Large-scale non-common-substrate independent module infrared detector splicing device and method

Abstract

The invention discloses a large-scale non-common-substrate independent module infrared detector splicing device and method.The device is arranged on a high-precision 3D shape measuring instrument and comprises a two-dimensional inclination adjusting mechanism, an adapter plate, a detector assembly supporting mechanism and a horizontal splicing adjusting mechanism, and the adapter plate is fixed to the two-dimensional inclination adjusting mechanism; the detector assembly supporting mechanism is arranged on the adapter plate, is configured to be adjustable in height and is used for supporting the detector assembly and adjusting the height of the detector assembly; and the at least two horizontal splicing adjusting mechanisms are configured to move along the X direction and the Y direction of the adapter plate. According to the device and the method, high-precision horizontal splicing of objects such as single modules with different heights, carrying tables and the like can be realized, the splicing forming time can be effectively shortened, and the phenomenon that the single modules are warped due to the fact that the single modules are subjected to tangential force in the splicing process due to insufficient mounting precision of a horizontal adjusting mechanism in the splicing process is effectively solved.

Description

Technical Field

[0001] This invention relates to the field of infrared detector splicing technology, specifically to a large-scale non-common substrate independent module infrared detector splicing device and method. Background Technology

[0002] Infrared detectors require both larger pixel scale and smaller pixel size, making large-scale infrared detectors one of the mainstream development directions. Due to limitations in materials, fabrication processes, readout circuits, and sensitivity specifications, the pixel scale of a single infrared detector chip is difficult to increase further. To meet practical application requirements, multi-detector stacking has become the only way to fabricate large-scale infrared detectors. Stacking multiple small-scale detectors into a large-scale detector necessarily requires high three-dimensional stitching accuracy. Limited by the infrared camera system and the installation accuracy requirements of the stitched large-scale detector, a certain height difference is often required between the detector focal plane and the detector mounting flange, and a certain positioning accuracy is also required between the large-scale detector and the mounting flange. Therefore, rapidly and effectively performing high-precision stacking of multiple modules is a problem that urgently needs to be solved by those skilled in the art.

[0003] CN108007578A discloses an automatic splicing mechanism for large-area infrared array multi-modules. It adopts a two-step splicing method, which first uses push pins to coarsely adjust a single module with the assistance of a projector, so that the splicing accuracy of the single module in the horizontal direction reaches ±50μm. Then, it is moved to another high-precision imager and spliced ​​using an automatic splicing device. Specifically, each single module is connected to seven stepper motors with push rods to realize the three-dimensional movement and rotation of the single module. After the splicing is completed, the single module is fixed by applying glue to obtain the large-area array detector substrate.

[0004] CN103411681A discloses a three-dimensional splicing structure and implementation of an area array infrared detector. It adopts a three-step splicing method. The mechanism is a relatively complex mechanical fine-tuning mechanism, which consists of a three-degree-of-freedom z-axis tilt adjustment mechanism, an xy rotation mechanism, and an xy translation structure. The mounting substrate is adjusted with the assistance of a high-precision projector using this mechanism. Then, single modules are glued to the mounting substrate using other devices. The entire structure is then moved to another high-precision projector for adjustment of single modules. After adjustment, glue is applied to fix the single modules to obtain a large area array detector substrate.

[0005] The aforementioned splicing structures are relatively complex. While the former is an automatic splicing system, each module requires seven electric motors with push rods to achieve three-dimensional movement and rotation. The latter is a manual splicing structure, but its complex structure also requires different mechanisms to achieve the three-dimensional movement and rotation adjustment of each module. Both suffer from cumbersome splicing steps. Therefore, the existing technologies described above cannot meet the requirements for fast, simple, axially adjustable, high-precision positioning of single modules and flanges, and non-common substrate splicing. Summary of the Invention

[0006] To address the aforementioned issues, this invention provides a large-scale non-common substrate independent module infrared detector splicing device and method, which can achieve high-precision horizontal splicing of single modules and platforms of different heights awaiting splicing, effectively shortening the splicing forming time and effectively solving the problem of warping of single modules due to tangential forces during the splicing process caused by insufficient installation accuracy of the horizontal adjustment mechanism.

[0007] A large-scale non-common substrate independent module infrared detector splicing device, mounted on a high-precision 3D topography measuring instrument, comprises:

[0008] Two-dimensional tilt adjustment mechanism;

[0009] The adapter plate is fixed to the two-dimensional tilt adjustment mechanism;

[0010] A detector assembly support mechanism is provided on the adapter plate and is configured to be height adjustable for supporting the detector assembly and adjusting the height of the detector assembly.

