Wafer carrying method, wafer carrying area control method and wafer carrying system

Abstract

The invention discloses a wafer carrying method, a wafer carrying area control method and a wafer carrying system. And the manufacturing execution system issues a carrying task to the material management and control system. The material management and control system issues carrying commands to the multiple carrying devices in the automatic carrying system through the multiple communication devices. And the carrying device transmits an execution result of the carrying command back to the material management and control system through the communication device. And the material management and control system integrates the execution results into carrying current condition comprehensive analysis data of the automatic carrying system, and transmits the analysis data to the execution system. The execution system analyzes the regional operation efficiency and then issues a correction command to the control system, and the control system sends a state adjustment command to the communication device according to the correction command. The communication device generates a second carrying command according to the state adjusting command and the original carrying command and outputs the second carrying command to the carrying device so as to change the carrying state of the wafer, correct the carrying command in real time according to the current condition of the carrying area and adjust the carrying progress of the wafer group regionally.

Description

TECHNICAL FIELD

[0001] The present application relates to a wafer transfer method, a wafer transfer area control method and a wafer transfer system. BACKGROUND

[0002] In the semiconductor manufacturing process, wafers will be sequentially passed through a plurality of facilities for processing according to the production flow. During the transportation, wafers are placed in wafer cassettes for quick movement among the processing facilities. When a plurality of transport vehicles simultaneously concentrate a large number of wafer cassettes to the destination processing facility, but the processing facility cannot timely digest, it will cause the transport vehicle carrying the wafer cassettes to be unable to unload, resulting in the extension of the transportation time. On the other hand, due to the transport vehicle being unable to unload, the transport vehicle cannot go to other processing facilities to transport other wafer cassettes, thereby causing the overall transportation efficiency to decrease, thereby delaying the production progress. SUMMARY

[0003] The present application provides a wafer transfer method and a wafer transfer system to avoid wafer transfer area congestion in advance, thereby effectively improving the wafer transfer efficiency.

[0004] Some embodiments of the present application provide a wafer transfer method, comprising: a manufacturing execution system issuing a transfer task to a material control system; the material control system issuing a transfer command to a plurality of transfer devices in an automated transfer system through a plurality of communication devices; the plurality of transfer devices returning the execution results of the transfer command to the material control system through the plurality of communication devices; the material control system integrating the execution results into the state of the automated transfer system and transmitting the state of the automated transfer system to the manufacturing execution system; the manufacturing execution system issuing a correction command to the material control system after analyzing the real-time operation efficiency of each area to correct the transfer command and send a state adjustment command to the plurality of communication devices; the material control system comprehensively considers the current operation state and sends the information to the manufacturing execution system; the manufacturing execution system issues a transfer sequence change command after analyzing the real-time operation efficiency of each area to the control system; then, the control system sends a state adjustment command to the plurality of communication devices according to the transfer sequence change command of the state of the automated transfer system; the plurality of communication devices generate a second transfer command according to the received state adjustment command and the transfer command, and output the second transfer command to the transfer device to change the transfer priority of the wafer in the automated transfer system in a regional manner, and also reserve a subsequent priority adjustment command for the next receiving device of the wafer transfer command.

[0005] Another embodiment of the present application provides a wafer transport area control method, comprising: a manufacturing execution system issuing a transport task to a material management system; the material management system issuing a transport command to a plurality of automated transport systems through a plurality of communication device groups, each of the plurality of communication device groups corresponding to each of the plurality of automated transport systems; the plurality of automated transport systems returning the execution results of the transport command to the material management system through the corresponding communication device groups; the material management system integrating the execution results into the status of each of the plurality of automated transport systems and transmitting the status of each of the automated transport systems to the manufacturing execution system; the material management system returning the current running status to the manufacturing execution system; the manufacturing execution system analyzing the real-time operation efficiency of each area and issuing a transport steering or suspension command to the control system; the communication device groups adjusting the received status adjustment command and the original transport command and outputting a second transport command to the transport devices in the corresponding automated transport systems to steer or suspend the transport of the wafers in the automated transport systems in the area and in turn reserving a subsequent adjustment command for the next receiving device of the wafer transport command.

[0006] Still another embodiment of the present application provides a wafer transport system, comprising: a manufacturing execution system; a material management system; a plurality of communication devices; an automated transport system comprising a plurality of transport devices; an execution system; and a control system, wherein: the manufacturing execution system issues a transport task to the material management system, the material management system issues a transport command to the corresponding plurality of transport devices in the automated transport system through the plurality of communication devices, the plurality of transport devices return the execution results of the transport command to the material management system through the plurality of communication devices, the material management system integrates the execution results into the status of the automated transport system and transmits the status of the automated transport system to the execution system; the execution system analyzes the real-time operation efficiency of each area and issues a correction command to the material management system to correct the transport command and sends a status adjustment command to the plurality of communication devices; the plurality of communication devices generate a second transport command according to the received status adjustment command and the transport command and output the second transport command to the transport devices to change the transport status of the wafers in the automated transport system.

[0007] Based on the above, the wafer transport method and wafer transport system of the present application can monitor the destination transport status in real time, reduce the transport volume in time when the destination area exceeds the transport capacity, control the number and speed of the in-and-out transport in the area through regional division, and disperse the vehicles to other demand areas to improve the overall transport efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 is a schematic diagram of a wafer handling system according to an embodiment of the present application.

[0009] Figure 2 is a flowchart of a wafer handling method according to an embodiment of the present application.

[0010] Figure 3 is a schematic diagram of a wafer handling system according to an embodiment of the present application.

[0011] Figure 4 is a flowchart of a wafer handling method according to an embodiment of the present application.

