Film tearing module of laser de-bonding and film tearing all-in-one machine

Abstract

The invention provides a film tearing module of a laser de-bonding and film tearing all-in-one machine, and belongs to the technical field of wafer film tearing, the film tearing module comprises an assembly plate used for installing the module, one side of the assembly plate is in sliding connection with an adhesive tape unwinding station through an adhesive tape carrying module, and one side of the assembly plate is further provided with a film removing and transferring module; an adhesive tape winding station is arranged on one side of the demolding transfer module, and the two ends of the film tearing adhesive tape are connected with the adhesive tape unwinding station and the adhesive tape winding station correspondingly; tension is supplemented by adjusting the winding speed of the adhesive tape winding station, and incomplete stripping of the protective film or residual film residues caused by insufficient tension is avoided. A lifting structure is further arranged on one side of the film removing and transferring module and comprises a first servo drive lifting module used for controlling the film pressing roller to ascend and descend and a second servo drive lifting module used for controlling the film tearing Bar to ascend and descend, and the film pressing roller is rotationally connected to the bottom of the first servo drive lifting module. The film tearing adhesive tape surrounds the film pressing roller and is in contact with the wafer; and the film tearing angle is adjusted by adjusting the height of the film tearing Bar.

Description

Technical Field

[0001] This invention belongs to the field of wafer debonding technology, and more specifically, relates to the debonding module of a laser debonding and debonding integrated machine. Background Technology

[0002] Against the backdrop of rapid development in the semiconductor industry, electronic products continue to evolve towards miniaturization, high density, and high reliability. Wafer-level advanced packaging technology, due to its ability to effectively improve chip integration and performance, has become one of the core manufacturing processes in consumer electronics, communication equipment, and automotive electronics. In the wafer-level advanced packaging process, to ensure the structural integrity of thin wafers and heterogeneous integrated wafers during processes such as dicing, handling, and bonding, temporary bonding adhesive is typically used to fix the wafer to a glass or silicon substrate to form a support. At the same time, a protective film is applied to the wafer surface to prevent scratches or contamination of delicate structures such as photolithography patterns and metal wiring.

[0003] Traditional debonding processes often rely on mechanical peeling or chemical immersion. Mechanical peeling is prone to causing wafer warping and breakage due to stress concentration, while chemical immersion may leave corrosive reagent residues that contaminate the wafer surface. As a critical cleaning process after wafer exposure, the performance of the film peeling operation directly affects the subsequent packaging quality. However, existing film peeling operations generally use manual methods, peeling off the protective film with tweezers or scrapers. This is not only inefficient, but also difficult to control the tension and angle applied manually, which can easily lead to uneven peeling, residual film, or even scratches on the wafer surface. While some semi-automatic film peeling equipment can achieve mechanical peeling, it lacks coordinated control with the debonding equipment, and the tension adjustment mechanism during the film peeling process is simple and cannot adapt to the peeling requirements of protective films with different adhesive properties. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a film-peeling module for a laser debonding and film-peeling integrated machine. This addresses the existing technical issues where film-peeling operations are generally performed manually, leading to uneven peeling and residual film. Furthermore, while some semi-automatic film-peeling devices can achieve mechanical peeling, they cannot adapt to the peeling requirements of protective films with different adhesive properties.

[0005] The purpose and effectiveness of the film-peeling module in the laser debonding and film-peeling integrated machine of the present invention are achieved by the following specific technical means: The film-tearing module of the laser debonding and film-tearing integrated machine includes an assembly plate for mounting the module. One side of the assembly plate is slidably connected to a tape unwinding station via a tape transport module. A film removal and transfer module is also provided on one side of the assembly plate. A tape take-up station is provided on one side of the film removal and transfer module. Both ends of the film-tearing tape are connected to the tape unwinding station and the tape take-up station, respectively. The demolding and transfer module is also equipped with a lifting structure on one side. The lifting structure includes a first servo-driven lifting module for controlling the lifting of the pressure roller and a second servo-driven lifting module for controlling the lifting of the tear bar. The pressure roller is rotatably connected to the bottom of the first servo-driven lifting module. The tearing tape surrounds the pressure roller and contacts the wafer. The tearing bar is provided at the bottom of the second servo-driven lifting module. The tearing bar does not contact the tearing tape.

