An immersion liquid-cooled light module

Abstract

The application provides an immersed liquid cooling optical module, which comprises a shell, a PCB circuit board and a fiber adapter, a first surface of the PCB circuit board is provided with a DSP signal processing chip and an optoelectronic transceiver assembly, the DSP signal processing chip is welded on the PCB circuit board through a flip-chip process and is sealed through organic silicon pouring sealant, the first surface of the PCB circuit board is provided with a dam groove and a protective cover for accommodating the optoelectronic transceiver assembly, the dam groove and the protective cover are provided with two-piece sealant strips with fiber outlets, and the protective cover and the two-piece sealant strips are sealed through organic silicon pouring sealant after installation, and the inside of the shell is provided with a non-character type flow guide heat dissipation structure which is bent at the same end of two side branches towards a trunk. The optical module of the application adopts the dam groove and the protective cover to seal the optoelectronic transceiver assembly, avoids the invasion of the cooling liquid into the optical device, and improves the balance of heat dissipation through the non-character type flow guide heat dissipation structure.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical communication technology, in particular to an immersion liquid-cooled optical module. BACKGROUND

[0002] Liquid-cooled optical module is a new technology that combines liquid cooling and optical module, directly or indirectly cools the optical communication module of optoelectronic devices through liquid medium, and brings many advantages to optical communication system.

[0003] Immersion liquid-cooled optical module is a kind of optical module directly immersed in non-conductive cooling liquid (such as fluorinated liquid, etc.), which uses the high heat conduction performance of liquid to quickly absorb and take away the heat generated by the module. Compared with the traditional air-cooled optical module, the liquid-cooled optical module can dissipate heat more efficiently, make the surrounding environment noise lower, and keep the temperature stable, which can improve the working stability and reliability.

[0004] However, the existing immersion liquid-cooled optical module design scheme still has the problems that the cooling liquid is easy to invade the optical path, causing refractive index mismatch, increasing optical loss, and the temperature field of the cooling liquid is not balanced, which can cause poor multi-channel signal quality and serious crosstalk.

[0005] Therefore, the prior art still needs to be improved and developed. SUMMARY

[0006] The present application provides an immersion liquid-cooled optical module, which aims to solve the technical problems mentioned in the background of the prior art.

[0007] The technical scheme of the present application is as follows:

[0008] An immersion liquid-cooled optical module, comprising a shell, a PCB circuit board and a fiber adapter, a first surface of the PCB circuit board is provided with a DSP signal processing chip and an optoelectronic transceiver assembly, the DSP signal processing chip is welded on the first surface of the PCB circuit board through flip-chip technology, and the periphery of the DSP signal processing chip is sealed by organic silicone sealant; the first surface of the PCB circuit board is provided with a dam groove and a protective cover matched with the dam groove, the optoelectronic transceiver assembly is accommodated in the space formed by the dam groove and the protective cover, two-lip type sealing rubber strips are arranged on the first side of the dam groove and the first side of the protective cover, the gap of the two-lip type sealing rubber strips is provided with a fiber outlet of the optoelectronic transceiver assembly, and the protective cover and the two-lip type sealing rubber strips are sealed by organic silicone sealant after the optoelectronic transceiver assembly is installed; a non-character type flow guide heat dissipation structure is arranged on the inner side of the shell, and the branches on both sides of the non-character type flow guide heat dissipation structure are bent towards the same end of the trunk.

[0009] In an alternative embodiment of the present application, the two-part sealing rubber strip comprises detachably connected upper and lower rubber strips, the upper rubber strip is provided with first and second semicircular hole rows at intervals, the lower rubber strip is provided with third and fourth semicircular hole rows at intervals, the first and third semicircular hole rows form the transmitting fiber outlet, and the second and fourth semicircular hole rows form the receiving fiber outlet.

