature control chip MAX1978 are respectively connected to the two ends of the built-in thermoelectric cooler of the second distributed feedback laser tube.

[0030] The speckle interference stress monitoring module 8 further comprises a lock pixel CMOS sensor module 802, which comprises a CMOS image sensor, an LVDS serializer, and an SI52111 clock generator; a pixel power supply end of the CMOS image sensor is connected to a +3.3V power supply, an input and output power supply end thereof is connected to a +3.3V power supply, a pixel ground end thereof is grounded, an input and output ground end of the CMOS image sensor is grounded, a main clock input end of the CMOS image sensor is connected to a clock output end of the SI52111 clock generator, pixel data output ends thereof are respectively connected to data input ends of the LVDS serializer, a power supply end of the LVDS serializer is connected to a +3.3V power supply, a ground end thereof is grounded, a pixel clock output end thereof is connected to a pixel clock input end of the CMOS image sensor, and a low-voltage differential signal output positive end and a low-voltage differential signal output negative end thereof output serial data.

[0031] The speckle interference stress monitoring module 8 further comprises a coherent demodulation and processing module 803, which comprises an LVDS deserializer, a first AD834 analog multiplier, a first OPA2180 operational amplifier, an AD8302 analog computing chip, an ADG1406 analog multiplexer, a first diode, and a second OPA2180 operational amplifier; the low-voltage differential signal input positive terminal and the low-voltage differential signal input negative terminal of the LVDS deserializer receive the output signal of the LVDS serializer, the power supply terminal of the LVDS deserializer is connected to +3.3V, the ground terminal thereof is grounded, the parallel data output terminal of the LVDS deserializer is connected to the first Y input terminal of the first AD834 analog multiplier, the power supply of the first AD834 analog multiplier is connected to a 5V power supply, the ground terminal thereof is grounded, the first X input terminal thereof is connected to a sinusoidal reference signal, and the output terminal thereof is connected to the inverting input terminal of the first OPA2180 operational amplifier; the power supply of the first OPA2180 operational amplifier is connected to a 15V power supply, the non-inverting input terminal thereof is grounded through a first resistor, a first feedback capacitor is connected in parallel between the inverting input terminal and the output terminal of the first OPA2180 operational amplifier, and the output terminal of the first OPA2180 operational amplifier outputs an in-phase component signal; the power supply terminal of the AD8302 analog computing chip is connected to a +5V power supply, the ground terminal thereof is grounded, the first input terminal of the AD8302 analog computing chip receives the in-phase component signal, the second input terminal of the AD8302 analog computing chip receives a signal representing a quadrature component, the amplitude output terminal of the AD8302 analog computing chip outputs an amplitude signal, the power supply terminal of the ADG1406 analog multiplexer is connected to a +15V power supply, the ground terminal thereof is grounded, the analog input terminal of the ADG1406 analog multiplexer receives amplitude signals from multiple channels, the address input terminal of the ADG1406 analog multiplexer is connected to an address bus, the output terminal of the ADG1406 analog multiplexer is connected to the anode of the first diode, the cathode of the first diode is grounded through a holding capacitor, the cathode of the first diode is connected to the non-inverting input terminal of the second OPA2180 operational amplifier, and the output terminal of the second OPA2180 operational amplifier outputs a maximum amplitude voltage signal.

[0032] The speckle interference stress monitoring module 8 further comprises a stress amplitude comparator module 804, which comprises an LT1016 voltage comparator, an AD5680 digital-to-analog converter, and a first RS latch CD4043; the power supply end of the LT1016 voltage comparator is connected to a 15V power supply, the non-inverting input end of the LT1016 voltage comparator receives a maximum amplitude voltage signal, the inverting input end of the LT1016 voltage comparator is connected to the output voltage end of the AD5680 digital-to-analog converter, the power supply end of the AD5680 digital-to-analog converter is connected to a +5V power supply, and the ground end is grounded, the serial data input end, the serial clock input end, and the chip selection end of the AD5680 digital-to-analog converter are connected to the PLC controller in the shot blasting machine 6, the output end of the LT1016 voltage comparator is connected to the set input end of the first RS latch CD4043, the power supply positive end of the first RS latch CD4043 is connected to a +5V power supply, the power supply negative end is grounded, and the output end of the first RS latch CD4043 outputs a first alarm signal.

