Equipment front-end module

Abstract

An equipment front-end module disclosed by the present invention comprises a frame and a wafer loading device, a manipulator and a buffer device are arranged in the frame, the buffer device comprises a bearing frame, the bearing frame comprises an inlet / outlet formed in the front, the left and right sides of the inlet / outlet are provided with gas inlet assemblies capable of spraying gas to the bearing frame, and the gas inlet assemblies comprise seat plates. An air inlet channel is formed in the seat plate, the air channel comprises an air inlet channel, an air outlet channel, a conducting part and a first opening, the air inlet channel and the air outlet channel are communicated through the conducting part, and the first opening is communicated with the air outlet channel and located in front of the inlet and outlet. The adjusting pipe rotates in the air outlet channel and comprises a closed area, an adjusting area, a flow guide area and a second opening which are sequentially arranged in the circumferential direction, and an adjusting hole is formed in the adjusting area. The air inlet assembly is arranged in the buffer device in a centralized mode to supply air to the bearing frame so as to purify the wafer in the bearing frame, meanwhile, the flow of sprayed air can be adjusted through the structure of the air inlet assembly, and the air for purification is saved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer processing equipment, in particular to an equipment front end module. BACKGROUND

[0002] The equipment front end module (EFEM) is used for wafer transmission between the wafer box and the process platform. After some process treatment, the wafer surface will be damaged by the residual process gas. Before the wafer is placed in the wafer box for transmission, the wafer needs to be protected and purified by clean gas in the equipment front end module. However, the wafer is prone to uneven purification during the purification process, or the wafer is purified to be relatively clean but a large amount of expensive gas is consumed. SUMMARY

[0003] In order to overcome the above-mentioned defects, the purpose of the present application is to provide an equipment front end module, which sets the gas inlet assembly in the buffer device to supply gas to the carrier frame, so as to purify the wafer in the carrier frame. At the same time, the structure of the gas inlet assembly can adjust the flow of the ejected gas, saving the gas for purification.

[0004] In order to achieve the above purpose, the technical scheme adopted by the present application is: an equipment front end module, comprising a frame and a wafer loading device connected with the frame, a mechanical hand and a buffer device are arranged in the frame, the buffer device comprises a carrier frame, the carrier frame comprises an inlet and outlet opened in front, gas inlet assemblies capable of ejecting gas are arranged on the left and right sides of the inlet and outlet, the gas inlet assembly comprises: a seat plate fixed outside the side plate of the carrier frame; a gas channel opened on the seat plate, the gas channel comprises a vertical gas inlet channel, a gas outlet channel, a through part and a first opening, the through part connects the gas inlet channel and the gas outlet channel, and the first opening is connected with the gas outlet channel and located in front of the inlet and outlet; an adjusting pipe rotating in the gas outlet channel, the adjusting pipe comprises a closed area, an adjusting area, a flow guiding area and a second opening arranged in sequence along the circumference, and an adjusting hole is opened on the adjusting area; When the adjusting area rotates to the through part, the second opening rotates to the first opening, and the adjusting hole adjusts the gas flow at the first opening by changing the alignment area with the through part; when the closed area closes the through part, the flow guiding area closes the first opening. Further, an angle between a vertical plane where the first opening is located and a vertical plane where the inlet and outlet are located is not less than 90°, a width of the second opening is less than a width of the first opening, and a coincident area of the first opening and the second opening forms the air outlet opening; When the adjustment hole is completely aligned with the conducting part, the first opening is partially blocked and the second opening serves as the air outlet opening, and an air outlet direction of the air outlet opening is forwardly inclined relative to the inlet and outlet; When the adjustment hole is partially aligned with the conducting part, the greater the area of the adjustment hole and the conducting part that are in communication, the greater the width of the air outlet opening, and the air outlet direction of the air outlet opening is forwardly inclined relative to the inlet and outlet or parallel to the inlet and outlet.

[0005] Further, the flow guide region further comprises an arc-shaped guide part located at the second opening, and the arc-shaped guide part abuts against two side walls of the first opening when the closed region closes the conducting part and the adjustment hole is completely aligned with the conducting part.

[0006] Further, the adjustment holes are uniformly arranged in the up-down direction, and each adjustment hole comprises a plurality of hole bodies uniformly distributed in the circumferential direction of the adjustment pipe.

