Multifunctional ion trap chip rapid replacement device and method and quantum computer

Abstract

The invention provides a multifunctional ion trap chip rapid replacement device, and the system comprises a vacuum assembly which comprises a first vacuum cavity, a bridging mechanism and a second vacuum cavity, the conveying assembly comprises a sample conveying mechanism and a chip carrier plate frame arranged at the conveying end of the sample conveying mechanism, the sample conveying mechanism is connected with the first vacuum cavity, and the conveying end can sequentially penetrate through the first vacuum cavity and the bridging mechanism to convey the chip carrier plate frame into the second vacuum cavity for chip replacement; the cleaning assembly comprises a cleaning cavity connected with the first vacuum cavity and a gas inlet valve arranged on the cleaning cavity, and cleaning gas can be introduced into the cleaning cavity through the gas inlet valve; and the replacement assembly comprises a switching mechanism, and the switching mechanism is arranged in the second vacuum cavity and is used for switching the chip on the chip carrier plate frame. According to the invention, the to-be-tested ion trap chip can be effectively and rapidly replaced.

Description

Technical Field

[0001] This invention belongs to the field of quantum chip testing technology, and specifically relates to a multifunctional ion trap chip rapid replacement device, method, and quantum computer. Background Technology

[0002] Ion trap quantum computers, which utilize the principles of quantum mechanics, are considered one of the most promising methods for achieving scalable quantum computing and have the potential to surpass traditional computers. Chip-based ion trap systems, with their integration, precise control, and high scalability, provide a feasible approach to building large-scale quantum computers and realizing quantum information processing, and have broad prospects for experimental implementation and commercial applications. However, almost all experiments related to ion traps rely on complex optical devices and ultra-high vacuum systems with optical pathways.

[0003] Developing a novel ion trap chip is a complex iterative process involving extensive prototyping, benchmarking, and validation. The ultra-high vacuum conditions required for ion trap experiments limit rapid iterative testing because restoring the ultra-high vacuum takes several weeks each time a new chip sample is replaced. Furthermore, the disassembly and reassembly of the ion trap chip during the ultra-high vacuum restoration process contaminates the vacuum system with the laboratory environment. This causes contaminants to adsorb onto the ion trap chip surface, leading to a sharp increase in the heating rate of cooled ions. Using cryogenic cooling devices can significantly accelerate the ultra-high vacuum restoration process, but this method requires complex and expensive external cooling equipment to maintain the ultra-high vacuum pressure.

[0004] The existing solution involves using a specially designed ultra-high vacuum chip replacement system, in which the chip is loaded into a separate chamber, and after loading several replaceable chips, vacuum preparation is performed. However, this method is limited by its complex and bulky structure in terms of the number of electrical connections and the number of chips that can be stored. Since restoring ultra-high vacuum requires baking, once the vacuum is broken and a new chip is inserted, the new chip inevitably comes into contact with the atmospheric environment, causing contamination. At the same time, the entire experimental platform still needs to be shut down and the vacuum preparation needs to be completed, which is quite time-consuming.

[0005] Therefore, it is necessary to design a multifunctional ion trap chip rapid replacement device, method, and quantum computer to solve the above-mentioned technical problems. Summary of the Invention

[0006] To address the above problems, the present invention provides a multifunctional ion trap chip quick replacement device, the system comprising:

[0007] A vacuum assembly includes a first vacuum chamber, a bridging mechanism, and a second vacuum chamber that are sequentially connected.

[0008] The transfer assembly includes a sample delivery mechanism and a chip carrier rack disposed at its transfer end. The sample delivery mechanism is connected to a first vacuum chamber, and the transfer end can sequentially pass through the first vacuum chamber and the bridging mechanism to transfer the chip carrier rack to a second vacuum chamber for chip replacement.

[0009] The cleaning assembly includes a cleaning chamber connected to a first vacuum chamber and an air inlet valve provided on the cleaning chamber, through which cleaning gas can be introduced into the cleaning chamber.

[0010] The replacement component includes an adapter mechanism located within a second vacuum chamber for transferring chips from a chip carrier.

[0011] Furthermore, the sample delivery mechanism includes a sample delivery chamber connected to the first vacuum chamber, a first housing connected to the sample delivery chamber, and a sample delivery rod disposed inside the first housing, wherein,

[0012] One end of the sample feeding rod is the conveying end, which is equipped with a locking component. The locking component can be connected to the chip carrier frame to lock the chip carrier frame.

[0013] Furthermore, the locking assembly includes a locking rod connected to the end face of the conveying end, wherein,

[0014] The end face of the locking rod is provided with a positioning hole extending into the inside of the locking rod, and two T-shaped limiting grooves are opened on the outer wall of the end of the locking rod. The chip carrier can be installed on the positioning hole and fixed by the two T-shaped limiting grooves.

[0015] Furthermore, an auxiliary disengagement mechanism is installed within the positioning hole, wherein,

[0016] The auxiliary release mechanism includes a spring and a top block installed sequentially from the positioning hole outwards. The top block has a strip-shaped limiting groove on its body. The outer wall of the end of the locking rod is provided with a limiting screw. The limiting screw is screwed into the positioning hole from the outer wall of the locking rod and inserted into the strip-shaped limiting groove.

[0017] Furthermore, the chip carrier includes a frame, wherein,

[0018] The frame has through holes, and the bottom of the through holes has a support platform along the inner wall of the through holes for placing chips.

