High-reliability precision soldering tin pump

Abstract

The invention discloses a high-reliability precision soldering tin pump which comprises a pump body, a pump shaft, a centrifugal component and a rotation driving motor. Nozzles are arranged at the top of the pump body; the lower end of the pump shaft extends into the pump body, a centrifugal component is fixedly sleeved outside the lower end of the pump shaft, and the upper end of the pump shaft is exposed out of the pump body and is connected with the driving motor to drive the centrifugal component to rotate circumferentially under the control of the driving motor so as to centrifugally pressurize the liquid soldering tin in the pump body and spray the liquid soldering tin from the nozzle; the centrifugal component is a multi-layer centrifugal impeller, a plurality of impeller pieces are evenly arranged on each layer of centrifugal impeller, and the impeller pieces on different layers are distributed in an up-down staggered mode. The device has the advantages that the driving and rotating motor is adopted to replace an electromagnetic driving part, the welding problem caused by magnetic force attenuation is avoided, liquid soldering tin flowing through the device can be centrifugally pressurized in a staggered mode due to the fact that the multiple wheel pieces on different layers are distributed in a vertically staggered mode, when the liquid soldering tin is sprayed out, the liquid flow pressure is stable and not prone to being high or low suddenly, the welding yield is high, and the welding quality is improved. And the heating pipe is arranged outside the tin bath and is not easy to corrode, so that the service life is long.

Description

Technical Field

[0001] This invention relates to the field of soldering equipment technology, and in particular to a high-reliability precision soldering pump. Background Technology

[0002] A solder pump is a device used in soldering processes to handle solder. There are two main categories: solder pumps for soldering and solder pumps for desoldering. The following is a detailed introduction:

[0003] Solder pumps for soldering: These are typically used in the soldering furnace of automatic soldering machines. Their function is to pressurize molten solder and flow it through the nozzle, forming a solder wave for soldering circuit boards. These solder pumps are generally driven by an electromagnetic motor. The height of the solder wave can be controlled by varying the pump's speed, adjusting its height, or a combination of both.

[0004] Solder pump for desoldering: Also known as a desoldering pump or desoldering pump, it is a manual or electric tool mainly used in the field of electronic repair to remove solder from soldered components on circuit boards, so that the components can be disassembled or resoldered. Its structure usually includes a spring-loaded piston mechanism, similar to a syringe. In use, first press the plunger to lock the piston in a specific position, pre-drawing the spring-loaded piston, then use a soldering iron to heat the solder joint to melt the solder, and then press the button to release the piston. The vacuum suction generated by the piston will draw the molten solder into the pump.

[0005] Although the aforementioned solder pump is driven by an electromagnetic motor to create a flowing liquid solder, which is then sprayed through a solder nozzle onto the pins of electronic components and the soldering positions on the PCB board surface for precision soldering, it also has the following drawbacks:

[0006] 1. Poor wave peak stability: The circuit resistance of the conductive electromagnetic pump is affected by the liquid high-temperature metal oxide slag, which in turn affects the circuit current and changes the electrodynamic force, resulting in unstable wave peaks, or even large fluctuations. This makes it easy for the liquid solder flow to fluctuate, so that the soldering yield cannot be guaranteed.

[0007] 2. Magnetism is easily attenuated and lost; some electromagnetic pumps use permanent magnets as magnetic field generators, such as neodymium iron boron magnets, which have a low Curie temperature, approximately 320℃-380℃. However, the working temperature of soldering pumps is usually 80℃-200℃, which is close to the Curie temperature of permanent magnets. Once the external temperature reaches the Curie temperature, the magnetism is easily attenuated and lost, which will cause the electromagnetic pump to fail, making soldering failure more likely.

[0008] 3. Susceptible to solder corrosion; solder is corrosive and can corrode components of the electromagnetic pump, such as ferritic stainless steel heating pipes, which may lead to solder leakage, affecting safety and environmental performance, and making maintenance and replacement complicated and reducing work efficiency.

[0009] 4. High motor heat generation and short lifespan: Some electromagnetic pumps are poorly designed, resulting in high motor heat generation and operating temperatures far exceeding the design temperature. This leads to low efficiency, short service life, and low reliability, and makes it difficult to resolve the contradiction between motor thrust and operating temperature.

[0010] 5. Low energy conversion efficiency; Some single-phase electromagnetic induction pumps use the difference in the magnetic circuit of electromagnets to generate a phase difference to form a moving magnetic field, but most of them are useless pulsating magnetic fields, resulting in serious harmonic components, low electromagnetic conversion efficiency, poor and small electromagnetic force uniformity, and inability to obtain stable high peaks and large peak widths. Most of the electrical energy is converted into eddy current heat energy and coil resistance heating.

[0011] In response, the inventor of this patent, drawing on experience, deeply considered the problems encountered in his work, reviewed a large amount of scientific research data and literature, and gradually conceived and designed this application through a novelty search to solve the relevant technical problems. Summary of the Invention

[0012] This invention aims to at least partially solve one of the technical problems in related technologies. Therefore, the object of this invention is to provide a highly reliable precision solder pump.

