Terminal-free electrode testing method

Abstract

The invention relates to a terminal-free electrode testing method, which is realized by adopting an electrode testing jig, the electrode testing jig comprises a plurality of first substrates and a plurality of second substrates, each first substrate comprises at least two first contact parts penetrating through the upper surface and the lower surface, and each second substrate comprises at least two second contact parts penetrating through the upper surface and the lower surface; the second substrate comprises at least two second contact parts penetrating through the upper surface and the lower surface; when the first substrate and the second substrate are stacked, any first contact part is provided with a corresponding second contact part; the electrode testing method comprises the steps that at least two electrocardio-electrode pairs are placed between a first substrate and a second substrate, and any electrocardio-electrode pair is attached to a first contact part and a second contact part; the second contact part is communicated with the positive electrode of a power supply, and the first contact part is communicated with the negative electrode of the power supply, so that the electrocardio-electrode pair between the first substrate and the second substrate is electrified; according to a preset time interval, the voltage between the first contact part and the second contact part of each electrocardio-electrode pair is detected, voltage change data is obtained, and the performance of the electrocardio-electrode pair is determined according to the voltage change data. According to the invention, the detection efficiency of the electrocardio-electrode pair is improved.

Description

Technical Field

[0001] This application relates to the field of medical testing, and in particular to a terminalless electrode testing method. Background Technology

[0002] Testing medical electrodes helps ensure their reliability. However, electrode testing typically requires testing each electrode individually, which is time-consuming. Furthermore, traditional alligator clips cannot reliably connect electrodes without terminals, leading to severe voltage drift and failure to meet testing standards. Therefore, how to simultaneously test all electrodes without terminals and improve testing efficiency has become a pressing issue. Summary of the Invention

[0003] This application provides a terminalless electrode testing method to at least solve the problem in related technologies where multiple terminalless electrodes cannot be tested synchronously, resulting in low testing efficiency.

[0004] In a first aspect, embodiments of this application provide a terminalless electrode testing method, which is implemented using an electrode testing fixture, the fixture comprising a plurality of first substrates and a plurality of second substrates. The first substrate includes at least two first contact portions penetrating the upper and lower surfaces, and different first contact portions are electrically connected to each other, and different first substrates are electrically connected to each other through the first contact portions; The second substrate includes at least two second contact portions penetrating the upper and lower surfaces, and different second contact portions are electrically connected to each other, and different second substrates are electrically connected to each other through the second contact portions; When the first substrate and the second substrate are stacked, each of the first contact portions has a corresponding second contact portion. The electrode testing method includes: At least two ECG electrode pairs are placed between the first substrate and the second substrate, and each ECG electrode pair is respectively attached to the first contact portion and the second contact portion; The second contact portion is connected to the positive terminal of the power supply, and the first contact portion is connected to the negative terminal of the power supply, so that the ECG electrode pair between the first substrate and the second substrate is energized. At preset time intervals, the voltage between the first contact portion and the second contact portion of each ECG electrode pair is detected to obtain voltage change data, and the performance of the ECG electrode pair is determined based on the voltage change data.

[0005] In one embodiment, the first contact portion includes a first through hole and a first mating surface, wherein the distance between the center of the first through hole and the geometric center of the first mating surface is greater than a preset distance; The second contact portion includes a second through hole and a second mating surface. The distance between the center of the second through hole and the geometric center of the second mating surface is greater than the preset distance. The opening of the second through hole on the upper surface of the second substrate is covered with a conductive material, and the conductive material is electrically connected to the second mating surface. The step of detecting the voltage between the first and second contact portions of each ECG electrode pair at preset time intervals to obtain voltage change data includes: When no current is applied, the voltage between the second through hole and the first mating surface is detected to obtain the initial voltage; Within a preset time period after the current is applied, the voltage between the second through hole and the first mating surface is detected according to a first preset time interval to obtain a number of first voltages. Based on the difference between the initial voltage and each of the first voltages, first voltage change data is obtained. After the preset duration, the voltage between the second through hole and the first mating surface is detected according to the second preset time interval to obtain a number of second voltages. Based on the difference between the initial voltage and each of the second voltages, second voltage change data is obtained.

[0006] In one embodiment, determining the performance of the ECG electrode pair based on the voltage change data includes: If both the first voltage change data and the second voltage change data are less than or equal to a preset voltage threshold, then the performance of the ECG electrode pair is qualified. If either the first voltage change data or the second voltage change data exceeds the preset voltage threshold, then the performance of the ECG electrode pair is unqualified.

[0007] In one embodiment, connecting the second contact portion to the positive terminal of a power supply and connecting the first contact portion to the negative terminal of a power supply, so that the ECG electrode pair between the first substrate and the second substrate is energized, includes: All the first substrates are arranged in order from left to right. In the last first substrate, the target first bonding surface is determined according to the wiring layout between the first bonding surfaces. All the second substrates are arranged in order from left to right. In the first second substrate, the target second bonding surface is determined according to the wiring layout between the second bonding surfaces. The positive terminal of the power supply is connected to the second bonding surface of the target, and the negative terminal of the power supply is connected to the first bonding surface of the target, so that the ECG electrode pair between the first substrate and the second substrate is energized.

[0008] In one embodiment, after connecting the positive terminal of the power supply to the target second bonding surface and the negative terminal of the power supply to the target first bonding surface, the method further includes: After power is connected, the current flow direction between the first bonding surface, the second bonding surface, and the ECG electrode pair is determined based on the wiring layout between the first bonding surfaces, the wiring layout of the second bonding surface, and the ECG electrode pair.