[0006] According to a preferred embodiment, the demolding and transfer module includes a first movable plate, and the first movable plate is slidably connected to one side of the assembly plate via a first slide rail structure. A tape winding station and a lifting structure are provided on one side of the first movable plate. Two sets of first bearing seats are also provided on one side of the assembly plate. A lead screw parallel to the axis of the first slide rail structure is provided between the two sets of first bearing seats. A first movable sleeve is sleeved on the lead screw. One side of the first movable sleeve is fixedly connected to the first movable plate. A demolding and transfer module motor is provided on one side of one set of first bearing seats. The main shaft of the demolding and transfer module motor is connected to the lead screw.

[0007] According to a preferred embodiment, a reference sensor for detecting full load in the receiving area is provided on one side of the first moving plate corresponding to the tape winding station. The tape handling module includes a second movable plate. The second movable plate is slidably connected to one side of the assembly plate via two sets of second slide rail structures. A tape unwinding station is provided on one side of the second movable plate. A movable belt structure is also provided on one side of the assembly plate. The top of the second movable plate is connected to the belt inside the movable belt structure via a biting block. A tape handling motor is provided at one end of the movable belt structure. A film consumption detection slot-type sensor is provided on one side of the second movable plate corresponding to the tape unwinding station.

[0008] According to a preferred embodiment, the first servo-driven lifting module and the second servo-driven lifting module have the same structure, both including a servo motor and a second bearing seat. A film-tearing support plate is provided on one side of the first moving plate. The top of the film-tearing support plate is provided with two sets of first mounting holes and two sets of second mounting holes. The servo motor is installed at the bottom of one set of first mounting holes, and the second bearing seat is installed at the bottom of one set of second mounting holes. A lifting screw is passed through the second bearing seat, and the top of the lifting screw is connected to the main shaft of the servo motor through a belt drive mechanism. A second movable sleeve is provided on the lifting screw.

[0009] According to a preferred embodiment, the bottom of the film-tearing support plate is provided with three sets of mounting blocks. Each of the three sets of mounting blocks is slidably connected to a connecting block via a lifting slide rail structure. The bottom ends of two sets of connecting blocks are connected to a rotating bracket. A film-pressing roller is rotatably connected to the bottom of the rotating bracket. The bottom end of the other set of connecting blocks is connected to a film-tearing bar. Two sets of buffer spring modules are respectively installed between the rotating bracket and one set of second movable sleeves, and between the film-tearing bar and another set of second movable sleeves.

[0010] According to a preferred embodiment, the buffer spring module includes two sets of guide posts and two sets of buffer springs. Two sets of guide posts are provided on one side of the second movable sleeve. A buffer mass block is slidably connected between the two sets of guide posts. A buffer spring is sleeved on each guide post. The bottom end of the buffer spring contacts the buffer mass block, and the top end contacts the second movable sleeve. The buffer mass block is connected to the film-tearing bar or rotating bracket via a connecting plate.

[0011] According to a preferred embodiment, a force feedback block is slidably connected between two sets of guide columns in the buffer spring module connected to the rotating bracket. A force sensor is provided between the top of the force feedback block and one of the second moving sleeves, and the tops of both sets of buffer springs are in contact with the force feedback block.

