A semiconductor wafer surface defect detection device and method

Abstract

This invention relates to the field of wafer inspection technology, specifically to a semiconductor wafer surface defect inspection device and method, comprising an inspection shell and a transport shell; a stage is disposed within the transport shell, and a pick-up device, a camera, a spotlight, a first rotating ring, a support, and a first driving unit are disposed within the inspection shell; the pick-up device is disposed within the inspection shell and is used to remove the semiconductor wafer from the stage, rotating around the axis of rotation of the stage's movement direction, with each rotation angle being 180 degrees; the camera is disposed on one side of the pick-up device; the spotlight has a ring structure and is sleeved around the camera; the first rotating ring is rotatably disposed within the inspection shell along the axis of rotation; the support is fixedly disposed on the first rotating ring, and the camera is disposed on the support; the first driving unit is disposed on one side of the first rotating ring. This invention improves the accuracy and reliability of double-sided inspection of semiconductor wafers.

Description

Technical Field

[0001] This invention relates to the field of wafer inspection technology, specifically to a semiconductor wafer surface defect detection device and method. Background Technology

[0002] After being cut, semiconductor wafers need to go through the stages of slurry removal, debinding, ultrasonic cleaning, grinding, polishing and inspection. Among these, defect detection on the surface of semiconductor wafers is a crucial step in the inspection process.

[0003] Chinese Patent Publication No. CN120109040B discloses an online inspection device for surface defects on semiconductor wafers, including a base with a cover fixedly installed on the upper end of the base. A first detection probe is fixedly installed on the inner side of the cover, and a second detection probe is fixedly installed inside the base. The device also includes a feeding mechanism for feeding the semiconductor wafer into the cover for inspection, the feeding mechanism being installed on the upper end of the base; a material carrier assembly for clamping the semiconductor wafer, the material carrier assembly being installed on the upper side of the feeding mechanism; and a suction assembly for extracting gas from inside the material carrier assembly. There are two sets of suction assemblies, symmetrically distributed. The feeding mechanism includes two guide rails fixedly installed on the upper end of the base. Two symmetrically distributed slides are movably sleeved on the outer side of the guide rails, and the four slides are fixedly connected by a connecting plate. A support column is fixedly installed on the upper end of each slide. Two symmetrically distributed electric push rods are fixedly installed on the upper end of the base corresponding to the outer sides of the two guide rails.

[0004] The above-mentioned solution uses two high-transparency films to clamp the wafer in order to simultaneously inspect both surfaces. However, during the inspection process, the high-transparency films can reflect light, requiring special treatment. Furthermore, the high-transparency films may discolor after a period of use, significantly impacting the inspection results. Additionally, the surface of the high-transparency films needs regular cleaning; dirt on the surface can also lead to deviations in the inspection results. Moreover, the wafer clamping process is unstable. If a more stable stage is used, the wafer surface in contact with the stage may be obscured, requiring manual or machine intervention to remove and flip the wafer after inspecting one surface. Existing flipping structures that work with the stage are quite complex. Since surface defect inspection on wafers often uses vision-based methods, the flipping mechanism needs to enter the vision inspection area during flipping and retract afterward, resulting in a large overall structure and high operating and maintenance costs. Summary of the Invention

[0005] To address the aforementioned issues, a semiconductor wafer surface defect detection device and method are provided. By optimizing the design of the semiconductor wafer surface defect detection device, a 180-degree rotatable pick-up device is used in conjunction with a multi-angle rotatable camera and a ring spotlight. This achieves an automatic flipping function without manual intervention during the detection of a single semiconductor wafer. At the same time, the semi-circular movement path formed by the camera rotating around the rotation axis, combined with the dynamic change of the spotlight angle, effectively reduces the detection blind zone caused by light from a single angle.

[0006] To address the problems of existing technologies, the present invention provides a semiconductor wafer surface defect detection device, comprising a detection shell and a transport shell arranged horizontally and interconnected;

[0007] A carrier for receiving semiconductor wafers is provided inside the conveying shell along the arrangement direction of the detection shell and the conveying shell. A pick-up device, a camera, a spotlight, a first rotating ring, a bracket and a first drive unit are provided inside the detection shell.

[0008] The pick-up device is set inside the detection housing and is used to remove the semiconductor wafers from the stage. With the moving direction of the stage as the axis of rotation, the pick-up device can rotate around the axis of rotation and the rotation angle is 180 degrees each time.

[0009] The camera is positioned on one side of the picking device, and the camera can rotate around the rotation axis and is always not lower than the upper surface of the platform.

[0010] The spotlights are arranged in a ring shape and surround the camera.

[0011] The first rotating ring is rotatably disposed inside the detection housing along the rotation axis;

[0012] The bracket is fixedly mounted on the first rotating ring, and the camera is mounted on the bracket.

[0013] The first driving unit is located on one side of the first rotating ring and is used to drive the first rotating ring to rotate.