[0013] To achieve one of the above objectives, a high-reliability precision soldering pump according to an embodiment of the present invention includes a pump body, a pump shaft, a centrifugal component, and a drive motor;

[0014] The pump body is provided with a nozzle at the top; the lower end of the pump shaft extends into the pump body and the centrifugal component is sleeved on the lower end of the pump shaft; the upper end of the pump shaft is exposed outside the pump body and connected to the drive motor, so as to drive the centrifugal component to rotate circumferentially under the control of the drive motor, so as to centrifugally pressurize the liquid solder in the pump body and make it spray out from the nozzle.

[0015] The centrifugal component is a multi-layer centrifugal impeller, with multiple blades evenly arranged on each layer of the centrifugal impeller, and the multiple blades in different layers are staggered vertically.

[0016] In addition, the high-reliability precision solder pump according to the above embodiments of the present invention may also have the following additional technical features:

[0017] According to one embodiment of the present invention, the pump body includes a pump casing, a solder bath, a solder guide block, and a solder guide tube;

[0018] The nozzle is provided at the top of the pump housing; the solder bath is provided inside the pump housing; the solder guide block is mounted in the middle of the solder bath, and a solder guide cavity is formed inside the solder guide block, a solder inlet is opened on the bottom surface and connected to the first end of the solder guide cavity, a solder outlet is opened on the top surface and connected to the second end of the solder guide cavity, and a pump shaft through-hole is also opened directly above the solder inlet;

[0019] The lower end of the solder guide tube is connected to the solder outlet, and the upper end is detachably connected to the solder nozzle; the lower end of the pump shaft extends into the solder guide cavity through the pump shaft sleeve.

[0020] According to one embodiment of the present invention, the inner diameter of the solder guiding cavity gradually decreases from its first end to its second end, and the first end of the solder guiding cavity is connected to a first solder guiding groove with an inner diameter larger than its inner diameter, and the second end of the solder guiding cavity is connected to a second solder guiding groove with an inner diameter larger than its inner diameter.

[0021] The solder inlet is located at the bottom of the first solder guide groove; the pump shaft through-sleeve is located at the top of the first solder guide groove; the solder outlet is located at the top of the second solder guide groove; and the lower end of the pump shaft extends into the first solder guide groove.

[0022] According to one embodiment of the present invention, the cross-section of the first solder guide groove is formed as a circle;

[0023] The outer diameter of the centrifugal component is smaller than the inner diameter of the first solder guide groove; the axis of the pump shaft is offset from the center point of the first solder guide groove, so that a centrifugal flow channel with a gradually increasing inner diameter is formed between the outer wall of the centrifugal component and the inner wall of the first solder guide groove, and the end of the centrifugal flow channel is connected to the first end of the solder guide cavity.

[0024] According to one embodiment of the present invention, the cross-section of the second solder guide groove is formed as a circle, and its inner diameter is smaller than the inner diameter of the first solder guide groove, but larger than the inner diameter of the solder guide cavity and the inner diameter of the solder guide tube.

[0025] According to one embodiment of the present invention, the pump body further includes a nitrogen gas guide pipe and a nitrogen gas guide shroud with an open upper end;

[0026] Both the solder nozzle and the nitrogen guide shroud are formed into an inverted funnel shape; the nitrogen guide shroud is fixed to the top of the pump housing and sleeved on the lower part of the solder nozzle, with an exhaust gap between its upper opening and the lower outer wall of the solder nozzle, and an air inlet chamber formed between its inner wall and the lower outer wall of the solder nozzle; the nitrogen guide pipe connection end is connected to the outer wall of the nitrogen guide shroud and communicates with the air inlet chamber.

[0027] According to one embodiment of the present invention, the pump body further includes a heating pipe and a heat insulation plate;

[0028] The heating tube is fixedly attached to the outer surface of the tin bath; the heat insulation plate is fixed to the outside of the heating tube to enclose and seal the heating tube.

[0029] According to one embodiment of the present invention, a plurality of heating tubes are fixedly attached to the outer wall and the bottom surface of the tin bath, and a heat insulation plate is fixedly attached to the outside of the plurality of heating tubes.

[0030] According to one embodiment of the present invention, it further includes a drive pulley belt assembly;

[0031] The drive motor is fixed upward outside the pump housing; the upper end of the pump shaft is exposed outside the pump housing; the first end of the transmission wheel assembly is fixed outside the upper shaft of the drive motor, and the second end is fixed outside the upper end of the pump shaft.

[0032] According to one embodiment of the present invention, it further includes a fixed base and a lifting component for controlling the pump housing to drive the nozzle to rise and fall;

[0033] The lifting component is fixed between the bottom of the pump casing and the upper part of the fixed base.

[0034] The beneficial effects of this invention are:

[0035] Firstly, in the specific implementation of the high-reliability precision solder pump provided in this application, the drive motor is used instead of the electromagnetic drive component used in traditional solder pumps, so that there will be no problem with soldering due to the magnetic force attenuation of the electromagnetic drive component, and it is also less likely to cause electromagnetic fluctuations due to voltage fluctuations, so that this application is more stable and reliable in use.

