Simulation ic synchronous test optimization method and system based on crosstalk simulation

Abstract

The application discloses a kind of based on crosstalk simulation analog IC synchronous test optimization method and system.The method first obtains the position layout data in analog IC synchronous test process and the test signal data of each analog IC, determines electromagnetic crosstalk information in combination with test signal, and accordingly constructs crosstalk schematic diagram with position layout data;Spectral clustering algorithm is used to cluster the schematic diagram, and the crosstalk path in synchronous test is identified;Based on the schematic diagram and the crosstalk path, an electromagnetic crosstalk signal isolation barrier is designed and deployed in the test environment, the analog IC is simulated and evaluated by constructing and injecting crosstalk simulation signals for independent testing, and the isolation effect is judged;According to the evaluation result, the isolation barrier is optimized to obtain an optimization scheme.The method can effectively identify and isolate the electromagnetic crosstalk path in the synchronous test process, and improve the accuracy and reliability of analog IC testing.

Description

Technical Field

[0001] This invention relates to the field of analog integrated circuit testing technology, and in particular to an optimized method and system for synchronous testing of analog ICs based on crosstalk simulation. Background Technology

[0002] Analog integrated circuits (ICs) are widely used in key aspects of electronic systems, such as signal acquisition, amplification, and filtering. With increasing integration levels and rising demands for testing efficiency, synchronous testing of analog ICs (i.e., parallel testing of multiple analog ICs on the same test platform) has become a crucial technique in production and verification. However, during synchronous testing, electromagnetic crosstalk is easily generated due to the physical proximity of multiple analog ICs and the overlap in their operating signal spectrum ranges.

[0003] Electromagnetic crosstalk (EMC) primarily originates from parasitic capacitance and inductance between conductors, as well as electromagnetic radiation coupling in space. In high-frequency or high-speed signal transmission environments, crosstalk introduces additional noise, causing waveform distortion, amplitude and phase shifts in the measured signal, thus affecting the accuracy and stability of the test results. Therefore, traditional physical suppression methods such as shielding and isolation often suffer from poor isolation effectiveness or design redundancy when precise analysis and localization are lacking.

[0004] Existing electromagnetic crosstalk analysis methods typically rely on static layout checks or simple frequency domain interference assessments, making it difficult to accurately identify major crosstalk paths and key coupling nodes by incorporating time-frequency characteristics during the dynamic process of synchronous testing. Furthermore, for the design and optimization of isolation barriers, most methods lack closed-loop adjustment mechanisms based on simulation feedback, resulting in insufficient crosstalk suppression rates and difficulty in maintaining stable isolation performance across different test batches and product models.

[0005] Therefore, there is an urgent need for a synchronous test optimization method and system that can combine layout data and test signal characteristics to achieve precise isolation barrier optimization through crosstalk path modeling and simulation evaluation, so as to improve the accuracy and consistency of analog IC testing and reduce the impact of electromagnetic crosstalk on test results. Summary of the Invention

[0006] To address at least one of the aforementioned technical problems, this invention proposes an optimization method and system for synchronous testing of analog ICs based on crosstalk simulation.

[0007] The first aspect of this invention provides an optimization method for analog IC synchronization testing based on crosstalk simulation, comprising:

[0008] Acquire the location layout data and test signal data of each analog IC during the synchronous testing process; determine the electromagnetic crosstalk information of each analog IC based on the test signal data; and construct a crosstalk diagram based on the location layout data and the electromagnetic crosstalk information.

[0009] The crosstalk diagram is clustered based on the spectral clustering algorithm to identify crosstalk paths in the simulated IC synchronous test process.

[0010] Construct an electromagnetic crosstalk signal isolation barrier for simulated IC synchronous testing based on the crosstalk diagram and crosstalk path;

[0011] The electromagnetic crosstalk signal isolation barrier is deployed in a synchronous test environment of an analog IC to construct a crosstalk simulation signal. The crosstalk simulation signal is injected into an independently tested analog IC to perform crosstalk simulation. The crosstalk isolation effect of the electromagnetic crosstalk signal isolation barrier is evaluated based on the crosstalk simulation.

[0012] The electromagnetic crosstalk signal isolation barrier is optimized based on the isolation effect to obtain an optimized electromagnetic crosstalk signal isolation barrier.

[0013] In this solution, the acquisition of location layout data and test signal data for each analog IC during synchronous testing, the determination of electromagnetic crosstalk information for each analog IC based on the test signal data, and the construction of a crosstalk diagram based on the location layout data and electromagnetic crosstalk information are specifically as follows:

[0014] Based on the carrier board layout information of the target analog IC tester, the test physical coordinates of each analog IC during the synchronous test of the analog IC are extracted, and the position layout data of the analog IC is established through three-dimensional spatial mapping.

[0015] The test signal data of each analog IC during the synchronous test of the analog IC is acquired. The test signal data includes time-domain waveform data and frequency-domain spectrum data. Wavelet transform processing is performed on the test signal data to extract the crosstalk noise component of the time-domain waveform signal. The instantaneous amplitude and instantaneous frequency of the crosstalk noise component are calculated by Hilbert transform.

[0016] The frequency domain spectrum data is divided into windows based on a sliding time window, and the electromagnetic crosstalk frequency points of the frequency domain spectrum data within each divided window are calculated based on Fourier transform. The power spectral density of each crosstalk frequency point is then calculated.

[0017] The electromagnetic crosstalk intensity and frequency between each analog IC are calculated based on the instantaneous amplitude and frequency of the crosstalk noise component and the power spectral density of the crosstalk frequency point, so as to obtain the electromagnetic crosstalk information of each analog IC.

[0018] The electromagnetic crosstalk information of each analog IC is mapped to the location layout data to construct a crosstalk diagram for synchronous testing of analog ICs.

[0019] In this solution, the step of clustering the crosstalk diagram based on the spectral clustering algorithm to identify crosstalk paths in the simulated IC synchronization test process specifically involves:

[0020] The spatial distance between each analog IC is determined based on the location layout data. The signal energy correlation of each analog IC at the same frequency point is calculated based on the power spectral density of the electromagnetic crosstalk frequency point. The crosstalk coupling coefficient between each analog IC is determined by weighted calculation based on the spatial distance and the signal energy correlation.

[0021] The crosstalk relationship between the simulated ICs is determined based on the crosstalk coupling coefficient. Each simulated IC is treated as a graph node. Connection edges are established for simulated IC nodes with crosstalk relationships. The connection weights of the connection edges are determined based on the crosstalk coupling coefficient and the crosstalk strength. A weighted adjacency matrix of the simulated ICs is then constructed.

[0022] The weighted adjacency matrix is ​​normalized, the degree matrix is ​​calculated and a symmetric normalized Laplacian matrix is ​​constructed, the eigenvectors corresponding to the first k largest eigenvalues ​​are obtained through eigenvalue decomposition, and the eigenvectors are arranged into a feature matrix by row.