[0009] In one embodiment, detecting the voltage between the second through hole and the first mating surface includes: Based on the direction of current flow, determine the inflow and outflow ends of each ECG electrode pair; For any ECG electrode pair to be detected, if either the outflow end or the inflow end is located on the second substrate, the first voltage detection end is passed through the first through hole to the conductive material of the second through hole; The second voltage detection terminal is brought into contact with the first bonding surface, and the voltage between the second through hole and the first bonding surface is detected based on the first voltage detection terminal and the second voltage detection terminal.

[0010] In one embodiment, after connecting the second contact portion to the positive terminal of the power supply and the first contact portion to the negative terminal of the power supply, the method further includes: Based on the first contact portion and the second contact portion, the total voltage of all said ECG electrode pairs is obtained; If the total voltage changes continuously, the first and second contact surfaces of each ECG electrode pair are inspected.

[0011] In one embodiment, the method further includes: The second preset time interval is greater than the first preset time interval.

[0012] The terminalless electrode testing method provided in this application has at least the following technical effects.

[0013] By placing at least two ECG electrode pairs between a first substrate and a second substrate, such that the ECG electrode pairs are respectively attached to the first contact portion and the second contact portion, and the second contact portion is connected to the positive terminal of the power supply, while the first substrate is not connected to the negative terminal of the power supply, the ECG electrode pairs are energized. The first substrate and the second substrate are connected through the ECG electrode pairs. Different first substrates are connected through the first contact portion, and different second substrates are connected through the second contact portion. When a power supply is connected, multiple ECG electrode pairs can be simultaneously powered through the connection relationship between the attached substrates and substrates of the same type. The voltage between each first contact portion and the second contact portion is detected at preset time intervals. The performance of the ECG electrode pairs can be determined based on the voltage change data. Since multiple electrodes are powered simultaneously, the voltage between the first contact portion and the second contact portion can be detected quickly, thereby improving the efficiency of ECG electrode pair performance detection.

[0014] Details of one or more embodiments of this application are set forth in the following drawings and description to make other features, objects and advantages of this application more readily apparent. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the structure of an electrode testing fixture according to an exemplary embodiment; Figure 2 This is a schematic diagram of the internal structure of the first contact portion according to an exemplary embodiment; Figure 3 This is a schematic diagram of the internal structure of the second contact portion according to an exemplary embodiment; Figure 4 This is a flowchart illustrating a terminalless electrode testing method according to an exemplary embodiment; Figure 5 This is a planar schematic diagram showing the current flow direction on the upper surface of a first substrate and the upper surface of a second substrate according to an exemplary embodiment; Figure 6 This is a schematic diagram illustrating the current flow in an electrode testing fixture for 27 ECG electrode pairs according to an exemplary embodiment.

[0016] In the above figures, the meanings of the reference numerals are as follows: 100. First substrate; 101. Upper surface of the first substrate; 102. Lower surface of the first substrate; 103. First bonding surface; 104. First through hole; 200, second substrate; 201, upper surface of the second substrate; 202, lower surface of the second substrate; 203, second bonding surface; 204, second through hole; 300, ECG electrode pair; 500, first contact portion; 600, second contact portion; 111. First upper bonding surface; 112. Second upper bonding surface; 113. Third upper bonding surface; 114. Fourth upper bonding surface; 115. Fifth upper bonding surface; 116. Sixth upper bonding surface; 117. Seventh upper bonding surface; 118. Eighth bonding surface; 119. Ninth upper bonding surface; 120. Tenth upper bonding surface; 121. Eleventh upper bonding surface; 122. Twelfth upper bonding surface; 123. Thirteenth upper bonding surface; 124. Fourteenth upper bonding surface; 12 5. Fifteenth upper bonding surface, 126. Sixteenth upper bonding surface, 127. Seventeenth upper bonding surface, 128. Eighteenth upper bonding surface, 129. Nineteenth upper bonding surface, 130. Twentieth upper bonding surface, 131. Twenty-first upper bonding surface, 132. Twenty-second upper bonding surface, 133. Twenty-third upper bonding surface, 134. Twenty-fourth upper bonding surface, 135. Twenty-fifth upper bonding surface, 136. Twenty-sixth upper bonding surface, 137. Twenty-seventh upper bonding surface; 211. First lower layer bonding surface; 212. Second lower layer bonding surface; 213. Third lower layer bonding surface; 214. Fourth lower layer bonding surface; 215. Fifth lower layer bonding surface; 216. Sixth lower layer bonding surface; 217. Seventh lower layer bonding surface; 218. Eighth layer bonding surface; 219. Ninth lower layer bonding surface; 220. Tenth lower layer bonding surface; 221. Eleventh lower layer bonding surface; 222. Twelfth lower layer bonding surface; 223. Thirteenth lower layer bonding surface; 224. Fourteenth lower layer bonding surface; 22 5. Fifteenth lower layer bonding surface, 226. Sixteenth lower layer bonding surface, 227. Seventeenth lower layer bonding surface, 228. Eighteenth lower layer bonding surface, 229. Nineteenth lower layer bonding surface, 230. Twentieth lower layer bonding surface, 231. Twenty-first lower layer bonding surface, 232. Twenty-second lower layer bonding surface, 233. Twenty-third lower layer bonding surface, 234. Twenty-fourth lower layer bonding surface, 235. Twenty-fifth lower layer bonding surface, 236. Twenty-sixth lower layer bonding surface, 237. Twenty-seventh lower layer bonding surface; 11. First ECG electrode pair; 12. Second ECG electrode pair; 13. Third ECG electrode pair; 14. Fourth ECG electrode pair; 15. Fifth ECG electrode pair; 16. Sixth ECG electrode pair; 17. Seventh ECG electrode pair; 18. Eighth bonding layer; 19. Ninth ECG electrode pair; 20. Tenth ECG electrode pair; 21. Eleventh ECG electrode pair; 22. Twelfth ECG electrode pair; 3. Thirteenth ECG electrode pair; 24. Fourteenth ECG electrode pair; 25. 15th ECG electrode pair, 26th, 16th, 27th, 17th, 28th, 18th, 29th, 19th, 30th, 20th, 31st, 21st, 32nd, 22nd, 33rd, 23rd, 34th, 24th, 35th, 25th, 36th, 26th, 37th; 60. First conductive region; 70. Second conductive region. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this application clearer, the application is described and illustrated below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application without inventive effort are within the scope of protection of this application.

