Dispensing logic control method, system and device for chip fine gap

Abstract

This invention relates to the field of semiconductor packaging control technology, and more particularly to a dispensing logic control method, system, and apparatus for micro-gap chip gaps. The method includes the following steps: after fixing the chip with a positioning fixture, multiple equidistant detection positions are selected along the length of the gap between the two chips using a sliding detection structure on one side of the fixture to collect gap data, with the median value of the gap data used as the actual gap parameter; initial control parameters for dispensing pressure, time, and spacing are configured based on the actual gap parameter; the dispensing head is controlled to move along the length of the gap, performing the first dispensing according to the initial control parameters, with a preset number of dispensing dots at intervals; a directional light source is projected by an illumination structure above the positioning fixture to obtain the diffusion contour information of the dispensing dots within the gap. This invention achieves high-precision automated dispensing operations for micro-gap chips by collecting gap data, dynamically adjusting dispensing parameters, and implementing staged curing, thereby improving dispensing quality and curing reliability.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor packaging control, and in particular to a chip fine gap dispensing logic control method, system and device. BACKGROUND

[0002] In the field of dispensing glue in the fine gap of chips, the prior art has many defects. Firstly, the gap data acquisition method is rough, and the precise acquisition means of multi-group equidistant detection and median value analysis is not used, which leads to the mismatch between the initial parameter configuration of dispensing glue and the actual gap situation, and the problems of glue point diffusion out of the boundary or insufficient coverage, poor dispensing precision and adaptability. Secondly, the glue curing process lacks a scientific staged control strategy, and the process of local curing and then overall curing is not implemented, and the dynamic scanning type irradiation and real-time parameter adjustment mechanism are not used during overall curing, which leads to insufficient curing uniformity and stability, and there is no targeted curing measure for the uncured area, so the curing effect and efficiency are difficult to guarantee. Thirdly, there is no integrated automatic control system for each link of dispensing operation, and the gap detection, dispensing execution, parameter adjustment and curing control modules and devices are not integrated, manual intervention is more, the degree of automation and production efficiency are low, and it is difficult to meet the high-precision production demand of dispensing glue in the fine gap of chips. SUMMARY

[0003] Therefore, it is necessary to provide a dispensing logic control method, system and device for dispensing glue in the fine gap of chips to solve at least one of the above technical problems.

[0004] To achieve the above-mentioned purpose, a dispensing logic control method for dispensing glue in the fine gap of chips is provided, and the method comprises the following steps:

[0005] Step S1: After the chip is fixed by the positioning clamp, a plurality of equidistant detection positions are selected along the length direction of the gap between the two chips by the slidable detection structure on one side of the clamp to collect gap data, and the median value of the gap data is taken as the actual parameter of the gap; and the initial control parameters of dispensing pressure, time and distance are configured according to the actual parameter of the gap.

[0006] Step S2: control the dispensing head to move along the length direction of the gap, execute the first dotting according to the initial control parameters, start the positioning clamp upper irradiation structure to project a directional light source every interval of a preset number of glue points, and obtain the diffusion profile information of the glue points in the gap.

[0007] Step S3: if the diffusion profile exceeds the boundary of the chip surface on both sides of the gap, reduce the dispensing pressure of the subsequent glue points and shorten the dispensing time; if the diffusion profile does not cover the preset proportion of the gap width, increase the dispensing pressure and prolong the dispensing time.

[0008] Step S4: After completing all glue point dotting, adjust the light source angle of the irradiation structure, first perform local curing of the glue in the specific length area at both ends of the gap, and then perform overall curing of the glue in the entire gap, to achieve chip fine gap dispensing.

[0009] The application also provides a chip fine gap dispensing logic control system for executing the chip fine gap dispensing logic control method described above, which comprises:

[0010] An initial configuration module is configured to, after fixing the chips by the positioning clamp, select multiple sets of equidistant detection positions along the length direction of the gap between the two chips to collect gap data by the slidable detection structure on one side of the clamp, and take the median value in the gap data as the actual parameter of the gap; and configure initial control parameters of dispensing pressure, time and interval according to the actual parameter of the gap.

[0011] A dispensing execution monitoring module is configured to control the dispensing head to move along the length direction of the gap, perform the first dotting according to the initial control parameters, and every interval of a preset number of glue points, start the irradiation structure above the positioning clamp to project a directional light source, and obtain the diffusion profile information of the glue point in the gap.

[0012] A dispensing parameter dynamic adjustment module is configured to, if the diffusion profile exceeds the surface boundary of the chips on both sides of the gap, reduce the dispensing pressure of the subsequent glue points and shorten the dispensing time; and if the diffusion profile does not cover a preset proportion of the gap width, increase the dispensing pressure and extend the dispensing time.

[0013] A glue curing control module is configured to, after completing all glue point dotting, adjust the light source angle of the irradiation structure, first perform local curing of the glue in the specific length area at both ends of the gap, and then perform overall curing of the glue in the entire gap, to achieve chip fine gap dispensing.

[0014] The application also provides a chip fine gap dispensing logic control device, which comprises a body, a positioning assembly, a dispensing structure and an irradiation structure; the body is provided with a working station, the positioning assembly is arranged at the working station and comprises a positioning clamp and a slidable detection structure, the positioning clamp is used for fixing a chip to be dispensed, and the slidable detection structure is arranged on one side of the positioning clamp and can move along the length direction of the chip fine gap and select multiple sets of equidistant detection positions to collect gap data; the dispensing structure comprises a dispensing head and a driving unit, the driving unit drives the dispensing head to move along the length direction of the gap to perform dotting on the gap according to initial control parameters, and the initial control parameters are configured based on the median value in the gap data collected by the slidable detection structure; the irradiation structure is arranged above the positioning clamp and can project a directional light source to obtain the diffusion profile information of the glue point, and can adjust the light source angle to first perform local curing of the glue in the specific length area at both ends of the gap, and then perform overall curing of the glue in the entire gap.