[0012]

Symbol Description

[0013] 100, 300: wafer handling system

[0014] 110: manufacturing execution system

[0015] 120: material control system

[0016] 130: execution system

[0017] 140: control system

[0018] 150_1, 150_2, 150_3: communication device

[0019] 150A, 150B, 150C, 150D: group of communication devices

[0020] 150_1A1, 150_2A1, 150_3A1: first communication port

[0021] 150_1A2, 150_2A2, 150_3A2: second communication port

[0022] 150_1C1, 150_2C1, 150_3C1: communication element

[0023] 150_1C2, 150_2C2, 150_3C2: logic element

[0024] 160A, 160B, 310A, 310B, 310C, 310D: automated handling section area

[0025] 162_1, 162_2, 162_3: automated handling system device

[0026] 170_1, 170_2: wafer transfer box

[0027] 200, 400: method

[0028] 202, 204, 206, 208, 210, 212, 214, 216, 218, 220, 222, 224, 226, 228, 230, 232, 234, 402, 404, 406, 408, 410, 412, 414, 416, 418, 420, 422, 424, 426, 428, 430, 432, 434, 436, 438, 440: Steps 312A, 312B, 312C, 312D: Conveying System Controller

[0029] 314A1, 314A2, 314A3, 314B1, 314B2, 314B3, 314C1, 314C2, 314D1, 314D2: Material storage bins Detailed Implementation

[0030] Figure 1 This is a schematic diagram of a wafer handling system according to an embodiment of the present invention. The wafer handling system 100 includes a manufacturing execution system 110, a material control system 120, multiple communication devices 150_1, 150_2, 150_3, automated transport partitions 160A, 160B, automated transport system devices (hereinafter referred to as transport devices) 162_1, 162_2, 162_3, 162_3, 180, an execution system 130, and a control system 140.

[0031] Automated transport zones 160A and 160B each include multiple transport devices. For example, in Figure 1 In the illustrated embodiment, automated transport compartment 160A includes transport devices 162_1 and 162_2, and automated transport compartment 160B includes transport device 162_3. In some embodiments, the automated transport compartment may have one or more transport devices, and this disclosure does not limit the number of transport devices in the automated transport system.

[0032] Manufacturing Execution System 110 controls each processing step of the wafer in the semiconductor manufacturing process. Therefore, Manufacturing Execution System 110 must manage the location of each wafer to ensure its movement between different process steps. Consequently, the Manufacturing Execution System issues handling tasks to Material Control System 120 to manage the wafer transport cassettes in the semiconductor factory, ensuring that the wafer transport cassettes can move between different process steps.

[0033] Material control system 120 is used to manage wafer transfer boxes (FOUPs) (e.g.) in semiconductor factories. Figure 1The management of wafer transfer boxes (170_1 and 170_2) within the semiconductor factory involves transporting wafers between process equipment, between different process technologies, and across floors within the semiconductor facility. Transport locations include process equipment, stockers, transport system controllers (TSCs), overhead buffers (OHBs), and conveyors. The goal is to reduce inter-equipment transport time and improve transport efficiency.

[0034] like Figure 1 As shown, the material control system 120 issues handling commands to multiple handling devices 162_1, 162_2, and 162_3 corresponding to the automated handling zones 160A and 160B through multiple communication devices 150_1, 150_2, and 150_3. In this embodiment, communication devices 150_1, 150_2, and 150_3 correspond one-to-one with handling devices 162_1, 162_2, and 162_3, respectively. For example, communication device 150_1 corresponds to handling device 162_1, communication device 150_2 corresponds to handling device 162_2, and communication device 150_3 corresponds to handling device 162_3. This one-to-one correspondence between communication devices and handling devices improves the transmission efficiency between them. In some embodiments, the handling commands include the handling direction of the wafer handling box, the handling priority order, etc., but are not limited thereto.

[0035] After receiving a handling command from communication devices 150_1, 150_2, and 150_3, the handling devices 162_1, 162_2, and 162_3 transmit the execution result of the handling command back to the material control system 120 through the communication devices 150_1, 150_2, and 150_3. In some embodiments, the execution result includes information such as the position, status, and handling priority of the wafer handling box, but is not limited thereto.

[0036] Specifically, such as Figure 1As shown, each of the communication devices 150_1, 150_2, 150_3 has similar structure and function. Without loss of generality, taking the communication device 150_1 as an example, the communication device 150_1 includes a first communication port 150_1A1 and a second communication port 150_1A2. The first communication port 150_1A1 is configured to receive the handling command sent by the reply material control system 120. The second communication port 150_1A2 is configured to transmit the received handling command to the corresponding handling device 162_1 in the automated handling area 160A, and receive the execution result of the handling command issued by the handling device 162_1. The execution result of the handling command is received by the second communication port 150_1A2 and then transmitted to the material control system 120 by the first communication port 150_1A1. The communication devices 150_2, 150_3 have the same function as the communication device 150_1, and thus will not be described again.

[0037] In some embodiments, the first communication port can be connected to the material control system in multiple communication modes, such as wireless network mode such as WiFi or Bluetooth, or wired network mode such as local area network, and the present disclosure is not limited thereto. In some embodiments, the second communication port can be connected to the corresponding handling device in multiple communication modes, such as wireless network mode such as WiFi or Bluetooth, or wired network mode such as local area network, and the present disclosure is not limited thereto. In some embodiments, the communication device can be provided in the corresponding handling device or outside the corresponding handling device.

[0038] In some embodiments, the handling devices 162_1, 162_2, 162_3 can be wafer handling or storage devices, such as material storage warehouses, conveyor system controllers, or suspended temporary storage shelves, or other devices with similar functions, and the present disclosure is not limited thereto.

[0039] The material control system 120 integrates the execution results of the handling devices 162_1, 162_2, 162_3 of the automated handling area 160A, 160B returned by the communication devices 150_1, 150_2, 150_3 into the state of the automated handling system 160A, 160B, and transmits the state of the automated handling area 160A, 160B to the execution system 130.

