Double-side target distance adjustable rotating tool equipment for PVD coating

Abstract

The invention relates to double-side target distance adjustable rotary tooling equipment for PVD (Physical Vapor Deposition) coating, which relates to the technical field of PVD coating and comprises two groups of copper sputtering targets which are oppositely and parallelly arranged on two sides of a product. The product is driven to rotate through the rotating mechanism, and uniform deposition of a film layer is ensured. Specifically, after the positive and negative control motor is started, an output shaft of the positive and negative control motor drives the rotating shaft to rotate, the rotating shaft penetrates into the bearing on the upper surface of the fixing seat, the bearing provides stable supporting and limiting for the rotating shaft, and friction during rotation is greatly reduced; meanwhile, second balls in a first sliding rail on the upper surface of the fixed seat and a second sliding rail on the lower surface of the turntable roll, so that the rotating resistance of the turntable is further reduced. The rotating disc at the upper end of the rotating shaft synchronously rotates along with the rotating shaft, then the rotating rod fixed to the rotating disc and the product are driven to rotate, all the surfaces of the product can evenly receive copper atoms generated by the copper sputtering target, and the problems that due to unstable rotation of a traditional tool, film deposition is uneven, and the boundary is fuzzy are effectively solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of PVD coating, in particular to a double-sided target distance adjustable rotating tool equipment for PVD coating. BACKGROUND

[0002] PVD coating is the abbreviation of physical vapor deposition technology, which is a process of depositing a thin film on the surface of a workpiece in a vacuum environment through physical methods. Its core principle is to use high-temperature evaporation, sputtering and other physical processes to make atoms or molecules of target materials (such as metals, alloys or ceramics) separate from the parent body, and then migrate to the surface of the workpiece to be plated under vacuum conditions, and condense into a uniform and dense thin film. This technology is widely used in many fields: in the tool and die industry, it can improve the wear resistance and service life; in the decoration field, it can give the product a metallic luster and a variety of colors, such as mobile phone cases, watch bands, etc.; in the optical field, it is used to make antireflection films, reflective films, etc., to improve the performance of optical elements; in the functional coating aspect, it can also realize the functions of conductivity, insulation, corrosion resistance, etc., and is an efficient and environmentally friendly surface treatment technology. In the PVD coating technology, the rationality of the tool equipment directly affects the coating quality and efficiency. At present, for products with simple structure and neat interval boundary, the existing PVD coating tool adopts the method of fixed target position combined with ink shielding or tool shielding, but its target distance adjustment is not convenient, and it is difficult to adapt to different size products, and for products with complex structure and irregular interval boundary, the shielding effect is poor, and problems such as uneven film deposition and blurred boundary are prone to occur. For complex structure products that require thick copper film, the traditional process relies on water and electroplating copper bottom layer, and the corresponding electroplating equipment has the problems of large pollution and poor environmental protection, which does not meet the current green production requirements. In the existing vacuum copper plating tool, part of the equipment has unreasonable target material layout, the target distance is not adjustable or the adjustment precision is low, and there is a lack of stable workpiece rotating mechanism, which leads to low copper film deposition efficiency and poor film layer uniformity, and it is difficult to meet the requirements of rapid deposition of thick copper film and film layer quality. Therefore, it is a key requirement to develop a PVD coating tool equipment with adjustable target distance, stable workpiece rotation and adaptation to complex products, which can improve the efficiency and quality of coating process and promote environmental protection production. Therefore, a double-sided target distance adjustable rotating tool equipment for PVD coating is provided. SUMMARY

[0003] 1. Technical problems solved The purpose of the present application is to provide a double-sided target distance adjustable rotating tool equipment for PVD coating to solve the problems in the background art.