[0018] Obviously, the accompanying drawings described below are merely some examples or embodiments of this application. Those skilled in the art can apply this application to other similar scenarios based on these drawings without any inventive effort. Furthermore, it is understood that although the efforts made in this development process may be complex and lengthy, for those skilled in the art related to the content disclosed in this application, any changes to design, manufacturing, or production based on the technical content disclosed in this application are merely conventional technical means and should not be construed as insufficient disclosure of the content of this application.

[0019] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0020] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms “a,” “an,” “an,” “the,” and similar words used in this application do not indicate quantity limitation and may indicate singular or plural. The terms “comprising,” “including,” “having,” and any variations thereof used in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units not listed, or may include other steps or units inherent to these processes, methods, products, or devices. The terms “connected,” “linked,” “coupled,” and similar words used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Multiple” used in this application refers to two or more. “And / or” describes the relationship between related objects, indicating that three relationships may exist; for example, “A and / or B” can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following objects are in an "or" relationship. The terms "first," "second," and "third" used in this application are merely to distinguish similar objects and do not represent a specific ordering of the objects.

[0021] The terminalless electrode testing method of this application is implemented using an electrode testing fixture. Figure 1 This is a schematic diagram of the structure of an electrode testing fixture according to an exemplary embodiment, such as... Figure 1 As shown, the electrode testing fixture includes: a plurality of first substrates 100 and a plurality of second substrates 200. The first substrate 100 includes at least two first contact portions 500 penetrating the upper and lower surfaces, and the different first contact portions 500 are electrically connected to each other, and the different first substrates 100 are electrically connected to each other through the first contact portions 500.

[0022] The second substrate 200 includes at least two first contact portions 600 penetrating the upper and lower surfaces, and the different first contact portions 600 are electrically connected to each other, and the different second substrates 200 are electrically connected to each other through the first contact portions 600.

[0023] When the first substrate 100 and the second substrate 200 are stacked, each first contact portion 500 has a corresponding first contact portion 600.

[0024] In the electrode testing fixture, the first contact portion 500 is covered with conductive material on both the upper and lower surfaces of the first substrate 100. The first contact portion 600 is covered with conductive material on both the upper and lower surfaces of the second substrate 200. The conductive material covering the upper surface is used to complete the electrical connection between different first contact portions 500, and the conductive material covering the lower surface is used to adhere to the ECG electrode pair 300, thereby completing the connection between the first contact portion 500, the ECG electrode pair 300, and the first contact portion 600. When the second substrate 200 is stacked with the first substrate 200, the contact portions of the lower surface 102 of the first substrate and the lower surface 202 of the second substrate are respectively adhered to the ECG electrode pair 300, thereby completing the connection between the first substrate 100 and the second substrate 200. Furthermore, when the first substrate 100 and the second substrate 200 are stacked, each first contact portion 500 has a corresponding first contact portion 600. Wherein, the intersection of the projected area of ​​the first contact portion 500 and the area of ​​the first contact portion 600 is greater than the first preset area. Preferably, the projection of the first contact portion 500 onto the first contact portion 600 completely coincides with the first contact portion 600.

[0025] Figure 2 This is a schematic diagram of the internal structure of the first contact portion according to an exemplary embodiment. Figure 3 This is a schematic diagram of the internal structure of the second contact portion according to an exemplary embodiment, such as... Figure 2 and Figure 3 As shown, the first contact portion 500 includes a first through hole 104 and a first mating surface 103, and the distance between the center of the first through hole 104 and the geometric center of the first mating surface 103 is greater than a preset distance.

[0026] In the upper and lower surfaces of the first substrate 100, the first bonding surface 103 is covered with conductive material, while the first through hole 104 is not covered with conductive material. Furthermore, the distance between the center of the first through hole 104 and the geometric center of the first bonding surface 103 is greater than a preset distance to prevent the ECG electrode pair 300 from covering the first through hole 104 when it is bonded to the first bonding surface 103, thus affecting subsequent detection. Preferably, when the distance between the first through hole 104 and the first bonding surface 103 is greater than the preset distance, the first through hole 104 is located on the left side of the first bonding surface 103. If the location of the first through hole 104 on the first bonding surface 103 affects the wiring layout between the first bonding surfaces 103, then the first through hole 104 is located on the right side of the first bonding surface 103.

[0027] The first contact portion 600 includes a second through hole 204 and a second mating surface 203. The distance between the center of the second through hole 204 and the geometric center of the second mating surface 203 is greater than a preset distance. The opening of the second through hole 204 in the upper surface of the second substrate 200 is covered with a conductive material, and the conductive material is electrically connected to the second mating surface 203.

