High-speed and high-precision needling type die bonder and control method thereof

Abstract

The invention discloses a high-speed and high-precision needling type die bonder and a control method thereof, and belongs to the technical field of semiconductor packaging equipment, the high-speed and high-precision needling type die bonder comprises a first driving mechanism, the first driving mechanism is connected with a second driving mechanism, the first driving mechanism comprises a first voice coil motor and a first connecting structure, and the second driving mechanism comprises a second voice coil motor. The second voice coil motor is connected with the first needle head, the first needle head is connected with the second needle head through the second connecting structure, the second needle head is connected with the elastic fixing mechanism, and piezoelectric ceramics are arranged on the first needle head and the second needle head. According to the high-speed and high-precision needling type die bonder and the control method thereof, the first driving mechanism, the second driving mechanism, the first needle head and the second needle head are designed in a light weight mode, the efficiency bottleneck of a transmission mechanical structure is broken through, high-speed and high-precision collaborative operation is achieved through a path planning algorithm and a vibration suppression technology, and the working efficiency is improved. And the system response speed is improved by adopting an FPGA + PLC dual-controller architecture.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of semiconductor packaging equipment, in particular to a high-speed and high-precision needle-sticking die bonder and a control method thereof. BACKGROUND

[0002] The efficiency of a traditional single-head needle-sticking die bonder is limited by the low frequency (usually less than or equal to 100 Hz) of a voice coil motor on a needle-sticking head, and it is difficult to meet the high-yield demand of LED and IC chip packaging. The traditional multi-head swing arm type die bonder is limited by the swing arm reciprocating mode, and the single-head efficiency is low (less than 10 Hz), the coordination efficiency is low, the motion path is conflicted (limited by the motion acceleration of the motor, the larger the substrate is, about 12-inch substrate, the efficiency decreases by about 30%), the needle positioning error accumulates, and the like, which leads to that the actual efficiency does not reach the theoretical value. SUMMARY

[0003] The application aims to provide a high-speed and high-precision needle-sticking die bonder and a control method thereof, a first driving mechanism and a second driving mechanism are arranged, and a first needle and a second needle adopt lightweight design, the efficiency bottleneck of a transmission mechanical structure is broken through, a path planning algorithm and a vibration suppression technology are utilized to realize high-speed and high-precision coordinated operation, and a FPGA+PLC double-controller architecture is adopted to improve the response speed of a motion control system.

[0004] To achieve the above-mentioned purpose, the application provides a high-speed and high-precision needle-sticking die bonder and a control method thereof, which comprises a first driving mechanism, the first driving mechanism is connected with a second driving mechanism, the first driving mechanism comprises a first voice coil motor and a first connecting structure, the second driving mechanism comprises a second voice coil motor, the second voice coil motor is connected with a first needle, the first needle is connected with a second needle through a second connecting structure, the second needle is connected with an elastic fixing mechanism, and piezoelectric ceramics are arranged on the first needle and the second needle.

[0005] Preferably, an acceleration sensor is mounted on the first needle, the second connecting structure is a high-precision movable connecting rod mechanism, and the piezoelectric ceramics are electrically connected with a piezoelectric ceramic controller.

[0006] Preferably, the first needle and the second needle adopt lightweight carbon fiber materials.

[0007] Preferably, the first driving mechanism and the second driving mechanism are connected with a motion control system, the motion control system is a FPGA+PLC double-controller architecture, and a self-adaptive filter is embedded in the motion control system.

[0008] The application provides a control method of a high-speed and high-precision needle-sticking die bonder, which comprises the following steps:

[0009] S1, lay a UV film above the LED / IC device, and a motion control system controls the first voice coil motor to move the first needle and the second needle above the LED / IC device based on a time-optimal trajectory planning algorithm;

[0010] S2, start the second voice coil motor, the second voice coil motor drives the first needle and the second needle to move up and down alternately through the second connecting structure, a self-adaptive filter collects acceleration sensor data in real time, suppresses high-frequency mechanical vibration, and a motion control system offsets inertia impact in the start-stop stage of the second voice coil motor through a feedforward compensation algorithm;

[0011] S3, when the needle deviates, a piezoelectric ceramic controller controls the piezoelectric ceramic to fine-tune the second needle, and compensates for the positioning deviation caused by mechanical vibration.