[0007] Further, the adjustment holes are uniformly arranged in the up-down direction, and the adjustment holes are waist-shaped holes extending in the circumferential direction of the adjustment pipe. Further, the air inlet assembly further comprises a rotary driving member fixed on the seat plate and used for driving the adjustment pipe to rotate.

[0008] Further, the buffer device further comprises an oxygen sensor located in the bearing frame, the oxygen sensor is located in the rear region of the bearing frame, the oxygen sensor is used for collecting the oxygen content in the bearing frame, and the rotary driving member is linked with the oxygen sensor.

[0009] Further, the seat plate is provided with a gas supply opening in communication with the air inlet channel, and the gas enters the air inlet channel from the gas supply opening.

[0010] Further, the buffer device further comprises an air outlet assembly, the air outlet assembly comprises an adapter fixed on the rear plate of the bearing frame, the adapter and the rear plate of the bearing frame form an air outlet channel, and the rear plate is provided with an air outlet opening in communication with the air outlet channel.

[0011] Further, the frame bottom is provided with an air suction opening. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1A structural schematic diagram of a front end module of an apparatus in an embodiment of the present application; Figure 2 A three-dimensional structural schematic diagram of a cache device in an embodiment of the present application; Figure 3 A schematic diagram of a cache rack after a part thereof is cut in an embodiment of the present application; Figure 4 A Figure 3 An enlarged view of A in FIG. 1; Figure 5 A structural schematic diagram of an air inlet passage in an embodiment of the present application; Figure 6 A structural schematic diagram of an adjusting member in an embodiment of the present application; Figure 7 A schematic diagram of the adjusting member in a closed first opening state in an embodiment of the present application; Figure 8 A Figure 7 An enlarged view of B in FIG. 2; Figure 9 A schematic diagram of the adjusting member in an exhaust state in an embodiment of the present application; Figure 10 A Figure 9 An enlarged view of C in FIG. 3; Figure 11 A schematic diagram of the adjusting member in a small flow aeration state in an embodiment of the present application; Figure 12 A Figure 11 A large view of D in FIG. 4; Figure 13 A schematic diagram of the adjusting member in a large flow aeration state in an embodiment of the present application; Figure 14 A Figure 13 An enlarged view of E in FIG. 5.

[0013] In the drawings: 100, frame; 101, air inlet; 200, wafer loading device; 300, robot; 400, cache device; 1, bearing rack; 11, inlet and outlet; 12, side plate; 13, back plate; 131, air outlet; 14, support assembly; 15, containing cavity; 2. Intake assembly; 21. Seat plate; 22. Gas passage; 221. Intake passage; 2211. Air supply port; 2212. Pipe connector; 222. Exhaust passage; 223. Conductor; 224. First opening; 23. Adjusting pipe; 231. Enclosed area; 232. Adjustment area; 2321. Adjustment hole; 23211. First hole; 23212. Second hole; 23213. Third hole; 233. Guide area; 234. Second opening; 2341. Arc-shaped guide; 24. Rotary drive component; 25. Exhaust opening; 3. Oxygen sensor; 4. Exhaust assembly; 41. Adapter; 411. Exhaust passage; 42. Exhaust pipe; 51. Bracket; 52. Connecting plate; 6. Wafer. Detailed Implementation The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby providing a clearer and more explicit definition of the scope of protection of the present invention.

[0014] See appendix Figure 1 As shown, a device front-end module includes a frame 100 and a wafer loading device 200 docked with the frame 100. The wafer loading device 200 is used to load wafer cassettes. A robot arm 300 and a buffer device 400 are provided inside the frame 100. The robot arm 300 transfers wafers 6 between the process station docked with the device front-end module and the wafer cassettes on the wafer loading device 200. The wafers 6 can be buffered in the buffer device 400.

[0015] See appendix Figure 2 and attached Figure 3 As shown, the buffer device includes a carrier frame 1, which includes a rear plate 13 and two side plates 12 in the left and right directions. The rear plate 13 and the side plates 12 define a receiving cavity 15. An inlet / outlet 11 for the wafer 6 to enter and exit the receiving cavity 15 is provided at the front of the carrier frame 1. A support assembly 14 is provided inside the receiving cavity 15. The support assembly 14 includes slots evenly distributed in the vertical direction, and each slot can accommodate one wafer 6.

[0016] The wafer 6, after being processed at the process station, is cached in the cache device 400. Process gases may remain on the wafer 6, so the wafer 6 in the cache device 400 needs to be purified.