[0023] K-means clustering is performed on the row vectors of the feature matrix to divide the simulated IC into k crosstalk coupling clusters. The average crosstalk intensity between simulated ICs in each crosstalk coupling cluster is calculated. Simulated IC pairs with average crosstalk intensity exceeding the inter-cluster crosstalk threshold are marked as strongly coupled node pairs.

[0024] Based on the strongly coupled node pair, a crosstalk propagation directed graph is constructed. A depth-first search is performed on the crosstalk propagation directed graph to identify the path with the maximum cumulative crosstalk intensity as the main crosstalk path.

[0025] Based on the location layout data of each analog IC on the main crosstalk path, the correlation coefficient between the spatial distance between adjacent analog ICs on the path and the crosstalk intensity is calculated. Path segments with correlation coefficients exceeding the distance influence threshold are marked as distance-sensitive crosstalk paths. Combining the main crosstalk path and the distance-sensitive crosstalk path, a set of analog IC synchronous test crosstalk paths is constructed.

[0026] In this solution, the step of constructing an electromagnetic crosstalk signal isolation barrier for simulated IC synchronous testing based on the crosstalk diagram and crosstalk path specifically includes:

[0027] Based on the electromagnetic crosstalk information of each analog IC in the crosstalk diagram, the crosstalk intensity distribution characteristics are extracted. The propagation direction of the main crosstalk path in the crosstalk path set is combined with the propagation direction of the main crosstalk path to determine the electromagnetic field radiation main lobe direction. Based on the electromagnetic field radiation main lobe direction, the signal coverage range of each analog IC in three-dimensional space is calculated.

[0028] Based on the signal coverage and location map data, spatial overlay analysis is performed to identify analog IC pairs with overlapping electromagnetic fields, and the center point of the overlapping electromagnetic field region is used as the reference anchor point of the isolation barrier.

[0029] An initial isolation barrier plane is constructed based on the reference anchor point. The normal vector direction of the isolation barrier plane is adjusted according to the spatial correlation coefficient of the distance-sensitive crosstalk path in the crosstalk path set. The adjusted isolation barrier plane forms the maximum angle with the distance-sensitive crosstalk path.

[0030] Obtain the intersection length between the isolation barrier plane corresponding to the maximum included angle and the coverage area of ​​each analog IC signal. When the intersection length exceeds the intersection threshold, divide the isolation barrier plane into high crosstalk area and low crosstalk area according to the electromagnetic crosstalk intensity distribution characteristics. Generate the metal shielding layer distribution strategy of the isolation barrier based on the position coordinates of the high crosstalk area.

[0031] When the intersection length is not greater than the intersection threshold, the electromagnetic crosstalk frequency power spectral density of adjacent analog ICs on the main crosstalk path is re-extracted, the frequency energy difference is calculated and the energy-dominant frequency band is identified, the dielectric material parameters of the isolation barrier plane are determined based on the energy-dominant frequency band, and a frequency band matching isolation barrier impedance optimization strategy is generated.

[0032] An electromagnetic crosstalk signal isolation barrier for analog IC synchronous testing is constructed based on the metal shielding layer distribution strategy or the isolation barrier impedance optimization strategy.

[0033] In this solution, the electromagnetic crosstalk signal isolation barrier is deployed in a synchronous test environment of an analog IC to construct a crosstalk simulation signal. This crosstalk simulation signal is then injected into an independently tested analog IC for crosstalk simulation. The crosstalk isolation effect of the electromagnetic crosstalk signal isolation barrier is evaluated based on the crosstalk simulation results. Specifically:

[0034] Based on the strongly coupled node pairs and their corresponding electromagnetic crosstalk frequency points identified in the crosstalk diagram, the power spectral density features of each frequency point are extracted, and the time-domain crosstalk signal waveform is reconstructed by inverse Fourier transform. According to the spatial position relationship of the simulated IC on the main crosstalk path, the time delay and attenuation coefficient of the crosstalk signal on the transmission path are calculated, and a crosstalk simulation signal equivalent to the synchronous test environment is generated.

[0035] A single analog IC is deployed sequentially at each carrier board position of the target analog IC tester for independent simulation testing. The crosstalk simulation signal is injected into the simulation test analog IC through the signal injection port of the tester to obtain the output signal data of the simulation test analog IC.

[0036] The output signal data is subjected to bandpass filtering to extract the signal component that matches the frequency band of the crosstalk simulation signal, and the energy ratio of the signal component is calculated as the crosstalk coupling strength at the current test position.

[0037] Based on the deployment location of the electromagnetic crosstalk signal isolation barrier, the analog IC regions on both sides of the isolation barrier are divided, and the crosstalk coupling strength difference between the analog ICs on both sides of the barrier is calculated. The crosstalk suppression rate is determined based on the difference, and the crosstalk isolation effect is determined based on the crosstalk suppression rate.

[0038] In this solution, optimizing the electromagnetic crosstalk signal isolation barrier based on the isolation effect to obtain an optimized electromagnetic crosstalk signal isolation barrier specifically involves:

[0039] A crosstalk isolation effect distribution map is constructed based on the crosstalk isolation effect of the simulated IC tested independently at each carrier board location. The regions in the crosstalk isolation effect distribution map with crosstalk suppression rates below a threshold are extracted as optimization target regions.

[0040] Based on the set of crosstalk paths in the optimized target area, the electromagnetic field radiation main lobe direction of the main crosstalk path is recalculated, the plane normal vector of the isolation barrier is adjusted to be orthogonal to the updated radiation main lobe direction, and the adjustment angle of the isolation shielding plane is determined.

[0041] Frequency domain feature analysis is performed on the crosstalk simulation signal of the optimized target area to identify residual crosstalk frequency bands that have not been effectively suppressed. The required increase in shielding layer thickness is calculated based on the power spectral density characteristics of the frequency band. The electromagnetic crosstalk signal isolation barrier is optimized according to the adjustment angle of the isolation shielding plane and the increase in shielding layer thickness to obtain the optimized electromagnetic crosstalk signal isolation barrier.

[0042] A second aspect of the present invention also provides an analog IC synchronous test optimization system based on crosstalk simulation. The system includes a memory and a processor. The memory includes a program for an analog IC synchronous test optimization method based on crosstalk simulation. When the processor executes the program, the program performs the following steps:

[0043] Acquire the location layout data and test signal data of each analog IC during the synchronous testing process; determine the electromagnetic crosstalk information of each analog IC based on the test signal data; and construct a crosstalk diagram based on the location layout data and the electromagnetic crosstalk information.

[0044] The crosstalk diagram is clustered based on the spectral clustering algorithm to identify crosstalk paths in the simulated IC synchronous test process.

[0045] Construct an electromagnetic crosstalk signal isolation barrier for simulated IC synchronous testing based on the crosstalk diagram and crosstalk path;

[0046] The electromagnetic crosstalk signal isolation barrier is deployed in a synchronous test environment of an analog IC to construct a crosstalk simulation signal. The crosstalk simulation signal is injected into an independently tested analog IC to perform crosstalk simulation. The crosstalk isolation effect of the electromagnetic crosstalk signal isolation barrier is evaluated based on the crosstalk simulation.