[0011] Two or more horizontal splicing adjustment mechanisms are provided on the adapter plate, wherein the installation directions of the two horizontal splicing adjustment mechanisms are different, and they are configured to move along the X and Y directions of the adapter plate; the horizontal splicing adjustment mechanism includes:

[0012] A two-dimensional mobile stage is mounted on the adapter plate;

[0013] A height adjustment platform is mounted on the two-dimensional movable platform;

[0014] A horizontally spliced ​​stress relief bar is installed on the height adjustment platform in a height-adjustable manner;

[0015] The horizontal splicing fixing head has one end movably connected to the horizontal splicing relief rod, and the other end is used to connect to the detector assembly support mechanism or detector module; when the horizontal splicing relief rod moves, it applies a thrust to the horizontal splicing fixing head to push the horizontal splicing fixing head to move.

[0016] Furthermore, the horizontal splicing stress relief bar has a connecting part at one end near the horizontal splicing fixing head, and the connecting part has an open mouth-shaped structure at the top; one end of the horizontal splicing fixing head has an abutting part, and when the horizontal splicing stress relief bar moves, the connecting part applies a pushing force to the abutting part to push the horizontal splicing fixing head to move.

[0017] Furthermore, the two-dimensional moving platform is provided with a first adjusting screw and a second adjusting screw. The first adjusting screw is used to adjust the position of the height adjusting platform in the X direction of the adapter plate; the second adjusting screw is used to adjust the position of the height adjusting platform in the Y direction of the adapter plate.

[0018] Furthermore, the detector assembly support mechanism includes:

[0019] The detector assembly flange is located on the adapter plate;

[0020] A Z-axis support column for the detector assembly is provided on the flange of the detector assembly;

[0021] The detector assembly platform is located above the Z-axis support column of the detector assembly.

[0022] The detector assembly Z-axis adjustment column is located on the detector assembly platform. The detector assembly Z-axis adjustment column is provided in several groups, and each group of detector assembly Z-axis adjustment columns supports one detector module.

[0023] Furthermore, the bolt passes through the detector assembly platform and the detector assembly Z-axis adjustment column from the lower surface of the detector assembly platform and connects to the corresponding threaded hole of the detector module.

[0024] Furthermore, positioning identifiers are provided at the four corners of the detector assembly flange and the detector assembly platform.

[0025] A method for stitching infrared detectors using the aforementioned large-scale non-common substrate independent module infrared detector stitching device includes:

[0026] Step 1: Measure no less than 5 points on the flange surface of the detector assembly using a high-precision 3D topography measuring instrument, and perform surface fitting to obtain the fitting plane A; adjust the two-dimensional tilt adjustment mechanism to ensure that the height difference between it and the fitting plane A meets the requirements.

[0027] Step 2: Use a high-precision 3D topography measuring instrument to identify the flange of the detector assembly, and calculate its center coordinates (x1, y1), as well as the coordinate system A_falan centered on these coordinates;

[0028] Step 3: Fix the Z-axis support column of the detector assembly to the corresponding position of the detector assembly flange, and then fix the detector assembly platform on the Z-axis support column of the detector assembly;

[0029] Step 4: Use a high-precision 3D topography measuring instrument to measure no less than 5 points on the detector assembly platform, perform surface fitting, obtain the fitting plane B, and determine the actual required height of the detector assembly Z-direction support column based on the fitting plane A and the fitting plane B. Then select the detector assembly Z-direction support column of the corresponding height for reassembly.

[0030] Step 5: Use a high-precision 3D topography measuring instrument to identify the detector assembly stage, and calculate the initial center coordinates (x4, y4) of the detector assembly stage, as well as the coordinate system B_falan centered on these coordinates;

[0031] Step 6: Move and / or rotate the detector assembly stage horizontally using the horizontal splicing adjustment mechanism, and use a high-precision 3D topography measuring instrument to measure the real-time center coordinates (x4', y4') of the detector assembly stage and the coordinate system B_zaitai of the detector assembly stage in real time. Calculate the center deviation between the real-time center coordinates (x4', y4') of the detector assembly stage and the center coordinates (x1, y1) of the detector assembly flange, as well as the angular deviation between the coordinate system B_zaitai of the detector assembly stage and the coordinate system A_falan of the detector assembly flange; continue until the center deviation and angular deviation meet the requirements.