[0028] Both the upper and lower surfaces of the second substrate 200 are covered with conductive material for the second bonding surface 203. However, the opening of the second through hole 204 on the lower surface of the second substrate 200 is not covered with conductive material. On the upper surface of the second substrate 200, the opening of the second through hole 204 is covered with conductive material, and this conductive material is electrically connected to the second bonding surface 203 on the upper surface of the second substrate 200. Furthermore, the distance between the center of the second through hole 204 and the geometric center of the first bonding surface 103 is greater than a preset distance to prevent the ECG electrode pair 300 from covering the second through hole 204 when it is bonded to the second bonding surface 203, thus affecting subsequent detection. Preferably, when the distance between the second through hole 204 and the second bonding surface 203 is greater than the preset distance, the second through hole 204 is located on the left side of the second bonding surface 203. If the second through hole 204 located on the second bonding surface 203 affects the wiring layout between the second bonding surfaces 203, then the second through hole 204 is located on the right side of the second bonding surface 203.

[0029] When the first substrate 100 and the second substrate 200 are stacked, the intersection of the projected area of ​​the first through hole 104 and the area of ​​the second through hole 204 is greater than a second preset area, and the intersection of the projected area of ​​the first through hole 104 and the area of ​​the second through hole 204 is greater than a third preset area.

[0030] It should be noted that the dimensions and areas of the first through hole 104 and the second through hole 204 are equal, as are the dimensions and areas of the first mating surface 103 and the second mating surface 203. The first preset area, the second preset area, and the third preset area are specifically determined based on the dimensions of the through holes and mating surfaces in the electrode testing fixture. Optionally, the first preset area, the second preset area, and the third preset area are 90% of the area of ​​the corresponding component.

[0031] Based on the above-mentioned electrode testing fixture, this application provides an electrode testing method without terminals.

[0032] In a first aspect, embodiments of this application provide an electrode testing method without terminals, wherein the electrode testing method is implemented using an electrode testing fixture. Figure 4 This is a flowchart illustrating a terminalless electrode testing method according to an exemplary embodiment, such as... Figure 4 As shown, the electrode testing method without terminals includes: Step S101: Place at least two ECG electrode pairs 300 between the first substrate 100 and the second substrate 200, with any one ECG electrode pair 300 abutting against the first contact portion 500 and the second contact portion 600 respectively.

[0033] An electrocardiogram (ECG) electrode pair 300 is placed between a first substrate 100 and a second substrate 200. The ECG electrode pair 300 is respectively attached to a first contact portion 500 on the lower surface 102 of the first substrate and a first contact portion 600 on the lower surface of the second substrate 200 to complete the connection between the first substrate 100 and the second substrate 200. The first contact portion 500 includes a first contact surface 103 and a first through hole 104, and the first contact portion 600 includes a second contact surface 203 and a second through hole 204. The ECG electrode pair 300 is attached to the first contact surface 103 on the lower surface 102 of the first substrate and to the second contact surface 203 on the lower surface of the second substrate 200. The first contact surface 103 and the second contact surface 203 are covered with a conductive material, enabling the ECG electrode pair 300 to conduct electricity.

[0034] When several first substrates 100 are connected through first contact portions 500 and several second substrates 200 are connected through first contact portions 600, and when all first contact portions 500 and corresponding first contact portions 600 are in contact with ECG electrode pairs 300, then multiple ECG electrode pairs 300 are connected in series in the electrode testing fixture, enabling simultaneous detection of multiple ECG electrode pairs 300.

[0035] Step S102: Connect the first contact portion 600 to the positive terminal of the power supply and connect the first contact portion 500 to the negative terminal of the power supply, so that the ECG electrode pair 300 between the first substrate 100 and the second substrate 200 is energized.

[0036] All first substrates 100 are arranged from left to right. In the last first substrate 100, a target first bonding surface is determined based on the wiring layout between the first bonding surfaces 103. All second substrates 200 are arranged from left to right. In the first second substrate 200, a target second bonding surface is determined based on the wiring layout between the second bonding surfaces 203. The positive terminal of the power supply is connected to the target second bonding surface, and the negative terminal of the power supply is connected to the target first bonding surface, so that the ECG electrode pair 300 between the first substrate 100 and the second substrate 200 is energized.

[0037] When power is applied through the target second bonding surface and the target first bonding surface, the current in the electrode testing fixture starts from the target second bonding surface and flows through the ECG electrode pair 300, the first bonding surface 103, and the second bonding surface 203, according to the wiring between the ECG electrode pair 300 and the first bonding surface 103, and the wiring between the second bonding surfaces 203, until it reaches the target first bonding surface. After power is applied, the current flow direction between the first bonding surface 103, the second bonding surface 203, and the ECG electrode pair 300 is determined according to the wiring layout between the first bonding surfaces 103, the wiring layout of the second bonding surface 203, and the ECG electrode pair 300.

[0038] If there are traces between the first bonding surfaces 103, the current flows through the traces between the first bonding surfaces 103. The first bonding surfaces 103 and the second bonding surfaces 203 are connected by ECG electrode pairs 300. When there is current in the bonding surfaces, the current reaches the bonding surface on the other substrate through the ECG electrode pairs 300, completing the conduction of the ECG electrode pairs 300. The current flows through all the ECG electrode pairs 300 in sequence through the trace layout, thus applying the same current to all the ECG electrode pairs 300. In one embodiment, a positive bias current of 200nA is applied to the target second bonding surface, and a negative bias current of 200nA is applied to the target first bonding surface. The current starts from the target second bonding surface and, according to the wiring layout in the first bonding surface 103 of the first substrate 100 and the wiring layout in the second bonding surface 203 of the second substrate 200, simultaneously applies a bias current of 200nA to all ECG electrode pairs 300, satisfying the medical standard YY / T 0196-200 and the international standard ANSI / AAMI EC12:2000 (R2005).

[0039] When the same bias current is applied to all ECG electrode pairs 300 simultaneously, all ECG electrode pairs 300 can be detected, eliminating the need to detect each ECG electrode pair 300 individually. This reduces the detection time for each ECG electrode pair 300 and improves detection efficiency.