[0015] The beneficial effects of this invention are as follows:

[0016] I. Improved dispensing accuracy and adaptability. By collecting gap data through a sliding detection structure and using the median value as the actual parameter, combined with the glue dot diffusion profile information, the dispensing pressure and time are dynamically adjusted. This can accurately match the actual situation of the chip's fine gaps, effectively avoiding problems such as glue dot diffusion exceeding the boundary or insufficient coverage, and ensuring dispensing quality.

[0017] II. Optimizing Curing Effect and Efficiency. A method of partial curing followed by full curing is adopted. Simultaneously, dynamic scanning irradiation is used during the full curing process, with parameters adjusted in real time. This ensures the uniformity and stability of the adhesive curing while also allowing for targeted re-curing of substandard areas, thereby improving overall curing efficiency and reliability.

[0018] Third, achieve automated and precise control. Relying on a dedicated control system and device, the processes of gap detection, dispensing execution, parameter adjustment, and curing control are integrated into an automated process, reducing manual intervention, improving the automation level and production efficiency of dispensing operations, and adapting to the high-precision production requirements of dispensing into the fine gaps of chips. Attached Figure Description

[0019] Fig. 1 A schematic diagram of the steps of a dispensing logic control method for fine gaps in a chip;

[0020] Fig. 2 A schematic diagram of the dispensing logic control device for the fine gaps in the chip;

[0021] Fig. 3 This is a schematic diagram of adhesive dispensing into the fine gaps of the chip.

[0022] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] The technical method of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0024] Furthermore, the accompanying drawings are merely illustrative of the invention and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted. Some block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically independent entities. These functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor methods and / or microcontroller methods.

[0025] It should be understood that although the terms "first," "second," etc., may be used herein to describe various units, these units should not be limited by these terms. These terms are used merely to distinguish one unit from another. For example, without departing from the scope of the exemplary embodiments, a first unit may be referred to as a second unit, and similarly, a second unit may be referred to as a first unit. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] To achieve the above objectives, please refer to Figs. 1 to 3 A method for dispensing logic control of minute gaps in a chip, the method comprising the following steps:

[0027] Preferably, in step S1: after the chip is fixed by the positioning fixture, multiple sets of equidistant detection positions are selected along the length of the gap between the two chips through the sliding detection structure on one side of the fixture to collect gap data, and the median value of the gap data is used as the actual gap parameter; the initial control parameters of dispensing pressure, time and spacing are configured according to the actual gap parameter.

[0028] Optionally, in step S1, the selection of multiple equidistant detection positions to collect gap data along the length of the gap between the two chips using a sliding detection structure on one side of the fixture is specifically as follows:

[0029] A three-dimensional coordinate system is established by using the positioning marks on the edge of the positioning fixture, with the gap length direction set as the X-axis, the width direction as the Y-axis, and the depth direction as the Z-axis.

[0030] The X-axis is divided into detection positions at equal intervals, and the width data in the Y-axis direction and the depth data in the Z-axis direction are collected simultaneously at each detection position;

[0031] During the data acquisition process, the probe of the sliding detection structure vibrates at a preset frequency, and the measurement deviation of the depth data is corrected through vibration feedback signals.

[0032] In this embodiment, the positioning fixture is made of aerospace-grade aluminum alloy. Its edge is equipped with three sets of metal positioning marks with a diameter of 0.5mm and a spacing of 10mm. The positioning marks are identified by a high-precision laser interferometer to establish a three-dimensional coordinate system. The gap length direction is defined as the X-axis, with a measurement range of 0-50mm and an accuracy of ±0.001mm; the width direction is defined as the Y-axis, with a measurement range of 0-5mm and an accuracy of ±0.0005mm; and the depth direction is defined as the Z-axis, with a measurement range of 0-2mm and an accuracy of ±0.0002mm.

[0033] It should be noted that the detection positions are divided at equal intervals of 0.5mm along the X-axis, with a total of 100 groups of detection positions. The X-axis coordinates of each group of detection positions are 0mm, 0.5mm, 1.0mm...49.5mm respectively.

[0034] It should be noted that the detection structure adopts a piezoelectric driven sliding module, and its probe is a sapphire probe with a diameter of 0.1mm. At each detection position, the width data in the Y-axis direction and the depth data in the Z-axis direction are collected synchronously through a laser triangular displacement sensor. The acquisition frequency is set to 10kHz, and the amount of data collected in a single acquisition is 1024 bytes.

[0035] During the data acquisition process, the probe of the sliding detection structure vibrates longitudinally at a preset frequency of 5kHz, with the amplitude controlled within ±0.002mm. The vibration signal is converted into an electrical signal by a piezoelectric sensor, and after analog-to-digital conversion by a 16-bit A / D converter, it is input into a digital signal processor. The processor corrects the depth data in the Z-axis direction in real time based on the phase change of the vibration feedback signal. The correction threshold is set to 0.0003mm. When the measurement deviation exceeds this threshold, the data compensation mechanism is automatically triggered. The compensation value is calculated at 1.2 times the deviation to eliminate measurement errors caused by reflection from the inner wall of the gap and surface roughness.