[0004] The double-sided target distance adjustable rotating tool equipment for PVD coating provided by the application adopts the following technical scheme: two groups of copper sputtering targets are arranged opposite and parallel on the two sides of the product, position adjusting mechanisms are arranged at the lower ends of the two groups of copper sputtering targets, a rotating mechanism is arranged on the middle upper surface of the position adjusting mechanism, a rotating rod is arranged at the upper end of the rotating mechanism, the rotating rod is used for fixing and rotating the product, the position adjusting mechanism comprises a base, an electric push rod is fixedly connected inside the base, a U-shaped seat is fixedly connected to the output end of the electric push rod, movable rods are movably connected to the left and right sides of the U-shaped seat, movable plates are movably connected to the distal ends of the two groups of movable rods, the movable plates are movably connected inside the base, support plates are fixedly connected to the distal ends of the two groups of movable plates, the two groups of support plates are movably connected to the left and right sides of the base, and the two groups of copper sputtering targets are fixedly connected to the upper surfaces of the distal ends of the two groups of support plates. By adopting the above technical scheme, the core structure of the target distance adjustable and capable of rotating the product is constructed by arranging the two groups of copper sputtering targets opposite and parallel, the position adjusting mechanism, the rotating mechanism and the rotating rod. In the position adjusting mechanism, the linkage of the electric push rod, the U-shaped seat, the movable rod, the movable plate and the support plate realizes flexible adjustment of the distance between the copper sputtering targets and adapts to products of different sizes. The rotating mechanism rotates the product to ensure that the copper atoms are uniformly deposited on each surface of the product with complex structure, and solves the problems of poor adaptability of the traditional fixed target position tool and uneven film layer.

[0005] Preferably, the rotating mechanism comprises a fixed seat fixedly connected to the upper surface of the base, a forward-reverse motor fixedly connected inside the fixed seat, a rotating shaft fixedly connected to the output shaft of the forward-reverse motor, a bearing penetrating the upper surface of the fixed seat, the rotating shaft penetrating the inside of the bearing, and a rotating disc fixedly connected to the upper end of the rotating shaft. By adopting the above technical scheme, the fixed seat of the rotating mechanism provides stable support for the forward-reverse motor, the bearing supports and limits the rotating shaft, and reduces the rotating friction; the cooperation of the rotating disc and the rotating rod transmits the motor power to the product, ensures the rotation stability, avoids the film deposition deviation caused by the product shaking, and improves the uniformity of the coating of the complex product.

[0006] Preferably, a sliding block is fixedly connected to the side surface of the movable plate, a first rolling ball is rolling connected inside the sliding block, and a sliding groove is formed in the inside of the base. By adopting the above technical scheme, the sliding block, the first rolling ball and the sliding groove in the inside of the base are arranged on the side surface of the movable plate, so that the friction is reduced when the movable plate moves, and the sliding is smoother. This design improves the response speed and adjustment accuracy of the position adjusting mechanism, ensures the accurate adjustment of the distance between the copper sputtering targets, and guarantees the target distance consistency when the products of different sizes are coated.

[0007] Preferably, the upper surface of the fixed base is provided with a first slide rail, and the lower surface of the turntable is provided with a second slide rail. The first and second slide rails are connected by rolling second balls. There are multiple sets of second balls, which are symmetrically arranged inside the first and second slide rails. By adopting the above technical solution, the first slide rail of the fixed base, the second slide rail of the turntable, and the second ball bearing inside, in conjunction with the bearing, further reduce the rotational friction of the turntable and reduce vibration during rotation. This structure enhances the operational stability of the rotating mechanism, making the product rotate more smoothly and avoiding blurring of the film boundary due to shaking.

[0008] Preferably, the copper sputtering target is powered by a DC drive power supply, and the DC drive power supply is electrically connected to the copper sputtering target to form a closed loop. The copper sputtering target is driven by a stable output current to generate a continuous and uniform sputtering effect, providing a stable ion source for copper atom deposition. By adopting the above technical solution, the copper sputtering target is powered by a DC drive power supply, forming a closed loop. The stable current output ensures a continuous and uniform sputtering effect, and the rate at which copper atoms detach from the target surface is stable. This design avoids uneven film thickness caused by power fluctuations, guarantees the deposition quality of thick copper films, and eliminates the pollution problems of electroplating, meeting environmental protection requirements.

[0009] Preferably, the support plate of the position adjustment mechanism is provided with a position sensor, which is electrically connected to the control system of the electric push rod, and is used to monitor the position of the copper sputtering target in real time and feed it back to the control system to ensure the adjustment accuracy of the distance between the two sets of copper sputtering targets. By adopting the above technical solution, the position sensor monitors the position of the copper sputtering target in real time and feeds back to the electric push rod control system, realizing closed-loop control of the target distance adjustment. By accurately sensing the position deviation, the control system can promptly correct the adjustment amount, avoiding over-adjustment or under-adjustment, ensuring the accuracy of the distance between the two sets of copper sputtering targets, and solving the problem of traditional tooling target distance adjustment relying on manual labor and having large errors.

