Electroplating carrier, electroplating device, electroplating method, solar cell and photovoltaic module

Abstract

The invention relates to the technical field of solar cell electroplating devices, in particular to an electroplating carrier, an electroplating device, an electroplating method, a solar cell and a photovoltaic module. The electroplating carrier comprises a first mold assembly and a second mold assembly, wherein the second mold assembly comprises a first frame and a first conductive strip; an area limited by the inner side edge of the first frame is a hollow area. The first conductive strip is arranged on the first frame in a surrounding mode, and at least one surface of the first conductive strip is exposed. Wherein the second mold assembly is movably connected with the first mold assembly and has a mold closing position and a separation position, and the second mold assembly and the first mold assembly in the mold closing position clamp the solar cell. The first frame is configured to cover the edge area, the hollow area is configured to expose the to-be-electroplated area, and the first conductive strip is configured to make contact with the edge area to form annular contact. The first conductive strips conduct electricity to the electroplating area around the electroplating area, and the electric field intensity uniformity is improved.

Description

Technical Field

[0001] This application relates to the field of solar cell electroplating technology, and more particularly to electroplating carriers, electroplating apparatus, electroplating methods, solar cells and photovoltaic modules. Background Technology

[0002] Electroplating is one of the processes in solar cell production; for example, it can be used to create the electrodes for solar cells. However, when using current electroplating equipment to electroplat solar cells, problems such as poor uniformity of the metal layer thickness on the solar cell surface often occur, making it imperative to further optimize the performance of solar cells. Summary of the Invention

[0003] This application discloses an electroplating carrier, an electroplating apparatus, an electroplating method, a solar cell, and a photovoltaic module, which can improve the uniformity of the electric field intensity during electroplating, thereby improving the uniformity of the thickness of the electroplated metal layer.

[0004] To achieve the above objectives, in a first aspect, embodiments of this application disclose an electroplating carrier for manufacturing solar cells, the solar cells having a surface to be electroplated, the surface to be electroplated having a region to be electroplated and an edge region disposed around the edge of the region to be electroplated;

[0005] The electroplating carrier includes:

[0006] First module component; and

[0007] The second module assembly includes a first frame and a first conductive strip; the area defined by the inner edge of the first frame is a hollow area, the size of which is smaller than the size of the solar cell; the first conductive strip is arranged around the first frame and at least one surface of the first conductive strip is exposed.

[0008] The second module assembly is movably connected to the first module assembly and has a closed position and a separated position. The second module assembly in the closed position and the first module assembly clamp the solar cell. The first frame is configured to cover the edge area. The hollow area is configured to expose the area to be electroplated. The first conductive strip is configured to contact the edge area to form an annular contact.

[0009] In one possible implementation of the first aspect, the surface to be electroplated further has a region to be segmented, the region to be segmented traversing the region to be electroplated;

[0010] The second module assembly further includes a plurality of second conductive strips, which are disposed on the first frame and span the hollow area, with at least one surface of the second conductive strips being exposed;

[0011] When the second module assembly is in the mold-closing position, the second conductive strip is configured to contact the area to be divided to form continuous contact.

[0012] In one possible implementation of the first aspect, the second module assembly further includes an insulating wrapping element, the second conductive strip being embedded in the insulating wrapping element on the side opposite to the first module assembly, and the surface of the second conductive strip facing the first module assembly being exposed.

[0013] And / or, the second conductive strip is a second flexible conductive strip.

[0014] In one possible implementation of the first aspect, the first frame is a waterproof, insulating, flexible frame, and when the second mold assembly is in the mold-closed position, the insulating, flexible frame is configured to be pressed against the edge region and elastically deformed.

[0015] In one possible implementation of the first aspect, the second module component further includes a rigid second frame that surrounds the first frame and is connected to the outer edge of the first frame;

[0016] An external conductive component is provided on the second frame, and the external conductive component is configured to be electrically connected to the cathode of an external power source. The first conductive strip is connected to the external conductive component.

[0017] In a possible implementation of the first aspect, the surface to be electroplated further has a region to be segmented, the region to be segmented extending across the region to be electroplated; the second mold assembly further includes a plurality of second conductive strips, the second conductive strips being disposed on the first frame and spanning the hollowed-out region, at least one surface of the second conductive strips being exposed; when the second mold assembly is in the mold-closed position, the second conductive strips are configured to contact the region to be segmented to form continuous contact; the second conductive strips are connected to the external conductive component.

[0018] In one possible implementation of the first aspect, the external conductive element extends along one side of the second frame and is configured to be held in place by a conductive clamp of a horizontal electroplating apparatus and connected to the cathode of an external power source.

[0019] In one possible implementation of the first aspect, the second frame is provided with a plurality of insulating extensions on both opposite sides in the horizontal direction;

[0020] The extension includes a first extension segment and a second extension segment. The first extension segment extends along the horizontal direction and protrudes beyond the second frame. The horizontal direction intersects the conveying direction of the conductive conveying mechanism. The second extension segment is connected to the end of the first extension segment away from the second frame and extends upward. The external conductive member is connected to the end of the second extension segment away from the first extension segment and protrudes along the horizontal direction. The external conductive member is configured to be clamped in the conductive conveying mechanism and in contact with the conductive conveying mechanism.

[0021] In a possible implementation of the first aspect, the first module assembly includes an insulating template having a bearing surface, the bearing surface being the side of the template facing the second module assembly, the bearing surface being configured to adhere to the non-electroplated surface of the solar cell, the non-electroplated surface being the side of the solar cell opposite to the surface to be electroplated;

[0022] When the second module assembly is in the mold-closed position, the first frame abuts against the edge region of the solar cell on the support surface. The first frame is configured to apply pressure to the solar cell on the support surface through the edge region so that the unplated surface is in close contact with the support surface.

[0023] In one possible implementation of the first aspect, an insulating flexible material layer is provided on the bearing surface, the flexible material layer being configured to adhere to the entire unplated surface.

[0024] In one possible implementation of the first aspect, the flexible material layer has a boss that protrudes relative to the rest of the flexible material layer and is configured to conform to the entire unplated surface.

[0025] The first frame is a waterproof, insulated, flexible frame. When the second mold assembly is in the mold-closing position, the insulated, flexible frame is configured to abut against the edge area and apply pressure to the boss portion. The edge of the boss portion protrudes under pressure and abuts against the insulated, flexible frame.

[0026] In a possible implementation of the first aspect, the first frame is a waterproof, insulating, flexible frame, and the first conductive strip is a first flexible conductive strip configured to deform with the insulating, flexible frame.

[0027] And / or, the first conductive strip is embedded in the first frame on the side away from the first module assembly and the surface of the first conductive strip facing the first module assembly is exposed;

[0028] And / or, the size of the hollowed-out area is greater than or equal to the size of the area to be electroplated.

[0029] In one possible implementation of the first aspect, the electroplating carrier further includes a clamping mechanism disposed on the first mold assembly and / or the second mold assembly, the clamping mechanism being configured to clamp the first mold assembly with the second mold assembly switched to the mold closing position.

[0030] In a possible implementation of the first aspect, the fastening mechanism includes a rotating shaft and a fastening member, the rotating shaft being disposed on one side of the first mold assembly, and the fastening member swinging relative to the first mold assembly via the rotating shaft;

[0031] When the second mold assembly switches to the mold closing position, the latching member swings to a position where it engages with the second mold assembly;

[0032] The buckle swings to a position where it is separated from the second module assembly, and the second module assembly switches to the separated position.

[0033] In a possible implementation of the first aspect, the fastener has a snap-fit ​​arm and a pressing arm, one end of the pressing arm being connected to one end of the snap-fit ​​arm and the snap-fit ​​arm extending in a direction close to the second mold assembly while bending relative to the pressing arm, the connection between the pressing arm and the snap-fit ​​arm being connected to the pivot; the fastening mechanism further includes a first spring, one end of which is connected to the pressing arm, the pressing arm being configured to compress the first spring when pressed and drive the snap-fit ​​arm to swing to a position separated from the second mold assembly; the first spring is configured to, when rebounding, drive the snap-fit ​​arm to swing to a position engaging with the second mold assembly via the pressing arm; the end of the snap-fit ​​arm away from the first mold assembly is provided with a pressing slope, the pressing slope being inclined toward the direction of movement of the second mold assembly, the pressing slope being configured to press the snap-fit ​​arm when in contact with the second mold assembly, so that the snap-fit ​​arm swings to a position avoiding the second mold assembly;

[0034] And / or, a protruding second spring is provided on the surface of the first mold assembly near the second mold assembly, the second spring is compressed when the second mold assembly switches to the mold closing position, and the second spring is configured to rebound when it drives the second mold assembly to switch to the separation position.

[0035] Secondly, embodiments of this application disclose an electroplating apparatus, including an electroplating carrier as described in the first aspect.

[0036] In a possible implementation of the second aspect, the electroplating apparatus further includes a conductive conveying mechanism configured to convey the electroplating carrier and a cathode electrically connected to an external power source.

[0037] The second module is provided with an external conductive component, and the first conductive strip is connected to the external conductive component. The external conductive component is configured to contact the conductive conveying mechanism when the electroplating carrier is conveyed by the conductive conveying mechanism.

[0038] In a possible implementation of the second aspect, the second module assembly further includes a plurality of second conductive strips disposed on the first frame and spanning the hollow area, with at least one surface of the second conductive strip exposed; when the second module assembly is switched to the mold closing position, the second conductive strip is configured to contact the area to be divided to form continuous contact; the second conductive strip is connected to the external conductive component.

