Capacitor and method for manufacturing a capacitor

Abstract

Described herein is a capacitor (1) comprising a capacitive element (2) arranged in a housing (3) sealed with a cover (4), where the housing (3) or the cover (4) comprises at least one through-hole (5) covered with a gas dissipation element (6) configured to reduce a gas pressure inside the capacitor (1) during operation of the capacitor (1), where the gas dissipation element (6) is configured to reduce a gas pressure inside the capacitor (1) during operation of the capacitor (1). The gas dissipation element (6) is arranged on an outer surface (7) or an inner surface (8) of the housing (3) or the cover (4), where the outer surface (7) or the inner surface (8) respectively comprises a surface structure (9) configured to improve the engagement between the gas dissipation element (6) and the outer surface (7) or the inner surface (8), and where the gas dissipation element (6) is chemisorbed onto the housing (3) or the cover (4). The invention further relates to a method for producing a capacitor (1).

Description

[0001] This article specifies a capacitor and a method for manufacturing the capacitor.

[0002] For example, capacitors with high CV factors and long lifespans can be used, for example, in switch-mode power supplies. Here, the CV factor corresponds to the product of capacitance and operating voltage divided by the volume of the capacitor, and determines the volumetric efficiency of the capacitor. In particular, the lifespan of high-CV capacitors is limited by internal gas generation or electrolyte degradation. For example, the capacitance of the anode element is inversely proportional to the formation voltage of the anodic oxide layer, which in turn is proportional to the thickness of the anodic oxide layer. However, as the formation voltage decreases, the leakage current through the anodic oxide layer can increase exponentially, thereby increasing the amount of gas that can be generated inside the capacitor. Furthermore, high-CV capacitors may not have sufficient free volume space to accommodate such gas. Therefore, the pressure inside the capacitor may increase during operation, which may lead to damage or failure of the capacitor and a correspondingly shortened lifespan. For example, document DE 102015119844A1 discloses a capacitor with a safety vent.

[0003] At least one objective of certain embodiments is to provide a capacitor with increased lifespan. At least one further objective of certain embodiments is to provide a method for producing a capacitor with increased lifespan. These objectives are achieved by the capacitor according to the independent claims and the method for manufacturing the capacitor.

[0004] Advantageous embodiments and further improvements of the capacitor and the method for manufacturing the capacitor are described in the dependent claims.

[0005] According to one aspect, a capacitor includes a capacitive element arranged in a housing sealed with a cover.

[0006] Specifically, the capacitor element is configured to store charge during capacitor operation. For example, the capacitor element can be charged and discharged during capacitor operation. For example, the capacitor element includes a cathode element and an anode element physically separated by dielectric elements. The cathode element and the anode element can be electrically contacted through conductive elements (e.g., wires or leads).

[0007] For example, the housing is configured to mechanically support the capacitor. Specifically, the housing includes a cavity in which the capacitor element is arranged. For example, the housing has an opening to allow the capacitor element to be inserted into the cavity during capacitor manufacturing. For example, the housing has a cylindrical shape with a bottom surface and an open end face opposite the bottom surface, wherein the open end face forms the opening. In particular, the housing protects the capacitor element from external forces or harmful substances that could damage the capacitor during operation.

[0008] The housing can be configured to electrically isolate the capacitor element from the external environment. Alternatively, the housing can be configured to electrically contact the capacitor element. For example, the housing is conductive and electrically connected to an anode or cathode element. Furthermore, the housing can be configured as a heat sink so that heat generated by the capacitor element during operation is effectively transferred and dissipated from the capacitor element. For example, the capacitor element is in thermal contact with the housing.

[0009] For example, the cover and housing form a sealed cavity in which the capacitor element is disposed. Specifically, the cavity is sealed by disposing of or mounting the cover over an opening in the housing. Furthermore, at least one conductive element, such as a wire or pin, for electrical contact with the capacitor element may be disposed in or integrated into the cover. For example, the cover may comprise or be composed of metal, plastic, glass, cardboard, or rubber.