[0036] Secondly, when the liquid solder in the pump body is immersed in the centrifugal component, it can be centrifugally pressurized by the agitation of the multi-layer centrifugal impellers, and then sprayed out from the nozzle for precision soldering of electronic component pins and PCB board surface soldering positions. This application uses a multi-layer centrifugal impeller for the centrifugal component, with multiple impeller blades evenly arranged on each layer, and the blades in different layers are staggered vertically. This allows the drive motor to centrifugally pressurize the liquid solder flowing through it by interlacing the multiple impeller blades when running at high speed, ensuring a continuous and stable spray from the nozzle. This results in stable liquid flow pressure during the spraying process, effectively guaranteeing a high soldering yield.

[0037] Thirdly, because the inner diameter of the solder guide cavity gradually decreases from its first end to its second end, the flow channel space formed inside it also gradually decreases from its first end to its second end. As a result, the liquid solder that has been centrifugally pressurized can be further pressurized when it flows from the first end of the solder guide cavity to its second end, so that it can be squeezed out under high pressure and sprayed out from the nozzle under high pressure, making the application more effective.

[0038] Fourthly, through the optimized design of the above structure, the liquid solder in the solder bath, when immersed into the solder guide cavity through the solder inlet, will be pre-immersed in the centrifugal component. When the centrifugal component rotates rapidly, it can centrifugally pressurize the liquid solder and make it fly away through the centrifugal flow channel with gradually increasing inner diameter, so that it can be driven to quickly enter the solder guide cavity. Thus, in actual use, the liquid solder can be continuously and rapidly centrifugally pressurized and can be rapidly and high-pressure ejected from the nozzle to perform precision soldering on the pins of electronic components and the soldering positions on the PCB board surface, making the application highly efficient in operation and use.

[0039] Fifthly, when using this application, an external nitrogen supply device is connected to the end of the nitrogen gas duct. The nitrogen flowing from the external nitrogen supply device to the nitrogen gas duct can then enter the inlet chamber and be evenly sprayed out from the exhaust gap. Some of the nitrogen can be sprayed downwards into the solder bath. This ensures that when the centrifugally pressurized liquid solder is used for precision soldering of electronic component leads and PCB board surface soldering positions, the evenly sprayed nitrogen can cover the solder surface of the electronic component leads and PCB board surface soldering positions, as well as the surface of the liquid solder in the solder bath. This effectively isolates the solder from air, preventing oxidation and ensuring its good fluidity. It also prevents oxidation of electronic component leads and PCB board surface soldering positions, thus preventing soldering defects. In other words, in actual use, this application, in order to perform precision soldering in the provided nitrogen environment, can better protect the solder, pads, leads, etc., from oxidation during high-temperature soldering, thereby ensuring the strength, reliability, and stability of the solder-substrate connection.

[0040] Sixthly, the heating tube in this application generates heat when energized, transferring the heat through the outer wall of the solder bath to its interior. This allows for better heating of the solder pre-stored in the solder bath, ultimately forming liquid solder. In this process, firstly, because the heating tube is placed outside the solder bath, unlike traditional tubes built into the bath, the heating tube in this application does not come into contact with the solder, making it less susceptible to corrosion and oxidation, thus extending its service life. This, in turn, extends the overall service life of the entire application. Secondly, the heat insulation plate effectively seals and protects the tube from damage by external impacts. The heat insulation plate also provides thermal insulation, ensuring that the heat generated by the heating tube is conducted unidirectionally to the solder bath and the pre-stored solder, resulting in low heat loss and low heat dissipation rate. Therefore, this application achieves high solder heating efficiency.

[0041] Seventhly, upon completion of welding, the pump housing can be controlled by the lifting component to move the nozzle away from the pins of electronic components and the welding position on the PCB board surface, so that when the relevant welding parts need to be transferred after welding, they are not easily hit by the nozzle described in this application, thus making the transfer of the welded product highly reliable.

[0042] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0044] Figure 1 This is a schematic diagram of the overall structure of the high-reliability precision solder pump of the present invention. Figure 1 ;

[0045] Figure 2 This invention relates to a high-reliability precision soldering pump. Figure 1 ;

[0046] Figure 3 This is a schematic diagram of the overall structure of the high-reliability precision solder pump of the present invention. Figure 2 ;

[0047] Figure 4 This invention relates to a high-reliability precision soldering pump. Figure 2 ;

[0048] Figure 5This is a longitudinal sectional view of the high-reliability precision solder pump of the present invention;

[0049] Figure 6 This is a cross-sectional view of the high-reliability precision soldering pump of the present invention;

[0050] Figure label:

[0051] High-reliability precision solder pump 1000;

[0052] Pump body 10;

[0053] Nozzle 10a;

[0054] Pump casing 101;

[0055] Tin bath 102;

[0056] Solder guide block 103;

[0057] Solder flow channel 1031;

[0058] Solder inlet 1032;

[0059] Solder outlet 1033;

[0060] Pump shaft through-sleeve opening 1034;

[0061] First solder flow channel 1035;

[0062] Second solder flow channel 1036;

[0063] Solder guide tube 104;

[0064] Nitrogen gas delivery tube 105;

[0065] Nitrogen gas deflector 106;

[0066] Exhaust clearance 107;

[0067] Intake chamber 108;

[0068] Heating element 109;

[0069] Insulation board 110;

[0070] Card slot 1101;

[0071] Rotary bearing housing 111;

[0072] Pump shaft 20;

[0073] Centrifugal component 30;

[0074] Wheel 301;

[0075] Drive motor 40;

[0076] Centrifugal flow channel 50;

[0077] Drive belt assembly 60;

[0078] Fixed base 70;

[0079] Lifting component 80;

[0080] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0081] The embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0082] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "circumferential," and "radial," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0083] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0084] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0085] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0086] The high-reliability precision solder pump 1000 of the present invention will now be described in detail with reference to the accompanying drawings.