[0033] The phase-locked thermal imaging monitoring module 9 comprises an infrared laser driving module 901, which comprises a high-power MOS transistor and a direct digital synthesizer; the power supply end of the direct digital synthesizer is connected to a +5V power supply, the digital ground end of the direct digital synthesizer is grounded, the analog output end of the direct digital synthesizer is connected to the input end of a filter amplification circuit composed of an operational amplifier, the output end of the filter amplification circuit is connected to the gate of the high-power MOS transistor, the drain of the high-power MOS transistor is connected to the anode of an infrared laser diode array through a third current-limiting resistor, the source is grounded, and the cathode of the infrared laser diode array is connected to a laser driving power supply.

[0034] The phase-locked thermal imaging monitoring module 9 further comprises a refrigeration infrared sensor module 902, which comprises a refrigeration infrared sensor and an ADA4817 pre-operational amplifier; the video signal output end of the refrigeration infrared sensor is connected to the non-inverting input end of the ADA4817 pre-operational amplifier, the power supply of the ADA4817 pre-operational amplifier is connected to a 15V power supply, and the output end outputs an analog video signal.

[0035] The phase-locked thermal imaging monitoring module 9 further comprises a phase-locked processing module 903, which comprises a second AD834 analog multiplier, an LTC1068 switched capacitor filter, and an analog coordinate rotation digital computer; the power supply of the second AD834 analog multiplier is connected to a 5V power supply, the first Y input end of the second AD834 analog multiplier receives an analog video signal, the first X input end of the second AD834 analog multiplier is connected to a modulated sinusoidal reference signal, the output end of the second AD834 analog multiplier is connected to the input end of the LTC1068 switched capacitor filter, the power supply of the LTC1068 switched capacitor filter is connected to a 5V power supply, the output end of the LTC1068 switched capacitor filter outputs an in-phase component signal, the X input end of the analog coordinate rotation digital computer receives the in-phase component signal, the Y input end of the analog coordinate rotation digital computer receives a signal representing a quadrature component, and the phase output end of the analog coordinate rotation digital computer outputs a phase angle signal.

[0036] The phase-locked thermal imaging monitoring module 9 further comprises a phase angle comparator module 904, which comprises a first voltage comparator in an LM393 dual voltage comparator, a second voltage comparator in the LM393 dual voltage comparator, a CD4081 AND gate, a second RS latch CD4043, a first precision potentiometer, and a second precision potentiometer; the non-inverting input end of the first voltage comparator in the LM393 dual voltage comparator receives the phase angle signal, the inverting input end of the first voltage comparator in the LM393 dual voltage comparator is connected to the sliding arm of the first precision potentiometer, the inverting input end of the second voltage comparator in the LM393 dual voltage comparator receives the phase angle signal, the non-inverting input end of the second voltage comparator in the LM393 dual voltage comparator is connected to the sliding arm of the second precision potentiometer, the first input end of the CD4081 AND gate is connected to the output end of the first voltage comparator in the LM393 dual voltage comparator, the second input end of the CD4081 AND gate is connected to the output end of the second voltage comparator in the LM393 dual voltage comparator, the output end of the CD4081 AND gate is connected to the set input end of the second RS latch CD4043, and the output end of the second RS latch CD4043 outputs a second alarm signal.

[0037] The central safety arbitration and execution unit 10 comprises a CD4071 OR gate, a MOSFET driver, and a safety relay; the first input end of the CD4071 OR gate is connected to the first alarm signal, the second input end of the CD4071 OR gate is connected to the second alarm signal, the output end of the CD4071 OR gate is connected to the input end of the MOSFET driver, the output end of the MOSFET driver is connected to the positive electrode end of the coil of the safety relay, the negative electrode end of the coil of the safety relay is grounded, the first normally closed contact end of the safety relay is connected in series to the contactor coil circuit of the main motor power supply circuit in the shot blasting cleaning machine 6, and the second normally closed contact end of the safety relay is connected in series to the power supply circuit of the control air circuit electromagnetic valve of the pneumatic pellet valve in the shot blasting cleaning machine 6.

[0038] In the working process of the device, the device first shoots the sand core forming the flow channel of the valve body inner cavity through the core making machine 1, then the molding machine 2 compacts the molding sand to form a complete casting mold containing a mold cavity and a sand core, then the induction arc furnace 3 melts the metal raw material into liquid metal with precise composition, the automatic pouring machine 4 stably pours the metal liquid into the casting mold, the metal filled in the mold cavity cools and solidifies, and then the vibration shakeout machine 5 separates the casting from the molding sand through vibration, and then the shot blasting cleaning machine 6 high-speed projects the pellets to remove the sand and oxide skin on the surface of the casting.

[0039] In the process of machining the valve body in the shot blasting cleaning machine 6, the safety detection system works in cooperation.