[0010] According to one aspect of the capacitor, the housing or cover includes at least one through-hole covered by a gas dissipation element configured to reduce the gas pressure inside the capacitor during operation.

[0011] For example, the housing or cover includes one, two, three, or more through holes. In particular, if the housing or cover includes two or more through holes, the through holes may be clustered together in one area of ​​the housing or one area of ​​the cover. For example, the distance between adjacent through holes may be less than the diameter of one through hole. In particular, multiple through holes may form a regular array. For example, one, two, or more through holes may also be arranged on the housing and cover.

[0012] The characteristics of a through-hole are described below. These characteristics may apply to one through-hole, multiple through-holes, or all through-holes. Specifically, the through-hole extends completely through the housing, allowing gas to escape from the cavity via it. For example, the through-hole may have a circular, elliptical, oval, curved, square, rectangular, or polygonal cross-section. The diameter of the through-hole is, for example, between 0.1 mm and 10 mm, or preferably between 0.5 mm and 6 mm. Herein and below, diameter refers to the maximum linear dimension of the through-hole's cross-section.

[0013] For example, through-holes are arranged on the bottom surface of the housing. Here and below, the bottom surface is arranged opposite the opening of the cavity through which the capacitor element is inserted into the cavity during the manufacture of the capacitor. In particular, the bottom surface is flat. Alternatively or additionally, through-holes are arranged on the side surface of the housing. In particular, the side surface is arranged crosswise or perpendicular to the bottom surface. For example, the side surface is curved.

[0014] Specifically, the gas dissipation element completely covers at least one through-hole. For example, the gas dissipation element completely covers one, two, or more through-holes. For example, the gas dissipation element completely covers an array of through-holes. For example, the gas dissipation element is directly arranged or disposed on or above at least one through-hole. In other words, the gas dissipation element is not completely arranged inside at least one through-hole. If both the housing and the cover include through-holes, the capacitor may also include two or more gas dissipation elements, for example, at least one for the housing and one for the cover.

[0015] Specifically, gases generated within the sealed cavity formed by the housing and cover during capacitor operation can escape from the cavity via at least one through-hole and a gas release element. For example, if the partial pressure of the gas inside the cavity is greater than the partial pressure of the gas outside the cavity, the gas can diffuse or permeate out of the cavity through the gas dissipation element. In particular, liquids such as electrolytes cannot permeate through the gas dissipation element. In other words, for example, the liquid is hermetically sealed inside the cavity.

[0016] According to at least one additional aspect of the capacitor, a gas dissipation element is arranged on the outer or inner surface of the housing or cover. Herein and hereinafter, the inner surface is the surface facing the capacitor element, while the outer surface is the surface opposite to the inner surface. In particular, neither the outer nor the inner surface includes the sidewalls of the through-hole.

[0017] According to at least one further aspect of the capacitor, the outer or inner surface includes a surface structure configured to improve the engagement between the gas dissipation element and the outer or inner surface, respectively. For example, the surface structure completely surrounds a through-hole. For example, the surface structure includes a surface region with increased surface roughness. For example, the surface structure includes one or more recesses or is composed of one or more recesses. In particular, the recess completely surrounds the through-hole, or the through-hole is formed within the recess. For example, the depth of the recess is at most half the thickness of the housing or cover.

[0018] According to at least one further aspect of the capacitor, the gas dissipation element is chemically adsorbed onto the housing or cap. For example, the gas dissipation element is attached to the outer or inner surface without the use of adhesives. Specifically, a direct chemical bond is formed between the gas dissipation element and the housing or cap, thereby forming a liquid-tight seal. The chemical bond can be, for example, a primary bond, a secondary bond, or a van der Waals bond.