[0040] The execution system 130 receives the state of the automated transport zone partition area 160A, 160B transmitted by the material control system 120, and transmits the state of the automated transport zone partition area 160A, 160B to the control system 140. The control system 140 analyzes the advantages and disadvantages of the current operation efficiency of each zone according to the state of the automated transport zone partition area 160A, 160B, and sends a state adjustment command to the communication device 150_1, 150_2, 150_3. In some embodiments, the execution system 130 and the control system 140 can be executed in hardware or software, for example, by a computer, or by a computer program to enable the computer to perform the above functions, but the present disclosure is not limited thereto.

[0041] The communication device 150_1, 150_2, 150_3 generates a second transport command according to the state adjustment command received from the control system 140 and the transport command transmitted by the material control system 120, and outputs the second transport command to the corresponding transport device 162_1, 162_2, 162_3, to change the transport state of the wafer in the automated transport zone partition area 160A, 160B.

[0042] The state adjustment command issued by the control system 140 can be used to fine-tune the transport device in the automated transport zone partition area 160A, 160B when the material control system 120 issues a transport command to the communication device 150_1, 150_2, 150_3, to achieve timely control changes of the wafer transport box in the automated transport system.

[0043] Please refer to Figure 1 , each of the communication device 150_1, 150_2, 150_3 further comprises a communication device. Without loss of generality, taking the communication device 150_1 as an example, the communication device comprises a communication element 150_1C1 and a logic element 150_1C2.

[0044] The communication element 150_1C1 is used to connect with the control system 140 to receive the state adjustment command issued by the control system 140.

[0045] In some embodiments, the communication element can be connected with the control system in various communication modes, such as wireless network mode such as WiFi or Bluetooth, or wired network mode such as local area network, but the present disclosure is not limited thereto.

[0046] The logic element 150_1C2 is used to store all the handling commands issued by the communication device 150_1 to the handling device 162_1. When the state adjustment command issued by the control system 140_1 triggers the logic element 150_1C2 via the communication element 150_1C1, the logic element 150_1C2 generates a second handling command according to the handling command received by the communication device 150_1 and the state adjustment command of the control system 140. The second communication port 150_1A2 transmits the second handling command to the corresponding handling device 162_1 in the automated handling area 160A, and the handling device 162_1 executes the second handling command. The handling device 162_1 sends the execution result of the second handling command to the communication device 150_1, which is received by the second communication port 150_1A2 of the communication device 150_1 and then transmitted to the material management system 120 by the first communication port 150_1A1 of the communication device 150_1.

[0047] In some embodiments, the logic element 150_1C2 can be a microprocessor with a storage device, or a device with similar functions, and the present disclosure is not limited thereto. The functions stored in the logic element 150_1C2 can be updated by network connection or hardware abstraction.

[0048] Therefore, by using the wafer handling system 100 described above, the state of each wafer handling box can be effectively controlled, for example, the wafer handling box 170_1 about to enter the automated handling area 160A, or the wafer handling box 170_2 located in the automated handling area 160A, about to pass through the handling device 162_2, and about to pass through the automated handling area 160B to enter the automated handling system device 180.

[0049] When the automated handling system device 180 in the wafer handling system as shown in Figure 1 needs new wafers for processing, the automated handling system device 180 will issue a demand to the manufacturing execution system 110. When the manufacturing execution system 110 receives the demand issued by the automated handling system device 180, it will change the handling state of the wafer handling box in the wafer handling system 100 according to the flowchart as shown in Figure 2 .

[0050] Please refer to Figure 1 , Figure 2 for more information. The wafer handling method includes the following steps.

[0051] First, the manufacturing execution system 110 issues a handling task to the material management system 120.

[0052] The material control system 120 issues a carrying command to each of the plurality of carrying devices 162_1, 162_2, 162_3 in the corresponding sub-area 160A, 160B of the automated carrying area through the plurality of communication devices 150_1, 150_2, 150_3.

[0053] The plurality of carrying devices 162_1, 162_2, 162_3 returns the execution result of the carrying command to the material control system 120 through the plurality of communication devices 150_1, 150_2, 150_3.

[0054] The material control system 120 integrates the execution result into the state of the sub-area 160A, 160B of the automated carrying area, and transmits the state of the sub-area 160A, 160B of the automated carrying area to the execution system 130.

[0055] The execution system 130 transmits the state of the sub-area 160A, 160B of the automated carrying area to the control system 140, and the control system 140 sends a state adjustment command to the plurality of communication devices 150_1, 150_2, 150_3 according to the state of the sub-area 160A, 160B of the automated carrying area.

[0056] The plurality of communication devices 150_1, 150_2, 150_3 generates a second carrying command according to the received state adjustment command and the carrying command, and outputs the second carrying command to the carrying device 162_1, 162_2, 162_3 to change the carrying state of the wafer in the sub-area 160A, 160B of the automated carrying area.

[0057] Please refer to Figure 2 In step 202, the automated carrying system device 180 sends a demand to the manufacturing execution system 110, requesting to increase the wafer carrying box input into the automated carrying system device 180. Specifically, the wafer carrying box has different carrying priority during the carrying process, and if the carrying priority is too low, it may be stopped at a certain place in the carrying system and cannot continue to move forward, so that the downstream automated carrying system device 180 cannot perform subsequent processing on the wafer in the wafer carrying box. Therefore, the automated carrying system device 180 can also make an emergency request to the execution system 130, and specify a specific wafer carrying box as a wafer carrying box with priority carrying right.

[0058] In some embodiments, the second carrying command is to change the carrying state of the wafer in the first carrying device of the plurality of carrying devices 162_1, 162_2, 162_3. Without loss of generality, the following first carrying device is taken as an example. Figure 1

[0059] ​If the demand from the automated handling system device 180 is to change the handling state of a single FOUP, step 204 is performed. If the demand from the automated handling system device 180 is to change the handling state of a group of FOUPs in a certain automated processing system or in a certain area, step 220 is performed. The change of the handling state includes, but is not limited to, increasing the handling priority, changing the handling route, etc.