[0040] Step S1: providing working power for the speckle interferometric stress monitoring module 8, the lock-in thermography monitoring module 9, and the central safety arbitration and execution unit 10 through the power supply module; Step S2: emitting two laser beams with a stable frequency difference to the valve body to be measured through the double-frequency laser source module 801 of the speckle interferometric stress monitoring module 8, emitting a first laser beam through the first MAX3643 laser drive chip to drive the first distributed feedback laser tube, generating a modulation signal through the ADF4110 phase-locked loop frequency synthesizer and the MAX2754 voltage-controlled oscillator, emitting a second laser beam through the second MAX3643 laser drive chip according to the modulation signal to make the second laser beam have a stable frequency difference relative to the first laser beam, and accurately controlling the temperature of the first distributed feedback laser tube and the second distributed feedback laser tube through the first TEC temperature control chip MAX1978 and the second TEC temperature control chip MAX1978 Step S3: The lock pixel CMOS sensor module 802 of the speckle interference stress monitoring module 8 receives the laser speckle field reflected by the measured valve body, and performs photoelectric conversion and in-chip modulation to output image data. The CMOS image sensor receives the laser speckle field and performs photoelectric conversion to generate raw image data. The SI52111 clock generator provides a main clock signal for the CMOS image sensor, and the LVDS serializer performs parallel-serial conversion on the raw image data and outputs it in the form of a low-voltage differential signal; Step S4: The coherent demodulation and processing module 803 of the speckle interference stress monitoring module 8 demodulates and processes the image data, calculates and outputs a voltage signal representing the stress gradient on the surface of the valve body. The LVDS deserializer converts the received low-voltage differential signal into parallel image data. The first AD834 analog multiplier performs multiplication operation on the parallel image data and the sine and cosine reference signals, respectively. The integrator composed of the first OP A2180 operational amplifier performs low-pass filtering on the multiplication operation results to obtain in-phase component signals and quadrature component signals. The AD8302 analog calculation chip calculates the stress gradient amplitude signal based on the in-phase component signals and the quadrature component signals. The ADG1406 analog multiplexer, the second OP A2180 operational amplifier, and the first diode constitute a peak holding circuit that scans and finds the maximum stress gradient amplitude in the entire field of view and outputs the corresponding voltage signal. Step S4.1: Perform fixed pattern noise correction and dark current compensation on the collected time sequence speckle images. Specifically, subtract the dark field image gray value from the original gray value and divide by the flat field image gray value. Step S4.2: Calculate the wrapped phase of each pixel point based on the four-step phase shift method. Specifically, use the gray values of four frames of speckle images with phase difference of ninety degrees to calculate the arctangent value. Step S4.3: Unwrap the wrapped phase by the quality-guided path algorithm to obtain the absolute phase field. Step S4.4: Calculate the phase gradient amplitude as a stress concentration representation. Specifically, calculate the square root of the sum of the squares of the partial derivatives of the phase in the horizontal and vertical directions. Step S4.5: Find the maximum phase gradient value in the entire field of view. Step S5: comparing the voltage signal with a first threshold voltage by the stress amplitude comparator module 804 of the speckle interference stress monitoring module 8, if exceeding the first threshold voltage, outputting a first alarm signal, the judgment condition is that the maximum phase gradient value is greater than the stress gradient threshold value determined by process experiment, outputting a preset first threshold voltage by the AD5680 digital-to-analog converter, comparing the voltage signal representing the maximum stress gradient amplitude with the first threshold voltage by the LT1016 voltage comparator, if the voltage signal is greater than the first threshold voltage, locking and outputting the first alarm signal by the first RS latch CD4043; Step S6: emitting the infrared laser modulated by a specific frequency to the measured valve body by the infrared laser driving module 901 of the lock-in thermography monitoring module 9, generating a sine wave signal by the direct digital synthesizer, conditioning the sine wave signal by the filter amplification circuit composed of operational amplifiers, driving the infrared laser diode array according to the conditioned signal by the high-power MOS transistor, and emitting the infrared laser with modulated intensity; Step S7: receiving the infrared signal radiated by the measured valve body and converting it into an analog video signal by the refrigeration infrared sensor module 902 of the lock-in thermography monitoring module 9, converting the received infrared radiation into a weak electric signal by the refrigeration infrared sensor, amplifying the weak electric signal by the ADA4817 pre-operational amplifier, and outputting the analog video signal; Step S8: processing the analog video signal by the lock-in processing module 903 of the lock-in thermography monitoring module 9, extracting and outputting a phase angle signal representing the near-surface defects of the valve body, multiplying the analog video signal with the sine and cosine reference modulation signals by the second AD834 analog multiplier, low-pass filtering the multiplication results by the LTC1068 switched capacitor filter to obtain the in-phase component signal and the quadrature component signal, and calculating the absolute phase angle signal according to the in-phase component signal and the quadrature component signal by the analog coordinate rotation digital computer; Step S8.1: collecting a sequence of time-series thermal images covering multiple thermal excitation periods; Step S8.2: performing discrete Fourier transform on the temperature change sequence of each pixel point to calculate the real part and the imaginary part of the Fourier component at the excitation frequency, specifically by multiplying each frame of temperature values with the corresponding cosine function value and sine function value and then summing them up; Step S8.3: calculating the thermal wave phase delay of each pixel, specifically by calculating the inverse tangent value of the ratio of the imaginary part to the real part; Step S9: The phase angle signal is compared with a preset phase angle window by the phase angle comparator module 904 of the lock-in thermal imaging monitoring module 9, and if it exceeds the phase angle window, a second alarm signal is output. The judgment condition is that the phase angle signal is less than the lower limit of the normal phase angle range or greater than the upper limit of the normal phase angle range. Whether the phase angle signal is lower than the lower limit threshold is judged by the first voltage comparator in the LM393 dual voltage comparator, and whether the phase angle signal is higher than the upper limit threshold is judged by the second voltage comparator in the LM393 dual voltage comparator. Whether the phase angle signal of any pixel point simultaneously satisfies the lower limit threshold or the upper limit threshold is judged by the AND gate CD4081, and if so, the second alarm signal is locked and output by the second RS latch CD4043; Step S10: The central safety arbitration and execution unit 10 receives the first alarm signal and / or the second alarm signal, and directly cuts off the power supply of the main motor of the shot blasting machine 6 and closes the pneumatic projectile valve. The arbitration logic is to execute emergency stop when any of the first alarm signal or the second alarm signal is true. The first alarm signal and the second alarm signal are received by the OR gate CD4071, and if any alarm signal is in the active state, the safety relay is driven by the MOSFET driver, and the normally closed contact of the safety relay is disconnected, so as to hard-wire cut off the power supply of the main motor of the shot blasting machine 6 and close the pneumatic projectile valve.