[0019] Furthermore, the other end face of the frame is provided with a connecting groove, and the connecting groove is provided with a connecting rod and two inserts. The connecting rod can be inserted into the positioning hole, and the two inserts can be inserted into two T-shaped limiting grooves.

[0020] Furthermore, the moving mechanism includes a second housing connected to the vacuum storage cavity and a moving rod disposed inside the second housing, wherein one end of the moving rod is the moving end.

[0021] Furthermore, the cleaning assembly also includes a vacuum feeder, which is installed on the cleaning chamber.

[0022] Furthermore, the adapter mechanism includes a fixed cover plate, which is fixed on a chip holder inside the second vacuum chamber. The fixed cover plate has a carrier sliding groove that extends laterally through the fixed cover plate for mounting the chip carrier frame.

[0023] Furthermore, the storage component also includes a first vacuum pump connected to the vacuum storage chamber.

[0024] Furthermore, the bridging mechanism includes a bridging cavity, a first gate valve, and a second gate valve, wherein,

[0025] The first gate valve and the second gate valve are respectively located at both ends of the bridging cavity. The first gate valve is connected to the first vacuum cavity, and the second gate valve is connected to the second vacuum cavity.

[0026] Furthermore, the second gate valve is connected to the second vacuum chamber via a vacuum maintaining mechanism included in the vacuum assembly, wherein the vacuum maintaining mechanism includes a maintaining chamber and a second vacuum pump, and the maintaining chamber is connected to the second gate valve and the second vacuum chamber.

[0027] On the one hand, the present invention also provides a method for rapid replacement of a multifunctional ion trap chip, the method being implemented based on the above-mentioned apparatus, the method comprising:

[0028] S11. Preparation: Install chips on all chip carrier boards and store them in the first vacuum chamber;

[0029] S12, Plasma cleaning: The sample delivery mechanism controls the plasma cleaning of all stored chips in the cleaning chamber through which cleaning gas is introduced via the air inlet valve.

[0030] S13. Vacuum preparation: Vacuum preparation is performed on the first vacuum chamber, the bridging chamber and the second vacuum chamber.

[0031] S14. Control the sample delivery mechanism to send the chip after step S13 into the transfer mechanism in the second vacuum chamber for the first test chip installation.

[0032] S15, Holding state: Maintain the connection state of the first vacuum chamber, the bridging chamber and the second vacuum chamber; or, Removal state: Remove the entire conveying assembly and the cleaning assembly together with the first vacuum chamber while maintaining vacuum.

[0033] S16. Chip replacement: Replace the test chip that needs to be replaced in the second vacuum chamber.

[0034] Replacement scenario (1): If in the holding state in S15, the first vacuum chamber, the bridging chamber and the second vacuum chamber are connected. Control the sample delivery mechanism to move, lock and pull out the chip carrier in the second vacuum chamber, repeat the S14 process, and the chip replacement can be completed.

[0035] Replacement Situation (II): If the device is in the dismantling state in S15, reinstall the entire dismantled conveying assembly and cleaning assembly together with the first vacuum chamber while maintaining a vacuum, and then repeat the steps of Replacement Situation (I).

[0036] Furthermore, the method also includes:

[0037] S21. Remove the components. When all the stored chips are used up and replenishment is needed, remove the entire transfer component, cleaning component and the first vacuum chamber together.

[0038] S22. Reinstall the chips: Remove all stored chips and reinstall the chips.

[0039] S23. Clean the chips again, and perform plasma cleaning on all chips again;

[0040] S24. Reinstall the removed components, and reinstall the entire conveying component, cleaning component and the first vacuum chamber together in a way that maintains a vacuum, to restore the vacuum of the bridging mechanism.

[0041] S25. If it is necessary to replace the chip again, repeat the steps in replacement case (1).

[0042] On the other hand, the present invention also provides a quantum computer, which includes the replacement system as described above.

[0043] This invention provides a multifunctional ion trap chip rapid replacement device, method, and quantum computer. The vacuum is divided into three parts, with the second vacuum chamber maintaining an ultra-high vacuum state under all circumstances. This eliminates the need to break the vacuum in the second vacuum chamber for chip replacement. A vacuum bridging mechanism connects the first and second vacuum chambers, requiring only the vacuum level of the bridging mechanism to be restored in all cases, significantly shortening the time required to restore the ultra-high vacuum. Furthermore, a cleaning component allows for pre-treatment of the chip using plasma cleaning, reducing heat generation during chip testing.

[0044] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description, claims and drawings. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 A schematic diagram of a multifunctional ion trap chip quick-change device according to an embodiment of the present invention is shown;

[0047] Figure 2 An embodiment of the present invention is shown. Figure 1 Top view.

[0048] Figure 3 A partial structural schematic diagram of a transmission component according to an embodiment of the present invention is shown;

[0049] Figure 4 A partial structural schematic diagram of the sample feeding rod according to an embodiment of the present invention is shown;

[0050] Figure 5 An exploded view of the installation between the sample feed bar and the chip carrier according to an embodiment of the present invention is shown;

[0051] Figure 6 A schematic diagram of the chip carrier frame according to an embodiment of the present invention is shown;

[0052] Figure 7 A partial structural schematic diagram of a storage component according to an embodiment of the present invention is shown;

[0053] Figure 8 A schematic diagram of a chip storage mechanism according to an embodiment of the present invention is shown;

[0054] Figure 9 A schematic diagram of the adapter mechanism according to an embodiment of the present invention is shown. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0056] like Figure 1 and Figure 2 As shown, the present invention provides a multifunctional ion trap chip quick replacement device. The system includes a vacuum component, a transmission component, a storage component, and a replacement component, which will be described in detail below.

