Image generation device and head-up display device

Abstract

The embodiment of the invention discloses an image generation device and a head-up display device. The image generation device can comprise a heat dissipation element, a lamp panel and a conductive connecting piece. The lamp panel comprises at least one through hole; and one end of the conductive connecting piece is connected with the grounding end on the lamp panel, and the other end is electrically contacted with the radiating element through the through hole. The image generation device can solve the technical problem that the cost is high when the GND copper sheet network is difficult to form effective electrical connection with the heat dissipation element on the back side.

Description

Technical Field

[0001] This disclosure relates to the field of vehicle head-up display technology, and more particularly to an image generation device and a head-up display device. Background Technology

[0002] In the electronics field, especially in the design and manufacturing of automotive HUDs (Head-Up Displays), the requirements for heat dissipation and electromagnetic compatibility (EMC) are becoming increasingly stringent. Due to its excellent thermal conductivity, aluminum substrates are widely used in the design of printed circuit boards (PCBs) such as backlight boards, infrared boards, and laser boards, which require efficient heat dissipation.

[0003] The single-sided form of aluminum substrates limits their electrical connectivity. The back side is typically a single piece of aluminum reinforcement material, making it difficult for the copper grounding network (GND) on the front to form an effective electrical connection with the heat dissipation components on the back. To achieve GND network connectivity, a multi-layer board design, such as a four-layer board, is usually required, which undoubtedly increases manufacturing costs and production time. Summary of the Invention

[0004] In view of this, the present disclosure aims to provide an image generation device and a head-up display device that can solve the technical problem of high cost when the surface GND copper foil network of the backlight board or aluminum-based lamp board is difficult to form an effective electrical connection with the heat dissipation element on the back.

[0005] The technical solution of this disclosure embodiment is implemented as follows:

[0006] In a first aspect, embodiments of this disclosure provide an image generation apparatus, including:

[0007] Light panel;

[0008] Heat dissipation components, including metal structures;

[0009] The conductive connector has one end connected to the grounding terminal on the lamp board and the other end in electrical contact with the metal structure of the heat dissipation element.

[0010] In some examples, the lamp panel includes at least one through hole, one end of the conductive connector is connected to a ground terminal on the lamp panel, and the other end is in electrical contact with the metal structure of the heat dissipation element through the through hole.

[0011] In some examples, the conductive connector includes:

[0012] The base is located on the side of the lamp panel away from the heat dissipation element and is connected to the grounding terminal on the lamp panel;

[0013] A spring, fixed to the base, is disposed in the through hole;

[0014] The contact point, connected to the spring, is used for electrical contact with the metal structure of the heat dissipation element.

[0015] In some examples, the image generating device further includes:

[0016] A thermally conductive silicone pad is disposed between the lamp board and the heat dissipation element. The thermally conductive silicone pad includes at least one through hole, and the central axis of the through hole coincides with the central axis of the through hole.

[0017] The conductive connector makes electrical contact with the metal structure of the heat dissipation element through the through hole and the via.

[0018] In some examples, the light panel also includes:

[0019] The conductive layer is connected to the grounding terminal;

[0020] The through hole penetrates the conductive layer, and the conductive connector is connected to the conductive layer.

[0021] In some examples, the heat dissipation element further includes:

[0022] The central axis of the through hole coincides with the central axis of the through hole.

[0023] The conductive connector includes:

[0024] The screw has its first end connected to the grounding terminal of the lamp panel, and its second end passing through the through hole;

[0025] A nut, adapted to the second end of the screw, is disposed on the side of the heat dissipation element away from the lamp plate and is in electrical contact with the metal structure of the heat dissipation element.

[0026] In some examples, the conductive connector includes:

[0027] The slot has a first end connected to the grounding terminal of the lamp board and a second end connected to the metal structure of the heat dissipation element, and the lamp board is disposed in the slot.

[0028] A locking mechanism is used to set the opening and closing dimensions between the first and second ends of the slot.

[0029] In some examples, the image generating device further includes:

[0030] The light guide cavity is used to mount the lamp plate;

[0031] Display device for generating and displaying images based on illumination from a light panel.

[0032] In some examples, the light guide cavity includes at least one positioning post;

[0033] The light panel also includes:

[0034] At least one first positioning hole, adapted to the positioning post, is used to fix the lamp panel inside the light guide cavity.

[0035] In some examples, the heat dissipation element includes:

[0036] At least one second positioning hole is adapted to the positioning post;

[0037] Threaded holes are used to fix the heat dissipation element to the light guide cavity by screws that are adapted to the threaded holes.

[0038] In a second aspect, embodiments of this disclosure provide a head-up display device, including:

[0039] The image generation device described in the first aspect.