[0041] More specifically, As described above, the power supply module supplies power, When the system starts to work, the dual-frequency laser source module 801 in the speckle interference stress monitoring module 8 is started first. The first MAX3643 laser drive chip and the second MAX3643 laser drive chip output accurate drive current under the driving of +5V power supply, and drive the first distributed feedback laser tube and the second distributed feedback laser tube to emit two beams of laser through the first current limiting resistor and the second current limiting resistor. At the same time, the ADF4110 phase-locked loop frequency synthesizer generates an accurate modulation signal input to the modulation pin of the second MAX3643 laser drive chip under the 10MHz reference clock provided by the reference crystal oscillator, so that the second beam of laser generates a stable frequency difference relative to the first beam. The first TEC temperature control chip MAX1978 and the second TEC temperature control chip MAX1978 continuously adjust the temperature of the two laser tubes through their output pins to ensure the long-term stability of the output laser frequency. The two beams of laser with stable frequency difference form a speckle field after irradiating the surface of the measured valve body.

[0042] Subsequently, the lock pixel CMOS sensor module 802 begins to work, the lock pixel CMOS image sensor chip obtains +3.3V power supply at its pixel power supply and IO power supply pin, receives the clock signal generated by the SI52111 clock generator at the main clock input pin, starts to collect the speckle field image, and transmits the image data to the data input pin of the LVDS serializer through the pixel data output pin, and the LVDS serializer converts the parallel image data into a low-voltage differential signal and sends it out through the output pin.

[0043] Next, the LVDS deserializer in the coherent demodulation and processing module 803 receives the differential signals and converts them into parallel data, and the signals of the output pin are connected to the Y1 input pin of the first AD834 analog multiplier, and the multiplication operation is performed with the sine reference signal connected to the X1 input pin. The multiplication result enters the inverting input terminal of the first OP A2180 operational amplifier from the output terminal, and the operational amplifier is configured as an integrator with a feedback capacitor connected in parallel between the inverting input terminal and the output terminal. The low-pass filtered signal is output from the output terminal, and the in-phase component signal is obtained. The same processing procedure is used to obtain the quadrature component signal. The two signals are sent to the input pin of the AD8302 analog computing chip, and the amplitude output pin outputs a signal representing the stress gradient. The signal enters the analog input pin of the analog multiplexer, and under the control of the address input pin of the multiplexer, the stress gradient signals of all channels are scanned in turn. The signal of the output pin charges the holding capacitor through the anode-cathode path of the diode, and the voltage follower monitors the capacitor voltage through the in-phase input terminal and outputs the maximum value from the output terminal.