[0036] Preferably, in step S2: control the dispensing head to move along the length of the gap, perform the first dotting according to the initial control parameters, set a preset number of glue dots at each interval, start the irradiation structure above the positioning fixture to project a directional light source, and obtain the diffusion contour information of the glue dots in the gap;

[0037] Optionally, in step S2, when obtaining the diffusion contour information of the adhesive dots within the gap, the method of alternating projection using dual light sources includes:

[0038] The first light source projects along the gap width direction to obtain the lateral boundary information of the diffusion profile;

[0039] The second light source projects along the gap depth direction to obtain the longitudinal filling information of the diffusion profile;

[0040] By fusing the horizontal boundary information with the vertical filling information, a three-dimensional diffusion contour model is generated, which includes the boundary coordinates and filling density distribution of the contour.

[0041] In this embodiment, the dual light source includes a first light source and a second light source. The first light source uses a red semiconductor laser with a wavelength of 650nm and an output power of 5mW. The beam is shaped by a cylindrical lens with a focal length of 50mm to form a sheet of light with a thickness of 0.01mm. The light is projected along the gap width direction (Y-axis) with an incident angle of 90° to the gap width direction. The light source is installed 10mm away from the gap surface. The second light source uses a blue semiconductor laser with a wavelength of 450nm and an output power of 3mW. The beam divergence angle is adjusted to 5° by a microlens array. The light is projected along the gap depth direction (Z-axis) with an incident angle of 45° to the gap depth direction. The light source is installed 5mm away from the end of the gap.

[0042] It should be noted that the alternating projection period of the dual light sources is set to 10ms, where the projection duration of the first light source is 4ms, the projection duration of the second light source is 4ms, and the interval is 2ms.

[0043] In one embodiment, during the projection of the first light source, a CCD camera (1920×1080 pixels, 100fps) located on the other side of the gap and at a 180° symmetrical position with the light source simultaneously acquires images with an exposure time set to 3ms, obtaining the lateral boundary information of the diffusion contour in the Y-axis direction. Each pixel in the image corresponds to an actual physical size of 0.5μm×0.5μm. During the projection of the second light source, a CMOS camera (2560×1440 pixels, 120fps) located above the gap and at a 90° angle with the light source simultaneously acquires images with an exposure time set to 2ms, obtaining the vertical filling information of the diffusion contour in the Z-axis direction. Each pixel in the image corresponds to an actual physical size of 0.3μm×0.3μm.

[0044] In another embodiment, the lateral boundary information includes the X and Y coordinates of the boundary points in the Y-axis direction, with a data sampling interval of 0.01 mm, and 100 sets of boundary point coordinates are collected for each glue point; the longitudinal filling information includes the X and Z coordinates of the filling area in the Z-axis direction, with a data sampling interval of 0.005 mm, and 200 sets of filling point coordinates are collected for each glue point.

[0045] For example, the horizontal boundary information and the vertical filling information are fused in real time through an FPGA chip. The fusion clock frequency is 100MHz. During the fusion process, the data is aligned based on the X-axis coordinate. The alignment error is controlled within ±0.001mm. This forms three-dimensional diffusion contour data that includes the contour boundary coordinates and the filling density distribution. The filling density distribution is calculated by the number of filling points per unit volume. The calculation volume unit size is set to 0.01mm×0.01mm×0.01mm, and the data storage format is binary.

[0046] Of particular importance is that, in step S2, when controlling the dispensing head to move along the length of the gap, the following operations are performed:

[0047] Before the dispensing head moves, the actual gap parameters and the initial dispensing distance are obtained to determine the basis for dividing the moving segments, so that the length of each moving segment is an integer multiple of the initial dispensing distance, and the start and end coordinates of each moving segment are recorded.

[0048] When the dispensing head enters the first moving segment, the moving speed is increased according to the preset acceleration rate until the speed reaches the rated value that matches the initial dispensing distance, and the rated speed is maintained to complete the dispensing of all glue dots in the moving segment;

[0049] When the dispensing head approaches the end coordinate of the moving section, the moving speed is reduced according to the preset deceleration rate until the speed falls into the low speed range corresponding to the rated speed, and the low speed state is maintained for a preset buffer time.

[0050] After the pause, increase the dispensing head speed to the rated value at the same acceleration rate and enter the next moving segment;

[0051] After each moving segment is completed, the diffusion contour information of the first and last glue dots is retrieved, the contour center coordinates of the two glue dots are extracted, the deviation value of the two point coordinates in the gap length direction is calculated, and the starting coordinates of the next moving segment are corrected according to the deviation value.

[0052] In this embodiment, when controlling the dispensing head to move along the gap length direction (X-axis), a three-axis motion platform driven by a servo motor is used, with a positioning accuracy of ±0.001mm and a repeatability of ±0.0005mm.

[0053] It should be noted that before the dispensing head moves, the actual gap parameters are retrieved, with a total gap length of 30mm and an initial dispensing distance of 0.2mm. The system is then divided into three moving segments, each containing 50 glue dots and a length of 10mm. The start and end coordinates of each segment are as follows: segment 1: 0.0mm-10.0mm, segment 2: 10.0mm-20.0mm, and segment 3: 20.0mm-30.0mm. These coordinates are stored in the motion controller's buffer area.

[0054] In one embodiment, when the dispensing head enters the first moving section, it accelerates at a rate of 50 mm / s², reaches the rated speed of 2 mm / s after 0.04 s, and maintains this speed to complete the application of 50 glue dots, corresponding to X-axis coordinates of 0.2 mm, 0.4 mm, ... 10.0 mm.

[0055] It should be noted that when the dispensing head approaches the end coordinate of the moving segment, and the real-time position reaches 9.5mm, the speed is reduced at a deceleration rate of 50mm / s², decreasing to 0.2mm / s after 0.04s (falling into the low-speed range of 0.1-0.3mm / s), with a pause of 20ms. After the pause, the speed is increased to the rated value of 2mm / s at the same acceleration rate, and then the next moving segment begins.

