Integrated circuit chip test equipment

Abstract

The invention relates to the technical field of chip detection, in particular to integrated circuit chip testing equipment which comprises a workbench, a placement groove is formed in the upper end of the workbench, a chip body is arranged in the placement groove, and the chip body is heated in a stepped mode through a heat generation mechanism and a stepped heat conduction mechanism. Probe pin detection, power-on detection and temperature detection can be combined through the above design, and the device is very convenient to use, and can be completed only through the convenient operation of a single worker, thereby reducing the cost required by the detection of the chip body, and improving the detection efficiency of the chip body. And the detection efficiency of the chip body can be improved, and the required time is shortened.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip detection, in particular to an integrated circuit chip testing device. BACKGROUND

[0002] Integrated circuit, also known as microcircuit, microchip or chip, is a miniaturized circuit in electronics, mainly including semiconductor devices and passive components, etc., and is often manufactured on the surface of a semiconductor wafer. Integrated circuit manufactured on the surface of a semiconductor chip is also called thin film integrated circuit. Thick film integrated circuit is a miniaturized circuit composed of independent semiconductor devices and passive components integrated into a substrate or a circuit board.

[0003] After the chip is assembled and before it is actually used, it needs to be tested. The aspects of testing include but are not limited to probe detection, input value detection, temperature detection, ultrasonic detection, etc. Among them, probe detection, chip power-on detection and temperature detection are very important parts of chip detection. Probe detection refers to contacting the pin position of the chip through a probe to detect whether the current and voltage frequency of the pin position are normal. Power-on detection is to simulate the use of the chip by powering it on to check the output efficiency of the chip. The final temperature detection is to detect the use efficiency of the chip under different temperature environments to determine whether the chip is qualified. The above three aspects of chip detection are relatively scattered in actual use, and different facilities are needed for corresponding detection, and staff equipped with operation facilities are needed. This not only increases the time cost and labor cost of chip detection, but also reduces the detection efficiency and prolongs the detection time, which is not conducive to chip detection. SUMMARY

[0004] The purpose of the present application is to provide an integrated circuit chip testing device to solve the problem of high time cost and labor cost of chip detection in the prior art.

[0005] To achieve the above purpose, the present application provides the following technical scheme:

[0006] The utility model provides an integrated circuit chip testing equipment, including the workbench, the upper end of workbench is equipped with the placement groove, be provided with chip body in the placement groove, the inner surface of placement groove is fixedly connected with a plurality of electrically conductive lanyard, the outer surface of chip body is fixedly connected with a plurality of electrically conductive pins, a plurality of electrically conductive pins are electrically connected with a plurality of electrically conductive lanyard respectively, the circumferential surface of workbench is fixedly connected with stabilizing plate, the lower end of stabilizing plate is fixedly connected with water storage cylinder, the upper end of stabilizing plate is movably penetrated by moving rod, the upper and lower ends of moving rod are fixedly connected with pull plate and sealing plate respectively, the circumferential surface of water storage cylinder is fixedly connected with blocking plate, the upper end of blocking plate is equipped with water permeation hole, the upper side and the outside of workbench are equipped with pressing mechanism and heat production mechanism respectively, the pressing mechanism is used for detecting the electrification of electrically conductive lanyard and electrically conductive pin, and the pull plate is pressed down, and the heat production mechanism is used for generating heat.

[0007] Further, the pressing mechanism is provided with a top plate, a moving block, a pressing rod, a pressing block, a plurality of detection probes and a driving assembly, the driving assembly is arranged on the outside of the workbench, the top plate is connected with the driving assembly, the moving block is fixedly connected to the circumferential surface of the top plate, the plurality of detection probes are fixedly connected to the lower end of the top plate, the pressing rod is fixedly connected to the lower end of the moving block, the pressing block is fixedly connected to the lower end of the pressing rod, and the driving assembly is used to drive the top plate and the plurality of components to descend.

[0008] Further, the driving assembly is provided with a mounting block, a motor, a lead screw and a lead screw nut, the mounting block is fixedly connected to the circumferential surface of the workbench, the motor is fixedly connected to the lower end of the mounting block, the lead screw is rotatably connected to the upper end of the mounting block, the lead screw nut is threadedly connected to the circumferential surface of the lead screw, and the lead screw nut is fixedly connected with the top plate.

