Temperature detection assembly, temperature detection device and server

Abstract

The invention discloses a temperature detection assembly, a temperature detection device and a server, and relates to the technical field of servers. Wherein the temperature detection assembly comprises a heat insulation part, a heat conduction part and a temperature detection part, the heat conduction part and the heat insulation part are arranged, the heat insulation part forms a heat insulation channel, and heat conduction interference during temperature detection is reduced; when the temperature detection assembly is in a compressed state, the first heat conduction part and the second heat conduction part are in surface contact from point contact, and the heat conduction efficiency is improved. The temperature detection device comprises a heat conduction base, temperature detection assemblies and a signal connecting piece, the temperature detection assemblies arranged in an array mode are arranged at installation positions formed in the heat conduction base, temperature distribution of the surface of a to-be-detected piece can be measured, and the temperature detection device can be used in cooperation with a radiator; through the stretching deformation of the signal connecting piece, the temperature detection device still keeps the relative position precision after being pressed, and the temperature measurement error caused by deformation is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of servers, and in particular to a temperature detection assembly, a temperature detection device and a server. BACKGROUND

[0002] With the continuous growth of the power consumption of electronic equipment, the local hotspot temperature of the heat generating device in the electronic equipment also rises, and the heat resistance control ability and temperature uniformity of the heat generating device are concerned. In the research and development and testing stage of the heat generating device, the surface temperature distribution thereof needs to be monitored in real time to optimize the heat dissipation design.

[0003] In the related art, a non-contact infrared thermal imaging detection technology is used to generate a temperature cloud map by capturing infrared radiation on the surface of the heat generating device, but only transient temperature detection can be performed, and long-term stable detection cannot be performed; a contact temperature sensor is used for detection, which is easily disturbed by heat conduction. SUMMARY

[0004] The present application provides a temperature detection assembly, a temperature detection device and a server to at least solve the problems of difficulty in long-term stable temperature detection and temperature detection results being easily disturbed by heat conduction in the related art.

[0005] In a first aspect, an embodiment of the present application provides a temperature detection assembly, comprising: a heat insulation member, the heat insulation member being a deformation member, and the heat insulation member forming a heat insulation channel; a heat conduction member, the heat conduction member being a deformation member, and the heat conduction member having the same deformation direction as the heat insulation member, the heat conduction member being located in the heat insulation channel, and a gap being formed between the heat conduction member and the heat insulation member; an end portion of the deformation direction of the heat conduction member being used for thermal conduction with a to-be-detected member; and a temperature detection member, the temperature detection member being arranged in the heat insulation member and being used for detecting heat conducted to the heat conduction member.

[0006] In a second aspect, an embodiment of the present application provides a temperature detection device, comprising: a heat conduction base; the temperature detection assembly described above, a plurality of temperature detection assemblies being arranged in an array and being installed on the heat conduction base; the heat conduction member of the temperature detection assembly being in thermal conduction with the heat conduction base; and a signal connection member, the signal connection member connecting temperature detection members of at least two temperature detection assemblies.

[0007] In a third aspect, an embodiment of the present application further provides a server, comprising an electronic element and the temperature detection device described above, and the electronic element being in thermal conduction with the heat conduction base of the temperature detection device.

[0008] The temperature detection assembly, the temperature detection device and the server are provided in the embodiments of the present application. In the temperature detection assembly, the heat insulation member is arranged, the heat insulation channel is formed in the heat insulation member, the heat conduction path along the X-Y plane can be effectively blocked, the heat conduction in the Z-axis direction is reserved, the interference of the heat conduction in the X-Y plane on the temperature of the measuring point is reduced, and the measurement accuracy is improved. The heat conduction efficiency is improved, and long-term stable detection can be realized.

[0009] In the temperature detection device, the mounting positions arranged at intervals in an array are arranged on the heat conduction base, and the plurality of temperature detection assemblies are one-to-one mounted on the mounting positions of the heat conduction base, so that the temperature distribution on the surface of the to-be-detected member can be detected, and the temperature detection device can be used in cooperation with the heat sink. The signal connecting member connects at least two temperature detection assemblies, and the relative position accuracy of the temperature detection device is maintained after being pressed by the deformation of the signal connecting member, and the temperature measurement error caused by the deformation is reduced.

[0010] In the server, the temperature detection assembly and the temperature detection device are used, so that the server has at least the beneficial effects of the temperature detection assembly and the temperature detection device. BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present application, the drawings required in the embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0012] Figure 1 The structural schematic diagram of the temperature detection assembly provided in the embodiments of the present application is shown in the figure.

[0013] Figure 2 The structural schematic diagram of the first state of the heat insulation member and the heat conduction member of the temperature detection assembly provided in the embodiments of the present application is shown in the figure.