[0047] The electromagnetic crosstalk signal isolation barrier is optimized based on the isolation effect to obtain an optimized electromagnetic crosstalk signal isolation barrier.

[0048] This invention discloses an optimization method and system for synchronous testing of analog ICs based on crosstalk simulation. The method first acquires the location layout data and test signal data of each analog IC during synchronous testing. Electromagnetic crosstalk information is determined by combining the test signals, and a crosstalk diagram is constructed based on this diagram and the location layout data. A spectral clustering algorithm is used to cluster the diagram to identify crosstalk paths in the synchronous test. An electromagnetic crosstalk signal isolation barrier is designed based on the diagram and crosstalk paths, and deployed in the test environment. Simulation evaluation is performed on independently tested analog ICs by constructing and injecting crosstalk simulation signals to determine the isolation effect. The isolation barrier is optimized based on the evaluation results to obtain an optimized solution. This method can effectively identify and isolate electromagnetic crosstalk paths during synchronous testing, improving the accuracy and reliability of analog IC testing. Attached Figure Description

[0049] Figure 1 A flowchart of an optimization method for synchronous testing of analog ICs based on crosstalk simulation according to the present invention is shown;

[0050] Figure 2 A flowchart illustrating the crosstalk isolation effect of the crosstalk signal isolation barrier according to the present invention is shown;

[0051] Figure 3 The flowchart illustrating the optimized electromagnetic crosstalk signal isolation barrier obtained by the present invention is shown.

[0052] Figure 4 A block diagram of an analog IC synchronous test optimization system based on crosstalk simulation according to the present invention is shown. Detailed Implementation

[0053] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0054] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0055] Figure 1 The flowchart of an optimization method for synchronous testing of analog ICs based on crosstalk simulation according to the present invention is shown.

[0056] like Figure 1 As shown, the first aspect of the present invention provides an optimization method for analog IC synchronization testing based on crosstalk simulation, comprising:

[0057] S102, acquire the location layout data and test signal data of each analog IC during the synchronous test of the analog IC, determine the electromagnetic crosstalk information of each analog IC based on the test signal data, and construct a crosstalk diagram based on the location layout data and the electromagnetic crosstalk information;

[0058] S104, perform clustering operation on the crosstalk diagram based on the spectral clustering algorithm to identify the crosstalk path in the simulated IC synchronous test process;

[0059] S106, Construct an electromagnetic crosstalk signal isolation barrier for simulated IC synchronous testing based on the crosstalk diagram and crosstalk path;

[0060] S108, the electromagnetic crosstalk signal isolation barrier is deployed in the analog IC synchronous test environment to construct a crosstalk simulation signal, the crosstalk simulation signal is injected into the independently tested analog IC to perform crosstalk simulation, and the crosstalk isolation effect of the electromagnetic crosstalk signal isolation barrier is evaluated based on the crosstalk simulation.

[0061] S110, The electromagnetic crosstalk signal isolation barrier is optimized based on the isolation effect to obtain an optimized electromagnetic crosstalk signal isolation barrier.

[0062] It should be noted that by acquiring the location layout data and test signal data of each analog IC during synchronous testing, the spatial layout and signal characteristics of each device under test can be accurately reconstructed in the early stages of testing. Electromagnetic crosstalk information is extracted from the test signal data and combined with the location layout to construct a crosstalk diagram, intuitively presenting the coupling relationship and interference intensity between different analog ICs, thus visualizing the crosstalk distribution. A spectral clustering algorithm is used to perform cluster analysis on the crosstalk diagram, effectively identifying groups of devices with high coupling and the main crosstalk paths, thereby accurately locating the interference propagation channels. Electromagnetic crosstalk signal isolation is constructed based on the crosstalk diagram and path information. The isolation barrier is a targeted isolation measure placed in critical coupling areas to reduce unnecessary shielding structures and improve the effectiveness and economy of isolation design. The isolation barrier is deployed in the test environment and an equivalent crosstalk simulation signal is injected into the independently tested analog IC. Without affecting normal production testing, the electromagnetic interference process is realistically reproduced, and the suppression effect of the isolation barrier is quantitatively measured through simulation evaluation. Finally, the isolation barrier is optimized based on the evaluation results, and the isolation structure parameters and positions are adjusted so that the isolation barrier can maintain a high crosstalk suppression rate under different test batches and layout conditions, thereby significantly improving the accuracy and consistency of synchronous testing of analog ICs.

[0063] According to an embodiment of the present invention, the steps of acquiring the location layout data and test signal data of each analog IC during the synchronous testing process of the analog IC, determining the electromagnetic crosstalk information of each analog IC based on the test signal data, and constructing a crosstalk diagram based on the location layout data and the electromagnetic crosstalk information are specifically as follows:

[0064] Based on the carrier board layout information of the target analog IC tester, the test physical coordinates of each analog IC during the synchronous test of the analog IC are extracted, and the position layout data of the analog IC is established through three-dimensional spatial mapping.

[0065] The test signal data of each analog IC during the synchronous test of the analog IC is acquired. The test signal data includes time-domain waveform data and frequency-domain spectrum data. Wavelet transform processing is performed on the test signal data to extract the crosstalk noise component of the time-domain waveform signal. The instantaneous amplitude and instantaneous frequency of the crosstalk noise component are calculated by Hilbert transform.

[0066] The frequency domain spectrum data is divided into windows based on a sliding time window, and the electromagnetic crosstalk frequency points of the frequency domain spectrum data within each divided window are calculated based on Fourier transform. The power spectral density of each crosstalk frequency point is then calculated.

[0067] The electromagnetic crosstalk intensity and frequency between each analog IC are calculated based on the instantaneous amplitude and frequency of the crosstalk noise component and the power spectral density of the crosstalk frequency point, so as to obtain the electromagnetic crosstalk information of each analog IC.

[0068] The electromagnetic crosstalk information of each analog IC is mapped to the location layout data to construct a crosstalk diagram for synchronous testing of analog ICs.

[0069] It should be noted that during synchronous testing of analog ICs, because multiple ICs under test operate simultaneously in adjacent locations, their pins and internal circuits generate electromagnetic radiation during high-speed or high-frequency signal transmission. This radiation, through test board traces, common power / ground planes, and spatial coupling, creates parasitic capacitance and inductance, resulting in electromagnetic crosstalk between different ICs. This crosstalk is not only related to the physical spacing and relative layout between ICs, but also closely related to the frequency components, amplitude variations, and spectral overlap of their operating signals. It can easily lead to distortion of test signals from adjacent ICs, noise superposition, or frequency shift, affecting test accuracy. By extracting the three-dimensional physical coordinates of each IC based on the board layout information and combining them with the time and frequency domain characteristics of the test signals, the electromagnetic crosstalk intensity and frequency distribution can be calculated. Mapping this to the location layout to construct an electromagnetic crosstalk diagram can visually reveal the coupling relationship, interference strength, and frequency characteristics between ICs.