[0040] This disclosure provides an image generation device and a head-up display device. On one hand, it uses conductive connectors to establish electrical contact with heat dissipation elements, avoiding the need for more complex conductive materials to achieve contact. On the other hand, by ensuring electrical connection between the metal structure of the heat dissipation element and the grounding terminal of the lamp board, the device's electrostatic discharge (ESD) protection capability is enhanced, reducing device failures caused by electrostatic interference during EMC testing and increasing the probability of the product passing relevant test standards. Furthermore, it avoids the use of complex multilayer PCBs or additional conductive materials, reducing material costs, manufacturing costs, and time costs. Moreover, the direct electrical contact method provides a stable electrical connection, reducing the risk of connection failure due to poor contact or loose conductive connectors, and improving the overall reliability of the image generation device. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of a vehicle-mounted system provided in an embodiment of the present disclosure.

[0042] Figure 2 This is a schematic diagram of the structure of a first image generation device provided in an embodiment of the present disclosure.

[0043] Figure 3 This is a schematic diagram of the circuit connection structure of a lamp board provided in an embodiment of the present disclosure.

[0044] Figure 4 This is a schematic diagram of the structure of a second image generation device provided in an embodiment of this disclosure.

[0045] Figure 5 This is a schematic diagram of the structure of a conductive connector provided in an embodiment of this disclosure.

[0046] Figure 6 This is a schematic diagram of the planar structure of a lamp panel provided in an embodiment of the present disclosure.

[0047] Figure 7 An embodiment provided by this disclosure Figure 6 The side view at point A.

[0048] Figure 8 for Figure 7 A magnified view of a portion of region B in the middle.

[0049] Figure 9 This is a schematic diagram of the structure of a third image generation device provided in an embodiment of this disclosure.

[0050] Figure 10 An exemplary top view of the vehicle provided in this disclosure.

[0051] Figure 11 An exemplary perspective view from a vehicle driver's seat is provided for this disclosure.

[0052] Figure 12 This is a schematic diagram of the architecture of the head-up display device provided in this disclosure.

[0053] The accompanying drawings have illustrated specific embodiments of this disclosure, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this disclosure to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0054] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0055] like Figure 1 As shown, the vehicle-mounted system 100 includes: a navigation subsystem 110, an environmental detection device group 120 for acquiring the vehicle's environment during vehicle operation, a vehicle driving status detection device group 130, a data processing unit 140, a display control unit 150, and a display unit 160. These components or device groups are coupled together via a communication bus 12. In some examples, the communication bus 12 is used for communication between these components or device groups. It should be noted that... Figure 1 Only a portion of the vehicle system 100 is shown, not all of the components of the vehicle system 100.

[0056] exist Figure 1 The navigation subsystem 110 includes a positioning device 111 and a map information storage device 112. The positioning device 111 can determine the vehicle's location based on various positioning systems, including the Global Positioning System (GPS), China's BeiDou system, Russia's GLONASS system, Europe's Galileo system, Japan's Quasi-Zenith Satellite System (QZSS), and India's Indian Regional Navigation Satellite System (IRNSS), thus obtaining the vehicle's location information. The map information storage device 112 stores map information and can retrieve a navigation path to the destination based on the location information obtained from the positioning device 111, displaying the location information and navigation path in a map application.

[0057] exist Figure 1 In this system, the environmental monitoring equipment group 120 may include an in-vehicle communication device 121, a radar 122, a laser rangefinder 123, and a camera 124. These devices are capable of acquiring environmental information representing the surrounding environment of the vehicle.

[0058] The vehicle-mounted communication device 121 can wirelessly communicate with one or more devices, either directly or via a communication network. These devices can communicate with the vehicle-mounted communication device 121, including other vehicles, roadside vehicles or roadside stations, and mobile terminal devices used by occupants of the vehicle. In some examples, the vehicle-mounted communication device 121 can use 3G cellular communication, such as code division multiple access (CDMA), EVDO, Global System for Mobile Communications (GSM) / General Packet Radio Service (GPRS), or 4G cellular communication, such as long term evolution (LTE), or 5G cellular communication. In some examples, the vehicle-mounted communication device 121 can also communicate using WiFi and a wireless local area network (WLAN). In some embodiments, the vehicle-mounted communication device 121 can also communicate directly with devices using an infrared link, Bluetooth, or ZigBee. In some examples, the vehicle-mounted communication device 121 can also communicate with devices using other wireless protocols.

[0059] Radar 122 is used to sense objects in the vehicle's surrounding environment, and can also be used to sense the speed and / or direction of travel of these objects. In some examples, radar 122 can use electromagnetic waves or lasers as a medium to detect objects based on time-of-flight (TOF) or phase-shift methods, and detect the position of the detected object, the distance to the detected object, and the relative speed. In some examples, in order to detect objects located in front of, behind, or to the side of the vehicle, radar 122 can be configured at an appropriate location outside the vehicle.