[0032] Step 7: Use a high-precision 3D topography measuring instrument to measure the height of the chip surface on the central detector module, fit plane C, calculate the height difference between the fitted plane C and the fitted plane A of the detector assembly flange, and adjust the height of the detector assembly Z-axis adjustment column based on the height difference until the height difference between the fitted plane C and the fitted plane A meets the requirements.

[0033] Step 8: Use a high-precision 3D topography measuring instrument to identify the center detector module, and calculate the center coordinates of the center detector module and the coordinate system C_danmokuai with these coordinates as the center.

[0034] Step 9: Adjust the horizontal splicing adjustment mechanism to connect with the central detector module, and adjust the central detector module using the same method as adjusting the horizontal offset and rotation of the detector assembly platform, so that the offset and rotation of the central detector module meet the requirements.

[0035] Step 10: After assembling the central detector module, assemble the other detector modules in sequence. After all the modules are assembled, use a high-precision 3D topography measuring instrument to re-measure the assembly accuracy of the detector modules. If the requirements are not met, reassemble the detector modules that do not meet the requirements until all detector modules meet the requirements.

[0036] Further, in step 4, the step of determining the actual required height of the Z-axis support column of the detector assembly based on fitting plane A and fitting plane B includes:

[0037] Step 41: Obtain the center coordinates (x2, y2) of the left pillar and the center coordinates (x3, y3) of the right pillar.

[0038] Step 42: Substitute the center coordinates (x2, y2) of the left support pillar into the equations of fitting plane A and fitting plane B to obtain the Z-height value Z. A2 and Z B2 Set the center coordinates of the right pillar to (x3, y3).

[0039] Substituting the center coordinates (x3, y3) of the right support pillar into the equations of fitting plane A and fitting plane B, we obtain the Z-height value Z. A3 and Z B3 ;

[0040] Step 43: Calculate the elevation difference d2=Z respectively. B2 -Z A2 d3=Z B3 -Z A3 Calculate the difference between the heights, d = d3 - d2, and use this difference to determine the height of the Z-direction support columns of the left and right detector components.

[0041] Furthermore, step S4 also includes:

[0042] The angle between fitting plane A and fitting plane B is θ, and the maximum distance d between fitting plane A and fitting plane B is... AB =tan(θ)*L, where L is the length of the detector assembly stage. After reassembling the detector assembly with the Z-axis support column of the appropriate height, the maximum distance d between the fitting plane A and the fitting plane B is... AB Satisfy d AB ≤±5μm.

[0043] Furthermore, in step 6,

[0044] The center deviation between the real-time center coordinates (x4', y4') of the detector assembly stage and the center coordinates (x1, y1) of the detector assembly flange is (x4'-x1, y4'-y1).

[0045] The angular deviation between the coordinate system B_zaitai of the detector assembly stage and the coordinate system A_falan of the detector assembly flange is: .

[0046] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0047] (1) This adopts a stacked splicing structure. The two-dimensional tilt adjustment mechanism can obtain the horizontal reference for the splicing of the detector components, reducing the reduction in axial splicing accuracy caused by the tilt of the reference. The height adjustment platform can adjust the axial position of the horizontal splicing stress relief rod, realizing high-precision horizontal splicing of single modules and carriers of different heights, and realizing high-precision assembly of non-common substrate detector components.

[0048] (2) The use of bolts and adhesive to fix the modules can solve the problems of long waiting time for low-temperature adhesive and the movement of single modules caused by low-temperature adhesive curing, thus improving assembly efficiency.

[0049] (3) The horizontal splicing adjustment mechanism is a snap-lock structure with a force-relieving function, which can effectively reduce the installation difficulty of the splicing mechanism and solve the problem of focal plane warping caused by the non-parallelism between the moving device and the focal plane during the splicing process. Attached Figure Description

[0050] Figure 1 This is a schematic diagram of the large-scale non-common substrate independent module infrared detector splicing device in Example 1;

[0051] Figure 2 This is a diagram of the detector assembly stage assembly structure in Example 1;

[0052] Figure 3 This is a schematic diagram of the two-dimensional tilt adjustment mechanism in Example 1;

[0053] Figure 4 This is a schematic diagram of the forward structure of the horizontal splicing stress relief bar and the horizontal splicing fixing head in Example 1;

[0054] Figure 5 This is a lateral structural diagram of the horizontally spliced ​​stress relief bar and the horizontally spliced ​​fixing head in Example 1;

[0055] Figure 6 This is a schematic diagram of the Z-direction support column of the detector assembly in Example 1.

