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Golden finger plate processing technology

A processing technology and golden finger technology, which is applied in the direction of electrical connection formation of printed components, electrical components, printed circuit manufacturing, etc., can solve the problems of galling, scrapping, dry film is difficult to completely cover the gap between lines and lines, etc., to avoid short circuit, The effect of improving quality

Active Publication Date: 2016-09-21
DIGITAL PRINTED CIRCUIT BOARD CO LTD
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0005] In order to solve the defects in the above-mentioned prior art, the object of the present invention is to provide a gold finger board processing technology, which completely solves the problem that the dry film cannot completely cover the line and the line gap on the same plane when the gold finger is etching the lead wire. The gap between the wires penetrates into the dry film and bites the line, resulting in scrapping

Method used

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Embodiment Construction

[0029] The technical solutions of the present invention will be described below in conjunction with the embodiments.

[0030] The technical scheme adopted in the present invention is: a gold finger plate processing technology, comprising the following steps:

[0031] 1) Provide a PCB board, form a copper-plated layer on the surface of the circuit board, and the production process steps of the copper-plated layer are:

[0032] A. Provide multi-layer PCB board raw materials;

[0033] B. Separately cut the raw materials of the multi-layer PCB board;

[0034] C. In the PCB board raw material as the surface of the inner layer raw material, transfer the inner layer graphics to form the inner layer circuit circuit, and perform automatic optical detection on the inner layer circuit circuit;

[0035] D, stacking the multi-layer PCB board raw materials, and further pressing to form the multi-layer PCB board, and then performing targeting and drilling processes on the multi-layer PCB b...

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Abstract

The invention discloses a golden finger plate processing technology. A primary dry film is provided at the position of a golden finger graph, an acidic CuCl2 etching solution is utilized to etch the position for golden finger plating, a problem of diffusion plating on leads caused by incomplete dry film coverage for lines on a same plane and gaps among the lines because of inaccurate alignment during anti-plating dry film operation can be prevented, non-plating areas except a PCB plate golden finger graph area is provided with secondary dry films, plating of a nickel layer and a gold layer is sequentially carried out at an etched golden finger graph area, after dry film removal, no lead residual on golden fingers is realized, a problem of short circuit at the golden finger position because of diffusion plating can be effectively avoided, and quality of products is improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a processing technology for smooth gold finger boards and no wire residue. Background technique [0002] Printed Circuit Board (PCB) is the basis of almost any electronic product and appears in almost every electronic device. Generally speaking, if there are electronic components in a certain device, they are also integrated on PCBs of various sizes. In addition to fixing various components, the main function of PCB is to provide connection circuits between various components. As electronic equipment becomes more and more complex, more and more components are required, and the lines and components on the surface of the PCB are becoming more and more dense. Some circuit boards need to be provided with long and short gold fingers due to the needs of the connection interface. [0003] The golden finger is composed of many golden conductive contacts. Because the sur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40
CPCH05K3/4007H05K2203/0392
Inventor 张涛
Owner DIGITAL PRINTED CIRCUIT BOARD CO LTD
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