[0039] In a possible implementation of the second aspect, the conductive transmission mechanism has a clamping gap; the second module assembly is provided with a plurality of insulated extensions, the external conductive member is disposed on the extensions, and the extensions are configured to be clamped in the clamping gap so that the external conductive member contacts the conductive transmission mechanism.

[0040] In a possible implementation of the second aspect, the second module further includes a rigid second frame, which surrounds the first frame and is connected to the outer edge of the first frame; the second frame has a plurality of extensions on both opposite sides in the horizontal direction, the horizontal direction intersecting the conveying direction of the conductive conveying mechanism; there are two conductive conveying mechanisms, which are arranged opposite to each other in the horizontal direction, and the electroplating carrier is located between the two conductive conveying mechanisms during conveying; the plurality of extensions on both opposite sides of the second frame are respectively clamped in the clamping gap of the two conductive conveying mechanisms.

[0041] And / or, the electroplating apparatus further includes a plurality of rollers that contact the side of the first mold assembly opposite to the second mold assembly.

[0042] In a possible implementation of the second aspect, the conductive transmission mechanism includes a first conductive chain and a second conductive chain, the first conductive chain and the second conductive chain being arranged opposite each other in the vertical direction to form a strip-shaped clamping gap.

[0043] In a possible implementation of the second aspect, the hollowed-out area is arranged facing upwards so that the area to be electroplated comes into contact with the electroplating liquid falling from above the hollowed-out area, and a baffle structure is provided between the hollowed-out area and the conductive conveying mechanism, the baffle structure being configured to prevent the electroplating liquid from contacting the conductive conveying mechanism.

[0044] In a possible implementation of the second aspect, the extension includes a first extension segment and a second extension segment. The first extension segment extends along the horizontal direction and protrudes beyond the second frame. The horizontal direction intersects the conveying direction of the conductive conveying mechanism. The second extension segment is connected to the end of the first extension segment away from the second frame and extends upward. The external conductive member is connected to the end of the second extension segment away from the first extension segment and protrudes along the horizontal direction. The external conductive member is configured to be clamped in the conductive conveying mechanism and in contact with the conductive conveying mechanism.

[0045] The baffle structure includes an inner baffle and an outer baffle. The inner baffle is disposed on the side of the second extension section near the hollow area and located on the upper side of the first extension section. The outer baffle is disposed on the side of the second extension section away from the hollow area and located on the lower side of the external conductive component.

[0046] In a possible implementation of the second aspect, the electroplating apparatus further includes an electroplating solution container and an anode plate. The electroplating solution container is configured to store the electroplating solution, and the bottom of the electroplating solution container has an opening. The anode plate covers the opening and is configured to be electrically connected to the anode of an external power source. The anode plate is provided with a drain hole.

[0047] The second module assembly, which is conveyed on the conductive conveying mechanism, is located below the anode plate, and the first module assembly is located below the second module assembly. The hollow area is correspondingly arranged with respect to the drain hole.

[0048] In a possible implementation of the second aspect, the electroplating apparatus further includes an electroplating tank and a liquid inlet pump, wherein the electroplating tank defines an electroplating processing cavity;

[0049] The electroplating carrier is movably disposed on the upper part of the electroplating processing cavity, and the lower part of the electroplating processing cavity is configured to store the electroplating solution and recover the electroplating solution falling from the upper part of the electroplating processing cavity.

[0050] The inlet end of the inlet pump is connected to the lower part of the electroplating processing chamber, and the outlet of the inlet pump is connected to the electroplating solution container.

[0051] In a possible implementation of the second aspect, the second module assembly further includes a rigid second frame that surrounds the first frame and is connected to the outer edge of the first frame; the external conductive member extends along one side of the second frame.

[0052] The conductive transmission mechanism includes a conductive clamp configured to hold the external conductive component and a cathode electrically connected to the external power source.

[0053] Thirdly, embodiments of this application disclose an electroplating method for solar cells, wherein the electroplating method uses an electroplating carrier as described in the first aspect, or the electroplating method uses an electroplating apparatus as described in the second aspect;

[0054] The electroplating method includes the following steps:

[0055] The second module assembly switches to the mold-closing position and clamps the solar cell with the first module assembly; wherein, the surface to be electroplated is the side of the solar cell adjacent to the second module assembly; the first frame covers the edge area, the first conductive strip contacts the edge area to form an annular contact, and the first conductive strip is electrically connected to the cathode of the external power supply, and the hollow area exposes the area to be electroplated;

[0056] Electroplating is performed on the area to be electroplated in the solar cell; wherein the electroplating solution contacts the area to be electroplated through the hollow area, and the first conductive strip is electrically connected to the cathode of an external power source and energized.

[0057] In a possible third implementation, prior to the step of switching the second module assembly to the mold-closing position and clamping the solar cell with the first module assembly, the electroplating method further includes the following steps:

[0058] The solar cell is placed in the first module assembly by visual alignment;

[0059] The second module is positioned on the side of the solar cell away from the first module by visual alignment;

[0060] And / or, the step of switching the second module assembly to the mold-closing position to clamp the solar cell with the first module assembly further includes:

[0061] The second mold assembly is tightly fitted with the first mold assembly, with the hollowed-out area facing upwards; the surface to be electroplated also has a region to be divided, which extends across the region to be electroplated; the second mold assembly further includes a plurality of second conductive strips, which are disposed on the first frame and span the hollowed-out area, with at least one surface of each second conductive strip exposed; when the second mold assembly is in the mold-closed position, the second conductive strips are configured to contact the region to be divided to form continuous contact, and the second conductive strips are electrically connected to the cathode of the external power supply;

[0062] The step of electroplating the area to be electroplated on the solar cell includes:

[0063] The electroplating carrier is conveyed into the electroplating tank for electroplating; wherein the electroplating solution is stored in the electroplating tank and falls from above the hollow area to contact the area to be electroplated;

[0064] After the step of electroplating the area to be electroplated, the electroplating method further includes the following steps:

[0065] The electroplating carrier is transferred to the outside of the electroplating tank;

[0066] The second module assembly and the first module assembly are released from their tight fit;

[0067] The second module component switches to the separation position and separates from the first module component;

[0068] The solar cell is removed from the first module.

[0069] Fourthly, embodiments of this application disclose a solar cell, which includes a cell body and electrodes, wherein the electrodes are disposed on the surface of the cell body and connected to the cell body.

[0070] The electrode is made using an electroplating carrier as described in the first aspect, or the electrode is made using an electroplating apparatus as described in the second aspect, or the electrode is made by an electroplating method as described in the third aspect.

[0071] In a possible implementation of the fourth aspect, the battery body includes: a silicon substrate; an N-type doped semiconductor layer and a P-type doped semiconductor layer disposed on the back surface of the silicon substrate, wherein the N-type doped semiconductor layer and the P-type doped semiconductor layer are interdigitated.

[0072] The electrode includes a seed layer and an electroplated metal layer formed on the seed layer, and the seed layer is in conductive contact with the corresponding N-type doped semiconductor layer and the P-type doped semiconductor layer, respectively.

[0073] Fifthly, embodiments of this application disclose a photovoltaic module, including a plurality of solar cells connected in series and / or in parallel, wherein at least one solar cell is a solar cell as described in the fourth aspect.

[0074] Compared with the prior art, the beneficial effects of this application are: when the second mold assembly of the electroplating carrier is in the mold closing position, the solar cell is clamped between the second mold assembly and the first mold assembly for transfer, reducing the direct contact between the solar cell and the transfer mechanism during the transfer process, thereby reducing the damage to the solar cell caused by the transfer.

[0075] During the electroplating process, the area to be plated on the solar cell corresponds to the cut-out area, exposing the plating area so that the plating solution can contact the area to be plated through the cut-out area. A first frame covers the edge area, and a first conductive strip contacts the edge area, forming a ring-shaped contact around it. The first conductive strip conducts electricity around the area to be plated, improving the uniformity of the electric field strength and thus enhancing the uniformity of the plated metal layer thickness. During electroplating, no plated metal layer needs to be formed on the edge area, and the first conductive strip easily separates from the edge area after electroplating. Attached Figure Description

[0076] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0077] Figure 1 This is a schematic diagram of the structure of an electroplating carrier disclosed in an embodiment of this application (in a separated position);

[0078] Figure 2 This is a schematic diagram of the structure of an electroplating carrier disclosed in an embodiment of this application (in a separated position, showing the internal structure);

[0079] Figure 3 This is a schematic diagram of the structure of an electroplating carrier disclosed in an embodiment of this application (in the mold-closed position);

[0080] Figure 4 This is a top view (in the mold-closed position) of an electroplating carrier disclosed in an embodiment of this application;

[0081] Figure 5 It is along Figure 4 A sectional view of section AA shown in the figure;

[0082] Figure 6 yes Figure 5 A magnified view of region B in the image;

[0083] Figure 7 yes Figure 5 A magnified view of region C in the image;

[0084] Figure 8 This is a schematic diagram of the tight-fitting mechanism disclosed in the embodiments of this application;

[0085] Figure 9 yes Figure 8 A schematic diagram of the structure of the second mold component when it is in the mold-closed position;

[0086] Figure 10yes Figure 8 A schematic diagram of the structure when the pressing arm is in the pressed state;

[0087] Figure 11 yes Figure 5 A schematic diagram of the hidden structure;

[0088] Figure 12 This is a schematic diagram of the structure of an electroplating apparatus disclosed in an embodiment of this application;

[0089] Figure 13 yes Figure 12 A schematic diagram of the electroplating carrier in the diagram;

[0090] Figure 14A This is another structural schematic diagram of an electroplating apparatus disclosed in an embodiment of this application;

[0091] Figure 14B yes Figure 14A Exploded view;

[0092] Figure 14C yes Figure 14A A schematic diagram of the structure of the first and second conductive chains in the diagram;

[0093] Figure 14D yes Figure 14A Another structural schematic diagram of the first and second conductive chains in the process;

[0094] Figure 15 This is a schematic diagram of the structure of the electroplating apparatus disclosed in the embodiments of this application, which also includes an electroplating tank;

[0095] Figure 16 yes Figure 15 A magnified view of region D shown in the image;

[0096] Figure 17 This is another structural schematic diagram of the electroplating apparatus disclosed in the embodiments of this application, which also includes an electroplating tank;

[0097] Figure 18 This is a schematic diagram of the structure of a solar cell disclosed in an embodiment of this application.