[0060] In step 206, it is checked whether the wafer is being operated in the first handling device 162_1. Specifically, the control system 140 checks the status of the automated handling area 160A, 160B to determine whether the wafer in a certain FOUP is being operated in a certain handling device.

[0061] If the wafer is not being operated in the first handling device 162_1 but is queued in the queue for execution, step 210 is performed. If the wafer is being operated in the first handling device 162_1, step 208 is performed.

[0062] In step 210, if the wafer is not being operated in the first handling device 162_1 but is queued in the queue for execution, the first handling device 162_1 directly adjusts the handling state of the wafer in the queue according to the second handling command. Specifically, the first handling device 162_1 increases the handling priority of the wafer according to the second handling command so that the state or the handling priority of the wafer in the queue in the first handling device 162_1 is changed. Then, step 218 is performed.

[0063] In step 208, if the wafer is being operated in the first handling device 162_1, the first handling device 162_1 stops the current operation according to the second handling command.

[0064] In step 208, if the first handling device stops the operation according to the second handling command, step 212 is performed. The material control system 120 sends a third handling command, and the first communication device 150_1 corresponding to the first handling device 162_1 in the plurality of communication devices transmits the third handling command to the first handling device 162_1 so that the first handling device 162_1 adjusts the handling state of the wafer according to the third handling command. Specifically, the first handling device 162_1 stops the operation at an appropriate time point and adjusts the state or the handling priority of the wafer according to the third handling command.

[0065] In step 208, if the first handling device 162_1 cannot stop the operation according to the second handling command, step 214 is performed, and the first handling device 162_1 continues to complete the operation.

[0066] If the first communication device 150_1 fails to transmit the third handling command to the first handling device 162_1, step 212 is followed by step 216. In step 216, the first communication device 150_1 transmits the error status of the first handling device 162_1 to the material handling system 120. The material handling system 120 waits for a first time interval and then sends the third handling command again to the first communication device 150_1 for transmission to the first handling device 162_1 to adjust the handling priority of the wafer. Specifically, when the first communication device 150_1 fails to transmit the third handling command to the first handling device 162_1, one possible scenario is that the first handling device 162_1 is in a busy state and thus cannot receive and process the third handling command. Therefore, by waiting for the first time interval, the first handling device 162_1 can be allowed to return to a normal state to receive and process the third handling command.

[0067] After step 216, step 234 is entered to complete the request.

[0068] After step 214, or after the first communication device 150_1 transmits the third handling command to the first handling device 162_1 in step 212, step 218 is entered.

[0069] In step 218, the control system 140 determines whether to change the handling state of the wafer for the plurality of handling devices, such as the handling device 162_3, of the second automated handling bay 160B through which the wafer will subsequently pass, based on the state of the first automated handling bay 160A.

[0070] If the handling state of the wafer for the plurality of handling devices of the second automated handling bay 160B is to be changed, step 232 is entered.

[0071] In step 232, the control system 140 sends a second state adjustment command to the plurality of communication devices, such as the communication device 150_3, corresponding to the plurality of handling devices, such as the handling device 162_3, of the second automated handling bay 160B to change the handling state of the wafer when the wafer is in the second automated handling bay 160B. Specifically, the communication device 150_3 stores the second state adjustment command in the logic element 150_3C2 and combines the second state adjustment command with the handling command sent by the material handling system 120 to become a new handling command, which is transmitted to the handling device 162_3 to increase the handling priority of the wafer when the wafer passes through the handling device 162_3 to speed up the wafer passing through the handling device 162_3.

[0072] After step 232, step 234 is entered to complete the request.

[0073] If the second handling command does not require a change in the handling status of the plurality of wafers in the second automated handling section zone 160B, then the process proceeds to step 234, where the request is completed.

[0074] In some embodiments, the second handling command is a change in the handling status of a plurality of wafers in the plurality of handling devices 162_1, 162_2, 162_3. Without loss of generality, the following first handling device is taken as the handling device 162_1, 162_2 in the plurality of handling devices 162_1, 162_2. Figure 1

[0075] If the request from the automated handling system device 180 is for a change in the handling status of a plurality or regional group of wafer pods in an automated processing system (e.g., the automated handling section zone 160A), then step 220 is performed.

[0076] In step 222, it is determined whether the handling status of all wafers in the first plurality of handling devices 162_1, 162_2 is to be changed. Specifically, the control system 140 determines whether the handling priority of all wafers or a subset of wafers in the handling devices 162_1, 162_2 is to be changed.

[0077] If yes, then step 224 is performed to change the handling priority of each of the plurality of wafers, and the handling status of all wafers in the first plurality of handling devices 162_1, 162_2 is changed. Specifically, the handling priority of all wafers in the first plurality of handling devices 162_1, 162_2 can be changed, such as by increasing the handling priority of a subset of wafers, increasing the handling priority of all wafers, or decreasing the handling priority of all or a subset of wafers.

[0078] If no, then step 226 is performed to modify the handling path of the plurality of wafers, and the handling path of a specific subset of wafers in the first plurality of handling devices 162_1, 162_2 is changed according to the appended wafer list by the control system 140. In some embodiments, the first subset of wafers is, for example, the wafers in the handling device 162_1 or the wafers in the handling device 162_2. In other embodiments, the first subset of wafers can be, for example, wafers that satisfy certain conditions, such as all wafers that have a waiting time exceeding a certain threshold, or wafers that include a low-efficiency region in the handling path, but the present application is not limited thereto.