[0014] Preferably, one side of the inner ring of the first rotating ring is coated with a black light-absorbing paint.

[0015] Preferably, the picking device includes a second rotating ring, a suction cup, and a second drive unit;

[0016] The second rotating ring is rotatably disposed on one side of the first rotating ring along the rotation axis;

[0017] The suction cup is mounted on the second rotating ring;

[0018] The second drive unit is located on one side of the second rotating ring and is used to drive the second rotating ring to rotate.

[0019] Preferably, the picking device further includes a slide, a lifting frame, and an electrical synchronization controller;

[0020] There are two sets of suction cups and two slides that are symmetrical about the first rotating ring. Both slides are vertically set in the detection housing.

[0021] There are two lifting frames, each located on a separate slide, and two sets of suction cups are respectively installed on the two lifting frames.

[0022] An electrical synchronization controller is installed on one side of the two slides and is used to control the synchronous operation of the two slides.

[0023] Preferably, the part-retrieving device further includes a vent pipe and a solenoid valve;

[0024] The vent tube is located on the upper part of the suction cup, and the lower end of the vent tube is connected to the upper part of the suction cup.

[0025] The solenoid valve is located at the upper end of the vent pipe.

[0026] Preferably, a power supply component for supplying power to the spotlight and the camera is provided on one side of the first rotating ring.

[0027] Preferably, the power supply component includes a carbon ring, a carbon brush, a spring, and a conductive sheet;

[0028] The carbon ring is positioned on one side of the first rotating ring, and the axis of the spring is collinear with the axis of the first rotating ring;

[0029] The carbon brush is mounted on the support and moves along the axis of the first rotating ring. The end of the carbon brush contacts and slides with the carbon ring.

[0030] The spring is positioned between the carbon brush and the support along the axial direction of the first rotating ring. The two ends of the spring are connected to the carbon brush and the support, respectively. An insulating sheet is provided between the spring and the carbon brush.

[0031] The conductive sheet is mounted on the bracket, and the sidewall of the carbon brush slides in contact with the conductive sheet. The conductive sheet is electrically connected to the spotlight and the camera, respectively.

[0032] Preferably, a positioning unit for detecting the state of the second rotating ring after rotation is provided on one side of the second rotating ring.

[0033] Preferably, a lead screw and a third rotary drive are also provided in the conveyor housing;

[0034] The lead screw is rotatably installed in the conveying shell along the arrangement direction of the detection shell and the conveying shell, and the lead screw passes through the platform and is threadedly engaged with the platform.

[0035] The third rotary actuator is located at the end of the lead screw and is used to drive the lead screw to rotate.

[0036] This invention also relates to a method for detecting surface defects on semiconductor wafers, employing a semiconductor wafer surface defect detection device, the specific process of which is as follows:

[0037] S1. Feeding: The semiconductor wafer is placed on a stage located in the transport housing. The stage moves the semiconductor wafer into the detection housing and stops moving when it reaches directly below the camera.

[0038] S2. First-side inspection: The camera rotates around the rotation axis on the upper part of the platform, and the height of the camera is never lower than the upper surface of the platform. At the same time, the spotlight is turned on synchronously. When the camera rotates around the rotation axis, it takes pictures of the surface of the semiconductor wafer at a natural frequency. The movement path formed by the camera is semi-circular.

[0039] S3. Flip over. After the first side inspection is completed, the pick-up device rotates from below the stage to above the stage and picks up the semiconductor wafer located on the stage. Then the stage is removed from the inspection shell, and the pick-up device rotates the picked-up semiconductor wafer 180 degrees to complete the flipping.

[0040] S4. Second side detection: The camera repeats the steps in S2.

[0041] S5. Unloading: After the inspection is completed, the pick-up device rotates the inspected semiconductor wafer 180 degrees again, making the height of the semiconductor wafer higher than the height of the stage. Then the stage extends into the inspection shell and stops when it is directly below the semiconductor wafer. The pick-up device places the semiconductor wafer on the stage and then releases it. The stage moves the semiconductor wafer back into the conveyor shell, where the operator can then remove the semiconductor wafer.

[0042] The advantages of this invention compared to the prior art are:

[0043] 1. This invention optimizes the design of a semiconductor wafer surface defect inspection device by employing a 180-degree rotatable pick-up device in conjunction with a multi-angle rotatable camera and a ring spotlight. This achieves automatic flipping functionality without manual intervention during the inspection of a single semiconductor wafer. Furthermore, the semi-circular movement path formed by the camera's rotation around its axis, combined with the dynamic changes in the spotlight's angle, effectively reduces blind spots caused by single-angle light. Since the entire inspection process takes place within the inspection housing, the influence of external light is effectively reduced, significantly improving the accuracy and reliability of double-sided semiconductor wafer inspection. Additionally, coating the inner wall of the first rotating ring with a black light-absorbing coating prevents light reflection during camera inspection, further enhancing the camera's detection accuracy.