[0098] Explanation of reference numerals in the attached figures:

[0099] 100. Electroplating carrier; 110. First mold assembly; 111. Template; 112. Bearing surface; 113. Flexible material layer; 1131. Boss; 114. Second spring; 120. Second mold assembly; 121. First frame; 122. First conductive strip; 123. Hollowed-out area; 124. Second conductive strip; 125. Insulating wrapping; 126. Second frame; 127. External conductive component; 128. Extension; 1281. First extension section; 1282. Second extension section; 130. Fitting mechanism; 131. Rotating shaft; 132. Buckling component; 1321. Snap-fit ​​swing arm; 1322. Pressing swing arm; 1323. Extrusion slope; 133. First spring; 200. Conductive transmission mechanism; 210. Clamping gap; 220. 221. First conductive chain; 222. First conductive slide rail; 223. First conductive wheel; 230. Second conductive shaft; 231. Second conductive slide rail; 232. Second conductive wheel; 233. Second conductive shaft; 300. Roller; 400. Baffle structure; 410. Inner baffle; 420. Outer baffle; 500. Electroplating solution container; 510. Anode plate; 511. Drain hole; 600. Electroplating tank; 610. Electroplating processing cavity; 620. Inlet pump; 700. External power supply; 800. Conductive clamp; 900. Solar cell; 910. Surface to be electroplated; 911. Area to be electroplated; 912. Edge area; 920. Non-electroplated surface; 930. Area to be segmented; 940. Electrode; 950. Battery body. Detailed Implementation

[0100] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0101] In this application, the terms "upper," "lower," "bottom," "inner," "outer," "vertical," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0102] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0103] Furthermore, the terms "set up," "equipped with," "connected," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0104] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0105] In the electroplating process of solar cells, the electroplating equipment uses conductive clamps, conductive brushes, or conductive rollers for conduction. Taking conductive rollers as an example, in horizontal electroplating, the solar cell is transferred between the upper and lower rollers. The transfer process of the above-mentioned electroplating equipment generally causes damage to the solar cell, and the conductive contact points with the solar cell are limited, the points of cathode current entry are limited, and the electric field distribution is poor, which in turn leads to the uniformity of the thickness of the electroplated metal layer.

[0106] Although solar cells can be transferred by fixing them with fixtures to protect them during electroplating, the conductive structure on the fixture is not designed for the structure of the solar cell. The contact position between the conductive structure and the solar cell is unreasonable, the uniformity of the electric field distribution is still poor, the uniformity of the thickness of the electroplated metal layer still needs to be improved, and the conductive structure is difficult to peel off from the solar cell after electroplating.

[0107] Based on the above analysis, this application provides an electroplating carrier that reduces damage to the solar cells during transport by sandwiching them between a second module and a first module. During electroplating, the area of ​​the solar cell to be plated corresponds to a cutout area, exposing the area to be plated and allowing the electroplating solution to contact it through the cutout area. A first conductive strip contacts the edge area, forming a ring-shaped contact around it. The first conductive strip conducts electricity around the area to be plated, improving the uniformity of the electric field strength and thus enhancing the uniformity of the electroplated metal layer thickness. During electroplating, no electroplated metal layer needs to be formed on the edge area, and the first conductive strip easily separates from the edge area after electroplating.

[0108] The technical solution of the present invention will now be described in conjunction with the embodiments and accompanying drawings.

[0109] Firstly, such as Figure 1 and Figure 2As shown in the illustration, this application discloses an electroplating carrier 100 for fabricating a solar cell 900, wherein the solar cell 900 referred to herein is a solar cell 900 to be electroplated. The solar cell 900 has a surface 910 to be electroplated, which has a region 911 to be electroplated and an edge region 912 surrounding the edge of the region 911. The term "surface 910 to be electroplated" refers to the surface of the solar cell 900 where electrodes need to be electroplated; specifically, the light-receiving surface and / or the backlighting surface of the solar cell 900. The term "region 911 to be electroplated" refers to the area on the surface 910 where electrodes need to be electroplated, and the term "edge region 912" is a non-functional area surrounding the region 911 where electrodes are not needed for electroplating.

[0110] Combination Figure 1 and Figure 2 The electroplating carrier 100 includes a first mold assembly 110 and a second mold assembly 120. The second mold assembly 120 includes a first frame 121 and a first conductive strip 122, which is, for example, a conductive metal strip or a conductive polymer strip. The area defined by the inner edge of the first frame 121 is a hollow area 123, the size of which is smaller than the size of the solar cell 900, so that the first frame 121 covers the edge area 912, and the first conductive strip 122 on the first frame 121 can contact the edge area 912 of the solar cell 900. When the solar cell 900 is square, it is preferable that the length and width of the hollow area 123 are both smaller than the size of the solar cell 900. The first conductive strip 122 is disposed around the first frame 121, and at least one surface of the first conductive strip 122 is exposed.

[0111] The second mold assembly 120 is movably connected to the first mold assembly 110 and has a mold-closing position and a mold-separating position, for example, in Figure 2 In the middle, when the second mold assembly 120 moves along the Z0-Z1 direction, it approaches the first mold assembly 110 and switches to the mold-closing position. The state of the second mold assembly 120 switching to the mold-closing position is as follows: Figure 3 As shown. Conversely, when the second module component 120 moves away from the first module component 110 along the Z0-Z1 direction, the separation position is switched. The Z0-Z1 direction can be either vertical or horizontal.

[0112] Further integration Figures 4 to 6As shown, the second mold assembly 120, in the closed position, clamps the solar cell 900 between the first mold assembly 110. In other words, when the second mold assembly 120 is in the separated position, the solar cell 900 can be removed between the second mold assembly 120 and the first mold assembly 110. The first frame 121 is configured to cover the edge region 912 of the solar cell 900, the cutout region 123 is configured to expose the electroplating region 911 of the solar cell 900, and the first conductive strip 122 is configured to contact the edge region 912 to form a ring contact. Please refer to... Figure 6 and Figure 8 The term "ring contact" refers to the fact that the exposed surface of the first conductive strip 122 is also ring-shaped, and the exposed surface of the ring contacts the edge region 912, thus forming a ring contact.

[0113] When the second mold assembly 120 of the electroplating carrier 100 is in the mold closing position, the solar cell 900 is sandwiched between the second mold assembly 120 and the first mold assembly 110 for transfer, reducing direct contact between the solar cell 900 and the transfer mechanism during the transfer process, thereby reducing damage to the solar cell 900 caused by the transfer.

[0114] During the electroplating process, the electroplating area 911 of the solar cell 900 corresponds to the hollow area 123, so that the electroplating area 911 of the solar cell 900 is exposed through the hollow area 123, allowing the electroplating solution to contact the electroplating area 911 through the hollow area 123. The first frame 121 covers the edge area 912, and the first conductive strip 122 contacts the edge area 912 to form a ring-shaped contact around the edge area 912. The first conductive strip 122 conducts electricity to the electroplating area 911 around its perimeter, improving the uniformity of the electric field strength, thereby improving the uniformity of the thickness of the electroplated metal layer. In addition, since the edge area 912 does not need to form an electroplated metal layer through electroplating, the first conductive strip 122 and the edge area 912 are easily separated after electroplating.

[0115] In the possible implementations of the first aspect, see the return. Figure 2 As shown, the surface 910 to be electroplated also has a region 930 to be divided, which extends across the region 911 to be electroplated. The term "region 930 to be divided" refers to the region used to divide the solar cell 900 into several sub-cells; the number of regions 930 to be divided can be one or more. For example, when cutting a solar cell into two half-cells, the following is set up... Figure 2 The area 930 shown is a strip-shaped region to be divided. For example, when the solar cell 900 needs to be divided into three sub-cells, the area 930 to be divided can be two pieces.

[0116] like Figure 1 , Figure 2 , Figure 7 and Figure 8 As shown, the second module assembly 120 further includes a plurality of second conductive strips 124, which are disposed on the first frame 121 and span across the cutout area 123. The term "spans" means that the second conductive strip 124 traverses the cutout area 123, and both ends of the second conductive strip 124 are respectively connected to the inner edge of the first frame 121. At least one surface of the second conductive strip 124 is exposed.

[0117] When the second mold assembly 120 is in the mold-closed position, the second conductive strip 124 is configured to contact the region 930 to be divided to form continuous contact. The term "continuous contact" means that the strip-shaped second conductive strip 124 has a continuous exposed surface, and the continuous exposed surface contacts the region 930 to be divided, thereby forming continuous contact. It is understood that the number of second conductive strips 124 is preferably the same as the number of regions 930 to be divided, with each second conductive strip 124 contacting each region 930 to be divided.

