Optical module capable of improving heat dissipation efficiency and assembling method thereof

Abstract

The invention relates to the technical field of optical modules, in particular to an optical module capable of improving heat dissipation efficiency and an assembling method of the optical module. The heat conduction assembly is arranged between the circuit board and the shell; the heat conduction assembly comprises a first heat conduction cover plate and a heat conduction bridging piece, the first heat conduction cover plate abuts against the first optical assembly in a heat conduction mode, one end of the heat conduction bridging piece abuts against one end of the first heat conduction cover plate, and the other end of the heat conduction bridging piece extends to the position below the covering area of the radiator; wherein the first optical assembly is located on the circuit board, and when the optical module is inserted into a mouse cage of the optical network terminal, the area where the first optical assembly is located and the area covered by the radiator are mutually staggered in the vertical direction. By arranging the heat conduction bridging piece between the first heat conduction cover plate and the second heat conduction cover plate, the problem that in the prior art, heat dissipation is poor due to the fact that an optical assembly and a radiator are arranged in a staggered mode is effectively solved.

Description

Technical Field

[0001] This invention relates to the field of optical module technology, and in particular to an optical module with improved heat dissipation efficiency and its assembly method. Background Technology

[0002] In the field of optical communication, optical modules, as the core components for realizing photoelectric signal conversion, directly determine the reliability of optical transmission systems. As data transmission rates evolve towards 800Gbps and above, the power consumption of optical devices such as optical emitting components and driver chips integrated within optical modules increases significantly, leading to a sharp rise in heat flux density per unit volume.

[0003] Current optical modules generally employ external squirrel-cage heat sinks for passive cooling, which achieves heat conduction through direct contact between the metal thermally conductive structure and the internal heat-generating components. However, due to the trend towards miniaturization in optical module design, the internal circuit board layout space is highly compressed, resulting in some irregularly shaped or specially arranged optical devices being unable to form effective thermal coupling with the heat sink's thermally conductive structure. This physical misalignment directly interrupts the heat conduction path, forcing heat to be transferred through inefficient air convection or low thermal conductivity media, causing the local heat flux density to significantly exceed the design threshold.

[0004] To alleviate this problem, existing technologies attempt to improve heat dissipation by expanding the heat sink fin area or filling it with thermally conductive adhesive. However, the former is limited by module size constraints, while the latter poses long-term reliability risks. Some solutions even require sacrificing module integration to adjust component layout, which contradicts the development trend of high-density integration in optical modules.

[0005] Therefore, overcoming the shortcomings of the existing technology is an urgent problem to be solved in this technical field. Summary of the Invention

[0006] The technical problem to be solved by the embodiments of the present invention is the low heat dissipation efficiency of optical modules caused by the physical misalignment between optical devices and heat sink structures on existing optical modules.

[0007] The embodiments of the present invention adopt the following technical solutions: On the one hand, an optical module with improved heat dissipation efficiency is provided. The optical module includes: a housing 1 and a circuit board 3, the circuit board 3 being disposed inside the housing 1; the optical module is used to be plugged into the cage 2 of an optical network terminal, the cage 2 being provided with a heat sink 20, and the optical module also includes a heat-conducting component 4; the heat-conducting component 4 is disposed between the circuit board 3 and the housing 1. The heat-conducting component 4 includes a first heat-conducting cover plate 40 and a heat-conducting bridge component 41. The first heat-conducting cover plate 40 is in heat-conducting contact with the first optical component 30. One end of the heat-conducting bridge component 41 abuts against one end of the first heat-conducting cover plate 40, and the other end of the heat-conducting bridge component 41 extends below the area covered by the heat sink 20. The first optical component 30 is located on the circuit board 3, and when the optical module is plugged into the cage 2 of the optical network terminal, the area where the first optical component 30 is located is offset from the area covered by the heat sink 20 in the vertical direction.

[0008] Furthermore, a second optical component 31 is also provided on the circuit board 3, and the second optical component 31 is located below the area covered by the heat sink 20; The heat-conducting component 4 also includes a second heat-conducting cover plate 42, which is in thermal contact with the second optical component 31, and the other end of the heat-conducting bridge 41 abuts against one end of the second heat-conducting cover plate 42.

[0009] Furthermore, after the first optical component 30 and the second optical component 31 are assembled within the optical module, each component inside them forms an inverted structure relative to the heat sink 20.

[0010] Furthermore, the lower surface of the thermally conductive bridge 41 is provided with a first surrounding plate 411 and a second support plate 412, the first surrounding plate 411 being disposed near the first thermally conductive cover plate 40, and the second support plate 412 being disposed near the second thermally conductive cover plate 42. The first heat-conducting cover plate 40 and the first enclosure plate 411 are assembled to form an electromagnetic shielding inner cavity.

[0011] Furthermore, a first notch 4110 is provided at the bottom of the first enclosure 411, the first notch 4110 being used to allow the optical fiber of the first optical component 30 to pass through. The second support plate 412 has a second notch 4120 on each side. The second notch 4120 is used to avoid the optical fiber and allow the optical fiber to pass through the second notch 4120.

[0012] Furthermore, the second heat-conducting cover plate 42 includes a first sub-cover plate 420 and a second sub-cover plate 421 that can be assembled into an electromagnetic shielding cavity. The first sub-cover plate 420 is located between the heat-conducting bridge member 41 and the second sub-cover plate 421, and the first sub-cover plate 420 abuts against the heat-conducting bridge member 41 and the second sub-cover plate 421 respectively.

[0013] Furthermore, the first sub-cover plate 420 is provided with a second mating concave surface 4200, and the second sub-cover plate 421 is provided with a second mating protrusion 4210, and the second mating concave surface 4200 and the second mating protrusion 4210 are coupled to each other.

[0014] Furthermore, the thermally conductive bridging component 41 is provided with a third mating boss 413, and the first sub-cover plate 420 is provided with a third mating concave surface 4201, and the third mating boss 413 and the third mating concave surface 4201 are coupled to each other.

[0015] Furthermore, the optical module also includes an optical connector 5, and the second optical component 31 is disposed between the first optical component 30 and the optical connector 5. The first optical component 30 and the second optical component 31 are connected to the optical connector 5 via optical fibers.

[0016] Furthermore, the first heat-conducting cover plate 40 is provided with a first mating concave surface 400, and the heat-conducting bridge member 41 is provided with a first mating boss 410, and the first mating concave surface 400 and the first mating boss 410 are coupled to each other.

[0017] Furthermore, the heat-conducting component 4 also includes one or more first heat-conducting sheets 43, which overlap at the seams between different structural components in the heat-conducting component 4.

[0018] Furthermore, the first heat-conducting sheet 43 is a tungsten copper sheet, a graphene sheet, or a heat-conducting adhesive sheet.