[0017] In one embodiment, see Appendix Figure 3 and attached Figure 4As shown, the buffer device 400 also includes an air intake assembly 2 capable of ejecting gas. The air intake assembly 2 is located on the left and right sides of the inlet and outlet 11. The gas ejected by the air intake assembly 2 can purify the wafer 6 in the receiving cavity 15. The air intake assembly 2 includes a base plate 21, a gas channel 22, and a regulating pipe 23. The regulating pipe 23 rotates within the gas channel 22 to regulate the final air flow rate of the air intake assembly 2.

[0018] The mounting plate 21 is fixed to the outside of the side plate 12 of the support frame 1, and will not affect the entry and exit of the wafer 6 into the receiving cavity 15. Gas channels 22 are formed on the mounting plate 21, see attached diagram. Figure 5 As shown, the gas channel 22 includes a vertically arranged inlet channel 221, an outlet channel 222, a guide section 223, and a first opening 224. Gas directly enters the inlet channel 221. The guide section 223 connects the inlet channel 221 and the outlet channel 222. The first opening 224 connects the outlet channel 222. The first opening 224 is located in front of the inlet / outlet 11 and faces the support frame 1.

[0019] See appendix Figure 6 As shown, the regulating pipe 23 is a hollow tubular structure. The regulating pipe 23 includes a closed region 231, an regulating region 232, a guiding region 233, and a second opening 234 arranged sequentially along the circumference. At this time, the regulating pipe 23 forms a C-shape in its cross-section along the horizontal plane, and the air outlet channel is connected to the hollow cavity of the regulating pipe 23. An regulating hole 2321 is provided on the regulating region 232. When the regulating region 232 rotates to the guiding part 223, the second opening 234 rotates to the first opening 224. The regulating hole 2321 adjusts the airflow at the first opening 224 by changing the alignment area with the guiding part 223. When the closed region 231 closes the guiding part 223, the guiding region 233 closes the first opening 224.

[0020] The gas in the intake passage 221 passes through the guide section 223 and the regulating pipe 23 to enter the exhaust passage 222. When it is not necessary to purify the wafer 6 in the support frame 1, see Appendix. Figure 7 and attached Figure 8 As shown, when the regulating tube 23 rotates to the closed position of the closed region 231 and the closed conduction part 223, the guide region 233 closes the first opening 224, and the gas in the gas channel 22 will not be ejected from the first opening 224. This forms two seals on the path of the gas flowing out of the gas channel 22, achieving a double seal and reducing gas loss. When it is necessary to purify the wafer 6 in the support frame 1, the regulating tube 23 rotates to the alignment position of the regulating region 232 and the conduction part 223. At this time, by changing the rotation angle of the regulating tube 23, the alignment area between the regulating hole 2321 and the conduction part 223 is changed, thereby adjusting the gas flow rate in the gas channel 22, supplying gas as needed, and reducing gas waste.

[0021] The cooperation of the adjusting pipe 23 and the gas passage 22 can control the gas flow of the gas inlet assembly, and can double seal the path of the gas passage 22 when no gas is needed, so as to adjust the opening and flow of the gas according to the use requirement, and save the gas consumption.

[0022] In the embodiment, the gas is nitrogen, and the wafer 6 is purified by blowing nitrogen to the surface of the wafer 6 according to the processing requirement of the wafer 6.

[0023] In one embodiment, referring to FIGS. 1 and 2, the gas inlet passage 221 and the gas outlet passage 222 are in the shape of an 8 in the horizontal cross-sectional area, and the intersection of the gas inlet passage 221 and the gas outlet passage 222 forms the conducting part 223. Figure 4 and FIG. 3, the gas inlet passage 221 and the gas outlet passage 222 are in the shape of an 8 in the horizontal cross-sectional area, and the intersection of the gas inlet passage 221 and the gas outlet passage 222 forms the conducting part 223. Figure 5 The intersection of the gas inlet passage 221 and the gas outlet passage 222 forms the conducting part 223, and no additional passage is needed as the conducting part 223, so that the space occupied by the gas passage 22 can be reduced, and the processing technology is simplified.

