Heat dissipation device and electronic device

Abstract

The application discloses a heat dissipation device and electronic equipment, and relates to the technical field of heat dissipation. The heat dissipation device comprises a cooling liquid source, a liquid inlet collecting part, a liquid return collecting part, a first heat exchange flow channel and an air cooling module. The combination of the first heat exchange flow channel and the air cooling module improves the heat dissipation efficiency and system adaptability of the heat dissipation device. The fluid power cavity in the first heat exchange flow channel provides an installation space for the air cooling module, and the air cooling module is automatically driven to rotate by the cooling liquid flow in the fluid power cavity, so that the heat dissipation system can strengthen the heat exchange effect through the synergistic effect of air cooling and liquid cooling while maintaining compact structure, and at least solves the problem that the heat dissipation device in the related art has a high dependence on environmental conditions. When the environmental temperature rises, the air cooling capacity will decrease significantly, and it is difficult to effectively cool down. The application achieves the technical effects of flexibly adapting to the heat dissipation requirements in different environments, and taking into account the heat dissipation performance, system stability and use flexibility.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to heat dissipation devices and electronic equipment. Background Technology

[0002] With the rapid development of electronic information technology, various electronic devices, such as server power supplies, vehicle power supplies for new energy vehicles, and high-power power supplies in industrial automation, are constantly evolving towards higher power and higher density, resulting in a dramatic increase in the heat generated per unit volume. Heat dissipation performance has become a key factor restricting the operational stability, lifespan, and performance limits of electronic devices.

[0003] Currently, most devices in the industry still primarily use air cooling for heat dissipation. This method relies on fans to drive airflow to remove heat from the surface of the power board. Although air cooling has the advantages of simple structure and low cost, its heat dissipation effect is highly dependent on environmental conditions. When the ambient temperature rises, the heat dissipation capacity of the air will decrease significantly, making it difficult to effectively cool high-power-density devices. Summary of the Invention

[0004] This application provides a heat dissipation device and electronic equipment to at least solve the problem in the related art that the heat dissipation device is highly dependent on environmental conditions; when the ambient temperature rises, the heat dissipation capacity of the air will decrease significantly, making it difficult to effectively cool high power density equipment.

[0005] This application provides a heat dissipation device, including a coolant source, a coolant inlet collection section, a coolant return collection section, a first heat exchange channel, and an air-cooling module; the coolant inlet collection section is connected to the outlet of the coolant source; the coolant return collection section is connected to the coolant return port of the coolant source; the first heat exchange channel is connected between the coolant inlet collection section and the coolant return collection section; and a hydrodynamic cavity is formed inside the first heat exchange channel; the air-cooling module is rotatably mounted in the hydrodynamic cavity.

[0006] This application also provides an electronic device, including a heat-dissipating device and the aforementioned heat dissipation device; the aforementioned heat dissipation device is thermally connected to the heat-dissipating device.

[0007] The combined design of the first heat exchange channel and the air-cooling module in this application improves the heat dissipation efficiency and system adaptability of the heat dissipation device. The fluid dynamic cavity within the first heat exchange channel provides installation space for the air-cooling module, which is rotatable. The air-cooling module's rotation is automatically driven by the flow of coolant in the fluid dynamic cavity. This allows the heat dissipation system to maintain a compact structure while enhancing heat exchange through the synergistic effect of air and liquid cooling. This addresses the problem in related technologies where heat dissipation devices are highly dependent on environmental conditions; when the ambient temperature rises, the air's heat dissipation capacity significantly decreases, making it difficult to effectively cool high-power-density equipment. This achieves the technical effect of flexibly adapting to heat dissipation needs in different environments, balancing heat dissipation performance, system stability, and operational flexibility. Attached Figure Description

[0008] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 This is a schematic diagram of the connection between the heat dissipation device and the device to be cooled, as provided in the embodiments of this application.

[0010] Figure 2 This is a schematic diagram of the structure of the heat dissipation device provided in the embodiments of this application;

[0011] Figure 3 This is an exploded view of the heat dissipation device provided in the embodiments of this application;

[0012] Figure 4 This is a partial sectional view of the side of the heat dissipation device provided in an embodiment of this application;

[0013] Figure 5 This is a schematic diagram of the structure of the air-cooled module provided in an embodiment of this application.

[0014] The above figures include the following reference numerals:

[0015] 100. Heat dissipation device; 110. Coolant source; 111. Cooling tank; 1111. Mounting groove; 112. Refrigeration assembly; 1121. Semiconductor cooler; 1122. Cooling fan; 120. Liquid inlet collection section; 121. First liquid outlet; 130. Liquid return collection section; 140. First heat exchange channel; 141. Annular channel unit; 142. Connecting pipe; 1421. First connecting pipe; 1422. Second connecting pipe; 1423. Third connecting pipe; 150. Air-cooled module; 151. Power impeller; 152. Cooling fan blade; 153. Drive shaft; 154. Sealed bearing; 160. Second heat exchange channel; 170. Infusion assembly; 171. Power pump; 172. Infusion pipeline; 181. Temperature sensor; 182. Temperature controller; 183. Fixing plate; 190. Return pipeline;

[0016] 200. Devices to be cooled. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0018] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0019] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] The embodiments of this application provide a heat dissipation device 100 and an electronic device. The device is described in detail in conjunction with the structure and working principle of the heat dissipation device 100 and the electronic device.