[0012] According to a preferred embodiment, a mounting plate is connected to the end of the film-tearing support plate away from the first moving plate, and two sets of winding rollers are provided on the side of the mounting plate adjacent to the first moving plate, and the film-tearing tape is respectively wrapped around the two sets of winding rollers. A knurled spindle winding unit is provided on one side of the first moving plate, and the contact surface between the film-peeling tape and the wafer wraps around the knurled winding hub of the knurled spindle winding unit. A cable chain is provided on one side of the mounting plate.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. The tape handling module pre-stretches the film-peeling tape to maintain basic tension before peeling, laying the foundation for stable peeling. Simultaneously, as the first servo-driven lifting module controls the descent of the pressure roller, the force sensor in the corresponding buffer spring module monitors the pressure of the roller on the wafer and the tape tension changes in real time, and feeds the data back to the control system. If excessive pressure is detected, the first servo-driven lifting module is adjusted to reduce the descent stroke to prevent damage to the delicate surface structure of the wafer due to overpressure. If insufficient tension is detected, the tension is supplemented by adjusting the winding speed of the tape take-up station to avoid incomplete peeling of the protective film or residual film due to insufficient tension.

[0014] 2. The tear-off bar is raised and lowered via an independent second servo-driven lifting module. Before peeling, the tear-off bar is adjusted to a height similar to the pressure roller, establishing a fixed peeling angle reference. During peeling, the film removal and transfer module drives the entire mechanism to move at a uniform speed, ensuring the tear-off bar maintains a preset angle to guide the protective film peeling direction. This prevents film rebound, uneven tearing, or localized stress concentration caused by angle deviation. Compared to traditional semi-automatic equipment that lacks angle control or has coarse angle adjustment, this independent lifting control structure can flexibly adjust the height of the tear-off bar based on parameters such as protective film adhesion and wafer thickness. This ensures a constant peeling angle for workpieces of different specifications, significantly improving peeling consistency in batch processing and adapting to diverse process requirements.

[0015] 3. By equipping the system with both a membrane material consumption detection trough sensor and a control sensor, the remaining tape quantity at the unwinding station and the full load status of the rewinding station are monitored in real time. When the sensor detects that the tape is about to run out, a replacement prompt is automatically sent. When the rewinding area reaches the set capacity, an alarm is triggered and operation is paused to prevent peeling interruptions or rewinding overflows and contamination due to insufficient tape. Simultaneously, the knurled spindle winding unit provides stable winding power for the peeled protective film. Its knurled structure increases friction with the film material, preventing slippage during winding and ensuring uniform and compact winding. This achieves fully automated monitoring and control of the entire process from tape replenishment and peeling to waste material rewinding, reducing manual inspection and operation, lowering the risk of human error, avoiding process interruptions, and improving overall operational efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the assembled structure of the present invention; Figure 2 This is a schematic diagram of the structure of the present invention after it has been unfolded; Figure 3 This is a schematic diagram of the assembled structure of the tape handling module and the demolding and transfer module in this invention; Figure 4 This is a schematic diagram of the structure of the tape handling module and the demolding and transfer module after separation in this invention; Figure 5 This is a schematic diagram of the assembled lifting structure in this invention; Figure 6 yes Figure 5 A schematic diagram of the disassembled structure; Figure 7 This is a schematic diagram of the assembled structure of the first servo-driven lifting module in this invention; Figure 8 This is a schematic diagram of the disassembled structure of the first servo-driven lifting module in this invention; Figure 9 This is a schematic diagram of the structure of the film-tearable support plate and the mounting plate after assembly in this invention; Figure 10 This is a schematic diagram of the structure after the film-tearable support plate and the mounting plate are separated in this invention.