[0014] Figure 3 The structural schematic diagram of the second state of the heat insulation member and the heat conduction member of the temperature detection assembly provided in the embodiments of the present application is shown in the figure.

[0015] Figure 4 The structural schematic diagram of the temperature detection device provided in the embodiments of the present application is shown in the figure.

[0016] Figure 5 The structural schematic diagram of the heat conduction base of the temperature detection device provided in the embodiments of the present application is shown in the figure.

[0017] Figure 6A structural schematic view of a signal connecting piece of the temperature detection device provided by the embodiment of the present application;

[0018] Figure 7 A structural schematic view of another signal connecting piece of the temperature detection device provided by the embodiment of the present application;

[0019] Figure 8 A structural schematic view of a signal output piece of the temperature detection device provided by the embodiment of the present application.

[0020] The above-mentioned drawings include the following reference signs:

[0021] 100, temperature detection assembly; 110, heat insulation piece; 120, interval; 121, middle part; 122, first end part; 123, second end part; 130, heat conduction piece; 131, first heat conduction part; 132, second heat conduction part; 140, temperature detection piece; 141, detection part; 142, transmission part; 200, temperature detection device; 210, heat conduction base; 211, mounting position; 212, heat insulation structure; 220, signal connecting piece; 221, connecting channel; 230, signal output piece. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0023] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case of the described case, and the approximate case is within the acceptable deviation range, wherein the acceptable deviation range is determined by the ordinary skilled person considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, wherein the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, wherein the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, less than or equal to 5% of either of the two. The terms "first" and "second" and the like are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. The specific meaning of the above terms in the present application can be understood in specific cases by the ordinary skilled person.

[0024] First, the terms involved in the present application are explained:

[0025] Seebeck effect: refers to the phenomenon that when two different conductors or semiconductor materials are connected to form a closed loop, when the temperature of the two junctions is different, a continuous potential difference is generated in the loop to form an electric current, so that heat energy is converted into electrical energy.

[0026] In the related art, the surface temperature of a heating device in an electronic device is detected by using non-contact infrared thermal imaging detection technology or contact flexible temperature sensors or thermocouples. The infrared thermal imaging detection technology can only detect temperature instantaneously and cannot detect temperature stably for a long time. The flexible temperature sensor has ductility, but the deformation direction after being pressed will affect the measurement error and the flexible temperature sensor is also susceptible to heat conduction interference. The thermocouple can only measure a single point and cannot measure the surface temperature distribution of the heating device, and the measurement range is limited. In addition, the above detection methods cannot be used in cooperation with a heat-conducting interface material and a heat sink, and have limitations.

[0027] Therefore, the embodiments of the present application provide a temperature detection assembly, a temperature detection device and a server. The temperature detection assembly includes a heat insulation member, a heat conduction member and a temperature detection member. The heat insulation member and the heat conduction member are both deformation members. The heat insulation member forms a heat insulation channel. The heat conduction member is located in the heat insulation channel and is spaced apart from the heat insulation member. By providing the heat insulation member, the heat insulation channel is formed. The heat insulation member and the heat insulation channel cooperate to effectively block the heat conduction path in the X-Y plane and retain the heat conduction in the Z-axis direction, thereby reducing the interference of heat conduction in the X-Y plane on the temperature of the measurement point and improving the measurement accuracy. By providing the heat conduction member in the heat insulation channel, when the temperature detection assembly is in a compressed state, the two heat conduction members realize point contact to surface contact, the contact area is increased, and stable contact is formed, which not only improves the heat conduction efficiency but also enables long-term stable detection.

[0028] The temperature detection device includes a heat conduction base, a temperature detection device and a signal connecting member. The heat conduction base is provided with mounting positions arranged in an array and spaced apart. A plurality of temperature detection assemblies are installed one by one in the mounting positions. The signal connecting member connects at least two temperature detection assemblies. By providing a plurality of mounting positions arranged in an array and spaced apart on the heat conduction base, a plurality of temperature detection assemblies are installed one by one in the mounting positions of the heat conduction base, which can realize detection of the temperature distribution on the surface of the to-be-detected member and can be used in cooperation with a heat sink. The signal connecting member connects at least two temperature detection assemblies. By deforming the signal connecting member, the temperature detection device still maintains relative positional accuracy after being pressed, thereby reducing the temperature measurement error caused by deformation.

[0029] In order for those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0030] In a first aspect, with reference to Figure 1As shown, the embodiment of the present application provides a temperature detection assembly 100, which comprises a heat insulation member 110, a heat conduction member 130 and a temperature detection member 140, wherein the heat insulation member 110 is a deformation member, and the heat insulation member 110 is formed with a heat insulation channel; the heat conduction member 130 is a deformation member, and the heat conduction member 130 has the same deformation direction as the heat insulation member 110, the heat conduction member 130 is located in the heat insulation channel, and a gap 120 is formed between the heat conduction member 130 and the heat insulation member 110, and the end of the deformation direction of the heat conduction member 130 is used for thermal conduction with a to-be-detected member; and the temperature detection member 140 is arranged in the heat insulation member 110 and is used for detecting the heat conducted to the heat conduction member 130.