[0044] 2. By setting up a second rotating ring, a second driving unit, a slide, and a lifting frame, the suction cup can be positioned below the stage when the semiconductor wafer is placed on the stage for testing, and the suction cup will not obstruct the camera's imaging area.

[0045] 3. By setting up carbon rings, carbon brushes, springs, and conductive plates, the camera and spotlight can be continuously and stably powered when the first rotating ring drives the camera to rotate. Attached Figure Description

[0046] Figure 1 This is a three-dimensional schematic diagram of a semiconductor wafer surface defect detection device according to the present invention.

[0047] Figure 2 This is a three-dimensional schematic diagram of a semiconductor wafer surface defect detection device of the present invention after removing the detection shell and the transport shell. Figure 1 .

[0048] Figure 3 This invention relates to a semiconductor wafer surface defect detection device. Figure 2 A magnified view of a portion of point A in the middle.

[0049] Figure 4 This invention relates to a semiconductor wafer surface defect detection device. Figure 2 A magnified view of a portion of point B in the middle.

[0050] Figure 5 This is a side view of a semiconductor wafer surface defect detection device according to the present invention.

[0051] Figure 6 This invention relates to a semiconductor wafer surface defect detection device. Figure 5 A cross-sectional view at point CC.

[0052] Figure 7 This is a cross-sectional three-dimensional schematic diagram of a semiconductor wafer surface defect detection device according to the present invention.

[0053] Figure 8 This invention relates to a semiconductor wafer surface defect detection device. Figure 7 A magnified view of a portion of point D.

[0054] Figure 9 This invention relates to a semiconductor wafer surface defect detection device. Figure 7 A magnified view of a portion of point E in the middle.

[0055] Figure 10 This is a three-dimensional schematic diagram of a semiconductor wafer surface defect detection device of the present invention after removing the detection shell and the transport shell. Figure 2 .

[0056] Figure 11This is a three-dimensional schematic diagram of the combination of a part-picking device and a first rotating ring equipped with a power supply component in a semiconductor wafer surface defect detection device of the present invention.

[0057] Figure 12 This is a three-dimensional schematic diagram of the semiconductor wafer after the wafer has been flipped once in the semiconductor wafer surface defect detection equipment of the present invention.

[0058] The diagram is labeled as follows: 1. Detection shell; 11. Picking device; 111. Second rotating ring; 112. Suction cup; 113. Second drive unit; 1131. Second rotary actuator; 1132. Gear; 114. Slide table; 115. Lifting frame; 116. Vent pipe; 117. Solenoid valve; 12. Camera; 13. Spotlight; 14. First rotating ring; 141. Bracket; 142. Power supply assembly; 1421. Carbon ring; 1422. Carbon brush; 1423. Spring; 1424. Conductive sheet; 15. First drive unit; 151. Worm gear; 152. Worm wheel; 153. First rotary actuator; 16. Positioning unit; 2. Conveying shell; 21. Platform; 22. Lead screw; 23. Third rotary actuator; 3. Semiconductor wafer. Detailed Implementation

[0059] To further understand the features, technical means, and specific objectives and functions achieved by the present invention, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

[0060] Reference Figure 1 , Figure 2 and Figures 5-7 A semiconductor wafer surface defect detection device includes a detection shell 1 and a conveying shell 2 arranged horizontally and interconnected.

[0061] A platform 21 for receiving semiconductor wafers 3 is provided inside the conveying shell 2 along the arrangement direction of the detection shell 1 and the conveying shell 2. A pick-up device 11, a camera 12, a spotlight 13, a first rotating ring 14, a bracket 141 and a first drive unit 15 are provided inside the detection shell 1.

[0062] The picking device 11 is disposed inside the detection housing 1 and is used to pick up the semiconductor wafer 3 on the stage 21. With the moving direction of the stage 21 as the axis of rotation, the picking device 11 can rotate around the axis of rotation and the rotation angle is 180 degrees each time.

[0063] The camera 12 is located on one side of the picking device 11. The camera 12 can rotate around the rotation axis and is always not lower than the upper surface of the platform 21.

[0064] The spotlight 13 has a ring-shaped structure and is fitted around the camera 12.

[0065] The first rotating ring 14 is rotatably disposed inside the detection housing 1 along the rotation axis;

[0066] The bracket 141 is fixedly mounted on the first rotating ring 14, and the camera 12 is mounted on the bracket 141.

[0067] The first driving unit 15 is disposed on one side of the first rotating ring 14 and is used to drive the first rotating ring 14 to rotate.