[0118] During the electroplating process, the electric field strength generated by the external power source in the electroplating area 911 of the solar cell 900 through the first conductive strip 122 exhibits a decaying distribution along the direction away from the first conductive strip 122. The portion of the electroplating area 911 near the segmented area 930 experiences greater attenuation due to its greater distance from the first conductive strip 122. Therefore, the electroplating carrier 100 utilizes the second conductive strip 124 to contact the segmented area 930, thus conducting electricity to the electroplating area 911 during electroplating. The function of the second conductive strip 124 is to increase the cathode current input point in the segmented area 930. The external power source also generates an electric field strength in the electroplating area 911 of the solar cell 900 through the second conductive strip 124. The electric field strength in the portion of the electroplating area 911 near the segmented area 930 is increased, offsetting the aforementioned electric field strength decay, thereby improving the uniformity of the electric field strength in the electroplating area 911. Furthermore, the area to be divided 930 is one side edge of the sub-cell. The combination of the first conductive strip 122 and the second conductive strip 124 ensures that there are cathode current inlet points on all four sides of the sub-cell, thereby improving the uniformity of the thickness of the electroplated metal layer on each sub-cell.

[0119] Furthermore, such as Figure 5 and Figure 7 As shown, the second module assembly 120 also includes an insulating wrapping member 125. For example, the insulating wrapping member 125 may be a silicone member, a rubber member, or a plastic member. The insulating wrapping member 125 is preferably a strip with the same length as the second conductive strip 124.

[0120] The second conductive strip 124 is embedded in the insulating wrapping 125 on the side facing away from the first mold assembly 110, and the surface of the second conductive strip 124 facing the first mold assembly 110 is exposed. It is understood that since the second mold assembly 120 and the first mold assembly 110 can be separated, the orientation of the first mold assembly 110 relative to the second mold assembly 120 is not unique. The above structural description of the second conductive strip 124 is based on the molded state of the second mold assembly 120 and the first mold assembly 110, that is, when the second mold assembly 120 and the first mold assembly 110 are molded, the side of the second conductive strip 124 facing away from the first mold assembly 110 is embedded in the insulating wrapping 125, and the surface of the second conductive strip 124 facing the first mold assembly 110 is exposed.

[0121] The side of the second conductive strip 124 facing away from the first mold assembly 110 is wrapped by an insulating wrapping 125, thereby isolating it from the electroplating solution. The exposed surface of the second conductive strip 124 is also sealed to the area to be divided 930, avoiding direct contact between the second conductive strip 124 and the electroplating solution, thereby reducing the probability of the second conductive strip 124 being plated with metal.

[0122] Preferably, the second conductive strip 124 is a second flexible conductive strip, such as a flexible conductive metal strip. The second flexible conductive strip can deform under force, and when the second module assembly 120 is pressed down, the second flexible conductive strip makes flexible contact with the area to be divided 930, reducing the probability of the solar cell 900 being damaged. Furthermore, electroplating is not required to form an electroplated metal layer on the area to be divided 930, making it easy to separate the second conductive strip 124 and the area to be divided 930 after electroplating.

[0123] The first frame 121 and the first conductive strip 122 will be further described below.

[0124] Among the possible implementations of the first aspect, such as Figure 5 and Figure 6 As shown, the first frame 121 is a waterproof, insulating, flexible frame. This frame can be made of waterproof, insulating polymer materials, such as nylon or polyester. These types of frames not only block liquids but also possess insulating and flexible properties. When the second module assembly 120 is in the closed position, the insulating flexible frame is configured to press against the edge region 912 and elastically deform. The insulating flexible frame makes flexible contact with the edge region 912, thereby reducing the probability of the solar cell 900 being damaged. Furthermore, no electroplated metal layer needs to be formed on the edge region 912, avoiding the formation of an electroplated metal layer between the insulating flexible frame and the edge region 912 that would hinder their separation. This allows the insulating flexible frame and the edge region 912 to be easily separated after electroplating.

[0125] Furthermore, such as Figure 5 and Figure 6As shown, the side of the first conductive strip 122 facing away from the first mold assembly 110 is built into the first frame 121. The built-in portion of the first conductive strip 122 is isolated from the electroplating solution to prevent metal plating. The surface of the first conductive strip 122 facing the first mold assembly 110 is exposed, and the exposed portion of the first conductive strip 122 is used to contact the edge region 912 and adheres to the edge region 912, reducing contact with the electroplating solution. As shown above, the orientation of the first mold assembly 110 relative to the second mold assembly 120 is not unique. The above structural description of the first conductive strip 122 is based on the state where the second mold assembly 120 and the first mold assembly 110 are molded together. That is, when the second mold assembly 120 and the first mold assembly 110 are molded together, the side of the first conductive strip 122 facing away from the first mold assembly 110 is built into the first frame 121, and the surface of the first conductive strip 122 facing the first mold assembly 110 is exposed.

[0126] Preferably, the first conductive strip 122 is a first flexible conductive strip, which is configured to deform with the insulating flexible frame so that the overall flexibility of the insulating flexible frame is better.

[0127] Preferably, such as Figure 2 and Figure 8 As shown, the size of the cutout area 123 is greater than or equal to the size of the area to be electroplated 911, for example, the length of the cutout area 123 is greater than or equal to the length of the area to be electroplated 911; and / or, the width of the cutout area 123 is greater than or equal to the width of the area to be electroplated 911. In other words, when the second mold assembly 120 is in the mold-closed position, the first frame 121 is separated from the area to be electroplated 911 to avoid the first frame 121 pressing on the electroplated metal layer on the area to be electroplated 911.

[0128] The first module component 110 will be further described below.

[0129] Among the possible implementations of the first aspect, such as Figure 1 , Figure 5 and Figure 6 As shown, the first module assembly 110 includes an insulating template 111. The insulating template 111, in contact with the electroplating solution, prevents it from being plated with metal. The template 111 has a bearing surface 112, which is the side of the template 111 facing the second module assembly 120. The bearing surface 112 is configured to adhere to the non-electroplated surface 920 of the solar cell 900, which is the side of the solar cell 900 opposite to the surface 910 to be electroplated. Since the non-electroplated surface 920 does not require electroplating, it does not need to contact the electroplating solution. On the contrary, excessive contact between the non-electroplated surface 920 and the electroplating solution would affect the performance of the solar cell 900. Therefore, this application precisely uses the bearing surface 112 to adhere to the non-electroplated surface 920 during electroplating, thereby reducing the impact of the electroplating solution on the solar cell 900.

[0130] When the second mold assembly 120 is in the mold-closed position, the first frame 121 abuts against the edge region 912 of the solar cell 900 on the bearing surface 112. The first frame 121 is configured to apply pressure to the solar cell 900 on the bearing surface 112 through the edge region 912, so that the non-electroplated surface 920 is in close contact with the bearing surface 112, thereby making the sealing effect between the bearing surface 112 and the non-electroplated surface 920 better.

[0131] Furthermore, an insulating flexible material layer 113 is provided on the bearing surface 112. Exemplarily, the flexible material layer 113 can be a silicone layer, a rubber layer, or a plastic layer. The flexible material layer 113 is configured to adhere to the entire unplated surface 920. The flexible material layer 113 reduces rigid contact between the solar cell 900 and the template 111, thereby reducing the risk of the solar cell 900 being crushed. The unplated surface 920 may have a textured surface, and the flexible material layer 113 can better adhere to the textured unplated surface 920.

[0132] Furthermore, the flexible material layer 113 has a boss portion 1131 that protrudes relative to the rest of the flexible material layer 113 and is configured to conform to the entire unplated surface 920. Specifically, when the second mold assembly 120 is in the mold-closed position, the first frame 121 can utilize the height difference between the boss portion 1131 and the rest of the flexible material layer 113. The inner ring portion of the first frame 121 abuts against the edge of the boss portion 1131, while the outer ring portion of the first frame 121 can continue to be pressed down away from the boss portion 1131 to increase the pressure exerted by the first frame 121 on the solar cell 900.

[0133] The first frame 121 is a waterproof, insulating, flexible frame. When the second mold assembly 120 is in the mold-closed position, the insulating flexible frame is configured to abut against the edge region 912 and apply pressure to the boss portion 1131. The edge of the boss portion 1131 is pressed and protrudes to abut against the insulating flexible frame, so that the insulating flexible frame and the edge of the boss portion 1131 are separated, further preventing the electroplating liquid from contacting the non-electroplated surface 920.

[0134] The following section provides a further explanation of how the second mold assembly and the first mold assembly, which are located in the mold-closing position, cooperate.

[0135] Among the possible implementations of the first aspect, such as Figures 8 to 10The electroplating carrier further includes a clamping mechanism 130, which is disposed on the first mold assembly 110 and / or the second mold assembly 120. The clamping mechanism 130 is configured to clamp the first mold assembly 110 with the second mold assembly 120 when switched to the mold-closed position, so that the second mold assembly 120 is held in the mold-closed position, and the solar cell 900 is held between the first mold assembly 110 and the second mold assembly 120 during electroplating. Exemplarily, the clamping mechanism 130 may be a magnetic attraction mechanism, a negative pressure adsorption mechanism, or a snap-fit ​​mechanism. Exemplarily, the magnetic attraction mechanism includes a first magnetic attractant and a second magnetic attractant that attract each other. The first magnetic attractant and the second magnetic attractant are respectively disposed on the first mold assembly 110 and the second mold assembly 120. When the second mold assembly 120 is in the mold-closed position, the first magnetic attractant and the second magnetic attractant attract each other, so that the first mold assembly 110 and the second mold assembly 120 are magnetically clamped together.

[0136] Preferably, the fastening mechanism 130 includes a rotating shaft 131 and a latching member 132. The rotating shaft 131 is located on one side of the first mold assembly 110, and the latching member 132 swings relative to the first mold assembly 110 via the rotating shaft 131. When the second mold assembly 120 switches to the mold-closing position, the latching member 132 swings to a position where it engages with the second mold assembly 120. When the latching member 132 swings to a position where it separates from the second mold assembly 120, the second mold assembly 120 switches to the separated position. The swinging latching member 132 has the advantages of easy fastening and easy separation.