[0057] 1. Vacuum assembly:

[0058] The vacuum assembly includes a first vacuum chamber 1, a bridging mechanism 2, and a second vacuum chamber 3 that are connected in sequence. It should be understood that, in this embodiment, the bridging mechanism can control whether the first vacuum chamber 1 and the second vacuum chamber 3 can be connected or closed.

[0059] 2. Teleportation Component:

[0060] The transfer assembly includes a sample delivery mechanism 4 and a chip carrier 5 disposed at its transfer end. The sample delivery mechanism 4 is connected to the first vacuum chamber 1, and under the control of the control mechanism, the transfer end can sequentially pass through the first vacuum chamber 1 and the bridging mechanism 2 to transfer the chip carrier 5 to the second vacuum chamber 3 for chip replacement.

[0061] 3. Storage components

[0062] The storage component includes a vacuum storage cavity 6 connected to a first vacuum cavity 1, a moving mechanism 7 connected to the vacuum storage cavity 6, and a chip storage mechanism 8 disposed at the moving end of the moving mechanism 7. The moving end of the moving mechanism 7 is disposed in the vacuum storage cavity 6, and the chip storage mechanism 8 stores a plurality of chip carriers 5 loaded with chips.

[0063] 4. Cleaning components

[0064] The cleaning assembly includes a cleaning chamber 101 connected to a first vacuum chamber 1, an air inlet valve 102 disposed on the cleaning chamber 101, and an ionization mechanism disposed within the cleaning chamber 101. The ionization mechanism is used to ionize the gas introduced into the cleaning chamber 101 to form a plasma state. The nozzle of the cleaning chamber 101 is aligned with the chip carrier 5 within the first vacuum chamber 1. Cleaning gas can be introduced into the cleaning chamber 101 through the air inlet valve 102.

[0065] 5. Replace components

[0066] The replacement component includes an adapter mechanism 9, which is located in the second vacuum chamber 3 and is used to transfer chips on the chip carrier 5.

[0067] The following is a detailed description of each component.

[0068] In some embodiments of the present invention, such as Figure 1 , Figure 3 As shown, the sample delivery mechanism 4 includes a sample delivery chamber 401 connected to the first vacuum chamber 1, a first housing 402 connected to the sample delivery chamber 401, and a sample delivery rod 403 disposed inside the first housing 402, wherein, as Figure 4 As shown, one end of the sample feeding rod 403 is the conveying end, and the conveying end is provided with a locking component. The locking component can be connected to the chip carrier 5 and is used to lock the chip carrier 5.

[0069] The locking assembly includes a locking rod 411 connected to the end face of the transmission end. The end face of the locking rod 411 has a positioning hole 404 extending into the locking rod 411. The outer wall of the end of the locking rod 411 has two T-shaped limiting grooves 405. One end of each T-shaped limiting groove 405 extends to the end face of the locking rod 411, allowing the chip carrier 5 to be mounted on the positioning hole 404 and fixed by the two T-shaped limiting grooves 405.

[0070] In this embodiment, the entire sample delivery rod 403 can be controlled by a first control mechanism to move within the first housing 402. The first control mechanism can control the movement of the sample delivery rod 403 through the meshing of a motor with a gear and rack. For example, the first control mechanism includes components such as a motor, gears, and a rack. A first motor is installed within the first housing 402, a gear is installed at the output end of the first motor, and a rack is installed on the sample delivery rod 403. Through the meshing of the rack and gear, the movement of the sample delivery rod 403 within the first housing 402 can be controlled. Figure 3 As shown, the first control mechanism can also be controlled via magnetic coupling technology. For example, the first control mechanism includes a first magnet, a second magnet, and a first limiting sleeve 410. The first limiting sleeve 410 is fitted onto the outside of the first housing 402 and close to the sample delivery chamber 401 (this position is set as needed; that is, as long as the sample delivery rod 403 moves to its maximum position and is just blocked by the first limiting sleeve 410, the locking assembly can just lock or disengage the chip carrier 5). It also slides in contact with the outside of the first housing 402. The other end of the sample delivery rod 403 inside the first housing 402 is provided with a second magnet that can be attracted by the first magnet. When the first magnet slides inside the first housing 402, the second magnet can be attracted and move within the first housing 402. Alternatively, the first magnet can be driven to slide on the first housing 402 by some power mechanism, such as a hydraulic cylinder or a pneumatic cylinder.

[0071] In addition, in this embodiment, a controller, such as a servo motor, can be installed inside the first housing 402. The control terminal of the controller is connected to the other end of the sample delivery rod 403 inside the first housing 402, thereby controlling the rotation of the sample delivery rod 403. The rotation angle can be set as needed, such as between 0-360°, and in this invention, it is 90°. In this embodiment, when the connecting rod 507 of the chip carrier 5 is inserted into the positioning hole 404 and rotated 90°, the chip carrier 5 is locked; otherwise, it is disengaged.