[0021] The following is combined with Figures 1 to 5 The following describes embodiments of the present invention.

[0022] According to an embodiment of the present invention, in one aspect, a heat dissipation device 100 is provided, such as... Figure 2 and Figure 3As shown, the heat dissipation device 100 includes a coolant source 110, a liquid inlet collection section 120, a liquid return collection section 130, a first heat exchange channel 140, and an air-cooling module 150; the liquid inlet collection section 120 is connected to the outlet of the coolant source 110; the liquid return collection section 130 is connected to the return port of the coolant source 110; the first heat exchange channel 140 is connected between the liquid inlet collection section 120 and the liquid return collection section 130; and a hydrodynamic cavity is formed inside the first heat exchange channel 140; the air-cooling module 150 is rotatably mounted in the hydrodynamic cavity.

[0023] In the above embodiments, the combined design of the first heat exchange channel 140 and the air-cooling module 150 improves the heat dissipation efficiency and system adaptability of the heat dissipation device 100. The hydrodynamic cavity within the first heat exchange channel 140 provides installation space for the air-cooling module 150, and the air-cooling module 150 is rotatably mounted. The air-cooling module 150 is automatically driven to rotate by the flow of coolant in the hydrodynamic cavity, so that the heat dissipation system can enhance the heat exchange effect through the synergistic effect of air cooling and liquid cooling while maintaining a compact structure. This at least solves the problem in related technologies where the heat dissipation device 100 is highly dependent on environmental conditions; when the ambient temperature rises, the heat dissipation capacity of the air will decrease significantly, making it difficult to effectively cool high-power-density equipment. This achieves the technical effect of flexibly adapting to the heat dissipation needs in different environments, taking into account heat dissipation performance, system stability, and usage flexibility.

[0024] In a specific implementation, the air-cooled module 150 is driven by the coolant flowing through the hydrodynamic chamber to generate airflow.

[0025] In this embodiment, the inlet liquid collection section 120 and the return liquid collection section 130 are two independent collection boxes arranged side by side. Both the inlet liquid collection section 120 and the return liquid collection section 130 are fixedly connected to the top of the cooling box 111, making full use of the space at the top of the cooling box 111, realizing the integration and modularization of components, making the overall structure more compact, and facilitating installation and maintenance.

[0026] Furthermore, the inlet liquid collection section 120 and the return liquid collection section 130 are arranged side by side along the length or width of the top of the cooling tank 111, maintaining a preset distance between them to avoid mutual interference. This distance can be adaptively adjusted according to actual installation requirements and pipeline connection space. In terms of connection and fixing, both the inlet liquid collection section 120 and the return liquid collection section 130 are fixedly connected to the top end face of the cooling tank 111 via a detachable connection structure or an integrally formed structure.

[0027] Specifically, one or more first heat exchange channels 140 are provided, and multiple first heat exchange channels 140 are connected in parallel between the liquid inlet collection section 120 and the liquid return collection section 130.

[0028] In one embodiment, the first heat exchange channel 140 includes an annular channel unit 141 and a connecting pipe 142; the annular channel unit 141 forms a hydrodynamic cavity; the connecting pipe 142 connects the annular channel unit 141 with the liquid inlet collection section 120 and the liquid return collection section 130.

[0029] In the above embodiments, the structure of the annular flow channel unit 141 not only naturally forms a hydrodynamic cavity to accommodate the air-cooled module 150, providing a stable and reasonable installation space for the air-cooled module 150, but also allows the coolant to form a more uniform circulation within the flow channel, reducing heat exchange dead zones caused by uneven local flow rates and effectively reducing the flow resistance of the coolant. The connecting pipe 142 can precisely connect the annular flow channel unit 141 to the inlet collection part 120 and the return collection part 130, ensuring that the coolant can smoothly enter and exit the annular flow channel, avoiding pressure loss caused by poor flow channel connection. Ultimately, while ensuring the stability of the liquid cooling cycle, it fully leverages the synergistic heat dissipation effect of air cooling and liquid cooling. Furthermore, through the modular design of the annular flow channel unit 141 and the connecting pipe 142, the power function unit and the connecting pipe 142 are clearly separated, facilitating manufacturing, assembly, and maintenance. This achieves efficient synergy and integration of liquid cooling and enhanced air cooling within a limited space.

[0030] In a specific implementation, the first heat exchange channel 140 includes one or more annular channel units 141, and the multiple annular channel units 141 are connected in series through connecting pipes 142.

[0031] In this embodiment, as Figure 2 As shown, the first heat exchange channel 140 includes two annular channel units 141, and the connecting pipe 142 includes a first connecting pipe 1421, a second connecting pipe 1422, and a third connecting pipe 1423. One end of the first connecting pipe 1421 is connected to the first outlet 121 of the liquid inlet collection section 120, and the other end is connected to the inlet of one annular channel unit 141. One end of the second connecting pipe 1422 is connected to the outlet of another annular channel unit 141, and the other end is connected to the first inlet of the liquid return collection section 130. One end of the third connecting pipe 1423 is connected to the outlet of one annular channel unit 141, and the other end is connected to the inlet of another annular channel unit 141.