[0010] In an alternative embodiment of the present application, the upper rubber strip is provided with Ω-shaped transverse clamping columns between the first and second semicircular hole rows, outside the first semicircular hole row and outside the second semicircular hole row, the lower rubber strip is provided with Ω-shaped transverse clamping grooves adapted to the transverse clamping columns between the third and fourth semicircular hole rows, outside the third semicircular hole row and outside the fourth semicircular hole row, and the upper and lower rubber strips are detachably connected through the Ω-shaped transverse clamping columns and the Ω-shaped transverse clamping grooves.

[0011] In an alternative embodiment of the present application, the first side of the dam groove is provided with a rubber strip placement area, the width of the rubber strip placement area is greater than that of the non-rubber strip placement area of the dam groove, the lower rubber strip is arranged in the rubber strip placement area, the first side of the protective cover is provided with a rubber strip containing opening corresponding to the rubber strip placement area, and the upper rubber strip is detachably arranged in the rubber strip containing opening.

[0012] In an alternative embodiment of the present application, the optoelectronic transceiver assembly comprises an optoelectronic receiving device and an optoelectronic transmitting device, the optoelectronic receiving device comprises a multi-channel cross-group amplifier, a photodiode array and a receiving fiber array, and the optoelectronic transmitting device comprises a silicon optical chip, a double-channel isolator, a lens, a continuous wave high-power laser and a transmitting fiber array.

[0013] In an alternative embodiment of the present application, the silicon optical chip is provided with an RF pad group, and the pad arrangement order of the RF pad group is a first ground pad, a first differential signal pad, a second differential signal pad and a second ground pad.

[0014] In an alternative embodiment of the present application, the housing comprises a bottom shell and an upper cover, the first end of the upper cover and the first end of the bottom shell are provided with a plurality of adapter slots, the plug-in end cover of the PCB circuit board is combined with the second end of the upper cover and the second end of the bottom shell, the DSP signal processing chip and the optoelectronic transceiver assembly are sequentially arranged on the PCB circuit board from inside to outside of the plug-in end, and the two-part sealing rubber strip of the first side of the dam groove and the first side of the protective cover is arranged towards the side of the adapter slots.

[0015] In an alternative embodiment of the present application, the two side branches of the non-character-shaped flow guide heat dissipation structure are fishbone-shaped branches, and the V-shaped branches of the fishbone-shaped branches are inclined away from the main stem.

[0016] In an alternative embodiment of the present application, an L-shaped hook groove with a bottom arm inward is arranged on the inner side wall of the dam groove, and the outer side wall of the dam groove is outwardly inclined.

[0017] In an alternative embodiment of the present application, the second side, the third side and the fourth side of the protective cover are provided with pry openings for facilitating disassembly of the protective cover.

[0018] The beneficial effect is that the present application provides an immersion liquid cooling optical module, which comprises a shell, a PCB circuit board and a fiber adapter, a first surface of the PCB circuit board is provided with a DSP signal processing chip and an optoelectronic transceiver assembly, the DSP signal processing chip is welded on the PCB circuit board through flip-chip technology and is sealed by organic silicone potting glue; the first surface of the PCB circuit board is provided with a dam groove and a protective cover for accommodating the optoelectronic transceiver assembly, the dam groove and the protective cover are provided with two-piece sealing glue strips of the fiber outlet, and the protective cover and the two-piece sealing glue strips are sealed by organic silicone potting glue after installation; a non-character-shaped flow guide heat dissipation structure with two side branches bent towards the same end of the main stem is arranged in the shell on one side of the second surface of the PCB circuit board. The optical module of the present application adopts a dam groove and a protective cover to seal the optoelectronic transceiver assembly, avoids the intrusion of cooling liquid into the optical device, and improves the balance of heat dissipation through a non-character-shaped flow guide heat dissipation structure. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is an exploded view of the immersion liquid cooling optical module of the present application.

[0020] Figure 2 It is a sealing structure diagram of the DSP signal processing chip of the present application.