[0009] Further, the heat production mechanism is composed of a transmission pipe, a placement plate, a reaction shell and a heat conduction rod, the placement plate is fixedly connected to the circumferential surface of the workbench, the reaction shell is fixedly connected to the upper end of the placement plate, the transmission pipe is fixedly connected to the circumferential surfaces of the reaction shell and the water storage cylinder, and the heat conduction rod is fixedly connected to the lower end of the placement plate.

[0010] Further, the utility model further comprises a stepped heat conduction mechanism, the stepped heat conduction mechanism is composed of an expansion groove, a heat conduction stress plate, a heat conduction pushing rod, a heat conduction disc and a heat resistance component, the expansion groove is arranged in the workbench, the heat conduction rod is connected with the substance filled in the expansion groove, the heat conduction stress plate is slidably connected in the expansion groove, the heat conduction pushing rod is fixedly connected to the upper end of the heat conduction stress plate, the heat conduction disc is fixedly connected to the upper end of the heat conduction pushing rod, and the heat resistance component is arranged in the expansion groove and is used to control the heat transfer through the heat conduction coefficient.

[0011] Further, the heat resistance assembly is composed of a total connecting disc, a total connecting groove, a third PTC heat conduction ring, a first conduction rod, a second PTC heat conduction ring, a second conduction rod, a first PTC heat conduction ring, a third conduction rod and a heat dissipation plate, the third PTC heat conduction ring, the second PTC heat conduction ring and the first PTC heat conduction ring are fixedly connected to the circumferential surface of the expansion groove, the total connecting groove is arranged in the workbench, the total connecting disc is fixedly connected in the total connecting groove, the first conduction rod is fixedly connected to the circumferential surface of the third PTC heat conduction ring and the total connecting disc, the second conduction rod is fixedly connected to the circumferential surface of the second PTC heat conduction ring and the total connecting disc, the third conduction rod is fixedly connected to the proximal end of the first PTC heat conduction ring and the total connecting disc, the heat dissipation plate is fixedly connected to the lower inner wall of the placing groove, and the heat dissipation plate and the total connecting disc are connected through the heat conduction pipe.

[0012] Further, the upper end of the reaction shell is fixedly connected with a connecting pipe, and the circumferential surface of the water storage cylinder is fixedly connected with a transmission pipe.

[0013] Further, the upper end of the mounting block is fixedly connected with a limiting rod, and the upper end of the screw rod nut is provided with a vertical hole, and the screw rod nut is slidingly connected to the circumferential surface of the limiting rod through the vertical hole.

[0014] Further, the upper end of the mounting block is fixedly connected with a limiting rod, and the upper end of the screw rod nut is provided with a vertical hole, and the screw rod nut is slidingly connected to the circumferential surface of the limiting rod through the vertical hole.

[0015] Further, the upper end of the screw rod is fixedly connected with an anti-dropping block, the upper end of the workbench is provided with a heat insulation groove, and the lower end of the top plate is fixedly connected with a heat insulation plate.

[0016] Further, the upper end of the top plate is fixedly connected with an electricity connecting ladder, and the upper end of the electricity connecting ladder is fixedly connected with an electricity connecting wire.

[0017] The technical scheme provided by the application has the following beneficial effects compared with the known prior art:

[0018] I. When the chip body needs to be detected, the chip body is placed in the placement slot. In this process, the plurality of conductive pins and the plurality of conductive lugs are in contact, the external current is introduced into the chip body, the chip body is powered on, the performance and power-on condition of the chip body are detected, and then the power-on condition and frequency, voltage and the like of the conductive pins and the conductive lugs are detected by starting the pressing mechanism. On the other hand, the movement of the pressing mechanism will contact the pulling plate and push the moving rod and the sealing plate downward, so that the sealing plate gradually moves downward and then leaves the closing of the water permeable hole. Then the liquid in the upper cavity of the blocking plate will enter the lower area of the water storage cylinder through the water permeable hole, and then the chip body is heated by the heat generating mechanism and the stepped heat conduction mechanism. The performance of the chip body at different temperatures is detected. Through the above design, the probe pin detection, power-on detection and temperature detection can be combined, and the use of the device is very convenient. Only one person can complete the operation, which can not only reduce the cost of chip body detection, but also improve the chip body detection efficiency and shorten the time required.