[0032] In another embodiment of this invention, when the first heat exchange channel 140 includes an annular channel unit 141, the connecting pipe 142 includes a first connecting pipe 1421 and a second connecting pipe 1422; one end of the first connecting pipe 1421 is connected to the first outlet 121 of the liquid inlet collection section 120, and the other end is connected to the inlet of the annular channel unit 141; one end of the second connecting pipe 1422 is connected to the outlet of the annular channel unit 141, and the other end is connected to the first inlet of the liquid return collection section 130.

[0033] Specifically, the annular flow channel unit 141 is a hollow cylindrical structure.

[0034] In one embodiment, such as Figure 5 As shown, the air-cooled module 150 includes a power impeller 151 and a heat dissipation fan blade 152; the power impeller 151 is rotatably disposed in the fluid dynamic cavity; the heat dissipation fan blade 152 is linked with the power impeller 151 and is located outside the annular flow channel unit 141.

[0035] In the above embodiment, the power impeller 151 is rotatably mounted within the fluid dynamic cavity, directly utilizing the kinetic energy of the coolant flow within the first heat exchange channel 140 to drive its own rotation. Without the need for additional motors or other power components, it directly converts the waste energy of the liquid cooling system into the mechanical rotation of the cooling fan blades 152, achieving autonomous and efficient coordinated heat dissipation from liquid cooling to air cooling. This reduces both energy consumption and system failure points. The linked cooling fan blades 152 are located outside the annular flow channel unit 141 and rotate synchronously with the power impeller 151, quickly removing heat from the annular flow channel unit 141 and its surrounding area, enhancing convective heat transfer and achieving real-time linkage between liquid cooling and air cooling. This not only ensures heat dissipation efficiency but also simplifies the overall system layout and control logic. Furthermore, functional separation optimizes the working environment of each component, enabling the entire system to improve overall heat dissipation capacity and energy utilization efficiency with zero additional energy consumption.

[0036] In one embodiment, the air-cooled module 150 further includes a drive shaft 153, which is connected between the power impeller 151 and the cooling fan blades 152.

[0037] In the above embodiment, by setting the drive shaft 153 to directly connect the power impeller 151 and the cooling fan blades 152, the rotational kinetic energy generated by the power impeller 151 driven by the coolant is stably and losslessly transmitted to the cooling fan blades 152, ensuring that the two are synchronized and avoiding the problem of insufficient speed of the cooling fan blades 152 and reduced heat dissipation efficiency due to poor power transmission. This not only ensures the shortest power conversion path and maximizes efficiency, but also simplifies the overall structure by integrating the rotating components into a single shaft system, improving the operational stability, mechanical strength and service life of the air-cooled module 150. Furthermore, by utilizing the length and installation position design of the drive shaft 153, the distance between the cooling fan blades 152 and the annular flow channel unit 141 can be flexibly adjusted, allowing the cooling fan blades 152 to accurately act on the area that needs cooling, while avoiding interference with the flow channel unit, further improving the stability of the air-cooled module 150 during installation and operation.

[0038] In one embodiment, a sealed bearing 154 is provided on the wall of the annular flow channel unit 141, and the drive shaft 153 is rotatably supported by the sealed bearing 154.

[0039] In the above embodiment, a sealed bearing 154 is provided on the wall of the annular flow channel unit 141 to support the drive shaft 153, which can simultaneously ensure transmission stability and flow channel sealing, further improving system reliability. The sealed bearing 154 can provide stable support for the drive shaft 153, preventing it from shifting or shaking during rotation, and ensuring that the power impeller 151 and the cooling fan blades 152 always maintain synchronous and smooth linkage; at the same time, the sealing characteristics of the sealed bearing 154 can prevent the coolant inside the annular flow channel unit 141 from leaking from the shaft hole, preventing the decrease in heat dissipation efficiency or system failure caused by coolant loss, making the process of liquid cooling and air cooling combined heat dissipation more stable and durable.

[0040] In a specific implementation, the fluid power cavity is a hollow cavity formed inside the annular flow channel unit 141, the outline of which is adapted to the outer peripheral outline of the power impeller 151, and there is a certain gap between the two to ensure power conversion efficiency.

[0041] Specifically, the power impeller 151 is disposed in the hydrodynamic cavity of the annular flow channel unit 141; the drive shaft 153 extends vertically, with its upper end fixed to the center of the bottom surface of the power impeller 151, and its lower end extending through the annular flow channel unit 141 to the outside. The cooling fan blade 152 is disposed below the annular flow channel unit 141, with its center fixedly connected to the lower end face of the drive shaft 153. The connection method can be welding or bolt fastening, so that the cooling fan blade 152 can rotate synchronously with the drive shaft 153, thereby achieving the heat dissipation function through air convection.

[0042] Specifically, to achieve sealed support for the drive shaft 153, a through-hole is provided on the bottom surface of the annular flow channel unit 141. This through-hole is a circular through hole, the inner diameter of which matches the outer diameter of the outer ring of the sealed bearing 154. The outer ring of the sealed bearing 154 is fixedly connected to the through-hole by an interference fit or a retaining ring positioning method, while the inner ring of the bearing forms an interference fit with the outer circumferential surface of the drive shaft 153. This ensures that the drive shaft 153 can rotate flexibly, and also prevents the coolant in the hydrodynamic chamber from leaking along the gap between the drive shaft 153 and the through-hole through the sealing structure of the sealed bearing 154.