[0056] Figure label:

[0057] 1-1 Two-dimensional tilt adjustment mechanism; 1-2 adapter plate; 2-1 Two-dimensional moving stage; 2-2 Height adjustment stage; 2-3 Horizontal splicing stress relief bar; 2-4 Horizontal splicing fixing head; 2-5 Detector assembly Z-direction adjustment column; 2-6 Detector assembly Z-direction support column; 3-1 Detector module; 3-2 Detector assembly platform; 3-3 Detector assembly flange. Detailed Implementation

[0058] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings.

[0059] Example 1

[0060] like Figure 1-2 As shown, this embodiment discloses a large-scale non-common substrate independent module infrared detector splicing device, including: a horizontal splicing adjustment mechanism and a two-dimensional tilt adjustment mechanism 1-1, a transition plate 1-2 and a detector assembly support mechanism arranged in a stacked structure from bottom to top, wherein the detector assembly is placed on the detector assembly support mechanism for splicing.

[0061] The two-dimensional tilt adjustment mechanism 1-1 is installed in a high-precision 3D topography measuring instrument, such as... Figure 3 As shown, it includes two wedge-shaped components, one above the other. These two wedge-shaped components are adjusted via two screws 1-1-1, and the tilt is adjusted using the support points of the wedge-shaped components, thus achieving a two-dimensional tilt adjustment function. An adapter plate 1-2 is fixed to the two-dimensional tilt adjustment mechanism 1-1. The detector assembly support mechanism is located on the adapter plate 1-2 and includes, from bottom to top: a detector assembly flange 3-3, a detector assembly Z-direction support column 2-6, a detector assembly platform 3-2, and a detector assembly Z-direction adjustment column 2-5. The detector assembly flange 3-3 is connected to the adapter plate 1-2 by bolts. The detector assembly Z-direction support column 2-6 has two columns, left and right, and is machined at 2μm height intervals to form several detector assembly Z-direction support columns 2-6 of different heights. Similarly, the detector assembly Z-direction adjustment column 2-5 is also machined at 2μm height intervals. Each detector assembly Z-axis adjustment column 2-5 comprises four columns, mounted on the detector assembly platform 3-2, collectively supporting one detector module 3-1. Bolts pass through the detector assembly platform 3-2 and the detector assembly Z-axis adjustment columns 2-5 from the lower surface of the detector assembly platform 3-2 and connect to the corresponding threaded holes of the detector module 3-1. The four corners of the detector assembly flange 3-3, the detector assembly platform 3-2, and the detector module 3-1 are all equipped with etched positioning identifiers for identification and calculation by high-precision 3D topography measuring instruments.

[0062] At least two horizontal splicing adjustment mechanisms are provided, and the installation directions of the two horizontal splicing adjustment mechanisms are not the same. In this embodiment, the installation directions of the two horizontal splicing adjustment mechanisms are the X direction and the Y direction, respectively. Each horizontal splicing adjustment mechanism includes: a two-dimensional moving platform 2-1, a height adjustment platform 2-2, a horizontal splicing stress relief rod 2-3, and a horizontal splicing fixing head 2-4. The two-dimensional moving platform 2-1 is provided on the adapter plate 1-2, and the height adjustment platform 2-2 is provided on the two-dimensional moving platform 2-1. The two-dimensional moving platform 2-1 is provided with a first adjusting screw and a second adjusting screw for fixing the height adjustment platform 2-2 in the X and Y directions. The height adjustment platform 2-2 can be adjusted and fixed by the first adjusting screw and the second adjusting screw. The horizontal splicing stress relief rod 2-3 is set on the height adjustment platform 2-2 in a height-adjustable manner, such as... Figure 4-5 As shown, a connecting part is provided at one end near the horizontal splicing fixing head 2-4, and the connecting part is in the shape of... The structure is shaped like a prism, and the connecting part is formed as follows: Figure 4 The four inner surfaces a, b, c, and d are shown. One end of the horizontal splicing fixing head 2-4 has an abutment part e, which is placed inside the connecting part. Assume it is... Figure 2 The horizontal splicing adjustment mechanism on the left side, when the height adjustment platform 2 moves to the right on the two-dimensional moving platform 2-1, drives the horizontal splicing relief rod 2-3 to move continuously to the right, so that surface a of the horizontal splicing relief rod 2-3 contacts the abutment part e of the horizontal splicing fixing head 2-4. At this time, the horizontal splicing relief rod 2-3 applies a rightward pushing force to the horizontal splicing fixing head 2-4, pushing the horizontal splicing fixing head 2-4 to move to the right. Conversely, when the horizontal splicing relief rod 2-3 moves continuously to the left, the clamp-shaped surface b of the horizontal splicing relief rod 2-3 contacts the horizontal splicing fixing head 2-4. At this time, the horizontal splicing relief rod 2-3 applies a leftward pulling force to the horizontal splicing fixing head 2-4, pulling the horizontal splicing fixing head 2-4 to move to the left, realizing the left and right movement of the detector assembly platform 3-2. Similarly, the horizontal splicing adjustment mechanism in the other direction realizes the up and down movement of the detector assembly platform 3-2; when Figure 2 The a-side of the horizontal splicing relief rod 2-3 of the lower horizontal splicing adjustment mechanism contacts the horizontal splicing fixing head 2-4, allowing it to move. Figure 2 The two-dimensional moving stage 2-1 of the horizontal splicing adjustment mechanism on the left drives the horizontal splicing relief rod 2-3 to move downward, so that the c-face of the horizontal splicing relief rod 2-3 contacts the horizontal splicing fixed head 2-4, realizing the counterclockwise rotation of the detector assembly platform 3-2, and vice versa, realizing the clockwise rotation.