[0087] Reference Figures 1 to 6 As shown;

[0088] The high-reliability precision solder pump 1000 provided according to an embodiment of the present invention includes a pump body 10, a pump shaft 20, a centrifugal component 30, and a drive motor 40;

[0089] The pump body 10 is provided with a nozzle 10a at its top; the lower end of the pump shaft 20 extends into the pump body 10, and the centrifugal component 30 is sleeved on the lower end of the pump shaft 20; the upper end of the pump shaft 20 is exposed outside the pump body 10 and is connected to the drive motor 40, so as to drive the centrifugal component 30 to rotate circumferentially under the control of the drive motor 40, so as to centrifugally pressurize the liquid solder in the pump body 10 and spray it out from the nozzle 10a;

[0090] Furthermore, in comparison Figure 2 , Figure 4 and Figure 5 As shown, the centrifugal component 30 is a multi-layer centrifugal impeller, and each layer of the centrifugal impeller is uniformly provided with multiple blades 301, and the multiple blades 301 in different layers are staggered vertically.

[0091] Based on the above, it is clear that in specific implementation, this application is mainly used as a high-reliability precision solder pump 1000.

[0092] Specifically, when applying this application, the application is assembled according to the structure described above and used. The drive motor 40 drives the pump shaft 20 to rotate, which in turn drives the centrifugal component 30 to rotate. This centrifugally pressurizes the liquid solder in the pump body 10 and causes it to be ejected from the nozzle 10a. In this way, precise soldering can be achieved at the pins of electronic components and the soldering positions on the PCB board surface.

[0093] Clearly, the application of this application will have the following technical effects:

[0094] On the one hand, this application uses the drive motor 40 instead of the electromagnetic drive component used in the traditional solder pump, so that there will be no problem with soldering due to the magnetic force attenuation of the electromagnetic drive component, and it is also less likely to cause electromagnetic fluctuations due to voltage fluctuations, so that this application is more stable and reliable in use.

[0095] On the other hand, when the liquid solder in the pump body 10 is immersed in the centrifugal component 30, it can be centrifugally pressurized by the agitation of the multi-layer centrifugal impellers, and then sprayed out from the nozzle 10a to perform precision soldering on the pins of electronic components and the soldering positions on the PCB board surface. In this application, the centrifugal component 30 is a multi-layer centrifugal impeller, and each layer of the centrifugal impeller is uniformly provided with multiple wheel blades 301. Furthermore, the multiple wheel blades 301 of different layers are staggered vertically. In this way, when the drive motor 40 is running at high speed, it can drive the multiple wheel blades 301 of different layers to centrifugally pressurize the liquid solder flowing through it, so that it can be continuously and stably sprayed out from the nozzle 10a. During the process of the liquid solder being sprayed out, the liquid flow pressure is stable and does not easily fluctuate, so that the soldering yield can be effectively guaranteed.

[0096] Furthermore, through the above-mentioned optimized design, the whole constituted by this application is highly practical and has a good effect in use.

[0097] Furthermore, in specific implementation, we will continue to refer to... Figure 2 , Figure 4 and Figure 5 As shown, according to one embodiment of the present invention, the pump body 10 includes a pump housing 101, a solder bath 102, a solder guide block 103, and a solder guide pipe 104;

[0098] The pump housing 101 is provided with the nozzle 10a at the top; the solder bath 102 is provided inside the pump housing 101; the solder guide block 103 is mounted in the middle of the solder bath 102, and the solder guide block 103 has a solder guide cavity 1031 inside, a solder inlet 1032 connected to the first end of the solder guide cavity 1031 on the bottom surface, a solder outlet 1033 connected to the second end of the solder guide cavity 1031 on the upper surface, and a pump shaft through-hole 1034 located directly above the solder inlet 1032.

[0099] Based on this, in this application, the lower end of the solder guide tube 104 is connected to the solder outlet 1033, and the upper end is detachably connected to the solder nozzle 10a; the lower end of the pump shaft 20 extends into the solder guide cavity 1031 through the pump shaft through-hole 1034, so that the centrifugal component 30 is located in the first end of the solder guide cavity 1031.

[0100] Thus, when the liquid solder in the solder bath 102 is immersed into the solder guide cavity 1031 through the solder inlet 1032, it will be pre-immersed in the centrifugal member 30, and then, under the centrifugal pressure of the centrifugal member 30, it will flow through the second end of the solder guide cavity 1031 to the solder guide tube 104, and then be sprayed out from the nozzle. In this way, precision soldering can be achieved on the pins of electronic components and the soldering positions on the PCB board surface.