[0043] Specifically, when the device is in operation, the coolant is distributed through the inlet collector 120 and flows into the hydrodynamic chamber inside the annular flow channel unit 141. The high-speed flowing coolant generates a continuous impact force on the blades of the power impeller 151. Driven by this impact force, the power impeller 151 rotates along the axis of the drive shaft 153. Since the bottom surface of the power impeller 151 is fixedly connected to the upper end of the drive shaft 153, the two form a rigid linkage structure, so the drive shaft 153 rotates synchronously with the power impeller 151. The outer ring of the sealed bearing 154 is fixedly connected to the through-hole on the bottom surface of the annular flow channel unit 141, providing support for the drive shaft 153; its inner ring is interference-fitted with the drive shaft 153, which not only ensures the degree of rotational freedom, but also prevents the coolant in the hydrodynamic chamber from leaking outward along the gap between the drive shaft 153 and the through-hole through the sealing structure of the sealed bearing 154, thus achieving a dynamic sealing effect.

[0044] Furthermore, the lower end face of the drive shaft 153 is fixedly connected to the center of the cooling fan blade 152. When the drive shaft 153 rotates, the cooling fan blade 152 rotates at high speed, and its blades push the surrounding air to form a directional airflow. This airflow acts directly on the bottom surface of the device to be cooled 200 and the outer wall of the annular flow channel unit 141, accelerating heat transfer through forced convection: the airflow can not only quickly remove the radiant heat from the surface of the device to be cooled 200, but also form a secondary heat exchange with the coolant flowing through the annular flow channel unit 141 when it flows through the outer wall of the annular flow channel unit 141, thereby enhancing the heat dissipation efficiency of the liquid cooling system.

[0045] Specifically, the power impeller 151 and the cooling fan blades 152 are mechanically linked through the drive shaft 153. The driving force of the entire air-cooled module 150 comes entirely from the kinetic energy of the coolant flow, eliminating the need for additional power sources such as motors, thus reducing system complexity and energy consumption. Meanwhile, the sealed bearing 154 ensures the sealing of the fluid dynamic chamber, effectively preventing coolant leakage from affecting the operational safety of the device.

[0046] In one embodiment, a second heat exchange channel 160 is further included, which is arranged in parallel with the first heat exchange channel 140 and connected between the liquid inlet collection section 120 and the liquid return collection section 130.

[0047] In the above embodiment, the second heat exchange channel 160 is connected in parallel with the first heat exchange channel 140 to the liquid inlet collection section 120 and the liquid return collection section 130, which can simultaneously divert coolant to cool different areas or heat-generating components, thereby expanding the heat dissipation coverage while avoiding the risk of heat dissipation failure caused by blockage of a single channel.

[0048] In a specific embodiment, the second heat exchange channel 160 and the first heat exchange channel 140 are configured to directly physically contact the bottom of the device to be cooled 200. Preferably, the upper surfaces of the second heat exchange channel 160 and the first heat exchange channel 140 together form a flat heat exchange plane, which is in close contact with the bottom surface of the device to be cooled 200.

[0049] In the description of the embodiments of this application, it should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0050] Specifically, the arrangement of the second heat exchange channel 160 and the first heat exchange channel 140 in close contact with the bottom of the device to be cooled 200 minimizes the path of heat transfer from the device to be cooled 200 to the coolant. During operation, the heat generated by the device to be cooled 200 can be rapidly conducted to the coolant flowing within the second heat exchange channel 160 and the first heat exchange channel 140 through this direct contact interface without needing to pass through complex multi-layer interfaces. This reduces contact thermal resistance and overall heat transfer thermal resistance, thereby achieving efficient and rapid heat exchange between the device to be cooled 200 and the coolant.

[0051] As a preferred embodiment, to ensure the best contact effect, the bottom surface of the heat dissipation device 200 and / or the upper contact surface between the second heat exchange channel 160 and the first heat exchange channel 140 can be polished or milled for fine processing to improve the surface flatness, reduce micro air gaps, and further optimize heat transfer efficiency.

[0052] In a preferred embodiment, a high-performance thermally conductive material is filled between the contact interface between the heat dissipation device 200 and the second heat exchange channel 160 and the first heat exchange channel 140 to fill microscopic unevenness, thereby achieving efficient and reliable heat transfer while ensuring the lowest interfacial thermal resistance.

[0053] Specifically, the inlet of the second heat exchange channel 160 is connected to the liquid inlet collection section 120, and the outlet of the second heat exchange channel 160 is connected to the liquid return collection section 130. The inlet of the first heat exchange channel 140 is connected to the liquid inlet collection section 120, and the outlet of the first heat exchange channel 140 is connected to the liquid return collection section 130. During operation, the coolant is diverted from the liquid inlet collection section 120 and enters the second heat exchange channel 160 and the first heat exchange channel 140 respectively. After absorbing the heat transferred by the heat dissipation device 200, it converges to the liquid return collection section 130.