[0010] Preferably, the turntable of the rotating mechanism is equipped with a speed sensor, which is electrically connected to the drive system of the forward and reverse motors to monitor the rotation speed of the turntable in real time. When the speed deviates from the preset range, the drive system can automatically adjust the output of the forward and reverse motors to ensure rotational stability. By adopting the above technical solution, the speed sensor monitors the turntable speed in real time and forms a closed-loop speed control in conjunction with the forward and reverse motor drive system. When the speed deviates from the preset range, the drive system automatically adjusts the motor output to maintain a stable speed, avoiding rotational speed fluctuations caused by load changes, ensuring consistent copper atom deposition on all surfaces of the product, and improving film uniformity.

[0011] Preferably, a film thickness monitoring sensor is provided on the front side of the copper sputtering target. The film thickness monitoring sensor is electrically connected to an external control system to collect film thickness data on the product surface in real time and feed it back to the control system. When the film thickness is detected to reach a preset value, the control system can issue a signal prompt or automatically trigger a shutdown procedure to realize real-time monitoring of the deposition thickness. By adopting the above technical solution, the film thickness monitoring sensor collects real-time data on the film thickness on the product surface and feeds it back to the control system, realizing dynamic monitoring of the deposition process. When the film thickness reaches the preset value, the system can promptly issue a warning or stop the machine to prevent the film from being too thick or too thin, thus meeting the quality requirements of thick copper films, reducing the generation of defective products, and improving production efficiency.

[0012] 2. Beneficial effects In summary, this application includes at least one of the following beneficial technical effects: 1. This invention provides a rotary fixture with adjustable target spacing for PVD coating. This fixture uses a rotating mechanism to drive the product to rotate, ensuring uniform film deposition. Specifically, after the forward and reverse motors are started, their output shafts drive the rotating shaft to rotate. Since the rotating shaft passes through the bearings on the upper surface of the fixed base, the bearings provide stable support and limit the rotation, significantly reducing friction during rotation. Simultaneously, the first slide rail on the upper surface of the fixed base and the second ball bearings in the second slide rail on the lower surface of the turntable roll, further reducing the rotational resistance of the turntable. The turntable at the upper end of the rotating shaft rotates synchronously with the rotating shaft, thereby driving the rotating rod fixed on the turntable and the product to rotate. This ensures that each surface of the product can uniformly receive copper atoms generated by the copper sputtering target, effectively solving the problems of uneven film deposition and blurred boundaries caused by unstable rotation in traditional fixtures, especially improving the coating consistency of complex structure products. The target spacing is flexibly adjustable through a position adjustment mechanism to adapt to products of different sizes. When the electric push rod is operated, its output end pushes the U-shaped seat to move, and the movable rods on both sides of the U-shaped seat move in conjunction, causing the movable plate to slide inside the base. The first ball bearing inside the slider on the side of the movable plate rolls within the groove, reducing friction between the movable plate and the base. This allows the support plate to move the copper sputtering target smoothly and precisely adjust the spacing between the two sets of copper sputtering targets. This design solves the problems of fixed target spacing and inconvenient adjustment in traditional tooling. It eliminates the need for ink or tooling masking, making it suitable for products with complex structures and irregular electrical boundaries, significantly expanding the applicability of the equipment.

[0013] 2. This invention provides a rotary fixture with adjustable target spacing on both sides for PVD coating. It achieves vacuum copper plating using a copper sputtering target and a DC drive power supply. The DC drive power supply and the copper sputtering target form a closed loop, with a stable output current driving the copper sputtering target to continuously generate a uniform sputtering effect, providing a stable ion source for copper atom deposition. This setup completely eliminates the dependence on the electroplating tank in traditional water-based electroplating processes, avoiding pollution problems generated during electroplating from the source, meeting increasingly stringent environmental protection requirements, and achieving a more sustainable production model. A position sensor is installed on the support plate of the position adjustment mechanism, which is electrically connected to the control system of the electric push rod, allowing real-time monitoring of the copper sputtering target position and data feedback. When the target spacing is close to the preset value, the control system can precisely control the start and stop of the electric push rod, avoiding over- or under-adjustment, ensuring the spacing accuracy of the two sets of copper sputtering targets, further guaranteeing the consistency of target distance when coating products of different sizes, and improving process stability.