[0021] Figure 3 It is an exploded view of the sealing structure of the optoelectronic transceiver assembly of the present application.

[0022] Figure 4 It is a structure diagram of the optoelectronic transceiver assembly of the present application.

[0023] Figure 5 It is a cross-sectional structure diagram of the dam groove of the present application.

[0024] Figure 6 It is an exploded view of the two-piece sealing glue strip of the present application.

[0025] Figure 7 It is a structure diagram of the protective cover of the present application.

[0026] Figure 8 Figure 1 is a schematic view of a bottom shell structure of the present application.

[0027] The reference signs in the drawings are as follows:

[0028] 10 - housing; 20 - PCB circuit board; 30 - fiber adapter; 40 - DSP signal processing chip; 50 - dam groove; 60 - protective cover; 70 - two-part sealing strip; 80 - fiber outlet; 90 - non-alphabetical flow guide heat dissipation structure; 100 - upper sealing strip; 110 - lower sealing strip; 120 - first semicircular hole row; 130 - second semicircular hole row; 140 - third semicircular hole row; 150 - fourth semicircular hole row; 160 - Ω-shaped transverse clamping column; 170 - Ω-shaped transverse clamping groove; 180 - sealing strip placement area; 190 - sealing strip containing opening; 200 - multi-channel cross-group amplifier; 210 - photodiode array; 220 - receiving fiber array; 230 - silicon optical chip; 240 - dual-channel isolator; 250 - lens; 260 - continuous wave high-power laser; 270 - transmitting fiber array; 280 - bottom shell; 290 - upper cover; 300 - adapter slot; 310 - L-shaped hook groove; 320 - pry opening. DETAILED DESCRIPTION

[0029] In order to make the technical problems to be solved by the present application, the technical solutions and the beneficial effects more clearly understood, the present application will be further described in detail below in conjunction with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and do not limit the present application.

[0030] It should be noted that in the following description of the present application, if there are terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like, the orientation or positional relationship indicated thereby is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0031] The terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated thereby. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0032] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. Thus, the appearances of the phrase "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0033] Referring to Figure 1 The application provides an immersed liquid cooling optical module, comprising a shell 10, a PCB circuit board 20 and a fiber adapter 30, a first surface (illustrated as an upper surface) of the PCB circuit board 20 is provided with a DSP (Digital Signal Processing) signal processing chip 40 and an optoelectronic transceiver assembly, the DSP signal processing chip 40 is welded on the first surface of the PCB circuit board 20 through a flip-chip process, referring to Figure 2 The four sides of the DSP signal processing chip 40 are sealed by silicone pouring sealant. In the application, the DSP signal processing chip 40 can adopt a bare high-speed signal processing chip with low power consumption, the DSP signal processing chip 40 is welded on the PCB circuit board 20 through a flip-chip process, and the four sides and the upper surface thereof are sealed and protected by silicone pouring sealant. The DSP signal processing chip 40 is sealed by pouring, and is cured into a thermosetting polymer insulating material with excellent performance under normal temperature or heating conditions, so as to achieve the purposes of bonding, sealing, pouring and coating protection. The silicone pouring sealant is strictly controlled in terms of glue amount and glue thickness, and the silicone pouring sealant made of silicone rubber is selected, and a soft elastomer protective layer can be formed after curing, which can resist mechanical impact and cold and hot impact of the electric chip; the electric chip has excellent electrical performance and insulation performance, and the insulation between the internal electric chip and the circuit can be effectively improved after pouring; the silicone pouring sealant has good high and low temperature resistance, corrosion resistance and sealing performance, and can be self-leveling after coating, so as to ensure complete filling of the pouring sealant and the electric chip; meanwhile, the silicone pouring sealant is also convenient for repair, and the sealed components can be easily taken out for repair and replacement.