[0060] The laser rangefinder 123 can use lasers to sense objects in the environment in which the vehicle is located. In some embodiments, the laser rangefinder 123 may include one or more laser sources, a laser scanner, and one or more detectors, as well as other system components.

[0061] Camera 124 can be used to capture multiple images of the vehicle's surrounding environment. Camera 124 can be a still camera or a video camera. In some examples, to acquire images of the vehicle's exterior, camera 124 can be positioned appropriately outside the vehicle. For example, to acquire images of the front of the vehicle, camera 124 can be positioned inside the vehicle's interior close to the windshield. Alternatively, camera 124 can be positioned around the front bumper or radiator grille. In some examples, to acquire images of the rear of the vehicle, camera 124 can be positioned inside the vehicle's interior close to the rear window. Alternatively, camera 124 can be positioned around the rear bumper, trunk, or tailgate. In some examples, to acquire images of the sides of the vehicle, camera 124 can be positioned inside the vehicle's interior close to at least one of the side windows. Alternatively, camera 124 can be positioned around a side mirror, fender, or door.

[0062] exist Figure 1 In this system, the vehicle driving state detection device group 130 may include: a steering angle sensor 131 for detecting the vehicle's steering angle, a vehicle speed sensor 132 for detecting the vehicle's speed, and an acceleration sensor 133 for detecting the acceleration applied to the vehicle. In some examples, as shown in the dashed box, it may also include an inertial sensor 134 for detecting changes in the vehicle's position and orientation based on inertial acceleration. In specific implementations, the inertial sensor 134 may be a combination of the acceleration sensor 133 and a gyroscope.

[0063] exist Figure 1In this embodiment, the data processing unit 140 can be implemented as a computing system having a memory, a processor, input / output interfaces, and buses connecting these components. In some examples, the data processing unit 140 causes the processor to execute multiple commands via program instructions stored in the memory to process data obtained from the navigation subsystem 110, the environmental detection device group 120, and the vehicle driving status detection device group 130. In some examples, the data processing unit 140 can also partially or completely control the driving of the vehicle based on the processed data.

[0064] exist Figure 1 As shown in the dashed box, the data processing unit 140, the display control unit 150, and the display unit 160 can serve as the main body of the head-up display (HUD) device 170. The display control unit 150 can receive data processed by the data processing unit 140, or data obtained from the navigation subsystem 110, the environmental detection equipment group 120, and the vehicle driving status detection equipment group 130, process the received data to obtain the display information to be displayed, and project the display information onto the windshield of the vehicle through the display unit 160 for display.

[0065] Head-up display (HUD) devices project the light from the image output from the image source onto an imaging window (e.g., an imaging panel, windshield, etc.) through reflective optical designs, to display vehicle status information such as speed and fuel level, as well as navigation and hazard warning information, at an appropriate position in front of the driver. This allows the driver to obtain relevant information such as speed and fuel level without deviating from the road ahead, thereby improving driving safety and driving experience.

[0066] In related technologies, during EMC electrostatic discharge (ESD) testing of HUDs, if the heat dissipation components of the internal lamp board of the HUD's optomechanical system are not connected to the GND of the lamp board, static electricity can strike the metal heat dissipation components of the HUD's optomechanical system, affecting the HUD's functionality, causing the device to freeze or display a distorted image, leading to test failure and failure to meet relevant national standard testing requirements. The lamp board in a HUD typically uses an aluminum substrate. In the technical solution of connecting the front GND copper foil of a single-sided aluminum substrate to the heat dissipation components on the back, there are several methods:

[0067] The first method involves designing screw holes on the front of the heat sink element, with the surrounding GND copper foil designed as open windows. Conductive screws are then driven through these holes onto the heat sink element on the back of the aluminum substrate, connecting the GND copper foil network on the front of the aluminum substrate to the heat sink element. This method requires modifying the lamp board structure, pre-drilling threaded holes on the lamp board, and creating open windows around the holes. During installation, screws need to be driven into the front of the lamp board, which must first be screwed into the heat sink element to form a module before it can be installed on the existing structure. However, the original installation process involves first installing the lamp board into the light guide cavity through the positioning holes in the structure, and then covering the back of the light guide cavity with the heat sink element through its positioning holes. Therefore, the introduction of screws will affect the existing installation sequence, making it impossible to install and position the structural components sequentially. This necessitates the introduction of screw-driving tooling or additional screw-driving stations and manpower. Structurally, the heat sink element needs corresponding screw hole positions. Modifying the existing heat sink element mold and introducing conductive screws will also increase costs.