[0014] 3. This invention provides a rotary fixture with adjustable target spacing on both sides for PVD coating. The rotating mechanism's turntable is equipped with a speed sensor electrically connected to the drive system of the forward and reverse motors to monitor the turntable's rotation speed in real time. When the speed deviates from the preset range due to factors such as load changes, the drive system automatically adjusts the output power of the forward and reverse motors, allowing the turntable speed to quickly return to a stable range, ensuring consistent product rotation speed, providing a stable dynamic environment for uniform copper atom deposition, and reducing film thickness deviations caused by speed fluctuations. A film thickness monitoring sensor located on the front side of the copper sputtering target is electrically connected to an external control system to collect film thickness data on the product surface in real time during the coating process. When the film thickness reaches the preset value, the control system immediately sends a signal to the operator or automatically triggers a shutdown procedure to terminate sputtering, achieving precise control of the deposition thickness. This function solves the problem of relying on manual judgment or delayed detection of film thickness in traditional processes, effectively avoiding material waste caused by excessively thick film or product defects caused by excessively thin film, significantly improving product qualification rate and production efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a partial top view of the structure of the present invention; Figure 3 This is a structural schematic diagram of the position adjustment mechanism of the present invention, viewed from the top cross-section. Figure 4 for Figure 3 Schematic diagram of the structure at point A; Figure 5 This is a cross-sectional structural schematic diagram of the rotating mechanism of the present invention; Figure 6 for Figure 5 Schematic diagram of the structure at point B Figure 7 This is a schematic diagram of the copper sputtering target of the present invention near the side of the rotating rod.

[0016] The components include: 1. Copper sputtering target; 2. Position adjustment mechanism; 201. Base; 202. Electric push rod; 203. U-shaped seat; 204. Movable rod; 205. Movable plate; 206. Support plate; 207. Slider; 208. First ball bearing; 209. Slide groove; 3. Rotation mechanism; 301. Fixed seat; 302. Forward and reverse motor; 303. Rotating shaft; 304. Bearing; 305. Turntable; 306. First slide rail; 307. Second slide rail; 308. Second ball bearing; 4. Rotating rod; 5. Position sensor; 6. Speed ​​sensor; 7. Film thickness monitoring sensor. Detailed Implementation

[0017] The following is in conjunction with the appendix Figure 1 -Appendix Figure 7 This application will be described in further detail below.

[0018] Example 1: Adjustable rotating fixture with dual-sided target distance for PVD coating, refer to Figure 1 , Figure 2 and Figure 3 Two sets of copper sputtering targets 1 are arranged opposite and parallel to each other on both sides of the product. A position adjustment mechanism 2 is provided at the lower end of each set of copper sputtering targets 1. A rotating mechanism 3 is provided on the upper surface of the middle of the position adjustment mechanism 2. A rotating rod 4 is provided at the upper end of the rotating mechanism 3. The rotating rod 4 is used to fix the product and drive the product to rotate. The position adjustment mechanism 2 includes a base 201. An electric push rod 202 is fixedly connected inside the base 201. A U-shaped seat 203 is fixedly connected to the output end of the electric push rod 202. Movable rods 204 are movably connected to both sides of the U-shaped seat 203. Two sets of movable rods 204 are each movably connected to a movable plate 205 at their furthest ends. The movable plate 205 is movably connected inside the base 201. Support plates 206 are fixedly connected to the furthest ends of both sets of movable plates 205. The two support plates 206 are movably connected to the left and right sides of the base 201. Two sets of copper sputtering targets 1 are fixedly connected to the furthest ends of the upper surfaces of the two support plates 206. By setting up two sets of opposing and parallel copper sputtering targets 1, a position adjustment mechanism 2, a rotation mechanism 3, and a rotation rod 4, a core structure with adjustable target spacing and the ability to drive product rotation is constructed. In the position adjustment mechanism 2, the linkage of the electric push rod 202, U-shaped seat 203, movable rod 204, movable plate 205, and support plate 206 enables flexible adjustment of the spacing between the copper sputtering targets 1, adapting to products of different sizes. The rotation mechanism 3, by driving the product to rotate, ensures that copper atoms are uniformly deposited on each surface of complex structure products, solving the problems of poor adaptability and uneven film layer in traditional fixed target fixtures.