[0034] Referring to Figure 3 In an alternative embodiment of the application, a first surface of the PCB circuit board 20 is provided with a dam groove 50 and a protective cover 60 matched with the dam groove 50, the optoelectronic transceiver assembly is accommodated in a space formed by the dam groove 50 and the protective cover 60, a first side of the dam groove 50 and a first side of the protective cover 60 are provided with a two-lobed sealing rubber strip 70, a gap of the two-lobed sealing rubber strip 70 is provided with a fiber outlet 80 of the optoelectronic transceiver assembly, and the protective cover 60 and the two-lobed sealing rubber strip 70 are sealed by silicone pouring sealant after the optoelectronic transceiver assembly is installed.

[0035] Referring to Figure 4 The photoelectric transceiver assembly of the present application comprises a photoelectric receiving device and a photoelectric transmitting device. The photoelectric receiving device may, for example, comprise a multi-channel trans-impedance amplifier (TIA) 200, a photo diode array (PD Array) 210 and a receiving fiber array (RX-FA) 220. The photoelectric transmitting device may, for example, comprise a silicon photonic chip (PIC) 230, a dual-channel isolator (ISO) 240, a lens (Lens) 250, a continuous wave high power laser (CW Laser) 260 and a transmitting fiber array (TX-FA) 270. The silicon photonic chip is provided with a group of RF pads, which are arranged in the order of a first ground pad, a first differential signal pad, a second differential signal pad and a second ground pad.

[0036] Specifically, the front end of the silicon photonic chip 230 is provided with a plurality of groups of high-speed differential signal pads (RF pads), which are arranged in the order of G-S-S-G, wherein G represents a ground pad and S represents a differential signal pad. This pad arrangement can effectively improve the quality of differential signals and prevent inter-channel crosstalk, thereby improving signal quality and integrity. The side end of the silicon photonic chip 230 is provided with DC pads, which are used for PIC power supply, monitoring and operating point control, etc. The RF pads and DC pads of the silicon photonic chip 230 are electrically connected to the pads provided on the PCB 20 through wire bonding. The continuous wave high power laser and the multi-channel trans-impedance amplifier are also connected to the pads of the PCB 20 through wire bonding, and the photo diode array is connected to the multi-channel trans-impedance amplifier through wire bonding.

[0037] In an exemplary embodiment of the present application, the area where the silicon photonic chip (PIC) 230 and the multi-channel trans-impedance amplifier (TIA) 200 are mounted in the dam groove 50 can be subjected to a sinking process to ensure that the surface pads of the PIC and TIA after mounting and the pads on the PCB 20 are at the same height. This can reduce the length of the bonding wires caused by the height difference between the high-speed pads of the PIC and TIA and the high-speed pads of the PCB, thereby reducing signal loss and improving the high-speed performance of the product at both the receiving and transmitting ends.

[0038] In the present application, the protective cover 60 is placed in the dam groove 50, and is tightly combined with the dam groove 50 by curing glue (for example, silicone potting glue), thereby forming a device closed space. The photoelectric transceiver assembly adopts a dam design, and a groove is processed on the PCB circuit board 20. The depth of the groove can be 0.2-0.3 mm, the width can be 1.0-1.5 mm, and the wall thickness of the protective cover 60 can be 0.6-1.0 mm. Therefore, when the protective cover 60 is inverted and buckled into the dam groove 50, there is at least 0.4 mm of space reserved for the glue to fill. The beneficial effects of this are: 1) a larger area is reserved for the glue to fill, which can improve the sealing of the entire protective cover 60 and prevent fluorinated liquid from penetrating into the optical device area and causing the optical device to fail; 2) silicone glue is relatively soft and has not very strong adhesion, and increasing the amount of glue can appropriately increase the adhesion of the protective cover 60 and improve the stability of the product.