[0054] In one embodiment of this invention, the inlet collection section 120 and the return collection section 130 are two independent and side-by-side collection box structures. Each collection box has an independent cavity; one serves as the inlet collection section 120, receiving the low-temperature coolant input from the coolant source 110 and distributing it to the second heat exchange channel 160 and the first heat exchange channel 140; the other serves as the return collection section 130, collecting the high-temperature coolant after heat exchange in the second heat exchange channel 160 and the first heat exchange channel 140, and guiding it back to the coolant source 110 for cooling. By arranging the two collection boxes side-by-side, the independent functions of each box are maintained while reducing the space occupied by the overall structure, facilitating arrangement in limited installation environments.

[0055] In another embodiment of this invention, the liquid inlet collection section 120 and the liquid return collection section 130 are two independent and spaced-apart chambers separated by a partition structure in a single-piece molded component. One chamber serves as the liquid inlet collection section 120, and the other chamber serves as the liquid return collection section 130. The second heat exchange channel 160 and the first heat exchange channel 140 are disposed between the two chambers. The single-piece molded structural design simplifies the assembly process of the heat dissipation device 100 and improves the structural stability between the liquid inlet collection section 120 and the liquid return collection section 130.

[0056] Specifically, one or more second heat exchange channels 160 can be configured. When there is only one second heat exchange channel 160, its inlet is directly connected to the liquid inlet collection section 120, and its outlet is connected to the liquid return collection section 130. The configuration of a single second heat exchange channel 160 is simple in structure and suitable for heat dissipation devices 200 with relatively low heat generation power and low requirements for heat dissipation efficiency.

[0057] In this embodiment, multiple second heat exchange channels 160 are configured, and these multiple second heat exchange channels 160 are connected in parallel between the liquid inlet collection section 120 and the liquid return collection section 130. The inlet of each second heat exchange channel 160 is independently connected to the liquid inlet collection section 120, and the outlet of each second heat exchange channel 160 is also independently connected to the liquid return collection section 130. When the coolant flows out of the liquid inlet collection section 120, it is diverted into each of the second heat exchange channels 160, flowing within the multiple second heat exchange channels 160 and exchanging heat with the bottom of the device to be cooled 200. Afterward, it flows into the liquid return collection section 130 from its respective outlet. This parallel design of multiple second heat exchange channels 160 effectively increases the contact area between the coolant and the device to be cooled 200, increasing the heat exchange per unit time, thereby improving heat dissipation efficiency. This design is suitable for devices 200 with high heat output. Meanwhile, the parallel arrangement allows the coolant flow in each of the second heat exchange channels 160 to be independent, which can avoid the overall heat dissipation function being affected by problems such as blockage of a single channel, and improve the reliability of the heat dissipation device 100.

[0058] Specifically, a plurality of first liquid outlets 121 are provided along the length of the side of the liquid inlet collecting section 120 near the liquid return collecting section 130. Correspondingly, a plurality of first liquid inlets are also provided along the length of the side of the liquid return collecting section 130 near the liquid inlet collecting section 120. The two ends of the second heat exchange channel 160 are respectively sealed and connected to a corresponding first liquid outlet 121 and a first liquid inlet.

[0059] Specifically, both the first liquid inlet and the first liquid outlet 121 are constructed as square openings.

[0060] In a specific embodiment, the inlet collection section 120, the return collection section 130, the first heat exchange channel 140, and the second heat exchange channel 160 are all made of copper. This fully utilizes copper's excellent thermal conductivity, reducing resistance during heat transfer and accelerating the transfer of heat from the heat-dissipating device 200 to the coolant. This effectively improves the overall heat dissipation performance of the heat dissipation device 100, ensuring stable operation of the heat-dissipating device 200 at a suitable temperature. Furthermore, copper has good machinability, facilitating the fabrication of the required channel structure and collection section shape through forging, stamping, and welding processes to meet structural design requirements in different scenarios. Simultaneously, copper has a certain degree of corrosion resistance, allowing it to withstand the environmental impact of long-term coolant flow and ensuring the service life of the heat dissipation device 100.

[0061] In one embodiment, the coolant source 110 includes a cooling tank 111 and a refrigeration assembly 112; the refrigeration assembly 112 is installed in the cooling tank 111.

[0062] In the above embodiments, by setting the cooling tank 111 as a storage container for coolant, the system can be ensured to have a sufficient supply of coolant circulation, avoiding heat dissipation interruption due to insufficient coolant; the refrigeration component 112 is installed in the cooling tank 111, which can directly cool the coolant in the tank, so that the coolant entering the heat exchange channel is always kept at a low temperature, thereby improving the efficiency of subsequent liquid cooling heat exchange from the source, and at the same time, it does not need to rely on an external cold source, making the entire heat dissipation system more independent and adaptable.

[0063] In a specific implementation, the cooling tank 111 is equipped with coolant.

[0064] Specifically, the coolant is selected from heat-conducting media with high specific heat capacity, low viscosity and good thermal stability, such as ethylene glycol aqueous solution or special electronic coolant, in order to improve heat exchange efficiency and avoid freezing at low temperature or deterioration at high temperature.

[0065] In one embodiment, the cooling box 111 is provided with a mounting groove 1111, and the cooling assembly 112 includes a semiconductor cooler 1121, which is mounted in the mounting groove 1111.