[0024] The gas inlet passage 221 and the gas outlet passage 222 are in the shape of a cylinder, and partially overlap. The outer diameter of the adjusting pipe 23 is the same as or slightly smaller than the diameter of the gas outlet passage 222, so that the adjusting pipe 23 can rotate in the gas outlet passage 222, and the closed area 231 enters the gas inlet passage 221 to block the conducting part 223. At the same time, the size of the adjusting pipe 23 reduces the gap between the adjusting pipe 23 and the side wall of the gas outlet passage 222, so as to reduce the escape of the gas in the gas inlet passage from the gap as much as possible, and improve the utilization rate of the gas.

[0025] In the embodiment, the cooperation of the rotating adjusting pipe 23 and the gas passage 22 can block the gas passage 22 according to the use requirement, and adjust the flow of the final gas outlet of the gas passage 22, so as to reduce the waste of the gas, and improve the utilization efficiency of the gas while meeting the wafer 6 purification in the carrier 1.

[0026] In one embodiment, referring to FIGS. 1 and 2, the gas inlet passage 221 and the gas outlet passage 222 are in the shape of an 8 in the horizontal cross-sectional area, and the intersection of the gas inlet passage 221 and the gas outlet passage 222 forms the conducting part 223. Figure 3 and FIG. 3, the gas inlet passage 221 and the gas outlet passage 222 are in the shape of an 8 in the horizontal cross-sectional area, and the intersection of the gas inlet passage 221 and the gas outlet passage 222 forms the conducting part 223. Figure 4 The intersection of the gas inlet passage 221 and the gas outlet passage 222 forms the conducting part 223, and no additional passage is needed as the conducting part 223, so that the space occupied by the gas passage 22 can be reduced, and the processing technology is simplified.

[0027] When the adjusting hole 2321 is completely aligned with the conducting part 223, the gas flow is the largest at this time, the first opening 224 is partially blocked by the adjusting pipe 23, at this time, the second opening 234 is completely overlapped with the first opening 224 and serves as the gas outlet opening 25, the gas outlet direction of the gas outlet opening 25 is inclined forward relative to the inlet and outlet 11. At this time, the gas outlet opening 25 is open to the outside of the bearing frame 1, and the gas outlet opening 25 is also the largest, and the gas in the gas channel 22 can be quickly discharged. When the adjusting hole 2321 is partially aligned with the conducting part 223, the larger the area of the adjusting hole 2321 and the conducting part 223, the smaller the area of the first opening 224 blocked by the adjusting pipe 23, at this time, the area of the adjusting hole 2321 and the conducting part 223 is proportional to the area of the gas outlet opening 25, the larger the area of the adjusting hole 2321 and the conducting part 223, the larger the gas outlet opening 25, the larger the gas outlet flow, and the gas outlet direction of the gas outlet opening 25 is inclined forward relative to the inlet and outlet 11 or parallel to the inlet and outlet 11.

[0028] Referring to the accompanying drawings Figure 4 As shown, the seat plate 21 is provided with a gas supply port 2211 communicated with the gas inlet channel 221, and the gas enters the gas inlet channel 221 from the gas supply port 2211. The gas supply port 2211 is connected with a pipe joint 2212, and the pipe joint 2212 is connected with an external nitrogen gas supply through a pipeline, and the nitrogen gas enters the gas channel 22 through the gas supply port 2211.

[0029] The gas supply port 2211 is provided in fewer, for example, two gas supply ports 2211 are provided in the up-down direction. The adjusting holes 2321 are uniformly arranged in the up-down direction, at this time, the gas in the gas inlet channel 221 enters the gas outlet channel 222 through the uniformly distributed adjusting holes 2321, so that the gas in the gas outlet channel 222 is more uniform, and the gas outlet of the gas outlet opening 25 is more uniform in the up-down direction, reducing the problem that the gas concentration near the gas supply port 2211 is larger.

[0030] Referring to the accompanying drawings Figure 3 As shown, the buffer device 400 further comprises an exhaust assembly 4, the exhaust assembly 4 comprises an adapter 41 fixed on the rear plate 13 of the bearing frame 1, the adapter 41 and the rear plate 13 of the bearing frame 1 form an exhaust channel 411, and the rear plate 13 is provided with a gas outlet 131 communicated with the exhaust channel 411. The exhaust channel 411 is connected with an air pump outside the buffer device 400 through an exhaust pipe 42, and when the air pump works, the gas in the containing cavity 15 can be extracted, the gas sprayed by the gas inlet assembly 2 can be sucked into the containing cavity 15 and discharged from the containing cavity 15, so that the gas passes through the wafer 6 to purify the wafer 6.