[0039] Further, in order to increase the adhesion area between the glue and the dam groove 50 and the protective cover 60 and improve the fixing strength and sealing performance of the dam groove 50 and the protective cover 60, the present application specially designs the groove on the PCB circuit board 20, as shown in Figure 5 That is, in an alternative embodiment of the present application, an L-shaped hook groove 310 with a bottom arm inward is arranged on the inner side wall of the dam groove 50, and the outer side wall of the dam groove 50 is outwardly inclined. The present application adopts an L design on the contact surface of the inner side of the dam groove 50, so that the inner side wall of the dam groove 50 and the protective cover 60 can have a certain distance, the gap of the L-shaped hook groove 310 can fill more glue, and at the same time, it can also limit the excessive glue from overflowing onto the optical device and causing failure. At the same time, the outer side wall of the dam groove 50 adopts an inclined surface design, which can fill more glue and increase the adhesion surface of the glue. At the same time, when reworking, the inclined surface can be used as a guide surface for the reworking tool, thereby making it more convenient to rework, and reducing the damage of the reworking tool to the PCB circuit board 20. The material of the protective cover 60 can be selected to be resistant to corrosion of the coolant, have good sealing performance, and not affect the performance of the high-speed line and introduce crosstalk. In order to facilitate disassembly, a pry 320 for facilitating disassembly of the protective cover can be arranged on the second side, the third side and the fourth side of the protective cover 60.

[0040] Referring to Figure 6In an alternative embodiment of the present application, the two-part sealing strip 70 comprises an upper sealing strip 100 and a lower sealing strip 110 which are detachably connected, the upper sealing strip 100 is provided with a first semicircular hole row 120 and a second semicircular hole row 130 at intervals, the lower sealing strip 110 is provided with a third semicircular hole row 140 and a fourth semicircular hole row 150 at intervals, the first semicircular hole row 120 and the third semicircular hole row 140 constitute the outlet of the transmitting optical fiber, and the second semicircular hole row 130 and the fourth semicircular hole row 150 constitute the outlet of the receiving optical fiber. The sealing is specially designed at the rear end of the optical device. Specifically, the two-part sealing strip 70 is designed with an optical fiber outlet, the upper sealing strip 100 is designed with a plurality of semicircular curved grooves for the optical fiber outlet, the diameter of the semicircle is slightly larger than the diameter of the optical fiber, and the semicircle is reserved for assembly tolerance and glue filling space, and is assembled with the lower sealing strip 110 designed with a plurality of semicircular curved grooves on the other side. The diameter of the semicircle of the upper sealing strip 100 and the diameter of the semicircle of the lower sealing strip 110 are the same, and a plurality of circular through holes are formed after the upper sealing strip 100 and the lower sealing strip 110 are assembled with the protective cover 60, which are used for the outlet of the optical fiber. In order to increase the protection of the optical fiber, the sealing strip will be made of inert and soft material with certain elasticity. When the sealing strip of the present application is assembled, a certain amount of silicone glue is applied to the surface of the circular groove, and then the optical fiber is assembled together, which can fill the gap between the circular groove and the optical fiber and prevent the leakage of fluorinated liquid.

[0041] Referring to Figure 6 In an alternative embodiment of the present application, the upper sealing strip 100 is provided with an Ω-shaped transverse clamping column 160 between the first semicircular hole row 120 and the second semicircular hole row 130, outside the first semicircular hole row 120 and outside the second semicircular hole row 130; the lower sealing strip 110 is provided with an Ω-shaped transverse clamping groove 170 which is matched with the Ω-shaped transverse clamping column 160 between the third semicircular hole row 140 and the fourth semicircular hole row 150, outside the third semicircular hole row 140 and outside the fourth semicircular hole row 150, and the upper sealing strip 100 and the lower sealing strip 110 are detachably connected through the Ω-shaped transverse clamping column 160 and the Ω-shaped transverse clamping groove 170. Specifically, in order to increase the contact area of the upper and lower sealing strips and improve the sealing performance of the assembly, the structure of the upper and lower sealing strips is specially designed by referring to the design of the mortise and tenon structure. The Ω-shaped protruding structure is made on the upper sealing strip 100, and the corresponding Ω-shaped hollow structure is made on the lower sealing strip 110 to assemble with the Ω-shaped protruding structure of the upper sealing strip 100. In this way, the upper and lower sealing strips can be tightly matched to play a sealing role, and the interface between the upper and lower sealing strips and the optical fiber is coated with silicone glue after assembly to improve the sealing performance of the entire assembly. The strength of the silicone glue itself is small, the elasticity is high, it is easy to peel off, and it will not damage the sealing strip and the optical fiber.