[0079] Since a handling device often has multiple entrances and exits for the convenience of transporting wafers, the handling path can be changed to use a higher-efficiency entrance or exit in the same handling device to avoid a lower-efficiency entrance or exit in the same handling device.

[0080] ​In step 226, if a specific category of wafer group is specified, then proceed to step 228 to change the transport path of the specific category of wafers in the transport devices 162_1 and 162_2 that meet the conditions.

[0081] After step 228, proceed to step 234 to complete the request.

[0082] If no in step 226, proceed to step 230 to change the transport path of the existing wafers in the first plurality of transport devices 162_1 and 162_2.

[0083] After step 224 or after step 230, proceed to step 218.

[0084] As described above, in step 218, the control system 140 determines whether to change the handling status of multiple handling devices (e.g., handling device 162_3) of the second automated handling system 162, which the wafer will subsequently pass through, based on the state of the automated handling zone 160. For specific operation methods, please refer to the aforementioned descriptions of steps 218 and 232, which will not be repeated here.

[0085] Therefore, according to Figure 2 The provided wafer handling method can change the handling state of wafers in a specific handling device, or change the handling path or handling priority order of wafers in a group of specific handling devices, so as to improve the overall handling efficiency.

[0086] In other embodiments, the wafer handling system may have multiple automated handling systems. When a handling device in one of the automated handling systems malfunctions or malfunctions, it will affect the handling efficiency of that automated handling system. Therefore, a method similar to the aforementioned wafer handling method can be used to change the handling state of the automated handling system and determine whether the handling state of wafers in adjacent automated handling systems needs to be adjusted.

[0087] Figure 3 This is a schematic diagram of a wafer handling system according to an embodiment of the present invention. Figure 4 This is a flowchart of a wafer handling method according to an embodiment of the present invention.

[0088] Please refer to Figure 3 . Figure 3 The wafer handling system 300 shown is Figure 1 The wafer handling system 100 shown is similar, therefore only the differences will be described. The wafer handling system includes four communication device groups 150A, 150B, 150C, and 150D. The wafer handling system includes four automated handling systems 310A, 310B, 310C, and 310C.

[0089] Each communication device group 150A, 150B, 150C, and 150D is connected to the control system 140. Each communication device group 150A, 150B, 150C, and 150D also corresponds one-to-one with the automated material handling systems 310A, 310B, 310C, and 310C, respectively; for example, communication device group 150A is connected to automated material handling system 310A. Each communication device group includes multiple similar... Figure 1 The communication device 150_1 shown is a communication device (not shown). These communication devices correspond to the conveying devices in the automated conveying system. Please refer to [reference needed] for details. Figure 1 The explanation will not be repeated here.

[0090] Automated material handling system 310A includes multiple material handling devices, including a transport system controller (TSC) 312A and stockers (STKs) 314A1, 314A2, and 314A3 connected to the transport system controller 312A. Material handling system 310B includes multiple material handling devices, including a transport system controller 312B and stockers 314B1, 314B2, and 314B3 connected to the transport system controller 312B. Material handling system 310C includes multiple material handling devices, including a transport system controller 312C and stockers 314C1 and 314C2 connected to the transport system controller 312C. Material handling system 310D includes multiple material handling devices, including a transport system controller 312D and stockers 314D1 and 314D2 connected to the transport system controller 312D.

[0091] Conveyor system controller 312A is connected to conveyor system controllers 312B and 312C, and conveyor system controller 312D is connected to conveyor system controllers 312B and 312C. The conveyor system controllers are used to move wafers, such as wafer transport boxes, from other conveyor system controllers to connected material storage bins. For example, conveyor system controller 312A moves wafer transport boxes from conveyor system controller 312A to material storage bins 314A1, 314A2, and 314A3. The conveyor system controllers can also move wafers from material storage bins to other adjacent material storage bins. For example, conveyor system controller 312A moves wafers from material storage bin 314A1 to material storage bins 314A2 or 314A3. Conveyor system controllers can also move wafers to other adjacent conveyor system controllers. For example, conveyor system controller 312A can move wafers to adjacent conveyor system controllers 312B or 312C.

[0092] In some embodiments, the transport system controller 312A, 312B, 312C, 312D can be an overhead hoist transfer (OHT), or a handling device with similar functions, and the present disclosure is not limited thereto.

[0093] Reference is made to the drawings, which are to be read in conjunction with the following detailed description. Figure 3 、 Figure 4 The wafer transport method comprises the following steps.

[0094] The manufacturing execution system 110 issues a transport task to the material control system 120.

[0095] The material control system 120 issues a transport command to each of the plurality of automated transport systems 310A, 310B, 310C, 310D through the plurality of communication device groups 150A, 150B, 150C, 150D, respectively. Each of the plurality of communication device groups 150A, 150B, 150C, 150D corresponds to each of the plurality of automated transport systems 310A, 310B, 310C, 310D, respectively.

[0096] The plurality of automated transport systems 310A, 310B, 310C, 310D transmit the execution results of the transport command to the material control system 120 through the corresponding communication device groups 150A, 150B, 150C, 150D.

[0097] The material control system 120 integrates the execution results into the status of each of the plurality of automated transport systems 310A, 310B, 310C, 310D, respectively, and transmits the status of each of the plurality of automated transport systems 310A, 310B, 310C, 310D to the execution system 130.

[0098] The execution system 130 transmits the status of each of the plurality of automated transport systems 310A, 310B, 310C, 310D to the control system 140, and the control system 140 sends a status adjustment command to the communication device groups 150A, 150B, 150C, 150D according to the status of each of the plurality of automated transport systems 310A, 310B, 310C, 310D.

[0099] The communication device groups 150A, 150B, 150C, 150D output a second transport command to the transport device in the corresponding automated transport system 310A, 310B, 310C, 310D according to the received status adjustment command and transport command, so as to change the transport status of the wafer in the automated transport system 310A, 310B, 310C, 310D.