[0068] After the semiconductor wafer 3 is cut off, the surface defects of the semiconductor wafer 3 need to be detected before leaving the factory. The existing detection method is a fixed detection method, which places the semiconductor wafer 3 horizontally under the camera 12 and performs visual inspection through the camera 12. However, it is easily affected by light and blind spots are likely to occur. At the same time, the semiconductor wafer 3 has two surfaces, so it is necessary to flip the semiconductor wafer 3 manually or with a robotic arm during the inspection. If a robotic arm is used to flip it, it will increase the footprint of the inspection equipment. To avoid detection blind spots, existing devices enable the camera 12 to operate from multiple angles. However, these devices do not have an automatic flipping function. This is because the existing flipping device obstructs the camera area of ​​the camera 12, preventing the camera 12 from capturing the full view of the semiconductor wafer 3. To avoid obstruction by the flipping device, a moving mechanism needs to be added to the flipping device. When the flipping device completes the flipping, the moving mechanism removes the flipping device from the camera area. However, the semiconductor wafer 3 is still on the flipping device at this time. As a result, when the flipping device is moved out, the semiconductor wafer 3 is also moved out simultaneously with the flipping device, which still prevents the camera 12 from capturing the full view of the semiconductor wafer 3. The existing equipment capable of simultaneously inspecting both sides of the semiconductor wafer 3 cannot be matched with the multi-angle adjustable camera 12. This is because when simultaneously inspecting both sides of the semiconductor wafer 3, the existing equipment relies on a high-transparency film to hold the semiconductor wafer 3. However, the high-transparency film itself still has a certain degree of reflectivity. In addition, if there are defects on the surface of the semiconductor wafer 3, it will also damage the surface of the high-transparency film. Furthermore, the high-transparency film will gradually develop problems such as discoloration after long-term use. Therefore, it has a significant impact on the inspection results and cannot be compatible with the visual inspection method of the camera 12.

[0069] To avoid the aforementioned issues, the existing semiconductor wafer 3 surface defect detection equipment was optimized, enabling the detection of a single semiconductor wafer 3 without human intervention and with less susceptibility to ambient light, thus improving the detection accuracy of the semiconductor wafer 3 surface. The specific structure and operation of this invention are as follows:

[0070] The first drive unit 15 includes a worm 151, a worm wheel 152, and a first rotary driver 153. The worm wheel 152 is fixedly sleeved on the periphery of the first rotating ring 14. The worm 151 is vertically arranged on one side of the worm wheel 152 and is in transmission cooperation with the worm wheel 152. The first rotary driver 153 is arranged at the end of the worm 151 and is used to drive the worm 151 to rotate. The first rotary driver 153 is preferably a servo motor.

[0071] Before testing, the stage 21 is located in the conveying shell 2. The upper part of the conveying shell 2 has a feeding port. The operator places the semiconductor wafer 3 into the conveying shell 2 through the feeding port, and the stage 21 receives it. The upper part of the stage 21 has a circular recess, the diameter of which is the same as the diameter of the semiconductor wafer 3. Then, the stage 21 carries the semiconductor wafer 3 into the testing shell 1. At this time, the picking device 11 is located below the stage 21, while the camera 12 is always not lower than the upper surface of the stage 21. Therefore, the picking device 11 does not obstruct the view above the stage 21. After confirming that the stage 21 has stopped moving, at this time... The semiconductor wafer 3 is located directly below the camera 12, which is in a vertical position. The spotlights 13 surrounding the camera 12 are turned on. The camera 12 then begins visual inspection of the surface of the semiconductor wafer 3. During inspection, the camera 12 rotates around its axis of rotation, and its height is not lower than the upper surface of the stage 21. The movement path of the camera 12 during inspection is semi-circular. Therefore, when the camera 12 inspects the surface of the semiconductor wafer 3, the angle of the light projected by the spotlights 13 changes with the rotation of the camera 12. To reduce the occurrence of blind spots, after completing the inspection of one surface of the semiconductor wafer 3, the pick-up device 11 rotates from below the stage 21 to above the stage 21. The pick-up device 11 picks up the semiconductor wafer 3 located on the stage 21, and then the stage 21 is removed from the detection housing 1. The pick-up device 11 drives the semiconductor wafer 3 to rotate 180 degrees, completing the flip. After the flip, the upper surface of the semiconductor wafer 3 is in a horizontal state. Then the camera 12 inspects the surface of the semiconductor wafer 3 again. The movement path formed by the camera 12 during inspection is the same as the previous movement path. When the camera 12 inspects the semiconductor wafer 3... After the second surface of the bulk wafer 3 is inspected, the pick-up device 11 rotates the semiconductor wafer 3 180 degrees. At the same time, the pick-up device 11 lifts the semiconductor wafer 3, so that the height of the semiconductor wafer 3 adsorbed by the pick-up device 11 is higher than the stage 21. The stage 21 extends into the inspection shell 1 again and stops moving when it reaches directly below the semiconductor wafer 3. The pick-up device 11 places the semiconductor wafer 3 on the stage 21 and releases it. The stage 21 pulls the semiconductor wafer 3 out of the inspection shell 1 and into the transport shell 2 for reset. Then, the operator can take out the semiconductor wafer 3 placed on the stage 21.