[0019] Furthermore, the heat-conducting component 4 also includes a second heat-conducting sheet 44 and a heat pipe 45 that abut against each other; the second heat-conducting sheet 44 is disposed on the first heat-conducting cover plate 40 and the heat-conducting bridge member 41, and the heat pipe 45 is fixedly disposed on the housing 1.

[0020] Furthermore, the second heat-conducting sheet 44 is a tungsten copper sheet, a graphene sheet, or a thermally conductive film.

[0021] Furthermore, the first optical component 30 and / or the second optical component 31 are composed of one or more of the following: a laser array, a detector array, an optical path structure, a heat sink, and a thermoelectric cooler (TEC).

[0022] Furthermore, on the other side of the circuit board 3, a protective cover for protecting the optical device is provided in the area of ​​the first optical component 30, wherein the other side of the circuit board 3 is disposed opposite to the side that fixes the first heat-conducting cover plate 40.

[0023] Secondly, a method for assembling an optical module to improve heat dissipation efficiency is provided, including: After the internal structural components of the first optical component 30 are assembled, the bottom surface of the thermoelectric cooler in the first optical component 30 is fixed facing the inner wall of the first heat-conducting cover plate 40. Control the first heat-conducting cover plate 40, and after passing the first optical component 30 through the pre-set through slot on the circuit board 3 and completing the alignment of the laser array and / or detector array chip pins on the first optical component 30 with the gold fingers on the back of the circuit board 3, complete the fixation of the first heat-conducting cover plate 40 to the circuit board 3. The second optical component 31 is fixed to the second heat-conducting cover plate 42, and the second heat-conducting cover plate 42 is fixed to the circuit board 3, through the same assembly process as the first optical component 30. After spatial positioning of a group of optical fibers in the first optical component 30, the thermal bridging component 41 is connected to the first thermal cover plate 40, and the thermal bridging component 41 is fixed to the circuit board 3.

[0024] Furthermore, the fiber optic adapter ports of the first optical component 30 and the second optical component 31 are assembled and fixed in the optical module.

[0025] Furthermore, when the optical module also includes one or more first heat-conducting sheets 43, second heat-conducting sheets 44, and heat pipes 45, the method includes: The first heat-conducting sheet 43 is overlapped at the joint between different structural components in the heat-conducting assembly 4; The second heat-conducting sheet 44 is disposed on the first heat-conducting cover plate 40 and the heat-conducting bridge member 41, and the heat pipe 45 is fixedly disposed on the housing 1 of the optical module.

[0026] Compared with the prior art, the beneficial effects of the present invention are as follows: the heat of the first optical component, which is misaligned with the heat sink, is conducted to the heat-conducting bridge through the first heat-conducting cover plate, then to the housing, and finally dissipated through the heat sink on the cage, effectively solving the problem of poor heat dissipation caused by the misaligned arrangement of the optical component and the heat sink in the prior art. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a connection diagram of an optical communication system provided in an embodiment of the present invention; Figure 2 This is a structural diagram of an optical module plugged into a mouse cage according to an embodiment of the present invention; Figure 3 This is a diagram of an optical module provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of a heat sink for an optical module that improves heat dissipation efficiency, provided in an embodiment of the present invention. Figure 5 This is a schematic diagram of the overall structure of an optical module for improving heat dissipation efficiency provided in an embodiment of the present invention; Figure 6 This is an exploded view of an optical module with improved heat dissipation efficiency provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of a heat sink for an optical module that improves heat dissipation efficiency, provided in an embodiment of the present invention. Figure 8 This is a schematic diagram of a first heat-conducting cover plate, a heat-conducting bridge component, and a second heat-conducting cover plate for an optical module that improves heat dissipation efficiency, provided by an embodiment of the present invention. Figure 9 This is a bottom view schematic diagram of a first heat-conducting cover plate, a heat-conducting bridge component, and a second heat-conducting cover plate for an optical module that improves heat dissipation efficiency according to an embodiment of the present invention. Figure 10 This is a schematic diagram of a heat-conducting component for improving heat dissipation efficiency of an optical module provided in an embodiment of the present invention; Figure 11 This is a schematic diagram of a second heat-conducting sheet for an optical module that improves heat dissipation efficiency, provided in an embodiment of the present invention. Figure 12 This is a schematic diagram of the first heat-conducting sheet of an optical module for improving heat dissipation efficiency according to an embodiment of the present invention; Figure 13 This is a schematic diagram of a cover plate and heat pipe for an optical module that improves heat dissipation efficiency, provided by an embodiment of the present invention. Figure 14 This is a schematic diagram of a first optical component and a second optical component of an optical module for improving heat dissipation efficiency, provided in an embodiment of the present invention. Figure 15 This is an exploded view of an optical module with improved heat dissipation efficiency provided in an embodiment of the present invention; Figure 16 This is a schematic diagram of an installation method for an optical module that improves heat dissipation efficiency, provided by an embodiment of the present invention. Figure 17 This is a schematic diagram of the structure of a heat-conducting component provided in an embodiment of the present invention; Figure 18 This is a schematic diagram of another heat-conducting component provided in an embodiment of the present invention; Figure 19 This is a schematic diagram of another heat-conducting component provided in an embodiment of the present invention; Figure 20 This is a schematic diagram of another heat-conducting component provided in an embodiment of the present invention.

[0029] The accompanying diagram is described as follows: 1. Housing; 2. Cage; 20. Heat sink; 3. Circuit board; 30. First optical component; 30. First thermoelectric cooler; 300. First laser; 301. Second optical component; 31. Second thermoelectric cooler; 310. Second laser; 311. First protective cover; 32. Second protective cover; 33. First through slot; 34. Second through slot; 35. Heat-conducting component; 4. First heat-conducting cover plate; 40. First mating concave surface; 400. First reference slot; 401. Heat-conducting bridge component; 41. First mating boss; 410. First enclosure plate; 4110. First notch; 412. Second support plate; 412. Second notch. 0. Third docking boss 413, second heat-conducting cover plate 42, first sub-cover plate 420, second docking concave surface 4200, third docking concave surface 4201, second reference groove 4202, second sub-cover plate 421, second docking boss 4210, third notch 4211, first heat-conducting sheet 43, second heat-conducting sheet 44, heat pipe 45, optical connector 5, optical network terminal 6, optical fiber 60, network cable 61, optical module interface 62, network cable interface 63, PCB board 64, remote server 7, local information processing equipment 8, optical module 9, upper shell 90, lower shell 91. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0031] Unless the context otherwise requires, throughout this specification, the term "comprising" is interpreted as openly encompassing, meaning "including, but not limited to." In the description of this specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples; that is, although they may be incorporated into embodiments or examples using the above terms for reasons such as order and position, it does not limit them to be incorporated in combination by a single embodiment or example.