[0101] Preferably, in this technical solution, according to an embodiment of the present invention, compared with... Figure 2 and Figure 6 As shown, the inner diameter of the solder guiding cavity 1031 gradually decreases from its first end to its second end, and the first end of the solder guiding cavity 1031 is connected to a first solder guiding groove 1035 with an inner diameter larger than its inner diameter, and the second end of the solder guiding cavity 1031 is connected to a second solder guiding groove 1036 with an inner diameter larger than its inner diameter.

[0102] Based on this, in this application, comparison Figure 2 , Figure 4 and Figure 5 As shown, the solder inlet 1032 is located at the bottom of the first solder guide groove 1035; the pump shaft through-hole 1034 is located at the top of the first solder guide groove 1035; the solder outlet 1033 is located at the top of the second solder guide groove 1036; the lower end of the pump shaft 20 extends into the first solder guide groove 1035 through the pump shaft through-hole 1034, so that the centrifugal component 30 is located inside the first solder guide groove 1035.

[0103] It should be noted that, generally speaking, the outer dimensions of the centrifugal component 30 and the inner diameter of the solder guide tube 104 must be larger than the inner diameter of the solder guide cavity 1031. Therefore, this application connects the first end of the solder guide cavity 1031 to a first solder guide groove 1035 with an inner diameter larger than its inner diameter, and connects the second end of the solder guide cavity 1031 to a second solder guide groove 1036 with an inner diameter larger than its inner diameter. Then, the large-sized centrifugal component 30 can be installed in the first solder guide groove 1035, and the large-sized solder guide tube 104 can be connected to the second solder guide groove 1036.

[0104] Regarding the aforementioned solution of this application, since the inner diameter of the solder guiding cavity 1031 gradually decreases from its first end to its second end, the flow channel space formed within it also gradually decreases from its first end to its second end. As a result, the liquid solder that has been centrifugally pressurized can be further pressurized when it flows from the first end of the solder guiding cavity 1031 to its second end, so that it can be extruded under high pressure and ejected from the nozzle 10a under high pressure, thus making the application more effective.

[0105] Furthermore, in a specific implementation, according to an embodiment of the present invention, the cross-section of the first solder guide groove 1035 is formed as a circle;

[0106] Wherein, the outer diameter of the centrifugal component 30 is smaller than the inner diameter of the first solder guide groove 1035; the axis of the pump shaft 20 is offset from the center point of the first solder guide groove 1035, so that a centrifugal flow channel 50 with a gradually increasing inner diameter is formed between the outer wall of the centrifugal component 30 and the inner wall of the first solder guide groove 1035, and the end of the centrifugal flow channel 50 is connected to the first end of the solder guide cavity 1031.

[0107] In response, through the optimized design of the above structure, the liquid solder in the solder bath 102, when immersed into the solder guide cavity 1031 through the solder inlet 1032, will be pre-immersed in the centrifugal component 30. When the centrifugal component 30 rotates rapidly, it can centrifugally pressurize the liquid solder and make it fly out through the centrifugal flow channel 50 with gradually increasing inner diameter, so that it can be driven to quickly enter the solder guide cavity 1031. Thus, in actual use, the liquid solder can be continuously and rapidly centrifugally pressurized and can be rapidly and high-pressure ejected from the nozzle 10a to perform precision soldering on the pins of electronic components and the soldering positions on the PCB board surface, making the operation efficiency and usage efficiency of this application high.

[0108] Preferably, in this technical solution, according to an embodiment of the present invention, the cross-section of the second solder guide groove 1036 is formed as a circle, and its inner diameter is smaller than the inner diameter of the first solder guide groove 1035, and larger than the inner diameter of the solder guide cavity 1031 and the inner diameter of the solder guide tube 104.

[0109] In this way, the liquid solder is continuously and rapidly centrifugally pressurized and can enter the first solder guide tank 1035 for buffering and caching before being further pressurized by the solder guide tube 104 with a relatively small inner diameter and then ejected from the nozzle 10a under high pressure. This ensures that the liquid solder can be stably and continuously ejected under centrifugal pressure in actual use.

[0110] Furthermore, in specific implementation, in accordance with Figure 1 and Figure 3 As shown, according to an embodiment of the present invention, the pump body 10 further includes a nitrogen gas guide pipe 105 and a nitrogen gas guide shroud 106 with an open upper end;

[0111] The solder nozzle 10a and the nitrogen guide shroud 106 are both formed in an inverted funnel shape. The nitrogen guide shroud 106 is fixed to the top of the pump housing 101 and sleeved on the lower part of the solder nozzle 10a. Its upper opening has an exhaust gap 107 between it and the lower outer wall of the solder nozzle 10a. Its inner wall forms an air inlet chamber 108 between it and the lower outer wall of the solder nozzle 10a. The connecting end of the nitrogen guide pipe 105 is connected to the outer wall of the nitrogen guide shroud 106 and communicates with the air inlet chamber 108.