[0072] In some embodiments of the present invention, such as Figure 5 As shown, an auxiliary disengagement mechanism is installed in the positioning hole 404. This mechanism facilitates the disengagement of the chip carrier 5 from the locking assembly. The auxiliary disengagement mechanism includes a spring 406 and a top block 407 installed sequentially from the inside to the outside of the positioning hole 404. A strip-shaped limiting groove 408 is formed on the block of the top block 407, and a limiting screw 409 is provided on the outer wall of the transmission end. In this embodiment, the limiting screw 409 is screwed into the positioning hole 404 from the outer wall of the transmission end and inserted into the strip-shaped limiting groove 408. Furthermore, in this embodiment, the length of the strip-shaped limiting groove 408 is greater than the diameter of the external thread of the limiting screw 409. Therefore, under the elastic force of the spring 406, the top block 407 is not completely restricted by the limiting screw 409 and can have a certain amount of movement within the positioning hole 404, thus facilitating the disengagement of the sample delivery rod 403 from the chip carrier 5.

[0073] In some embodiments of the present invention, such as Figure 6 As shown, the chip carrier 5 includes a frame 501, wherein a through hole 502 is provided on the frame 501, and a support 503 is provided at the bottom of the through hole 502 along the inner wall of the through hole 502. The support 503 is for loading chips. In this embodiment, the chip includes a chip core and a chip carrier used in the ion trap quantum computing system. The chip core is fixed on the chip carrier, and the chip carrier can be placed on the chip carrier frame.

[0074] Additionally, in this embodiment, as Figure 6 As shown, one end face of the frame 501 is provided with a downward pressing slope 504. This downward pressing slope 504 is designed to allow for easy and smooth entry into the adapter mechanism 9 when replacing the chip. The bottom of the other end of the frame 501 is provided with a limiting step 505 integral with the frame 501. The limiting step 505 is designed to limit the depth of the frame 501 inserted into the adapter mechanism 9, thereby better positioning the replacement position of the chip carrier 5. The other end face of the frame 501 is provided with a connecting groove 506. The connecting groove 506 contains a connecting rod 507 and two insert blocks 508. In this embodiment, the connecting rod 507 can be inserted into the positioning hole 404 and can contact and press against the aforementioned top block 407.Figure 5 As shown, the two inserts 508 can be inserted into the transverse slots of the two T-shaped limiting slots 405. After the two inserts 508 can be inserted into the two T-shaped limiting slots 405, the entire sample feeding rod 403 is rotated, such as by 90°, so that the two inserts 508 rotate into the longitudinal slots of the two T-shaped limiting slots 405, thereby preventing the chip carrier 5 from detaching from the sample feeding rod 403.

[0075] In some embodiments of the present invention, such as Figure 7 As shown, the moving mechanism 7 includes a second housing 61 connected to the vacuum storage cavity 6 and a moving rod 62 disposed inside the second housing 61, wherein one end of the moving rod 62 is the moving end. In this embodiment, the entire moving rod 62 can be controlled by a second control mechanism to move within the second housing 61. In this embodiment, the second control mechanism can control the movement of the moving rod 62 within the second housing 61 by means of a motor and gears and racks. For example, the second control mechanism includes components such as a motor, gears, and racks. By installing a motor inside the second housing 61, installing a gear at the output end of the motor, and then installing a rack on the moving rod 62, the movement of the moving rod 62 within the second housing 61 can be controlled by the meshing of the rack and gears. Figure 7 As shown, the second control mechanism can also be controlled by magnetic coupling technology. For example, the second control mechanism includes a third magnet, a fourth magnet, and a second limiting sleeve 610. The second limiting sleeve 610 is fitted outside the second housing 61 and close to the sample delivery cavity 401 (this position is set as needed, i.e., as long as the moving rod 62 moves to its maximum position, it is just blocked by the second limiting sleeve 610, at which time the chip storage rack 802 can reach the most suitable position of the first vacuum cavity 1), and slides in contact with the outside of the second housing 61. The other end of the moving rod 62 inside the second housing 61 is provided with a fourth magnet that can be attracted by the second magnet. The fourth magnet is made of a metal material that can be attracted by the second magnet. When the third magnet slides inside the second housing 61, the fourth magnet can be attracted and move inside the second housing 61. In addition, the third magnet can be driven to slide on the second housing 61 by some power mechanism, such as a hydraulic cylinder or a pneumatic cylinder.

[0076] In some embodiments of the present invention, such as Figure 7 and Figure 8 As shown, the chip storage mechanism 8 includes an adapter 801 and a plurality of chip storage racks 802. The plurality of chip storage racks 802 are interconnected, and one of the connected chip storage racks 802 is connected to the adapter 801. The chip storage rack 802 stores a chip carrier 5 that holds the chips. In some embodiments of the present invention, such as Figure 8As shown, the chip storage rack 802 includes a storage block 803. A storage slot 804 is provided on the side wall of the storage block 803, which extends horizontally through the body of the storage block 803. The storage slot 804 is used to store a chip carrier rack (5) containing the chip.

[0077] Additionally, it should be noted that the interconnection of multiple chip storage racks 802, as mentioned above, and the connection between one chip storage rack 802 and the adapter 801, can be achieved using a snap-fit ​​connection, for example... Figure 8 As shown, the upper surface of the storage block 803 is provided with a slot 810, and the lower surface of both the storage block 803 and the adapter 801 is provided with a locking block 811 that matches the slot 810. Through the friction between the locking block 811 and the slot 810, the locking block 811 can be inserted into the slot 810 to form a snap-fit ​​connection. Furthermore, to prevent insufficient friction between the locking block 811 and the slot 810 from failing to form a stable snap-fit ​​connection, this embodiment can combine snap-fit ​​and fixed connection methods, for example... Figure 8 As shown, threaded holes 812 are made on the sidewalls of the storage block 803 and the card block 811, and then screws are screwed in to stably connect the card block 811 and the card slot 810. In this embodiment, the way multiple chip storage racks 802 are connected to each other, and the way one chip storage rack 802 is connected to the adapter 801, are not limited to the two forms mentioned above. Other methods can also be used, such as magnetic attraction. That is, corresponding magnets that can attract each other can be installed between the adapter 801 and the chip storage rack 802, and between the chip storage racks 802.