[0017] In the diagram, the correspondence between component names and drawing numbers is as follows: 11. Assembly plate; 12. Tape unwinding station; 13. Tape rewinding station; 14. Film-tearing tape; 15. Film-pressing roller; 16. Film-tearing bar; 17. Comparison sensor; 18. Knurled spindle winding unit; 21. First moving plate; 22. First slide rail structure; 23. First bearing seat; 24. Lead screw; 25. First moving sleeve; 26. Demolding and transfer module motor; 31. Second moving plate; 32. Second slide rail structure; 33. Moving belt structure; 34. Engaging block; 35. Tape conveying motor; 36. 41. Membrane material consumption detection slotted sensor; 42. Servo motor; 43. Second bearing seat; 44. Film tearing support plate; 45. First mounting hole; 46. Second mounting hole; 47. Lifting screw; 48. Belt drive mechanism; 49. Second moving sleeve; 50. Mounting block; 51. Lifting slide rail structure; 52. Connecting block; 53. Rotating bracket; 54. Mounting plate; 55. Winding roller; 66. Cable chain; 67. Guide column; 68. Buffer spring; 69. Buffer mass block; 60. Force feedback block; 61. Force sensor. Detailed Implementation

[0018] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but should not be used to limit the scope of protection of the present invention.

[0019] Example:

[0020] As attached Figures 1 to 10 As shown: The present invention provides a film-removing module for a laser debonding and film-removing integrated machine, including an assembly plate 11 for mounting the module. A tape unwinding station 12 is slidably connected to one side of the assembly plate 11 via a tape transport module. A film removal and transfer module is also provided on one side of the assembly plate 11. A tape take-up station 13 is provided on one side of the film removal and transfer module. The two ends of the film-removing tape 14 are respectively connected to the tape unwinding station 12 and the tape take-up station 13. A lifting structure is also provided on one side of the demolding and transfer module. The lifting structure includes a first servo-driven lifting module for controlling the lifting of the pressure roller 15 and a second servo-driven lifting module for controlling the lifting of the tear bar 16. The pressure roller 15 is rotatably connected to the bottom of the first servo-driven lifting module. The tear tape 14 surrounds the pressure roller 15 and contacts the wafer. The tear bar 16 is provided at the bottom of the second servo-driven lifting module. The tear bar 16 does not contact the tear tape 14.

[0021] Please see as follows Figure 3and Figure 4 As shown, the demolding and transfer module includes a first movable plate 21. The first movable plate 21 is slidably connected to one side of the assembly plate 11 via two sets of parallel first slide rail structures 22. Each first slide rail structure 22 consists of a guide rail and a slider. The guide rail is fixed to the surface of the assembly plate 11 by bolts, and the slider is fixedly connected to the bottom of the first movable plate 21 by bolts, allowing the slider to slide along the guide rail. A tape winding station 13 and a lifting structure are provided on the side of the first movable plate 21 facing the assembly plate 11. Two sets of first bearing seats 23 are also provided on one side of the assembly plate 11. A lead screw 24 is mounted between seats 23, and the axis of the lead screw 24 is parallel to the axis of the guide rail of the first slide rail structure 22. A first movable sleeve 25 is fitted on the lead screw 24. The first movable sleeve 25 has an internal thread that matches the external thread of the lead screw 24. The outer side of the first movable sleeve 25 is connected to the first movable plate 21 by screws. A demolding and transfer module motor 26 is mounted on the side of a set of first bearing seats 23 away from the lead screw 24 through a motor bracket. The demolding and transfer module motor 26 is a servo motor, and its main shaft is coaxially connected to one end of the lead screw 24 through a coupling.

[0022] Specifically, when in use, the motor 26 of the demolding and transfer module is started. The motor spindle drives the lead screw 24 to rotate synchronously in the bearing of the first bearing seat 23 through the coupling. Since the first moving sleeve 25 is threadedly engaged with the lead screw 24, and the rotation of the first moving sleeve 25 is restricted by the first moving plate 21 and the first slide rail structure 22, the rotational motion of the lead screw 24 is converted into the linear motion of the first moving sleeve 25, which in turn drives the first moving plate 21 to move smoothly along the guide rail of the first slide rail structure 22.