[0032] In the description of this invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0033] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more. Furthermore, for example, the description may use the prefix "A" or "B" to describe the same type of nouns as two independent entities. In this case, the corresponding features defined with "A" and "B" are used only to distinguish between similar entities and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0034] In describing some embodiments, the terms "coupled," "coupled," and "connected," and their derivative expressions, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. Similarly, the term "coupled" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the terms "connected" or "coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other, such as "optical coupling," "wireless connection," etc. The embodiments disclosed herein are not necessarily limited to the scope of this invention.

[0035] In the description of this invention, the expression “A and / or B” (where A and B are used to formally represent specific features) will be used. The corresponding expression includes the following three combinations: only A, only B, and a combination of A and B.

[0036] As used in this invention, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from a particular value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0037] Figure 1 This is a connection diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes an optical network terminal 6, a remote server 7, a local information processing device 8, an optical module 9, an optical fiber 60, and a network cable 61.

[0038] One end of optical fiber 60 is connected to the remote server 7, and the other end is connected to the optical network terminal 6 via optical module 9. Optical fiber itself can support long-distance signal transmission, such as signal transmission over several kilometers (6 to 8 kilometers). Theoretically, ultra-long-distance transmission can be achieved by using repeaters. Therefore, in typical optical communication systems, the distance between the remote server 7 and the optical network terminal 6 can usually reach several kilometers, tens of kilometers, or hundreds of kilometers.

[0039] One end of the network cable 61 is connected to the local information processing device 8, and the other end is connected to the optical network terminal 6. The local information processing device 8 can be any one or more of the following devices: router, switch, computer, mobile phone, tablet computer, television, etc.

[0040] The physical distance between the remote server 7 and the optical network terminal 6 is greater than the physical distance between the local information processing device 8 and the optical network terminal 6. The connection between the local information processing device 8 and the remote server 7 is completed by optical fiber 60 and network cable 61; while the connection between optical fiber 60 and network cable 61 is completed by optical module 9 and optical network terminal 6.

[0041] Optical module 9 includes an optical port and an electrical port. The optical port is configured to connect to optical fiber 60, thereby establishing a bidirectional optical signal connection between optical module 9 and optical fiber 60; the electrical port is configured to connect to optical network terminal 6, thereby establishing a bidirectional electrical signal connection between optical module 9 and optical network terminal 6. Optical module 9 can perform mutual conversion between optical signals and electrical signals, thereby establishing a connection between optical fiber 60 and optical network terminal 6. For example, optical signals from optical fiber 60 are converted into electrical signals by optical module 9 and then input to optical network terminal 6, while electrical signals from optical network terminal 6 are converted into optical signals by optical module 9 and then input to optical fiber 60.

[0042] The optical network terminal 6 includes a generally rectangular housing, and an optical module interface 62 and a network cable interface 63 disposed on the housing. The optical module interface 62 is configured to connect to an optical module 9, thereby establishing a bidirectional electrical signal connection between the optical network terminal 6 and the optical module 9. The network cable interface 63 is configured to connect to a network cable 61, thereby establishing a bidirectional electrical signal connection between the optical network terminal 6 and the network cable 61. The optical module 9 and the network cable 61 are connected through the optical network terminal 6. For example, the optical network terminal 6 transmits electrical signals from the optical module 9 to the network cable 61 and vice versa. Therefore, the optical network terminal 6 acts as a host computer for the optical module 9, monitoring its operation. Besides the optical network terminal 6, the host computer for the optical module 9 may also include an optical line terminal (OLT), etc.

[0043] The remote server 7 establishes a bidirectional signal transmission channel with the local information processing equipment 8 through optical fiber 60, optical module 9, optical network terminal 6 and network cable 61.

[0044] Figure 2 This is a structural diagram of an optical module inserted into a mouse cage according to some embodiments. It is not difficult to see... Figure 2 The optical module in the middle is compared to Figure 1 The optical modules in this system belong to a completely new type of optical module standard. Figure 1 The optical module standard in this context refers to an operation where the optical port and electrical port are located at opposite ends of the optical module. Figure 2 The optical module type described here refers to a configuration where both the optical and electrical ports are located at the end furthest from the handle. This change in the optical module structure diagram serves two purposes: firstly, to emphasize that the technical solution of this invention is applicable to optical modules of various types, providing motivation for improvement when encountering the technical problems addressed by this invention; secondly, to emphasize that a typical example of the technical solution of this invention is... Figure 2 The proposed improvements are based on the optical module scenario shown. The examples shown are... Figure 1 The optical module examples given are two completely different optical module standards. To clearly show the connection relationship between optical module 9 and optical network terminal 6, Figure 2 Only the structure of the optical network terminal 6 related to the optical module 9 is shown. For example... Figure 2 As shown, the optical network terminal 6 also includes a PCB board 64 disposed within a housing, a cage 2 disposed on the surface of the PCB board 64, an electrical connector disposed inside the cage 2, and a heat sink 20 disposed on the surface of the cage 2. The electrical connector is configured to connect to the electrical port of the optical module 9. The heat sink has protrusions such as fins to increase the heat dissipation area.

[0045] Optical module 9 is inserted into the cage 2 of optical network terminal 6, where it is secured. Heat generated by optical module 9 is conducted to the cage 2 and then dissipated through a heat sink. After insertion, the electrical port of optical module 9 connects to the electrical connector inside the cage 2, establishing a bidirectional electrical signal connection between optical module 9 and optical network terminal 6. Furthermore, the optical port of optical module 9 connects to optical fiber 60, establishing a bidirectional electrical signal connection between optical module 9 and optical fiber 60.

[0046] Figure 3 Here is a structural diagram of an optical module according to some embodiments, such as Figure 3 As shown, the optical module 9 includes a housing and a circuit board 3. The housing includes an upper housing 90 and a lower housing 91. The upper housing 90 covers the lower housing 91 to form the aforementioned housing with two openings. The outer contour of the housing is generally rectangular.

[0047] In some embodiments of this disclosure, the lower housing 91 includes a bottom plate and two lower side plates located on both sides of the bottom plate and arranged perpendicularly to the bottom plate; the upper housing 90 includes a cover plate and two upper side plates located on both sides of the cover plate and arranged perpendicularly to the cover plate, and the two side walls are combined with the two side plates to realize that the upper housing 90 covers the lower housing 91.