[0019] II. The expansion groove can discharge the steam generated by heating in the reaction shell, and can also supplement the reaction substances in the reaction shell. The external water source can be connected through the delivery pipe. When the screw nut moves, it can slide on the circumferential surface of the limiting rod through the vertical hole, improving the movement stability and rationality of the screw nut. SUMMARY

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creating any creative labor.

[0021] Figure 1 It is a front view of the present application;

[0022] Figure 2 It is a front view of the present application;

[0023] Figure 3 It is a front view of the present application;

[0024] Figure 4 It is a front view of the present application; Figure 3 It is a front view of the present application;

[0025] Figure 5 It is a front view of the present application;

[0026] Figure 6 It is a front view of the present application;

[0027] In the figure: 1, workbench; 101, mounting block; 102, motor; 103, screw rod; 104, limiting rod; 105, screw rod nut; 106, anti-dropping block; 2, top plate; 201, temperature insulation plate; 202, temperature insulation groove; 203, electric contact; 204, electric wire; 205, chip body; 206, placing groove; 207, detection probe; 208, conductive pin; 209, conductive contact; 3, moving block; 301, pressing rod; 302, pressing block; 303, stabilizing plate; 304, pulling plate; 305, spring; 306, water storage cylinder; 307, moving rod; 308, blocking plate; 309, sealing plate; 310, sealing groove; 311, transmission pipe; 4, transmission pipe; 401, placing plate; 402, heat conduction rod; 403, reaction shell; 404, expansion groove; 405, heat conduction stress plate; 406, heat conduction pushing rod; 5, heat conduction disc; 501, third PTC heat conduction ring; 502, second PTC heat conduction ring; 503, first PTC heat conduction ring; 504, first conduction rod; 505, second conduction rod; 506, third conduction rod; 507, total contact disc; 508, heat dissipation plate; 509, total contact groove. DETAILED DESCRIPTION

[0028] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0029] The present application will be further described below with reference to the embodiments.

[0030] An integrated circuit chip testing device, such as Figures 1-6As shown, including the workbench 1, the upper end of the workbench 1 is provided with a placing groove 206, the placing groove 206 is provided with a chip body 205, the inner surface of the placing groove 206 is fixedly connected with a plurality of conductive ladders 209, the outer surface of the chip body 205 is fixedly connected with a plurality of conductive pins 208, the plurality of conductive pins 208 are respectively electrically connected with the plurality of conductive ladders 209, the circumferential surface of the workbench 1 is fixedly connected with a stabilizing plate 303, the lower end of the stabilizing plate 303 is fixedly connected with a water storage cylinder 306, the upper end of the stabilizing plate 303 is movably penetrated by a moving rod 307, the upper and lower ends of the moving rod 307 are respectively fixedly connected with a pulling plate 304 and a sealing plate 309, the circumferential surface of the water storage cylinder 306 is fixedly connected with a blocking plate 308, the upper end of the blocking plate 308 is provided with a water permeable hole, the upper side and the outer side of the workbench 1 are respectively provided with a pressing mechanism and a heat generating mechanism, the pressing mechanism is used for detecting the power-on condition of the conductive ladders 209 and the conductive pins 208, and the pulling plate 304 is pressed down, the heat generating mechanism is used for generating heat;

[0031] The pressing mechanism comprises a top plate 2, a moving block 3, a pressing rod 301, a pressing block 302, a plurality of detection probes 207 and a driving assembly, the driving assembly is arranged on the outer side of the workbench 1, the top plate 2 is connected with the driving assembly, the moving block 3 is fixedly connected to the circumferential surface of the top plate 2, the plurality of detection probes 207 are all fixedly connected to the lower end of the top plate 2, the pressing rod 301 is fixedly connected to the lower end of the moving block 3, the pressing block 302 is fixedly connected to the lower end of the pressing rod 301, and the driving assembly is used to drive the top plate 2 and the plurality of components to descend;