[0019] According to an embodiment, the capacitor includes a capacitor element disposed in a housing sealed with a cover, wherein the housing or cover includes at least one through-hole, the through-hole being covered by a gas dissipation element configured to reduce the gas pressure inside the capacitor during operation of the capacitor, wherein the gas dissipation element is disposed on an outer surface or an inner surface of the housing or cover, wherein the outer surface or the inner surface includes a surface structure configured to improve the engagement between the gas dissipation element and the outer surface or the inner surface, respectively, and wherein the gas dissipation element is chemically adsorbed onto the housing or cover.

[0020] The capacitor disclosed herein is based on the idea of ​​extending the life of a high-CV capacitor by providing a gas dissipation element that reduces the internal pressure of the capacitor during operation. For example, during capacitor charging or discharging, electrochemical processes can generate gases inside the capacitor, such as hydrogen (H2), carbon dioxide (CO2), ethane, or other low-molecular-weight gases. Therefore, the internal pressure of the capacitor can increase during operation. For example, if the internal pressure of the capacitor becomes too high, the capacitor may be damaged or ruptured. Advantageously, the gas dissipation element allows such gases to escape from the capacitor, thereby reducing the internal pressure. Therefore, the capacitor's lifespan is increased. Furthermore, for example, a liquid electrolyte remains sealed inside the capacitor.

[0021] Furthermore, compared to gas dissipation elements mechanically clamped inside a through-hole, for example, arranging the gas dissipation element to cover the through-hole can simplify the manufacturing process and thus reduce manufacturing costs. Additionally, the overall thickness of the housing and the gas dissipation element can be advantageously reduced because no additional components are needed, for example, to clamp the gas dissipation element inside the through-hole.

[0022] According to at least one further embodiment of the capacitor, the gas dissipation element includes or is composed of a gas diffusion layer. Specifically, gas generated inside the capacitor during operation can diffuse or permeate through or fill the gas diffusion layer. The H2 permeability of the gas dissipation element is, for example, 10. 10 cm 2 / (s atm) to 10 13 cm 2 / (s Between (atm).

[0023] According to at least one further embodiment of the capacitor, the gas dissipation element comprises or is composed of at least one of the following materials: polymer, metal-organic framework, or silicon. For example, the gas dissipation element comprises or is composed of a gas diffusion layer, wherein the gas diffusion layer comprises, for example, a polymer, silicone, metal-organic framework, silicon, silicon nitride, or silicon carbide, or is composed of the same.

[0024] According to at least one further embodiment of the capacitor, the gas dissipation element extends at least partially into the through-hole. For example, the gas diffusion layer comprises a polymer covering the through-hole and extending partially or completely into it. For example, the through-hole may be partially or completely filled with polymer.

[0025] According to at least one further embodiment of the capacitor, the thickness of the gas dissipation element is between 0.1 mm and 2.5 mm, including the values ​​of 0.1 mm and 2.5 mm. The thickness of the gas dissipation element can also be between 0.1 mm and 3 mm, including the values ​​of 0.1 mm and 3 mm. For example, the thickness of the gas diffusion layer is between 0.1 mm and 2.5 mm. Specifically, thickness refers to the spatial dimension in a direction parallel to the through-hole. In other words, thickness refers to the spatial dimension in a direction parallel to the central axis of the through-hole.

[0026] According to at least one further embodiment of the capacitor, if the housing includes a through-hole, the total thickness of the housing and the gas dissipation element is at most 2.5 mm. Specifically, the total thickness refers to the combined thickness of the gas dissipation element and the housing.

[0027] According to at least one further embodiment of the capacitor, if the cover includes a through-hole, the total thickness of the cover and the gas dissipation element is at most 3.5 mm. In particular, the total thickness refers to the combined thickness of the gas dissipation element and the cover.

[0028] According to at least one further embodiment of the capacitor, molecules with a molecular weight below 60 Da can penetrate the gas dissipation element. In particular, H2 can penetrate or permeate the gas dissipation element.