[0023] Please see as follows Figure 4As shown, a reference sensor 17 is fixed to the side of the first moving plate 21 facing the tape take-up station 13 via an L-shaped bracket. The reference sensor 17 can be a photoelectric reference sensor, with its transmitter and receiver installed on both sides of the bracket, facing the take-up roller of the tape take-up station 13. The stripping waste material wound on the take-up roller is located in the optical path between the transmitter and receiver. The tape handling module includes a second movable plate 31. The second movable plate 31 is slidably connected to one side of the assembly plate 11 via two sets of parallel second slide rail structures 32, which are parallel to the first slide rail structure 22. A tape unwinding station 12 is located on one side of the second movable plate 31, with a film-tearing tape 14 wound on the unwinding roller of the tape unwinding station 12. A movable belt structure 33 is also located on one side of the assembly plate 11. This movable belt structure 33 includes a drive wheel, a driven wheel, and an annular belt. The drive wheel and the driven wheel are fixed to the assembly plate 11 via bearing seats, and the belt is fitted between the drive wheel and the driven wheel. The top of the second movable plate 31 is fixedly connected to the side of the belt via a biting block 34. A tape handling motor 35 is mounted on the end of the movable belt structure 33 near the drive wheel via a motor mount. The main shaft of the tape handling motor 35 is connected to the drive wheel via a coupling. A film consumption detection slotted sensor 36 is mounted on the side of the second movable plate 31 near the unwinding roller of the tape unwinding station 12 via a bracket.

[0024] Specifically, before the film-peeling process is started, the film-peeling tape 14 needs to be pre-stretched by the tape transport module. The tape transport motor 35 is started, which drives the drive wheel of the moving belt structure 33 to rotate. The belt then rotates and drives the second moving plate 31 to move away from the tape winding station 13 along the second slide rail structure 32 through the biting block 34. The unloading roller of the tape unwinding station 12 releases the film-peeling tape 14 at the same time, so that the tape is stretched to the preset length. Then the tape transport motor 35 stops rotating. At this time, the film-peeling tape 14 maintains basic tension, which is ready for subsequent bonding and peeling with the wafer surface. During the film-tearing process, the film consumption detection slotted sensor 36 continuously monitors the status of the film-tearing tape 14. When the film consumption detection slotted sensor 36 detects that the tape is about to run out, it sends a replacement prompt to the external control terminal, reminding the operator to replace the tape roll with a new one. The comparison sensor 17 monitors the thickness of the waste material on the take-up roller of the tape take-up station 13 in real time. As the thickness of the waste material increases, when the thickness reaches a preset value, the waste material roll blocks the optical path between the transmitter and receiver of the comparison sensor 17. The sensor triggers a take-up full load alarm, and the system immediately suspends the operation of the film removal and transfer module and the tape take-up station 13 to prevent waste material overflow from causing pollution or equipment jamming. The dual sensor monitoring of film consumption detection and take-up full load detection realizes automated reminders for tape replenishment and waste material handling, reduces the workload of frequent manual inspections, and prevents process interruptions caused by insufficient tape or waste material overflow, ensuring the continuity of the film-tearing process.

[0025] Please see as follows Figure 6 and Figure 8 As shown, the first servo-driven lifting module and the second servo-driven lifting module have the same structure, both consisting of a servo motor 41, a second bearing seat 42, a lifting screw 46, a belt drive mechanism 47, and a second moving sleeve 48. The first moving plate 21 is bolted to the side facing the film-tearing area with a film-tearing support plate 43. The top of the film-tearing support plate 43 has two sets of first mounting holes 44 and two sets of symmetrical second mounting holes 45. The servo motor 41 is bolted to the bottom of one set of first mounting holes 44, and the motor spindle extends upward out of the hole. The second bearing seat 42 is installed at the bottom of one set of second mounting holes 45. The lifting screw 46 passes through the second bearing seat 42, and the top of the lifting screw 46 extends out of the second bearing seat 42 and is connected to the spindle of the servo motor 41 through a belt drive mechanism 47. The second moving sleeve 48 is sleeved on the lifting screw 46, and the inner wall of the second moving sleeve 48 is machined with an internal thread that matches the lifting screw 46.