[0078] Additionally, in this embodiment, as Figure 8 As shown, the upper surface of the storage block 803 has multiple fixing holes 805 that extend longitudinally through the storage block 803. A carrier board fixing mechanism 806 is installed within each fixing hole 805 to fix the chip carrier board 5 stored in the storage slot 804. Figure 8As shown, the carrier frame fixing mechanism 806 includes fixing screws 807, compression springs 808, and ejector pins 809, all installed in fixing holes 805. The head of the ejector pin 809 extends through the fixing hole 805 and into the storage slot 804, where it can press against the chips on the chip carrier frame 5. The compression spring 808 is located between the fixing screws 807 and the ejector pin 809. The external thread of the fixing screw 807 meshes with the internal thread of the fixing hole 805. In this embodiment, after the chip carrier frame 5 is inserted into the storage slot 804, the ejector pin 809 can press the chips on the chip carrier frame 5 under the elastic force of the compression spring 808, thereby stably storing the chip carrier frame 5 in the storage block 803. In addition, to facilitate observation of whether chips are placed in the chip storage rack 5 stored in the storage block 803, a chip observation hole 813 is provided on the side of the storage block 803. The observation hole 813 can be strip-shaped, round, or other shapes.

[0079] In some embodiments of the present invention, such as Figure 1 As shown, the storage component also includes a first vacuum pump 10, which is connected to the vacuum storage chamber 6. The first vacuum pump 10 is used to maintain the ultra-high vacuum in the vacuum storage chamber 6, enabling the entire chip storage mechanism 8 to perform ultra-high vacuum preparation and maintenance independently of the ion trap computing system.

[0080] In some embodiments of the present invention, the replacement component, after the chip replacement is completed, is mainly used for testing the chip in the second vacuum chamber 3. The chip is the core of the ion trap quantum computing system. The replacement component is installed as a whole on the chip holder 902 inside the second vacuum chamber 3. The chip holder 902 is fixed to a circuit board (the circuit board can be any one of ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high-frequency board, thick copper plate, impedance board, etc.). This circuit board provides connection channels for the electrical connections of the ion trap quantum computing system. For example, the chip holder 902 has multiple vertical insertion holes (…). Figure 9 (Not shown in the diagram), a spring pin is installed in the socket (not limited to a spring pin; any elastic connector can be used in this invention). The bottom end of the spring pin contacts and is electrically connected to an electrical connection point on the circuit board. The necessary electrical components of the ion trap quantum computing system can be connected through the electrical connection point on the circuit board. The top end of the spring pin presses against an electrical connection point on the chip carrier, and the electrical connection point on the chip carrier is electrically connected to the chip core. In this way, the chip core and the necessary electrical components of the ion trap quantum computing system are electrically connected.

[0081] In this embodiment, the chip needs to be replaced for testing. The replacement of the chip within the second vacuum chamber 3 requires a transfer mechanism. In this embodiment, the replacement assembly includes a transfer mechanism 9 that provides the transfer function, such as... Figure 9 As shown, the adapter mechanism 9 includes a fixed cover plate 901, which is fixed to the chip holder 902 inside the second vacuum chamber 3 by fastening screws 904. The fixed cover plate 901 has a carrier sliding groove 903 that extends horizontally through the fixed cover plate 901 to prevent damage to the chip core during chip insertion and removal. The carrier sliding groove 903 is used to install the chip carrier 5, that is, the chip carrier 5 can be inserted from the carrier sliding groove 903 into the fixed cover plate 901. In addition, the fixed cover plate 901 is also provided with There is a clearance groove 905, which is to prevent the chip on the chip carrier 5 from being blocked when the chip carrier 5 is inserted into the fixed cover plate 901 from the carrier sliding groove 903. After the new chip carrier 5 to be tested is inserted into the designated position in the fixed cover plate 901 from the carrier sliding groove 903, the spring pin will be pressed against the top of the spring pin after the replacement to stabilize the chip on the chip carrier. At this time, the top of the spring pin is designed to make contact with the electrical connection point at the bottom of the chip carrier included in the chip.

[0082] In some embodiments of the present invention, such as Figure 1 As shown, the bridging mechanism 2 includes a bridging cavity 201, a first gate valve 202, a second gate valve 203, a vacuum connection flange 204, and a molecular pump. The first gate valve 202 and the second gate valve 203 are respectively located at both ends of the bridging cavity 201. The molecular pump can be connected to the vacuum connection flange 204 for vacuuming. The first gate valve 202 is connected to the first vacuum cavity 1, and the second gate valve 203 is connected to the second vacuum cavity 3. Specifically, one end of the first gate valve 202 is connected to one end of the first vacuum cavity 1 through a flange joint, and the other end of the first gate valve 202 is connected to one end of the bridging cavity 201 through a flange joint. One end of the second gate valve 203 is connected to one end of the second vacuum cavity 3 through a flange joint, and the other end of the second gate valve 203 is connected to the other end of the bridging cavity 201 through a flange joint. In this embodiment, when the first gate valve 202 and the second gate valve 203 are fully opened, the sample delivery rod 403 can pass through the first vacuum chamber 1 and the bridging chamber 201, and then enter the second vacuum chamber 3 for replacement.