[0072] By optimizing the design of the semiconductor wafer 3 surface defect detection equipment, a 180-degree rotatable pick-up device 11 is used in conjunction with a multi-angle rotatable camera 12 and a ring spotlight 13 to achieve automatic flipping function without manual intervention during the detection of a single semiconductor wafer 3. At the same time, the semi-circular movement path formed by the camera 12 rotating around the rotation axis, combined with the dynamic change of the light angle of the spotlight 13, effectively reduces the detection blind zone caused by a single angle of light. Furthermore, since the detection shell 1 has a certain degree of light shielding, the accuracy and reliability of double-sided detection of the semiconductor wafer 3 are significantly improved.

[0073] Reference Figure 2 and Figure 6 The inner ring side of the first rotating ring 14 is coated with black light-absorbing paint.

[0074] Since the camera 12 needs to use the light source of the spotlight 13 to illuminate the surface of the semiconductor wafer 3 when taking pictures, and the semiconductor wafer 3 itself has a certain reflective effect, some light will be reflected by the semiconductor wafer 3 onto the inner ring sidewall of the first rotating ring 14. If the inner ring sidewall of the first rotating ring 14 is not treated, the inner wall of the first rotating ring 14 will also reflect light, which will cause the camera 12 to be affected by other light when visually inspecting the surface of the semiconductor wafer 3, ultimately leading to deviations in the detection results. However, after coating the inner wall of the first rotating ring 14 with black light-absorbing paint, the reflection of light by the inner wall of the first rotating ring 14 during the detection process of the camera 12 can be avoided, thus improving the detection accuracy of the camera 12.

[0075] Reference Figure 2 , Figure 3 , Figure 9 and Figure 10 The part-retrieving device 11 includes a second rotating ring 111, a suction cup 112, and a second drive unit 113.

[0076] The second rotating ring 111 is rotatably disposed on one side of the first rotating ring 14 along the rotation axis;

[0077] The suction cup 112 is mounted on the second rotating ring 111;

[0078] The second drive unit 113 is disposed on one side of the second rotating ring 111 and is used to drive the second rotating ring 111 to rotate.

[0079] After the suction cup 112 picks up the semiconductor wafer 3 on the stage 21, it lifts the semiconductor wafer 3. Then, the stage 21 returns from the detection shell 1 to the transport shell 2. The second drive unit 113 drives the second rotating ring 111 to rotate 180 degrees, causing the suction cup 112 to flip the semiconductor wafer 3 by 180 degrees, thereby flipping the semiconductor wafer 3. Finally, the camera 12 rotates around the rotation axis under the drive of the first rotating ring 14, so that the camera 12 can detect the surface of the flipped semiconductor wafer 3. The second drive unit includes a second rotary drive 1131 and a gear 1132. The outer circumference of the second rotating ring 111 is evenly provided with meshing teeth. The gear 1132 is rotatably disposed on one side of the second rotating ring 111 and meshes with the meshing teeth on the second rotating ring 111. The second rotary drive 1131 is disposed at the end of the gear 1132. The second rotary drive 1131 is preferably a servo motor.

[0080] Reference Figure 9 and Figure 10 The retrieval device 11 also includes a slide table 114, a lifting frame 115, and an electrical synchronization controller;

[0081] Two sets of suction cups 112 are provided, and two slides 114 are provided and symmetrical about the first rotating ring 14. Both slides 114 are vertically arranged in the detection shell 1.

[0082] There are two lifting frames 115, which are respectively mounted on two slides 114, and two sets of suction cups 112 are respectively mounted on the two lifting frames 115;

[0083] An electrical synchronization controller is installed on one side of the two slides 114 and is used to control the synchronous operation of the two slides 114.

[0084] Two sets of suction cups 112 are provided in the picking device 11, so that the two sets of suction cups 112 can simultaneously adsorb the semiconductor wafer 3, which improves the stability during subsequent flipping. Two sliding tables 114 drive two lifting frames 115 respectively, so that the two lifting frames 115 will not collide with the camera 12 when they rise and fall. This avoids the situation where the suction cups 112 adsorb the semiconductor wafer 3 and the sliding tables 114 drive the lifting frames 115 to rise and collide with the camera 12. By setting an electrical synchronization controller, the synchronicity of the two sliding tables 114 driving the two lifting frames 115 to rise and fall is ensured, so that the semiconductor wafer 3 is subjected to more uniform force when it is adsorbed and rises, avoiding damage to the semiconductor wafer 3 due to detection.

[0085] Reference Figure 11 The part-retrieving device 11 also includes a vent pipe 116 and a solenoid valve 117;

[0086] The vent pipe 116 is located on the upper part of the suction cup 112, and the lower end of the vent pipe 116 is connected to the upper part of the suction cup 112.

[0087] Solenoid valve 117 is located at the upper end of vent pipe 116.