[0068] The second method involves designing solder mask openings on the front GND copper foil of the aluminum substrate, exposing the copper. Conductive copper foil is then applied to the opening area and wrapped around the back of the aluminum substrate. After the heat sink is secured with screws, the conductive copper foil connects the heat sink to the front GND copper foil of the aluminum substrate. This method requires designing solder mask openings on the front of the light board, applying copper foil after the opening, adding manual or automated copper foil application stations and tooling, and increasing production costs. The copper foil wraps from the front to the back of the aluminum substrate, and the heat sink needs to be secured with screws to ensure tight contact with the copper foil. However, heat sinks are generally made of extruded or die-cast aluminum, resulting in uneven flatness. The thin copper foil can also prevent proper contact between the heat sink and the foil. Furthermore, the adhesive properties of the copper foil decrease over time, leading to poor contact and an unreliable connection.

[0069] The third method involves using a special welding process to weld the GND copper network on the front surface of the aluminum substrate to the reinforcing aluminum material on the back, thus connecting the entire aluminum reinforcement to GND. Conductive foam is then used on the back of the lamp board to connect with the heat dissipation element. This method requires a special welding process, resulting in poor reliability and high cost. The introduction of conductive foam in the redesigned lamp board further increases costs. The thermally conductive foam sandwiched between the heat dissipation element and the lamp board affects the contact area between them, thus impacting heat dissipation performance.

[0070] In summary, grounding the heat dissipation components in related technologies is costly and has low reliability.

[0071] Based on this, the present disclosure first provides an image generation device, referring to Figure 2 and Figure 5The image generation device may include a heat dissipation element 2, a lamp board 1, and a conductive connector 3. The heat dissipation element 2 includes a metal structure. One end of the conductive connector 3 is connected to the grounding terminal on the lamp board 1, and the other end is in electrical contact with the metal structure of the heat dissipation element 2.

[0072] The image generation device disclosed herein, on the one hand, establishes electrical contact between conductive connectors and heat dissipation elements, avoiding the need for more complex conductive materials to achieve contact. On the other hand, by ensuring electrical connection between the metal structure of the heat dissipation element and the grounding terminal of the lamp board, the device's electrostatic discharge (ESD) protection capability is enhanced, reducing equipment failures caused by electrostatic interference during EMC testing and increasing the probability of the product passing relevant test standards. Furthermore, it avoids the use of complex multilayer PCBs or additional conductive materials, reducing material costs, manufacturing costs, and time costs. Moreover, the direct electrical contact method provides a stable electrical connection, reducing the risk of connection failure due to poor contact or loose conductive connectors, and improving the overall reliability of the image generation device.

[0073] The following is a detailed description of each of the above components.

[0074] In some example implementations, refer to Figure 2 The light panel 1 can be provided with at least one through hole 11. The shape of the light panel 1 can be rectangular or other shapes. The specific shape can be customized according to user needs, which will not be elaborated in this example. The number of through holes 11 can be one or more. The more through holes 11 there are, the higher the manufacturing cost will be, but the better the stability will be. The specific number can be customized according to user needs.

[0075] In this example embodiment, the lamp board 1 can be an aluminum substrate, whose metal base provides better thermal conductivity, enabling the aluminum substrate to carry higher currents than conventional circuit boards. The aluminum substrate has better mechanical durability and is more suitable for use in harsh mechanical or environmental conditions. The aluminum substrate has a lower coefficient of thermal expansion, which is closer to that of copper foil, which helps to ensure the quality and reliability of the printed circuit board and reduce circuit problems caused by thermal expansion.

[0076] The cross-sectional shape of the above-mentioned multiple through holes 11 can be circular, rectangular, elliptical, etc., or it can be customized according to user needs, which will not be elaborated in this example.

[0077] In some examples, the lamp board 1 may include multiple LEDs connected to a power supply, which provides electrical energy to the LEDs so that they illuminate. The lamp board 1 may also include a controller for controlling the operating status of the multiple LEDs. The LEDs and the power supply can be connected via wiring on the lamp board 1, and the connection relationship between the LEDs and the circuit is as follows. Figure 3As shown, multiple LEDs are connected in series and then connected to the power supply. A grounding terminal is also provided on the lamp board 1.