[0044] Subsequently, the LT1016 voltage comparator in the stress amplitude comparator module 804 receives the signal at its in-phase input terminal and compares it with the threshold voltage provided by the output voltage pin of the AD5680 digital-to-analog converter connected to its inverting input terminal. When the stress exceeds the standard, the level of the output pin of the comparator flips, triggering the set input pin of the first RS latch CD4043, so that the output pin outputs a high-level first alarm signal.

[0045] At the same time, the phase-locked thermal imaging monitoring module 9 also works in parallel. The direct digital synthesizer in the infrared laser driving module 901 of the phase-locked thermal imaging monitoring module 9 outputs a sine wave signal from the analog output pin under +5V power supply, which is conditioned by the filter amplifier circuit composed of operational amplifiers to drive the gate of the high-power MOS transistor, so that the drain of the high-power MOS transistor drives the infrared laser diode array to emit modulated infrared light to irradiate the valve body through the current-limiting resistor.

[0046] The refrigeration type infrared sensor in the refrigeration infrared sensor module 902 converts the received infrared radiation into an electrical signal, which is output from the video signal output pin to the non-inverting input terminal of the ADA4817 pre-operational amplifier, and then output from the output pin after amplification.

[0047] The second AD834 analog multiplier in the phase-locked processing module 903 receives the video signal at its Y1 input pin, multiplies it with the reference modulation signal at the X1 input pin, and then outputs from the output pin to the input pin of the LTC1068 switched capacitor filter, and then outputs the in-phase component signal obtained after filtering from the output pin to the X input pin of the analog coordinate rotation digital computer. Similarly, the quadrature component input Y pin is obtained by processing. The calculation core outputs the absolute phase angle signal from the phase output pin.

[0048] The first voltage comparator in the LM393 dual voltage comparator in the phase angle comparator module 904 and the second voltage comparator in the LM393 dual voltage comparator receive signals at their input pins, respectively, and compare them with the upper and lower threshold values set by the precision potentiometer connected to their other input pins. The output pins of the two comparators are connected to the input pins of the AND gate circuit. When the phase angle exceeds the normal range, the output pin of the AND gate triggers the set input pin of the second RS latch CD4043, causing the output pin to output a high-level second alarm signal.

[0049] Finally, the OR gate circuit in the central safety arbitration and execution unit 10 receives the two alarm signals at its input pins. As long as either one is true, the output pin outputs a high level to the input pin of the MOSFET driver. The MOSFET driver then outputs a current from its output pin to drive the coil of the safety relay, causing the normally closed contact of the safety relay to open, thereby directly physically cutting off the power contactor coil loop of the main motor of the shot blasting machine 6 and the electromagnetic valve loop of the pneumatic shot valve, achieving emergency shutdown.

[0050] In this way, the problems of electrochemical corrosion caused by carbon steel pollution and damage to the sealing surface caused by over-throwing process are avoided, ensuring that every stainless steel valve body that leaves the factory fully meets the requirements of standards such as API 600 and ASTM A351.

[0051] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Those skilled in the art can make various modifications and changes to the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A valve body casting production apparatus characterized by comprising: The core making machine (1), the molding machine (2), the induction electric arc furnace (3), the automatic pouring machine (4), the vibrating knock-out machine (5) and the shot blasting machine (6) are sequentially arranged, and a safety detection system is arranged in the shot blasting machine (6), wherein the safety detection system comprises a power module (7), a speckle interference stress monitoring module (8), a phase-locked thermal imaging monitoring module (9) and a central safety arbitration and execution unit (10); The power output end of the power module (7) provides working power for each module; The speckle interference stress monitoring module (8) is used for emitting double-frequency laser to the measured valve body, receiving the reflected speckle field, and outputting a voltage signal representing the stress gradient of the valve body surface after photoelectric conversion, coherent demodulation and processing, calculation and comparison with a first threshold voltage, and outputting a first alarm signal when the first threshold voltage is exceeded; The phase-locked thermal imaging monitoring module (9) is used for emitting modulated infrared laser to the measured valve body, receiving the reflected infrared signal, and outputting a phase angle signal representing the phase delay of the near-surface of the valve body after photoelectric conversion and phase-locked processing, and outputting a second alarm signal when the phase angle window is exceeded. The first alarm signal input end of the central safety arbitration and execution unit (10) is electrically connected with the first alarm signal output end of the speckle interference stress monitoring module (8), and the second alarm signal input end of the central safety arbitration and execution unit (10) is electrically connected with the second alarm signal output end of the phase-locked thermal imaging monitoring module (9); The power control output end of the central safety arbitration and execution unit (10) is electrically connected with the power loop of the main motor in the shot blasting machine (6), and the gas path control output end of the central safety arbitration and execution unit (10) is electrically connected with the control gas path of the pneumatic projectile valve in the shot blasting machine (6), and the central safety arbitration and execution unit (10) is used for cutting off the power of the main motor in the shot blasting machine (6) and closing the pneumatic projectile valve in the shot blasting machine (6) when receiving the first alarm signal or the second alarm signal.