[0137] Furthermore, the fastener 132 has a fastening arm 1321 and a pressing arm 1322, one end of the pressing arm 1322 is connected to one end of the fastening arm 1321 and the fastening arm 1321 extends in a direction close to the second mold assembly 120 and is bent relative to the pressing arm 1322. The connection between the pressing arm 1322 and the fastening arm 1321 is connected to a pivot 131.

[0138] The fastening mechanism 130 further includes a first spring 133, one end of which is connected to a pressing swing arm 1322. The pressing swing arm 1322 is configured to compress the first spring 133 when pressed, causing the latching swing arm 1321 to swing to a position separated from the second mold assembly 120. When the first spring 133 rebounds, it causes the latching swing arm 1321 to swing to a position engaging with the second mold assembly 120 via the pressing swing arm 1322. The end of the latching swing arm 1321 away from the first mold assembly 110 is provided with a pressing slope 1323. The pressing slope 1323 is inclined in the direction of movement of the second mold assembly 120. The pressing slope 1323 is configured to press the latching swing arm 1321 when it contacts the second mold assembly 120, so that the latching swing arm 1321 swings to a position away from the second mold assembly 120.

[0139] like Figure 8As shown, when the second mold assembly 120 switches to the mold closing position, the second mold assembly 120 contacts the extrusion slope 1323, and the latching swing arm 1321 is squeezed and automatically swings to a position that avoids the second mold assembly 120, so that the second mold assembly 120 can continue to move to the mold closing position. During this process, the pressing swing arm 1322 swings and compresses the first spring 133.

[0140] like Figure 9 As shown, when the second mold assembly 120 is in the mold-closed position, the first spring 133 rebounds and drives the latching arm 1321 to swing to the position where it engages with the second mold assembly 120 by pressing the swing arm 1322, so that the first mold assembly 110 and the second mold assembly 120 are tightly fitted.

[0141] like Figure 10 As shown, when the second module assembly 120 needs to be switched to the separated position, press the pressing swing arm 1322. The pressing swing arm 1322 drives the latching swing arm 1321 to swing to the position separated from the second module assembly 120, and then the second module assembly 120 moves to the separated position.

[0142] Optionally, a protruding second spring 114 is provided on the surface of the first mold assembly 110 near the second mold assembly 120. When the second mold assembly 120 switches to the mold-closing position, the second spring 114 is compressed. When the second spring 114 is configured to rebound, it drives the second mold assembly 120 to switch to the separation position. Specifically, when the latch 132 swings to the position separated from the second mold assembly 120, the second mold assembly 120 is in a movable state. The second spring 114 rebounds and returns to its original length. The upper end of the second spring 114 pushes the second mold assembly 120 from the mold-closing position to the separation position, realizing automatic separation.

[0143] The second module component 120 will be further described below.

[0144] like Figure 11 As shown, the second module assembly 120 also includes a rigid second frame 126, which surrounds the first frame 121 and is connected to the outer edge of the first frame 121. The rigid second frame 126 is used to support the flexible first frame 121.

[0145] An external conductive element 127 is provided on the second frame 126. The external conductive element 127 is configured to be electrically connected to the cathode of an external power source. The first conductive strip 122 is connected to the external conductive element 127. For example, one end of the first conductive strip 122 is connected to the external conductive element 127, or both ends of the external conductive element 127 are respectively connected to two external conductive elements 127.

[0146] In this application, the external conductive component 127 is disposed on the rigid second frame 126. The rigid second frame 126 is in rigid contact with the outside world, which is conducive to the stable electrical connection of the external conductive component 127 to the cathode of the external power source, that is, the first conductive strip 122 is stably connected to the cathode of the external power source.

[0147] Furthermore, the second conductive strip 124 is also connected to the external conductive element 127. In other words, the second conductive strip 124 is also stably electrically connected to the cathode of the external power supply via the external conductive element 127 on the second frame 126.

[0148] The specific structure of the second frame 126, and the way in which the second frame 126 cooperates with the rest of the electroplating apparatus disclosed in the second aspect of this application, will be further described below.

[0149] Secondly, such as Figures 12 to 17 As shown in the figure, an embodiment of this application discloses an electroplating apparatus, including an electroplating carrier 100 as described in the first aspect.

[0150] The following provides a further description of one of the electrical connection methods of the electroplating carrier 100 in the electroplating apparatus.

[0151] In the possible implementations of the second aspect, such as Figure 12 and Figure 13 As shown, in conjunction with the description of the second frame 126 in the first aspect, the external conductive member 127 extends along one side of the second frame 126. The conductive transfer mechanism includes a conductive clamp 800, which is configured to hold the external conductive member 127 and a cathode electrically connected to an external power source. It is understood that after the first mold assembly 110 and the second mold assembly 120 are molded together, the conductive clamp 800 holds the external conductive member 127, and the first mold assembly 110 and the second mold assembly 120 are transferred together with the conductive clamp 800. This conductive transfer mechanism can be a mechanism for conveying the conductive clamp 800 in a horizontal electroplating device. In other words, the electroplating carrier 100 can be transferred using a horizontal electroplating device, which has high versatility. By using the conductive clamp 800 to hold the external conductive member 127 to transfer current to the first conductive strip 122 and the second conductive strip 124, compared with the conductive method in the related art where the conductive clamp 800 directly holds the solar cell 900, the electric field strength uniformity is higher, and it is also beneficial to maintain the structural integrity of the solar cell 900.

[0152] Furthermore, such as Figure 13 As shown, in conjunction with the description of the second conductive strip 124 in the first aspect, the second conductive strip 124 is connected to the external conductive member 127. The conductive transmission mechanism transmits current to the second conductive strip 124 on the electroplating carrier while simultaneously transmitting the electroplating carrier.

[0153] The following provides a further explanation of another electrical connection method for the electroplating carrier 100 in the electroplating apparatus.

[0154] In the possible implementations of the second aspect, such as Figure 14A and Figure 14B As shown, the electroplating apparatus also includes a conductive conveying mechanism 200, which is configured to convey the electroplating carrier 100 and the cathode electrically connected to an external power source. The conductive conveying mechanism 200 can simultaneously convey one or more electroplating carriers 100 to achieve automated electroplating of solar cells.

[0155] The second module assembly 120 is provided with an external conductive component 127. A first conductive strip 122 is connected to the external conductive component 127. The external conductive component 127 is configured to contact the conductive conveying mechanism 200 when the electroplating carrier 100 is conveyed, and then be electrically connected to the cathode of the external power supply 700. During the automated conveying of the electroplating carrier 100, the first conductive strip 122 is electrically connected to the cathode of the external power supply 700 by contacting the conductive conveying mechanism 200 through the external conductive component 127. The solar cell 900 is conveyed without the conductive conveying mechanism 200 directly contacting the solar cell 900, and the solar cell 900 is conductive through the first conductive strip 122, which protects the solar cell 900 and improves the uniformity of the electric field intensity.

[0156] like Figure 14A and Figure 14B As shown, the conductive transmission mechanism 200 has a clamping gap 210. The second module assembly 120 is provided with a plurality of insulated extensions 128, and an external conductive member 127 is disposed on the extensions 128. The extensions 128 are configured to be clamped in the clamping gap 210 so that the external conductive member 127 contacts the conductive transmission mechanism 200. Before electroplating begins, the extensions 128 enter into the clamping gap 210 and are clamped there, so that the electroplating carrier 100 is synchronized with the conductive transmission mechanism 200. The conductive transmission mechanism 200 transmits the electroplating carrier 100 by clamping the extensions 128, and transmits current to the first conductive strip 122 and the second conductive strip 124 by contacting the external conductive member 127 on the extensions 128.

[0157] Furthermore, such as Figure 14A and Figure 14B As shown, in conjunction with the description of the second frame 126 in the first aspect, the second frame 126 has a plurality of rigid extensions 128 on both opposite sides in the horizontal direction, which intersect the transmission direction of the conductive transmission mechanism 200 in the horizontal direction, as shown in the figure. Figure 14A and Figure 14B In the X direction, the transmission direction of the conductive transmission mechanism 200 is as follows: Figure 14A and Figure 14BIn the Y direction, in other words, the transmission direction of the conductive transmission mechanism 200 is another horizontal direction. Through the cooperation of the rigid second frame 126 and the extension 128 with the conductive transmission mechanism 200, the efficiency of rigid contact force transmission is higher.

[0158] Preferably, two extensions 128 are provided on each of the two opposite sides of the second frame 126, that is, the number of extensions 128 is four. The first conductive strip 122 is square, and the four corners of the square first conductive strip 122 are respectively connected to the external conductive members 127 on the four extensions 128. The two ends of the second conductive strip 124 are respectively connected to the extensions 128 on the two opposite sides of the second frame 126.

[0159] like Figure 14A and Figure 14B As shown, there are two conductive conveying mechanisms 200, which are arranged opposite each other in the horizontal direction. The electroplating carrier 100 is positioned between the two conductive conveying mechanisms 200 during transport. Multiple extensions 128 on the two opposite sides of the second frame 126 are respectively clamped in the clamping gap 210 between the two conductive conveying mechanisms 200. By transporting the electroplating carrier 100, the two conductive conveying mechanisms 200 ensure a more balanced force on the two opposite sides of the electroplating carrier 100, resulting in smoother transport.