[0029] According to at least one further embodiment of the capacitor, the housing comprises metal, such as aluminum, or is composed of metal. Alternatively or additionally, the housing comprises or is composed of plastic or polymer, for example.

[0030] According to at least one further embodiment of the capacitor, the capacitor element is a winding element comprising a liquid electrolyte with a water concentration of at least 2% by weight. Specifically, the winding element comprises a cathode foil and an anode foil, which are wound around each other and separated by a dielectric. For example, the capacitor is an aluminum electrolytic capacitor. For example, the winding element is partially or completely immersed in the liquid electrolyte.

[0031] According to at least one further embodiment of the capacitor, the capacitor has a volume fill factor of at least 75%. Specifically, the volume fill factor refers to the ratio between the volume of the winding elements and the volume of the cavity formed by the housing and cover.

[0032] According to at least one further embodiment of the capacitor, the capacitor has an anode foil formation factor of up to 1.55. Specifically, the anode foil formation factor corresponds to the ratio between the formation voltage of the anolyte layer and the nominal voltage of the capacitor. The nominal voltage refers to, for example, the maximum operating voltage applied between the anode and cathode of the capacitor during operation. In particular, the higher the anode foil formation factor, the longer the lifespan of the capacitor.

[0033] For example, an anode element, such as an anode foil, includes an anode oxide layer on its surface, and the formation voltage of the anode oxide layer corresponds to the thickness of the anode oxide layer. For example, the formation voltage is measured by immersing the anode element together with the counter electrode in a liquid electrolyte and applying a constant current to the anode element. The constant current is applied until the voltage between the anode element and the counter electrode saturates to a maximum value, which corresponds to the formation voltage.

[0034] Specifically, the formation voltage was measured at 90°C in a stainless steel container used as the counter electrode, using a liquid electrolyte comprising softened water, boric acid, and ammonium pentaborate. Furthermore, the anode element had a 20 cm² diameter. 2 The area, and the constant current has, for example, 0.5 mA / cm². 2 The current density.

[0035] According to at least one further embodiment of the capacitor, the nominal voltage of the capacitor is at least 350 V.

[0036] According to at least one further embodiment of the capacitor, the gas dissipation element is electrically insulated.

[0037] According to at least one further embodiment of the capacitor, the gas dissipation element has a dielectric strength of at least 1.2 kV / mm.

[0038] Furthermore, this document specifies a method for manufacturing a capacitor. Specifically, this method can be used to produce a capacitor as described above. All characteristics of the capacitor used in the method for manufacturing the capacitor are also disclosed.

[0039] According to one aspect of a method for manufacturing a capacitor, a housing and a cover are provided, wherein the housing or cover includes at least one through-hole. Alternatively, the housing and the cover may each include at least one through-hole.

[0040] According to another aspect of the method for manufacturing a capacitor, at least one through-hole is covered by a gas dissipation element, wherein the gas dissipation element is configured to reduce the gas pressure inside the capacitor during operation. If the housing and the cover each include at least one through-hole, at least two separate gas dissipation elements can be arranged to cover the through-holes in the housing and the cover, respectively.

[0041] According to another aspect of the method for manufacturing a capacitor, a gas dissipation element is chemically adsorbed onto the outer or inner surface of the housing or cover, wherein the outer or inner surface includes a surface structure configured to improve the bonding between the gas dissipation element and the outer or inner surface, respectively.

[0042] According to another aspect of the method for manufacturing a capacitor, the capacitor element is arranged in a housing. For example, the capacitor element includes a winding element having an anode foil and a cathode foil wound around each other. In particular, the housing includes a cavity and the winding element is inserted into the cavity.

[0043] According to another aspect of the method for manufacturing a capacitor, the housing and the cover are sealed. For example, the cover is pressed onto the housing or into the cavity. For example, the cover is pressed into the cavity using a curling tool such that the edge of the housing curls toward the cover when the cover is pressed into the cavity. In particular, the cover is pressed onto the housing or into the cavity such that a liquid- or gas-resistant seal is formed between the housing and the cover.