[0056] In another embodiment, after each moving segment is completed, the diffusion contour information of the first and last glue dots of that segment is retrieved, and the contour center coordinates are extracted ( )and( ), calculate the X-axis deviation value ,according to Correct the starting coordinates of the next segment and retain them to the fourth decimal place before inputting them into the motion controller.

[0057] Preferably, in step S3: if the diffusion profile extends beyond the chip surface boundaries on both sides of the gap, reduce the dispensing pressure of subsequent adhesive dots and shorten the dispensing time; if the diffusion profile does not cover the preset proportion of the gap width, increase the dispensing pressure and extend the dispensing time.

[0058] Optionally, determining whether the diffusion profile exceeds the chip surface boundaries on both sides of the gap in step S3 specifically involves:

[0059] Extract the extreme points of the lateral boundary in the 3D diffusion profile model;

[0060] Calculate the distance difference between the extreme point and the chip surface boundary. If the difference is positive and continues to exceed the preset time, it is determined that the diffusion profile exceeds the chip surface boundary on both sides of the gap.

[0061] This immediately triggers the parameter reduction mechanism, lowering the dispensing pressure to the preset ratio;

[0062] If, after reducing the dispensing pressure to the preset ratio, two consecutive glue dots still extend beyond the chip surface boundaries on both sides of the gap, then the dispensing pressure should be reduced while the dispensing time is shortened.

[0063] In one embodiment, when determining whether the diffusion profile exceeds the chip surface boundaries on both sides of the gap, the three-dimensional diffusion profile data is analyzed by an image processor to extract the extreme points of the lateral boundary in the width direction, including the left extreme point and the right extreme point. Each extreme point corresponds to a coordinate interval of 0.01 mm in the length direction, and 200 sets of extreme point data are extracted for a single glue dot.

[0064] It should be noted that the width coordinates of the chip surface boundary are stored as -0.5 mm for the left boundary and +0.5 mm for the right boundary through prior calibration. The distance difference between the left extreme point and the left boundary, and the distance difference between the right extreme point and the right boundary are calculated, and the distance difference is retained to five decimal places. The preset duration is set to 5 milliseconds. When the distance difference on the left or right side is greater than 0 for 5 milliseconds or more, it is determined that the diffusion profile exceeds the chip surface boundaries on both sides of the gap.

[0065] In another embodiment, a parameter reduction mechanism is immediately triggered, reducing the dispensing pressure from the initial value of 0.3 MPa to 80% of a preset percentage, i.e., 0.24 MPa, with the pressure adjustment response time controlled within 10 milliseconds. If, after reducing the pressure, the difference in distance between the left or right sides of two consecutive dispensing dots remains positive for more than 5 milliseconds, the dispensing pressure is further reduced from 0.24 MPa to 70% of a preset percentage, i.e., 0.21 MPa, while the dispensing time is shortened from the initial value of 20 milliseconds to 18 milliseconds, with a time adjustment accuracy of ±0.1 milliseconds.

[0066] Optionally, the preset percentage of the gap width not covered by the diffusion contour in step S3 is specifically determined as follows:

[0067] Calculate the fill density in the 3D diffusion contour model. If the fill density is greater than or equal to a preset threshold, determine the proportion of the width direction of the area where the fill density exceeds the preset threshold.

[0068] If the proportion in the width direction is lower than the preset width value, record the location distribution area of ​​the uncovered area:

[0069] If the uncovered area is concentrated in the middle of the gap, increase the dispensing pressure;

[0070] If the uncovered areas are scattered on both sides of the gap, extend the dispensing time.

[0071] In this embodiment, when determining the percentage of the gap width not covered by the diffusion contour, the three-dimensional diffusion contour data is processed. Using 0.01 mm × 0.01 mm × 0.01 mm as the volume unit, the ratio of the number of filling points in each unit to the theoretical maximum number of filling points in that unit is calculated to obtain the filling density. The filling density is retained to three decimal places.

[0072] It should be noted that the preset threshold is set to 0.75. When the fill density is greater than or equal to 0.75, the start and end coordinates of the region in the width direction are identified, the difference between the two is calculated to obtain the effective width, and then the effective width is compared with the actual gap width of 1.0 mm to obtain the width proportion. The proportion is retained to two decimal places.

[0073] It should be noted that the preset width value is set to 0.8. When the proportion of the width direction is less than 0.8, the distribution coordinates of the uncovered area (the area with a fill density of less than 0.75) in the width direction are recorded, and the coordinate accuracy is 0.001 mm.

[0074] In one embodiment, if more than 90% of the coordinates of the uncovered area are concentrated in the width direction within the range of -0.1 mm to 0.1 mm (the middle of the gap), the dispensing pressure is increased by 10% from the current value, with a pressure adjustment step of 0.01 MPa and an adjustment response time of no more than 8 milliseconds; if the distribution ratio of the uncovered area in both the width direction range of -0.5 mm to -0.1 mm and 0.1 mm to 0.5 mm exceeds 40% (dispersed on both sides of the gap), the dispensing time is extended by 5% from the current value, with a time adjustment step of 0.5 milliseconds and an adjustment accuracy controlled within ±0.1 milliseconds.

[0075] Optionally, step S3 further includes setting a dynamic adjustment coefficient during the adjustment of dispensing pressure and dispensing time:

[0076] When the distance of the diffusion superboundary increases to the boundary threshold distance, the pressure reduction coefficient and the time reduction coefficient increase simultaneously, and the increase of the pressure reduction coefficient is greater than that of the time reduction coefficient.

[0077] When the coverage percentage decreases to the threshold coverage percentage, the pressure adjustment coefficient and the time extension coefficient increase simultaneously, and the increase of the pressure adjustment coefficient is greater than that of the time extension coefficient.