[0031] In the embodiment of the present application, the heat insulation member 110 extends along the Z-axis direction, which can prevent the heat conduction in the X-Y plane and support the structure of the temperature detection assembly to prevent the core heat conduction area from being deformed asymmetrically when being pressed, so as to affect the measurement accuracy and precision. The heat insulation member 110 has a ring structure, and the middle region is formed with a heat insulation channel extending along the Z-axis direction. The heat insulation member 110 and the heat insulation channel jointly prevent the heat conduction in the X-Y plane of the temperature detection assembly 100, so as to affect the accuracy of temperature detection of the measurement region. For example, the heat insulation member 110 can be heat insulation bubble cotton or heat insulation gel. The heat insulation bubble cotton is a closed or open structure foam material formed by polymer foaming, and the heat insulation gel can use polydimethylsiloxane gel, which is a kind of organic silicon material with low cross-linking density and semi-solid gel state, and has good elasticity and high temperature resistance. After deformation, it is easy to recover and can effectively adapt to the high heat of the to-be-detected member and the compression deformation of the temperature detection assembly 100.

[0032] In the embodiment of the present application, the heat conduction member 130 is arranged in the heat insulation channel and is used for conducting the heat from the to-be-detected member, so that the temperature detection member 140 arranged in the heat conduction member 130 is detected. For example, the heat conduction member 130 can use a heat conduction pad with good resilience, and specifically can use a carbon fiber heat conduction pad. Since the carbon fiber heat conduction pad has very strong heat conduction anisotropy, it has very high thermal conductivity in the Z-axis direction, and the thermal conductivity in the X-Y plane is low. Therefore, the use of the carbon fiber heat conduction pad can reduce the temperature measurement error caused by the heat conduction of the measurement point temperature in the X-Y plane, and improve the heat conduction efficiency.

[0033] It can be understood that the heat insulation member 110 is arranged around the heat conduction member 130, and the gap 120 is formed between the inner wall of the heat insulation member 110 and the heat conduction member 130 (for example, the gap 120 is filled with air). Figure 2As shown in the figure, the interval 120 can be filled with air or argon gas, which is a gaseous heat insulation medium, further to insulate heat conduction in the X-Y plane. The size of the interval 120 needs to consider the compression rate of the temperature detection assembly 100 when it is compressed, for example, the X-Y size before compression can be 100-300 μm, and the interval 120 still exists after compression (as shown in the figure) Figure 3 The X-Y size after compression can be 50-150 μm. At this time, the temperature detection assembly 100 is in a compressed state, so that the heat conduction in the X-Y plane can be effectively insulated after compression, so that the spot temperature reflects the local thermal state of the detected member.

[0034] In other embodiments, an elastic heat insulation layer can be arranged in the interval between the heat conduction member 130 and the heat insulation member 110, to increase the heat insulation effect in the X-Y plane, and the elastic heat insulation layer can be deformed synchronously when compressed, and can also play a heat insulation effect after compression. For example, the elastic heat insulation layer can be multi-layered, and the multi-layered elastic heat insulation layer is sleeved along the X-Y direction, so that a plurality of intervals are formed between adjacent heat insulation layers, and different low-conductivity gases are filled in the plurality of intervals, to further enhance the heat insulation effect and effectively improve the heat conduction blocking rate in the X-Y plane.

[0035] It should be noted that the extension direction of the X-Y plane is perpendicular to the compression direction of the temperature detection assembly 100, and the Z-axis direction is the compression direction of the temperature detection assembly 100.

[0036] As an implementable embodiment, along the deformation direction of the heat insulation member 110, the heat insulation channel has a middle part 121 and two end parts located on opposite sides of the middle part 121; along the middle part 121 to the end part, the channel size of the heat insulation channel has an increasing trend; and in the heat insulation channel, at least the middle part 121 and the opposite position of the heat conduction member 130 form an interval 120.

[0037] For example, the channel size of the middle part 121 of the heat insulation channel to the end part of the heat insulation channel has an increasing trend, specifically, the channel size of the heat insulation channel gradually increases along the middle part 121 to the end part, so that the inner wall surface of the heat insulation member 110 is inclined, which helps to reduce the transverse shear stress when compressed, provides smooth stress transition, and reduces material damage of the heat insulation member 110 caused by stress concentration. In the embodiment of the present application, the end part of the side of the heat insulation channel close to the detected member is a first end part 122, and the end part of the side away from the detected member is a second end part 123.