[0032] The driving assembly comprises a mounting block 101, a motor 102, a lead screw 103 and a lead screw nut 105, the mounting block 101 is fixedly connected to the circumferential surface of the workbench 1, the motor 102 is fixedly connected to the lower end of the mounting block 101, the lead screw 103 is rotatably connected to the upper end of the mounting block 101, and the lead screw nut 105 is threadedly connected to the circumferential surface of the lead screw 103 and is fixedly connected with the top plate 2;

[0033] The heat generating mechanism comprises a transmission pipe 4, a placing plate 401, a reaction shell 403 and a heat conducting rod 402, the placing plate 401 is fixedly connected to the circumferential surface of the workbench 1, the reaction shell 403 is fixedly connected to the upper end of the placing plate 401, the transmission pipe 4 is fixedly connected to the circumferential surfaces of the reaction shell 403 and the water storage cylinder 306, and the heat conducting rod 402 is fixedly connected to the lower end of the placing plate 401;

[0034] The stepped heat conduction mechanism is composed of the expansion groove 404, the heat conduction stress plate 405, the heat conduction pushing rod 406, the heat conduction disc 5 and the heat resistance component, the expansion groove 404 is arranged in the workbench 1, the heat conduction rod 402 is connected with the substance filled in the expansion groove 404, the heat conduction stress plate 405 is slidingly connected in the expansion groove 404, the heat conduction pushing rod 406 is fixedly connected to the upper end of the heat conduction stress plate 405, the heat conduction disc 5 is fixedly connected to the upper end of the heat conduction pushing rod 406, and the heat resistance component is arranged in the expansion groove 404 and is used for controlling the heat transfer through the heat conduction coefficient.

[0035] The heat resistance component is composed of the total connecting disc 507, the total connecting groove 509, the third PTC heat conduction ring 501, the first conduction rod 504, the second PTC heat conduction ring 502, the second conduction rod 505, the first PTC heat conduction ring 503, the third conduction rod 506 and the heat dissipation plate 508, the third PTC heat conduction ring 501, the second PTC heat conduction ring 502 and the first PTC heat conduction ring 503 are fixedly connected to the circumferential surface of the expansion groove 404, the total connecting groove 509 is arranged in the workbench 1, the total connecting disc 507 is fixedly connected in the total connecting groove 509, the first conduction rod 504 is fixedly connected to the circumferential surface of the third PTC heat conduction ring 501 and the total connecting disc 507, the second conduction rod 505 is fixedly connected to the circumferential surface of the second PTC heat conduction ring 502 and the total connecting disc 507, the third conduction rod 506 is fixedly connected to the first PTC heat conduction ring 503 and the total connecting disc 507, the heat dissipation plate 508 is fixedly connected to the lower inner wall of the placing groove 206, and the heat dissipation plate 508 and the total connecting disc 507 are connected through the heat conduction pipe.