[0112] It's important to note that during soldering, liquid solder (especially lead-free solder, such as Sn-Ag-Cu alloy) and the metal being soldered (such as copper pads on a PCB or component leads) readily react with oxygen in the air at high temperatures (typically 230-260°C), forming metal oxides (such as CuO and SnO2). These oxides can lead to serious soldering defects, while the inertness of nitrogen (chemically stable and non-reactive) completely solves this problem.

[0113] In this application, a nitrogen supply device is connected to the end of the nitrogen gas duct 105. The nitrogen flowing from the external nitrogen supply device to the nitrogen gas duct 105 can enter the air inlet chamber 108 and then be evenly sprayed out from the exhaust gap 107. Some of the nitrogen can be sprayed downward into the solder bath 102. This ensures that when the centrifugally pressurized liquid solder is used for precision soldering of electronic component leads and PCB board surface soldering positions, the evenly sprayed nitrogen can cover the solder surface of the electronic component leads and PCB board surface soldering positions, as well as the liquid solder surface in the solder bath 102. This effectively isolates the solder from air, prevents solder oxidation, ensures good fluidity, and also prevents oxidation of electronic component leads and PCB board surface soldering positions, thus preventing soldering defects.

[0114] In other words, in actual use, this application can better protect the solder, pads, and leads from oxidation during high-temperature soldering in the provided nitrogen environment for precision welding, thereby ensuring the strength, reliability, and stability of the solder-substrate connection.

[0115] Furthermore, in specific implementation, it is necessary to refer to... Figure 2 and Figure 4 As shown, according to one embodiment of the present invention, the pump body 10 further includes a heating tube 109 and a heat insulation plate 110;

[0116] The heating tube 109 is fixedly attached to the outer surface of the tin bath 102; the heat insulation plate 110 is fixedly attached to the outside of the heating tube 109 to enclose and seal the heating tube 109.

[0117] Preferably, in this technical solution, according to an embodiment of the present invention, multiple heating tubes 109 are fixedly attached to the outer wall and the bottom surface of the tin bath 102, and the heat insulation plate 110 is fixedly attached to the outside of the multiple heating tubes 109.

[0118] In this regard, it is clear that the heating tube 109 in this application generates heat when energized, and transfers the heat through the outer wall of the solder bath 102 to its interior, thus effectively heating the solder pre-stored in the solder bath 102 to form liquid solder. During this process, firstly, since the heating tube 109 is placed outside the solder bath 102, unlike traditional tubes built into the solder bath 102, the heating tube 109 in this application does not come into contact with the solder, making it less susceptible to corrosion and oxidation, resulting in a longer service life. This, in turn, extends the overall service life of the entire application. Secondly, the heat insulation plate 110 provides excellent protection, preventing damage from impacts. The heat insulation plate 110 also acts as a heat insulation barrier, ensuring that the heat generated by the heating tube 109 is only conducted unidirectionally to the solder bath 102 and the pre-stored solder within it, resulting in low heat loss and heat dissipation rates. Therefore, this application achieves high solder heating efficiency.

[0119] Furthermore, in a specific implementation, according to one embodiment of the present invention, this application also includes a transmission pulley belt assembly 60;

[0120] The drive motor 40 is fixed upward outside the pump housing 101; the upper end of the pump shaft 20 is exposed outside the pump housing 101; the first end of the transmission wheel belt assembly 60 is fixed outside the upper shaft of the drive motor 40, and the second end is fixed outside the upper end of the pump shaft 20.

[0121] Preferably, in this technical solution, the drive belt assembly 60 preferably includes a first drive gear fixed to the upper shaft of the drive motor 40, a second drive gear fixed to the upper end of the pump shaft 20, and a drive belt fitted around the first drive gear and the second drive gear.

[0122] Thus, when the drive motor 40 is working, the first transmission gear can drive the drive wheel belt to rotate, and then the rotating drive wheel belt can drive the second transmission gear to rotate, and then the rotating second transmission gear can drive the pump shaft 20 and the centrifugal component 30 fixed to its lower end to rotate. In this way, liquid solder can be centrifugally pressurized so that it can be sprayed out through the nozzle to perform precision soldering on the pins of electronic components and the soldering positions on the PCB board surface.

[0123] It should be added that, in specific implementation, comparison should be made with... Figure 1 and Figure 3 As shown, according to an embodiment of the present invention, this application further includes a fixed base 70 and a lifting member 80 for controlling the pump housing 101 to drive the nozzle 10a to rise and fall;

[0124] The lifting component 80 is fixed between the bottom of the pump housing 101 and the upper part of the fixed base 70. Thus, upon completion of welding, the lifting component 80 can control the pump housing 101 to move the nozzle 10a away from the electronic component pins and the welding position on the PCB board surface. This ensures that when the welded parts need to be moved after welding, they are less likely to be impacted by the nozzle 10a, resulting in high reliability during product transfer.

[0125] In this technical solution, the lifting component 80 is preferably a screw drive linear module, a belt drive linear module, or a cylinder drive linear module, which are common and mature technologies in the prior art. In this application, it can be directly purchased from the market or assembled and used by purchasing accessories. Therefore, its details are not described in detail here.