[0160] like Figure 14A and Figure 14B As shown, the conductive conveying mechanism 200 includes a first conductive chain 220 and a second conductive chain 230. The first conductive chain 220 and the second conductive chain 230 are arranged opposite each other in the vertical direction to form a strip-shaped clamping gap 210. More specifically, the first conductive chain 220 is located above the second conductive chain 230, and a lower section of the first conductive chain 220 is parallel to an upper end of the second conductive chain 230, thereby forming a clamping gap 210 extending in the horizontal direction between them. Both ends of the clamping gap 210 in the length direction are open structures, so that the extension 128 can automatically move into or out of the clamping gap 210 through the open structures, thereby realizing the automated conveying of the electroplating carrier 100.

[0161] Furthermore, the first conductive chain 220 and the second conductive chain 230 achieve conductivity in the following specific ways:

[0162] The first method: such as Figure 14C As shown, the first conductive chain 220 is slidably connected to the first conductive slide rail 221, and the second conductive chain 230 is slidably connected to the second conductive slide rail 231. The first conductive slide rail 221 and the second conductive slide rail 231 are both fixedly installed and electrically connected to the cathode of an external power source.

[0163] The second method: The first conductive chain 220 rolls in contact with the first conductive wheel 222, and the second conductive chain 230 rolls in contact with the second conductive wheel 232. The first conductive wheel 222 is rotatably mounted on the first conductive shaft 223 via a first bearing, and the second conductive wheel 232 is rotatably mounted on the second conductive shaft 233 via a second bearing. Both the first conductive shaft 223 and the second conductive shaft 233 are fixedly mounted and electrically connected to the cathode of an external power source. For example... Figure 15 As shown, the electroplating apparatus also includes several rollers 300, which contact the side of the first mold assembly 110 opposite to the second mold assembly 120. The rollers 300 support and transport the electroplating carrier 100, reduce the load on the conductive transport mechanism 200, and ensure that the electroplating carrier 100 is transported at a preset speed.

[0164] In the possible implementations of the second aspect, such as Figures 15 to 17 As shown, the hollow area 123 is arranged facing upward so that the area to be electroplated can contact the electroplating liquid falling from above the hollow area 123. A baffle structure 400 is provided between the hollow area 123 and the conductive conveying mechanism 200. The baffle structure 400 is configured to block the electroplating liquid from contacting the conductive conveying mechanism 200, thereby reducing the probability that the conductive conveying mechanism 200 and the external conductive component 127 will be plated with metal.

[0165] Furthermore, such as Figure 15 and Figure 16 As shown, the extension 128 includes a first extension segment 1281 and a second extension segment 1282. The first extension segment 1281 extends horizontally and protrudes from the second frame 126. The horizontal direction intersects the transmission direction of the conductive transmission mechanism 200. Figure 16 In the X0-X1 direction, the transmission direction of the conductive transmission mechanism 200 is another horizontal direction. The second extension segment 1282 is connected to the end of the first extension segment 1281 away from the second frame 126 and extends upward, as shown in the vertical direction. Figure 16 The Z0-Z1 direction in the middle. The external conductive member 127 is connected to one end of the second extension 1282 away from the first extension 1281 and protrudes in the horizontal direction. The external conductive member 127 is configured to be clamped in the conductive transmission mechanism 200 and to contact the conductive transmission mechanism 200.

[0166] The baffle structure 400 includes an inner baffle 410 and an outer baffle 420. The inner baffle 410 is disposed on the side of the second extension 1282 near the hollow area 123 and located on the upper side of the first extension 1281. The outer baffle 420 is disposed on the side of the second extension 1282 away from the hollow area 123 and located on the lower side of the external conductive member 127.

[0167] The function of the first extension section 1281 is to bring the second extension section 1282 and the external conductive member 127 closer to the conductive transmission mechanism 200. The inner baffle 410 and the outer baffle 420 separate and block the inner and outer sides of the second extension section 1282, providing a good blocking effect on the electroplating solution. The function of the second extension section 1282 is to pass upward through the gap between the inner baffle 410 and the outer baffle 420, making it difficult for the electroplating solution to flow upward through this gap. The function of the external conductive member 127 is to be inserted into the clamping gap 210 and contact the conductive transmission mechanism 200 to be electrically connected to the cathode of the external power supply 700.

[0168] In the possible implementations of the second aspect, such as Figure 15 and Figure 17 As shown, the electroplating apparatus also includes an electroplating solution container 500 and an anode plate 510. The electroplating solution container 500 is configured to store the electroplating solution and has an opening at its bottom. The anode plate 510 covers the opening and is configured to be electrically connected to the anode of an external power supply 700. When the anode plate 510 is energized, the metal material on the anode plate 510 is oxidized and dissolved in the electroplating solution. The anode plate 510 is provided with a drain hole 511, through which the electroplating solution in the electroplating solution container 500 flows out to the area below the anode plate 510 in a vertical direction. Figure 17 The Z-direction. The number of drain holes 511 can be multiple, preferably arranged at intervals along the conveying direction of the conductive conveying mechanism 200, such as... Figure 17 in the Y direction.

[0169] The second mold assembly 120, conveyed on the conductive conveying mechanism 200, is located below the anode plate 510, and the first mold assembly 110 is located below the second mold assembly 120. The hollowed-out area 123 is correspondingly arranged with the drain hole 511. In other words, the electroplating solution flows out from the drain hole 511 above the hollowed-out area 123 and contacts the area to be electroplated 911 through the hollowed-out area 123. When the first conductive strip 122 and the second conductive strip 124 are energized, the area to be electroplated 911 will be electroplated to form an electroplated metal layer. This electroplating device supplies the electroplating solution to the electroplating carrier 100 from above, so that the electroplating carrier 100 does not need to be completely immersed in the electroplating solution, and thus the electroplating carrier 100 can be conveyed by the conductive conveying mechanism 200.

[0170] Furthermore, such as Figure 15 and Figure 17 As shown, the electroplating apparatus also includes an electroplating tank 600 and an inlet pump 620, with an electroplating processing cavity 610 defined inside the electroplating tank 600.

[0171] The electroplating carrier is movably positioned at the upper part of the electroplating processing chamber 610, and the lower part of the electroplating processing chamber 610 is configured to store the electroplating solution and recover the electroplating solution falling from the upper part of the electroplating processing chamber 610.

[0172] The inlet end of the inlet pump 620 is connected to the lower part of the electroplating processing chamber 610, and the outlet of the inlet pump 620 is connected to the electroplating solution container 500.

[0173] The inlet pump 620 draws the electroplating solution from the lower part of the electroplating chamber 610 into the electroplating solution container 500. The electroplating solution in the container 500 flows out through the drain hole 511 and contacts the hollow area 123 for electroplating. The electroplating process takes place in the upper part of the electroplating chamber 610. The electroplating solution used in the process flows downward back to the lower part of the chamber and is then continuously circulated back to the electroplating solution container 500 by the inlet pump 620. By recycling the electroplating solution, the consumption and discharge of the electroplating solution are reduced.

[0174] The following details the operation of this electroplating device, with the following steps:

[0175] Step 1: Transfer the first module component to the target location.

[0176] Step 2: Using alignment methods such as visual alignment and mechanical alignment, place the solar cell on the bearing surface of the first module, specifically placing the solar cell on the protrusion of the flexible material layer on the bearing surface.

[0177] Step 3: Using alignment methods such as visual alignment and mechanical alignment, the second module assembly is conveyed to the top of the first module assembly, i.e., above the solar cell. Then, the second module assembly moves closer to the first module assembly to switch to the mold-closing position, and the first and second module assemblies are tightly fitted together by a clamping mechanism. The surface to be electroplated is the side of the solar cell adjacent to the second module assembly; the first frame covers the edge area, and the first conductive strip contacts the edge area to form a ring contact. The first conductive strip is electrically connected to the cathode of an external power supply through an external conductive component, and the hollowed-out area exposes the area to be electroplated. When the solar cell has an area to be divided, the second module assembly also includes a second conductive strip, which contacts the area to be divided to form a continuous contact.

[0178] Step 4: The external conductive component contacts the conductive conveying mechanism to transport the electroplating carrier and achieve conductivity. There are two methods here: Method 1: When the external conductive component is set in the extension, the extension automatically enters the beginning of the clamping gap and contacts the first conductive chain and / or the second conductive chain. The first conductive chain, the second conductive chain, and the roller together transport the electroplating carrier in the horizontal direction. After electroplating is completed, the extension automatically disengages from the end of the clamping gap; Method 2: When the external conductive component extends along one side of the second frame, the external conductive component is clamped by the conductive clamp of the horizontal electroplating equipment to achieve conductivity, and the conductive clamp is transported by the conductive conveying mechanism of the horizontal electroplating equipment. The electroplating carrier is transported along with the conductive clamp.

[0179] Step 5: The electroplating carrier is conveyed into the electroplating tank. The electroplating solution falls from the anode plate above the hollow area. The anode plate is connected to the anode of the external power supply, thus forming an electroplating system, so that the area to be electroplated comes into contact with the electroplating solution and is plated with an electroplated metal layer.

[0180] Step 6: After electroplating is completed, the electroplating carrier is transported outside the electroplating tank for cleaning and drying. The fastening mechanism is released, and the second module and solar cell are sequentially lifted using a suction nozzle or suction cup. The second module is then switched to the separation position.

[0181] Step 7: The first module is returned to storage to await the next cycle, while the solar cells are transferred to the next process. The second module may be partially plated with metal; after removing this metal, it is cleaned, dried, and returned to storage to await the next cycle.

[0182] Thirdly, embodiments of this application disclose an electroplating method for solar cells, which uses an electroplating carrier as described in the first aspect, or an electroplating apparatus as described in the second aspect.