[0026] Specifically, during use, the first servo drive lifting module and the second servo drive lifting module are controlled separately according to the process requirements. When controlling the first servo drive lifting module, the corresponding servo motor 41 is started, which drives the lifting screw 46 to rotate in the second bearing seat 42 through the belt transmission mechanism 47, thereby controlling the second moving sleeve 48 to rise and fall along the lifting screw 46, thereby controlling the pressing roller 15 to rise and fall, so as to achieve the contact or disengagement of the pressing roller 15 with the wafer surface. When controlling the second servo drive lifting module, another servo motor 41 is started, which drives the second moving sleeve 48 and the film peeling bar 16 to rise and fall through the same transmission logic. In the preparatory stage before film peeling, the first servo-driven lifting module controls the pressure roller 15 to descend until it contacts the wafer surface and applies a preset pressure. Then, the second servo-driven lifting module controls the peeling bar 16 to descend, adjusting its height to be close to that of the pressure roller 15, thus forming a fixed peeling angle reference. During film peeling, the film removal and transfer module drives the entire mechanism to move at a uniform speed. The peeling bar 16 always maintains a preset angle to guide the peeling direction of the protective film. The lifting and lowering control of the pressure roller 15 and the peeling bar 16 is realized through independent servo drive. The lifting and lowering of the pressure roller 15 is used to adjust the bonding pressure with the wafer to ensure that the peeling tape 14 is in full contact with the protective film. The lifting and lowering of the peeling bar 16 is used to adjust the peeling angle. Compared with the lack of angle control or the coarse angle adjustment of traditional semi-automatic equipment, the peeling angle is changed by adjusting the height of the peeling bar 16 through the second servo-driven lifting module according to parameters such as the adhesiveness of the protective film and the thickness of the wafer, ensuring that the peeling conditions of each workpiece are consistent during batch processing.

[0027] Please see as follows Figure 8 and Figure 10As shown, the bottom of the film-tearing support plate 43 is provided with three sets of mounting blocks 49. Each of the three sets of mounting blocks 49 has a connecting block 51 slidably connected to one side via a lifting slide rail structure 50. The lifting slide rail structure 50 consists of a vertical guide rail and a sliding block, which can slide up and down along the guide rail. The sliding block of each set of lifting slide rail structure 50 is fixed to the connecting block 51 with screws. The bottom ends of two sets of connecting blocks 51 are connected to a rotating bracket 52. The bottom of the rotating bracket 52 is rotatably connected to a film-pressing roller 15. The bottom end of the other set of connecting blocks 51 is connected to a film-tearing bar 16. Two sets of buffer spring modules are respectively provided between the rotating bracket 52 and one set of second moving sleeves 48, and between the film-tearing bar 16 and the other set of second moving sleeves 48.

[0028] Please see as follows Figure 8 As shown, the buffer spring module includes two sets of parallel guide posts 61 and two sets of buffer springs 62. Two sets of guide posts 61 are located on one side of the second movable sleeve 48. A buffer mass block 63 is slidably connected between the two sets of guide posts 61. The two sets of buffer springs 62 are respectively sleeved on the two sets of guide posts 61. The buffer springs 62 are compression springs, with their bottom ends contacting the top surface of the buffer mass block 63 and their top ends contacting the bottom surface of the second movable sleeve 48. The bottom of the buffer mass block 63 is bolted to the top of the film-tearing Bar 16 or the top of the rotating bracket 52 via a connecting plate to achieve force transmission. A force feedback block 64 is slidably connected between the two sets of guide posts 61 in the buffer spring module connected to the rotating bracket 52. A force sensor 65 is installed between the top of the force feedback block 64 and one of the sets of second movable sleeves 48. The tops of both sets of buffer springs 62 are in contact with the force feedback block 64.