[0083] In some embodiments of the present invention, such as Figure 1As shown, the second gate valve 203 is connected to the second vacuum chamber 3 via a vacuum maintaining mechanism 11 included in the vacuum assembly. The vacuum maintaining mechanism 11 includes a maintaining chamber 111 and a second vacuum pump 112. The maintaining chamber 111 is connected to the second gate valve 203 and the second vacuum chamber 3.

[0084] In some embodiments of the present invention, such as Figure 1 As shown, the storage component includes a plasma cleaning component. The storage component is not merely a container for storage chips, but also a device for cleaning chips. Thus, after updating the chips stored in the first vacuum chamber, the chips can be cleaned in situ. Specifically, by rotating the control sample delivery rod 403 90° as mentioned above and opening the inlet valve 102, high-pressure cleaning gas, such as argon, can be introduced. After the cleaning gas is introduced into the cleaning chamber 101, the ionization mechanism (in this invention, any commercially available ionization mechanism capable of ionizing gas into an ionized state can be used; specific types are not limited here) is activated to ionize the cleaning gas, thereby forming a plasma state. This plasma cleaning is then applied to the chips on the chip carrier 5, which is locked by the locking rod. Plasma cleaning is crucial to the stability of the ion trap quantum computing system.

[0085] The following describes the usage process of a multifunctional ion trap chip quick replacement device according to the present invention. The usage method of the device includes:

[0086] S1. Sample delivery steps:

[0087] S11. Preparation: Install chips on all chip carriers 5 and insert all chip carriers 5 into all storage slots 804 of the chip storage mechanism 8.

[0088] S12, Plasma cleaning: The sample delivery mechanism 4 controls the sample delivery mechanism 4 to perform plasma cleaning on all the chips stored in the chip storage mechanism 8, i.e., the chips of all the chip carriers 5, in the chip storage mechanism 8, in the cleaning chamber (101) through which cleaning gas is introduced via the air inlet valve (102).

[0089] S121. After connecting the first vacuum chamber 1, the bridging chamber 201 and the second vacuum chamber 3 to each other, connect the molecular pump to the bridging chamber 201.

[0090] S122, the locking assembly of the control sample delivery rod 403 moves to the first vacuum chamber 1, locks one chip carrier 5 of the storage slot 804, and then retracts to the sample delivery chamber 401;

[0091] S123, control the chip storage mechanism 8 to move upward, then control the chip carrier 5 to retract into the sample delivery cavity 401 and extend into the first vacuum cavity 1, and control the sample delivery rod 403 to rotate 90°;

[0092] S124. Keep the second gate valve 203 closed and the first gate valve 202 open. Turn on the molecular pump and then open the inlet valve 102 to introduce cleaning gas (such as argon, oxygen, etc.) to ionize it into plasma state for plasma cleaning of the chip after it has been rotated 90°. After cleaning, put it into the original storage tank 804.

[0093] S125. Clean all the chips.

[0094] S13. Vacuum preparation: Vacuum preparation is performed on the first vacuum chamber 1, bridging chamber 201 and the second vacuum chamber 3. The inlet valve 102 is closed, the first gate valve 202 is kept open, the second gate valve 203 is opened, and the first vacuum chamber 1, bridging chamber 201 and the second vacuum chamber 3 are evacuated by a molecular pump to complete the vacuum preparation. At this time, the chip is completely not in contact with the laboratory environment after cleaning, which can ensure the cleanliness of the chip surface.

[0095] S14. Control the sample delivery mechanism to remove the chip, after plasma cleaning and vacuum preparation processes, from the chip storage mechanism 8 and send it into the transfer mechanism 9 in the second vacuum chamber 3 for the first test chip installation:

[0096] S141, control the chip storage mechanism 8 to move down, and control the locking assembly of the sample delivery rod 403 to move into the first vacuum chamber 1, lock one chip carrier 5 of the storage slot 804 and then retract it to the sample delivery chamber 401, and then control the chip storage mechanism 8 to move up.

[0097] S142. Control the sample delivery rod 403 to move, so that the locking component on it moves into the second vacuum chamber 3 and is inserted into the appropriate position in the carrier plate sliding groove 903 (for example, by limiting it through the first limiting sleeve 410).

[0098] S143. After the sample delivery rod 403 rotates to 90°, it retracts into the sample delivery chamber 401 and closes the second gate valve 203 and the first gate valve 202.

[0099] S15, Holding state: Maintain the connection state of the first vacuum chamber 1, the bridging chamber 2 and the second vacuum chamber 3; or, Removal state: Remove the entire conveying assembly, the cleaning assembly and the first gate valve 202 together with the storage assembly and the first vacuum chamber 1 in a vacuum-maintaining manner.

[0100] S16. Chip replacement: Replace the test chip that needs to be replaced in the second vacuum chamber 3.