[0044] According to an embodiment, a method for manufacturing a capacitor includes the following steps:

[0045] a) Provide a housing and a cover, wherein the housing or cover includes at least one through hole;

[0046] b) Covering at least one through hole with a gas dissipation element, wherein the gas dissipation element is configured to reduce the gas pressure inside the capacitor during operation of the capacitor, wherein the gas dissipation element is chemically adsorbed onto the outer or inner surface of the housing or cover, and wherein the outer or inner surface includes a surface structure configured to improve the engagement between the gas dissipation element and the outer or inner surface, respectively.

[0047] c) Arranging the capacitor elements within the housing; and

[0048] d) Seal the housing with a cover.

[0049] Preferably, the steps of the capacitor manufacturing method are performed in the order of a) to d) above.

[0050] According to another embodiment of the method, the step of covering at least one through-hole includes adhesively bonding a gas dissipation element to the outer or inner surface of the housing or cover, thereby covering the through-hole. For example, an adhesive is used to bond the gas dissipation element to the outer or inner surface of the housing or cover.

[0051] According to another embodiment of the method, the step of covering at least one through-hole includes directly bonding the gas dissipation element to the outer or inner surface of the housing or cover, such that the through-hole is completely covered. Specifically, no adhesive is used to form a liquid-tight seal between the outer surface and the gas dissipation element, or between the inner surface and the gas dissipation element. For example, primary bonds, secondary bonds, or van der Waals bonds are formed between the gas dissipation element and the housing, or between the gas dissipation element and the cover.

[0052] According to another embodiment of the method, the gas dissipation element is a gas diffusion layer chemically adsorbed onto the housing or cover during the step of covering at least one through-hole. Specifically, during the adsorption of the gas diffusion layer onto the housing or cover, a chemical reaction bonds the gas diffusion layer to the housing or cover.

[0053] According to another embodiment of the method, the step of covering at least one through-hole includes setting a gas dissipation element across the through-hole in an adhesive form, and subsequently curing or hardening the gas dissipation element. For example, the gas dissipation element consists of a gas diffusion layer comprising a resin. For example, the resin is coated onto the through-hole and cured using heat or ultraviolet radiation.

[0054] Other advantageous and other embodiments of the capacitor and the method for manufacturing the capacitor will become apparent from the following exemplary embodiments described in conjunction with the accompanying drawings.

[0055] Figures 1 to 6 A schematic cross-section of a capacitor according to different exemplary embodiments is shown.

[0056] Element that is identical, similar, or has the same effect is indicated by the same reference numerals in the accompanying drawings. The scale of the drawings and the elements shown therein should not be considered to be on a true scale. Rather, for better representativeness and / or better understanding, individual elements may be shown as larger than they actually are.

[0057] according to Figure 1 The capacitor 1 in the exemplary embodiment includes a capacitor element 2 disposed within a housing 3 sealed with a cover 4. The housing 3 has a cylindrical shape and is made of a metal such as aluminum. The cover 4 is made of, for example, rubber. Furthermore, two conductive elements 10 for electrical contact with the capacitor element 2 are embedded in the cover 4.

[0058] The housing 3 has a through-hole 5 on its bottom surface opposite to the cover 4. The through-hole 5 has a circular shape with a diameter between 1 mm and 5 mm. The through-hole 5 is covered by a gas dissipation element 6, which is configured to reduce the gas pressure inside the capacitor 1 during operation. Specifically, during the operation of the capacitor 1, gases, such as H2, generated by electrochemical processes during the charging or discharging of the capacitor element 2 can escape from the interior of the capacitor 1 through the through-hole 5 and the gas dissipation element 6.