[0036] In specific embodiments of the present application, when the chip body 205 needs to be detected, the chip body 205 is placed in the placement slot 206, and in the process, the plurality of conductive pins 208 and the plurality of conductive laces 209 are contacted, the external current is introduced into the chip body 205, and the chip body 205 is powered on to detect the performance and power-on condition of the chip body 205, and then the motor 102 is started to rotate the output end and drive the lead screw 103 to rotate synchronously, the lead screw nut 105 connected with the circumferential surface of the lead screw 103 starts to move, and then drives the top plate 2, the moving block 3, the pressing rod 301, the pressing block 302 and the plurality of detection probes 207 to move downward synchronously. On the one hand, the vertical movement of the plurality of detection probes 207 will contact the contact end of the conductive pins 208 and the conductive laces 209 to detect the power-on condition, frequency, voltage and the like of the conductive pins 208 and the conductive laces 209. On the other hand, the descent of the pressing block 302 will contact and pull the pulling plate 304 and push the moving rod 307 and the sealing plate 309 downward, so that the sealing plate 309 gradually moves downward and then leaves the closing of the water-permeable hole. The liquid in the upper cavity of the blocking plate 308 will then enter the lower region of the water storage cylinder 306 through the water-permeable hole, and then be transmitted to the reaction shell 403 through the transmission pipe 4 to react with the substance in the reaction shell 403 and generate heat. The heat of the reaction is then conducted to the expansion tank 404 through the heat conduction rod 402. First, the heat will be conducted to the substance in the expansion tank 404, which will itself produce a thermal expansion effect, pushing the heat-conducting stressed plate 405, the heat-conducting pushing rod 406 and the heat-conducting disc 5 to move upward. Secondly, because the substance itself carries heat, the heat will be conducted to the heat sink 508 through the heat-conducting disc 5, the third PTC heat-conducting ring 501, the first conduction rod 504, the total connecting disc 507, and then the heat sink 508 will heat the chip body 205, thereby simulating the power-on condition of the chip body 205 under the heating condition and whether there is a problem in signal transmission or operation. Finally, because the reaction shell 403 continuously reacts to generate heat, the substance in the expansion tank 404 will continuously expand and heat, thereby continuously pushing the heat-conducting stressed plate 405 upward, so that the heat-conducting disc 5 is separated from the third PTC heat-conducting ring 501 and enters the second PTC heat-conducting ring 502. Because the critical temperature of the second PTC heat-conducting ring 502 out of the factory is higher than that of the third PTC heat-conducting ring 501, more heat will be conducted to the heat sink 508 through the second conduction rod 505 at this time. At this time, the temperature of the chip body 205 will be heated twice, simulating the temperature condition of the chip body 205 under the heating condition. Similarly, after the heat continues to be transmitted, the heat-conducting disc 5 will finally move to the first PTC heat-conducting ring 503 and contact it. The critical temperature of the first PTC heat-conducting ring 503 set at the time of leaving the factory is higher than that of the third PTC heat-conducting ring 501 and the second PTC heat-conducting ring 502, so that the heat received by the chip body 205 will continue to increase, and the temperature will continue to rise, thereby simulating whether the performance of the chip body 205 under high heat condition exists corresponding problem. After the complete reaction in the reaction shell 403, the temperature gradually decreases,The substance in the expansion groove 404 will be cold contracted, and the heat-conducting stressed plate 405 will be pulled back to the initial position, facilitating subsequent use. It should be noted that when the heat-conducting disc 5 is in the third PTC heat-conducting ring 501, since the limit temperature of the third PTC heat-conducting ring 501 is 30 degrees, the conducted temperature will only be adjusted between 25 degrees and 30 degrees, and the temperature can be stabilized in a certain interval. The process of gradually moving the heat-conducting disc 5 to the second PTC heat-conducting ring 502 requires 10-15 minutes, which can fully meet the required time and data of the experiment. Similarly, the time required for the heat-conducting disc 5 to move from the second PTC heat-conducting ring 502 to the first PTC heat-conducting ring 503 is the same as the time described above. Through the above design, the probe pin detection, power-on detection and temperature detection can be combined, and the use of the device is extremely convenient. Only a single operator is needed to complete the operation, which not only reduces the cost required for chip body 205 detection, but also improves the chip body 205 detection efficiency and shortens the required time.

[0037] Preferably, the substance in the reaction shell 403 is potassium carbonate-based hydrated salt. This substance will produce a high temperature of more than 100 degrees after coming into contact with water. After the water in the substance is evaporated, anhydrous potassium carbonate is obtained. When it comes into contact with water again, it will react again, improving the sustainability and repeatability of the reaction of the device.

[0038] Preferably, the lower end of the blocking plate 308 is provided with a sealing groove 310. After the sealing plate 309 and the sealing groove 310 are clamped, the sealing property of the sealing plate 309 can be improved.

[0039] Preferably, a rubber ring or other waterproof ring is arranged at the connection between the moving rod 307 and the water storage cylinder 306 to prevent the liquid in the upper cavity of the water storage cylinder 306 from flowing out.

[0040] Preferably, the circumference of the moving rod 307 is sleeved with a spring 305. Through the elastic expansion of the spring 305, the pulling plate 304 can be pushed upwards to reset the component, facilitating subsequent use.

[0041] Preferably, the temperatures of the first PTC heat-conducting ring 503, the second PTC heat-conducting ring 502 and the third PTC heat-conducting ring 501 are different when they are shipped. For example, the first PTC heat-conducting ring 503, the second PTC heat-conducting ring 502 and the third PTC heat-conducting ring 501 are respectively set to 30 degrees, 60 degrees and 90 degrees. This results in that the heat and temperature transferred by them will not exceed the set threshold, so that different gears of the device can be realized. In addition, the PTC material can heat quickly before the temperature reaches the critical point, so that the required heat and temperature of different gears can be quickly reached to meet the detection needs.