[0038] As an implementable embodiment, the cross-sectional area of the heat-conducting member 130 at the middle portion 121 is smaller than the cross-sectional area of the heat-conducting member 130 at the end portion; the cross-section of the heat-conducting member 130 is perpendicular to the deformation direction of the heat-conducting member 130; when the heat-conducting member 130 is compressed along the deformation direction, the cross-sectional area of the heat-conducting member 130 at the middle portion 121 increases.

[0039] As an implementable embodiment, the heat-conducting member 130 comprises a first heat-conducting portion 131 and a second heat-conducting portion 132 connected to each other, the first heat-conducting portion 131 is located from the middle portion 121 to one end portion of the heat-insulating channel, and the second heat-conducting portion 132 is located from the middle portion 121 to the other end portion of the heat-insulating channel; the connection between the first heat-conducting portion 131 and the second heat-conducting portion 132 is located at the middle portion 121 of the heat-insulating channel; along the direction from the middle portion 121 to the end portion, the cross-sectional area of the first heat-conducting portion 131 and / or the second heat-conducting portion 132 has a trend of increasing.

[0040] Exemplarily, the number of the heat-conducting member 130 can be multiple, in the embodiment of the present application, the number of the heat-conducting member 130 is 2, which are the first heat-conducting portion 131 and the second heat-conducting portion 132, and both are correspondingly arranged in the heat-insulating channel, and the shape is a conical structure. The heat-conducting member 130 located in the channel from the middle portion 121 to the first end portion 122 of the heat-insulating channel is the first heat-conducting portion 131, and the heat-conducting member 130 located in the channel from the middle portion 121 to the second end portion 123 of the heat-insulating channel is the second heat-conducting portion 132. The first heat-conducting portion 131 and the second heat-conducting portion 132 are both conical structures, the cross-section is a triangle, and the top of the first heat-conducting portion 131 and the second heat-conducting portion 132 abut against each other, the abutment is located at the middle portion 121 of the heat-insulating channel, and the bottom of the first heat-conducting portion 131 is flush with the first end portion 122 of the heat-insulating channel, and the bottom of the second heat-conducting portion 132 is flush with the second end portion 123 of the heat-insulating channel. In other embodiments, the heat-conducting member 130 can also be a pyramid structure.

[0041] The cross-sectional area of the first heat conduction part 131 and the second heat conduction part 132 has a gradually increasing trend in the direction from the middle part 121 to the end part. When the temperature detection assembly 100 is not compressed and deformed, the first heat conduction part 131 and the second heat conduction part 132 form a point contact at the position of the middle part 121. When the temperature detection assembly 100 is compressed and deformed, the first heat conduction part 131 and the second heat conduction part 132 are easily compressed to absorb the compression stress, avoid stress transmission and damage to the detected object, and thus can play a role in protecting the detected object. When the two heat conduction parts 130 are compressed and deformed, the contact between the first heat conduction part 131 and the second heat conduction part 132 changes from a point contact to a surface contact, increasing the contact area in the X-Y direction and increasing the heat conduction area. This can effectively improve the heat conduction efficiency in the Z-axis direction and avoid the influence of asymmetric deformation on the detection accuracy. In this way, the heat of the detected object can be quickly and efficiently conducted to the second heat conduction part 132 through the first heat conduction part 131, which can not only be efficiently conducted to the temperature detection part 140 for detecting the temperature of the measurement point, reducing the detection data error caused by heat transfer, but also can be further conducted to the heat sink installed on the side of the second heat conduction part 132 away from the first heat conduction part 131 for efficient heat dissipation of the detected object.

[0042] As an implementable embodiment, the temperature detection part 140 includes an electrically connected detection part 141 and a transmission part 142. The detection part 141 is arranged in the heat conduction part 130, and the transmission part 142 is led to the outside of the heat conduction part 130 and the heat insulation part 110.

[0043] Exemplarily, the temperature detection part 140 is a thermocouple, which is a temperature sensor that converts a temperature signal into an electric potential (voltage) signal based on the Seebeck effect. The detection part 141 of the temperature detection part 140 is a thermocouple probe, and the transmission part 142 is a thermocouple wire. The thermocouple probe is closely connected to the heat conduction part 130.

[0044] The detection part 141 is a measurement end part of the temperature detection part 140, which directly contacts the detected object or the heat conduction part 130 arranged on the detected object, and is composed of a measurement end, a protection structure and a lead-out end. The measurement end is a welded joint of the transmission part 142. Exemplarily, the protection structure can adopt a stainless steel sleeve and a ceramic insulation layer to protect the thermocouple probe from chemical corrosion, oxidation or wear. The measurement end, the protection structure and the lead-out end are combined to accurately perceive the temperature of the detected object, quickly reach thermal equilibrium and reduce temperature detection error.