[0012] Therefore, the high-speed and high-precision needle type die bonder and the control method thereof have the following beneficial effects:

[0013] (1) the first driving mechanism and the second driving mechanism and the first needle and the second needle are designed to be lightweight, the motion inertia is reduced, the double-head needle release mechanism is designed to be integrated, the pickup-release action cycle is shortened to within 5ms, and the transmission mechanical structure efficiency bottleneck is broken through;

[0014] (2) the path planning algorithm and the vibration suppression technology are used to suppress high-frequency mechanical vibration and realize high-speed and high-precision collaborative operation;

[0015] (3) the FPGA+PLC dual-controller architecture is adopted to improve the response speed of the motion control system, realize parallel operation of motion control and logic processing, and shorten the control cycle to 0.1ms;

[0016] (4) the piezoelectric ceramic and the piezoelectric ceramic controller are arranged to compensate for the positioning deviation caused by mechanical vibration and control the precision of the first needle and the second needle.

[0017] The technical solutions of the present application will be further described in detail below with the help of the drawings and examples. BRIEF DESCRIPTION OF DRAWINGS

[0018] Fig. 1 is a structure schematic view of a high-speed and high-precision needle type die bonder of the present application;

[0019] Fig. 2 is a structure schematic view of a first use process of a high-speed and high-precision needle type die bonder of the present application;

[0020] Fig. 3 is a structure schematic view of a second use process of a high-speed and high-precision needle type die bonder of the present application.

[0021] REFERENCE NUMERALS

[0022] 1. Second voice coil motor; 2. First needle; 3. Second connecting structure; 4. Second needle; 5. Elastic fixing mechanism; 6. Piezoelectric ceramic; 7. Piezoelectric ceramic controller; 8. UV film; 9. LED / IC device; 10. Accelerometer. Detailed Implementation

[0023] The technical solution of the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] Unless otherwise defined, the technical or scientific terms used in this invention shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0025] Example 1

[0026] like Figs. 1 to 3 As shown, the present invention provides a high-speed and high-precision needle-type die bonder and its control method, including a first driving mechanism connected to a second driving mechanism. The first driving mechanism includes a first voice coil motor and a first connecting structure. The first voice coil motor drives the second driving mechanism to move through the first connecting structure, thereby controlling the X-axis movement of the first needle 2 and the second needle 4.

[0027] The second drive mechanism includes a second voice coil motor 1, which is connected to the first needle 2. The second voice coil motor 1 can drive the second needle 4 to move in the Z direction. The first needle 2 is connected to the second needle 4 through a second connecting structure 3, which is a high-precision movable linkage mechanism. The second needle 4 is connected to an elastic fixing mechanism 5. The first needle 2 and the second needle 4 can achieve alternating reciprocating motion through the elastic fixing mechanism 5, which elastically fixes the second needle 4. The integrated design of the dual-head needle release mechanism can shorten the pick-up-release cycle to less than 5ms.

[0028] The piezoelectric ceramics 6 are arranged on the first needle 2 and the second needle 4, and the piezoelectric ceramics 6 are electrically connected with a piezoelectric ceramic controller 7, the piezoelectric ceramic controller 7 can control the piezoelectric ceramics 6 to reversely compensate the first needle 2 and the second needle 4 to ensure the accuracy of the first needle 2 and the second needle 4.

[0029] The acceleration sensor 10 is arranged on the first needle 2, the acceleration sensor 10 can detect the acceleration of the first needle 2 during die bonding, and the acceleration feedback data during die bonding is compared with the die bonding result, and the acceleration feedforward compensation is performed on the second voice coil motor 1 during the next die bonding.

[0030] The first needle 2 and the second needle 4 are made of lightweight carbon fiber material, which can reduce the motion inertia and improve the die bonding efficiency.

[0031] The first driving mechanism and the second driving mechanism are connected with a motion control system, the motion control system is a FPGA+PLC double-controller architecture, parallel operation of motion control and logic processing is realized, the response speed of the motion control system is improved, and the control period is shortened to 0.1 ms.

[0032] The application provides a control method of a high-speed and high-precision needle type die bonder.