[0183] The electroplating method includes the following steps:

[0184] The second module is switched to the mold-closing position and clamps the solar cell with the first module; wherein, the surface to be electroplated is the side of the solar cell adjacent to the second module; the first frame covers the edge area, the first conductive strip contacts the edge area to form a ring contact, and the first conductive strip is electrically connected to the cathode of the external power supply, and the hollow area exposes the area to be electroplated;

[0185] Electroplating is performed on the area to be electroplated in the solar cell; wherein, the electroplating solution contacts the area to be electroplated through a perforated area, and the first conductive strip is electrically connected to the cathode of an external power source and energized.

[0186] This electroplating method utilizes a first conductive strip to form a ring-shaped contact around the edge region. The first conductive strip conducts electricity around the area to be plated, improving the uniformity of the electric field strength and thus enhancing the uniformity of the plated metal layer thickness. During the electroplating process, no plated metal layer needs to be formed in the edge region, and the first conductive strip and the edge region are easily separated after electroplating.

[0187] In a possible implementation of the third aspect, before the step of switching the second module to the mold-closing position and clamping the solar cell with the first module, the electroplating method further includes the following steps:

[0188] The solar cells are placed in the first module by visual alignment;

[0189] The second module is positioned on the side of the solar cell away from the first module by visual alignment.

[0190] Visual alignment enables precise correspondence between the solar cell, the second module, and the first module, further facilitating the precise alignment of the first conductive strip with the edge area, the precise alignment of the hollow area with the area to be electroplated, and the precise alignment of the first frame with the edge area.

[0191] In a possible implementation of the third aspect, the step of switching the second module to the mold-closing position and clamping the solar cell with the first module further includes:

[0192] The second mold assembly fits tightly with the first mold assembly, with the hollowed-out area facing upwards; the surface to be electroplated also has a region to be divided, which runs across the region to be electroplated; the second mold assembly also includes several second conductive strips, which are disposed on the first frame and span the hollowed-out area, with at least one surface of the second conductive strip exposed; when the second mold assembly is in the mold-closed position, the second conductive strips are configured to contact the region to be divided to form continuous contact, and the second conductive strips are electrically connected to the cathode of the external power supply.

[0193] The electroplating method also uses a second conductive strip to contact the area to be divided for the solar cell to be divided, thereby improving the uniformity of the electric field intensity and improving the uniformity of the thickness of the electroplated metal layer on each sub-cell of the solar cell.

[0194] Furthermore, the step of electroplating the area to be electroplated on the solar cell includes:

[0195] The electroplating carrier is conveyed into the electroplating tank for electroplating; wherein, the electroplating solution is stored in the electroplating tank and falls from above the hollow area to contact the area to be electroplated;

[0196] Furthermore, after the step of electroplating the area to be electroplated, the electroplating method further includes the following steps:

[0197] The electroplating carrier is transferred outside the electroplating tank;

[0198] The second module assembly and the first module assembly are no longer tightly fitted together;

[0199] The second module component switches to the separation position and separates from the first module component;

[0200] Remove the solar cells from the first module.

[0201] Fourthly, such as Figure 18 As shown, this application discloses a solar cell 900, which includes a cell body 950 and electrodes 940. The electrodes 940 are disposed on the surface of the cell body 950 and connected to the cell body 950 to transmit the photocurrent generated by the cell body 950. Although in Figure 18The image only shows an electrode 940 disposed on one side surface of the battery body 950, but this application is not limited to disposing of the electrode 940 on only one side surface of the battery body 950, and may also dispose of the electrode 940 on both sides surface of the battery body 950.

[0202] The electrode 940 is made using an electroplating carrier as described in the first aspect, or the electrode 940 is made using an electroplating apparatus as described in the second aspect, or the electrode 940 is made by an electroplating method as described in the third aspect.

[0203] Optionally, the battery body can be a back contact solar cell body, a perovskite solar cell body, a passivated contact solar cell body, or a heterojunction solar cell body.

[0204] In a possible implementation of the fourth aspect, the battery body includes: a silicon substrate; an N-type doped semiconductor layer and a P-type doped semiconductor layer disposed on the back surface of the silicon substrate, wherein the N-type doped semiconductor layer and the P-type doped semiconductor layer are interdigitated.

[0205] The electrode includes a seed layer and an electroplated metal layer formed on the seed layer. The seed layer is in conductive contact with the corresponding N-type doped semiconductor layer and P-type doped semiconductor layer, respectively.

[0206] The electroplating carrier, electroplating apparatus, and electroplating method of this application can improve the electroplating effect of the aforementioned solar cells. The template of the first module is attached to the light-receiving surface of the solar cell, and then the area to be electroplated on the back-lighting surface is exposed through the hollow area for single-sided electroplating. While electroplating the back-lighting surface, the influence of the electroplating solution on the battery structure on the light-receiving surface is reduced.

[0207] Fifthly, embodiments of this application disclose a photovoltaic module, including a plurality of solar cells connected in series and / or in parallel, wherein at least one solar cell is a solar cell as described in the fourth aspect.

[0208] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electroplating carrier for manufacturing solar cells, characterized in that, The solar cell has a surface to be electroplated, the surface to be electroplated having a region to be electroplated and an edge region surrounding the edge of the region to be electroplated; The electroplating carrier includes: First module component; and The second module assembly includes a first frame and a first conductive strip; the area defined by the inner edge of the first frame is a hollow area, the size of which is smaller than the size of the solar cell; the first conductive strip is arranged around the first frame and at least one surface of the first conductive strip is exposed. The second module assembly is movably connected to the first module assembly and has a closed position and a separated position. The second module assembly in the closed position and the first module assembly clamp the solar cell. The first frame is configured to cover the edge area. The hollow area is configured to expose the area to be electroplated. The first conductive strip is configured to contact the edge area to form an annular contact.

2. The electroplating carrier according to claim 1, characterized in that, The surface to be electroplated also has a region to be segmented, and the region to be segmented extends across the region to be electroplated. The second module assembly further includes a plurality of second conductive strips, which are disposed on the first frame and span the hollow area, with at least one surface of the second conductive strips being exposed; When the second module assembly is in the mold-closing position, the second conductive strip is configured to contact the area to be divided to form continuous contact.

3. The electroplating carrier according to claim 2, characterized in that, The second module assembly further includes an insulating wrapping element, wherein the second conductive strip is embedded in the insulating wrapping element on the side opposite to the first module assembly, and the surface of the second conductive strip facing the first module assembly is exposed; And / or, the second conductive strip is a second flexible conductive strip.

4. The electroplating carrier according to claim 1, characterized in that, The first frame is a waterproof, insulated, flexible frame. When the second mold assembly is in the mold-closing position, the insulated, flexible frame is configured to be pressed against the edge region and elastically deformed.

5. The electroplating carrier according to claim 4, characterized in that, The second module assembly further includes a rigid second frame that surrounds the first frame and is connected to the outer edge of the first frame; An external conductive component is provided on the second frame, and the external conductive component is configured to be electrically connected to the cathode of an external power source. The first conductive strip is connected to the external conductive component.

6. The electroplating carrier according to claim 5, characterized in that, The surface to be electroplated also has a region to be divided, which extends across the electroplating area; the second mold assembly further includes a plurality of second conductive strips, which are disposed on the first frame and span the hollow area, with at least one surface of the second conductive strip exposed; when the second mold assembly is in the mold-closed position, the second conductive strips are configured to contact the region to be divided to form continuous contact; the second conductive strips are connected to the external conductive component.

7. The electroplating carrier according to claim 5, characterized in that, The external conductive element extends along one side of the second frame and is configured to be held in place by a conductive clamp of a horizontal electroplating device and connected to the cathode of an external power source.

8. The electroplating carrier according to claim 5, characterized in that, The second frame has multiple insulating extensions on both opposite sides in the horizontal direction; The extension includes a first extension segment and a second extension segment. The first extension segment extends along the horizontal direction and protrudes beyond the second frame. The horizontal direction intersects the conveying direction of the conductive conveying mechanism. The second extension segment is connected to the end of the first extension segment away from the second frame and extends upward. The external conductive member is connected to the end of the second extension segment away from the first extension segment and protrudes along the horizontal direction. The external conductive member is configured to be clamped in the conductive conveying mechanism and in contact with the conductive conveying mechanism.

9. The electroplating carrier according to claim 1, characterized in that, The first module includes an insulating template having a bearing surface, the bearing surface being the side of the template facing the second module, the bearing surface being configured to adhere to the non-electroplated surface of the solar cell, the non-electroplated surface being the side of the solar cell opposite to the surface to be electroplated; When the second module assembly is in the mold-closed position, the first frame abuts against the edge region of the solar cell on the support surface. The first frame is configured to apply pressure to the solar cell on the support surface through the edge region so that the unplated surface is in close contact with the support surface.

10. The electroplating carrier according to claim 9, characterized in that, An insulating flexible material layer is provided on the bearing surface, and the flexible material layer is configured to adhere to the entire non-electroplated surface.

11. The electroplating carrier according to claim 10, characterized in that, The flexible material layer has a boss portion that protrudes relative to the rest of the flexible material layer and is configured to conform to the entire unplated surface. The first frame is a waterproof, insulated, flexible frame. When the second mold assembly is in the mold-closing position, the insulated, flexible frame is configured to abut against the edge area and apply pressure to the boss portion. The edge of the boss portion protrudes under pressure and abuts against the insulated, flexible frame.

12. The electroplating carrier according to any one of claims 1 to 11, characterized in that, The first frame is a waterproof, insulating, flexible frame, and the first conductive strip is a first flexible conductive strip, which is configured to deform with the insulating, flexible frame. And / or, the first conductive strip is embedded in the first frame on the side away from the first module assembly and the surface of the first conductive strip facing the first module assembly is exposed; And / or, the size of the hollowed-out area is greater than or equal to the size of the area to be electroplated.