[0042] For details, please refer to Figures 1-6The upper end of the reaction shell 403 is fixedly connected with a connecting pipe, the circumferential surface of the water storage cylinder 306 is fixedly connected with a delivery pipe 311, the upper end of the mounting block 101 is fixedly connected with a limiting rod 104, the upper end of the screw nut 105 is provided with a vertical hole, and the screw nut 105 is slidably connected to the circumferential surface of the limiting rod 104 through the vertical hole.

[0043] In the embodiment, the connecting pipe can discharge steam generated by heating in the reaction shell 403 and can also supplement reactants in the reaction shell 403, the delivery pipe 311 can connect an external water source, and the screw nut 105 can slide on the circumferential surface of the limiting rod 104 through the vertical hole when the screw nut 105 moves, so that the movement stability and rationality of the screw nut 105 are improved.

[0044] For details, please refer to Figures 1-6 The upper end of the screw rod 103 is fixedly connected with an anti-dropping block 106, the upper end of the workbench 1 is provided with a heat insulation groove 202, the lower end of the top plate 2 is fixedly connected with a heat insulation plate 201, the upper end of the top plate 2 is fixedly connected with an electricity connecting cord 203, and the upper end of the electricity connecting cord 203 is fixedly connected with an electricity connecting wire 204.

[0045] In the embodiment, the electricity connecting cord 203 and the electricity connecting wire 204 can conveniently connect an external current with the detection probe 207, and when the top plate 2 is covered on the upper end of the workbench 1, the heat insulation plate 201 can be inserted into the heat insulation groove 202, so that the heat preservation of the device is improved and the temperature is conveniently constant.

[0046] Working principle and use process of the device:

[0047] When the chip body 205 needs to be detected, the chip body 205 is placed in the placement slot 206, in the process, the plurality of conductive pins 208 and the plurality of conductive laces 209 are contacted, the external current is introduced into the chip body 205, the chip body 205 is powered on, the performance and power-on condition of the chip body 205 are detected, and then the motor 102 is started to rotate the output end and drive the lead screw 103 to rotate synchronously, the lead screw nut 105 connected with the circumferential surface of the lead screw 103 starts to move, and then drives the top plate 2, the moving block 3, the pressing rod 301, the pressing block 302 and the plurality of detection probes 207 to descend synchronously. On the one hand, the vertical movement of the plurality of detection probes 207 will contact the contact end of the conductive pin 208 and the conductive lace 209, and detect the power-on condition, frequency, voltage and the like of the conductive pin 208 and the conductive lace 209. On the other hand, the descent of the pressing block 302 will contact and pull the pulling plate 304 and push the moving rod 307 and the sealing plate 309 downward, so that the sealing plate 309 gradually moves downward and leaves the closing of the water-permeable hole. Then the liquid in the upper cavity of the blocking plate 308 enters the lower region of the water storage cylinder 306 through the water-permeable hole, and then is transmitted to the reaction shell 403 through the transmission pipe 4, reacts with the substance in the reaction shell 403, and generates heat. Then the heat of the reaction is conducted to the expansion tank 404 through the heat conduction rod 402. First, the heat is conducted to the substance in the expansion tank 404, which itself will produce a thermal expansion effect, pushing the heat-conducting stressed plate 405, the heat-conducting pushing rod 406 and the heat-conducting disc 5 to move upward. Secondly, because the substance itself carries heat, the heat is conducted to the heat sink 508 through the heat-conducting disc 5, the third PTC heat-conducting ring 501, the first conduction rod 504, the total connecting disc 507, and then the heat sink 508 heats the chip body 205, thereby simulating the power-on condition of the chip body 205 under the heating condition and whether there is a problem in signal transmission or operation. Finally, because the reaction shell 403 continuously reacts to generate heat, the substance in the expansion tank 404 will continuously expand and heat, thereby continuously pushing the heat-conducting stressed plate 405 upward, so that the heat-conducting disc 5 is separated from the third PTC heat-conducting ring 501 and enters the second PTC heat-conducting ring 502. Because the heat conductivity of the second PTC heat-conducting ring 502 is better than that of the third PTC heat-conducting ring 501, more heat will be conducted to the heat sink 508 through the second conduction rod 505 at this time. At this time, the temperature of the chip body 205 will be heated twice, simulating the temperature condition of the chip body 205 under the heating condition. Similarly, after the heat continues to be transmitted, the heat-conducting disc 5 will finally move to the first PTC heat-conducting ring 503 and contact it. The heat conductivity of the first PTC heat-conducting ring 503 is better than that of the third PTC heat-conducting ring 501 and the second PTC heat-conducting ring 502, so that the heat received by the chip body 205 will continue to increase, and the temperature will continue to rise, thereby simulating whether the performance of the chip body 205 under high heat condition exists corresponding problem. After the complete reaction in the reaction shell 403, the temperature gradually decreases, and the substance in the expansion tank 404 will shrink.The heat-conducting force plate 405 is pulled back to the initial position, facilitating subsequent use. It should be noted that when the heat-conducting disc 5 is in the third PTC heat-conducting ring 501, the temperature conducted is between 25 and 30 degrees, and the temperature can be stabilized in a certain interval. The process of gradually moving the heat-conducting disc 5 to the second PTC heat-conducting ring 502 requires 10-15 minutes, which can fully meet the required time and data for the experiment. Similarly, the time required for the heat-conducting disc 5 to move from the second PTC heat-conducting ring 502 to the first PTC heat-conducting ring 503 is the same as the time described above. Through the above design, the probe pin detection, power-on detection and temperature detection can be combined, and the use of the device is extremely convenient. Only a single operator is required to perform convenient operation, which can not only reduce the cost required for the chip body 205 detection, but also improve the chip body 205 detection efficiency and shorten the required time.