[0019] Reference Figure 1 , Figure 4 andFigure 5 The rotating mechanism 3 includes a fixed base 301, which is fixedly connected to the upper surface of the base 201. A forward and reverse motor 302 is fixedly connected inside the fixed base 301. A rotating shaft 303 is fixedly connected to the upper end of the output shaft of the forward and reverse motor 302. A bearing 304 passes through the upper surface of the fixed base 301, and the rotating shaft 303 passes through the bearing 304. A turntable 305 is fixedly connected to the upper end of the rotating shaft 303. A rotating rod 4 is fixedly connected to the upper surface of the turntable 305. A slider 207 is fixedly connected to the side of the movable plate 205. A first ball bearing 208 is rotatably connected inside the slider 207. A groove 20 is formed inside the base 201. 9. The first ball bearing 208 is rolled within the groove 209. The fixed seat 301 of the rotating mechanism 3 provides stable support for the forward and reverse motors 302. The bearing 304 supports and limits the rotating shaft 303, reducing rotational friction. The turntable 305, in cooperation with the rotating rod 4, transmits motor power to the product, ensuring rotational stability and preventing film deposition deviations caused by product shaking. This improves the uniformity of coating on complex products. By setting the slider 207, the first ball bearing 208, and the groove 209 inside the base 201 on the side of the movable plate 205, friction is reduced and sliding is smoother when the movable plate 205 moves. This design improves the response speed and adjustment accuracy of the position adjustment mechanism 2, ensuring accurate adjustment of the copper sputtering target 1 spacing and guaranteeing the consistency of target distance when coating products of different sizes.

[0020] Reference Figure 1 , Figure 6 and Figure 7 The upper surface of the fixed base 301 is provided with a first slide rail 306, and the lower surface of the turntable 305 is provided with a second slide rail 307. The first slide rail 306 and the second slide rail 307 are connected by rolling second balls 308. There are multiple sets of second balls 308, which are symmetrically arranged inside the first slide rail 306 and the second slide rail 307. The copper sputtering target 1 is powered by a DC drive power supply, and the DC drive power supply is electrically connected to the copper sputtering target 1 to form a closed loop. The copper sputtering target 1 is driven by a stable output current to generate a continuous and uniform sputtering effect, providing a stable ion source for copper atom deposition. The first slide rail 306 of the fixed base 301, the second slide rail 307 of the turntable 305 and the second balls 308 inside cooperate with the bearing 304 to further reduce the rotational friction of the turntable 305 and reduce vibration during rotation. This structure enhances the operational stability of the rotating mechanism 3, making the product rotate more smoothly and avoiding blurred film boundaries caused by shaking. The copper sputtering target 1 is powered by a DC drive power supply, forming a closed loop. The stable current output ensures a continuous and uniform sputtering effect, and the rate at which copper atoms detach from the target surface is stable. This design avoids uneven film thickness caused by power fluctuations, ensuring the deposition quality of thick copper films, while also eliminating the pollution problems of electroplating and meeting environmental protection requirements. Reference Figure 1 ,Figure 2 and Figure 3 A position sensor 5 is installed on the support plate 206 of the position adjustment mechanism 2. The position sensor 5 is electrically connected to the control system of the electric push rod 202. It is used to monitor the position of the copper sputtering target 1 in real time and feed it back to the control system to ensure the spacing adjustment accuracy of the two sets of copper sputtering targets 1. A speed sensor 6 is installed on the turntable 305 of the rotation mechanism 3. The speed sensor 6 is electrically connected to the drive system of the forward and reverse motors 302. It is used to monitor the rotation speed of the turntable 305 in real time. When the speed deviates from the preset range, the drive system can automatically adjust the output of the forward and reverse motors 302 to ensure rotational stability. A film thickness monitoring sensor 7 is installed on the front side of the copper sputtering target 1. The film thickness monitoring sensor 7 is electrically connected to the external control system to collect the film thickness data on the product surface in real time and feed it back to the control system. When the film thickness is detected to reach the preset value, the control system can issue a signal prompt or automatically trigger the shutdown program to realize real-time monitoring of the deposition thickness. The position sensor 5 monitors the position of the copper sputtering target 1 in real time and feeds it back to the control system of the electric push rod 202 to realize closed-loop control of the target distance adjustment. By accurately sensing positional deviations, the control system can promptly correct adjustments, avoiding over- or under-adjustment and ensuring the accuracy of the spacing between the two sets of copper sputtering targets 1. This solves the problem of traditional tooling target spacing adjustment relying on manual labor and resulting in large errors. The speed sensor 6 monitors the rotation speed of the turntable 305 in real time, forming a closed-loop speed control system in conjunction with the forward and reverse motors 302. When the speed deviates from the preset range, the drive system automatically adjusts the motor output to maintain a stable speed, avoiding rotational speed fluctuations caused by load changes. This ensures consistent copper atom deposition on all product surfaces, improving film uniformity. The film thickness monitoring sensor 7 collects film thickness data on the product surface in real time and feeds it back to the control system, enabling dynamic monitoring of the deposition process. When the film thickness reaches the preset value, the system can promptly alert or stop the machine, preventing the film from being too thick or too thin, meeting the quality requirements of thick copper films, reducing defective products, and improving production efficiency.