[0088] When the suction cup 112 adsorbs the semiconductor wafer 3 located on the stage 21, the solenoid valve 117 is in the closed state. The lifting frame 115 is driven by the slide 114 to press down the suction cup 112. When the suction cup 112 presses against the surface of the semiconductor wafer 3, it generates an adsorption force on the semiconductor wafer 3. Subsequently, the suction cup 112 adsorbs the semiconductor wafer 3 and rises. At the same time, the stage 21 is retracted. Driven by the second rotating ring 111, the adsorbed semiconductor wafer 3 is rotated 180 degrees, thereby achieving flipping. After flipping, the upper surface of the semiconductor wafer 3 is in a horizontal state. 2. After the test is completed, the second rotating ring 111 rotates 180 degrees again. Then, the stage 21 extends into the test housing 1 again and moves to the bottom of the semiconductor wafer 3. Then, the slide 114 drives the lifting frame 115 to descend, so that the semiconductor wafer 3 is placed on the stage 21. Then, the solenoid valve 117 opens, the suction force of the suction cup 112 on the semiconductor wafer 3 disappears, the slide 114 drives the lifting frame 115 to rise again, the suction cup 112 disengages from the semiconductor wafer 3, and the stage 21 moves the semiconductor wafer 3, which has completed the test, into the transport housing 2 to complete the reset.

[0089] Reference Figure 6 A power supply component 142 for supplying power to the spotlight 13 and the camera 12 is provided on one side of the first rotating ring 14.

[0090] Reference Figure 8 and Figure 11 The power supply component 142 includes a carbon ring 1421, a carbon brush 1422, a spring 1423, and a conductive sheet 1424.

[0091] The carbon ring 1421 is disposed on one side of the first rotating ring 14, and the axis of the spring 1423 is collinear with the axis of the first rotating ring 14;

[0092] The carbon brush 1422 is movably mounted on the bracket 141 along the axial direction of the first rotating ring 14, and the end of the carbon brush 1422 contacts and slides with the carbon ring 1421.

[0093] Spring 1423 is disposed between carbon brush 1422 and bracket 141 along the axial direction of the first rotating ring 14. The two ends of spring 1423 are respectively connected to carbon brush 1422 and bracket 141. An insulating sheet is provided between spring 1423 and carbon brush 1422.

[0094] The conductive sheet 1424 is mounted on the bracket 141. The sidewall of the carbon brush 1422 slides in contact with the conductive sheet 1424. The conductive sheet 1424 is electrically connected to the spotlight 13 and the camera 12, respectively.

[0095] Spring 1423 provides pressing force to carbon brush 1422, so that carbon brush 1422 is always pressed on carbon ring 1421. When the first rotating ring 14 rotates, carbon brush 1422 slides on carbon ring 1421. When carbon ring 1421 is energized, current is transmitted through carbon brush 1422 to conductive sheet 1424, thereby realizing power supply to spotlight 13 and camera 12.

[0096] Reference Figure 6 and Figure 7 A positioning unit 16 is provided on one side of the second rotating ring 111 to detect the state of the second rotating ring 111 after rotation.

[0097] The positioning unit 16 can select a Hall sensor or an angle sensor, depending on the actual situation. When using a Hall sensor, a magnetic induction sheet needs to be set on the second rotating ring 111. The Hall sensor can identify the magnetic induction sheet every 180 degrees that the second rotating ring 111 rotates, thereby completing the positioning of the second rotating ring 111. If an angle sensor is used, the angle sensor is set between the second rotary driver 1131 and the gear 1132. Since the diameter of the gear 1132 is smaller than that of the second rotating ring 111, the rotation angle of the gear 1132 is accumulated and counted by the angle sensor. When the specified accumulated value is reached, it means that the second rotating ring 111 has rotated 180 degrees.

[0098] Reference Figure 4 and Figure 7 The conveyor housing 2 is also equipped with a lead screw 22 and a third rotary drive 23;

[0099] The lead screw 22 is rotatably disposed in the conveying shell 2 along the arrangement direction of the detection shell 1 and the conveying shell 2, and the lead screw 22 passes through the platform 21 and is threadedly engaged with the platform 21.

[0100] The third rotary actuator 23 is located at the end of the lead screw 22 and is used to drive the lead screw 22 to rotate.

[0101] The third rotary driver 23 is preferably a servo motor. The third rotary driver 23 rotates the lead screw 22, causing the stage 21 to extend into or retract from the detection housing 1.

[0102] Reference Figures 1-12 This invention also relates to a method for detecting surface defects on semiconductor wafers, employing a semiconductor wafer surface defect detection device, the specific process of which is as follows:

[0103] S1. Feeding: The semiconductor wafer 3 is placed on the stage 21 located in the conveyor housing 2. The stage 21 moves the semiconductor wafer 3 into the detection housing 1 and stops moving when it reaches directly below the camera 12.

[0104] S2. First-side detection: The camera 12 rotates around the rotation axis on the upper part of the stage 21, and the height of the camera 12 is always not lower than the upper surface of the stage 21. At the same time, the spotlight 13 is turned on. When the camera 12 rotates around the rotation axis, it takes pictures of the surface of the semiconductor wafer 3 according to its inherent frequency. The movement path formed by the camera 12 when it moves is semi-circular.