[0063] Specifically, when using this splicing device, firstly, the two-dimensional tilt adjustment mechanism 1-1 is fixed in the high-precision 3D topography measuring instrument, and the two-dimensional tilt adjustment mechanism 1-1 is zeroed. Then, the adapter plate 1-2 is fixed to the two-dimensional tilt adjustment mechanism 1-1 with bolts to form a reference plane. Then, the infrared detector splicing is performed using this large-scale non-common substrate independent module infrared detector splicing device. The specific process includes:

[0064] Step 1: Secure the detector assembly flange 3-3 to the adapter plate 1-2 using bolts. The detector assembly flange 3-3 has dimensions of 260mm × 180mm × 10mm and is made of Kovar alloy. Measure at least 5 points on the surface of the detector assembly flange 3-3 using a high-precision 3D topography measuring instrument and perform surface fitting to obtain the fitting plane A. Then adjust the two-dimensional tilt adjustment mechanism 1-1 to ensure that the height difference between it and the fitting plane A meets the requirements (the height difference should not exceed 5μm).

[0065] Step 2: Use a high-precision 3D topography measuring instrument to identify the positioning identifiers on the detector assembly flange 3-3, and calculate its center coordinates (x1, y1), as well as the coordinate system A_falan with these coordinates as the center, the line connecting the centers of the left and right identifiers as the x-axis, the line connecting the centers of the upper and lower identifiers as the y-axis, and the normal to the fitted plane as the z-axis.

[0066] Step 3: Fix the Z-axis support column 2-6 of the detector assembly to the corresponding position of the flange 3-3 of the detector assembly, and then fix the stage 3-2 of the detector assembly to the Z-axis support column 2-6 of the detector assembly.

[0067] Step 4: Measure at least 5 points on the detector assembly stage 3-2 using a high-precision 3D topography measuring instrument, perform surface fitting to obtain the fitting plane B, and determine the actual required height of the Z-direction support column 2-6 of the detector assembly based on the fitting plane A and the fitting plane B; the steps for determining the actual required height of the Z-direction support column of the detector assembly based on the fitting plane A and the fitting plane B include:

[0068] Step 41: The coordinates of the left and right detector components Z-direction support columns 2-6 in coordinate system A_falan are: left column center coordinates (x2, y2) and right column center coordinates (x3, y3).

[0069] Step 42: Substitute the center coordinates (x2, y2) of the left support pillar into the equations of fitting plane A and fitting plane B to obtain the Z-height value Z. A2 and Z B2 Set the center coordinates of the right pillar to (x3, y3).