[0070] According to an embodiment of the present invention, the step of performing a clustering operation on the crosstalk diagram based on the spectral clustering algorithm to identify crosstalk paths in the simulated IC synchronization test process specifically includes:

[0071] The spatial distance between each analog IC is determined based on the location layout data. The signal energy correlation of each analog IC at the same frequency point is calculated based on the power spectral density of the electromagnetic crosstalk frequency point. The crosstalk coupling coefficient between each analog IC is determined by weighted calculation based on the spatial distance and the signal energy correlation.

[0072] It should be noted that the signal energy correlation is calculated by measuring the correlation coefficient between the power spectral densities of each analog IC at the same frequency point, thereby quantifying their signal coupling strength in the electromagnetic crosstalk band; the crosstalk coupling coefficient is used to quantify the electromagnetic crosstalk strength between analog ICs, and a weighted fusion method is used to combine the spatial distance attenuation effect with the signal energy coupling degree, wherein closer distances and higher signal correlations will significantly increase the coupling coefficient.

[0073] The crosstalk relationship between the simulated ICs is determined based on the crosstalk coupling coefficient. Each simulated IC is treated as a graph node. Connection edges are established for simulated IC nodes with crosstalk relationships. The connection weights of the connection edges are determined based on the crosstalk coupling coefficient and the crosstalk strength. A weighted adjacency matrix of the simulated ICs is then constructed.

[0074] The weighted adjacency matrix is ​​normalized, the degree matrix is ​​calculated and a symmetric normalized Laplacian matrix is ​​constructed, the eigenvectors corresponding to the first k largest eigenvalues ​​are obtained through eigenvalue decomposition, and the eigenvectors are arranged into a feature matrix by row.

[0075] K-means clustering is performed on the row vectors of the feature matrix to divide the simulated IC into k crosstalk coupling clusters. The average crosstalk intensity between simulated ICs in each crosstalk coupling cluster is calculated. Simulated IC pairs with average crosstalk intensity exceeding the inter-cluster crosstalk threshold are marked as strongly coupled node pairs.

[0076] It should be noted that analog IC pairs with an average crosstalk intensity exceeding the inter-cluster crosstalk threshold are marked as strongly coupled node pairs because these node pairs exhibit significantly higher crosstalk intensity within the same cluster than other inter-cluster connections, indicating a significant electromagnetic interference coupling relationship between them. This strong coupling relationship typically represents the main interference path in actual synchronization testing and is a key target for locating and suppressing crosstalk. The crosstalk relationship refers to whether crosstalk exists between two analog ICs.

[0077] Based on the strongly coupled node pair, a crosstalk propagation directed graph is constructed. A depth-first search is performed on the crosstalk propagation directed graph to identify the path with the maximum cumulative crosstalk intensity as the main crosstalk path.

[0078] Based on the location layout data of each analog IC on the main crosstalk path, the correlation coefficient between the spatial distance between adjacent analog ICs on the path and the crosstalk intensity is calculated. Path segments with correlation coefficients exceeding the distance influence threshold are marked as distance-sensitive crosstalk paths. Combining the main crosstalk path and the distance-sensitive crosstalk path, a set of analog IC synchronous test crosstalk paths is constructed.

[0079] It should be noted that the spectral clustering algorithm, by combining graph theory and linear algebra, can automatically discover highly correlated node clusters in complex networks. It abstracts the crosstalk relationships between analog ICs into a weighted graph structure, treating each analog IC as a node, establishing connections between pairs of crosstalking analog ICs, and using the crosstalk coupling coefficient, which comprehensively considers spatial distance and signal energy correlation, as the connection weight to form a weighted adjacency matrix. Through normalization and the construction of a symmetric normalized Laplacian matrix, followed by eigenvalue decomposition, the original complex network can be projected into a low-dimensional feature space, making the coupling strength between analog ICs geometrically separable by clustering. Subsequently, K-means clustering can divide the analog ICs into multiple crosstalk coupling clusters, and the average crosstalk intensity within each cluster is used to screen for strongly coupled node pairs, which reflect potential high-energy crosstalk channels. Furthermore, a directed graph of crosstalk propagation is constructed by pairing strongly coupled nodes, and a depth-first search is used to find the path with the largest cumulative crosstalk intensity, which can identify the main crosstalk path most likely to cause interference in actual tests. Finally, by analyzing the correlation between the distance and crosstalk intensity of adjacent ICs in the main crosstalk path, distance-sensitive paths that are significantly affected by spatial distance are marked, thus obtaining a complete set of crosstalk paths. Spectral clustering groups analog IC nodes with strong coupling relationships in electromagnetic crosstalk, high signal energy correlation, and close spatial locations into one class. In the directed graph of crosstalk propagation, nodes represent analog ICs, the direction of directed edges is from analog ICs with larger crosstalk coupling coefficients to analog ICs with smaller crosstalk coupling coefficients, and the edge weight represents the crosstalk intensity; k is a preset value.

[0080] According to an embodiment of the present invention, the step of constructing an electromagnetic crosstalk signal isolation barrier for simulated IC synchronous testing based on the crosstalk diagram and crosstalk path specifically includes:

[0081] Based on the electromagnetic crosstalk information of each analog IC in the crosstalk diagram, the crosstalk intensity distribution characteristics are extracted. The propagation direction of the main crosstalk path in the crosstalk path set is combined with the propagation direction of the main crosstalk path to determine the electromagnetic field radiation main lobe direction. Based on the electromagnetic field radiation main lobe direction, the signal coverage range of each analog IC in three-dimensional space is calculated.

[0082] Based on the signal coverage and location map data, spatial overlay analysis is performed to identify analog IC pairs with overlapping electromagnetic fields, and the center point of the overlapping electromagnetic field region is used as the reference anchor point of the isolation barrier.

[0083] An initial isolation barrier plane is constructed based on the reference anchor point. The normal vector direction of the isolation barrier plane is adjusted according to the spatial correlation coefficient of the distance-sensitive crosstalk path in the crosstalk path set. The adjusted isolation barrier plane forms the maximum angle with the distance-sensitive crosstalk path.

[0084] It should be noted that maximizing the angle between the adjusted isolation barrier plane and the distance-sensitive crosstalk path minimizes the propagation of electromagnetic crosstalk along this path. Distance-sensitive crosstalk paths refer to crosstalk routes where crosstalk intensity is closely related to spatial distance and significantly affected by physical location. By maximizing the angle between the isolation barrier plane and these paths, the barrier is essentially perpendicular or nearly perpendicular to the crosstalk signal propagation direction, thereby enhancing the barrier's blocking effect on electromagnetic waves, effectively blocking or weakening the crosstalk signal propagation path, and improving the shielding performance and overall crosstalk suppression effect of the isolation barrier. The main lobe direction refers to the direction where magnetic energy is most concentrated and radiated power is highest, which is also the direction where electromagnetic wave energy is most concentrated and propagation is most significant.