[0045] The transmission part 142 is a signal transmission channel of the temperature detection piece 140, which is composed of two metal wires of different materials, namely a positive wire and a negative wire, and can be a K-type thermocouple wire or a T-type thermocouple wire. For example, the K-type thermocouple wire is made of nickel-chromium-nickel-silicon material, and the color coding is yellow and red, which is suitable for a medium-high temperature environment (-270℃ to 1372℃) and supports fast dynamic response; the T-type thermocouple wire is made of copper-constantan material, and the color coding is blue and red, which is suitable for a low-temperature environment (-270℃ to 400℃) and has high precision. One end of the transmission part 142 is connected to the detection part 141, and the other end is connected to a reference end to form a closed loop. The reference end is a component with a known and stable temperature. When the measurement end and the reference end form a temperature difference, a potential difference will be formed at the junction of the two ends of the thermocouple wire. The transmission part 142 transmits the potential difference to the temperature acquisition circuit on the reference end side, and finally the temperature value of the measurement end can be measured by calculation.

[0046] In summary, the temperature detection assembly 100 provided by the embodiment of the present application can effectively block the heat conduction path along the X-Y plane by the synergistic effect of the heat conduction piece 130 and the heat insulation piece, and the interval 120 between the two, and only retain the heat conduction in the Z-axis direction, reduce the interference of heat conduction on the measurement point temperature, and improve the measurement accuracy.

[0047] In a second aspect, referring to Figure 4 The temperature detection device 200 provided by the embodiment of the present application includes a heat conduction base 210, the temperature detection assembly 100 described above, and a signal connection piece 220. The plurality of temperature detection assemblies 100 are installed in an array on the heat conduction base 210, and the heat conduction piece 130 of the temperature detection assembly 100 is in thermal conduction with the heat conduction base 210. The signal connection piece 220 connects the temperature detection pieces 140 of at least two temperature detection assemblies 100.

[0048] For example, the heat conduction base 210 is installed on the surface of the to-be-detected piece, and is used to conduct heat from the surface of the to-be-detected piece to the temperature detection assembly 100 for measuring the surface temperature. The heat conduction base 210 is made of a heat conduction interface material, and specifically can use a heat conduction pad. The heat conduction pad used here can use a carbon fiber heat conduction pad. Since the carbon fiber has a highly ordered graphite microcrystalline structure inside, the heat transfer efficiency along the fiber axis is very high, so it has a high thermal conductivity coefficient in the Z-axis direction, specifically up to 400-1000 W / mK, and has anisotropy in the X-Y plane, showing a low thermal conductivity coefficient, specifically 1-5 W / mK.

[0049] In another embodiment, a heat-conductive gel, a heat-conductive phase change material or other heat-conductive interface material can also be used, and specifically a paraffin-based heat-conductive phase change material can be used, which can reduce the surface temperature fluctuation of the to-be-detected member by using its phase change characteristics. In yet another embodiment, a graphene composite heat-conductive pad can also be used, which can further increase the heat conduction coefficient of the Z-axis to 1500 W / mK or higher. In addition, since graphene is a two-dimensional material, a very thin graphene composite heat-conductive pad can achieve good heat conduction effect, and the thickness thereof can be reduced to 50 μm, thereby reducing the overall weight of the temperature detection device 200.

[0050] In the embodiment of the present application, the heat-conductive base 210 is provided with a plurality of mounting positions 211 arranged in an array. The mounting positions 211 can be mounting grooves or mounting holes. The plurality of temperature detection assemblies 100 are arranged in the mounting grooves or mounting holes in a one-to-one correspondence. In this way, the mounting positions 211 can fix the temperature detection assemblies 100 to a measurement region. By arranging the temperature detection assemblies 100 in an array on the mounting positions 211 of the heat-conductive base 210, the surface temperature distribution of the to-be-detected member can be measured. The heat-conductive base 210 can not only conduct heat to the temperature detection member 140 to detect the surface temperature distribution of the to-be-detected member, but also transmit heat to the heat sink to dissipate heat from the heat-generating element. The heat-generating element can also be understood as the to-be-detected member.

[0051] It can be understood that, since the temperature detection device 200 of the embodiment of the present application uses the technical solutions of the above-mentioned temperature detection assembly 100 embodiments, it at least has the beneficial effects brought by the technical solutions of the above-mentioned temperature detection assembly 100 embodiments, which will not be described here.

[0052] In the embodiment of the present application, the signal connecting member 220 is used to connect the temperature detection assemblies 100, so that the accuracy of the relative position of the temperature detection assemblies 100 is maintained, and the flexible signal connecting member 220 can meet the ductility required when the temperature detection assemblies 100 are deformed under pressure, so as to install the heat sink on the side of the temperature detection device 200 away from the to-be-detected member, to adapt to the installation requirements between the to-be-detected member and the heat sink.