[0070] Substituting the center coordinates (x3, y3) of the right support pillar into the equations of fitting plane A and fitting plane B, we obtain the Z-height value Z. A3 and Z B3 ;

[0071] Step 43: Calculate the elevation difference d2=Z respectively. B2 -Z A2 d3=Z B3 -Z A3 Calculate the height difference d = d3 - d2, and use this difference to determine the height of the Z-axis support columns for the left and right detector components. For example, keep the Z-axis support column 2-6 of the left detector component unchanged, and change the height of the Z-axis support column 2-6 of the right detector component to its original height plus d. Then, select the support column 2-6 with the closest detector component's Z-axis height and reassemble it until the maximum distance d between the fitting plane A and the fitting plane B is reached. AB Satisfy d AB ≤±5μm. The angle between fitting plane A and fitting plane B is θ, and the maximum distance d between fitting plane A and fitting plane B is... AB=tan(θ)*L, where L is the length of the detector assembly stage 3-2.

[0072] Step 5: Use a high-precision 3D topography measuring instrument to identify the positioning identifiers on the detector assembly stage 3-2, and calculate the initial center coordinates (x4, y4) of the detector assembly stage 3-2, as well as the coordinate system B_falan with these coordinates as the center, the line connecting the centers of the left and right identifiers as the x-axis, the line connecting the centers of the upper and lower identifiers as the y-axis, and the normal to the fitted plane as the z-axis.

[0073] Step 6: Move and / or rotate the detector assembly stage 3-2 horizontally using the horizontal splicing adjustment mechanism. Utilize a high-precision 3D topography measuring instrument to measure the real-time center coordinates (x4', y4') of the detector assembly stage 3-2 and its coordinate system B_zaitai. Calculate the center deviation between the real-time center coordinates (x4', y4') and the center coordinates (x1, y1) of the detector assembly flange, and the angular deviation between the coordinate system B_zaitai of the detector assembly stage and the coordinate system A_falan of the detector assembly flange. Continue until the center deviation and angular deviation meet the requirements. The center deviation between the real-time center coordinates (x4', y4') and the center coordinates (x1, y1) of the detector assembly flange is (x4'-x1, y4'-y1). The angular deviation between the coordinate system B_zaitai of the detector assembly stage and the coordinate system A_falan of the detector assembly flange is: Continue until the requirements are met (center deviation of 3μm, angle deviation of ±0.5′), then apply fastening adhesive to the fastening bolts of the detector assembly Z-axis support column 2-6 and the detector assembly stage 3-2 to increase stability.

[0074] Step 7: Module assembly. The assembly sequence is to start from the central detector module and assemble outwards. Use a high-precision 3D topography measuring instrument to measure the height (h1, h2, h3, h4) of the small area around the four through holes on the stage 3-2 where the central detector module is placed. Select four detector component Z-axis adjustment columns 2-5 of appropriate height and place them on the four through holes so that the upper surfaces of the four detector component Z-axis adjustment columns 2-5 have the same height. Align the detector component Z-axis adjustment columns 2-5 with the corresponding through holes on the detector component stage 3-2. Place the single detector module 3-1 on the detector component Z-axis adjustment columns 2-5 and use bolts to pass through the through holes of the detector component stage 3-2 and the detector component Z-axis adjustment columns 2-5 and the corresponding threaded holes of the single detector module 3-1 from the lower surface of the detector component stage 3-2.

[0075] The height of the chip surface on the central detector module is measured using a high-precision 3D topography measuring instrument. A fitting plane C is then established, and the height difference between the fitting plane C and the fitting plane A of the detector assembly flange 3-3 is calculated. This height difference calculation method is similar to that in step 4 and will not be repeated here. Then, based on this height difference, a suitable detector assembly is selected, and the Z-axis column 2-5 is adjusted until the height difference between the fitting plane C and the fitting plane A meets the requirement (height difference not greater than 5μm), and the average height difference between the fitting plane C of all single modules and the fitting plane A of the detector assembly flange 3-3 meets the requirement (70±0.5mm).

[0076] Step 8: Use a high-precision 3D topography measuring instrument to identify the positioning identifier on the center detector module, calculate the center coordinates of the center detector module and the coordinate system C_danmokuai with the coordinates as the center, the line connecting the centers of the left and right identifiers as the x-axis, the line connecting the centers of the top and bottom identifiers as the y-axis, and the normal of the fitted plane as the z-axis.

[0077] Step 9: Adjust the horizontal splicing adjustment mechanism to connect with the central detector module, and adjust the central detector module using the same method as adjusting the horizontal offset and rotation of the detector assembly platform 3-2, so that the offset and rotation of the central detector module meet the requirements.