[0085] Obtain the intersection length between the isolation barrier plane corresponding to the maximum included angle and the coverage area of ​​each analog IC signal. When the intersection length exceeds the intersection threshold, divide the isolation barrier plane into high crosstalk area and low crosstalk area according to the electromagnetic crosstalk intensity distribution characteristics. Generate the metal shielding layer distribution strategy of the isolation barrier based on the position coordinates of the high crosstalk area.

[0086] It should be noted that the intersection line refers to the line segment in three-dimensional space where the plane of the isolation barrier intersects with the signal coverage area of ​​the analog IC, representing the actual contact or overlap between the barrier and the electromagnetic signal propagation area. When the length of the intersection line exceeds a preset intersection line threshold, it indicates that there is a large overlap between the isolation barrier and the signal coverage areas of multiple analog ICs, and electromagnetic crosstalk may propagate through these overlapping areas. Based on the characteristics of electromagnetic crosstalk intensity distribution, high crosstalk zones and low crosstalk zones are divided on both sides of the isolation barrier plane. This allows for precise location of areas where crosstalk energy is concentrated, and targeted placement of metal shielding layers at the coordinates of high crosstalk zones can effectively block or weaken the transmission path of electromagnetic waves.

[0087] When the intersection length is not greater than the intersection threshold, the electromagnetic crosstalk frequency power spectral density of adjacent analog ICs on the main crosstalk path is re-extracted, the frequency energy difference is calculated and the energy-dominant frequency band is identified, the dielectric material parameters of the isolation barrier plane are determined based on the energy-dominant frequency band, and a frequency band matching isolation barrier impedance optimization strategy is generated.

[0088] An electromagnetic crosstalk signal isolation barrier for analog IC synchronous testing is constructed based on the metal shielding layer distribution strategy or the isolation barrier impedance optimization strategy.

[0089] It should be noted that when the intersection length is not greater than the intersection threshold, it indicates that the overlap between the isolation barrier plane and the coverage area of ​​the analog IC signal is small, and traditional metal shielding layers are insufficient to fully cover or block the main crosstalk paths. In this case, by re-extracting the power spectral density of the electromagnetic crosstalk frequency points of adjacent analog ICs on the main crosstalk path, calculating the frequency point energy difference, and identifying the dominant energy frequency band, the main frequency range of the interference signal can be accurately determined. Based on this dominant energy frequency band, the dielectric material parameters of the isolation barrier plane are specifically determined to ensure good electromagnetic wave absorption or impedance matching characteristics within a specific frequency band. The frequency band-matched isolation barrier impedance optimization strategy can effectively reduce the reflection and penetration of electromagnetic waves in this frequency band, improve the barrier's ability to suppress electromagnetic crosstalk in a specific frequency band, and thus optimize the overall isolation effect.

[0090] Figure 2 A flowchart illustrating the crosstalk isolation effect of the crosstalk signal isolation barrier according to the present invention is shown.

[0091] According to an embodiment of the present invention, the step of deploying the electromagnetic crosstalk signal isolation barrier in a synchronous test environment of an analog IC to construct a crosstalk simulation signal, injecting the crosstalk simulation signal into an independently tested analog IC for crosstalk simulation, and evaluating the crosstalk isolation effect of the electromagnetic crosstalk signal isolation barrier based on the crosstalk simulation, specifically includes:

[0092] S202, based on the strongly coupled node pairs identified in the crosstalk diagram and their corresponding electromagnetic crosstalk frequency points, extract the power spectral density features of each frequency point, reconstruct the time-domain crosstalk signal waveform through inverse Fourier transform, calculate the time delay and attenuation coefficient of the crosstalk signal on the transmission path according to the spatial position relationship of the simulated IC on the main crosstalk path, and generate a crosstalk simulation signal equivalent to the synchronous test environment.

[0093] S204, deploy a single analog IC in sequence at each carrier board position of the target analog IC tester for independent simulation testing, inject the crosstalk simulation signal into the simulation test analog IC through the signal injection port of the tester, and obtain the output signal data of the simulation test analog IC;

[0094] S206, bandpass filtering is performed on the output signal data to extract the signal component that matches the frequency band of the crosstalk simulation signal, and the energy ratio of the signal component is calculated as the crosstalk coupling strength at the current test position.

[0095] S208. Based on the deployment location of the electromagnetic crosstalk signal isolation barrier, divide the analog IC regions on both sides of the isolation barrier, calculate the crosstalk coupling strength difference between the analog ICs on both sides of the barrier, determine the crosstalk suppression rate based on the difference, and determine the crosstalk isolation effect based on the crosstalk suppression rate.

[0096] It should be noted that by constructing a crosstalk simulation signal that is highly consistent with the actual synchronous test environment, and injecting this signal into the independently tested analog IC, the electromagnetic crosstalk during the test process can be realistically simulated and reproduced, accurately reflecting the changes in crosstalk coupling strength at different test locations. By using the frequency band matching energy ratio of the simulation output signal, the influence of the crosstalk signal on the IC under test can be quantified. Then, by comparing the difference in crosstalk coupling strength between the analog ICs on both sides of the isolation barrier, the crosstalk suppression effect of the isolation barrier can be accurately evaluated.

[0097] Figure 3 A flowchart illustrating the optimized electromagnetic crosstalk signal isolation barrier obtained by the present invention is shown.

[0098] According to an embodiment of the present invention, optimizing the electromagnetic crosstalk signal isolation barrier based on the isolation effect to obtain an optimized electromagnetic crosstalk signal isolation barrier specifically involves:

[0099] S302, construct a crosstalk isolation effect distribution map based on the crosstalk isolation effect of the simulated IC tested independently at each carrier board location, and extract the area in the crosstalk isolation effect distribution map where the crosstalk suppression rate is lower than the threshold as the optimization target area;

[0100] S304, based on the crosstalk path set of the optimized target area, recalculate the electromagnetic field radiation main lobe direction of the main crosstalk path, adjust the isolation barrier plane normal vector to form an orthogonal relationship with the updated radiation main lobe direction, and determine the adjustment angle of the isolation shielding plane;

[0101] S306, perform frequency domain feature analysis on the crosstalk simulation signal of the optimized target area, identify the residual crosstalk frequency band that has not been effectively suppressed, calculate the required increase in shielding layer thickness based on the power spectral density characteristics of the frequency band, and optimize the electromagnetic crosstalk signal isolation barrier according to the adjustment angle of the isolation shielding plane and the increase in shielding layer thickness to obtain the optimized electromagnetic crosstalk signal isolation barrier.