[0029] Specifically, in the preparatory stage of film removal, the servo motor 41 of the first servo drive lifting module is activated, which drives the lifting screw 46 to rotate through the belt transmission mechanism 47, causing the second moving sleeve 48 to move downward, thereby pushing the buffer spring module, connecting block 51 and rotating bracket 52 to descend synchronously. The pressure roller 15 moves down until it contacts the film removal tape 14 and the wafer surface. At this time, the wafer generates a reaction force on the pressure roller 15. This force is transmitted to the buffer mass block 63 through the rotating bracket 52, pushing the buffer mass block 63 to slide upward along the guide post 61 and compress the buffer spring 62. After being compressed, the buffer spring 62 transmits the force to the force feedback block 64. The force feedback block 64 presses upward against the force sensor 65, and the force sensor 65 transmits the detected pressure signal to the control system in real time. The control system determines the pressure of the pressure roller 15 on the wafer and the tension of the film-tearing tape 14 based on the signal. If the pressure is too high, the first servo drive lifting module is adjusted to reduce the descent stroke to prevent overpressure from damaging the fine structure of the wafer surface. If the tension is insufficient, the tension is supplemented by adjusting the winding speed of the tape winding station 13 to avoid incomplete peeling of the protective film or residual film due to insufficient tension.

[0030] Please see as follows Figure 9 and Figure 10 As shown, a mounting plate 53 is bolted to the end of the film-peeling support plate 43 away from the first moving plate 21. Two sets of winding rollers 54 are connected to the side of the mounting plate 53 adjacent to the first moving plate 21 via bearing seats. The film-peeling tape 14 wraps around the two sets of winding rollers 54 respectively. A knurled spindle winding unit 18 is provided on one side of the first moving plate 21. This unit consists of a servo motor, a belt drive mechanism, and a knurled winding hub. The knurled winding hub is a metal cylinder with cross-knurled or diamond-shaped knurled patterns processed on its periphery. After the film-peeling tape 14 contacts the wafer and peels off the protective film, the tape, together with the peeled protective film, wraps around the periphery of the knurled winding hub. Winding is achieved through the friction between the knurled patterns and the film material. A drag chain 55 is installed on the side of the mounting plate 53 away from the winding rollers 54. Power and signal lines for connecting components such as the servo motor and sensors are threaded inside.

[0031] Specifically, the knurled spindle winding unit 18 provides stable winding power for the peeled protective film. The knurled winding hub of the knurled spindle winding unit 18 adopts a cross knurling or diamond knurling structure. Its knurling structure increases the friction with the film material, prevents the film material from slipping during the winding process, and ensures uniform and compact winding.

[0032] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. The film-peeling module of a laser debonding and film-peeling integrated machine, characterized in that: It includes an assembly plate for installing the module. One side of the assembly plate is slidably connected to a tape unwinding station via a tape transport module. Another side of the assembly plate is equipped with a demolding and transfer module. A tape rewinding station is located on one side of the demolding and transfer module. Both ends of the demolding tape are connected to the tape unwinding station and the tape rewinding station, respectively. The demolding and transfer module is also equipped with a lifting structure on one side. The lifting structure includes a first servo-driven lifting module for controlling the lifting of the pressure roller and a second servo-driven lifting module for controlling the lifting of the tear bar. The pressure roller is rotatably connected to the bottom of the first servo-driven lifting module. The tearing tape surrounds the pressure roller and contacts the wafer. The tearing bar is provided at the bottom of the second servo-driven lifting module. The tearing bar does not contact the tearing tape.