[0048] The above examples are only used to illustrate the technical solutions of the present application, and not to limit them. Although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions described in the foregoing examples can be modified, or some technical features can be replaced by equivalent ones. These modifications or replacements do not change the essence of the corresponding technical solutions out of the protection scope of the technical solutions of the embodiments of the present application.

Claims

1. An integrated circuit chip testing apparatus comprising a worktable (1), characterized in that: The upper end of the workbench (1) is provided with a placing groove (206), and the placing groove (206) is provided with a chip body (205). The inner surface of the placing groove (206) is fixedly connected with a plurality of conductive ladders (209). The outer surface of the chip body (205) is fixedly connected with a plurality of conductive pins (208). The plurality of conductive pins (208) are electrically connected with the plurality of conductive ladders (209) respectively. The circumferential surface of the workbench (1) is fixedly connected with a stabilizing plate (303). The lower end of the stabilizing plate (303) is fixedly connected with a water storage cylinder (306). The upper end of the stabilizing plate (303) is movably penetrated by a moving rod (307). The upper and lower ends of the moving rod (307) are fixedly connected with a pulling plate (304) and a sealing plate (309) respectively. The circumferential surface of the water storage cylinder (306) is fixedly connected with a blocking plate (308). The upper end of the blocking plate (308) is provided with a water permeable hole. The upper side and the outer side of the workbench (1) are respectively provided with a pressing mechanism and a heat generating mechanism. The pressing mechanism is used for detecting the power-on condition of the conductive ladders (209) and the conductive pins (208), and pressing the pulling plate (304) downward. The heat generating mechanism is used for generating heat.

2. An integrated circuit chip testing apparatus according to claim 1, wherein: The pressing mechanism comprises a top plate (2), a moving block (3), a pressing rod (301), a pressing block (302), a plurality of detection probes (207) and a driving assembly. The driving assembly is arranged on the outer side of the workbench (1). The top plate (2) is connected with the driving assembly. The moving block (3) is fixedly connected with the circumferential surface of the top plate (2). The plurality of detection probes (207) are fixedly connected with the lower end of the top plate (2). The pressing rod (301) is fixedly connected with the lower end of the moving block (3). The pressing block (302) is fixedly connected with the lower end of the pressing rod (301). The driving assembly is used for driving the top plate (2) and the plurality of components to descend.