[0048] The direction of the line connecting the two openings can be consistent with or inconsistent with the length direction of the optical module 9. For example, the two openings are located at the ends of the optical module 9. Alternatively, one opening may be located at the end of the optical module 9, while the other opening is located on the side of the optical module 9. One opening is an electrical port, from which the gold fingers of the circuit board 3 extend and are inserted into a host computer (such as an optical network terminal 6); the other opening is an optical port, configured to connect to an external optical fiber 60, allowing the optical fiber 60 to connect to the interior of the optical module 9.

[0049] The assembly method using an upper housing 90 and a lower housing 91 facilitates the installation of components such as circuit board 3 into the housing, and the upper housing 90 and lower housing 91 can provide encapsulation and protection for these components. Furthermore, the assembly of components such as circuit board 3 facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components, which is beneficial for automated production.

[0050] In some embodiments, the upper housing 90 and the lower housing 91 are generally made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0051] In some embodiments, the optical module 9 further includes an unlocking component located on the outer wall of its housing, the unlocking component being configured to establish a fixed connection between the optical module 9 and the host computer, or to release the fixed connection between the optical module 9 and the host computer.

[0052] For example, the unlocking component is located on the outer wall of the two lower side plates of the lower housing 91, and includes a locking component that matches the cage of the host computer (e.g., the mouse cage 2 of the optical network terminal 6). When the optical module 9 is inserted into the cage of the host computer, the locking component of the unlocking component fixes the optical module 9 in the cage of the host computer; when the unlocking component is pulled, the locking component of the unlocking component moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the locking relationship between the optical module 9 and the host computer, thereby allowing the optical module 9 to be pulled out of the cage of the host computer.

[0053] Circuit board 3 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0054] Circuit board 3 is generally a rigid circuit board. Due to its relatively rigid material, the rigid circuit board can also perform a load-bearing function, such as supporting the chip stably; the rigid circuit board can also be inserted into the electrical connector in the host computer cage.

[0055] The circuit board 3 also includes gold fingers formed on its end surface, each gold finger consisting of multiple independent pins. The circuit board 3 is inserted into the mouse cage 2 and is electrically connected to an electrical connector within the mouse cage 2 via the gold fingers. The gold fingers may be located only on one side of the surface of the circuit board 3 (e.g., the upper or lower surface). The gold fingers are configured to establish an electrical connection with a host computer to enable power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0056] As demonstrated in this invention Figures 1-3In the examples, ELSFP (External Laser Small Form Factor Pluggable) is mainly used for demonstration. However, it should be noted that in the various embodiments of the present invention, the improvements to the optical path structure and / or circuit structure in the corresponding technical solutions can be applied to packaging structures including but not limited to OSFP (Octal Small Form-factor Pluggable) packaging, OSFP-XD (Octal Small Form-factor eXtraDense Pluggable) packaging, etc. Since the packaging of optical modules is more for customized shell formats to adapt to scene size, the optical path structure and / or circuit structure theories proposed by the inventive effort of the present invention should also be applicable to possible packaging formats proposed in the future, unless there is an explicit technical conflict. Therefore, they should also be understood as being within the protection scope of the present invention.

[0057] The foregoing mainly introduced the application scenarios and basic structure of optical modules. Based on this scenario, some irregularly packaged or specially arranged optical devices are misaligned with the heat sink 20, failing to form effective thermal coupling. This physical misalignment directly interrupts the heat conduction path, forcing heat to be transferred through inefficient air convection or low thermal conductivity media, resulting in local heat flux density significantly exceeding the design threshold and poor heat dissipation performance. To solve this problem, this embodiment provides an optical module with improved heat dissipation efficiency, which can improve the aforementioned issues. The specific structure of this optical module with improved heat dissipation efficiency is described below with reference to the accompanying drawings.

[0058] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0059] Example 1: Embodiment 1 of the present invention provides an optical module with improved heat dissipation efficiency, such as... Figure 3 As shown, the optical module is plugged into the cage 2 of the optical network terminal, and the cage 2 is equipped with a heat sink 20.

[0060] like Figure 4 , Figure 5 and Figure 6As shown, the optical module for improving heat dissipation efficiency includes: a housing 1, a circuit board 3, and a heat-conducting component 4; the circuit board 3 is disposed inside the housing 1, and the heat-conducting component 4 is disposed between the circuit board 3 and the housing 1; a first optical component 30 is disposed on the circuit board 3, and when the optical module is plugged into the cage 2 of the optical network terminal, the area where the first optical component 30 is located is vertically offset from the area covered by the heat sink 20, that is, the first optical component 30 is located outside the area covered by the heat sink 20 (within the range of 1-2). Figure 4 For reference, the corresponding Figure 6 The first optical component 30 is located in Figure 4 The left side area of ​​cage 2, as indicated in the diagram, can also be accessed via... Figure 7 (The partial structural perspective view shows it intuitively). The heat-conducting component 4 includes a first heat-conducting cover plate 40 and a heat-conducting bridge component 41. The first heat-conducting cover plate 40 is in heat-conducting contact with the first optical component 30. One end of the heat-conducting bridge component 41 is in contact with one end of the first heat-conducting cover plate 40. The other end of the heat-conducting bridge component 41 extends below the area covered by the heat sink 20 to conduct heat to the heat sink 20.

[0061] In this configuration, after the first optical component 30 and the second optical component 31 are assembled within the optical module, each component inside them forms an inverted structure relative to the heat sink 20.

[0062] In one embodiment, the other end of the thermally conductive bridge 41 extends below the area covered by the heat sink 20 to conduct heat to the area covered by the heat sink 20, and then dissipate heat through the heat sink 20. In this embodiment of the invention, the reason for designing the combined structure of the first thermally conductive cover plate 40 and the thermally conductive bridge 41 is that the first thermally conductive cover plate 40 serves to support and fix the flip-mounted first optical component 30. Therefore, its size is preferably made so that the inner lining can just support the outer surface of the thermoelectric cooler (TEC) of the first optical component 30. This can maximize the operational redundancy space for the optical fiber led out from the first optical component 30 and avoid possible damage to the optical fiber during operation.

[0063] In one embodiment, a heat-conducting structure is provided below the area covered by the heat sink 20, and the other end of the heat-conducting bridge 41 extends to the heat-conducting structure to conduct heat to the heat-conducting structure, and then conduct heat to the heat sink 20 through the heat-conducting structure to dissipate heat through the heat sink 20.

[0064] In this embodiment, the heat from the first optical component 30, which is misaligned with the heat sink 20, is conducted through the first heat-conducting cover plate 40 to the heat-conducting bridge component 41, then to the housing 1, and finally dissipated through the heat sink 20 on the cage 2. This effectively solves the problem of poor heat dissipation caused by the misaligned arrangement of the optical component and the heat sink 20 in the prior art.