[0053] In summary, the plurality of temperature detection assemblies 100 are arranged in an array on the heat-conductive base 210 to form an "island" shaped detection unit, and the signal connecting member 220 connects the temperature detection assemblies 100 by pre-deformation to form a "bridge" shaped connection unit, so that the array arranged temperature detection assemblies 100 form an island-bridge structure, and the compressibility and heat conduction performance of the temperature detection device 200 are synergistically optimized, so as to accurately detect the temperature distribution when the surface is covered with a heat sink.

[0054] As an implementable embodiment, refer to Figure 5As shown, the heat-conducting base 210 is provided with a plurality of mounting positions 211 arranged in an array; the plurality of temperature detection assemblies 100 are one-to-one correspondingly mounted on the plurality of mounting positions 211; along a direction perpendicular to the deformation direction of the heat-conducting member 130 of the temperature detection assembly 100, the size of the mounting position 211 is greater than the size of the temperature detection assembly 100 after being compressed.

[0055] In the embodiments of the present application, the number and density of the plurality of mounting positions 211 arranged in an array and the plurality of temperature detection assemblies 100 can be set according to the need for detecting the surface temperature distribution of the to-be-detected member. For example, the array can be an equidistant array of 3x3, 4x4, 5x5, or an equidistant array of 3x4, 4x5, 5x6 according to the surface shape of the to-be-detected member to be measured. In addition, the heat flux density distribution of the surface of the to-be-detected member can be calculated by collecting the power consumption data of the to-be-detected member in real time, and the density of the detection member can be adjusted by dynamically adjusting the array spacing according to the heat flux density distribution. Specifically, the array spacing in the area with high heat flux density (for example, the central area) can be 1-3 mm, and the array spacing in the area with low heat flux density (for example, the edge area) can be 5-8 mm. It can be understood that the density of the temperature detection assembly 100 can be adjusted according to the predicted temperature distribution, so as to improve the temperature detection resolution and detection accuracy.

[0056] As another implementable embodiment, continuing to refer to Figure 5 As shown, the heat-conducting base 210 is provided with a heat insulation structure 212 arranged between two adjacent mounting positions 211.

[0057] In some embodiments, the heat insulation structure 212 can be a heat insulation groove, and the groove of the heat insulation groove and the groove of the mounting groove are located on the same surface of the heat-conducting base 210, and a plurality of heat insulation grooves extend towards the relative position perpendicular to the two adjacent mounting positions 211, which can be understood as forming a grid structure on the surface of the heat-conducting base 210. The heat insulation groove can be filled with a heat insulation medium.

[0058] In other embodiments, the heat insulation structure 212 can be a heat insulation hole, and the heat insulation hole can also be filled with a heat insulation medium. For example, the heat insulation medium in the heat insulation groove or the heat insulation hole can be air, aerogel powder, silica powder or other powdered medium.

[0059] In some embodiments, the heat insulation structure 212 can also be a heat insulation material embedded in the heat-conducting base 210. The heat insulation material can be a strip structure. For example, the heat insulation material can be a porous or foam material, specifically heat insulation foam, foam plastic, or aerogel. By creating heat insulation grooves or channels on the heat-conducting base 210, or by embedding heat insulation material inside the heat-conducting base 210, heat conduction along the XY plane can be further prevented, thereby improving the accuracy of temperature detection at the detection point.

[0060] As one feasible implementation method, refer to Figure 6 and Figure 7 As shown, the signal connector 220 has a connection channel 221, which is used to house the transmission section 142 of the temperature sensing element 140 of the temperature sensing assembly 100.

[0061] The signal connector 220 is a deformable component with a deformable structure. The deformation direction of the deformable structure is perpendicular to the deformation direction of the heat-conducting component 130. The deformable structure has a tendency to deform along the deformation direction perpendicular to the heat-conducting component 130.

[0062] In this embodiment, the signal connector 220 is used to connect the various temperature detection components 100 in the temperature detection device 200, ensuring the accuracy of the relative positions of the detection parts 141 in each temperature detection component 100. For example, the signal connector 220 is a folded paper structure or a pre-deformed bridge structure. When the temperature detection device 200 is compressed under pressure, the multiple arrayed temperature detection components 100 can extend and shift accordingly. Specifically, the structure can be arc-shaped (e.g., ...). Figure 6 ) or triangular arch structure (such as Figure 7 Since most of the surfaces of the parts to be tested are planar, the tensile deformation of the temperature detection device 200 in this embodiment only occurs in the XY plane and there is no tensile deformation in the Z-axis direction. Therefore, the above-mentioned deformation direction can be achieved by using a pre-deformed arc-shaped or triangular arch bridge structure, so that the temperature detection device 200 can be in stable contact with the surface of the parts to be tested, thereby satisfying the ductility required by the temperature detection component 100 array under pressure deformation.