[0066] In the above embodiment, a mounting groove 1111 is provided in the cooling box 111 and the semiconductor cooler 1121 is embedded therein. The mounting groove 1111 allows the semiconductor cooler 1121 to form a closer contact with the cooling box 111, shortens the heat transfer path, and makes the cooling capacity generated by the cooling component 112 more efficiently transferred to the coolant in the box, thereby improving the cooling speed. At the same time, the embedded installation does not require additional brackets for fixation, which can reduce the space occupied by the cooling component 112, optimize space utilization, make the overall structure of the coolant source 110 more compact, adapt to more installation scenarios, and reduce the risk of component loosening or displacement, thus ensuring the stability of the cooling effect.

[0067] In a specific implementation, a tight thermally conductive contact is achieved between the cold end face of the semiconductor cooler 1121 and the outer wall of the cooling tank 111. When the semiconductor cooler 1121 is powered on, its cold end face rapidly absorbs heat. This cooling energy is efficiently transferred to the wall of the cooling tank 111, which is in direct or indirect contact with the cold end face, through heat conduction, thereby continuously and actively cooling the coolant stored inside the cooling tank 111.

[0068] Preferably, the cooling assembly 112 further includes a cooling fan 1122, which is fixedly installed on the side of the thermoelectric cooler 1121 facing away from the cooling box 111, i.e., directly facing the hot end of the thermoelectric cooler 1121. When the thermoelectric cooler 1121 is working, its cold end absorbs heat from the coolant while its hot end releases a greater amount of heat. If this heat cannot be dissipated to the surrounding environment in a timely and effective manner, the temperature of the hot end will rise sharply, significantly reducing the cooling efficiency of the thermoelectric cooler 1121 and potentially causing damage due to overheating. Therefore, in this embodiment, by setting up the cooling fan 1122, forced convection is used to accelerate the airflow at the hot end of the thermoelectric cooler 1121, quickly dissipating the heat generated at the hot end to the external environment, effectively maintaining the temperature difference between the two ends of the thermoelectric cooler 1121, and preventing a decrease in cooling efficiency due to overheating of the hot end. Simultaneously, the cooling fan 1122 also reduces the workload of the thermoelectric cooler 1121, reduces energy loss, and further improves the heat dissipation efficiency and operational stability of the entire coolant source 110. In practical applications, the cooling fan 1122 can be a speed-adjustable fan, which automatically adjusts its speed according to the hot end temperature of the semiconductor cooler 1121, taking into account both heat dissipation effect and noise control.

[0069] Specifically, to meet the overall heat dissipation requirements of the cooling box 111 and ensure uniform temperature distribution of the coolant inside the cooling box 111, multiple cooling components 112 are evenly arranged along the length of the side wall where the cooling components 112 are installed. The spacing between each cooling component 112 is designed according to the length of the side wall of the cooling box 111, the heat generation power of the device 200 to be cooled, and its distribution, so as to achieve full-coverage cooling of the side wall of the cooling box 111. When multiple cooling components 112 work simultaneously, a uniform cooling distribution area can be formed on the side wall of the cooling box 111, avoiding excessively high or low local coolant temperatures, ensuring the consistency of the overall coolant temperature, and thus keeping the cooling effect of each part of the device 200 to be cooled uniform, preventing stress damage to the device due to excessive local temperature differences. In addition, the arrangement of multiple cooling components 112 also has a redundancy backup function. When one cooling component 112 fails, the remaining cooling components 112 can continue to work, ensuring the basic heat dissipation capacity of the coolant source 110 and improving the reliability and fault tolerance of the entire heat dissipation system.

[0070] In one embodiment, such as Figure 4 As shown, the heat dissipation device 100 also includes an infusion assembly 170, which includes a power pump 171 and an infusion line 172; one end of the infusion line 172 is connected to the outlet end of the power pump 171, and the other end is sealed to the inlet collection part 120.

[0071] In the above embodiment, by providing a power pump 171, a stable flow force can be actively provided for the coolant, ensuring that the coolant overcomes system flow resistance and is smoothly transported from the cooling tank 111 to the inlet collection section 120, where it continuously circulates in a closed loop including parallel flow channels. This effectively avoids the problem of slow coolant flow rate and low heat dissipation efficiency in the heat exchange channels caused by insufficient natural flow force. Simultaneously, the two ends of the delivery pipeline 172 are sealed to the outlet end of the power pump 171 and the inlet collection section 120, respectively, preventing coolant leakage during delivery. This avoids coolant loss and its impact on surrounding components, while also ensuring the stability of the system's operating pressure and flow rate.

[0072] In a specific embodiment, the liquid inlet manifold 120 is provided with a second liquid inlet for receiving coolant; the power pump 171 is a submersible pump, installed inside the cooling tank 111. The built-in design of the power pump 171 not only reduces external vibration and noise but also reduces external piping connections, lowering the size of the heat dissipation device 100 and the risk of coolant leakage. Specifically, the type of submersible pump includes, but is not limited to, DC submersible pumps and AC submersible pumps. One end of the liquid delivery pipeline 172 is connected to the outlet end of the submersible pump, and the other end passes through the outlet of the cooling tank 111 and is sealed to the second liquid inlet of the liquid inlet manifold 120.

[0073] Specifically, the outlet of the cooling tank 111 is equipped with a sealing structure such as a rubber gasket to ensure that the infusion line 172 will not leak when it passes through. The connection between the infusion line 172 and the second inlet is sealed, for example by threaded connection, clamp connection or the use of sealant, to prevent coolant leakage and ensure the long-term stable operation of the heat dissipation device 100.