[0065] In one embodiment, the circuit board 3 is further provided with a second optical component 31, which is located below the area covered by the heat sink 20; the thermally conductive component 4 further includes a second thermally conductive cover plate 42, which is in thermal contact with the second optical component 31, and the other end of the thermally conductive bridge 41 abuts against one end of the second thermally conductive cover plate 42. The second thermally conductive cover plate 42 is the thermally conductive structure below the area covered by the heat sink 20. Thus, a relatively complete structural scheme for the heat-conducting component 4 of this invention embodiment is constructed. Similarly, the unique assembly process accompanying this invention embodiment can also be highlighted, including: controlling the first heat-conducting cover plate 40; after passing the first optical component 30 through a pre-set slot on the circuit board 3 and aligning the laser array and / or detector array chip pins on the first optical component 30 with the gold fingers on the back of the circuit board 3, fixing the first heat-conducting cover plate 40 to the circuit board 3; fixing the second optical component 31 to the second heat-conducting cover plate 42 and the second heat-conducting cover plate 42 to the circuit board 3 through the same assembly process as the first optical component 30; spatially guiding a group of optical fibers of the first optical component 30; and after docking the heat-conducting bridge component 41 with the first heat-conducting cover plate 40, fixing the heat-conducting bridge component 41 to the circuit board 3.

[0066] In this configuration, both the first optical component 30 and the second optical component 31 are light emitting components; alternatively, the first optical component 30 can be a light emitting component and the second optical component 31 can be a light receiving component; or alternatively, the first optical component 30 can be a light receiving component and the second optical component 31 can be a light emitting component. Furthermore, in feasible solutions, it is also possible that both the first optical component 30 and the second optical component 31 are a hybrid configuration, with one part being a light receiving component and the other part being a light emitting component.

[0067] The first optical component 30 and / or the second optical component 31 are composed of one or more of the following: laser array, detector array, optical path structure, heat sink and thermoelectric cooler TEC.

[0068] The first heat-conducting cover plate 40, the second heat-conducting cover plate 42, and the heat-conducting bridging component 41 can be made of tungsten copper or other materials with good thermal conductivity.

[0069] Continue reading Figure 6In addition to the above structure, the optical module also includes an optical connector 5. The second optical component 31 is disposed between the first optical component 30 and the optical connector 5. The first optical component 30 and the second optical component 31 are connected to the optical connector 5 via optical fibers. In this embodiment of the invention, the interface of the corresponding optical connector 5 is typically an MPO (Multi-fiber Push On) interface.

[0070] In one embodiment, the optical connector 5 and the gold fingers of the circuit board 3 are located on the same side of the optical module. For example, the gold fingers are disposed on the lower surface of the circuit board 3, and the optical connector 5 is disposed on the upper surface of the circuit board 3.

[0071] A thermally conductive bridge 41 is provided between the first thermally conductive cover plate 40 and the second thermally conductive cover plate 42. Heat from the first optical component 30, which is misaligned with the heat sink 20, is conducted through the first thermally conductive cover plate 40 to the thermally conductive bridge 41, then to the second thermally conductive cover plate 42, and finally dissipated through the heat sink 20 on the cage 2. This effectively solves the problem of poor heat dissipation caused by the misaligned arrangement of the optical component and the heat sink 20 in the prior art. It should be further noted that another innovation of the thermally conductive component 4, which leads to the core innovation of this invention, lies in the innovative inversion structure of the first optical component 30 and the second optical component 31. This allows the bottom surface of the TEC, which serves as the heat dissipation body for the first and second optical components 30 and 31, to be directly connected to the heat sink 20 through the thermally conductive component 4, thus significantly improving the heat dissipation effect compared to the conventionally mounted first optical component 30 and second optical component 31 in the prior art. The two innovative points proposed in this invention are primarily aimed at future higher-speed optical modules, such as 3.2T or even higher-speed optical modules. Due to the speed requirements, the integration of the first and second optical components is improved. For example, in this invention, a typical first optical component 30 includes eight optical devices (which may be lasers and / or detectors). In solutions with higher integration, an arrayed waveguide grating (AWG) may even be introduced into the first optical component 30 to pre-couple the output of the optical devices, thereby reducing the number of optical fibers exported from the first optical component 30.

[0072] To fully illustrate the technical solutions provided by the embodiments of the present invention, the structures provided in the above solutions will be further described in detail below.

[0073] To improve the efficiency of heat transfer between the first heat-conducting cover plate 40 and the heat-conducting bridge member 41, the contact area between them can be increased to enhance heat transfer efficiency. In one embodiment, this can be specifically achieved as follows: Figure 8 As shown, the first heat-conducting cover plate 40 is provided with a first mating concave surface 400, and the heat-conducting bridge member 41 is provided with a first mating protrusion 410. The first mating concave surface 400 and the first mating protrusion 410 are coupled to each other. In practical applications, the first mating concave surface 400 and the first mating protrusion 410 can be any shape that can be coupled to each other, such as toothed coupling or wavy coupling.

[0074] To avoid optical crosstalk or electromagnetic interference between the first optical component 30 and the second optical component 31, such as Figure 8 and Figure 9 As shown, the first thermally conductive cover plate 40 is a semi-enclosed cover plate, with an opening on only one side for optical fibers to pass through. The lower surface of the thermally conductive bridge component 41 is provided with a first enclosure plate 411 and a second support plate 412. The first enclosure plate 411 is located close to the first thermally conductive cover plate 40, and the second support plate 412 is located close to the second thermally conductive cover plate 42. The first enclosure plate 411 is also a semi-enclosed cover plate, with an opening on the side that connects with the first thermally conductive cover plate 40 for optical fibers to pass through. The first thermally conductive cover plate 40 and the first enclosure plate 411 are combined to form an electromagnetic shielding cavity to avoid optical crosstalk and electromagnetic wave crosstalk. It can also provide physical protection for optical components, optical paths, bonding wires, etc. inside the optical assembly, preventing smoke or particulate matter from entering and contaminating the optical end face and affecting the optical signal.

[0075] See Figure 6 Since the second optical component 31 is disposed between the first optical component 30 and the optical connector 5, the optical fiber connecting the first optical component 30 and the optical connector 5 needs to pass through both sides of the second optical component 31 to connect with the optical connector 5. Based on this, a first notch 4110 is provided at the bottom of the first enclosure 411, which is used to allow the optical fiber of the first optical component 30 to pass through. Specifically, the first enclosure 411 includes two oppositely disposed side plates (not shown in the figure) and a bottom plate disposed between the two side plates, and the first notch 4110 is provided below the bottom plate.

[0076] To maximize the use of the internal space of the optical module and shorten the length of the optical fiber, second notches 4120 are provided on both sides of the second support plate 412. The second notches 4120 are used to avoid the optical fiber, allowing the optical fiber to pass through the second notches 4120. This structure allows the optical fiber of the first optical component 30 to bypass the second heat-conducting cover plate 42.