[0078] After each adjustment, the coefficient value decreases linearly with the increase of the number of consecutive qualified glue dots until it returns to the initial value.

[0079] In one embodiment, when setting a dynamic adjustment coefficient during the adjustment of dispensing pressure and dispensing time, the distance of the diffusion superboundary is the maximum distance value of the diffusion profile exceeding the chip surface boundaries on both sides of the gap. The boundary threshold distance is set to 0.05 mm. When this distance increases to 0.05 mm, the pressure reduction coefficient increases linearly from the initial value of 1.0 to 1.5, and the time reduction coefficient increases linearly from the initial value of 1.0 to 1.2. The increase of the pressure reduction coefficient is 0.5 / 0.05 mm, and the increase of the time reduction coefficient is 0.2 / 0.05 mm.

[0080] In another embodiment, the coverage ratio is the proportion of the area where the filling density exceeds a preset threshold in the width direction. The threshold coverage ratio is set to 0.6. When the coverage ratio decreases to 0.6, the pressure adjustment coefficient increases linearly from the initial value of 1.0 to 1.6, and the time extension coefficient increases linearly from the initial value of 1.0 to 1.3. The increase in the pressure adjustment coefficient is 0.6 / 0.2 (the change in coverage ratio from 0.8 to 0.6), and the increase in the time extension coefficient is 0.3 / 0.2.

[0081] It should be noted that after each adjustment, consecutive qualified glue dots are glue dots whose diffusion profile does not exceed the boundary and whose coverage ratio is not less than 0.8. The coefficient value decreases linearly with the increase of the number of consecutive qualified glue dots. The decay rate is set so that for each additional qualified glue dot, the pressure reduction coefficient and pressure increase coefficient decrease by 0.1, and the time shortening coefficient and time extension coefficient decrease by 0.05, until all coefficients return to the initial value of 1.0. The coefficient adjustment interval is within 0.5 milliseconds after each glue dot is applied. The adjustment data is written to the control register in real time, and the register response time does not exceed 0.1 milliseconds.

[0082] Optionally, after adjusting the dispensing pressure and dispensing time parameters in step S3, the following operations are performed:

[0083] Record the dispensing pressure, dispensing time, and diffusion contour boundary coordinates of the adjusted glue dots according to the dotting sequence to form real-time recording information. When the number of consecutive records reaches the preset analysis threshold, the parameter analysis process is triggered.

[0084] Extract the boundary coordinates of the diffusion contour from the real-time recorded information, calculate the difference between the maximum and minimum coordinate values, and obtain the contour fluctuation range;

[0085] If the contour fluctuation range exceeds the preset fluctuation threshold, retrieve the actual gap parameters, extract the local parameters of the current region's gap width and depth, and compare their deviation with the overall parameters:

[0086] When the deviation exceeds the allowable range, calculate the pressure and time adjustment values ​​according to the preset pressure reduction amount corresponding to the local width increment and the preset time extension amount corresponding to the local depth increment, and then fine-tune the parameters of the area.

[0087] When the deviation is within the allowable range, keep the pressure constant, calculate the time adjustment value and fine-tune it according to the preset time correction amount corresponding to the increment of the fluctuation range exceeding the threshold;

[0088] After the second fine-tuning, continuously mark the preset number of glue dots for verification and supplement the record, recalculate the contour fluctuation range, and repeat the fine-tuning if the standard is not met until the fluctuation range returns to the threshold.

[0089] In one embodiment, the adjusted dispensing pressure (accuracy 0.001 MPa), dispensing time (accuracy 0.01 ms), and diffusion contour boundary coordinates (accuracy 0.0005 mm in both width and depth directions) are recorded by a data acquisition module according to the dispensing sequence, forming real-time recording information. Each record includes a timestamp. The preset analysis threshold is set to 10 consecutive dispensing dots. When the number of consecutive records reaches 10, the parameter analysis process is triggered. The diffusion contour boundary coordinates are extracted from the real-time recording information by the data analysis unit. The difference between the maximum and minimum values ​​of the width direction coordinates is calculated to obtain the width fluctuation range, and the difference between the maximum and minimum values ​​of the depth direction coordinates is calculated to obtain the depth fluctuation range. The two are combined into the contour fluctuation range, and the result is retained to four decimal places.

[0090] It should be noted that the preset fluctuation threshold is set to 0.02 mm in the width direction and 0.015 mm in the depth direction. If the contour fluctuation range exceeds the preset fluctuation threshold, the actual gap parameters are retrieved from the storage unit, and the local parameters of the gap width and depth of the current 10 glue dots are extracted by the region segmenter. The deviation between the local parameters and the overall parameters is calculated (the overall parameters are the actual gap width of 1.0 mm and the actual depth of 0.5 mm obtained in step S1).

[0091] It should be noted that the allowable deviation range is set to width ±0.05 mm and depth ±0.03 mm. When the deviation exceeds the allowable range, the pressure adjustment value and time adjustment value are calculated according to the preset pressure reduction amount of 0.005 MPa for every 0.01 mm increment of local width and the preset time extension amount of 0.2 ms for every 0.01 mm increment of local depth. The parameters of this area are then fine-tuned a second time, with fine-tuning accuracy of 0.001 MPa and 0.01 ms, respectively. When the deviation is within the allowable range, the current dispensing pressure remains unchanged. The time adjustment value is calculated and fine-tuned according to the preset time correction amount of 0.1 ms for every 0.005 mm increment of the fluctuation range exceeding the threshold, with an adjustment accuracy of 0.01 ms.