[0040] Step S103: Detect the voltage between the first contact portion 500 and the first contact portion 600 of each ECG electrode pair 300 according to a preset time interval, obtain voltage change data, and determine the performance of the ECG electrode pair 300 based on the voltage change data.

[0041] When no current is applied, the voltage between the second through-hole 204 and the first contact surface 103 is detected to obtain an initial voltage. Within a preset time period after current is applied, the voltage between the second through-hole 204 and the first contact surface 103 is detected at a first preset time interval to obtain several first voltages. Each first voltage is subtracted from the initial voltage to obtain the difference between the initial voltage and each first voltage; each difference constitutes first voltage change data. After a preset time period, the voltage between the second through-hole 204 and the first contact surface 103 is detected at a second preset time interval to obtain several second voltages. Each second voltage is subtracted from the initial voltage to obtain the difference between the initial voltage and each second voltage; each difference constitutes second voltage change data. The second preset time interval is longer than the first preset time interval to ensure the accuracy of the ECG electrode pair performance test.

[0042] Based on the obtained voltage change data, if both the first and second voltage change data are less than or equal to a preset voltage threshold, then the performance of the ECG electrode pair 300 is qualified. If either the first or second voltage change data is greater than the preset voltage threshold, then the performance of the ECG electrode pair 300 is unqualified.

[0043] In one embodiment, when no current is applied, the voltage between the second through hole 204 and the first contact surface 103, i.e., the voltage of each ECG electrode pair 300, is detected to obtain the initial voltage. After current is applied, for eight hours, the voltage of each ECG electrode pair 300 is detected at one-hour intervals to obtain first voltage change data. The first voltage change data is the voltage change data of the ECG electrode pair 300 relative to the initial voltage for each one-hour interval within the eight hours, i.e., the difference between the first voltage detected every one hour and the initial voltage. After eight hours, the voltage of the ECG electrode pair 300 is detected every day until a preset detection time is met, and the voltage of the ECG electrode pair 300 is obtained at the end, thus obtaining second voltage change data. The second voltage change data is the voltage change data of the second voltage of the ECG electrode pair 300 detected each day relative to the initial voltage, i.e., the difference between the second voltage detected every other day and the initial voltage. If the voltage changes of all ECG electrode pairs 300 within the detection time do not exceed 100mV, it indicates that the performance of the ECG electrode pair 300 is qualified. If the voltage change exceeds 100mV, it indicates that the ECG electrode pair 300 is not up to standard.

[0044] Referring to step S102, after connecting the power supply to the electrode testing fixture, the current flow direction between the first bonding surface 103, the second bonding surface 203, and the ECG electrode pair 300 can be determined based on the wiring layout between the first bonding surface 103, the wiring layout of the second bonding surface 203, and the ECG electrode pair 300. Based on the current flow direction in the electrode testing fixture, the inflow and outflow ends of each ECG electrode pair 300 are determined. The inflow and outflow ends of the current can determine the positive and negative relationship when performing voltage detection on the ECG electrode pair 300. For any ECG electrode pair 300 to be tested, if either the outflow end or the inflow end is located on the second substrate 200, the first voltage detection end is passed through the first through hole 104 to the conductive material of the second through hole 204. The conductive material of the second through hole 204 is electrically connected to the second bonding surface 203 on the upper surface of the second substrate 200. When current flows through the second bonding surface 203, the current also flows through the conductive material covering the opening of the second through hole 204. Furthermore, the voltage on the second bonding surface 203 is consistent with the voltage on the conductive material. By contacting the second voltage detection terminal with the first bonding surface 103, the voltage of the ECG electrode pair 300 defined by the first bonding surface 103 and the corresponding second bonding surface 203 can be detected through the first voltage test terminal and the second voltage test terminal.

[0045] The voltage test end is electrically connected to the second mating surface 203 by passing through the first through hole 104 and the second through hole 204. This allows for stable detection of the voltage of the ECG electrode pair 300 from a single observation surface, avoiding the cumbersome steps of fixing the ECG electrode pair 300 and testing from both sides. This simplifies the testing process and improves testing efficiency.

[0046] Figure 5 This is a schematic planar view illustrating the current flow direction on the upper surfaces of the first and second substrates according to an exemplary embodiment, as shown below. Figure 5As shown, the first conductive region 60 is connected to the positive terminal of the power supply, so that the current flows in from the target second bonding surface 211, and flows through the ECG electrode pair 300 to the first upper bonding surface 111 of the upper surface 101 of the first substrate, flows through the wiring layout to the second upper bonding surface 112, then flows through the ECG electrode pair 300 to the second lower bonding surface 212 of the upper surface 201 of the second substrate, flows through the wiring layout of the upper surface 201 of the second substrate to the third lower bonding surface 213, and then flows through the ECG electrode pair 300 to the third upper bonding surface 113 of the upper surface of the first substrate 100. Based on the current flow direction described above, it can be determined that the first upper layer through hole 51 and the first lower layer through hole 54 are the positive terminals for voltage testing, and the first upper layer bonding surface 11 is the negative terminal for voltage testing; the second upper layer through hole 52 and the second lower layer through hole 55 are the negative terminals for voltage testing, and the second upper layer bonding surface 112 is the positive terminal for voltage testing; the third upper layer through hole 53 and the third lower layer through hole 56 are the positive terminals for voltage testing, and the third upper layer bonding surface 113 is the negative terminal for voltage testing.

[0047] It should be noted that after connecting the first contact portion 600 to the positive terminal of the power supply and the first contact portion 500 to the negative terminal of the power supply, the total voltage of the entire electrode measuring fixture is detected. If the total voltage data is constantly changing, the first contact surface 103 and the second contact surface 203 of each ECG electrode pair 300 are checked to ensure that the ECG electrode pair 300 is in close contact with each contact surface, thus ensuring the stability and accuracy of the detection.