[0021] The implementation principle of this application embodiment is as follows: During operation, the copper sputtering target 1 is powered by a DC drive power supply. The DC drive power supply and the copper sputtering target 1 are electrically connected to form a closed loop. Under the action of a stable output current, the copper sputtering target 1 generates a continuous and uniform sputtering effect, causing copper atoms to detach from the target surface and diffuse into the surrounding space, providing an ion source for copper film deposition on the product surface. After the rotating mechanism 3 is started, the forward and reverse motors 302 start working, and their output shaft drives the rotating shaft 303 to rotate. Since the rotating shaft 303 passes through the bearing 304 on the upper surface of the fixed base 301, the bearing 304 supports and limits the rotating shaft 303, reducing friction when the rotating shaft 303 rotates. The turntable 305 at the upper end of the rotating shaft 303 rotates together with the rotating shaft 303, thereby driving the rotating rod 4 fixed on the upper surface of the turntable 305 to rotate. The product fixed on the rotating rod 4 then rotates between the two sets of opposite and parallel copper sputtering targets 1, so that each surface of the product can uniformly receive copper atoms. Simultaneously, the first slide rail 306 on the upper surface of the fixed base 301 and the second ball bearing 308 inside the second slide rail 307 on the lower surface of the turntable 305 roll, further reducing friction when the turntable 305 rotates and ensuring the stability of product rotation. When it is necessary to adjust the distance between the two sets of copper sputtering targets 1 to accommodate products of different sizes, the position adjustment mechanism 2 starts to operate. The electric push rod 202 is activated, and its output end pushes the U-shaped base 203 to move. The movable rods 204 connected to the left and right sides of the U-shaped base 203 move accordingly. The end of the movable rod 204 away from the U-shaped base 203 drives the movable plate 205 to move inside the base 201. The first ball bearing 208 inside the slider 207 fixedly connected to the side of the movable plate 205 rolls in the groove 209 inside the base 201, assisting the movable plate 205 to move smoothly and reducing friction between the movable plate 205 and the base 201. The support plate 206, which is fixedly connected to the end of the movable plate 205 away from the movable rod 204, moves synchronously with the movable plate 205, thereby driving the copper sputtering target 1 fixed on the upper surface of the support plate 206 to move, realizing the adjustment of the distance between the two sets of copper sputtering targets 1; the position sensor 5 on the support plate 206 of the position adjustment mechanism 2 is electrically connected to the control system of the electric push rod 202. During the adjustment of the position of the copper sputtering target 1, the position sensor 5 monitors the position of the copper sputtering target 1 in real time and feeds the data back to the control system. The control system accurately controls the operation of the electric push rod 202 according to the feedback data to ensure the accuracy of the distance adjustment between the two sets of copper sputtering targets 1; the speed sensor 6 on the turntable 305 of the rotation mechanism 3 is electrically connected to the drive system of the forward and reverse motor 302. During the rotation of the turntable 305, the speed sensor 6 monitors the rotation speed of the turntable 305 in real time. When the rotation speed deviates from the preset range, the drive system receives the signal and automatically adjusts the output of the forward and reverse motors 302 to bring the rotation speed of the turntable 305 back to the preset range, ensuring rotational stability. The film thickness monitoring sensor 7 on the front side of the copper sputtering target 1 is electrically connected to the external control system. During the copper atom deposition process, the film thickness monitoring sensor 7 collects the film thickness data on the product surface in real time and feeds it back to the control system.When the film thickness is detected to reach the preset value, the control system issues a signal or automatically triggers a shutdown procedure to achieve real-time monitoring of the deposition thickness.