[0078] Reference Figure 3 The circuit design can include multiple test points (TPs), such as TP1, TP2, etc. TP1 is grounded, therefore, the aforementioned conductive connector 3 can be connected to TP1. Each LED can have one test point. For example, assuming the LED board includes six LEDs, namely D1, D2, D3, D4, D5, and D6, there can be six LED test points. Specifically, these could be TP18 for testing D1, TP17 for testing D2, TP16 for testing D3, TP15 for testing D4, TP14 for testing D5, and TP13 for testing D6. Furthermore, a protective resistor R1 can be included in the circuit design to prevent irreversible damage to the LED board caused by a short circuit. One end of the protective resistor R1 is connected to TP1, and the other end is connected to TP2. One end of D1 is connected to T18, and the other end can be connected to TP4. The test points are used to test the LED circuit to ensure the safe and stable operation of the circuit.

[0079] In some examples, refer to Figure 2 When the lamp board 1 is rectangular, the lamp beads can be placed in the center of the rectangle, and the through hole 11 can be placed near the grounding end of the lamp board 1 so that the conductive connector 3 can be connected to the grounding end using the shortest path.

[0080] In some examples, refer to Figure 4 A conductive layer 12 may be provided on the lamp board 1. The conductive layer 12 may be arranged around the lamp beads. The conductive layer 12 is connected to the grounding terminal on the lamp board 1 through a wiring. The through hole 11 penetrates the conductive layer 12. That is to say, the conductive connector 3 may be connected to the conductive layer 12 to ground the static electricity of the heat dissipation element through the conductive connector 3 and the conductive layer 12.

[0081] In some examples, refer to Figure 5 The conductive connector 3 may include a base 31, a spring 32, and a contact 33. The base 31 is disposed on the side of the lamp panel 1 away from the heat dissipation element and is connected to the grounding terminal. The spring 32 is connected between the base 31 and the contact 33 and is disposed inside the through hole 11. The contact 33 is electrically connected to the heat dissipation element 2. The base 31, spring 32, and contact 33 in the conductive connector 3 are all made of conductive materials, such as metal. In this example embodiment, the specific material is not specifically limited.

[0082] In some examples, the conductive connector 3 may further include a spring positioning member 34 connected to the base 31, with the spring 32 disposed inside the spring positioning member 34 to position the spring 32. The use of the spring positioning member 34 protects the spring 32 from damage, increases its service life, and thus improves the durability of the entire connection system. Because the spring positioning member 34 provides additional protection, maintenance work due to damage to the spring 32 can be reduced.

[0083] Optionally, the spring positioning element 34 can also be made of a conductive material, which can improve the conductivity of the conductive connector 3.

[0084] In some examples, the conductive connector 3 described above can be an elastic structure such as a POGOPIN spring contact probe. The conductive connector 3 is set as an elastic structure, which can provide mechanical elasticity and can adapt to small displacements caused by thermal expansion, mechanical vibration or installation errors.

[0085] In some examples, when the lamp panel 1 does not include a conductive layer, the base 31 can be connected to the grounding terminal by wiring or by soldering.

[0086] In other examples, when the lamp panel 1 includes a conductive layer, since the through hole 11 is located in the conductive layer, the base 31 of the conductive connector 3 can directly contact the conductive layer. Specifically, it can be connected by welding. The specific welding method can be customized according to user needs, and will not be described in detail in this example embodiment.

[0087] One end of the conductive connector 3 is connected to the grounding terminal of the lamp board 1, and the other end is electrically connected to the metal structure of the heat dissipation element 2 through the through hole 11, so as to transfer the static electricity on the heat dissipation element 2 to the grounding terminal of the lamp board 1 through the conductive connector 3.

[0088] Optional, refer to Figure 6 The image generation device described above may also include a thermally conductive silicone pad 4, which can be disposed between the lamp board 1 and the heat dissipation element 2 to transfer the heat of the lamp board 1 to the heat dissipation element more quickly, and to prevent mechanical collision between the lamp board 1 and the heat dissipation element 2, thereby enhancing the service life of the lamp board 1.

[0089] At least one through hole can be provided on the thermally conductive silicone pad 4. The central axis of the through hole coincides with the central axis of the through hole 11, and the number of through holes is the same as the number of through holes 11. The conductive connector 3 makes electrical contact with the metal structure of the heat dissipation element 2 through the through holes and through holes 11.

[0090] For example, there are four vias and four through holes 11, and their cross-sections are all circular. In this case, the cross-sections of the vias and the through holes 11 have the same radius.

[0091] Reference Figure 7 As shown, at least one first positioning hole 14 can also be provided on the lamp board 1 for mounting the lamp board 1 into the light guide cavity 5, as shown in the figure. Figure 8 and Figure 9 After the conductive connector 3 passes through the lamp board 1, the base 31 of the conductive connector 3 is set on the side of the lamp board 1 where the lamp beads are set. The length of the spring 32 is the same as the total length of the through hole 11 and the through hole, so that the contact 33 just extends out of the through hole. After the lamp board 1, the thermal conductive silicone pad 4 and the heat dissipation element 2 are assembled, the spring 32 is in a compressed state, and the contact 33 is in electrical contact with the surface of the heat dissipation element 2, which can prevent poor contact caused by vibration and other phenomena.