[0092] In another embodiment, after the second fine-tuning, five glue dots of a preset verification number are continuously applied, relevant parameters are supplemented and recorded, and the contour fluctuation range is recalculated. If it still exceeds the preset fluctuation threshold, the above fine-tuning process is repeated until the contour fluctuation range returns to within the threshold. The entire fine-tuning cycle is controlled within 50 milliseconds.

[0093] Preferably, in step S4: after all adhesive dots are applied, the angle of the light source of the irradiation structure is adjusted, and the adhesive in a specific length area at both ends of the gap is locally cured first, and then the adhesive in the entire gap is fully cured to achieve adhesive application in the fine gaps of the chip.

[0094] Optionally, before adjusting the light source angle of the illumination structure in step S4, the following steps are also included:

[0095] Identify the boundary coordinates of a specific length region at both ends of the positioning gap;

[0096] Calculate the optimal incident angle of the light source based on the boundary coordinates, so that the projection direction of the light source is at a preset angle with the normal direction of the area.

[0097] The angle adjustment adopts a step-by-step drive, pausing for a preset time after each preset angle adjustment. The angle is corrected by detecting the reflection characteristics of light at the edge of the area until the angle corrected by the reflection characteristics matches the preset correction angle.

[0098] In one embodiment, before adjusting the light source angle of the irradiation structure, a laser displacement sensor is used to locate the boundary of a specific length region at both ends of the gap. The specific length region is set to a length range of 2 mm at each end of the gap. The laser displacement sensor emits a laser beam with a wavelength of 635 nm, a spot diameter of 0.01 mm, and a sampling frequency of 10 kHz. It scans and collects the surface height change data of the region along the length direction. When the height change exceeds 0.05 mm, it is determined to be the boundary position. The starting boundary coordinates and ending boundary coordinates of the region in the length direction are identified with a coordinate accuracy of 0.001 mm. The boundary coordinates of the first specific region are 0 mm to 2 mm in the length direction, and the boundary coordinates of the last specific region are 28 mm to 30 mm in the length direction.

[0099] In another embodiment, the region normal direction is determined by the angle calculation unit based on the boundary coordinates. The normal direction forms a 90-degree angle with the length direction. The preset angle is set to 30 degrees. The optimal incident angle of the light source is then calculated, which consists of two symmetrical angles (+30 degrees and -30 degrees) that form a 30-degree angle with the region normal direction.

[0100] In another embodiment, the angle adjustment uses a rotating platform driven by a stepper motor with a step angle of 0.01 degrees. Every 0.01 degree adjustment is followed by a 50-millisecond pause. During this pause, a photodetector detects the reflected light signal at the edge of the area. The reflected light signal is processed by an amplification circuit and converted into a voltage value. When the voltage value stabilizes in the range of 3.5 to 4.5 volts, it is determined that the reflection characteristics meet the preset correction angle requirements. At this point, the angle adjustment is stopped. The angle adjustment range is controlled within ±5 degrees, and the final angle positioning error does not exceed 0.02 degrees.

[0101] Of particular importance is that, in step S4, when performing full curing of the overall adhesive in the gaps, dynamic scanning irradiation is used:

[0102] The light source performs a reciprocating scanning motion along the gap length direction. The scanning speed is related to the glue thickness in a stepwise manner: for every preset thickness unit increase in glue thickness, the scanning speed decreases by a preset speed unit.

[0103] During the scanning process, the curing reaction temperature of the adhesive is monitored in real time. If the temperature exceeds the upper limit of the preset range, the power of the light source is immediately reduced to the preset ratio of the current power, and the scanning speed is reduced to the preset ratio of the current speed.

[0104] After full curing, the curing density of the adhesive in the gaps is detected segment by segment by ultrasonic testing, and areas with curing density lower than the preset threshold are marked.

[0105] For the marked uncured areas, the light source is focused on the area, and a second local irradiation is performed according to the preset curing time. After irradiation, the curing density of the area is confirmed to meet the standard by ultrasonic testing, and the curing is completed.

[0106] In one embodiment, dynamic scanning irradiation is employed, using a 365 nm ultraviolet laser as the light source. The initial output power is set to 5 watts. A servo motor drives the laser to perform a reciprocating scanning motion along the gap length, with a scanning stroke of 0 to 30 mm and a single scan cycle of 2 seconds. The adhesive thickness is measured in real time using an infrared thickness gauge with a measurement accuracy of 0.001 mm. The preset thickness unit is 0.05 mm, and the preset speed unit is 5 mm / s. The initial scanning speed is 50 mm / s. When the adhesive thickness increases by 0.05 mm, the scanning speed decreases by 5 mm / s, and the speed adjustment response time does not exceed 100 milliseconds.

[0107] In another embodiment, during the scanning process, the curing reaction temperature of the adhesive is monitored in real time by a thermocouple temperature sensor. The sensor has a measurement range of 25 to 100 degrees Celsius and an accuracy of ±0.5 degrees Celsius. The upper limit of the preset temperature range is 60 degrees Celsius. If the monitored temperature exceeds 60 degrees Celsius, the power of the light source is immediately reduced to 80% of the current power, and the scanning speed is reduced to 70% of the current speed. The power and speed adjustments are completed synchronously, with an adjustment delay of no more than 50 milliseconds.

[0108] In another embodiment, after full curing, the curing density of the adhesive in the gap is detected segment by segment using an ultrasonic detector with a frequency of 10 MHz. The detection segment is 0.5 mm long, and 200 ultrasonic echo signals are collected for each segment. The preset curing density threshold is 1.1 g / cm³, and areas with curing density lower than 1.1 g / cm³ are marked.