[0063] For example, the signal connector 220 may be made of polyimide film or polydimethylsiloxane (PDMS) or other polymer film, and has high elasticity. Its structure is an origami structure or pre-deformed. When the temperature detection device 200 is compressed and deformed, the array unit of the temperature detection component 100 can be extended and displaced accordingly.

[0064] In the embodiment of the present application, the transmission part 142 of the temperature detection member 140 is arranged in the connecting channel 221 of the signal connecting member 220, and a physical isolation barrier can be formed through the signal connecting member 220 and the connecting channel 221 to isolate electromagnetic interference, so that the temperature signal of the transmission part 142 is not superimposed by noise, and the detection accuracy of the temperature detection member 140 is ensured. In addition, the transmission part 142 is arranged in the connecting channel 221, avoiding the need to groove or perform other operations on the metal package on the top of the to-be-detected member to accommodate the transmission part 142, thereby avoiding damage to the to-be-detected member and ensuring the normal operation of the to-be-detected member and the steady-state temperature distribution detection when the surface of the to-be-detected member is provided with a heat sink.

[0065] As an implementable embodiment, referring to FIG. 2, Figure 8 The signal output member 230 is further connected to the signal connecting member 220 and / or the transmission part 142 of the temperature detection member 140 of the temperature detection assembly 100.

[0066] It can be understood that the signal output member 230 is a centralized outlet end of the transmission part 142 of each temperature detection member 140, which can be understood as an electrode of the temperature detection signal, and is used to collect the signals detected by each array of the temperature detection assembly 100. Exemplarily, the number of the signal output member 230 can be multiple, and in the embodiment of the present application, the number of the signal output member 230 is 2, and the signal output member 230 is arranged on the same side of the temperature detection device 200. Specifically, the multiple and dispersed thermocouple wires are collected into two centralized and structured output ends, which greatly simplifies the electrical connection between the centralized multiple temperature detection assemblies 100 and the external data collection system of the temperature detection device 200, and makes the multiple temperature detection assemblies 100 compact in structure, facilitating subsequent maintenance.

[0067] Exemplarily, the signal output member 230 can be combined with a copper-clad substrate and a gold-plated layer, wherein the copper-clad substrate is a copper layer covered on a glass fiber epoxy resin or ceramic substrate, and the thick copper layer provides a conductive path and mechanical support. The surface of the copper-clad substrate is plated with gold, which can improve the oxidation resistance of the thick copper layer and maintain the stability of long-term connection. In addition, in order to reduce the cost, the copper can also be plated with tin or tin alloy, which has good weldability. The signal output member 230 can also use a graphene flexible electrode, which forms a high-density conductive path through laser etching, further reduces the electrode contact resistance, and can adapt to high-frequency temperature fluctuation detection.

[0068] In summary, the temperature detection device 200 of the embodiment of the present application realizes detection of the temperature distribution on the surface of the to-be-detected member by arranging a plurality of mounting positions 211 in an array on the heat-conducting base 210 and arranging a plurality of temperature detection assemblies 100 one by one in the mounting positions 211; the adjacent two temperature detection assemblies 100 are connected by the flexible signal connecting member 220, which can adapt to the deformation of the temperature detection device 200 under pressure to absorb the compression stress, and still maintain the relative position accuracy after being pressed. The temperature detection device 200 of the present application takes into account the compressibility and high heat conduction efficiency, and can meet the detection requirements of flexibility, ductility and high heat conduction.

[0069] In a third aspect, the embodiment of the present application further provides a server comprising an electronic component and the temperature detection device 200 described above, and the electronic component is in thermal conduction with the heat-conducting base 210 of the temperature detection device 200.

[0070] It can be understood that, since the server of the embodiment of the present application adopts the technical solutions of the temperature detection device 200 embodiment described above, it at least has the beneficial effects brought by the technical solutions of the temperature detection device 200 embodiment, which will not be repeated here.

[0071] Exemplarily, the electronic component is the to-be-detected member described above, and can also be understood as a heat source, which can be specifically a processor, a controller, a battery pack or a motor. When the server is powered on and works, the current flows through the electronic component, and the power consumption of the electronic component converts the electric energy into continuous and high-density heat energy, thereby forming a very high heat flux density. The heat-conducting base 210 of the temperature detection device 200 is arranged on the heating surface of the electronic component and is in thermal conduction with the heat-conducting base 210, for conducting heat to enable the temperature detection member 140 in the temperature detection assembly 100 to perform real-time and accurate detection, and convert the temperature signal into an electric signal that can be processed.