[0101] Replacement scenario (1): If in the holding state in S15, the first vacuum chamber 1, bridging chamber 201 and second vacuum chamber 3 are connected, that is, the second gate valve 203 and the first gate valve 202 are opened, the sample delivery rod 403 in the sample delivery mechanism 4 is controlled to move, so that the locking component on it moves to the second vacuum chamber 3, and the chip carrier 5 in the second vacuum chamber 3 is locked and pulled out by the locking component and then retracted to the sample delivery chamber 401. Then the chip storage mechanism 8 is controlled to move down, the sample delivery rod 403 of the sample delivery mechanism 4 is controlled to move, so that the locking component on it moves to the first vacuum chamber 1, and after being inserted into the empty storage slot 804, it is disengaged from the chip carrier 5, and the sample delivery rod 403 is controlled to retract to the sample delivery chamber 401. Then the chip storage mechanism 8 is controlled to move up.

[0102] Repeat step S14 to complete the chip replacement process;

[0103] Replacement Case (II): If the device is in the dismantling state in S15, the entire dismantled conveying assembly, cleaning assembly, and first gate valve 202, along with the storage assembly and the first vacuum chamber 1, will be reinstalled while maintaining a vacuum. Then, the steps of Replacement Case (I) will be repeated.

[0104] S2. Reinstallation steps:

[0105] S21. Remove the components. After all the chips in the storage slots 804 of the chip storage mechanism 8 have been used up, when replenishment is needed, the entire transfer assembly, cleaning assembly, and first gate valve 202, along with the storage assembly and the first vacuum chamber 1, are removed together.

[0106] S22. Reinstall the chips: Remove all stored chips from storage slot 804 and reinstall them.

[0107] S23. Clean the chips again. Connect the molecular pump to the bridging mechanism 2, to the unused side of the first gate valve 202, and then open the inlet valve 102 to introduce cleaning gas. Perform plasma cleaning on all chips again, i.e., proceed with steps S122-S124.

[0108] S24. Reinstall the removed components. After cleaning, reinstall the entire conveying assembly, cleaning assembly, and first vacuum chamber 1 together while maintaining a vacuum. That is, close the inlet valve 102, and then use a molecular pump in conjunction with the first vacuum pump 10 to evacuate the first vacuum chamber 1. After evacuation, close the first gate valve 202, remove the molecular pump, and reinstall the entire conveying assembly, cleaning assembly, first gate valve 202, storage assembly, and first vacuum chamber 1 together to form a state in which the first vacuum chamber 1, bridging mechanism (2), and second vacuum chamber 3 are interconnected. Reinstall the molecular pump removed in this step on the bridging chamber 201, and restore the vacuum of the bridging chamber 201 of the bridging mechanism 2 by using the molecular pump. Since the bridging chamber 201 is very small in size and has a simple structure, the vacuum is restored very quickly.

[0109] S25. If it is necessary to replace the chip again, repeat the steps in replacement case (1).

[0110] In this invention, depending on the specific circumstances, it is determined whether the conveying component, the cleaning component, and the first gate valve 202 along with the storage component are retained together, i.e., in the holding state or the removal state of S15. In the case of not breaking the vacuum, i.e., in the holding state, the chip can be directly replaced. At this time, there is no need to restore the vacuum state of the corresponding cavity, which greatly reduces the conventional vacuuming time of multiple corresponding cavities. In the case of breaking the vacuum, i.e., in the removal state, the overall system volume can be reduced. Moreover, when reinstalling after removal, only the vacuum of the bridging cavity 201 needs to be restored, which also reduces the conventional vacuuming time of multiple corresponding cavities.

[0111] In addition, in some embodiments of the present invention, a quantum computer is also provided, the quantum computer including the replacement system described above.

[0112] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A multifunctional ion trap chip quick-change device, characterized in that, The system includes: The vacuum assembly includes a first vacuum chamber (1), a bridging mechanism (2), and a second vacuum chamber (3) that are connected in sequence; The transfer assembly includes a sample feeding mechanism (4) and a chip carrier (5) disposed at its transfer end. The sample feeding mechanism (4) is connected to a first vacuum chamber (1), and the transfer end can sequentially pass through the first vacuum chamber (1) and the bridging mechanism (2) to transfer the chip carrier (5) to a second vacuum chamber (3) for chip replacement. The cleaning assembly includes a cleaning chamber (101) connected to the first vacuum chamber (1) and an air inlet valve (102) provided on the cleaning chamber (101). The air inlet valve (102) allows cleaning gas to be introduced into the cleaning chamber (101). The replacement component includes a transfer mechanism (9), which is located in the second vacuum chamber (3) and is used to transfer chips on the chip carrier (5).

2. The multifunctional ion trap chip quick-change device according to claim 1, characterized in that, The sample delivery mechanism (4) includes a sample delivery chamber (401) connected to the first vacuum chamber (1), a first housing (402) connected to the sample delivery chamber (401), and a sample delivery rod (403) disposed inside the first housing (402), wherein, One end of the sample feeding rod (403) is the conveying end, and the conveying end is provided with a locking component. The locking component can be connected to the chip carrier (5) for locking the chip carrier (5).

3. The multifunctional ion trap chip quick-change device according to claim 2, characterized in that, The locking assembly includes a locking rod (411) connected to the end face of the conveying end, wherein, The end face of the locking rod (411) is provided with a positioning hole (404) extending into the interior of the locking rod (411). The outer wall of the end of the locking rod (411) is provided with two T-shaped limiting grooves (405). The chip carrier (5) can be installed on the positioning hole (404) and limited and fixed by the two T-shaped limiting grooves (405).