[0109] In another embodiment, for the marked uncured area, the light source is controlled to focus on the area through a focusing lens with a focal length of 0.5 mm, the diameter of the focused spot is 0.1 mm, the preset curing time is 2 seconds, a second local irradiation is performed, and after irradiation, the curing density of the area is detected again by an ultrasonic detector with the same parameters until the detected value reaches 1.1 g / cm³ or above, and the curing is completed.

[0110] Please see Fig. 2A dispensing logic control device for chip micro-gap includes a body 101, a positioning component 102, a dispensing structure 105, and an irradiation structure. The body 101 has a working station 103. The positioning component 102 is located at the working station and includes a positioning fixture 1022 and a sliding detection structure 1021. The positioning fixture is used to fix the chip 104 to be dispensed. The sliding detection structure 1021 is located on one side of the positioning fixture 1022 and can move along the length of the chip micro-gap to select multiple equidistant detection positions to collect gap data. The dispensing structure 105 includes a dispensing head 1052 and a driving unit 1051. The driving unit 1051 drives the dispensing head 1052 to move along the gap length direction to perform dotting on the gap with initial control parameters. The initial control parameters are configured based on the median value of the gap data collected by the sliding detection structure. The irradiation structure is set above the positioning fixture and can project a directional light source to obtain the adhesive dot diffusion contour information. The angle of the light source can be adjusted to first perform local curing of the adhesive in a specific length area at both ends of the gap, and then perform full curing of the adhesive in the entire gap.

[0111] Please see Fig. 3 First, the boundary between the "non-contamination area" and the "component requiring adhesive" is identified (as shown in the upper left figure). The adhesive dispensing range is clearly defined using a logic similar to a "positioning fixture." Simultaneously, a "corresponding film-mounted mold" (upper right figure) is designed to physically isolate non-dispensing areas, preventing adhesive diffusion and contamination. This is another implementation method of "precisely configuring dispensing parameters to control adhesive dot boundaries after gap data acquisition" in this invention, achieving precise area division through physical film application. Dispensing is performed on the preset dispensing area of ​​the film (lower left figure, "dispensing from the film"). The shape and position of the film constrain the diffusion range of the adhesive dots, replacing part of the logic of "dynamically adjusting dispensing parameters through diffusion contour monitoring" in this invention, achieving preliminary precise control of the adhesive dots through physical means. After dispensing, the film is removed (lower right figure, "effect after removing the film"). The adhesive remains only in the target fine gap area, achieving the precise molding effect of "local curing + full curing" in this invention. The film-assisted process achieves cleanliness and precision in dispensing adhesive into the chip's fine gaps.

[0112] Therefore, the embodiments should be considered as exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of the equivalents of the application are intended to be included within the invention.

[0113] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features of the invention herein.

Claims

1. A dispensing logic control method for fine gaps in chips, characterized in that, Includes the following steps: Step S1: After the chip is fixed by the positioning fixture, multiple sets of equidistant detection positions are selected along the length of the gap between the two chips through the sliding detection structure on one side of the fixture to collect gap data, and the median value of the gap data is used as the actual parameter of the gap. Configure the initial control parameters for dispensing pressure, time, and spacing based on the actual gap parameters; Step S2: Control the dispensing head to move along the length of the gap, perform the first dotting according to the initial control parameters, set a preset number of glue dots at each interval, start the irradiation structure above the positioning fixture to project a directional light source, and obtain the diffusion contour information of the glue dots in the gap; In step S2, when obtaining the diffusion contour information of the adhesive dots within the gap, the method of alternating projection using dual light sources includes: The first light source projects along the gap width direction to obtain the lateral boundary information of the diffusion profile; The second light source projects along the gap depth direction to obtain the longitudinal filling information of the diffusion profile; By fusing the horizontal boundary information with the vertical filling information, a three-dimensional diffusion contour model is generated, which includes the boundary coordinates and filling density distribution of the contour. Step S3: If the diffusion profile extends beyond the chip surface boundaries on both sides of the gap, reduce the dispensing pressure of subsequent adhesive dots and shorten the dispensing time; if the diffusion profile does not cover the preset proportion of the gap width, increase the dispensing pressure and extend the dispensing time. Step S4: After completing all the adhesive dots, adjust the light source angle of the irradiation structure, first perform local curing on the adhesive in a specific length area at both ends of the gap, and then perform full curing on the adhesive in the entire gap to achieve adhesive dosing in the fine gaps of the chip.

2. The dispensing logic control method for fine gaps in chips according to claim 1, characterized in that, In step S1, multiple sets of equidistant detection positions are selected along the length of the gap between the two chips using a sliding detection structure on one side of the fixture to collect gap data. A three-dimensional coordinate system is established by using the positioning marks on the edge of the positioning fixture, with the gap length direction set as the X-axis, the width direction as the Y-axis, and the depth direction as the Z-axis. The X-axis is divided into detection positions at equal intervals, and the width data in the Y-axis direction and the depth data in the Z-axis direction are collected simultaneously at each detection position; During the data acquisition process, the probe of the sliding detection structure vibrates at a preset frequency, and the measurement deviation of the depth data is corrected through vibration feedback signals.

3. The dispensing logic control method for fine gaps in chips according to claim 1, characterized in that, Step S3, determining whether the diffusion profile exceeds the chip surface boundaries on both sides of the gap, specifically involves: Extract the extreme points of the lateral boundary in the 3D diffusion profile model; Calculate the distance difference between the extreme point and the chip surface boundary. If the distance difference is positive and the state continues for more than a preset time, it is determined that the diffusion profile exceeds the chip surface boundary on both sides of the gap. This immediately triggers the parameter reduction mechanism, lowering the dispensing pressure to the preset ratio; If, after reducing the dispensing pressure to the preset ratio, two consecutive glue dots still extend beyond the chip surface boundaries on both sides of the gap, then the dispensing pressure should be reduced while the dispensing time is shortened.