[0105] S3. Flip over. After the first side inspection is completed, the pick-up device 11 rotates from below the stage 21 to above the stage 21 and picks up the semiconductor wafer 3 located on the stage 21. Then the stage 21 is removed from the inspection shell 1. The pick-up device 11 drives the picked-up semiconductor wafer 3 to rotate 180 degrees to complete the flipping.

[0106] S4. Second side detection: Camera 12 repeats the steps in S2.

[0107] S5. Unloading: After the inspection is completed, the pick-up device 11 rotates the inspected semiconductor wafer 3 by 180 degrees again, making the height of the semiconductor wafer 3 higher than the height of the stage 21. Then, the stage 21 extends into the inspection shell 1 and stops when it is directly below the semiconductor wafer 3. The pick-up device 11 places the semiconductor wafer 3 on the stage 21 and then releases it. The stage 21 drives the semiconductor wafer 3 back to the conveying shell 2, where the operator can then remove the semiconductor wafer 3.

[0108] Working principle: Before testing, the stage 21 is located in the conveying shell 2. The upper part of the conveying shell 2 has a discharge port. The operator places the semiconductor wafer 3 into the conveying shell 2 through the discharge port, and the stage 21 receives it. The upper part of the stage 21 has a circular recess, the diameter of which is the same as the diameter of the semiconductor wafer 3. Then, the stage 21 carries the semiconductor wafer 3 into the testing shell 1. At this time, the picking device 11 is located below the stage 21, while the camera 12 is always not lower than the upper surface of the stage 21. Therefore, the picking device 11 will not obstruct the upper part of the stage 21. After confirming that the stage 21 has stopped moving... At this time, the semiconductor wafer 3 is located directly below the camera 12, which is in a vertical position. The spotlights 13 surrounding the camera 12 are turned on. The camera 12 then begins to visually inspect the surface of the semiconductor wafer 3. When inspecting the surface of the semiconductor wafer 3, the camera 12 rotates around its axis of rotation, and the height of the camera 12 is not lower than the upper surface of the stage 21. The movement path formed by the camera 12 during the inspection process is semi-circular. Therefore, when the camera 12 inspects the surface of the semiconductor wafer 3, the angle of the light projected by the spotlights 13 changes as the camera 12 rotates. This reduces the occurrence of blind spots. After completing the inspection of one surface of the semiconductor wafer 3, the pick-up device 11 rotates from below the stage 21 to above the stage 21. The pick-up device 11 picks up the semiconductor wafer 3 located on the stage 21, and then the stage 21 is removed from the detection housing 1. The pick-up device 11 drives the semiconductor wafer 3 to rotate 180 degrees, completing the flip. After the flip, the upper surface of the semiconductor wafer 3 is in a horizontal state. Then the camera 12 inspects the surface of the semiconductor wafer 3 again. The movement path formed by the camera 12 during inspection is the same as the movement path formed in the previous inspection. When the camera 12 is halfway... After the second surface of the conductor wafer 3 is inspected, the pick-up device 11 rotates the semiconductor wafer 3 180 degrees. At the same time, the pick-up device 11 lifts the semiconductor wafer 3, so that the height of the semiconductor wafer 3 adsorbed by the pick-up device 11 is higher than the stage 21. The stage 21 extends into the inspection shell 1 again and stops moving when it reaches directly below the semiconductor wafer 3. The pick-up device 11 places the semiconductor wafer 3 on the stage 21 and releases it. The stage 21 pulls the semiconductor wafer 3 out of the inspection shell 1 and into the transport shell 2 for reset. Then, the operator can take out the semiconductor wafer 3 placed on the stage 21.