[0074] Specifically, the coolant is stored in the cooling tank 111. After the submersible pump is started, the coolant is drawn from inside the cooling tank 111 and delivered to the second inlet of the inlet manifold 120 through the liquid delivery line 172. The inlet manifold 120 then distributes the coolant to the second heat exchange channel 160 and the first heat exchange channel 140. The entire system has a compact structure, good sealing performance, and improves cooling efficiency and reliability.

[0075] In a specific implementation, during the coolant supply stage, a power pump 171 is connected to the cooling tank 111 to provide the power source for coolant flow. When the system starts, the power pump 171 begins operation, drawing out the coolant stored in the cooling tank 111 and pumping it stably into the inlet collection section 120 through the liquid delivery pipeline 172, where it undergoes subsequent diversion processing. During the coolant return stage, the return collection section 130 is provided with at least one second outlet, which is used to discharge the coolant collected in the return collection section 130 after heat dissipation circulation. The cooling tank 111 is provided with a return port, which is fluidly connected to the second outlet of the return collection section 130 through a return pipeline 190, thereby establishing a circulation path for coolant to return from the return collection section 130 to the cooling tank 111, achieving coolant recycling.

[0076] In a preferred embodiment, multiple return pipes 190 are configured, with one end of each return pipe 190 independently connected to a second outlet on the return liquid collection section 130, and the other end connected to a return liquid port on the cooling tank 111. This one-to-one connection effectively avoids uneven distribution of coolant during the return process, ensuring that the coolant returns to the cooling tank 111 uniformly and efficiently, thus improving the overall efficiency of the circulation system.

[0077] Furthermore, the return pipe 190 is connected to the corresponding second outlet and return port by a sealed connection, such as by flange connection, threaded seal or rubber sealing ring, to prevent coolant leakage and ensure the airtightness and reliability of the heat dissipation device 100.

[0078] In one embodiment, a temperature control module is also included, which includes a temperature sensor 181 and a temperature controller 182. The temperature sensor 181 is used to monitor the temperature of the heat dissipation device 200. The temperature controller 182 is communicatively connected to the temperature sensor 181, the cooling assembly 112 and the power pump 171, and controls the operation of the cooling assembly 112 and the power pump 171 according to the temperature data of the temperature sensor 181.

[0079] In the above embodiments, the temperature control module is designed so that the temperature sensor 181 can monitor the temperature of the device to be cooled 200 in real time, providing accurate temperature basis for system adjustment and avoiding blind heat dissipation; the temperature controller 182, through communication connection with the temperature sensor 181, the cooling component 112 and the power pump 171, can automatically control the cooling intensity of the cooling component 112 and the operating status of the power pump 171 according to the monitored temperature data. When the temperature is high, it can enhance cooling and increase the flow rate of coolant to enhance heat dissipation; when the temperature is low, it can reduce the cooling power or slow down the flow rate to save energy consumption, so that the heat dissipation system always operates in a state that meets the temperature requirements of the device, ensuring the stable operation of the device to be cooled 200 and avoiding energy waste, realizing a dynamic balance between heat dissipation performance and energy efficiency optimization, and improving the intelligence level, environmental adaptability and operating economy of the entire heat dissipation device 100.

[0080] In a specific implementation, the temperature controller 182 is installed on the return liquid collection section 130.

[0081] In a specific embodiment, a fixing plate 183 is fixedly connected to the side of the return liquid collection section 130 near the inlet liquid collection section 120, and the temperature sensor 181 is fixed on the fixing plate 183. During installation, it should be ensured that the sensing end of the temperature sensor 181 is in close contact with the bottom surface of the device to be cooled 200. It is preferable to apply high-performance thermally conductive silicone grease between them to minimize the contact thermal resistance, thereby accurately sensing the actual operating temperature of the device to be cooled 200.

[0082] In a specific implementation, the fixing plate 183 and the cooling box 111 are spaced apart, physically not in contact, and maintain a predetermined gap. It is understood that if the fixing plate 183 is too close to or in direct contact with the low-temperature cooling box 111, the low temperature of the cooling box 111 will significantly affect the local temperature field of the fixing plate 183 through the solid-state heat conduction path. This low-temperature interference will be transmitted to the temperature sensor 181 on the fixing plate 183, causing its measurement value to be too low and unable to accurately reflect the heating status of the device 200 to be cooled, which may lead to misjudgment and malfunction of the temperature control system.

[0083] Specifically, by spacing the fixing plate 183 from the cooling box 111, the interference path caused by the low temperature of the cooling box 111 to the fixing plate 183 and the temperature sensor 181 through heat conduction is effectively cut off from the physical structure. This ensures that the temperature signal sensed by the temperature sensor 181 comes purely or mainly from the heat of the device to be cooled 200 itself, greatly improving the independence and accuracy of temperature detection.