[0042] Referring to Figure 4 In an alternative embodiment of the present application, the first side of the dam groove 50 is provided with a rubber strip placement area 180, the width of the rubber strip placement area 180 is greater than the width of the non-rubber strip placement area of the dam groove 50, the lower rubber strip 110 is arranged in the rubber strip placement area 180, referring to Figure 7 The first side of the protective cover 60 is provided with a rubber strip containing port 190 corresponding to the rubber strip placement area 180, and the upper rubber strip 100 is detachably arranged in the rubber strip containing port 190. Before the optical fiber is assembled, the lower rubber strip 110 should be fixed on the rubber strip placement area 180 by silica gel, and the upper rubber strip 100 is fixed by the elasticity of the silica gel itself and the rubber strip containing port 190.

[0043] Referring to Figure 1 and Figure 8 In an alternative embodiment of the present application, the inner side of the shell 10 is provided with a non-character-shaped flow guide heat dissipation structure 90, and the branches of the two sides of the non-character-shaped flow guide heat dissipation structure 90 are bent towards the same end of the trunk. In the present application, in order to improve the heat dissipation capacity of the product, bionics flow guide and heat dissipation design is made on the shell 10, and a plurality of tree-shaped microstructures (i.e. the non-character-shaped flow guide heat dissipation structure 90) are designed on the inner surface of the shell 10 on the first surface side and the second surface side of the PCB circuit board 20. The microstructure design can significantly increase the contact area of the shell and the cooling liquid, thereby increasing the heat dissipation efficiency of the shell and improving the heat dissipation performance. At the same time, the unified orientation of the microstructure can guide the flow of the cooling liquid, accelerating the heat exchange of cooling liquids of different temperatures, thereby improving the heat dissipation efficiency. Further, in order to better cooperate the non-character-shaped flow guide heat dissipation structure 90 on the inner surface of the shell 10 on the first surface side of the PCB circuit board 20 and the non-character-shaped flow guide heat dissipation structure 90 on the inner surface of the shell 10 on the second surface side of the PCB circuit board 20, the branches of the non-character-shaped flow guide heat dissipation structure 90 on the inner surface of the shell 10 on the first surface side of the PCB circuit board 20 and the non-character-shaped flow guide heat dissipation structure 90 on the inner surface of the shell 10 on the second surface side of the PCB circuit board 20 can be reversely arranged.

[0044] Further, referring to Figure 8The two sides of the non-character type flow guide heat dissipation structure 90 can be designed as fishbone-shaped branches, and the V-shaped branches of the fishbone-shaped branches are inclined away from the main stem. The micro trident structure (i.e., the fishbone-shaped branches) is further designed on the branches of the non-character type flow guide heat dissipation structure 90. In this embodiment, when the liquid temperature rises or the pressure decreases, the dissolved gas in the liquid becomes small bubbles and is released into the liquid. The bubbles in the liquid have a significant impact on the flow state of the fluid, which may cause the fluid flow rate to be unstable or increase the fluid resistance, thereby affecting the heat dissipation performance of the fluid. At the same time, the specific heat capacity of the gas is much smaller than that of the cooling liquid, which greatly affects the heat dissipation of the cooling liquid. The micro trident structure is designed to be smooth to avoid using sharp angles, ensuring that there is no liquid surface tension mutation point in the structure, thereby minimizing the generation of bubbles. At the same time, the micro structure has a flow guide effect, increases the flow rate of the cooling liquid, forms a local pressure difference, and can quickly take away the bubbles while breaking the bubbles.