[0100] In step 402, when the status of the automated material handling system 310A, 310B, 310C, 310D is that a first handling device in the automated material handling system 310A has an error, the control system 140 issues a second status adjustment command to the automated material handling system 310A. The automated material handling system 310A is also referred to as a fault zone because it has a handling device with an error.

[0101] In step 402, when the first handling device is the material storage 314A1, step 404 is performed, and step 406 is performed.

[0102] In step 406, it is determined whether the wafers in the first handling device 314A1 need to be diverted. Specifically, when the material storage 314A1 has an error, or when the material storage 314A1 has a more serious abnormal condition that affects other adjacent handling devices, such as the conveyor system controller 312A, it is determined whether the error condition of the material storage can be handled by other exits of the material storage, that is, the affected area is defined, and the error condition is improved by diverting the wafers. Generally, whether the wafers in the material storage 314A1 need to be diverted can be determined according to the frequency of the material storage 314A1, the handling efficiency, the total number of wafer handling vehicles, and the number of empty wafer handling vehicles. Therefore, step 406 determines whether the wafers in the material storage 314A1 can be handled by other exits of the first handling device, that is, the wafers in the material storage 314A1 are diverted.

[0103] If the wafers in the first handling device 314A1 need to be diverted, step 410 is performed to divert the wafers in the first handling device 314A, and step 414 is performed to determine whether the wafers in the automated material handling system 310B, 310C downstream of the automated material handling system 310A need to be slowed down to the automated material handling system 310A.

[0104] In step 406, if the wafers in the first handling device 314A do not need to be diverted, step 408 is performed to determine whether the conveyor system controller 312A connected to the first handling device 314A is affected. Specifically, when the first handling device 314A, that is, the material storage 314A1, has an error, the wafers stored in the material storage 314A1 can need to be handled by the conveyor system controller 312A to other material storages, such as the material storages 314A2 or 314A3. Therefore, it is determined in step 408 whether the adjacent conveyor system controller 312A is affected.

[0105] If the transport system controller 312A connected to the first handling device 314A1 will be affected, step 414 is performed to check if the wafers in the automated handling system 310B, 310C downstream of the automated handling system 310A have to be decelerated towards the automated handling system 310A.

[0106] If the transport system controller 312A connected to the first handling device 314A1 will be affected, step 414 is performed to check if the wafers in the automated handling system 310B, 310C downstream of the automated handling system 310A have to be decelerated towards the automated handling system 310A.

[0107] If the transport system controller 312A connected to the first handling device 314A1 will be affected, step 414 is performed to check if the wafers in the automated handling system 310B, 310C downstream of the automated handling system 310A have to be decelerated towards the automated handling system 310A. The automated handling systems 310B, 310C downstream of the automated handling system 310A can also be referred to as the peripheral area of the automated handling system 310A. Specifically, since the transport system controller 312A is connected to the transport system controllers 312B, 312C in the adjacent automated handling systems 310B, 310C, if the transport system controller 310A will be affected, it is possible that the transport system controllers 312B, 312C in the adjacent automated handling systems 310B, 310C will also be affected. Therefore, it is necessary to check if the handling process of the wafers in the adjacent automated handling systems 310B, 310C towards the automated handling system 310A has to be decelerated to reduce the burden on the automated handling system 310A and avoid the lower efficiency of the automated handling system 310A. Generally, the total number of vehicles in the peripheral area, the total number of vehicles towards the failure area, i.e. the automated handling system 310A, and the improvement ratio can be used to determine if the handling process of the wafers in the adjacent automated handling systems 310B, 310C towards the automated handling system 310A has to be decelerated.

[0108] If the wafers in the automated handling systems 310B, 310C have to be decelerated towards the automated handling system 310A, a third state adjustment command is sent by the control system 140 to the automated handling systems 310B, 310C to decelerate the wafers in the automated handling systems 310B, 310C towards the automated handling system 310A.

[0109] If the wafers in the automated handling systems 310B, 310C do not have to be decelerated towards the automated handling system 310A, step 440 is performed to complete the request.

[0110] After the wafers in the automated handling systems 310B, 310C are decelerated towards the automated handling system 310A, step 434 is performed.

[0111] In step 434, the control system 140 reviews the status in the wafer handling system 300, including the total number of vehicles, the total number of vehicles going to the abnormal area, the expected improvement ratio, and sends the information to step 436.

[0112] In step 436, according to the information obtained in step 434, it is determined whether the wafer in the automated handling system 310D downstream of the automated handling systems 310B, 310C needs to be decelerated to the automated handling systems 310B, 310C. The automated handling system 310D downstream of the automated handling systems 310B, 310C can also be referred to as the remote area of the automated handling system 310A.

[0113] If the wafer in the third automated handling system needs to be decelerated, step 438 is performed, and the control system 140 sends an additional status adjustment command (fourth status adjustment command) to the automated handling system 310D to decelerate the wafer in the automated handling system 310D, delay the arrival time at the automated handling system 310A, or detour to avoid the automated handling system 310A to reduce the burden of the automated handling system 310A.

[0114] After step 438, step 440 is performed to complete the request.

[0115] On the other hand, in step 402, when the first handling device is the transport system controller 312A, step 416 is performed, and step 418 is performed.

[0116] In step 418, it is reviewed whether there will be an impact on the adjacent material storage bins 314A, 314B, 314C. Specifically, since the transport system controller 312A controls the transport status of the adjacent material storage bins 314A, 314B, 314C, it is necessary to evaluate whether there will be an impact on the adjacent material storage bins 314A, 314B, 314C.

[0117] In step 418, if there is no impact on the adjacent material storage bins 314A, 314B, 314C, step 420 is performed to review whether there is an impact on the transport system controllers 312B, 312C in the automated handling systems 310B, 310C downstream of the automated handling system 310A.