[0048] In one embodiment, in the electrode test fixture, all wiring layouts and contacts are connected by silver paste spraying to provide lower contact resistance and line resistance, thereby making the test results more accurate.

[0049] Figure 6 This is a schematic diagram illustrating the current flow in an electrode testing fixture for 27 ECG electrode pairs according to an exemplary embodiment, as shown below. Figure 6As shown, a positive power supply is connected to the first conductive region 60, and a negative power supply is connected to the second conductive region 70. This allows the entire electrode testing fixture to connect the target second bonding surface 221 to the positive power supply via the wiring layout on the upper surface 201 of the second substrate. Current then flows through the target second bonding surface 211 on the upper surface 201 of the second substrate to the corresponding second lower bonding surface on the lower surface 202 of the second substrate, and then flows through the first ECG electrode pair 11 bonded to the lower surface. The current then flows sequentially through the first bonding surface on the lower surface 102 of the first substrate and the first upper bonding surface 111 on the upper surface 101 of the first substrate. On the upper surface 101 of the first substrate, the current is transmitted to the second upper bonding surface 112 along the wiring layout, and then through the second upper bonding surface 112, the current is transmitted through the second ECG electrode pair 12 to the corresponding second lower bonding surface 212 on the upper surface 201 of the second substrate. The second lower bonding surface 212 transmits current to the third lower bonding surface 213 according to the wiring layout in the upper surface 201 of the second substrate. The third lower bonding surface 213 transmits current to the corresponding second bonding surface in the lower surface 202 of the second substrate, and transmits current to the third upper bonding surface 113 in the upper surface 101 of the first substrate through the third ECG electrode pair 12. The third upper bonding surface 113 transmits current to the adjacent second first substrate 100 through the wiring layout. In the second first substrate 100, the fourth upper bonding surface 114 of the upper surface 101 of the first substrate receives the current transmitted by the third upper bonding surface 113, and transmits the current to the fourth lower bonding surface 214 of the upper surface 201 of the second second substrate 200 through the fourth ECG electrode pair 14. The fourth lower bonding surface 214 transmits current to the fifth lower bonding surface 215 according to the wiring layout in the upper surface 201 of the second substrate. The fifth lower bonding surface 215 transmits current through the fifth ECG electrode pair 15 to the fifth upper bonding surface 115 of the upper surface 101 of the first substrate. The fifth upper bonding surface 115, according to the wiring layout of the upper surface 101 of the first substrate, transmits current to the sixth upper bonding surface 116. The sixth upper bonding surface 116, through the sixth ECG electrode pair 16, transmits current to the sixth lower bonding surface 216 in the upper surface 201 of the second substrate. The sixth lower bonding surface 216, according to the wiring layout of the upper surface 201 of the second substrate, transmits current to the adjacent third second substrate 200.

[0050] In the upper surface 201 of the third second substrate 200, the seventh lower bonding surface 217 receives the current transmitted from the sixth lower bonding surface 217, and transmits the current sequentially through the seventh ECG electrode pair 17 to the first bonding surface of the lower surface 102 of the first substrate and the seventh upper bonding surface 117 of the upper surface 101 of the first substrate. In the upper surface 101 of the first substrate, the current is transmitted to the eighth upper bonding surface 118 along the wiring layout of the upper surface 101 of the first substrate, and then transmitted through the eighth upper bonding surface 118 to the eighth lower bonding surface 218 in the corresponding upper surface 201 of the second substrate via the eighth ECG electrode pair 18. The eighth lower bonding surface 218 transmits the current to the ninth lower bonding surface 219 according to the wiring layout in the upper surface 201 of the second substrate. The ninth lower bonding surface 219 transmits current to the corresponding second bonding surface on the lower surface 202 of the second substrate, and transmits current to the ninth upper bonding surface 119 on the upper surface 101 of the first substrate via the ninth ECG electrode pair 19. The ninth upper bonding surface 119 transmits current to the adjacent fourth first substrate 100 through a wiring layout. In the fourth first substrate 100, the tenth upper bonding surface 120 on the upper surface 101 of the first substrate receives the current transmitted from the ninth upper bonding surface and transmits the current through the tenth ECG electrode pair 20 to the tenth lower bonding surface 220 on the upper surface 201 of the second substrate in the fourth second substrate 200. The tenth lower bonding surface 220 transmits current to the eleventh lower bonding surface 221 according to the wiring layout on the upper surface 201 of the second substrate. The eleventh lower bonding surface 221 transmits current through the eleventh ECG electrode pair 20 to the eleventh upper bonding surface 121 on the upper surface 101 of the first substrate. The eleventh upper bonding surface 121 transmits current to the twelfth upper bonding surface 122 according to the wiring layout of the upper surface 101 of the first substrate. The twelfth upper bonding surface 122 transmits current to the twelfth lower bonding surface 222 in the upper surface 201 of the second substrate through the twelfth ECG electrode pair 22.