[0031] In one embodiment, each adjusting hole 2321 comprises a plurality of hole bodies which are uniformly distributed along the circumference of the adjusting pipe 23. The hole bodies can be round holes, square holes, rhombic holes, etc. and the shape of the hole bodies is not limited. For example, three hole bodies are provided, which are all round holes, and the three hole bodies are respectively a first hole 23211, a second hole 23212 and a third hole 23213.

[0032] When the buffer device 400 does not place the wafer 6, refer to the attached Figure 7 and the attached Figure 8 , the adjusting pipe 23 is rotated to the position shown in the figure, the closed area 231 of the adjusting pipe 23 closes the through part 223, and the gas cannot enter the outlet channel 222 from the inlet channel 221. It can be seen that the first hole 23211, the second hole 23212, the third hole 23213 and the second opening 234 are all aligned with the side wall of the outlet channel 222, and the first hole 23211, the second hole 23212, the third hole 23213 and the second opening 234 lose the communication with the outside, and the flow guide area 233 closes the first opening 224. At this time, the adjusting pipe 23 and the outlet channel 222 jointly enclose a closed space, which forms two closed paths for the gas in the inlet channel 221 to flow outwards, thereby reducing the loss of the gas.

[0033] Before the wafer 6 is placed into the accommodating cavity 15, the gas in the gas channel 22 with low purity needs to be discharged to avoid contaminating the wafer 6 in the accommodating cavity 15. Refer to the attached Figure 9 and the attached Figure 10 , the adjusting pipe 23 is rotated to the position shown in the figure. It can be seen that the first hole 23211, the second hole 23212 and the third hole 23213 are all in communication with the inlet channel 221, and the second opening 234 is completely coincident with the first opening 224. The outlet opening 25 is the second opening 234. At this time, the outlet opening 25 is the largest and the outlet direction of the outlet opening 25 is inclined to the front. The gas with low purity in the gas channel 22 can quickly flow out to the front of the carrier 1 and will not contaminate the accommodating cavity 15 of the carrier 1. The bottom of the frame 100 is provided with a suction port 101, and the gas discharged from the gas channel 22 will be sucked away by the suction port 101 and will not enter the accommodating cavity 15.

[0034] After the gas with low purity in the inlet channel 221 is discharged, a large amount of gas is not needed to quickly discharge at this time, so the adjusting pipe 23 is rotated to make the adjusting hole 2321 and the through part 223 partially coincide, and the gas flow of the outlet opening 25 is adjusted through the overlapping area of the adjusting hole 2321 and the through part 223.

[0035] For example, when a large amount of nitrogen gas is needed to quickly empty the original gas in the accommodating cavity 15, the adjusting pipe 23 can be directly rotated to the attached Figure 13 and the attached Figure 14At the indicated position, the first hole 23211 and the second hole 23212 of the regulating pipe 23 are connected to the air intake channel 221. At this time, the second opening 234 and the first opening 224 completely overlap, and the air outlet 25 is the second opening 234. The air outlet 25 is oriented towards the inlet / outlet 11 of the support frame and is tilted forward. The opening of the air outlet 25 is at its maximum, and a large amount of nitrogen can be discharged from the regulating pipe 23 to the inlet / outlet 11 of the support frame 1. The nitrogen can cover a large area in the left and right directions of the inlet / outlet 11 of the support frame 1. The exhaust pipe 42 sucks away the gas with low purity in the receiving cavity 15, and the large amount of nitrogen at the inlet / outlet 11 can quickly fill the receiving cavity 15. When the receiving cavity 15 of the support frame is full of nitrogen, the robot arm 300 places the wafer 6 to be cleaned into the receiving cavity 15. In this state, the angle of inclination of the air outlet 25 towards the left and right directions is smaller than the angle of inclination of the air outlet 25 towards the left and right directions when the adjustment hole 2321 and the guide part 223 are fully aligned.