[0072] In the embodiment of the present application, the server further comprises a heat sink arranged on the side of the temperature detection device 200 away from the electronic component, and the heat-conducting base 210 of the temperature detection device 200 and the heat-conducting member 130 in the temperature detection assembly 100 conduct the heat of the electronic component to the temperature detection member 140 at the same time, and conduct it to the heat sink for heat dissipation. Exemplarily, the heat sink can be an air-cooled heat sink or a liquid-cooled heat sink, which efficiently conducts the heat generated by the electronic component to the air through the heat dissipation fins on the surface of the heat sink, so that the electronic component can normally operate, thereby prolonging the service life of the electronic component and the server.

[0073] The temperature detection assembly, the temperature detection device and the server provided by the application are described in detail. The principles and implementation manners of the application are described by using specific examples, and the above description of the examples is only used to help understand the method of the application and the core idea. It should be pointed out that, for ordinary skilled persons in the technical field, some improvements and modifications can be made to the application without departing from the principles of the application, and these improvements and modifications also fall within the protection scope of the claims of the application.

Claims

1. A temperature detection assembly, characterized by, The temperature detection assembly (100) comprises: a heat insulation member (110), which is a deformation member, and which forms a heat insulation channel; a heat conduction member (130), which is a deformation member, and which is located in the heat insulation channel and has the same deformation direction as the heat insulation member (110), and which forms a gap (120) with the heat insulation member (110); and an end of the heat conduction member (130) in the deformation direction is used for thermal conduction with a to-be-detected member; a temperature detection member (140), which is arranged in the heat insulation member (110) and is used for detecting heat conducted to the heat conduction member (130).

2. The temperature detection assembly of claim 1, wherein, Along the deformation direction of the heat insulation member (110), the heat insulation channel has a middle part (121) and two ends located on opposite sides of the middle part (121); Along the middle part (121) to the ends, the channel size of the heat insulation channel has an increasing trend; In the heat insulation channel, at least the middle part (121) and the opposite position of the heat conduction member (130) form the gap (120).

3. The temperature detection assembly of claim 2, wherein, The cross-sectional area of the heat conduction member (130) located at the middle part (121) is smaller than the cross-sectional area of the heat conduction member (130) located at the ends; The cross section of the heat conduction member (130) is perpendicular to the deformation direction of the heat conduction member (130); When the heat conduction member (130) is compressed along the deformation direction, the cross-sectional area of the heat conduction member (130) located at the middle part (121) increases.

4. The temperature detection assembly of claim 3, wherein, The heat conduction member (130) comprises a first heat conduction part (131) and a second heat conduction part (132) connected to each other, the first heat conduction part (131) is located from the middle part (121) to one end of the heat insulation channel, and the second heat conduction part (132) is located from the middle part (121) to the other end of the heat insulation channel; The connection position of the first heat conduction part (131) and the second heat conduction part (132) is located at the middle part (121) of the heat insulation channel; Along the direction from the middle part (121) to the ends, the cross-sectional area of the first heat conduction part (131) and / or the second heat conduction part (132) has an increasing trend.

5. The temperature detection assembly of any one of claims 1-3, wherein, The temperature detection member (140) comprises a detection part (141) and a transmission part (142) connected to each other, the detection part (141) is arranged in the heat conduction member (130), and the transmission part (142) is led to the outside of the heat conduction member (130) and the heat insulation member (110).

6. A temperature detecting device characterized by comprising: The temperature detection assembly (100) comprises: a heat conduction base (210); a plurality of temperature detection assemblies (100) according to any one of claims 1-5, which are arranged in an array on the heat conduction base (210); the heat conduction member (130) of the temperature detection assembly (100) is in thermal conduction with the heat conduction base (210); a signal connecting member (220) connected to the temperature detection members (140) of at least two temperature detection assemblies (100).

7. The temperature detecting device according to claim 6, wherein The heat-conducting base (210) is provided with a plurality of mounting positions (211) arranged in an array; The plurality of temperature detection assemblies (100) are one-to-one correspondingly mounted on the plurality of mounting positions (211); The size of the mounting position (211) is greater than the size of the temperature detection assembly (100) after compression along the deformation direction of the heat-conducting member (130) of the temperature detection assembly (100).

8. The temperature detecting device according to claim 6, wherein The signal connecting member (220) has a connecting channel (221) for accommodating the transmission part (142) of the temperature detection member (140) of the temperature detection assembly (100); The signal connecting member (220) is a deformation member, and has a deformation structure, and the deformation direction of the deformation structure is perpendicular to the deformation direction of the heat-conducting member (130); The deformation structure has a tendency to deform along the direction perpendicular to the deformation direction of the heat-conducting member (130).

9. The temperature detecting device according to any one of claims 7-8, characterized in that, Further comprising a signal output member (230) connected to the signal connecting member (220) and / or the transmission part (142) of the temperature detection member (140) of the temperature detection assembly (100).

10. A server, characterized by Comprise: An electronic element; The temperature detection device (200) according to any one of claims 6-9, and the electronic element is in thermal conduction with the heat-conducting base (210) of the temperature detection device (200).

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