13. The electroplating carrier according to any one of claims 1 to 11, characterized in that, The electroplating carrier further includes a clamping mechanism disposed on the first mold assembly and / or the second mold assembly, the clamping mechanism being configured to clamp the first mold assembly with the second mold assembly switched to the mold closing position.

14. The electroplating carrier according to claim 13, characterized in that, The fastening mechanism includes a rotating shaft and a fastening element. The rotating shaft is disposed on one side of the first mold assembly, and the fastening element swings relative to the first mold assembly via the rotating shaft. When the second mold assembly switches to the mold closing position, the latching member swings to a position where it engages with the second mold assembly; The buckle swings to a position where it is separated from the second module assembly, and the second module assembly switches to the separated position.

15. The electroplating carrier according to claim 14, characterized in that, The fastening member has a fastening arm and a pressing arm. One end of the pressing arm is connected to one end of the fastening arm, and the fastening arm extends in a direction close to the second mold assembly while bending relative to the pressing arm. The connection between the pressing arm and the fastening arm is connected to the pivot. The fastening mechanism further includes a first spring, one end of which is connected to the pressing arm. The pressing arm is configured to compress the first spring when pressed, causing the fastening arm to swing to a position separated from the second mold assembly. The first spring is configured to, when rebounding, cause the fastening arm to swing to a position engaging with the second mold assembly via the pressing arm. The end of the fastening arm away from the first mold assembly has a pressing slope. The pressing slope is inclined towards the direction of movement of the second mold assembly. The pressing slope is configured to press the fastening arm when in contact with the second mold assembly, so that the fastening arm swings to a position avoiding the second mold assembly. And / or, a protruding second spring is provided on the surface of the first mold assembly near the second mold assembly, the second spring is compressed when the second mold assembly switches to the mold closing position, and the second spring is configured to rebound when it drives the second mold assembly to switch to the separation position.

16. An electroplating apparatus, characterized in that, Including the electroplating carrier as described in any one of claims 1 to 15.

17. The electroplating apparatus according to claim 16, characterized in that, The electroplating apparatus further includes a conductive conveying mechanism configured to convey the electroplating carrier and a cathode electrically connected to an external power source. The second module is provided with an external conductive component, and the first conductive strip is connected to the external conductive component. The external conductive component is configured to contact the conductive conveying mechanism when the electroplating carrier is conveyed by the conductive conveying mechanism.

18. The electroplating apparatus according to claim 17, characterized in that, The second module assembly further includes a plurality of second conductive strips, which are disposed on the first frame and span the hollow area, with at least one surface of the second conductive strip exposed; when the second module assembly is switched to the mold closing position, the second conductive strips are configured to contact the area to be divided to form continuous contact; the second conductive strips are connected to the external conductive component.

19. The electroplating apparatus according to claim 17, characterized in that, The conductive transmission mechanism has a clamping gap; the second module assembly is provided with a plurality of insulated extensions, the external conductive member is disposed on the extensions, and the extensions are configured to be clamped in the clamping gap so that the external conductive member contacts the conductive transmission mechanism.

20. The electroplating apparatus according to claim 19, characterized in that, The second module assembly further includes a rigid second frame, which surrounds the first frame and is connected to the outer edge of the first frame; the second frame has a plurality of extensions on both opposite sides in the horizontal direction, the horizontal direction intersecting the conveying direction of the conductive conveying mechanism; there are two conductive conveying mechanisms, which are arranged opposite to each other in the horizontal direction, and the electroplating carrier is located between the two conductive conveying mechanisms during conveying; the plurality of extensions on both opposite sides of the second frame are respectively clamped in the clamping gap of the two conductive conveying mechanisms; And / or, the electroplating apparatus further includes a plurality of rollers that contact the side of the first mold assembly opposite to the second mold assembly.

21. The electroplating apparatus according to claim 19, characterized in that, The conductive transmission mechanism includes a first conductive chain and a second conductive chain, which are arranged opposite each other in the vertical direction to form a strip-shaped clamping gap.

22. The electroplating apparatus according to claim 19, characterized in that, The hollowed-out area is arranged facing upwards so that the area to be electroplated can contact the electroplating liquid falling from above the hollowed-out area. A baffle structure is provided between the hollowed-out area and the conductive conveying mechanism. The baffle structure is configured to prevent the electroplating liquid from contacting the conductive conveying mechanism.

23. The electroplating apparatus according to claim 22, characterized in that, The extension includes a first extension segment and a second extension segment. The first extension segment extends along the horizontal direction and protrudes from the second frame. The horizontal direction intersects the conveying direction of the conductive conveying mechanism. The second extension segment is connected to the end of the first extension segment away from the second frame and extends upward. The external conductive member is connected to the end of the second extension segment away from the first extension segment and protrudes along the horizontal direction. The external conductive member is configured to be clamped in the conductive conveying mechanism and to contact the conductive conveying mechanism. The baffle structure includes an inner baffle and an outer baffle. The inner baffle is disposed on the side of the second extension section near the hollow area and located on the upper side of the first extension section. The outer baffle is disposed on the side of the second extension section away from the hollow area and located on the lower side of the external conductive component.

24. The electroplating apparatus according to any one of claims 17 to 23, characterized in that, The electroplating apparatus further includes an electroplating solution container and an anode plate. The electroplating solution container is configured to store the electroplating solution. The bottom of the electroplating solution container has an opening. The anode plate covers the opening. The anode plate is configured to be electrically connected to the anode of an external power source. The anode plate is provided with a drain hole. The second module assembly, which is conveyed on the conductive conveying mechanism, is located below the anode plate, and the first module assembly is located below the second module assembly. The hollow area is correspondingly arranged with respect to the drain hole.

25. The electroplating apparatus according to claim 24, characterized in that, The electroplating apparatus also includes an electroplating tank and a liquid inlet pump, wherein the electroplating tank defines an electroplating processing cavity; The electroplating carrier is movably disposed on the upper part of the electroplating processing cavity, and the lower part of the electroplating processing cavity is configured to store the electroplating solution and recover the electroplating solution falling from the upper part of the electroplating processing cavity. The inlet end of the inlet pump is connected to the lower part of the electroplating processing chamber, and the outlet of the inlet pump is connected to the electroplating solution container.

26. The electroplating apparatus according to claim 17 or 18, characterized in that, The second module assembly further includes a rigid second frame that surrounds the first frame and is connected to the outer edge of the first frame; the external conductive member extends along one side of the second frame. The conductive transmission mechanism includes a conductive clamp configured to hold the external conductive component and a cathode electrically connected to the external power source.

27. A method for electroplating solar cells, characterized in that, The electroplating method uses an electroplating carrier as described in any one of claims 1 to 15, or the electroplating method uses an electroplating apparatus as described in any one of claims 16 to 26; The electroplating method includes the following steps: The second module assembly switches to the mold-closing position and clamps the solar cell with the first module assembly; wherein, the surface to be electroplated is the side of the solar cell adjacent to the second module assembly; the first frame covers the edge area, the first conductive strip contacts the edge area to form an annular contact, and the first conductive strip is electrically connected to the cathode of the external power supply, and the hollow area exposes the area to be electroplated; Electroplating is performed on the area to be electroplated in the solar cell; wherein the electroplating solution contacts the area to be electroplated through the hollow area, and the first conductive strip is electrically connected to the cathode of an external power source and energized.

28. The electroplating method according to claim 27, characterized in that, Before the step of switching the second module assembly to the mold-closing position and clamping the solar cell with the first module assembly, the electroplating method further includes the following steps: The solar cell is placed in the first module assembly by visual alignment; The second module is positioned on the side of the solar cell away from the first module by visual alignment; And / or, the step of switching the second module assembly to the mold-closing position to clamp the solar cell with the first module assembly further includes: The second mold assembly is tightly fitted with the first mold assembly, with the hollowed-out area facing upwards; the surface to be electroplated also has a region to be divided, which extends across the region to be electroplated; the second mold assembly further includes a plurality of second conductive strips, which are disposed on the first frame and span the hollowed-out area, with at least one surface of each second conductive strip exposed; when the second mold assembly is in the mold-closed position, the second conductive strips are configured to contact the region to be divided to form continuous contact, and the second conductive strips are electrically connected to the cathode of the external power supply; The step of electroplating the area to be electroplated on the solar cell includes: The electroplating carrier is conveyed into the electroplating tank for electroplating; wherein the electroplating solution is stored in the electroplating tank and falls from above the hollow area to contact the area to be electroplated; After the step of electroplating the area to be electroplated, the electroplating method further includes the following steps: The electroplating carrier is transferred to the outside of the electroplating tank; The second module assembly and the first module assembly are released from their tight fit; The second module component switches to the separation position and separates from the first module component; The solar cell is removed from the first module.

29. A solar cell, characterized in that, The solar cell includes a cell body and electrodes, wherein the electrodes are disposed on the surface of the cell body and connected to the cell body. The electrode is made using an electroplating carrier as described in any one of claims 1 to 15, or the electrode is made using an electroplating apparatus as described in any one of claims 16 to 26, or the electrode is made by an electroplating method as described in claim 27 or 28.

30. The solar cell according to claim 29, characterized in that, The battery body includes: a silicon substrate; an N-type doped semiconductor layer and a P-type doped semiconductor layer disposed on the back surface of the silicon substrate, wherein the N-type doped semiconductor layer and the P-type doped semiconductor layer are interdigitated. The electrode includes a seed layer and an electroplated metal layer formed on the seed layer, and the seed layer is in conductive contact with the corresponding N-type doped semiconductor layer and the P-type doped semiconductor layer, respectively.

31. A photovoltaic module, characterized in that, It includes a plurality of solar cells connected in series and / or in parallel, wherein at least one solar cell is a solar cell as described in claim 29 or 30.

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