[0102] It should be noted that during the synchronous testing of analog ICs, due to the complex propagation paths of electromagnetic crosstalk and environmental changes, the initially constructed crosstalk signal isolation barrier may have insufficient crosstalk suppression in some areas, resulting in the test signal still being interfered with, affecting the accuracy and reliability of the test. By constructing a crosstalk isolation effect distribution map based on independent testing at each carrier position, the optimization target area with a suppression rate below the threshold can be accurately located. Combined with the crosstalk path set of the optimized area, the electromagnetic field radiation main lobe direction of the main crosstalk path is recalculated, and the plane normal vector of the isolation barrier is adjusted to achieve an orthogonal relationship with the radiation main lobe direction, effectively enhancing the barrier's ability to block the main crosstalk path. In addition, residual crosstalk frequency bands that have not been sufficiently suppressed are identified through frequency domain feature analysis, and the shielding layer thickness is reasonably calculated based on the power spectral density of the frequency band to further improve the shielding effect of the barrier on crosstalk in specific frequency bands. This optimization strategy comprehensively adjusts the spatial direction and material thickness, significantly enhancing the crosstalk suppression performance of the isolation barrier.

[0103] According to an embodiment of the present invention, it further includes:

[0104] The high-frequency crosstalk signal on the main crosstalk path is acquired during the synchronous test of the analog IC. The instantaneous phase information of the high-frequency crosstalk signal is extracted by Hilbert transform. The phase offset between adjacent windows is calculated based on the sliding time window. A phase drift trend model is constructed based on the phase offset.

[0105] Based on the phase drift trend model, the direction of phase change in the next time window is predicted. Combined with the dielectric constant-frequency characteristic curve of the current dielectric material of the isolation barrier, the deviation between the predicted phase and the barrier impedance matching frequency band is calculated.

[0106] When the deviation value exceeds the phase tolerance threshold, a dielectric constant adjustment command is generated based on the magnitude and direction of the deviation value. The equivalent dielectric constant of the isolation barrier is adjusted in real time through the voltage-controlled dielectric material layer, so that the barrier impedance matching frequency band dynamically tracks the phase drift of the high-frequency crosstalk signal.

[0107] According to an embodiment of the present invention, the real-time adjustment of the equivalent dielectric constant of the isolation barrier by the voltage-controlled dielectric material layer specifically involves: generating a voltage-controlled voltage signal according to the dielectric constant adjustment command, applying the voltage-controlled voltage signal to the barium strontium titanate thin film layer of the isolation barrier, and changing the lattice polarizability of the thin film by the electric field strength to achieve continuous adjustment of the dielectric constant;

[0108] The measured dielectric constant of the adjusted barium strontium titanate thin film is acquired synchronously, compared with the target dielectric constant, and the adjustment error is calculated. Based on the adjustment error, the amplitude of the voltage-controlled voltage signal is corrected using a PID control algorithm.

[0109] The dielectric parameter database in the phase drift trend model is updated based on the corrected voltage-controlled voltage signal, and a mapping table between the dielectric constant adjustment and the phase drift compensation effect is established. Based on the mapping table, the generation strategy of subsequent dielectric constant adjustment commands is optimized to achieve sub-millisecond dynamic matching between high-frequency phase drift and barrier impedance.

[0110] It should be noted that during synchronous testing of analog ICs, the phase drift of high-frequency crosstalk signals severely affects the impedance matching effect of isolation barriers. Isolation barriers with fixed parameters cannot adapt to dynamically changing signal characteristics, leading to persistent residual crosstalk interfering with test results. Due to factors such as transmission line delay, temperature changes, and nonlinear dielectric properties of materials, the phase characteristics of high-frequency signals drift unpredictably over time during transmission. This causes the originally designed impedance matching frequency band of the isolation barrier to gradually deviate from the actual signal frequency band, resulting in a decrease in barrier isolation effectiveness. By extracting the instantaneous phase information of the signal and establishing a phase drift trend model, a predictive algorithm is used to predict the direction of phase change in advance. Combined with the frequency characteristics of the dielectric material, the impedance matching deviation is calculated in real time. When the deviation exceeds the allowable range, a dielectric constant adjustment mechanism is immediately triggered. Utilizing the electric field sensitivity of voltage-controlled dielectric materials, the dielectric constant is continuously adjustable through precise voltage control. A closed-loop feedback system ensures adjustment accuracy, ultimately forming a dynamic matching system between phase drift and barrier impedance. This significantly improves the isolation barrier's adaptability to high-frequency phase drift signals, ensuring stable crosstalk suppression under different test environments and signal conditions.

[0111] Figure 4 A block diagram of an analog IC synchronous test optimization system based on crosstalk simulation according to the present invention is shown.

[0112] A second aspect of the present invention also provides an analog IC synchronous test optimization system based on crosstalk simulation, comprising: a memory 401, a processor 402, and a communication interface 403. The memory is used to store a program, the processor is used to execute the program stored in the memory, and the communication interface is used for data connection communication between the memory and the processor. When the program stored in the memory is executed, an analog IC synchronous test optimization method based on crosstalk simulation as described in any of the above claims is implemented.

[0113] This invention discloses an optimization method and system for synchronous testing of analog ICs based on crosstalk simulation. The method first acquires the location layout data and test signal data of each analog IC during synchronous testing. Electromagnetic crosstalk information is determined by combining the test signals, and a crosstalk diagram is constructed based on this diagram and the location layout data. A spectral clustering algorithm is used to cluster the diagram to identify crosstalk paths in the synchronous test. An electromagnetic crosstalk signal isolation barrier is designed based on the diagram and crosstalk paths, and deployed in the test environment. Simulation evaluation is performed on independently tested analog ICs by constructing and injecting crosstalk simulation signals to determine the isolation effect. The isolation barrier is optimized based on the evaluation results to obtain an optimized solution. This method can effectively identify and isolate electromagnetic crosstalk paths during synchronous testing, improving the accuracy and reliability of analog IC testing.

[0114] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods, such as: multiple units or components can be combined, or integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the various components shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or units can be electrical, mechanical, or other forms.

[0115] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units. They may be located in one place or distributed across multiple network units. Some or all of the units may be selected to achieve the purpose of this embodiment according to actual needs.

[0116] In addition, in the various embodiments of the present invention, each functional unit can be integrated into one processing unit, or each unit can be a separate unit, or two or more units can be integrated into one unit; the integrated unit can be implemented in hardware or in the form of hardware plus software functional units.

[0117] Those skilled in the art will understand that all or part of the steps of the above method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it performs the steps of the above method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as mobile storage devices, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0118] Alternatively, if the integrated units of this invention are implemented as software functional modules and sold or used as independent products, they can also be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the embodiments of this invention, or the parts that contribute to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the methods described in the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as mobile storage devices, ROM, RAM, magnetic disks, or optical disks.