2. The valve body casting production apparatus according to claim 1, characterized by The speckle interference stress monitoring module (8) includes a dual-frequency laser source module (801), the dual-frequency laser source module (801) includes a first MAX3643 laser drive chip, a second MAX3643 laser drive chip, a first TEC temperature control chip MAX1978, a second TEC temperature control chip MAX1978, a MAX2754 voltage controlled oscillator, an ADF4110 phase-locked loop frequency synthesizer, a reference crystal oscillator, a first distributed feedback laser tube, a second distributed feedback laser tube, a first current limiting resistor, a second current limiting resistor; the power supply end of the first MAX3643 laser drive chip is used for connecting +5V power supply, and the ground end is grounded, the laser drive output end of the first MAX3643 laser drive chip is connected with the first end of the first current limiting resistor, the second end of the first current limiting resistor is connected with the anode of the first distributed feedback laser tube, the cathode of the first distributed feedback laser tube is grounded, the modulation input end of the first distributed feedback laser tube is suspended, the power supply end of the second MAX3643 laser drive chip is used for connecting +5V power supply, and the ground end is grounded, the laser drive output end of the second MAX3643 laser drive chip is connected with the first end of the second current limiting resistor, the second end of the second current limiting resistor is connected with the anode of the second distributed feedback laser tube, the cathode of the second distributed feedback laser tube is grounded, the modulation input end of the second distributed feedback laser tube is connected with the output end of the MAX2754 voltage controlled oscillator, the power supply end of the MAX2754 voltage controlled oscillator is used for connecting +5V power supply, and the ground end is grounded, the control voltage input end of the MAX2754 voltage controlled oscillator is connected with the radio frequency output end of the ADF4110 phase-locked loop frequency synthesizer, the output end of the MAX2754 voltage controlled oscillator is feedback connected with the radio frequency input end of the ADF4110 phase-locked loop frequency synthesizer, the power supply end of the ADF4110 phase-locked loop frequency synthesizer is connected with +5V power supply, and the ground end is grounded, the reference clock input end of the ADF4110 phase-locked loop frequency synthesizer is connected with the output end of the reference crystal oscillator, the power supply positive end of the first TEC temperature control chip MAX1978 is connected with +5V power supply, the power supply negative end is connected with-15V power supply, and the ground end is grounded, the first output end and the second output end of the first TEC temperature control chip MAX1978 are respectively connected with two ends of the thermoelectric cooler built-in in the first distributed feedback laser tube, the power supply positive end of the second TEC temperature control chip MAX1978 is connected with +5V power supply, the power supply negative end is connected with-15V power supply, and the ground end is grounded, the first output end and the second output end of the second TEC temperature control chip MAX1978 are respectively connected with two ends of the thermoelectric cooler built-in in the second distributed feedback laser tube.

3. The valve body casting production apparatus according to claim 1, characterized by The speckle interference stress monitoring module (8) further includes a locked pixel CMOS sensor module (802), the locked pixel CMOS sensor module (802) includes a CMOS image sensor, an LVDS serializer, an SI52111 clock generator; a pixel power supply end of the CMOS image sensor is connected with a +3.3V power supply, an input and output power supply end thereof is connected with a +3.3V power supply, a pixel ground end thereof is grounded, an input and output ground end of the CMOS image sensor is grounded, a main clock input end of the CMOS image sensor is connected with a clock output end of the SI52111 clock generator, pixel data output ends thereof are respectively connected with data input ends of the LVDS serializer, a power supply end of the LVDS serializer is connected with a +3.3V power supply, a ground end thereof is grounded, a pixel clock output end thereof is connected with a pixel clock input end of the CMOS image sensor, and a low-voltage differential signal output positive end and a low-voltage differential signal output negative end thereof output serial data.