[0109] The above embodiments only illustrate one or more implementations of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of protection of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. A semiconductor wafer surface defect detection device, comprising a detection shell (1) and a transport shell (2) arranged horizontally and interconnected. Its features are, A platform (21) for receiving semiconductor wafers (3) is provided inside the conveying shell (2) along the arrangement direction of the detection shell (1) and the conveying shell (2). A pick-up device (11), a camera (12), a spotlight (13), a first rotating ring (14), a bracket (141) and a first driving unit (15) are provided inside the detection shell (1). The picking device (11) is set inside the detection shell (1) and is used to pick up the semiconductor wafer (3) on the stage (21). With the moving direction of the stage (21) as the axis of rotation, the picking device (11) can rotate around the axis of rotation and the rotation angle is 180 degrees each time. The camera (12) is set on one side of the picking device (11). The camera (12) can rotate around the rotation axis and is always not lower than the upper surface of the platform (21). The spotlight (13) has a ring structure and is fitted around the camera (12); The first rotating ring (14) is rotatably disposed inside the detection housing (1) along the rotation axis; The bracket (141) is fixedly mounted on the first rotating ring (14), and the camera (12) is mounted on the bracket (141); The first driving unit (15) is disposed on one side of the first rotating ring (14) and is used to drive the first rotating ring (14) to rotate; The picking device (11) includes a second rotating ring (111), a suction cup (112), and a second drive unit (113). The second rotating ring (111) is rotatably disposed on one side of the first rotating ring (14) along the rotation axis; The suction cup (112) is mounted on the second rotating ring (111); The second drive unit (113) is disposed on one side of the second rotating ring (111) and is used to drive the second rotating ring (111) to rotate; The picking device (11) also includes a slide (114), a lifting frame (115), and an electrical synchronization controller; There are two sets of suction cups (112) and two slides (114) symmetrical about the first rotating ring (14). Both slides (114) are vertically set in the detection shell (1). There are two lifting frames (115) respectively located on two slides (114), and two sets of suction cups (112) are respectively located on the two lifting frames (115); An electrical synchronization controller is installed on one side of the two slides (114) and is used to control the synchronous operation of the two slides (114); A power supply component (142) for supplying power to the spotlight (13) and the camera (12) is provided on one side of the first rotating ring (14). The power supply assembly (142) includes a carbon ring (1421), a carbon brush (1422), a spring (1423), and a conductive sheet (1424). A carbon ring (1421) is disposed on one side of the first rotating ring (14), and the axis of the spring (1423) is collinear with the axis of the first rotating ring (14); The carbon brush (1422) is mounted on the bracket (141) along the axial direction of the first rotating ring (14), and the end of the carbon brush (1422) contacts and slides with the carbon ring (1421); The spring (1423) is arranged between the carbon brush (1422) and the bracket (141) along the axial direction of the first rotating ring (14). The two ends of the spring (1423) are connected to the carbon brush (1422) and the bracket (141) respectively. An insulating sheet is provided between the spring (1423) and the carbon brush (1422). The conductive sheet (1424) is mounted on the bracket (141), and the sidewall of the carbon brush (1422) slides in cooperation with the conductive sheet (1424). The conductive sheet (1424) is electrically connected to the spotlight (13) and the camera (12) respectively.

2. The semiconductor wafer surface defect detection device according to claim 1, characterized in that, The inner ring side of the first rotating ring (14) is coated with black light-absorbing paint.

3. The semiconductor wafer surface defect detection device according to claim 1, characterized in that, The part-retrieving device (11) also includes a vent pipe (116) and a solenoid valve (117). The vent pipe (116) is located on the upper part of the suction cup (112), and the lower end of the vent pipe (116) is connected to the upper part of the suction cup (112); The solenoid valve (117) is located at the upper end of the vent pipe (116).

4. The semiconductor wafer surface defect detection device according to claim 1, characterized in that, A positioning unit (16) is provided on one side of the second rotating ring (111) to detect the state of the second rotating ring (111) after rotation.

5. The semiconductor wafer surface defect detection device according to claim 1, characterized in that, A lead screw (22) and a third rotary drive (23) are also provided in the conveyor housing (2); The lead screw (22) is rotatably disposed in the conveying shell (2) along the arrangement direction of the detection shell (1) and the conveying shell (2), and the lead screw (22) passes through the platform (21) and is threadedly engaged with the platform (21); The third rotary actuator (23) is located at the end of the lead screw (22) and is used to drive the lead screw (22) to rotate.

6. A method for detecting surface defects on a semiconductor wafer, employing the semiconductor wafer surface defect detection equipment according to any one of claims 1-5, characterized in that, The specific process is as follows: S1. Feeding: Place the semiconductor wafer (3) on the stage (21) located in the transport housing (2). The stage (21) moves the semiconductor wafer (3) into the detection housing (1) and stops moving when it reaches directly below the camera (12). S2, First surface detection: The camera (12) rotates around the rotation axis on the upper part of the stage (21), and the height of the camera (12) is always not lower than the upper surface of the stage (21). At the same time, the spotlight (13) is turned on. When the camera (12) rotates around the rotation axis, it takes pictures of the surface of the semiconductor wafer (3) according to the inherent frequency. The movement path formed by the camera (12) when it moves is semi-circular. S3. Flip over. After the first side inspection is completed, the pick-up device (11) rotates from below the stage (21) to above the stage (21) and picks up the semiconductor wafer (3) located on the stage (21). Then the stage (21) is removed from the inspection shell (1). The pick-up device (11) drives the picked-up semiconductor wafer (3) to rotate 180 degrees to complete the flipping. S4, Second side detection, camera (12) repeats the steps in S2; S5. After the test is completed, the pick-up device (11) rotates the semiconductor wafer (3) that has been tested by 180 degrees again, so that the height of the semiconductor wafer (3) is higher than the height of the stage (21). Then the stage (21) extends into the test shell (1) and stops when it is directly below the semiconductor wafer (3). The pick-up device (11) places the semiconductor wafer (3) on the stage (21) and releases it. The stage (21) drives the semiconductor wafer (3) to reset to the conveying shell (2). The staff can then take out the semiconductor wafer (3).

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