[0033] S1, a UV film 8 is laid above an LED / IC device 9, a motion control system controls the first voice coil motor to move the first needle 2 and the second needle 4 above the LED / IC device 9 based on a time-optimal trajectory planning algorithm;

[0034] S2, the second voice coil motor 1 is started, the second voice coil motor 1 drives the first needle 2 and the second needle 4 to move up and down alternately through the second connecting structure 3, an adaptive filter collects acceleration sensor 10 data in real time to suppress high-frequency mechanical vibration, and the motion control system offsets the inertia impact of the second voice coil motor 1 in the start-stop stage through a feedforward compensation algorithm.

[0035] S3, when the needle deviates, the piezoelectric ceramic controller 7 controls the piezoelectric ceramics 6 to fine-tune the second needle 4 to compensate for the positioning deviation caused by mechanical vibration.

[0036] The application provides a high-speed and high-precision needle type die bonder, and the efficiency is improved: the die bonding speed reaches 200 Hz; the accuracy is guaranteed: the mounting position error is less than or equal to ± 15 microns; and the compatibility is suitable for various packaging scenes of LED, Mini LED, IC chip and the like.

[0037] The experimental data show that the double-head cooperation efficiency is stable at 200 Hz, and the yield is greater than or equal to 99.995%, and after parameter optimization, the yield is expected to be greater than or equal to 99.999% when the subsequent die bonding quantity is large, as shown in Table 1:

[0038] Table 1 Die bonding data

[0039]

[0040] The needle type die bonding field using the die bonding head reduces the cost of water, electricity and gas by 50% compared with the traditional needle type die bonding machine, and reduces the cost of water, electricity and gas by more than 70% compared with the traditional swing arm type die bonding field, and reduces the energy consumption of water, electricity and gas by more than 60%, and under the condition of the same production capacity, the investment cost of the die bonding machine of the production plant is reduced by more than 30%, and the number of operating personnel is reduced by 40%.

[0041] Therefore, the high-speed and high-precision needle type die bonding machine and the control method thereof are adopted, the first driving mechanism and the second driving mechanism and the first needle head and the second needle head are designed to be lightweight, the transmission mechanical structure efficiency bottleneck is broken through, the path planning algorithm and the vibration suppression technology are used, the high-speed and high-precision cooperation operation is realized, and the FPGA+PLC double-controller architecture is adopted to improve the response speed of the motion control system.

[0042] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application but not to limit it, although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that: the technical solutions of the present application can still be modified or replaced by equivalents, and these modifications or equivalent replacements cannot make the modified technical solutions deviate from the spirit and scope of the technical solutions of the present application.

Claims

1. A high-speed, high-precision needle-punch die bonder, characterized in that: It includes a first driving mechanism, which is connected to a second driving mechanism. The first driving mechanism includes a first voice coil motor and a first connecting structure. The second driving mechanism includes a second voice coil motor, which is connected to a first needle. The first needle is connected to the second needle through the second connecting structure. The second needle is connected to an elastic fixing mechanism. Both the first and second needles are provided with piezoelectric ceramics.

2. The high-speed, high-precision needle-type die bonder according to claim 1, characterized in that: An acceleration sensor is installed on the first needle tip, and the second connection structure is a high-precision movable linkage mechanism. The piezoelectric ceramic is electrically connected to the piezoelectric ceramic controller.

3. The high-speed, high-precision needle-punch die bonder according to claim 1, characterized in that: The first and second needles are made of lightweight carbon fiber material.

4. The high-speed, high-precision needle-punch die bonder according to claim 1, characterized in that: The first and second drive mechanisms are connected to the motion control system, which is an FPGA+PLC dual controller architecture with an embedded adaptive filter.

5. A control method for a high-speed, high-precision needle-type die bonder according to any one of claims 1-4, characterized in that: Includes the following steps: S1. A UV film is laid on top of the LED / IC device. The motion control system controls the first voice coil motor to move the first and second needles above the LED / IC device based on the time-optimal trajectory planning algorithm. S2. Start the second voice coil motor. The second voice coil motor drives the first and second needles to move up and down alternately through the second connection structure. The adaptive filter collects acceleration sensor data in real time to suppress high-frequency mechanical vibration. The motion control system uses a feedforward compensation algorithm to offset the inertial impact during the start-up and stop phase of the second voice coil motor. S3. When the needle tip deviates, the piezoelectric ceramic controller controls the piezoelectric ceramic to fine-tune the second needle tip to compensate for the positioning deviation caused by mechanical vibration.

Images