[0092] In some examples, refer to Figure 2 and Figure 6 The heat dissipation element is used to dissipate heat from the lamp panel 1. The heat dissipation element can be a rectangular plate structure, including a metal structure. Optionally, the heat dissipation element is a metal rectangular plate structure and is disposed on the side of the lamp panel 1 away from the lamp beads. A protruding structure 22 is provided on the side of the heat dissipation element away from the lamp panel 1 to increase the heat dissipation area.

[0093] It should be noted that the heat dissipation element 2 can also be a heat dissipation structure such as a shell or a base plate. Its specific shape can be set according to the requirements, which will not be elaborated here.

[0094] In some examples, the heat dissipation element 2 may include at least one through hole (not shown), the central axis of which coincides with the central axis of the through hole 11. In this case, the conductive connector 3 may include a screw and a nut, the nut being adapted to the screw. One side of the screw may include a base 31, connected to the conductive layer or grounding terminal. The screw passes through the through hole 11 and the through hole and is fixed to the heat dissipation element 2 by the nut. At least one of the screw and the nut is in electrical contact with the metal structure of the heat dissipation element. While solving the grounding of the heat dissipation element 2, the screw passing through the through hole 11 and the through hole and being fixed by the nut enhances the mechanical connection between the heat dissipation element 2 and the lamp board 1, improving the stability of the entire structure. The robust connection between the heat dissipation element 2 and the lamp board 1 helps improve heat conduction efficiency because it reduces the air gap, thereby reducing thermal resistance.

[0095] The number of through holes is the same as the number of through holes 11, and the cross-section of the through holes can be the same as the cross-sectional shape of the through holes 11. For example, the number of through holes and through holes 11 are both 4, and the cross-section of each is circular. In this case, the cross-section of the through holes has the same radius as the cross-section of the through holes 11.

[0096] In some examples, the conductive connector may include a slot and a locking mechanism. The slot may include a straight plate, an upper buckle, and a lower buckle. The upper buckle and the lower buckle are arranged in parallel and are both perpendicular to the straight plate. The first end of the slot (the upper buckle) is connected to the grounding end of the lamp board 1, and the second end of the slot (the lower buckle) can be attached to the side of the lamp board 1 where no lamp beads are installed, so that when the lamp board is attached to the heat dissipation element, the second end of the slot can be connected to the metal structure of the heat dissipation element 2.

[0097] The aforementioned light panel is disposed in the aforementioned slot, which can engage with the edge of the light panel or with the aforementioned through hole 11, as will not be elaborated in this example embodiment. In some examples, the thickness of the upper and lower clips can be set according to structural strength requirements; the thinner the clips, the less impact they have on the assembly of the image generation device.

[0098] The locking mechanism is used to set the opening and closing dimensions between the first and second ends of the slot, so that the conductive connector can be adapted to lamp panels of different thicknesses.

[0099] In some examples, when the image generating device includes a thermally conductive silicone pad 4, the thermally conductive silicone pad 4 is disposed inside the slot. Specifically, the opening and closing size of the slot can be adjusted by the locking mechanism so that both the lamp board 1 and the thermally conductive silicone pad 4 are disposed inside the slot. The slot allows for a tighter fit between the thermally conductive silicone pad 4 and the lamp board 1.

[0100] Optionally, the straight plate can be disposed inside the through hole 11, with the upper clip connected to the grounding terminal and the lower clip in electrical contact with the metal structure of the heat dissipation element.

[0101] In some examples, refer to Figure 6 The aforementioned image generation device may further include a light guide cavity 5 and a display device 6. The aforementioned lamp board 1 may be installed inside the light guide cavity 5 to prevent external light from interfering with the light emitted by the lamp board 1. At least one positioning post may be provided inside the light guide cavity 5, and at least one first positioning hole 14 may be provided on the lamp board 1. The number of positioning posts and the number of first positioning holes 14 are the same. The lamp board 1 is positioned inside the light guide cavity 5 by the cooperation of the positioning posts and the first positioning holes 14.

[0102] In some examples, there are two positioning posts and two first positioning holes 14. The cooperation between the positioning posts and the first positioning holes 14 can prevent the light panel 1 from colliding with the inside of the light guide cavity 5 and increase the service life of the image generation device.

[0103] It should be noted that the positioning post can be inserted into the first positioning hole 14 to position the lamp tube. The cross-section of the positioning post and the cross-section of the first positioning hole 14 can be circular, triangular, rectangular, etc., which will not be elaborated in this example embodiment.