[0036] Since the cavity 15 is already filled with nitrogen, only a portion of the nitrogen will leak out during the handling process by the robotic arm 300 due to the open support frame 1. Therefore, there is no need to quickly replenish the nitrogen. At this time, the intake speed of the exhaust pipe 42 can be reduced, and the nitrogen demand can be reduced. This can be achieved by rotating the regulating pipe 23 to the attached position. Figure 11 and attached Figure 12 The location shown is in Figure 12 As can be seen from the position, only the first hole 23211 is connected to the air inlet channel 221. The second hole 23212 and the third hole 23213 are rotated to the side wall of the air outlet channel 222 and are closed. The guide area 233 partially blocks the first opening 224. The second opening 234 only partially overlaps with the first opening 224. The air outlet 25 is smaller than the second opening 234. The air outlet 25 is directly opposite the left and right ends of the inlet and outlet 11. The air outlet direction of the air outlet 25 is along the left and right direction. The nitrogen in the air inlet channel 221 enters the air outlet channel 222 through the first hole 23211 in sequence, and then passes through the smaller air outlet 25. This ensures that the small amount of nitrogen ejected from the air outlet 25 has a certain ejection pressure. The nitrogen can cover a large area of ​​the inlet and outlet 11 in the left and right direction, reducing the amount of air mixed into the receiving cavity 15 of the support frame from the middle area of ​​the inlet and outlet 11.

[0037] The regulating hole 2321 can also be an oblong hole extending circumferentially along the regulating tube 23. In this case, it is not necessary to set multiple hole bodies. Since it is an oblong hole, rotating the regulating tube 23 can steplessly adjust the size of the area where the oblong hole communicates with the guide portion 223. For example, when the oblong hole is rotated to the side wall position of the air outlet channel 222, the oblong hole loses communication with the outside, and the closed area 231 closes the guide portion 223. When the regulating tube 23 is rotated, the oblong hole is fully or mostly connected to the guide portion 223, and unclean gas can be quickly discharged to the outside of the support frame 1. When the regulating tube 23 is rotated to the point where most of the oblong hole is blocked and a small part is connected to the guide portion 223, a small amount of nitrogen gas sprayed from the air intake component 2 can replenish the nitrogen gas lost from the receiving cavity 15. When the regulating tube 23 is rotated to the point where a small part of the oblong hole is blocked and most of it is connected to the guide portion 223, a large amount of nitrogen gas sprayed out can quickly discharge unclean gas in the receiving cavity 15, protecting and cleaning the wafer 6.

[0038] In this embodiment, the larger the alignment area between the adjusting hole 2321 and the guiding part 223, the greater the air flow rate of the air outlet 25. At this time, the greater the forward tilt angle of the air outlet 25 relative to the left and right directions. Thus, the smaller the air flow rate of the air outlet 25, the closer the air outlet 25 is to the inlet and outlet 11, and the faster it can be drawn into the receiving cavity 15 by the exhaust assembly 4.

[0039] In one embodiment, see Appendix Figure 6 As shown, the flow guiding area 233 also includes an arc-shaped guide portion 2341 located at the second opening 234. The arc-shaped guide portion 2341 guides the ejected gas, allowing the gas to flow along the direction of the arc-shaped guide portion 2341. On the other hand, the arc-shaped guide portion 2341 also acts as a limit. When the closed area 231 closes the conduction portion 223 and the adjustment hole 2321 is fully aligned with the conduction portion 223, the arc-shaped guide portion 2341 abuts against the two side walls of the first opening 224 respectively. The arc-shaped guide portion 2341 limits the rotation angle of the adjustment tube 23, allowing the adjustment tube 23 to rotate only within a specified angle to meet the gas adjustment requirements.

[0040] See appendix Figure 3 As shown, the intake assembly 2 also includes a rotary drive 24, which is fixed on the base plate 21 and used to drive the regulating pipe 23 to rotate. For example, the rotary drive 24 is a motor, which is fixed to the lower end of the base plate 21. When the rotating shaft of the motor rotates, it drives the regulating pipe 23 to rotate around its own axis.

[0041] The buffer device 400 also includes an oxygen sensor 3 located within the support frame 1. The oxygen sensor 3 is situated in the rear region of the support frame 1 and is used to collect the oxygen content within the support frame 1. Because the rear region of the support frame 1 has the least amount of nitrogen, the nitrogen content there is sufficient, and the nitrogen content in other regions will inevitably meet the purification requirements. Therefore, by placing the oxygen sensor 3 in the rear region, when the oxygen sensor 3 detects a high oxygen concentration, it indicates that the nitrogen is insufficient and a large amount of nitrogen needs to be added.