[0118] If the change to the transport system controller 312B, 312C in the automated material handling system 310B, 310C downstream of the automated material handling system 310A will not affect the transport system controller 312B, 312C in the automated material handling system 310B, 310C downstream of the automated material handling system 310A, step 420 is performed, no change is made to the transport system controller 312B, 312C in the automated material handling system 310B, 310C downstream of the automated material handling system 310A, and step 428 is performed to complete the request.

[0119] If the change to the transport system controller 312B, 312C in the automated material handling system 310B, 310C downstream of the automated material handling system 310A will affect the adjacent material storage 314A, 314B, 314C, step 424 is performed.

[0120] In step 424, it is determined whether the FOUPs in the adjacent material storage 314A, 314B, 314C need to be turned. If the FOUPs in the adjacent material storage 314A, 314B, 314C need to be turned, step 430 is performed to turn the FOUPs in the material storage 314A, 314B, 314C, and step 432 is performed. If the FOUPs in the adjacent material storage 314A, 314B, 314C do not need to be turned, step 432 is performed directly.

[0121] In step 432, if the change to the transport system controller 312B, 312C in the automated material handling system 310B, 310C downstream of the automated material handling system 310A will affect the transport system controller 312B, 312C in the automated material handling system 310B, 310C downstream of the automated material handling system 310A, step 414 is performed to determine whether the FOUPs in the automated material handling system 310B, 310C downstream of the automated material handling system 310A are slowed down. The details of step 414 have been described previously and will not be repeated here.

[0122] In step 432, if the change to the transport system controller 312B, 312C in the automated material handling system 310B, 310C downstream of the automated material handling system 310A will not affect the transport system controller 312B, 312C in the automated material handling system 310B, 310C downstream of the automated material handling system 310A, step 436 is performed to determine whether the FOUPs in the automated material handling system 310D downstream of the automated material handling system 310B, 310C are slowed down. The details of step 436 have been described previously and will not be repeated here.

[0123] In some embodiments, for a transport command that needs to be urgently reached or bypass a failure area, which is passable but has poor transport efficiency during repair, the system 130 can connect the normal operation of the transport equipment to plan a special route to bypass the failure area.

[0124] Therefore, according to Figure 4The wafer conveying method provided can improve the conveying efficiency when the conveying device in the automatic conveying system fails.

[0125] In summary, the wafer conveying method and the wafer conveying system can monitor the destination transportation status in real time, reduce the transportation capacity in time when the destination receiving end or the route exceeds the transportation capacity, control the number and speed of vehicles in the region by regional division, and disperse the vehicles to other demand areas to improve the overall transportation efficiency.

Claims

1. A wafer handling method, comprising: a manufacturing execution system issuing a handling task to a material handling system; the material handling system issuing a handling command to a plurality of handling devices in an automated handling system through a plurality of communication devices respectively; the plurality of handling devices returning a result of execution of the handling command to the material handling system through the plurality of communication devices respectively; the material handling system integrating the result of execution into a state of the automated handling system and transmitting the state of the automated handling system to the manufacturing execution system; the manufacturing execution system issuing a correction command to the material handling system to correct the handling command and sending a state adjustment command to the plurality of communication devices after analyzing real-time operation efficiency of each zone; the plurality of communication devices generating a second handling command according to the state adjustment command and the handling command and outputting the second handling command to the plurality of handling devices to change a handling state of a wafer in the automated handling system.

2. The method of claim 1, wherein the second handling command is to change the handling state of the wafer in a first handling device of the plurality of handling devices.

3. The method of claim 2, further comprising: checking whether the wafer is being operated in the first handling device, wherein: if the wafer is not being operated in the first handling device but is located in a command queue waiting for execution, the first handling device changes a handling command of the wafer in the command queue according to the second handling command; if the wafer is being operated in the first handling device, the first handling device stops the operation according to the second handling command and a third handling command is sent by the material handling system to adjust the handling state of the wafer according to the third handling command.

4. The method of claim 3, wherein if the first handling device cannot stop the operation according to the second handling command, the first handling device continues to complete the operation.

5. The method of claim 3, wherein if the first communication device cannot transmit the third handling command to the first handling device, the first communication device returns an error state of the first handling device to the material handling system, and the material handling system sends the third handling command again to the first communication device to adjust the handling state of the wafer after waiting for a first time interval.

6. The method of claim 3, further comprising: the control system determining whether to change the handling state of the wafer for a plurality of handling devices of a second automated handling system to be passed by the wafer subsequently according to the state of the automated handling system, wherein changing the handling state of the wafer for the plurality of handling devices of the second automated handling system comprises: The control system sends a second state adjustment command to a plurality of communication devices corresponding to the plurality of handling devices of the second automated handling system, so that the wafer located in the second automated handling system performs a pause or changes the priority.

7. The method of claim 3, wherein the second handling command is to change a handling path of the wafer in a first plurality of handling devices of the plurality of handling devices.

8. The method of claim 7, further comprising: checking whether to change the handling path of all wafers in the first plurality of handling devices, wherein: if yes, changing the handling path of the all wafers in the first plurality of handling devices, if no, changing the handling path of a specific wafer in the first plurality of handling devices.

9. The method of claim 6, wherein the method further comprises: the control system determines whether to make a reservation in advance for the next handling device of the wafer according to the state of the automated handling system to continue the change of wafer handling state or path.