[0119] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for optimizing analog IC synchronous testing based on crosstalk simulation, characterized in that, The method comprises the following steps: acquiring position layout data and test signal data of each analog IC in a synchronous test process of the analog IC, determining electromagnetic crosstalk information of each analog IC according to the test signal data, and constructing a crosstalk schematic diagram according to the position layout data and the electromagnetic crosstalk information; performing a clustering operation on the crosstalk schematic diagram based on a spectral clustering algorithm, and identifying a crosstalk path in the synchronous test process of the analog IC, specifically: determining spatial distances between each analog IC according to the position layout data, calculating signal energy correlations of the analog ICs at the same frequency point according to electromagnetic crosstalk frequency point power spectrum densities, and determining crosstalk coupling coefficients between each analog IC through weighted calculation according to the spatial distances and the signal energy correlations; determining crosstalk relationships between the analog ICs according to the crosstalk coupling coefficients, taking each analog IC as a graph node, establishing a connection edge between the analog IC nodes with the crosstalk relationships, determining a connection weight of the connection edge according to the crosstalk coupling coefficients and crosstalk strengths, and constructing a weighted adjacency matrix of the analog IC; performing normalization processing on the weighted adjacency matrix, calculating a degree matrix and constructing a symmetric normalized Laplacian matrix, obtaining eigenvectors corresponding to the first k largest eigenvalues through eigenvalue decomposition, and grouping the eigenvectors into a feature matrix according to rows; performing K-means clustering on row vectors of the feature matrix, dividing the analog ICs into k crosstalk coupling clusters, calculating average crosstalk strengths between the analog ICs in each crosstalk coupling cluster, and marking analog IC pairs with average crosstalk strengths exceeding an inter-cluster crosstalk threshold as strongly coupled node pairs; constructing a crosstalk propagation directed graph based on the strongly coupled node pairs, performing a depth-first search on the crosstalk propagation directed graph, and identifying a path with the largest cumulative crosstalk strength as a main crosstalk path; calculating a correlation coefficient of spatial distances and crosstalk strengths between adjacent analog ICs on the main crosstalk path according to position layout data of the analog ICs on the main crosstalk path, marking a path segment with a correlation coefficient exceeding a distance influence threshold as a distance-sensitive crosstalk path, and constructing a synchronous test crosstalk path set of the analog ICs by combining the main crosstalk path and the distance-sensitive crosstalk path; constructing an electromagnetic crosstalk signal isolation barrier for the synchronous test of the analog ICs according to the crosstalk schematic diagram and the crosstalk path, specifically: extracting crosstalk strength distribution characteristics from electromagnetic crosstalk information of each analog IC in the crosstalk schematic diagram, determining an electromagnetic field radiation main lobe direction based on a propagation direction of the main crosstalk path in the crosstalk path set, and calculating signal coverage ranges of the analog ICs in a three-dimensional space based on the electromagnetic field radiation main lobe direction; performing spatial superposition analysis on the signal coverage ranges and the position layout data, identifying analog IC pairs with electromagnetic field overlapping regions, and taking a center point of the electromagnetic field overlapping region as a reference anchor point of the isolation barrier; constructing an initial isolation barrier plane based on the reference anchor point, adjusting a normal vector direction of the isolation barrier plane according to a spatial correlation coefficient of the distance-sensitive crosstalk path in the crosstalk path set, and forming a maximum included angle between the adjusted isolation barrier plane and the distance-sensitive crosstalk path. acquire the intersection line length of the isolation barrier plane corresponding to the maximum included angle and the coverage range of each simulated IC signal, when the intersection line length exceeds the intersection line threshold, then divide the high crosstalk region and the low crosstalk region on both sides of the isolation barrier plane according to the electromagnetic crosstalk intensity distribution characteristics, and generate the metal shielding layer distribution strategy of the isolation barrier based on the position coordinates of the high crosstalk region; when the intersection line length is not greater than the intersection line threshold, then re-extract the electromagnetic crosstalk frequency point power spectrum density of the adjacent analog IC on the main crosstalk path, calculate the frequency point energy difference value and identify the energy dominant frequency band, determine the dielectric material parameters of the isolation barrier plane based on the energy dominant frequency band, and generate the impedance optimization strategy of the frequency band matched isolation barrier; construct the electromagnetic crosstalk signal isolation barrier of the simulated IC synchronous test according to the metal shielding layer distribution strategy or the isolation barrier impedance optimization strategy; deploy the electromagnetic crosstalk signal isolation barrier in the simulated IC synchronous test environment, construct a crosstalk simulation signal, inject the crosstalk simulation signal into the independently tested analog IC for crosstalk simulation, and evaluate the crosstalk isolation effect of the electromagnetic crosstalk signal isolation barrier according to the crosstalk simulation; optimize the electromagnetic crosstalk signal isolation barrier according to the isolation effect, and obtain an optimized electromagnetic crosstalk signal isolation barrier.

2. The method of claim 1, wherein the method is characterized by: acquire the position layout data and test signal data of each simulated IC in the simulated IC synchronous test process, determine the electromagnetic crosstalk information of each simulated IC according to the test signal data, and construct a crosstalk diagram according to the position layout data and the electromagnetic crosstalk information, specifically: extract the test physical coordinates of each simulated IC in the simulated IC synchronous test process based on the board layout information of the target simulated IC tester, and establish the position layout data of the simulated IC through three-dimensional space mapping; acquire the test signal data of each simulated IC in the simulated IC synchronous test process, the test signal data including time domain waveform data and frequency domain spectrum data, perform wavelet transform processing on the test signal data, extract the crosstalk noise component of the time domain waveform signal, and calculate the instantaneous amplitude and instantaneous frequency of the crosstalk noise component through Hilbert transform; divide the frequency domain spectrum data into windows based on a sliding time window, calculate the electromagnetic crosstalk frequency points of the frequency domain spectrum data in each division window based on Fourier transform, and calculate the power spectrum density of each crosstalk frequency point; calculate the electromagnetic crosstalk intensity and electromagnetic crosstalk frequency between each simulated IC according to the instantaneous amplitude and instantaneous frequency of the crosstalk noise component and the power spectrum density of the crosstalk frequency point, and obtain the electromagnetic crosstalk information of each simulated IC; map the electromagnetic crosstalk information of each simulated IC to the position layout data to construct a crosstalk diagram of the simulated IC synchronous test.

3. The method of claim 1, wherein the method is characterized by: deploy the electromagnetic crosstalk signal isolation barrier in the simulated IC synchronous test environment, construct a crosstalk simulation signal, inject the crosstalk simulation signal into the independently tested analog IC for crosstalk simulation, and evaluate the crosstalk isolation effect of the electromagnetic crosstalk signal isolation barrier according to the crosstalk simulation, specifically: Based on the strong coupling node pairs identified in the crosstalk schematic diagram and their corresponding electromagnetic crosstalk frequency points, the power spectral density characteristics of each frequency point are extracted, the time-domain crosstalk signal waveform is reconstructed through inverse Fourier transform, the time delay and attenuation coefficient of the crosstalk signal on the transmission path are calculated according to the spatial position relationship of the analog ICs on the main crosstalk path, and the crosstalk simulation signal equivalent to the synchronous test environment is generated; A single analog IC is deployed in each load board position of the target analog IC tester for independent simulation testing, the crosstalk simulation signal is injected into the simulation test analog IC through the signal injection port of the tester, and the output signal data of the simulation test analog IC is obtained; The output signal data is band-pass filtered to extract signal components matching the frequency band of the crosstalk simulation signal, and the energy proportion of the signal components is calculated as the crosstalk coupling strength of the current test position; According to the deployment position of the electromagnetic crosstalk signal isolation barrier, the analog IC areas on both sides of the isolation barrier are divided, the crosstalk coupling strength difference of the analog ICs on both sides of the barrier is calculated, the crosstalk suppression rate is determined according to the difference, and the crosstalk isolation effect is determined according to the crosstalk suppression rate.