4. The valve body casting production apparatus according to claim 3, characterized by The speckle interference stress monitoring module (8) further comprises a coherent demodulation and processing module (803), the coherent demodulation and processing module (803) comprises a LVDS deserializer, a first AD834 analog multiplier, a first OP A2180 operational amplifier, an AD8302 analog computing chip, an ADG1406 analog multiplexer, a first diode, a second OP A2180 operational amplifier; the low-voltage differential signal input positive terminal and the low-voltage differential signal input negative terminal of the LVDS deserializer receive the output signal of the LVDS serializer, the power supply end of the LVDS deserializer is connected with +3.3V, and the grounding end is grounded; the parallel data output end of the LVDS deserializer is connected to the first Y input end of the first AD834 analog multiplier, the power supply of the first AD834 analog multiplier is connected with a 5V power supply, the grounding end is grounded, the first X input end is connected with a sinusoidal reference signal, and the output end is connected to the inverting input end of the first OP A2180 operational amplifier; the power supply of the first OP A2180 operational amplifier is connected with a 15V power supply, the non-inverting input end is grounded through a first resistor, a first feedback capacitor is connected in parallel between the inverting input end and the output end of the first OP A2180 operational amplifier, the output end of the first OP A2180 operational amplifier outputs a non-inverting component signal, the power supply end of the AD8302 analog computing chip is connected with a +5V power supply, the grounding end is grounded, the first input end of the AD8302 analog computing chip receives the non-inverting component signal, the second input end of the AD8302 analog computing chip receives a signal representing a quadrature component, the amplitude output end of the AD8302 analog computing chip outputs an amplitude signal, the power supply end of the ADG1406 analog multiplexer is connected with a +15V power supply, the grounding end is grounded, the analog input end of the ADG1406 analog multiplexer receives amplitude signals from multiple channels, the address input end of the ADG1406 analog multiplexer is connected with an address bus, the output end of the ADG1406 analog multiplexer is connected to the anode of the first diode, the cathode of the first diode is grounded through a holding capacitor, the cathode of the first diode is connected to the non-inverting input end of the second OP A2180 operational amplifier, and the output end of the second OP A2180 operational amplifier outputs a maximum amplitude voltage signal.

5. The valve body casting production apparatus according to claim 1, characterized by The speckle interference stress monitoring module (8) further comprises a stress amplitude comparator module (804), the stress amplitude comparator module (804) comprises an LT1016 voltage comparator, an AD5680 digital-analog converter, a first RS latch CD4043; the power supply end of the LT1016 voltage comparator is connected to a 15V power supply, the non-inverting input end of the LT1016 voltage comparator receives a maximum amplitude voltage signal, the inverting input end of the LT1016 voltage comparator is connected to the output voltage end of the AD5680 digital-analog converter, the power supply end of the AD5680 digital-analog converter is connected to a +5V power supply, and the ground end is grounded, the serial data input end, the serial clock input end and the chip selection end of the AD5680 digital-analog converter are connected to the PLC controller in the shot blasting machine (6), the output end of the LT1016 voltage comparator is connected to the set input end of the first RS latch CD4043, the power supply positive end of the first RS latch CD4043 is connected to a +5V power supply, and the power supply negative end is grounded, and the output end of the first RS latch CD4043 outputs a first alarm signal.

6. The valve body casting production apparatus according to claim 1, wherein The phase-locked thermal imaging monitoring module (9) comprises an infrared laser driving module (901), the infrared laser driving module (901) comprises a high-power MOS transistor and a direct digital synthesizer; the power supply end of the direct digital synthesizer is connected to a positive five-volt power supply, the digital ground end of the direct digital synthesizer is grounded, the analog output end of the direct digital synthesizer is connected to the input end of a filter amplification circuit composed of an operational amplifier, the output end of the filter amplification circuit is connected to the gate of the high-power MOS transistor, the drain of the high-power MOS transistor is connected to the anode of an infrared laser diode array through a third current-limiting resistor, the source is grounded, and the cathode of the infrared laser diode array is connected to a laser driving power supply.

7. The valve body casting production apparatus according to claim 1, wherein The phase-locked thermal imaging monitoring module (9) further comprises a refrigeration infrared sensor module (902), the refrigeration infrared sensor module (902) comprises a refrigeration infrared sensor and an ADA4817 pre-operational amplifier; the video signal output end of the refrigeration infrared sensor is connected to the non-inverting input end of the ADA4817 pre-operational amplifier, the power supply of the ADA4817 pre-operational amplifier is connected to a 15V power supply, and the output end outputs an analog video signal.