[0051] In the upper surface 201 of the fifth second substrate 200, the thirteenth lower bonding surface 223 receives the current transmitted from the sixth lower bonding surface 223, and the current flows sequentially through the first bonding surface of the lower surface 102 of the first substrate and the thirteenth upper bonding surface 123 of the upper surface 101 of the first substrate via the thirteenth ECG electrode pair 23. In the upper surface 101 of the first substrate, the current is transmitted to the fourteenth upper bonding surface 124 along the wiring layout of the upper surface 101 of the first substrate, and the current is transmitted through the fourteenth upper bonding surface 124 to the fourteenth lower bonding surface 224 in the corresponding upper surface 201 of the second substrate via the fourteenth ECG electrode pair 24. The fourteenth lower bonding surface 224 transmits the current to the fifteenth lower bonding surface 225 according to the wiring layout in the upper surface 201 of the second substrate. The fifteenth lower bonding surface 225 transmits current to the corresponding second bonding surface on the lower surface 202 of the second substrate, and transmits current to the fifteenth upper bonding surface 125 on the upper surface 101 of the first substrate through the fifteenth ECG electrode pair 25. The fifteenth upper bonding surface 125 transmits current to the adjacent sixth first substrate 100 through a wiring layout. In the sixth first substrate 100, the sixteenth upper bonding surface 126 on the upper surface 101 of the first substrate receives the current transmitted from the fifteenth upper bonding surface, and transmits the current through the tenth ECG electrode pair 26 to the sixteenth lower bonding surface 226 on the upper surface 201 of the sixth second substrate 200. The sixteenth lower bonding surface 226 transmits current to the seventeenth lower bonding surface 227 according to the wiring layout on the upper surface 201 of the second substrate. The seventeenth lower bonding surface 227 transmits current through the seventeenth ECG electrode pair 27 to the seventeenth upper bonding surface 127 of the upper surface 101 of the first substrate. The seventeenth upper bonding surface 127 transmits current to the eighteenth upper bonding surface 128 according to the wiring layout of the upper surface 101 of the first substrate. The eighteenth upper bonding surface 128 transmits current to the eighteenth lower bonding surface 228 in the upper surface 201 of the second substrate through the eighteenth ECG electrode pair.

[0052] In the upper surface 201 of the seventh second substrate 200, the nineteenth lower bonding surface 229 receives the current transmitted from the sixth lower bonding surface 229, and transmits the current sequentially through the nineteenth ECG electrode pair 29 to the first bonding surface of the lower surface 102 of the first substrate and the nineteenth upper bonding surface 129 of the upper surface 101 of the first substrate. In the upper surface 101 of the first substrate, the current is transmitted to the twentieth upper bonding surface 130 along the wiring layout of the upper surface 101 of the first substrate, and then transmitted through the twentieth upper bonding surface 130 to the twentieth lower bonding surface 230 in the corresponding upper surface 201 of the second substrate via the twentieth ECG electrode pair 30. The twentieth lower bonding surface 230 transmits the current to the twenty-first lower bonding surface 231 according to the wiring layout in the upper surface 201 of the second substrate. The 21st lower bonding surface 231 transmits current to the corresponding second bonding surface on the lower surface 202 of the second substrate, and transmits current to the 21st upper bonding surface 131 on the upper surface 101 of the first substrate via the 21st ECG electrode pair 31. The 21st upper bonding surface 131 transmits current to the adjacent eighth first substrate 100 through a wiring layout. In the eighth first substrate 100, the 22nd upper bonding surface 132 of the upper surface 101 of the first substrate receives the current transmitted from the 21st upper bonding surface, and transmits the current through the 10th ECG electrode pair 32 to the 22nd lower bonding surface 232 on the upper surface 201 of the second substrate 200. The 22nd lower bonding surface 232 transmits current to the 23rd lower bonding surface 232 according to the wiring layout on the upper surface 201 of the second substrate. The 23rd lower bonding surface 232 transmits current through the 23rd ECG electrode pair 32 to the 23rd upper bonding surface 132 of the upper surface 101 of the first substrate. The 23rd upper bonding surface 132 transmits current to the 24th upper bonding surface 134 according to the wiring layout of the upper surface 101 of the first substrate. The 24th upper bonding surface 134 transmits current to the 24th lower bonding surface 234 in the upper surface 201 of the second substrate through the 24th ECG electrode pair 34.

[0053] In the upper surface 201 of the ninth second substrate 200, the twenty-fifth lower bonding surface 235 receives the current transmitted from the sixth lower bonding surface 235, and through the twenty-fifth ECG electrode pair 35, the current flows sequentially through the first bonding surface of the lower surface 102 of the first substrate and the twenty-fifth upper bonding surface 135 of the upper surface 101 of the first substrate. In the upper surface 101 of the first substrate, along the wiring layout of the upper surface 101 of the first substrate, the current is transmitted to the twenty-sixth upper bonding surface 136, and through the twenty-sixth upper bonding surface 136, the current is transmitted through the twenty-sixth ECG electrode pair 36 to the twenty-sixth lower bonding surface 236 in the corresponding upper surface 201 of the second substrate. The twenty-sixth lower bonding surface 236 transmits the current to the twenty-seventh lower bonding surface 237 according to the wiring layout in the upper surface 201 of the second substrate. The 27th lower bonding surface 237 transmits current to the corresponding second bonding surface in the lower surface 202 of the second substrate, and transmits current to the target first bonding surface 131 in the upper surface 101 of the first substrate through the 27th ECG electrode pair 37. The target first bonding surface allows the current to flow back to the second conductive region 70, i.e. the negative terminal of the power supply, through the wiring layout of the upper surface 101 of the first substrate, so that the electrode test fixture and the 27 ECG electrode pairs form a closed current loop. The first conductive region 60 and the second conductive region 70 are used to stably connect to the two power supply levels.

[0054] Testing using an electrode testing fixture in the laboratory yielded the following results, as shown in Table 1. By simultaneously testing multiple pairs of ECG electrodes, the time required to test one pair can replace the time spent testing multiple pairs, thus improving testing efficiency. The wiring in the electrode fixture is covered with silver paste, and the ECG electrode pairs do not need to be moved during testing, significantly reducing contact resistance and improving stability by 80%. When testing the voltage of the ECG electrode pairs, the voltage deviation from 120mV to 150mV was reduced to 30-80mV, decreasing the voltage deviation and meeting the EC12 standard. In terms of testing equipment, the original parallel testing using multiple units was replaced with a single unit capable of testing multiple pairs of ECG electrodes, resulting in a 75% cost reduction.

