The invention relates to a method for defect analysis of a product, in particular a
printed circuit board product,
semiconductor wafer,
galvanic cell or the like, with an inspection
system (26) and an inspection
system, wherein the inspection
system comprises a projection device (32), an optical detection device (28) and a
processing device, wherein
white light is split into its spectral components by means of a
spectrometer device of the projection device and a multichromatic
light beam (37) formed from monochromatic light beams is projected onto a product at an
angle of incidence β, wherein the optical detection device comprises a detection unit (29) with a camera (27) and a lens (28), wherein a multichromatic
light beam (37) is reflected at the product in a detection plane (46) of the detection unit which extends transversely, preferably orthogonally to a product surface (38) of the product.which is captured by means of the camera, wherein the reflected multichromatic
light beam is projected onto an
image plane (49) of an
image sensor of the camera, wherein height information of the product surface is derived by means of the
processing device from a
spatial distribution of the reflected multichromatic light beam in the
image plane and a position of the optical detection unit relative to the product, wherein, within an interval of the
spatial distribution of intensity values of the reflected multichromatic light beam in the
image plane extending over at least two pixels of the
image sensor, the intensity value for each pixel is captured by means of the
processing device, wherein, from the respective intensity values, a position of a median and / or mode of the
spatial distribution in the image plane is determined by means of the processing device.