[0077] like Figure 8 and Figure 9 As shown, the second thermally conductive cover plate 42 includes a first sub-cover plate 420 and a second sub-cover plate 421 capable of forming an electromagnetic shielding cavity. The first sub-cover plate 420 is located between the thermally conductive bridge member 41 and the second sub-cover plate 421, and the first sub-cover plate 420 abuts against both the thermally conductive bridge member 41 and the second sub-cover plate 421. Both the first sub-cover plate 420 and the second sub-cover plate 421 are semi-enclosed cover plates, and their combination forms an electromagnetic shielding cavity to avoid optical crosstalk and electromagnetic wave crosstalk. It also provides physical protection for the optical components, optical paths, bonding wires, etc., inside the optical assembly, preventing dust or particulate matter from entering and contaminating the optical end face and affecting the optical signal.

[0078] Specifically, to improve heat dissipation efficiency and the stability of the relative fixation between the first sub-cover plate 420 and the second sub-cover plate 421, the first sub-cover plate 420 is provided with a second mating concave surface 4200, and the second sub-cover plate 421 is provided with a second mating protrusion 4210. The second mating concave surface 4200 and the second mating protrusion 4210 are coupled to each other. In practical applications, the second mating concave surface 4200 and the second mating protrusion 4210 can be any shape that can couple to each other, such as toothed coupling or wavy coupling.

[0079] Because the first optical component 30 is located close to the optical connector 5, the optical fiber used for connection between the first optical component 30 and the optical connector 5 is relatively short. Therefore, to facilitate the connection between the two, please refer to [the relevant documentation]. Figure 9 The bottom of the second sub-cover plate 421 is provided with a third notch 4211, which is used to allow the optical fiber of the second optical component 31 to pass through.

[0080] In practical applications, the adjacent first heat-conducting cover plate 40, heat-conducting bridge component 41, first sub-cover plate 420, and second sub-cover plate 421 are in an abutment-like contact configuration. Their heat conduction effect is influenced by factors such as the contact pressure and tightness of the two contact surfaces, and the flatness and roughness of the contact surfaces. Therefore, to improve the heat conduction efficiency of the heat-conducting optical module, such as... Figure 10 , Figure 11 and Figure 12 As shown, the heat-conducting component 4 further includes one or more first heat-conducting sheets 43; the first heat-conducting sheets 43 overlap at the seams between different structural components in the heat-conducting component 4. The first heat-conducting sheets 43 are used to improve the heat conduction efficiency between different structural components.

[0081] The first heat-conducting sheet 43 is a tungsten copper sheet, a graphene sheet, a thermally conductive film, or other materials with good thermal conductivity.

[0082] In one embodiment, a plurality of first heat-conducting sheets 43 are respectively disposed at the joint between the first heat-conducting cover plate 40 and the heat-conducting bridge member 41, at the joint between the heat-conducting bridge member 41 and the first sub-cover plate 420, and at the joint between the first sub-cover plate 420 and the second sub-cover plate 421. The first heat-conducting sheets 43 can improve the thermal conductivity between the first heat-conducting cover plate 40, the heat-conducting bridge member 41, the first sub-cover plate 420, and the second sub-cover plate 421.

[0083] In one embodiment, the heat-conducting component 4 further includes a second heat-conducting sheet 44 and a heat pipe 45 that abut against each other; the second heat-conducting sheet 44 is disposed on the first heat-conducting cover plate 40 and the heat-conducting bridge member 41, and the heat pipe 45 is fixedly disposed on the housing 1.

[0084] More specifically, the second heat-conducting plate 44 is located between the first heat-conducting plate 43 and the heat pipe 45. The second heat-conducting plate 44 is fixedly connected to the first heat-conducting cover plate 40, the heat-conducting bridge 41 and the second heat-conducting cover plate 42. The heat pipe 45 is located between the first heat-conducting plate 43 and the housing 1. The heat pipe 45 is fixedly disposed on the housing 1.

[0085] The second heat-conducting sheet 44 can be a tungsten copper sheet, a graphene sheet, or a heat-conducting adhesive sheet.

[0086] In order to facilitate the fixing of the heat pipe 45, such as Figure 13 As shown, the housing 1 includes a cover plate 10, on which a receiving groove 100 is provided, wherein the length and width of the heat pipe 45 match the size of the receiving groove 100.

[0087] In the above structure, the provided heat dissipation solution mainly consists of the composition structure of the heat-conducting component 4 and the heat dissipation path of the heat-conducting component 4. For the device to be cooled, in order to improve the heat conduction efficiency between the device to be cooled in the first optical component 30 and the first heat-conducting cover plate 40, and the heat conduction efficiency between the device to be cooled in the second optical component 31 and the second heat-conducting cover plate 42, such as Figure 14As shown, the first optical component 30 includes a first thermoelectric cooler 300 and a first laser 301, and the second optical component 31 includes a second thermoelectric cooler 310 and a second laser 311. The first thermoelectric cooler 300 covers the first laser 301, and the second thermoelectric cooler 310 covers the second laser 311. The first thermoelectric cooler 300 abuts against the first heat-conducting cover plate 40, and the second thermoelectric cooler 310 abuts against the second heat-conducting cover plate 42. The first thermoelectric cooler 300 and the second thermoelectric cooler 310 actively transfer heat through the Peltier effect, which can force the temperature of the device requiring heat dissipation to be reduced to below the ambient temperature, further cooling and heat dissipating the optical module and improving the stability of the optical module during operation.

[0088] In one embodiment, a protective cover for protecting the optical device is provided on the other side of the circuit board 3 in the area of ​​the first optical component 30, wherein the other side of the circuit board 3 is disposed opposite to the side on which the first heat-conducting cover plate 40 is fixed.

[0089] like Figure 15 As shown, the optical module for improving heat dissipation efficiency also includes a first protective cover 32 and a second protective cover 33. The first protective cover 32 is disposed on the other side of the circuit board 3, covering the first optical component 30. The first optical component 30 is on the other side of the circuit board 3, covering the second optical component 31.

[0090] A first through slot 34 and a second through slot 35 are provided on the circuit board 3. The first optical component 30 passes through the first through slot 34 and the second optical component 31 passes through the second through slot 35.

[0091] In summary, based on the above-described solutions, this invention also provides a method for assembling an optical module with improved heat dissipation efficiency, applicable to the optical modules with improved heat dissipation efficiency described in the above solutions, such as... Figure 15 As shown, it includes: In step S1, after the internal structural components of the first optical component 30 are assembled, the bottom surface of the thermoelectric cooler in the first optical component 30 is fixed facing the inner wall of the first heat-conducting cover plate 40.