[0104] For example, when the cross-sections of the positioning post and the first positioning hole 14 are both circular, the diameter of the positioning post is slightly smaller than the inner diameter of the first positioning hole 14, so that the positioning post can pass through the first positioning hole 14.

[0105] Optionally, the heat dissipation element may also include at least one second positioning hole 21, which has the same structure and central axis as the first positioning hole 14, so that the positioning post can pass through the second positioning hole 21.

[0106] Optionally, the aforementioned thermally conductive silicone pad 4 may include at least one third positioning hole 42. The third positioning hole 42 may have the same structure as the aforementioned first positioning hole 14, and its central axis may coincide with that of the aforementioned first positioning hole 14, so that the lamp panel 1, the thermally conductive silicone pad 4, and the aforementioned heat dissipation element 2 can be positioned by the same positioning post. By ensuring that the structure and position of the positioning holes are consistent, the precise alignment between components can be improved, and installation errors can be reduced. The identical positioning hole design means that the same positioning post can be used to fix the lamp panel 1, the thermally conductive silicone pad 4, and the heat dissipation element 2, which can improve assembly efficiency. The coincident central axis helps to ensure the mechanical stability of each component and reduces mechanical stress caused by inaccurate positioning. If it is necessary to replace or maintain the heat dissipation element 2 or the lamp panel 1, the identical positioning hole design makes disassembly and reinstallation easier.

[0107] In some examples, the heat dissipation element may also include multiple threaded holes 23 for fixing the heat dissipation element to the light guide cavity 5 by bolts 7, and for tightly connecting and pressing the heat dissipation element 2, thermally conductive silicone pad 4, lamp board 1, and light guide cavity 5 to ensure good contact and stable heat dissipation.

[0108] The display device 6 is connected to the light guide cavity 5 and is used to receive the light emitted by the light panel 1, generate an image and display it. The display device 6 is located on the side of the light panel 1 near the lamp beads. The display device 6 may include an image processor and an LCD screen to display information such as navigation, vehicle speed, and gear position of the HUD device during operation.

[0109] The image generation device provided in this disclosure, on the one hand, uses conductive connectors to establish electrical contact with heat dissipation elements, avoiding the need for more complex conductive materials to achieve contact. On the other hand, by ensuring electrical connection between the heat dissipation elements and the grounding terminal of the lamp board, the device's electrostatic discharge (ESD) protection capability can be enhanced, reducing equipment failures caused by electrostatic interference during EMC testing and increasing the probability of the product passing relevant test standards. Furthermore, it avoids the use of complex multilayer PCBs or additional conductive materials, reducing material, manufacturing, and time costs. Moreover, the direct electrical contact method provides a stable electrical connection, reducing the risk of connection failure due to poor contact or loose conductive connectors, and improving the overall reliability of the image generation device. Simultaneously, the design of at least one through-hole 11 provides flexibility in the design of the lamp board 1, allowing adjustments based on the specific layout of the heat dissipation elements 2 and the size of the lamp board 1 to adapt to different product design requirements. The conductive connector 3 is configured as an elastic structure, providing mechanical elasticity to accommodate minor displacements caused by thermal expansion, mechanical vibration, or installation errors.

[0110] Furthermore, this disclosure also provides a head-up display device including the aforementioned image generation device, and a vehicle including the aforementioned head-up display device, specifically referring to... Figure 10 and Figure 11 The head-up display can be installed on the vehicle, which includes a windshield 1004 located at the front of the vehicle. The driver and passengers in the vehicle's passenger cabin 1008 can see ahead of the vehicle through the windshield 1004.

[0111] exist Figure 11 In this configuration, the windshield 1004 is visually positioned above the vehicle's dashboard 1006. The driver can turn the steering wheel 1010 within the passenger cabin 1008 to steer the vehicle, for example, to change lanes, merge, and park. In some embodiments, the steering wheel 1010 may be retracted or omitted.

[0112] Reference Figure 11 Heads-up display device 170 (see Figure 12 Display information 1012 (e.g., a virtual image) is projected onto a portion of the windshield 1004 through one or more holes (e.g., hole 1016) in the dashboard 1006. Although Figure 12 An example size of the displayed information 1012 is shown, but the displayed information 1012 can be presented in a larger or smaller area. Examples of the displayed information 1012 include various vehicle information such as current vehicle speed, current gear of the vehicle's transmission, engine speed, vehicle direction, current infotainment system settings, and / or other vehicle information. The head-up display device 170 provides information to the vehicle driver without requiring the driver to take their eyes off objects in front of the vehicle.