8. The valve body casting production apparatus according to claim 1, wherein The phase-locked thermal imaging monitoring module (9) further comprises a phase-locked processing module (903), the phase-locked processing module (903) comprises a second AD834 analog multiplier, an LTC1068 switched capacitor filter and an analog coordinate rotation digital computer; the power supply of the second AD834 analog multiplier is connected with a 5V power supply, the first Y input end of the second AD834 analog multiplier receives an analog video signal, the first X input end of the second AD834 analog multiplier is connected with a modulated sinusoidal reference signal, the output end of the second AD834 analog multiplier is connected with the input end of the LTC1068 switched capacitor filter, the power supply of the LTC1068 switched capacitor filter is connected with a 5V power supply, the output end of the LTC1068 switched capacitor filter outputs an in-phase component signal, the X input end of the analog coordinate rotation digital computer receives the in-phase component signal, the Y input end of the analog coordinate rotation digital computer receives a signal representing a quadrature component, and the phase output end of the analog coordinate rotation digital computer outputs a phase angle signal.

9. The valve body casting production apparatus according to claim 1, wherein The phase-locked thermal imaging monitoring module (9) further comprises a phase angle comparator module (904), the phase angle comparator module (904) comprises a first voltage comparator in an LM393 dual voltage comparator, a second voltage comparator in the LM393 dual voltage comparator, a CD4081 AND gate, a second RS latch CD4043, a first precision potentiometer and a second precision potentiometer; the non-inverting input end of the first voltage comparator in the LM393 dual voltage comparator receives a phase angle signal, the wiper of the first precision potentiometer is connected with the inverting input end of the first voltage comparator in the LM393 dual voltage comparator, the inverting input end of the second voltage comparator in the LM393 dual voltage comparator receives the phase angle signal, the wiper of the second precision potentiometer is connected with the non-inverting input end of the second voltage comparator in the LM393 dual voltage comparator, the first input end of the CD4081 AND gate is connected with the output end of the first voltage comparator in the LM393 dual voltage comparator, the second input end of the CD4081 AND gate is connected with the output end of the second voltage comparator in the LM393 dual voltage comparator, the output end of the CD4081 AND gate is connected with the set input end of the second RS latch CD4043, and the output end of the second RS latch CD4043 outputs a second alarm signal.

10. A valve body casting production process by the valve body casting production apparatus as claimed in any one of claims 1 to 9, characterized in that, The method comprises the following steps: Step S1: providing working electric energy for the speckle interference stress monitoring module (8), the phase-locked thermal imaging monitoring module (9) and the central safety arbitration and execution unit (10) through the independent linear power supply module (7); Step S2: emitting two laser beams with a stable frequency difference to the measured valve body through the double-frequency laser source module (801) of the speckle interference stress monitoring module (8); Step S3: receiving the laser speckle field reflected by the measured valve body through the lock-in pixel CMOS sensor module (802) of the speckle interference stress monitoring module (8), and performing photoelectric conversion and in-chip modulation to output image data; Step S4: receiving the image data output by the lock-in pixel CMOS sensor module (802) through the central safety arbitration and execution unit (10), and performing image processing on the image data to output a stress monitoring result; Step S4: demodulating and processing the image data by the coherent demodulation and processing module (803) of the speckle interference stress monitoring module (8), calculating and outputting a voltage signal representing the stress gradient of the valve body surface; Step S5: comparing the voltage signal with a first threshold voltage by the stress amplitude comparator module (804) of the speckle interference stress monitoring module (8), if exceeding the first threshold voltage, outputting a first alarm signal, the judgment condition being that the maximum phase gradient value is greater than the stress gradient threshold value determined by process experiment; Step S6: emitting the infrared laser modulated by a specific frequency to the measured valve body by the infrared laser driving module (901) of the lock-in thermal imaging monitoring module (9); Step S7: receiving the infrared signal radiated by the measured valve body and converting it into an analog video signal by the refrigeration infrared sensor module (902) of the lock-in thermal imaging monitoring module (9); Step S8: processing the analog video signal by the lock-in processing module (903) of the lock-in thermal imaging monitoring module (9), extracting and outputting a phase angle signal representing the near-surface defects of the valve body; Step S9: comparing the phase angle signal with a preset phase angle window by the phase angle comparator module (904) of the lock-in thermal imaging monitoring module (9), if exceeding the phase angle window, outputting a second alarm signal, the judgment condition being that the phase angle signal is less than the lower limit of the normal phase angle range or greater than the upper limit of the normal phase angle range; Step S10: receiving the first alarm signal and / or the second alarm signal by the central safety arbitration and execution unit (10), and directly cutting off the power supply of the main motor of the shot blasting machine and closing the pneumatic projectile valve.

Images