[0045] Referring to Figure 1 In an optional embodiment of the present application, the shell comprises a bottom shell 280 and an upper cover 290, a first end of the upper cover 290 and a first end of the bottom shell 280 are provided with a plurality of adapter slots 300, a plug-in end of the PCB circuit board 20 is covered on a second end of the upper cover 290 and a second end of the bottom shell 280, the DSP signal processing chip 40 and the optoelectronic transceiver assembly are sequentially arranged on the PCB circuit board 20 from inside the plug-in end, and the two-cleft sealing rubber strip 70 on the first side of the dam groove 50 and the first side of the protective cover 60 is arranged towards one side of the adapter slot 300. In the present application, a corresponding number of fiber adapters 30 are installed in the adapter slots 300, and the optical fibers of the optoelectronic transceiver assembly are connected to the respective corresponding fiber adapters 30 after extending out of the two-cleft sealing rubber strip 70.

[0046] Overall, the main design features of the optical module of the present application are: (1) the sealing strip structure design, the dam boss and the device protection cover 60 are two-petal type circular curved surface, complete fitting fiber curved surface, protect the optical fiber; (2) the PCB groove structure design, cooperate with the two-petal type optical fiber sealing structure, the beneficial effect is that the optical device can be reworked, that is, the scrap rate of non-defective materials can be reduced, the BOM cost of the product is greatly reduced, the shell adopts a heat-conducting special structure, increases the flowability of the cooling liquid, realizes a fast and directional flow path, and realizes a better cooling effect. (3) The electric chip adopts a low-power bare high-speed signal processing chip, and adopts a filling design, which not only protects the high-speed signal processing, but also reduces power consumption; (4) The optical device protection adopts a dam design, which solves the problem of insufficient sealing reliability, ensures good sealing, and prevents the inflow of glue and cooling liquid; (5) The optical chip and its optical device structure adopt a sinking design, which shortens the high-speed wire, and ensures the integrity of the high-speed signal.

[0047] In summary, the present application provides an immersion liquid cooling optical module, comprising a shell, a PCB circuit board and an optical fiber adapter, the first surface of the PCB circuit board is provided with a DSP signal processing chip and an optoelectronic transceiver assembly, the DSP signal processing chip is welded on the PCB circuit board through flip-chip bonding process and sealed by organic silicon pouring sealant; The first surface of the PCB circuit board is provided with a dam groove and a protection cover for accommodating the optoelectronic transceiver assembly, the dam groove and the protection cover are provided with two-petal type sealing strips of optical fiber outlet, and the protection cover and the two-petal type sealing strips are sealed by organic silicon pouring sealant after installation; The inside of the shell is provided with a non-character type flow guide heat dissipation structure which is curved at the same end of the two side branches towards the main stem. The optical module of the present application adopts the dam groove and the protection cover to seal the optoelectronic transceiver assembly, avoids the invasion of the cooling liquid into the optical device, and improves the balance of heat dissipation through the non-character type flow guide heat dissipation structure.

[0048] Although the present application has been disclosed as above with preferred embodiments, the above preferred embodiments are not intended to limit the present application, and those skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present application, therefore the protection scope of the present application is subject to the scope defined by the claims.