[0113] See Figure 12 The exemplary implementation architecture of the head-up display device 170 shown includes a display control unit 150 that generates a signal 412 based on data processed by the data processing unit 140, or data 420 transmitted by the navigation subsystem 110, the environmental detection device group 120, and the vehicle driving status detection device group 130. The aforementioned communication control circuit is located in the data processing unit 140 and transmits display information to the display control unit 150.

[0114] The display unit 160 may include a light source 161 and an optical path assembly 162. The light source 161 outputs light (e.g., a virtual image) based on a signal 412 from the display control unit 150 to display on the windshield 1004. For example, the light source 161 may include one or more lasers and output red, green, and blue light.

[0115] The optical path assembly 162 reflects the output of the light source 161 onto the windshield 1004 through the aperture 1016. A viewer (e.g., a driver) can view the display information 1012 projected onto the windshield 1004 in the display area. In some examples, the optical path assembly 162 may include one or more reflectors (plane mirrors) and concave mirrors (magnifying glasses). The output of the light source 161 is reflected back via the reflector and magnified by the concave mirror before being reflected back onto the windshield 1004 to form a virtual image 40 that can be visually observed by the driver. The visual effect of this virtual image 40 is that it is projected onto a projection surface 41 at a predetermined distance in front of the vehicle, but the real environment remains visible through the projection surface 41. In some examples, the optical path assembly 162 may be omitted, and the light source 161 may project the display information 1012 directly onto the windshield 1004 to form the virtual image 40 on the projection surface 41.

[0116] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0117] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a data transmission connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0118] The use of "a" or "an" in the specification or claims of this invention includes both one or more cases, except where it is explicitly stated that there is only one. Similarly, the use of "two" or "two" in the specification or claims includes two or more cases, except where it is explicitly stated that there are only two. Sometimes, the claims and specification may include words such as "multiple," "one or more," or "at least one," however, the absence of such limitations does not mean and should not be construed as meaning or contemplating multiple.

[0119] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and all such changes and modifications should fall within the scope of this application; the scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. An image generation device, characterized in that, include: Light panel; Heat dissipation components, including metal structures; The conductive connector has one end connected to the grounding terminal on the lamp board and the other end in electrical contact with the metal structure of the heat dissipation element.

2. The image generation device according to claim 1, characterized in that, The lamp panel includes at least one through hole. One end of the conductive connector is connected to the grounding terminal on the lamp panel, and the other end is in electrical contact with the metal structure of the heat dissipation element through the through hole.

3. The image generation device according to claim 2, characterized in that, The conductive connector includes: The base is located on the side of the lamp panel away from the heat dissipation element and is connected to the grounding terminal on the lamp panel; A spring, fixed to the base, is disposed in the through hole; The contact point, connected to the spring, is used for electrical contact with the metal structure of the heat dissipation element.

4. The image generation device according to claim 3, characterized in that, The image generation device further includes: A thermally conductive silicone pad is disposed between the lamp board and the heat dissipation element. The thermally conductive silicone pad includes at least one through hole, and the central axis of the through hole coincides with the central axis of the through hole. The conductive connector is in electrical contact with the metal structure of the heat dissipation element through the through hole and the via.

5. The image generation device according to claim 2, characterized in that, The light panel also includes: The conductive layer is connected to the grounding terminal; The through hole penetrates the conductive layer, and the conductive connector is connected to the conductive layer.

6. The image generation device according to claim 2, characterized in that, The heat dissipation element also includes: The central axis of the through hole coincides with the central axis of the through hole. The conductive connector includes: The screw has its first end connected to the grounding terminal of the lamp panel, and its second end passing through the through hole; A nut, adapted to the second end of the screw, is disposed on the side of the heat dissipation element away from the lamp plate and is in electrical contact with the metal structure of the heat dissipation element.

7. The image generation apparatus according to claim 1 or 2, characterized in that, The conductive connector includes: The slot has a first end connected to the grounding terminal of the lamp board and a second end connected to the metal structure of the heat dissipation element, and the lamp board is disposed in the slot. A locking mechanism is used to set the opening and closing dimensions between the first and second ends of the slot.

8. The image generation device according to claim 1, characterized in that, The image generation device further includes: The light guide cavity is used to mount the lamp plate; Display device for generating and displaying images based on illumination from a light panel.

9. The image generation apparatus according to claim 8, characterized in that, The light guide cavity includes at least one positioning post; The light panel also includes: At least one first positioning hole, adapted to the positioning post, is used to fix the lamp panel inside the light guide cavity.

10. The image generation apparatus according to claim 9, characterized in that, The heat dissipation element includes: At least one second positioning hole is adapted to the positioning post; Threaded holes are used to fix the heat dissipation element to the light guide cavity by screws that are adapted to the threaded holes.

11. A head-up display device, characterized in that, include: The image generation apparatus according to any one of claims 1 to 10.

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