[0126] Furthermore, in specific implementation, according to the high-reliability precision solder pump 1000 provided in the embodiment of the present invention, a rotating bearing seat 111 is fixedly provided between the pump housing 101 and the solder guide block 103; the pump shaft 20 is rotatably sleeved in the rotating bearing seat 111.

[0127] This ensures the pump shaft 20 is securely fixed, thus optimizing the overall stability of the application.

[0128] Furthermore, in specific implementations, the high-reliability precision solder pump 1000 provided according to the embodiments of the present invention preferably uses a stepper motor 40 to enable precise adjustment of the rotation speed and other parameters, thereby making the soldering speed controllable.

[0129] Furthermore, the inner surface of the heat insulation plate 110 is provided with a mounting groove 1101, and the heating tube 109 at the corresponding position is embedded in the mounting groove 1101, thus making its fixed stability good and not easy to move.

[0130] Other embodiments, etc., will not be described here.

[0131] In summary, the high-reliability precision solder pump 1000 provided in this application, in specific implementation, uses the drive motor 40 instead of the electromagnetic drive component used in traditional solder pumps, so that there will be no problems with soldering due to the magnetic force attenuation of the electromagnetic drive component, and it is also less likely to have electromagnetic fluctuations due to voltage fluctuations, so that this application is more stable and reliable in use.

[0132] Furthermore, when the liquid solder in the pump body 10 is immersed in the centrifugal component 30, it can be centrifugally pressurized by the agitation of the multi-layer centrifugal impellers, and then sprayed out from the nozzle 10a to perform precision soldering on the pins of electronic components and the soldering positions on the PCB board surface. Because this application makes the centrifugal component 30 a multi-layer centrifugal impeller, and each layer of the centrifugal impeller is evenly provided with multiple wheel blades 301, and the multiple wheel blades 301 of different layers are staggered vertically, the drive motor 40 can drive the multiple wheel blades 301 of different layers to centrifugally pressurize the liquid solder flowing through it when it is running at high speed, so that it can be continuously and stably sprayed out from the nozzle 10a. During the process of the liquid solder being sprayed out, the liquid flow pressure is stable and does not easily fluctuate, so as to effectively ensure the soldering yield.

[0133] Furthermore, because the inner diameter of the solder guide cavity 1031 gradually decreases from its first end to its second end, the flow channel space formed inside it also gradually decreases from its first end to its second end. As a result, the liquid solder that has been centrifugally pressurized can be further pressurized when it flows from the first end of the solder guide cavity 1031 to its second end, so that it can be squeezed out under high pressure and ejected from the nozzle 10a under high pressure, making the application more effective.

[0134] Furthermore, through the optimized design of the above structure, the liquid solder in the solder bath 102, when immersed into the solder guide cavity 1031 through the solder inlet 1032, will be pre-immersed in the centrifugal component 30. When the centrifugal component 30 rotates rapidly, it can centrifugally pressurize the liquid solder and make it fly away through the centrifugal flow channel 50 with gradually increasing inner diameter, so that it can be driven to quickly enter the solder guide cavity 1031. Thus, in actual use, the liquid solder can be continuously and rapidly centrifugally pressurized and can be rapidly and high-pressure ejected from the nozzle 10a to perform precision soldering on the pins of electronic components and the soldering positions on the PCB board surface, making the application highly efficient in operation and use.

[0135] Furthermore, when using this application, a nitrogen supply device is connected to the end of the nitrogen gas duct 105. The nitrogen flowing from the external nitrogen supply device to the nitrogen gas duct 105 can enter the air inlet chamber 108 and then be evenly sprayed out from the exhaust gap 107. Some of the nitrogen can be sprayed downward into the solder bath 102. This ensures that when the centrifugally pressurized liquid solder is used for precision soldering of electronic component leads and PCB board surface soldering positions, the evenly sprayed nitrogen can cover the solder surface of the electronic component leads and PCB board surface soldering positions, as well as the liquid solder surface in the solder bath 102. This effectively isolates the air, prevents solder oxidation, ensures good fluidity, and also prevents oxidation of electronic component leads and PCB board surface soldering positions, thus preventing soldering defects. In other words, in actual use, this application can better protect the solder, pads, and leads from oxidation during high-temperature soldering in the provided nitrogen environment for precision welding, thereby ensuring the strength, reliability, and stability of the solder-substrate connection.

[0136] Furthermore, this application provides a heating tube 109. When energized, it generates heat and transfers the heat through the outer wall of the solder bath 102 to its interior, effectively heating the solder pre-stored in the solder bath 102 to form liquid solder. In this process, firstly, since the heating tube 109 is placed outside the solder bath 102, unlike traditional tubes built into the solder bath 102, the heating tube 109 in this application does not come into contact with the solder, making it less susceptible to corrosion and oxidation, thus extending its service life. Consequently, the entire application has a long service life. Secondly, by enclosing and sealing it with the heat insulation plate 110, it is well protected and not easily damaged by external impacts. The heat insulation plate 110 also serves as a heat insulation and heat-blocking agent, ensuring that the heat generated by the heating tube 109 can only be conducted unidirectionally to the solder bath 102 and the pre-stored solder within it, resulting in low heat loss rate and low heat dissipation rate. Therefore, this application has high solder heating efficiency.