10. A wafer handling area control method, comprising: a manufacturing execution system issuing a handling task to a material control system; the material control system issuing a handling command to a plurality of automated handling systems through a plurality of communication device groups, each of the plurality of communication device groups corresponding to each of the plurality of automated handling systems; the plurality of automated handling systems returning the execution result of the handling command to the material control system through the corresponding communication device group; the material control system integrating the execution result into the state of each of the plurality of automated handling systems and transmitting the state of each of the plurality of automated handling systems to the manufacturing execution system; the manufacturing execution system transmitting the state of each of the plurality of automated handling systems to a control system, and the control system sending a current running state returned by the material control system to the manufacturing execution system to the communication device group according to the state of each of the plurality of automated handling systems; the manufacturing execution system issuing a handling turning or pausing state adjustment command to the control system after analyzing the real-time operation efficiency of each area; the communication device group outputs a second handling command to the handling device in the corresponding automated handling system according to the received state adjustment command and the original handling command, to turn or pause the handling of the wafer in the automated handling system in the area, and also reserves to send a subsequent adjustment command to the next receiving device of the wafer handling command.

11. The method of claim 10, wherein when the state of the automated handling system is that a first handling device in a first automated handling system of the plurality of automated handling systems fails, the control system sends a second state adjustment command to the first automated handling system to adjust the wafer handling in execution in the surrounding area.

12. The method of claim 11, wherein when the first handling device is a material storage bin, the method comprises: visiting whether the wafer in the first handling device needs to be diverted, if the wafer in the first handling device needs to be diverted, diverting the wafer in the first handling device and visiting whether the wafer in a second automated handling system downstream of the first automated handling system needs to be decelerated towards the first automated handling system, if the wafer in the first handling device does not need to be diverted, visiting whether a downstream conveyor system controller connected to the first handling device will be affected, and if the downstream conveyor system controller will be affected, decelerating the wafer in a second automated handling system downstream of the first handling device connected to the first handling device towards the first automated handling system.

13. The method of claim 12, wherein in the step of visiting whether the wafer in the second automated handling system downstream of the first automated handling system needs to be decelerated, if the wafer in the second automated handling system needs to be decelerated, sending a third state adjustment command by the control system to the second automated handling system to decelerate the wafer in the second automated handling system in a peripheral area to delay the wafer from entering the failure zone.

14. The method of claim 12, further comprising: after the step of decelerating the wafer in the second automated handling system towards the first automated handling system, visiting whether the wafer in a third automated handling system downstream of the second automated handling system needs to be decelerated towards the second automated handling system, if the wafer in the third automated handling system needs to be decelerated, sending a fourth state adjustment command by the control system to the third automated handling system to decelerate the wafer in the third automated handling system in a more peripheral area.

15. The method of claim 11, wherein when the first handling device is a conveyor system controller, the method comprises: visiting whether a neighboring material storage bin will be affected, and visiting whether a conveyor system controller in a second automated handling system downstream of the first automated handling system will be affected.

16. The method of claim 15, wherein, in the step of visiting whether the wafer in the neighboring material storage bin needs to be diverted, the method further comprises: if the wafer in the neighboring material storage bin needs to be diverted, diverting the wafer in the neighboring material storage bin in real time.

17. The method of claim 15, wherein, in the step of visiting whether a conveyor system controller in a second automated handling system downstream of the first automated handling system will be affected, the method further comprises: if a conveyor system controller in a second automated handling system downstream of the first automated handling system will be affected, reserving deceleration for the second automated handling system. If the wafer in the third material storage bin adjacent to the first automated handling system needs to be diverted without affecting the conveyor system controller in the second automated handling system downstream of the first automated handling system, it is also checked whether the wafer in the third automated handling system downstream of the second automated handling system needs to be decelerated or diverted.

18. The method of claim 17, wherein, In the step of checking whether the wafer in the second automated handling system downstream of the first automated handling system needs to be decelerated, the method further comprises: If the wafer in the second automated handling system downstream of the first automated handling system needs to be decelerated, the control system sends a third state adjustment command to the second automated handling system to decelerate or divert the wafer in the second automated handling system towards the first automated handling system.

19. The method of claim 17, wherein in the step of checking whether the wafer in the third automated handling system downstream of the second automated handling system needs to be decelerated or diverted, If the wafer in the third automated handling system downstream of the second automated handling system needs to be decelerated, the control system sends a fourth state adjustment command to the third automated handling system to decelerate or divert the wafer in the third automated handling system towards the second automated handling system.

20. A wafer handling system, comprising: a manufacturing execution system; a material control system; a plurality of communication devices; an automated handling system comprising a plurality of handling devices; an execution system; and a control system, wherein: the manufacturing execution system issues a handling task to the material control system, the material control system issues a handling command to the corresponding handling devices in the automated handling system through the plurality of communication devices, the handling devices return the execution results of the handling command to the material control system through the plurality of communication devices, the material control system integrates the execution results into the state of the automated handling system and transmits the state of the automated handling system to the execution system, the execution system analyzes the real-time operation efficiency of each zone and issues a correction command to the material control system to correct the handling command and sends a state adjustment command to the plurality of communication devices, the plurality of communication devices generate a second handling command according to the received state adjustment command and handling command and output the second handling command to the handling devices to change the handling state of the wafer in the automated handling system. ​ 21. The wafer handling system of claim 20, wherein each of the plurality of communication devices comprises: a first communication port configured to receive a reply to the handling command sent by the material control system, and a second communication port configured to transmit the handling command to the corresponding handling device in the automated handling system and receive the execution result of the handling device, the execution result of the handling command being transmitted by the first communication port to the material control system after being received by the second communication port.

22. The wafer handling system of claim 21, wherein each of the plurality of communication devices further comprises a communication device, the communication device comprising: a communication element configured to connect with the control system to receive the state adjustment command sent by the control system; a logic element configured to store all the handling commands sent by the handling device on the communication device, when the state adjustment command sent by the control system triggers the logic element through the communication element, the logic element generates the second handling command according to the handling command received by the communication device and the state adjustment command of the control system, the second communication port transmits the second handling command to the corresponding handling device in the automated handling system, and the execution result of the second handling command is transmitted by the first communication port to the material control system after being received by the second communication port.

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