4. The dispensing logic control method for fine gaps in chips according to claim 1, characterized in that, In step S3, the preset percentage of the uncovered gap width in the diffusion contour is determined as follows: Calculate the fill density in the 3D diffusion contour model. If the fill density is greater than or equal to a preset threshold, determine the proportion of the width direction of the area where the fill density exceeds the preset threshold. If the proportion in the width direction is lower than the preset width value, record the location distribution area of ​​the uncovered area: If the uncovered area is concentrated in the middle of the gap, increase the dispensing pressure; If the uncovered areas are scattered on both sides of the gap, extend the dispensing time.

5. The dispensing logic control method for fine gaps in chips according to claim 1, characterized in that, Step S3 also includes setting a dynamic adjustment coefficient during the adjustment of dispensing pressure and dispensing time: When the distance of the diffusion superboundary increases to the boundary threshold distance, the pressure reduction coefficient and the time reduction coefficient increase simultaneously, and the increase of the pressure reduction coefficient is greater than that of the time reduction coefficient. When the coverage percentage decreases to the threshold coverage percentage, the pressure adjustment coefficient and the time extension coefficient increase simultaneously, and the increase of the pressure adjustment coefficient is greater than that of the time extension coefficient. After each adjustment, the coefficient value decreases linearly with the increase of the number of consecutive qualified glue dots until it returns to the initial value.

6. The dispensing logic control method for fine gaps in chips according to claim 1, characterized in that, After adjusting the dispensing pressure and dispensing time parameters in step S3, perform the following operations: Record the dispensing pressure, dispensing time, and diffusion contour boundary coordinates of the adjusted glue dots according to the dotting sequence to form real-time recording information. When the number of consecutive records reaches the preset analysis threshold, the parameter analysis process is triggered. Extract the boundary coordinates of the diffusion contour from the real-time recorded information, calculate the difference between the maximum and minimum coordinate values, and obtain the contour fluctuation range; If the contour fluctuation range exceeds the preset fluctuation threshold, retrieve the actual gap parameters, extract the local parameters of the current region's gap width and depth, and compare their deviation with the overall parameters: When the deviation exceeds the allowable range, calculate the pressure and time adjustment values ​​according to the preset pressure reduction amount corresponding to the local width increment and the preset time extension amount corresponding to the local depth increment, and then fine-tune the parameters of the area. When the deviation is within the allowable range, keep the pressure constant, calculate the time adjustment value and fine-tune it according to the preset time correction amount corresponding to the increment of the fluctuation range exceeding the threshold; After the second fine-tuning, continuously mark the preset number of glue dots for verification and supplement the record, recalculate the contour fluctuation range, and repeat the fine-tuning if the standard is not met until the fluctuation range returns to the threshold.

7. The dispensing logic control method for fine gaps in chips according to claim 1, characterized in that, Before adjusting the light source angle of the illumination structure in step S4, the following steps are also included: Identify the boundary coordinates of a specific length region at both ends of the positioning gap; Calculate the optimal incident angle of the light source based on the boundary coordinates, so that the projection direction of the light source is at a preset angle with the normal direction of the area. The angle adjustment adopts a step-by-step drive, pausing for a preset time after each preset angle adjustment. The angle is corrected by detecting the reflection characteristics of light at the edge of the area until the angle corrected by the reflection characteristics matches the preset correction angle.

8. A dispensing logic control system for fine gaps in chips, characterized in that, For performing the dispensing logic control method for chip fine gaps as described in claim 1, the chip fine gap dispensing logic control system includes: The initial configuration module is used to select multiple equidistant detection positions along the length of the gap between the two chips after the chips are fixed by the positioning fixture. The gap data is collected by using a sliding detection structure on one side of the fixture. The median value of the gap data is used as the actual gap parameter. The initial control parameters of dispensing pressure, time and spacing are configured according to the actual gap parameter. The dispensing execution monitoring module is used to control the dispensing head to move along the length of the gap, execute the first dispensing according to the initial control parameters, set a preset number of glue dots at each interval, and start the irradiation structure above the positioning fixture to project a directional light source to obtain the diffusion contour information of the glue dots in the gap. The dispensing parameter dynamic adjustment module is used to reduce the dispensing pressure and shorten the dispensing time of subsequent glue dots if the diffusion profile exceeds the chip surface boundaries on both sides of the gap; and to increase the dispensing pressure and extend the dispensing time if the diffusion profile does not cover the preset proportion of the gap width. The adhesive curing control module is used to adjust the light source angle of the irradiation structure after all adhesive dots have been applied. It first performs local curing on the adhesive in specific length areas at both ends of the gap, and then performs full curing on the adhesive in the entire gap, so as to achieve adhesive application in the fine gaps of the chip.

9. A dispensing logic control device for fine gaps in chips, characterized in that, The dispensing logic control system for chip micro-gap as described in claim 8 includes a body, a positioning component, a dispensing structure, and an irradiation structure. The body has a working station, and the positioning component, located at the working station, includes a positioning fixture and a sliding detection structure. The positioning fixture is used to fix the chip to be dispensed. The sliding detection structure, located on one side of the positioning fixture, can move along the length of the chip micro-gap and select multiple equidistant detection positions to collect gap data. The dispensing structure includes a dispensing head and a driving unit. The driving unit drives the dispensing head to move along the gap length to perform dotting on the gap using initial control parameters, which are configured based on the median value of the gap data collected by the sliding detection structure. The irradiation structure, located above the positioning fixture, can project a directional light source to obtain adhesive dot diffusion contour information and can adjust the light source angle to first perform local curing of the adhesive in specific length areas at both ends of the gap, and then perform full curing of the adhesive in the entire gap.

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