[0059] The gas dissipation element 6 is, for example, a gas diffusion layer 6 composed of silicone. The gas dissipation element 6 is chemically adsorbed onto the outer surface 7 of the housing 3. The outer surface 7 of the housing 3 faces the inner surface 8 of the housing 3, wherein the inner surface 8 faces the capacitor element 2. Specifically, the gas dissipation element 6 is not, for example, clamped inside the through-hole 5. Since no mechanical components for clamping the gas dissipation element 6 are required, the total thickness TD of the housing 3 and the gas dissipation element 6 can be advantageously reduced. Specifically, the total thickness TD of the housing 3 and the gas dissipation element 6 is at most 2.5 mm, while the thickness D of the gas dissipation element 6 is between 0.1 mm and 2.5 mm.

[0060] Regarding Figure 1 Compared to the capacitor 1 described in the exemplary embodiment, according to Figure 2 The capacitor 1 in the exemplary embodiment includes a gas dissipation element 6 disposed on the inner surface 8 of the housing 3. By disposing the gas dissipation element 6 on the inner surface 8 of the housing 3, the probability of debonding or delamination of the housing 3 and the gas dissipation element 6 during operation of the capacitor 1 can be reduced, for example.

[0061] Regarding Figure 1 Compared to the capacitor 1 described in the exemplary embodiment, according to Figure 3 In an exemplary embodiment, the capacitor 1 has a through-hole 5 disposed in the cover 4 instead of the housing 3. A gas dissipation element 6 is attached to the outer surface 8 of the cover 4 opposite to the capacitor element 2.

[0062] Regarding Figure 1 Compared to the capacitor 1 described in the exemplary embodiment, according to Figure 4 The capacitor 1 in the exemplary embodiment has a plurality of through holes 5 arranged in the bottom surface of the housing 3. The plurality of through holes 5 are arranged in a regular array. The plurality of through holes 5 are completely covered by a gas dissipation element 6.

[0063] By configuring multiple through holes 5 in the housing 3, the cross-sectional area of ​​each of the multiple through holes 5 can be reduced while maintaining the overall air permeability of the multiple through holes 5 compared to a single through hole 5. In particular, by arranging multiple through holes 5 in the housing instead of a larger single through hole 5, the mechanical stability of the housing 3 can be advantageously increased.

[0064] Regarding Figure 1 Compared to the capacitor 1 described in the exemplary embodiment, according to Figure 5 The capacitor 1 in the exemplary embodiment has an additional through hole 5 arranged in the cover 4, which is completely covered by a second gas diffusion element 6.

[0065] Figure 6A portion of the casing 3 of a capacitor 1 according to another exemplary embodiment is shown. Similar to a combination... Figure 1 The capacitor 1 described Figure 6 The capacitor shown has a through hole 5 arranged in the bottom surface of the housing 3. In addition, the outer surface 7 of the housing has a surface structure 9 in the form of a recess 9 that completely surrounds the through hole 5.

[0066] The gas dissipation element 6 is a gas diffusion layer formed inside the recess 9, completely covering the through hole 5. Furthermore, the gas dissipation element 6 extends into and completely fills the through hole 5. The gas dissipation element 6 is composed of silicone chemically adsorbed onto the housing 3. Specifically, silicone resin is disposed in the recess 9 and the through hole 5 and subsequently cured to form the gas dissipation element 6.

[0067] Based on the description of the exemplary embodiments, the present invention is not limited to the exemplary embodiments. Rather, the present invention covers any new features and any combination of features, including in particular any combination of features in the patent claims and any combination of features in the exemplary embodiments, even if the feature or combination itself is not expressly specified in the patent claims or exemplary embodiments.