[0078] Step 10: After assembling the central detector module, assemble the other detector modules in sequence. After all the modules are assembled, use a high-precision 3D topography measuring instrument to re-measure the assembly accuracy of the detector modules. If the requirements are not met, reassemble the detector modules that do not meet the requirements until all detector modules meet the requirements.

[0079] The above examples illustrate the present invention only to aid in understanding it and are not intended to limit the scope of the invention. Those skilled in the art can make various simple deductions, modifications, or substitutions based on the principles of this invention.

Claims

1. A large-scale non-common substrate independent module infrared detector splicing device, characterized in that, include: Two-dimensional tilt adjustment mechanism (1-1); The adapter plate (1-2) is fixed on the two-dimensional tilt adjustment mechanism (1-1); A detector assembly support mechanism is provided on the adapter plate (1-2) and is configured to be height adjustable for supporting the detector assembly and adjusting the height of the detector assembly. Two or more horizontal splicing adjustment mechanisms are provided on the adapter plate (1-2), wherein the installation directions of the two horizontal splicing adjustment mechanisms are not the same, and they are configured to move along the X and Y directions of the adapter plate (1-2); the horizontal splicing adjustment mechanism includes: A two-dimensional moving stage (2-1) is mounted on the adapter plate (1-2); A height adjustment platform (2-2) is mounted on the two-dimensional moving platform (2-1); A horizontally connected stress relief bar (2-3) is installed on the height adjustment platform (2-2) in a height-adjustable manner. The horizontal splicing fixing head (2-4) is movably connected at one end to the horizontal splicing stress relief rod (2-2), and the other end is used to connect to the detector assembly support mechanism or detector module; when the horizontal splicing stress relief rod (2-3) moves, it applies a thrust to the horizontal splicing fixing head (2-4) to push the horizontal splicing fixing head (2-4) to move.

2. The large-scale non-common substrate independent module infrared detector splicing device as described in claim 1, characterized in that, The horizontal splicing stress relief bar (2-3) has a connecting part at one end near the horizontal splicing fixing head (2-4), and the connecting part has an open mouth-shaped structure at the top; one end of the horizontal splicing fixing head (2-4) has an abutment part (e), and when the horizontal splicing stress relief bar (2-3) moves, the connecting part applies a pushing force to the abutment part (e) to push the horizontal splicing fixing head (2-4) to move.

3. The large-scale non-common substrate independent module infrared detector splicing device as described in claim 1, characterized in that, The two-dimensional moving stage (2-1) is provided with a first adjusting screw and a second adjusting screw. The first adjusting screw is used to adjust the position of the height adjusting stage (2-2) in the X direction of the adapter plate (1-2); the second adjusting screw is used to adjust the position of the height adjusting stage (2-2) in the Y direction of the adapter plate (1-2).

4. The large-scale non-common substrate independent module infrared detector splicing device as described in claim 1, characterized in that, The detector assembly support mechanism includes: The detector assembly flange (3-3) is located on the adapter plate (1-2); The detector assembly Z-axis support column (2-6) is provided on the detector assembly flange (3-3); The detector assembly stage (3-2) is located above the Z-direction support column (2-6) of the detector assembly; The detector assembly Z-axis adjustment column (2-5) is located on the detector assembly platform (3-2). The detector assembly Z-axis adjustment column (2-5) is provided in several groups, and each group of detector assembly Z-axis adjustment columns (2-5) supports a detector module (3-1).

5. The large-scale non-common substrate independent module infrared detector splicing device as described in claim 4, characterized in that, The bolt passes through the detector assembly platform (3-2) and the detector assembly Z-axis adjustment column (2-5) from the lower surface of the detector assembly platform (3-2) and connects to the corresponding threaded hole of the detector module (3-1).

6. The large-scale non-common substrate independent module infrared detector splicing device as described in claim 4 or 5, characterized in that, Positioning identifiers are provided at the four corners of the detector assembly flange (3-3) and the detector assembly platform (3-2).