4. The multifunctional ion trap chip quick-change device according to claim 3, characterized in that, An auxiliary release mechanism is installed inside the positioning hole (404), wherein, The auxiliary release mechanism includes a spring (406) and a top block (407) installed sequentially from the inside of the positioning hole (404) outwards. The top block (407) has a strip-shaped limiting groove (408) on its block body. The outer wall of the end of the locking rod (411) is provided with a limiting screw (409). The limiting screw (409) is screwed from the outer wall of the locking rod (411) into the positioning hole (404) and inserted into the strip-shaped limiting groove (408).

5. A multifunctional ion trap chip quick-change device according to claim 3 or 4, characterized in that, The chip carrier (5) includes a frame (501), wherein, The frame (501) has a through hole (502), and the bottom of the through hole (502) has a support (503) arranged along the inner wall of the through hole (502) for placing the chip.

6. A multifunctional ion trap chip quick-change device according to claim 5, characterized in that, The other end face of the frame (501) is provided with a connecting groove (506), and the connecting groove (506) is provided with a connecting rod (507) and two inserts (508). The connecting rod (507) can be inserted into the positioning hole (404), and the two inserts (508) can be inserted into two T-shaped limiting grooves (405).

7. The multifunctional ion trap chip quick-change device according to claim 1, characterized in that, The moving mechanism (7) includes a second housing (61) connected to the vacuum storage cavity (6) and a moving rod (62) disposed inside the second housing (61), wherein one end of the moving rod (62) is the moving end.

8. A multifunctional ion trap chip quick-change device according to claim 1, characterized in that, The cleaning assembly also includes a vacuum feeder, which is installed on the cleaning chamber (101).

9. A multifunctional ion trap chip quick-change device according to claim 1, characterized in that, The adapter (9) includes a fixed cover plate (901), which is fixed on a chip holder (902) inside the second vacuum chamber (3). The fixed cover plate (901) is provided with a carrier sliding groove (903) that extends horizontally through the fixed cover plate (901) for installing a chip carrier frame (5).

10. A multifunctional ion trap chip quick-change device according to any one of claims 6-9, characterized in that, The storage component also includes a first vacuum pump (10), which is connected to the vacuum storage chamber (6).

11. A multifunctional ion trap chip quick-change device according to any one of claims 1-4 and 6-9, characterized in that, The bridging mechanism (2) includes a bridging cavity (201), a first gate valve (202), and a second gate valve (203), wherein, The first gate valve (202) and the second gate valve (203) are respectively located at both ends of the bridging cavity (201). The first gate valve (202) is connected to the first vacuum cavity (1), and the second gate valve (203) is connected to the second vacuum cavity (3).

12. A multifunctional ion trap chip quick-change device according to claim 11, characterized in that, The second gate valve (203) is connected to the second vacuum chamber (3) through a vacuum maintaining mechanism (11) included in the vacuum assembly. The vacuum maintaining mechanism (11) includes a maintaining chamber (111) and a second vacuum pump (112). The maintaining chamber (111) is connected to the second gate valve (203) and the second vacuum chamber (3).

13. A method for rapid replacement of a multifunctional ion trap chip, said method being implemented based on the apparatus according to any one of claims 1-12, characterized in that, The method includes: S11. Preparation: Install chips on all chip carriers (5) and store them in the first vacuum chamber (1); S12, Plasma cleaning: The sample delivery mechanism (4) controls all the stored chips to undergo plasma cleaning in the cleaning chamber (101) through which cleaning gas is introduced via the air inlet valve (102); S13. Vacuum preparation: Vacuum preparation is performed on the first vacuum chamber (1), the bridging chamber (201), and the second vacuum chamber (3); S14. Control the sample delivery mechanism to send the chip after step S13 into the transfer mechanism (9) in the second vacuum chamber (3) for the first test chip installation. S15, Holding state: Maintain the connection state of the first vacuum chamber (1), the bridging chamber (2) and the second vacuum chamber (3); or, Removal state: Remove the entire conveying assembly and cleaning assembly together with the first vacuum chamber (1) in a vacuum-maintaining manner; S16. Chip replacement: Replace the test chip that needs to be replaced in the second vacuum chamber (3). Replacement Situation (1): If in the holding state in S15, the first vacuum chamber (1), the bridging chamber (201) and the second vacuum chamber (3) are connected. Control the sample delivery mechanism (4) to move, lock and pull out the chip carrier (5) in the second vacuum chamber (3), repeat the S14 process, and the chip replacement can be completed. Replacement Case (II): If the device is in the dismantling state in S15, the entire dismantled conveying assembly, cleaning assembly, and first vacuum chamber (1) will be reinstalled while maintaining a vacuum, and the steps of Replacement Case (I) will be repeated.

14. The method of using the multifunctional ion trap chip quick replacement device according to claim 13, characterized in that, The method further includes: S21. Remove the components. When all the stored chips are used up and replenishment is needed, the entire transfer component, cleaning component and the first vacuum chamber (1) are removed together. S22. Reinstall the chips: Remove all stored chips and reinstall the chips. S23. Clean the chips again, and perform plasma cleaning on all chips again; S24. Reinstall the removed components, and reinstall the entire conveying component and cleaning component together with the first vacuum chamber (1) in a way that maintains a vacuum, and restore the vacuum of the bridging mechanism (2). S25. If it is necessary to replace the chip again, repeat the steps in replacement case (1).

15. A quantum computer, characterized in that, The quantum computer includes the replacement system as described in any one of claims 1-12.

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