[0055] Table 1 Results of the Traditional Approach and the Approach in this Application

[0056] In summary, this application utilizes an electrode testing fixture capable of accommodating multiple ECG electrode pairs and simultaneously allowing the same current to flow into these pairs for convenient testing. Based on the current flow direction, the voltage of each ECG electrode pair is rapidly detected through the first and second through holes and the first contact surface, completing the testing of multiple ECG electrode pairs and thus improving the efficiency of ECG electrode pair performance testing. Furthermore, because the current is applied simultaneously, only a single device is required, reducing testing costs.

[0057] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A terminalless electrode testing method, characterized in that, The electrode testing method is implemented using an electrode testing fixture, which includes several first substrates and several second substrates. The first substrate includes at least two first contact portions penetrating the upper and lower surfaces, and different first contact portions are electrically connected to each other, and different first substrates are electrically connected to each other through the first contact portions; The second substrate includes at least two second contact portions penetrating the upper and lower surfaces, and different second contact portions are electrically connected to each other, and different second substrates are electrically connected to each other through the second contact portions; When the first substrate and the second substrate are stacked, each of the first contact portions has a corresponding second contact portion. The electrode testing method includes: At least two ECG electrode pairs are placed between the first substrate and the second substrate, and each ECG electrode pair is respectively attached to the first contact portion and the second contact portion; The second contact portion is connected to the positive terminal of the power supply, and the first contact portion is connected to the negative terminal of the power supply, so that the ECG electrode pair between the first substrate and the second substrate is energized. At preset time intervals, the voltage between the first contact portion and the second contact portion of each ECG electrode pair is detected to obtain voltage change data, and the performance of the ECG electrode pair is determined based on the voltage change data.

2. The electrode testing method without terminals according to claim 1, characterized in that, The first contact portion includes a first through hole and a first mating surface, and the distance between the center of the first through hole and the geometric center of the first mating surface is greater than a preset distance; The second contact portion includes a second through hole and a second mating surface. The distance between the center of the second through hole and the geometric center of the second mating surface is greater than the preset distance. The opening of the second through hole on the upper surface of the second substrate is covered with a conductive material, and the conductive material is electrically connected to the second mating surface. The step of detecting the voltage between the first and second contact portions of each ECG electrode pair at preset time intervals to obtain voltage change data includes: When no current is applied, the voltage between the second through hole and the first mating surface is detected to obtain the initial voltage; Within a preset time period after the current is applied, the voltage between the second through hole and the first mating surface is detected according to a first preset time interval to obtain a number of first voltages. Based on the difference between the initial voltage and each of the first voltages, first voltage change data is obtained. After the preset duration, the voltage between the second through hole and the first mating surface is detected according to the second preset time interval to obtain a number of second voltages. Based on the difference between the initial voltage and each of the second voltages, second voltage change data is obtained.

3. The electrode testing method without terminals according to claim 2, characterized in that, Determining the performance of the ECG electrode pair based on the voltage change data includes: If both the first voltage change data and the second voltage change data are less than or equal to a preset voltage threshold, then the performance of the ECG electrode pair is qualified. If either the first voltage change data or the second voltage change data exceeds the preset voltage threshold, then the performance of the ECG electrode pair is unqualified.

4. The electrode testing method without terminals according to claim 2, characterized in that, The step of connecting the second contact portion to the positive terminal of the power supply and the first contact portion to the negative terminal of the power supply, so that the ECG electrode pair between the first substrate and the second substrate is energized, includes: All the first substrates are arranged in order from left to right. In the last first substrate, the target first bonding surface is determined according to the wiring layout between the first bonding surfaces. All the second substrates are arranged in order from left to right. In the first second substrate, the target second bonding surface is determined according to the wiring layout between the second bonding surfaces. The positive terminal of the power supply is connected to the second bonding surface of the target, and the negative terminal of the power supply is connected to the first bonding surface of the target, so that the ECG electrode pair between the first substrate and the second substrate is energized.

5. The electrode testing method without terminals according to claim 4, characterized in that, After connecting the positive terminal of the power supply to the second mating surface of the target and the negative terminal of the power supply to the first mating surface of the target, the method further includes: After power is connected, the current flow direction between the first bonding surface, the second bonding surface, and the ECG electrode pair is determined based on the wiring layout between the first bonding surfaces, the wiring layout of the second bonding surface, and the ECG electrode pair.

6. The electrode testing method without terminals according to claim 5, characterized in that, The detection of the voltage between the second through hole and the first mating surface includes: Based on the direction of current flow, determine the inflow and outflow ends of each ECG electrode pair; For any ECG electrode pair to be detected, if either the outflow end or the inflow end is located on the second substrate, the first voltage detection end is passed through the first through hole to the conductive material of the second through hole; The second voltage detection terminal is brought into contact with the first bonding surface, and the voltage between the second through hole and the first bonding surface is detected based on the first voltage detection terminal and the second voltage detection terminal.

7. The electrode testing method without terminals according to claim 2, characterized in that, After connecting the second contact portion to the positive terminal of the power supply and the first contact portion to the negative terminal of the power supply, the method further includes: Based on the first contact portion and the second contact portion, the total voltage of all said ECG electrode pairs is obtained; If the total voltage changes continuously, the first and second contact surfaces of each ECG electrode pair are inspected.

8. The electrode testing method without terminals according to claim 2, characterized in that, The method further includes: The second preset time interval is greater than the first preset time interval.

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