7results about How to "Avoid plating" patented technology

The present application relates to the technical field of electroplating, and particularly relates to a horizontal plating device for experiments, which comprises a tank body, the upper end of the tank body is provided with a cover plate, a plating groove is formed in the cover plate, a rubber ring is arranged at the outer ring of the plating groove, a workpiece to be plated is placed on the plating groove with the electroplating surface downward and in contact with the rubber ring, a mounting seat is hung on the inner wall of the cover plate, a sub-tank is arranged on the mounting seat, a cavity for containing plating solution is formed in the sub-tank, an anode plate is arranged in the cavity, a cathode conductive pin is arranged in the cavity and in contact with the electroplating surface of the workpiece to be plated, a plating solution inlet is formed in the side surface of the sub-tank, the upper end of the sub-tank is inserted into the plating groove and sprays plating solution to the electroplating surface of the workpiece to be plated, the wiring ends of the anode plate and the cathode conductive pin are respectively led out from the bottom of the mounting seat, and a waterproof ring is arranged on the bottom surface of the mounting seat to shield the wiring ends. The horizontal plating device for experiments has compact structure, good protection of the anode and cathode components, small plating solution overflow and low maintenance cost.

This utility model belongs to the field of electroplating technology and discloses a steel strip for clamping packaged chip strips. The lower end of the steel strip body is provided with multiple conductive supports, each corresponding to an elastic clip. The upper end of the elastic clip is connected to the steel strip body above the conductive support, and the lower end of the elastic clip is the clamping end that cooperates with the conductive support to clamp the packaged chip strip. The clamping end of the elastic clip is provided with a first insulator molded into shape, and a second insulator is molded onto the conductive support. A conductive contact point is provided on one side of the bottom of the conductive support. The conductive contact point cooperates with the lower end of the first insulator to clamp the packaged chip strip. When the conductive contact point abuts against the lower end of the first insulator, the lower end of the first insulator covers the conductive contact point. This utility model minimizes the tin plating of the conductive supports and elastic clips, reducing energy loss during electroplating and minimizing the need for deplating after material handling.

This invention discloses a PECVD equipment and a silicon wafer passivation method. The PECVD equipment includes a reaction chamber and an RF power supply. The reaction chamber includes a base, an electrode plate vertically disposed within the reaction chamber, and a wafer cassette. The wafer cassette is used to hold multiple stacked silicon wafers and is positioned at a predetermined location on the base, such that the wafer cassette, after entering the reaction chamber, can be arranged on both sides of the electrode plate. The wafer cassette has an opening so that the passivation-to-be-treated sides of the stacked silicon wafers face the electrode plate. The RF power supply is electrically connected to the electrode plate. The wafer cassette and the base are grounded. The reactive gas introduced into the reaction chamber dissociates to form plasma, which is then deposited on the passivation-to-be-treated sides of the silicon wafers adjacent to the electrode plate. This invention avoids the need for plating around the wafer, shortens process time, reduces process temperature, improves equipment efficiency, and reduces breakage rate.

The invention discloses a bonding pad electrogilding method and structure, electronic equipment and a storage medium, and relates to the technical field of gilding. The method comprises the following steps: acquiring a substrate to be plated with gold; printing ink is subjected to silk-screen printing in the gold plating area, and the printing ink is exposed and developed to expose the bonding pad to be plated with gold; performing vacuum film pressing on the whole substrate to be plated with gold, and forming a first anti-corrosion photosensitive dry film on the surface of the substrate to be plated with gold; exposing and developing the first anti-corrosion photosensitive dry film to form a first window; according to the first window, nickel plating and soft gold plating are carried out on the to-be-gold-plated bonding pad, and the first anti-corrosion photosensitive dry film is removed; performing secondary vacuum film pressing on the whole substrate to be plated with gold, and forming a second anti-corrosion photosensitive dry film on the surface of the substrate to be plated with gold; exposing and developing the second anti-corrosion photosensitive dry film to form a second window; according to the second window, hard gold plating is carried out on the to-be-gold-plated bonding pad; and removing the second anti-corrosion photosensitive dry film and the ink layer. According to the method provided by the embodiment of the invention, the problem of diffusion coating can be improved.

The invention provides a laminated photovoltaic device and a production method, and relates to the technical field of photovoltaics. The laminated photovoltaic device comprises an upper-layer battery unit, a lower-layer battery unit, an insulating layer and a middle series structure, the upper-layer cell unit is a thin film solar cell; the lower-layer battery unit is provided with a light-facing surface and a backlight surface which are oppositely arranged, and a side surface connected with the light-facing surface and the backlight surface; and the insulating layer at least wraps the side surface of the lower-layer battery unit. The insulating layer is wrapped on the side surface of the lower-layer battery unit, so that the coating or winding plating of the thin film solar cell on the lower side surface of the thin film solar cell is positioned on the insulating layer and is not in contact with the side surface of the lower-layer battery unit, and the direct coating or winding plating of the thin film solar cell on the side surface of the lower-layer battery unit is avoided; the short circuit of the upper and lower layers of battery units is reduced to a great extent, and the power generation efficiency and the production yield of the laminated photovoltaic device can be improved. The production process is simple, and the production cost is low.

The present invention provides a device for eliminating the expansion and plating of solar cells, belonging to the technical field of semiconductor devices. The present invention provides a device for eliminating the expansion and plating of solar cells, comprising a wafer boat and a deposition furnace, wherein the wafer boat comprises a boat body, and a plurality of groups of slots are arranged on the boat body, and the width of the slots is greater than the thickness of the silicon wafer; the deposition furnace comprises a furnace tube body, a rotating assembly and a driving member, and the rotating assembly comprises a rotating shaft and a bottom bracket for supporting and fixing the boat body, the rotating shaft is rotatably connected with the furnace tube body, the rotating shaft passes through the bottom of the furnace tube body in a vertical direction, the bottom bracket is arranged on the top of the rotating shaft, and the driving member drives the rotating shaft to rotate. The present invention provides a device for eliminating the expansion and plating of solar cells, wherein the silicon wafer is inserted into the slot, the back of the silicon wafer is pressed against the boat wall on the side of the slot away from the center of the boat body, the wafer boat is arranged on the bottom bracket, the rotating shaft rotates, and the silicon wafer is pressed against the boat wall by centrifugal force to avoid the occurrence of expansion or plating, thereby improving production efficiency.

The utility model discloses a phase shifter and an antenna, and belongs to the technical field of antennas. The phase shifter comprises a cavity, a phase shifting assembly and a feed assembly. The phase shifting assembly is assembled in the cavity, the feed assembly comprises an electroplated coupling piece, the coupling piece is detachably assembled on the cavity, the coupling piece and the cavity are coupled and are in common ground, the cavity can be electrically connected with an outer conductor of the feed line through the electroplated coupling piece, and the phase shifting assembly can be electrically connected with an inner conductor of the feed line. According to the utility model, the electroplating coupling piece is connected with the outer conductor of the feeder line, so that the cost can be saved, and meanwhile, the problems of cavity deformation and the like caused by adopting an electroplating rivet pressing piece can be avoided.