7. A method for splicing infrared detectors using the large-scale non-common substrate independent module infrared detector splicing device according to any one of claims 4-6, characterized in that, include: Step 1: Measure no less than 5 points on the flange surface of the detector assembly using a high-precision 3D topography measuring instrument, and perform surface fitting to obtain the fitting plane A; adjust the two-dimensional tilt adjustment mechanism to ensure that the height difference between it and the fitting plane A meets the requirements. Step 2: Use a high-precision 3D topography measuring instrument to identify the flange of the detector assembly, and calculate its center coordinates (x1, y1), as well as the coordinate system A_falan centered on these coordinates; Step 3: Fix the Z-axis support column of the detector assembly to the corresponding position of the detector assembly flange, and then fix the detector assembly platform on the Z-axis support column of the detector assembly; Step 4: Use a high-precision 3D topography measuring instrument to measure no less than 5 points on the detector assembly platform, perform surface fitting, obtain fitting plane B, and determine the actual required height of the detector assembly Z-direction support column based on fitting plane A and fitting plane B. Then select the detector assembly Z-direction support column of the corresponding height for reassembly, and apply fastening adhesive to the detector assembly Z-direction support column and detector assembly flange fastening bolts. Step 5: Use a high-precision 3D topography measuring instrument to identify the detector assembly stage, and calculate the initial center coordinates (x4, y4) of the detector assembly stage, as well as the coordinate system B_falan centered on these coordinates; Step 6: Move and / or rotate the detector assembly stage horizontally using the horizontal splicing adjustment mechanism, and use a high-precision 3D topography measuring instrument to measure the real-time center coordinates (x4', y4') of the detector assembly stage and the coordinate system B_zaitai of the detector assembly stage in real time. Calculate the center deviation between the real-time center coordinates (x4', y4') of the detector assembly stage and the center coordinates (x1, y1) of the detector assembly flange, as well as the angular deviation between the coordinate system B_zaitai of the detector assembly stage and the coordinate system A_falan of the detector assembly flange; continue until the center deviation and angular deviation meet the requirements. Step 7: Use a high-precision 3D topography measuring instrument to measure the height of the chip surface on the central detector module, fit plane C, calculate the height difference between the fitted plane C and the fitted plane A of the detector assembly flange, and adjust the height of the detector assembly Z-axis adjustment column based on the height difference until the height difference between the fitted plane C and the fitted plane A meets the requirements. Step 8: Use a high-precision 3D topography measuring instrument to identify the center detector module, and calculate the center coordinates of the center detector module and the coordinate system C_danmokuai with these coordinates as the center. Step 9: Adjust the horizontal splicing adjustment mechanism to connect with the central detector module, and adjust the central detector module using the same method as adjusting the horizontal offset and rotation of the detector assembly platform, so that the offset and rotation of the central detector module meet the requirements. Step 10: After assembling the central detector module, assemble the other detector modules in sequence. After all the modules are assembled, use a high-precision 3D topography measuring instrument to re-measure the assembly accuracy of the detector modules. If the requirements are not met, reassemble the detector modules that do not meet the requirements until all detector modules meet the requirements. Finally, apply fastening glue to the bolts of the Z-axis adjustment column of the detector assembly.

8. The method as described in claim 7, characterized in that, In step 4, the step of determining the actual required height of the Z-axis support column of the detector assembly based on fitting plane A and fitting plane B includes: Step 41: Obtain the center coordinates (x2, y2) of the left pillar and the center coordinates (x3, y3) of the right pillar. Step 42: Substitute the center coordinates (x2, y2) of the left support pillar into the equations of fitting plane A and fitting plane B to obtain the Z-height value Z. A2 and Z B2 Set the center coordinates of the right pillar to (x3, y3). Substituting the center coordinates (x3, y3) of the right support pillar into the equations of fitting plane A and fitting plane B, we obtain the Z-height value Z. A3 and Z B3 ; Step 43: Calculate the elevation difference d2=Z respectively. B2 -Z A2 d3=Z B3 -Z A3 Calculate the difference between the heights, d = d3 - d2, and use this difference to determine the height of the Z-direction support columns of the left and right detector components.

9. The method as described in claim 7, characterized in that, Step S4 also includes: The angle between fitting plane A and fitting plane B is θ, and the maximum distance d between fitting plane A and fitting plane B is... AB =tan(θ)*L, where L is the length of the detector assembly stage. After reassembling the detector assembly with the Z-axis support column of the appropriate height, the maximum distance d between the fitting plane A and the fitting plane B is... AB Satisfy d AB ≤±5μm.

10. The method as described in claim 8, characterized in that, In step 6, The center deviation between the real-time center coordinates (x4', y4') of the detector assembly stage and the center coordinates (x1, y1) of the detector assembly flange is (x4'-x1, y4'-y1). The angular deviation between the coordinate system B_zaitai of the detector assembly stage and the coordinate system A_falan of the detector assembly flange is: .

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