[0068] Reference tag list

[0069] 1. Capacitor

[0070] 2. Capacitor Components

[0071] 3. Shell

[0072] 4. Cover

[0073] 5 through holes

[0074] 6 Gas dissipation elements

[0075] 7. Outer surface

[0076] 8. Inner surface

[0077] 9 Surface Structure

[0078] 10. Conductive elements

[0079] D Thickness

[0080] TD total thickness

Claims

1. A capacitor (1) comprising a capacitor element (2) disposed in a housing (3) sealed by a cover (4), wherein, The housing (3) or the cover (4) includes at least one through hole (5) covered by a gas dissipation element (6), the gas dissipation element (6) being configured to reduce the gas pressure inside the capacitor (1) during operation of the capacitor (1), wherein the gas dissipation element (6) is disposed on an outer surface (7) or an inner surface (8) of the housing (3) or the cover (4), wherein the outer surface (7) or the inner surface (8) includes a surface structure (9) respectively, the surface structure (9) being configured to improve the engagement between the gas dissipation element (6) and the outer surface (7) or the inner surface (8), and wherein the gas dissipation element (6) is chemically adsorbed onto the housing (3) or the cover (8).

2. The capacitor (1) according to the preceding claim, wherein, The gas dissipation element (6) includes or is composed of a gas diffusion layer.

3. The capacitor (1) according to any one of the preceding claims, wherein, The gas dissipation element (6) includes at least one of the following materials: polymer, metal-organic framework or silicon.

4. The capacitor (1) according to any one of the preceding claims, wherein, The gas dissipation element (6) extends at least partially into the through hole (5).

5. The capacitor (1) according to any one of the preceding claims, wherein, The thickness (D) of the gas dissipation element is between 0.1 mm and 2.5 mm, including 0.1 mm and 2.5 mm.

6. The capacitor (1) according to any one of the preceding claims, wherein - If the housing (3) includes the through hole (5), the total thickness (TD) of the housing (3) and the gas dissipation element (6) is at most 2.5 mm, or - If the cover (4) includes the through hole (5), the total thickness (TD) of the cover (4) and the gas dissipation element (6) is at most 3.5 mm.

7. The capacitor (1) according to any one of the preceding claims, wherein, Molecules with a molecular weight below 60 Da can penetrate the gas dissipation element (6).

8. The capacitor (1) according to any one of the preceding claims, wherein, The housing (3) comprises metal.

9. The capacitor (1) according to any one of the preceding claims, wherein, The capacitor element (2) is a winding element comprising a liquid electrolyte having a water concentration of at least 2% by weight.

10. The capacitor (1) according to any one of the preceding claims, wherein, The capacitor (1) has a volume fill factor of at least 75%.

11. The capacitor (1) according to any one of the preceding claims, wherein, The capacitor (1) has an anode foil forming factor of up to 1.

55.

12. The capacitor (1) according to any one of the preceding claims, wherein, The nominal voltage of the capacitor (1) is at least 350 V.

13. The capacitor (1) according to any one of the preceding claims, wherein, The gas dissipation element is electrically insulated.

14. The capacitor (1) according to the preceding claim, wherein, The gas dissipation element has a dielectric strength of at least 1.2 kV / mm.

15. A method for manufacturing a capacitor (1), comprising the following steps: a) Provide a housing (3) and a cover (4), wherein the housing (3) or the cover (4) includes at least one through hole (5); b) Cover the at least one through hole (5) with a gas dissipation element (6), wherein the gas dissipation element (6) is configured to reduce the gas pressure inside the capacitor (1) during operation of the capacitor (1), wherein the gas dissipation element (6) is chemically adsorbed onto the outer surface (7) or inner surface (8) of the housing (3) or the cover (4), and wherein the outer surface (7) or the inner surface (8) respectively includes a surface structure (9) configured to improve the engagement between the gas dissipation element (6) and the outer surface (7) or the inner surface (8); c) Arranging capacitor elements (2) in the housing (3); and d) Seal the housing (3) with the cover (4).

16. The method according to claim 15, in, In step b), the gas dissipation element (6) is configured to pass through the through hole (5) in a viscous form and is subsequently cured or hardened.

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