[0042] The rotary drive component 24 is linked to the oxygen sensor 3. When the oxygen concentration is high, it indicates that a large amount of air has entered the receiving cavity 15 of the support frame. At this time, the controller controls the motor to rotate the regulating tube 23 to the adjacent position. Figure 14 The indicated position allows for the supply of a larger amount of nitrogen to the receiving cavity 15 of the support frame 1; when the oxygen concentration is too low, it indicates that excessive nitrogen is being supplied, resulting in a waste of expensive nitrogen. The controller then controls the motor to rotate the regulating tube 23 to the position indicated by the position. Figure 12 At the location shown, a small amount of nitrogen can be used to appropriately replenish the nitrogen lost from the receiving cavity 15 of the support frame 1.

[0043] See appendix Figure 2 As shown, the support frame 1 is connected to the connecting plate 52 via the bracket 51. The connecting plate 52 is connected to the frame 100. The bracket 51 raises the height of the support frame. The support frame 1 can be fixed at a certain height above the ground. The height of the support frame 1 makes it convenient for the robot arm 300 to pick up and put down the wafer 6.

[0044] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A device front end module, characterized by: The application relates to a wafer loading device comprising a frame and a wafer loading device connected with the frame, a mechanical hand and a buffer device are arranged in the frame, the buffer device comprises a bearing frame, the bearing frame is provided with an inlet and outlet in front, left and right sides of the inlet and outlet are provided with air inlet assemblies capable of spraying gas to the bearing frame, the air inlet assembly comprises: a seat plate fixed outside the side plate of the bearing frame; an air channel is arranged on the seat plate, the air channel comprises vertically arranged air inlet channels, air outlet channels, a conducting part and a first opening, the conducting part conducts the air inlet channels and the air outlet channels, and the first opening is conducted with the air outlet channels and located in front of the inlet and outlet; an adjusting pipe is arranged in the air outlet channel, the adjusting pipe comprises a closed area, an adjusting area, a flow guiding area and a second opening arranged in sequence along the circumference of the adjusting pipe, and adjusting holes are arranged on the adjusting area; when the adjusting area rotates to the conducting part, the second opening rotates to the first opening, the adjusting holes adjust the air outlet flow rate at the first opening by changing the alignment area with the conducting part; when the closed area closes the conducting part, the flow guiding area closes the first opening.

2. The device front end module of claim 1, wherein: an angle between a vertical plane where the first opening is located and a vertical plane where the inlet and outlet are located is not less than 90 degrees, a width of the second opening is smaller than a width of the first opening, and a coincident area of the first opening and the second opening forms an air outlet opening; when the adjusting holes are completely aligned with the conducting part, the first opening is partially blocked and the second opening serves as the air outlet opening, and an air outlet direction of the air outlet opening is inclined forward relative to the inlet and outlet; when the adjusting holes are partially aligned with the conducting part, the greater the area where the adjusting holes are conducted with the conducting part, the greater the width of the air outlet opening, and the air outlet direction of the air outlet opening is inclined forward relative to the inlet and outlet or parallel to the inlet and outlet.

3. The device front end module of claim 1, wherein: the flow guiding area further comprises an arc-shaped guiding part located at the second opening, and the arc-shaped guiding part respectively abuts against two side walls of the first opening when the closed area closes the conducting part and the adjusting holes are completely aligned with the conducting part.

4. The device front end module of claim 1, wherein: the adjusting holes are uniformly arranged in an up-down direction, and each adjusting hole comprises a plurality of hole bodies uniformly distributed along the circumference of the adjusting pipe.

5. The device front end module of claim 1, wherein: the adjusting holes are uniformly arranged in the up-down direction, and the adjusting holes are waist-shaped holes extending along the circumference of the adjusting pipe.

6. The device front end module of claim 1, wherein: the air inlet assembly further comprises a rotary driving member fixed on the seat plate and used for driving the adjusting pipe to rotate.

7. The device front end module of claim 6, wherein: the buffer device further comprises an oxygen sensor located in the bearing frame, the oxygen sensor is located in a rear area of the bearing frame, the oxygen sensor is used for collecting oxygen content in the bearing frame, and the rotary driving member is linked with the oxygen sensor.

8. The device front end module of claim 1, wherein: a gas supply port is arranged on the seat plate and conducted with the air inlet channel, and the gas enters the air inlet channel from the gas supply port.

9. The equipment front end module of any of claims 1-8, wherein: The air exhaust assembly comprises an adapter fixed on the rear plate of the bearing frame, and the adapter forms an air exhaust channel with the rear plate of the bearing frame.

10. The device front end module of claim 9, wherein: The frame bottom is provided with an air inlet.

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