Claims

1. A PVD coating double-sided target distance adjustable rotating fixture, comprising two sets of copper sputtering targets (1) arranged opposite and parallel to each other on both sides of the product, characterized in that: The two sets of copper sputtering targets (1) are provided with a position adjustment mechanism (2) at their lower ends. The position adjustment mechanism (2) is provided with a rotating mechanism (3) on its upper middle surface. The rotating mechanism (3) is provided with a rotating rod (4) at its upper end. The rotating rod (4) is used to fix the product and drive the product to rotate. The position adjustment mechanism (2) includes a base (201). An electric push rod (202) is fixedly connected inside the base (201). A U-shaped seat (203) is fixedly connected to the output end of the electric push rod (202). 203) Movable rods (204) are movably connected to both the left and right sides. Movable plates (205) are movably connected to the ends of the two sets of movable rods (204) away from one end. The movable plates (205) are movably connected inside the base (201). Support plates (206) are fixedly connected to the ends of the two sets of movable plates (205) away from one end. The two sets of support plates (206) are movably connected to the left and right sides of the base (201). The two sets of copper sputtering targets (1) are fixedly connected to the ends of the upper surfaces of the two sets of support plates (206) away from one end.

2. The PVD coating double-sided target distance adjustable rotary fixture equipment according to claim 1, characterized in that: The rotating mechanism (3) includes a fixed seat (301), which is fixedly connected to the upper surface of the base (201). A forward and reverse motor (302) is fixedly connected inside the fixed seat (301). A rotating shaft (303) is fixedly connected to the upper end of the output shaft of the forward and reverse motor (302). A bearing (304) passes through the upper surface of the fixed seat (301). The rotating shaft (303) passes through the bearing (304). A turntable (305) is fixedly connected to the upper end of the rotating shaft (303). The rotating rod (4) is fixedly connected to the upper surface of the turntable (305).

3. The PVD coating double-sided target distance adjustable rotary fixture equipment according to claim 1, characterized in that: The movable plate (205) is fixedly connected to a slider (207) on its side. A first ball bearing (208) is rotatably connected inside the slider (207). A groove (209) is opened inside the base (201), and the first ball bearing (208) is rotatably connected inside the groove (209).

4. The PVD coating double-sided target distance adjustable rotary fixture equipment according to claim 2, characterized in that: The upper surface of the fixed base (301) is provided with a first slide rail (306), and the lower surface of the turntable (305) is provided with a second slide rail (307). The first slide rail (306) and the second slide rail (307) are connected by rolling second balls (308). There are multiple sets of second balls (308), which are symmetrically arranged inside the first slide rail (306) and the second slide rail (307).

5. The PVD coating double-sided target distance adjustable rotary fixture equipment according to claim 1, characterized in that: The copper sputtering target (1) is powered by a DC drive power supply, and the DC drive power supply is electrically connected to the copper sputtering target (1) to form a closed loop. The copper sputtering target (1) is driven by a stable output current to generate a continuous and uniform sputtering effect, providing a stable ion source for copper atom deposition.

6. The PVD coating double-sided target distance adjustable rotary fixture equipment according to claim 1, characterized in that: The position adjustment mechanism (2) has a position sensor (5) on its support plate (206). The position sensor (5) is electrically connected to the control system of the electric push rod (202) and is used to monitor the position of the copper sputtering target (1) in real time and feed it back to the control system to ensure the accuracy of the spacing adjustment between the two sets of copper sputtering targets (1).

7. The PVD coating double-sided target distance adjustable rotary fixture equipment according to claim 2, characterized in that: The rotating mechanism (3) has a rotation speed sensor (6) on its turntable (305). The rotation speed sensor (6) is electrically connected to the drive system of the forward and reverse motor (302) and is used to monitor the rotation speed of the turntable (305) in real time. When the rotation speed deviates from the preset range, the drive system can automatically adjust the output of the forward and reverse motor (302) to ensure rotation stability.

8. The PVD coating double-sided target distance adjustable rotary fixture equipment according to claim 1, characterized in that: A film thickness monitoring sensor (7) is provided on the front side of the copper sputtering target (1). The film thickness monitoring sensor (7) is electrically connected to the external control system. It collects the film thickness data on the product surface in real time and feeds it back to the control system. When the film thickness is detected to reach the preset value, the control system can issue a signal prompt or automatically trigger the shutdown procedure to realize real-time monitoring of the deposition thickness.

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