Claims

1. An immersion liquid-cooled optical module, characterized in that, The device includes a housing, a PCB circuit board, and an optical fiber adapter. A DSP signal processing chip and an optoelectronic transceiver assembly are disposed on the first surface of the PCB circuit board. The DSP signal processing chip is soldered to the first surface of the PCB circuit board through a flip-chip eutectic process. The periphery of the DSP signal processing chip is sealed with silicone potting compound. The first surface of the PCB circuit board is provided with a dam groove and a protective cover adapted to the dam groove. The optoelectronic transceiver assembly is housed in the space formed by the dam groove and the protective cover. A two-part sealing strip is provided on the first side of the dam groove and the first side of the protective cover. The optical fiber outlet of the optoelectronic transceiver assembly is provided at the gap position of the two-part sealing strip. After the optoelectronic transceiver assembly is installed, the protective cover and the two-part sealing strip are sealed with silicone potting compound. An L-shaped hook groove with the bottom arm facing inward is provided on the inner wall of the dam groove. The outer wall of the dam groove is inclined outward. The second, third and fourth sides of the protective cover are provided with pry holes to facilitate the removal of the protective cover. The inner surface of the outer shell on one side of the first surface and one side of the second surface of the PCB circuit board is provided with a non-character-shaped heat dissipation structure. The branches on both sides of the non-character-shaped heat dissipation structure are bent towards the same end of the main trunk. The branches on both sides of the non-character-shaped heat dissipation structure are fishbone-shaped branches. The V-shaped branches of the fishbone-shaped branches are inclined in the direction away from the main trunk. The branches of the non-character-shaped heat dissipation structure on the inner surface of the outer shell on one side of the first surface of the PCB circuit board and the non-character-shaped heat dissipation structure on the inner surface of the outer shell on one side of the second surface of the PCB circuit board are arranged in opposite directions. The two-part sealing strip includes a detachably connected upper strip and a lower strip. The upper strip is provided with a first semi-circular hole row and a second semi-circular hole row at intervals. The lower strip is provided with a third semi-circular hole row and a fourth semi-circular hole row at intervals. The first semi-circular hole row and the third semi-circular hole row form a transmitting optical fiber outlet, and the second semi-circular hole row and the fourth semi-circular hole row form a receiving optical fiber outlet. Ω-shaped transverse locking posts are provided between the first and second semicircular hole rows, on the outer side of the first and second semicircular hole rows, and on the outer side of the second semicircular hole rows. Ω-shaped transverse locking grooves adapted to the transverse locking posts are provided between the third and fourth semicircular hole rows, on the outer side of the third and fourth semicircular hole rows, and on the outer side of the fourth semicircular hole rows. The upper and lower adhesive strips are detachably connected via the Ω-shaped transverse locking posts and the Ω-shaped transverse locking grooves.

2. The immersion liquid-cooled optical module according to claim 1, characterized in that, The first side of the dam trench is provided with a rubber strip placement area, the width of which is greater than the width of the non-rubber strip placement area of ​​the dam trench. The lower rubber strip is placed in the rubber strip placement area. The first side of the protective cover is provided with a rubber strip receiving opening corresponding to the rubber strip placement area. The upper rubber strip is detachably placed in the rubber strip receiving opening.

3. The immersion liquid-cooled optical module according to claim 1, characterized in that, The optoelectronic transceiver assembly includes an optoelectronic receiver and an optoelectronic transmitter. The optoelectronic receiver includes a multi-channel cross-group amplifier, a photodiode array, and a receiving fiber array. The optoelectronic transmitter includes a silicon photonic chip, a dual-channel isolator, a lens, a continuous-wave high-power laser, and a transmitting fiber array.

4. The immersion liquid-cooled optical module according to claim 3, characterized in that, The silicon photonics chip is provided with an RF pad group, and the pads of the RF pad group are arranged in the following order: first ground pad, first differential signal pad, second differential signal pad, and second ground pad.

5. The immersion liquid-cooled optical module according to claim 1, characterized in that, The housing includes a bottom shell and a top cover. The first end of the top cover and the first end of the bottom shell are provided with a plurality of adapter slots. The plug-in end of the PCB circuit board covers the second end of the top cover and the second end of the bottom shell. The DSP signal processing chip and the optoelectronic transceiver assembly are sequentially arranged on the PCB circuit board from the plug-in end inward. The two-lobed sealing strips on the first side of the dam groove and the first side of the protective cover are arranged facing the adapter slot side.

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