2. The film-peeling module of the laser debonding and film-peeling integrated machine according to claim 1, characterized in that: The demolding and transfer module includes a first movable plate. The first movable plate is slidably connected to one side of the assembly plate via a first slide rail structure. A tape winding station and a lifting structure are provided on one side of the first movable plate. Two sets of first bearing seats are also provided on one side of the assembly plate. A lead screw parallel to the axis of the first slide rail structure is provided between the two sets of first bearing seats. A first movable sleeve is sleeved on the lead screw. One side of the first movable sleeve is fixedly connected to the first movable plate. A demolding and transfer module motor is provided on one side of one set of first bearing seats. The main shaft of the demolding and transfer module motor is connected to the lead screw.

3. The film-peeling module of the laser debonding and film-peeling integrated machine according to claim 2, characterized in that: A reference sensor for detecting full load in the receiving area is installed on one side of the first moving plate corresponding to the tape winding station. The tape handling module includes a second movable plate. The second movable plate is slidably connected to one side of the assembly plate via two sets of second slide rail structures. A tape unwinding station is provided on one side of the second movable plate. A movable belt structure is also provided on one side of the assembly plate. The top of the second movable plate is connected to the belt inside the movable belt structure via a biting block. A tape handling motor is provided at one end of the movable belt structure. A film consumption detection slot-type sensor is provided on one side of the second movable plate corresponding to the tape unwinding station.

4. The film-peeling module of the laser debonding and film-peeling integrated machine according to claim 2, characterized in that: The first servo-driven lifting module and the second servo-driven lifting module have the same structure, both including a servo motor and a second bearing seat. A film-tearing support plate is provided on one side of the first moving plate. The top of the film-tearing support plate has two sets of first mounting holes and two sets of second mounting holes. The servo motor is installed at the bottom of one set of first mounting holes, and the second bearing seat is installed at the bottom of one set of second mounting holes. A lifting screw is inserted into the second bearing seat, and the top of the lifting screw is connected to the main shaft of the servo motor through a belt drive mechanism. A second movable sleeve is provided on the lifting screw.

5. The film-peeling module of the laser debonding and film-peeling integrated machine according to claim 4, characterized in that: The bottom of the film-tearing support plate is equipped with three sets of mounting blocks. Each of the three sets of mounting blocks is slidably connected to a connecting block via a lifting slide rail structure. The bottom of two sets of connecting blocks is connected to a rotating bracket, and the bottom of the rotating bracket is rotatably connected to a film-pressing roller. The bottom of the other set of connecting blocks is connected to a film-tearing bar. Two sets of buffer spring modules are respectively installed between the rotating bracket and one set of second movable sleeves, and between the film-tearing bar and another set of second movable sleeves.

6. The film-peeling module of the laser debonding and film-peeling integrated machine according to claim 5, characterized in that: The buffer spring module includes two sets of guide posts and two sets of buffer springs. Two sets of guide posts are provided on one side of the second movable sleeve. A buffer mass block is slidably connected between the two sets of guide posts. A buffer spring is sleeved on each guide post. The bottom end of the buffer spring contacts the buffer mass block and the top end contacts the second movable sleeve. The buffer mass block is connected to the film-tearing bar or rotating bracket via a connecting plate.

7. The film-peeling module of the laser debonding and film-peeling integrated machine according to claim 6, characterized in that: In the buffer spring module connected to the rotating bracket, a force feedback block is slidably connected between two sets of guide columns. A force sensor is set between the top of the force feedback block and one of the second moving sleeves. The tops of both sets of buffer springs are in contact with the force feedback block.

8. The film-peeling module of the laser debonding and film-peeling integrated machine according to claim 4, characterized in that: A mounting plate is connected to the end of the film-tearing support plate away from the first moving plate. Two sets of winding rollers are provided on the side of the mounting plate adjacent to the first moving plate. The film-tearing tape is wrapped around the two sets of winding rollers respectively. A knurled spindle winding unit is provided on one side of the first moving plate, and the contact surface between the film-peeling tape and the wafer wraps around the knurled winding hub of the knurled spindle winding unit. A cable chain is provided on one side of the mounting plate.

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