[0084] The specific working principle and usage method of this application are as follows:

[0085] During operation, the temperature of the device to be cooled 200 is monitored in real time by the temperature sensor 181. When the detected temperature reaches the preset threshold of the temperature controller 182, the temperature controller 182 simultaneously sends an electrical signal to start the power pump 171 and the thermoelectric cooler 1121. The thermoelectric cooler 1121 then starts operating, actively cooling the coolant inside the cooling tank 111 to lower its temperature. Simultaneously, the power pump 171 starts, pumping the cooled coolant from the cooling tank 111 through the liquid delivery line 172 and delivering it to the inlet collection section 120 at the end of the liquid delivery line 172. The coolant is distributed in the inlet collection section 120 and flows into the second heat exchange channel 160 and the first heat exchange channel 140 for multi-stage distribution. The second heat exchange channel 160 and the first heat exchange channel 140 directly contact the device to be cooled 200, efficiently absorbing and removing the heat generated by it through liquid cooling. After heat exchange is completed, the cooled liquid, which has increased in temperature, will collect in the return collection section 130 and then return to the cooling tank 111 via the return pipe 190. At this point, the coolant has completed a complete cycle and will be cooled again in the cooling tank 111 to prepare for the next heat dissipation operation, thus realizing the closed-loop circulation and continuous utilization of the coolant.

[0086] In the liquid cooling circulation path, when the coolant flows through the hydrodynamic chamber within the annular flow channel unit 141, the flow of the coolant generates an impact force that directly acts on the power impeller 151. The power impeller 151 converts the fluid kinetic energy of the coolant into mechanical energy, thereby driving the drive shaft 153 to rotate stably. The rotational motion of the drive shaft 153 is further transmitted to the cooling fan blades 152, driving the cooling fan blades 152 to rotate and generate cooling airflow, performing air cooling heat dissipation on the bottom of the heat dissipation device 200. By combining active liquid cooling and passive air cooling, the two work together to improve the overall heat dissipation efficiency of the heat dissipation device 200.

[0087] According to an embodiment of the present invention, in another aspect, an electronic device is also provided, including a heat-dissipating device 200 and the aforementioned heat dissipation device 100; as Figure 1 As shown, the heat dissipation device 100 and the device to be cooled 200 are thermally connected.

[0088] Specifically, electronic devices include, but are not limited to, servers, on-board power supplies for new energy vehicles, and high-power power supplies for industrial automation.

[0089] Specifically, the device to be cooled 200 includes, but is not limited to, the power board body, chips, etc.

[0090] The above provides a detailed description of a heat dissipation device 100 and an electronic device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A heat dissipation device, characterized in that, include: Coolant source (110); The liquid inlet collection section (120) is connected to the outlet of the coolant source (110); The return liquid collection section (130) is connected to the return liquid port of the coolant source (110); The first heat exchange channel (140) is connected between the liquid inlet collection section (120) and the liquid return collection section (130); and a fluid dynamic cavity is formed inside the first heat exchange channel (140); An air-cooled module (150) is rotatably mounted in the hydrodynamic chamber; The coolant source (110) includes: Cooling box (111); A refrigeration assembly (112) is installed in the cooling box (111). The cooling box (111) is provided with a mounting groove (1111), and the refrigeration assembly (112) includes a semiconductor cooler (1121), which is mounted in the mounting groove (1111). It also includes an infusion assembly (170), which comprises: Power pump (171); The infusion line (172) is connected at one end to the outlet end of the power pump (171) and at the other end to the inlet collection part (120) in a sealed connection. It also includes a temperature control module, which includes: A temperature sensor (181) is used to monitor the temperature of the device (200) to be cooled; The thermostat (182) is communicatively connected to the temperature sensor (181), the refrigeration assembly (112) and the power pump (171), and controls the operation of the refrigeration assembly (112) and the power pump (171) according to the temperature data of the temperature sensor (181); The thermostat (182) is connected in communication with the temperature sensor (181), the refrigeration component (112) and the power pump (171). Based on the monitored temperature data, it automatically controls the cooling intensity of the refrigeration component (112) and the operating status of the power pump (171). When the temperature is high, it enhances the cooling and increases the flow rate of the coolant to strengthen heat dissipation. When the temperature is low, it reduces the cooling power or slows down the flow rate to save energy, so that the heat dissipation system always operates in a state that meets the temperature requirements of the adapter components.

2. The heat dissipation device according to claim 1, characterized in that, The first heat exchange channel (140) includes: The annular flow channel unit (141) forms the fluid dynamic cavity inside; Connecting pipe (142) connects the annular flow channel unit (141) to the liquid inlet collection section (120) and the liquid return collection section (130).

3. The heat dissipation device according to claim 2, characterized in that, The air-cooled module (150) includes: A power impeller (151) is rotatably disposed within the hydrodynamic chamber; The cooling fan blades (152), linked with the power impeller (151), are located outside the annular flow channel unit (141).

4. The heat dissipation device according to claim 3, characterized in that, The air-cooled module (150) also includes a drive shaft (153), which is connected between the power impeller (151) and the heat dissipation fan blades (152); A sealed bearing (154) is provided on the wall of the annular flow channel unit (141), and the drive shaft (153) is rotatably supported by the sealed bearing (154).

5. The heat dissipation device according to any one of claims 1 to 4, characterized in that, It also includes a second heat exchange channel (160), which is arranged in parallel with the first heat exchange channel (140) and connected between the liquid inlet collection section (120) and the liquid return collection section (130).

6. An electronic device, characterized in that, include: Device to be cooled (200); The heat dissipation device (100) according to any one of claims 1 to 5 is thermally connected with the heat dissipation device (200).

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