[0137] Finally, when the welding is completed, the pump housing 101 can be controlled by the lifting component 80 to move the nozzle 10a away from the electronic component pins and the welding position on the PCB board surface, so that when the relevant welding parts need to be transferred after welding, they are not easily hit by the nozzle 10a of this application, thus making the transfer of the welded product highly reliable.

[0138] Furthermore, the high-reliability precision solder pump 1000 provided in this application is indeed highly practical and has excellent performance, which makes this application inherently valuable for market promotion and will certainly be very popular and effectively popularized.

[0139] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0140] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A high-reliability precision soldering pump, characterized in that, Includes pump body, pump shaft, centrifugal components and drive motor; The pump body is equipped with a nozzle at the top; the lower end of the pump shaft extends into the pump body, and a centrifugal component is fitted over the lower end of the pump shaft; the upper end of the pump shaft is exposed outside the pump body and connected to the drive motor, so that the centrifugal component is rotated circumferentially under the control of the drive motor, so as to centrifugally pressurize the liquid solder in the pump body and spray it out from the nozzle. The centrifugal component is a multi-layer centrifugal impeller, with multiple blades evenly arranged on each layer of the centrifugal impeller, and the multiple blades in different layers are staggered vertically.

2. The high-reliability precision soldering pump according to claim 1, characterized in that, The pump body includes a pump casing, a solder bath, a solder guide block, and a solder guide tube; The top of the pump casing is equipped with a nozzle; the solder bath is located inside the pump casing; the solder guide block is installed in the middle of the solder bath, and a solder guide cavity is formed inside the solder guide block. The bottom surface has a solder inlet that connects to the first end of the solder guide cavity, and the top surface has a solder outlet that connects to the second end of the solder guide cavity. A pump shaft through-sleeve opening is also provided directly above the solder inlet. The lower end of the solder guide tube is connected to the solder outlet, and the upper end is detachably connected to the solder nozzle; the lower end of the pump shaft extends into the solder guide cavity through the pump shaft sleeve.

3. The high-reliability precision soldering pump according to claim 2, characterized in that, The inner diameter of the solder guide cavity gradually decreases from its first end to its second end, and the first end of the solder guide cavity is connected to a first solder guide groove with an inner diameter larger than its inner diameter, and the second end of the solder guide cavity is connected to a second solder guide groove with an inner diameter larger than its inner diameter. The solder inlet is located at the bottom of the first solder guide groove; the pump shaft through-sleeve is located at the top of the first solder guide groove; the solder outlet is located at the top of the second solder guide groove; and the lower end of the pump shaft extends into the first solder guide groove.

4. The high-reliability precision soldering pump according to claim 3, characterized in that, The cross-section of the first solder guide groove is circular; The outer diameter of the centrifugal component is smaller than the inner diameter of the first solder guide groove; the axis of the pump shaft is offset from the center point of the first solder guide groove so that a centrifugal flow channel with a gradually increasing inner diameter is formed between the outer wall of the centrifugal component and the inner wall of the first solder guide groove, and the end of the centrifugal flow channel is connected to the first end of the solder guide cavity.

5. The high-reliability precision soldering pump according to claim 3, characterized in that, The cross-section of the second solder guide groove is circular, and its inner diameter is smaller than that of the first solder guide groove, but larger than that of the solder guide cavity and the solder guide tube.

6. The high-reliability precision soldering pump according to claim 2, characterized in that, The pump body also includes a nitrogen gas delivery pipe and a nitrogen gas flow guide shroud with an open upper end; Both the solder nozzle and the nitrogen guide shroud are shaped like an inverted funnel. The nitrogen guide shroud is fixed to the top of the pump housing and is fitted over the lower part of the solder nozzle. There is an exhaust gap between its upper opening and the lower outer wall of the solder nozzle. An air inlet chamber is formed between its inner wall and the lower outer wall of the solder nozzle. The nitrogen guide pipe is connected to the outer wall of the nitrogen guide shroud and communicates with the air inlet chamber.

7. The high-reliability precision soldering pump according to claim 2, characterized in that, The pump body also includes heating elements and insulation plates; The heating tubes are fixedly attached to the outer surface of the tin bath; the heat insulation plate is fixed to the outside of the heating tubes to enclose and seal them.

8. The high-reliability precision soldering pump according to claim 7, characterized in that, Multiple heating tubes are fixedly attached to the outer wall and bottom surface of the tin bath, and heat insulation plates are fixedly attached to the outside of the multiple heating tubes.

9. The high-reliability precision soldering pump according to claim 2, characterized in that, It also includes drive belt assemblies; The drive motor is fixed upward outside the pump casing; the upper end of the pump shaft is exposed outside the pump casing; the first end of the transmission wheel belt assembly is fixed outside the upper shaft of the drive motor, and the second end is fixed outside the upper end of the pump shaft.

10. The high-reliability precision soldering pump according to claim 2, characterized in that, It also includes a fixed base and a lifting component for controlling the pump housing to drive the nozzle to rise and fall; The lifting component is fixed between the bottom of the pump casing and the upper part of the fixed base.

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