3. An integrated circuit chip testing apparatus according to claim 2, wherein: The driving assembly comprises a mounting block (101), a motor (102), a lead screw (103) and a lead screw nut (105). The mounting block (101) is fixedly connected with the circumferential surface of the workbench (1). The motor (102) is fixedly connected with the lower end of the mounting block (101). The lead screw (103) is rotatably connected with the upper end of the mounting block (101). The lead screw nut (105) is threadedly connected with the circumferential surface of the lead screw (103), and the lead screw nut (105) is fixedly connected with the top plate (2).

4. An integrated circuit chip testing apparatus according to claim 3, wherein: The heat generating mechanism comprises a transmission pipe (4), a placing plate (401), a reaction shell (403) and a heat conducting rod (402). The placing plate (401) is fixedly connected with the circumferential surface of the workbench (1). The reaction shell (403) is fixedly connected with the upper end of the placing plate (401). The transmission pipe (4) is fixedly connected with the circumferential surfaces of the reaction shell (403) and the water storage cylinder (306). The heat conducting rod (402) is fixedly connected with the lower end of the placing plate (401).

5. An integrated circuit chip testing apparatus according to claim 4, wherein: The application also comprises a stepped heat conduction mechanism, which is composed of an expansion groove (404), a heat-conducting stress plate (405), a heat-conducting pushing rod (406), a heat-conducting disc (5) and a heat resistance component, the expansion groove (404) is arranged in the workbench (1), the heat-conducting rod (402) is connected with the substance filled in the expansion groove (404), the heat-conducting stress plate (405) is slidingly connected in the expansion groove (404), the heat-conducting pushing rod (406) is fixedly connected to the upper end of the heat-conducting stress plate (405), the heat-conducting disc (5) is fixedly connected to the upper end of the heat-conducting pushing rod (406), and the heat resistance component is arranged in the expansion groove (404) and is used for controlling the heat transfer through the heat conductivity.

6. An integrated circuit chip testing apparatus according to claim 5, wherein: The heat resistance component is composed of a total connecting disc (507), a total connecting groove (509), a third PTC heat-conducting ring (501), a first conducting rod (504), a second PTC heat-conducting ring (502), a second conducting rod (505), a first PTC heat-conducting ring (503), a third conducting rod (506) and a heat dissipation plate (508), the third PTC heat-conducting ring (501), the second PTC heat-conducting ring (502) and the first PTC heat-conducting ring (503) are fixedly connected to the circumferential surface of the expansion groove (404), the total connecting groove (509) is arranged in the workbench (1), the total connecting disc (507) is fixedly connected in the total connecting groove (509), the first conducting rod (504) is fixedly connected to the circumferential surface of the third PTC heat-conducting ring (501) and the total connecting disc (507), the second conducting rod (505) is fixedly connected to the circumferential surface of the second PTC heat-conducting ring (502) and the total connecting disc (507), the third conducting rod (506) is fixedly connected to the proximal end of the first PTC heat-conducting ring (503) and the total connecting disc (507), and the heat dissipation plate (508) is fixedly connected to the lower inner wall of the placing groove (206).

7. An integrated circuit chip testing apparatus according to claim 6, wherein: The upper end of the reaction shell (403) is fixedly connected with a connecting pipe, and the circumferential surface of the water storage cylinder (306) is fixedly connected with a transmission pipe (311).

8. An integrated circuit chip testing apparatus according to claim 7, wherein: The upper end of the mounting block (101) is fixedly connected with a limiting rod (104), and the upper end of the screw nut (105) is provided with a vertical hole, and the screw nut (105) is slidingly connected to the circumferential surface of the limiting rod (104) through the vertical hole.

9. An integrated circuit chip testing apparatus according to claim 8, wherein: The upper end of the screw rod (103) is fixedly connected with an anti-dropping block (106), the upper end of the workbench (1) is provided with a heat insulation groove (202), and the lower end of the top plate (2) is fixedly connected with a heat insulation plate (201).

10. An integrated circuit chip testing apparatus according to claim 9, wherein: The upper end of the top plate (2) is fixedly connected with an electricity connecting rope (203), and the upper end of the electricity connecting rope (203) is fixedly connected with an electricity connecting wire (204).

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