[0092] Similar to the installation method of the first optical component 30, after the internal structural components of the second optical component 31 are assembled, the bottom surface of the thermoelectric cooler in the second optical component 31 is fixed facing the inner wall of the second heat-conducting cover plate 42.

[0093] In step S2, the first heat-conducting cover plate 40 is controlled to pass the first optical component 30 through the pre-set slot on the circuit board 3, and after the laser array and / or detector array chip pins on the first optical component 30 are aligned with the gold fingers on the back of the circuit board 3, the first heat-conducting cover plate 40 is fixed to the circuit board 3.

[0094] Combination Figure 15 A first through slot 34 and a second through slot 35 are provided on the circuit board 3. The first optical component 30 passes through the first through slot 34 and the second optical component 31 passes through the second through slot 35.

[0095] The optical fiber connecting the first optical component 30 and the optical connector 5 passes through the bottom of the first heat-conducting cover plate 40 and the first notch 4110 of the heat-conducting bridge 41, and then passes through the second notch 4120 of the heat-conducting bridge 41 to connect with the optical connector 5; the optical fiber connecting the second optical component 31 and the optical connector 5 passes through the bottom of the second heat-conducting cover plate 42 to connect with the optical connector 5.

[0096] In step S3, the second heat-conducting cover plate 42 is controlled to pass the second optical component 31 through the pre-set through slot on the circuit board 3, and after the laser array and / or detector array chip pins on the second optical component 31 are aligned with the gold fingers on the back of the circuit board 3, the second heat-conducting cover plate 42 is fixed to the circuit board 3.

[0097] In one embodiment, the first heat-conducting sheet 43 is overlapped at the seam between different structural components in the heat-conducting assembly 4; the second heat-conducting sheet 44 is disposed on the first heat-conducting cover plate 40 and the heat-conducting bridge 41, and the heat pipe 45 is fixedly disposed on the housing 1 of the optical module.

[0098] More specifically, the first heat-conducting sheet 43 is attached to the contact points between the first heat-conducting cover plate 40 and the heat-conducting bridge member 41, the heat-conducting bridge member 41 and the first sub-cover plate 420, and the first sub-cover plate 420 and the second sub-cover plate 421; the second heat-conducting sheet 44 is fixed above the first heat-conducting sheet 43; and the heat pipe 45 is fixed to the housing 1.

[0099] In step S4, the spatial position of a group of optical fibers of the first optical component 30 is guided, and after the thermal bridging component 41 is connected to the first thermal cover plate 40, the thermal bridging component 41 is fixed to the circuit board 3.

[0100] In this embodiment, the fiber optic adapter ports of the first optical component 30 and the second optical component 31 are assembled and fixed in the optical module.

[0101] The first optical component 30 can not only actively regulate the temperature through the first thermoelectric cooler 300, but also conduct heat to the outside through the heat dissipation path formed by "first heat-conducting cover plate 40-heat-conducting bridge 41-second heat-conducting cover plate 42-first heat-conducting sheet 43-second heat-conducting sheet 44-heat pipe 45-shell 1-radiator 20", thereby improving heat dissipation efficiency.

[0102] Example 2: In practical application scenarios, such as Figure 17 and Figure 18 As shown, the heat-conducting component 4 can also be a one-piece structure. In actual installation, the first optical component 30 and the second optical component 31 need to be fixed on the heat-conducting component 4 first, and then the heat-conducting component 4 is installed on the circuit board 3. It is necessary to ensure that the pins of the first optical component 30 and the second optical component 31 are aligned with the gold fingers of the circuit board 3. This structure has high requirements for the installation accuracy of the first optical component 30 and the second optical component 31, resulting in a low yield rate in actual production. However, this structure can eliminate the need for the first heat-conducting sheet 43.

[0103] In one embodiment, to reduce the installation accuracy requirements, the heat-conducting component 4 can be installed on the circuit board 3 first, and then the first optical component 30 and the second optical component 31 can be passed through the through slot from the back of the circuit board 3 to align the pins of the first optical component 30 and the second optical component 31 with the gold fingers of the circuit board 3 respectively.

[0104] To improve ease of installation, the heat-conducting component 4 is configured as a discrete structure as described in Embodiment 1 above, which allows for the alignment of the pins of the first optical component 30 and the second optical component 31 with the gold fingers of the circuit board 3, thus reducing the difficulty of installation.

[0105] However, in the aforementioned Embodiment 1, there is no contact between the thermally conductive bridge 41 and the first sub-cover plate 420, resulting in poor heat distribution. Furthermore, the contact area between the end of the thermally conductive bridge 41 near the first sub-cover plate 420 and the circuit board 3 is small, leading to a smaller support surface and poor stability. To address this issue, this embodiment improves the thermally conductive bridge 41 and the first sub-cover plate 420 in Embodiment 1 to enhance stability and heat distribution.

[0106] In one embodiment, such as Figure 19 and Figure 20 The thermally conductive bridge component 41 is provided with a third docking boss 413, and the first sub-cover plate 420 is provided with a third docking concave surface 4201. The third docking boss 413 and the third docking concave surface 4201 are coupled to each other.

[0107] Figure 19 and Figure 20The heat-conducting component 4 shown has at least the following effects: on the one hand, by using the third mating concave surface 4201 and the third mating protrusion 413 to abut and conduct heat, heat can be transferred to the first sub-cover plate 420 more quickly and evenly, which can improve heat uniformity; on the other hand, by completing the alignment of the pins of the first optical component 30 and the second optical component 31 with the gold fingers of the circuit board 3, the installation accuracy requirements are reduced.

[0108] In one embodiment, see further. Figure 20 The inner wall of the first heat-conducting cover plate 40 is provided with a first reference groove 401, and the inner wall of the first sub-cover plate 420 is provided with a second reference groove 4202. The first reference groove 401 and the second reference groove 4202 serve as reference positioning lines when mounting TEC, making it easier to align the position when mounting TEC under a microscope.

[0109] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An optical module for improving heat dissipation efficiency, the optical module comprising: A housing (1) and a circuit board (3), wherein the circuit board (3) is disposed inside the housing (1); The optical module is used to be plugged into the cage (2) of the optical network terminal. The cage (2) is provided with a heat sink (20). The optical module is characterized in that it further includes a heat-conducting component (4); the heat-conducting component (4) is disposed between the circuit board (3) and the housing (1). The heat-conducting component (4) includes a first heat-conducting cover plate (40) and a heat-conducting bridge (41). The first heat-conducting cover plate (40) is in heat-conducting contact with the first optical component (30). One end of the heat-conducting bridge (41) is in contact with one end of the first heat-conducting cover plate (40), and the other end of the heat-conducting bridge (41) extends to the area covered by the heat sink (20). The first optical component (30) is located on the circuit board (3), and when the optical module is plugged into the cage (2) of the optical network terminal, the area where the first optical component (30) is located is offset from the area covered by the heat sink (20) in the vertical direction.