4. The method of claim 1, wherein the method is characterized by: The isolation effect of the electromagnetic crosstalk signal isolation barrier is optimized according to the isolation effect, and an optimized electromagnetic crosstalk signal isolation barrier is obtained, specifically as follows: A crosstalk isolation effect distribution map is constructed according to the crosstalk isolation effect of the analog ICs tested independently at each load board position, and a region with a crosstalk suppression rate lower than a threshold value in the crosstalk isolation effect distribution map is extracted as an optimization target region; The electromagnetic field radiation main lobe direction of the main crosstalk path is recalculated according to the crosstalk path set of the optimization target region, the normal vector of the isolation barrier plane is adjusted to form an orthogonal relationship with the updated radiation main lobe direction, and the adjustment angle of the isolation shielding plane is determined; The frequency domain characteristics of the crosstalk simulation signal of the optimization target region are analyzed, the residual crosstalk frequency band that is not effectively suppressed is identified, the required shielding layer thickness is calculated based on the power spectral density characteristics of the frequency band, and the electromagnetic crosstalk signal isolation barrier is optimized according to the adjustment angle of the isolation shielding plane and the increase in the thickness of the shielding layer, thereby obtaining an optimized electromagnetic crosstalk signal isolation barrier.

5. A system for analog IC synchronous test optimization based on crosstalk simulation, the system comprising: It comprises: a memory and a processor, the memory is used to store a program, and the processor is used to execute the program stored in the memory, when the program stored in the memory is executed, the following steps are implemented: obtain the position layout data and the test signal data of each analog IC in the analog IC synchronous test process, determine the electromagnetic crosstalk information of each analog IC according to the test signal data, and construct a crosstalk schematic diagram according to the position layout data and the electromagnetic crosstalk information; perform clustering operation on the crosstalk schematic diagram based on the spectral clustering algorithm, and identify the crosstalk path in the analog IC synchronous test process, specifically as follows: determine the spatial distance between each analog IC according to the position layout data, calculate the signal energy correlation of each analog IC at the same frequency point according to the power spectral density of the electromagnetic crosstalk frequency point, and determine the crosstalk coupling coefficient between each analog IC through weighted calculation according to the spatial distance and the signal energy correlation; The crosstalk relationship between the simulated ICs is determined based on the crosstalk coupling coefficient. Each simulated IC is treated as a graph node. Connection edges are established for simulated IC nodes with crosstalk relationships. The connection weights of the connection edges are determined based on the crosstalk coupling coefficient and the crosstalk strength. A weighted adjacency matrix of the simulated ICs is then constructed. The weighted adjacency matrix is ​​normalized, the degree matrix is ​​calculated and a symmetric normalized Laplacian matrix is ​​constructed, the eigenvectors corresponding to the first k largest eigenvalues ​​are obtained through eigenvalue decomposition, and the eigenvectors are arranged into a feature matrix by row. K-means clustering is performed on the row vectors of the feature matrix to divide the simulated IC into k crosstalk coupling clusters. The average crosstalk intensity between simulated ICs in each crosstalk coupling cluster is calculated. Simulated IC pairs with average crosstalk intensity exceeding the inter-cluster crosstalk threshold are marked as strongly coupled node pairs. Based on the strongly coupled node pair, a crosstalk propagation directed graph is constructed. A depth-first search is performed on the crosstalk propagation directed graph to identify the path with the maximum cumulative crosstalk intensity as the main crosstalk path. Based on the location layout data of each analog IC on the main crosstalk path, the correlation coefficient between the spatial distance between adjacent analog ICs on the path and the crosstalk intensity is calculated. Path segments with correlation coefficients exceeding the distance influence threshold are marked as distance-sensitive crosstalk paths. Combining the main crosstalk path and the distance-sensitive crosstalk path, a set of analog IC synchronous test crosstalk paths is constructed. Based on the crosstalk diagram and crosstalk path, an electromagnetic crosstalk signal isolation barrier for simulated IC synchronous testing is constructed as follows: Based on the electromagnetic crosstalk information of each analog IC in the crosstalk diagram, the crosstalk intensity distribution characteristics are extracted. The propagation direction of the main crosstalk path in the crosstalk path set is combined with the propagation direction of the main crosstalk path to determine the electromagnetic field radiation main lobe direction. Based on the electromagnetic field radiation main lobe direction, the signal coverage range of each analog IC in three-dimensional space is calculated. Based on the signal coverage and location map data, spatial overlay analysis is performed to identify analog IC pairs with overlapping electromagnetic fields, and the center point of the overlapping electromagnetic field region is used as the reference anchor point of the isolation barrier. An initial isolation barrier plane is constructed based on the reference anchor point. The normal vector direction of the isolation barrier plane is adjusted according to the spatial correlation coefficient of the distance-sensitive crosstalk path in the crosstalk path set. The adjusted isolation barrier plane forms the maximum angle with the distance-sensitive crosstalk path. Obtain the intersection length between the isolation barrier plane corresponding to the maximum included angle and the coverage area of ​​each analog IC signal. When the intersection length exceeds the intersection threshold, divide the isolation barrier plane into high crosstalk area and low crosstalk area according to the electromagnetic crosstalk intensity distribution characteristics. Generate the metal shielding layer distribution strategy of the isolation barrier based on the position coordinates of the high crosstalk area. When the intersection length is not greater than the intersection threshold, the electromagnetic crosstalk frequency power spectral density of adjacent analog ICs on the main crosstalk path is re-extracted, the frequency energy difference is calculated and the energy-dominant frequency band is identified, the dielectric material parameters of the isolation barrier plane are determined based on the energy-dominant frequency band, and a frequency band matching isolation barrier impedance optimization strategy is generated. Construct an electromagnetic crosstalk signal isolation barrier for analog IC synchronous testing based on the metal shielding layer distribution strategy or the isolation barrier impedance optimization strategy. The electromagnetic crosstalk signal isolation barrier is deployed in a synchronous test environment of an analog IC to construct a crosstalk simulation signal. The crosstalk simulation signal is injected into an independently tested analog IC to perform crosstalk simulation. The crosstalk isolation effect of the electromagnetic crosstalk signal isolation barrier is evaluated based on the crosstalk simulation. The electromagnetic crosstalk signal isolation barrier is optimized based on the isolation effect to obtain an optimized electromagnetic crosstalk signal isolation barrier.

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