2. The optical module with improved heat dissipation efficiency according to claim 1, characterized in that, The circuit board (3) is also provided with a second optical component (31), which is located below the area covered by the heat sink (20); The heat-conducting component (4) further includes a second heat-conducting cover plate (42), which is in thermal contact with the second optical component (31), and the other end of the heat-conducting bridge (41) is in contact with one end of the second heat-conducting cover plate (42).

3. The optical module with improved heat dissipation efficiency according to claim 2, characterized in that, After the first optical component (30) and the second optical component (31) are assembled in the optical module, each component inside them forms an inverted structure relative to the heat sink (20).

4. The optical module with improved heat dissipation efficiency according to claim 2, characterized in that, The lower surface of the heat-conducting bridge component (41) is provided with a first enclosure plate (411) and a second support plate (412). The first enclosure plate (411) is disposed close to the first heat-conducting cover plate (40), and the second support plate (412) is disposed close to the second heat-conducting cover plate (42). The first heat-conducting cover plate (40) and the first enclosure plate (411) are assembled to form an electromagnetic shielding cavity.

5. The optical module with improved heat dissipation efficiency according to claim 4, characterized in that, The bottom of the first enclosure (411) is provided with a first notch (4110), which is used to allow the optical fiber of the first optical component (30) to pass through; The second support plate (412) has a second notch (4120) on each side. The second notch (4120) is used to avoid the optical fiber, so that the optical fiber passes through the second notch (4120).

6. The optical module with improved heat dissipation efficiency according to claim 2, characterized in that, The second heat-conducting cover plate (42) includes a first sub-cover plate (420) and a second sub-cover plate (421) that can be assembled into an electromagnetic shielding cavity. The first sub-cover plate (420) is located between the heat-conducting bridge member (41) and the second sub-cover plate (421), and the first sub-cover plate (420) abuts against the heat-conducting bridge member (41) and the second sub-cover plate (421) respectively.

7. The optical module with improved heat dissipation efficiency according to claim 6, characterized in that, The first sub-cover plate (420) is provided with a second mating concave surface (4200), and the second sub-cover plate (421) is provided with a second mating boss (4210). The second mating concave surface (4200) and the second mating boss (4210) are coupled to each other.

8. The optical module with improved heat dissipation efficiency according to claim 6, characterized in that, The thermally conductive bridge component (41) is provided with a third docking boss (413), and the first sub-cover plate (420) is provided with a third docking concave surface (4201). The third docking boss (413) and the third docking concave surface (4201) are coupled to each other.

9. The optical module with improved heat dissipation efficiency according to claim 2, characterized in that, The optical module further includes an optical connector (5), and the second optical component (31) is disposed between the first optical component (30) and the optical connector (5). The first optical component (30) and the second optical component (31) are connected to the optical connector (5) via optical fiber.

10. The optical module with improved heat dissipation efficiency according to claim 1, characterized in that, The first heat-conducting cover plate (40) is provided with a first mating concave surface (400), and the heat-conducting bridge component (41) is provided with a first mating boss (410). The first mating concave surface (400) and the first mating boss (410) are coupled to each other.

11. The optical module with improved heat dissipation efficiency according to any one of claims 1-10, characterized in that, The heat-conducting assembly (4) further includes one or more first heat-conducting sheets (43), which overlap at the seams between different structural components in the heat-conducting assembly (4).

12. The optical module with improved heat dissipation efficiency according to claim 11, characterized in that, The first heat-conducting sheet (43) is a tungsten copper sheet, a graphene sheet, or a heat-conducting adhesive sheet.

13. The optical module with improved heat dissipation efficiency according to any one of claims 1-10, characterized in that, The heat-conducting component (4) further includes a second heat-conducting sheet (44) and a heat pipe (45) that abut against each other; the second heat-conducting sheet (44) is disposed on the first heat-conducting cover plate (40) and the heat-conducting bridge (41), and the heat pipe (45) is fixedly disposed on the housing (1).

14. The optical module with improved heat dissipation efficiency according to claim 13, characterized in that, The second heat-conducting sheet (44) is a tungsten copper sheet, a graphene sheet, or a heat-conducting adhesive sheet.

15. The optical module with improved heat dissipation efficiency according to any one of claims 1-10, characterized in that, The first optical component (30) and / or the second optical component (31) are composed of one or more of the following: laser array, detector array, optical path structure, heat sink and thermoelectric cooler (TEC).

16. The optical module with improved heat dissipation efficiency according to any one of claims 1-10, characterized in that, On the other side of the circuit board (3), a protective cover for protecting the optical device is provided in the area of ​​the first optical component (30), wherein the other side of the circuit board (3) is disposed opposite to the side that fixes the first heat-conducting cover plate (40).

17. A method for assembling an optical module to improve heat dissipation efficiency, characterized in that, include: After the internal structural components of the first optical component (30) are assembled, the bottom surface of the thermoelectric cooler in the first optical component (30) is fixed facing the inner wall of the first heat-conducting cover plate (40); Control the first heat-conducting cover plate (40), and after passing the first optical component (30) through the pre-set through slot on the circuit board (3) and completing the alignment of the laser array and / or detector array chip pins on the first optical component (30) with the gold fingers on the back of the circuit board (3), complete the fixing of the first heat-conducting cover plate (40) and the circuit board (3). The second optical component (31) is fixed to the second heat-conducting cover plate (42) and the second heat-conducting cover plate (42) are fixed to the circuit board (3) through the same assembly process as the first optical component (30); After the spatial positioning of a group of optical fibers of the first optical component (30) is completed, the thermal bridge component (41) is connected to the first thermal cover plate (40), and the thermal bridge component (41) is fixed to the circuit board (3).

18. The optical module assembly method for improving heat dissipation efficiency according to claim 17, characterized in that, The fiber optic adapters of the first optical component (30) and the second optical component (31) are assembled and fixed in the optical module.

19. The optical module assembly method for improving heat dissipation efficiency according to claim 17, characterized in that, When the optical module also includes one or more first heat-conducting sheets (43), second heat-conducting sheets (44), and heat pipes (45), the method includes: The first heat-conducting sheet (43) is overlapped at the joint between different structural components in the heat-conducting assembly (4); The second heat-conducting sheet (44) is disposed on the first heat-conducting cover plate (40) and the heat-conducting bridge (41), and the heat pipe (45) is fixedly disposed on the housing (1) of the optical module.

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