Glue pouring coaxial testing device and manufacturing process thereof
By using a potting coaxial testing device with an insulating adhesive layer and a spring limiting structure in the chip testing equipment, the problems of signal reflection and crosstalk in high-frequency testing were solved, and stable transmission of high-frequency signals and stable connection of probes were achieved.
Patent Information
- Application Number
- CN202511189620.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-25
- Publication Date
- 2025-11-28
AI Technical Summary
Existing chip testing equipment introduces discontinuous impedance points in high-frequency testing due to the direct connection between the probes and the base, leading to signal reflection and ground bounce problems. Furthermore, the lack of effective shielding design for densely packed probes easily causes signal crosstalk.
A coaxial testing device with potting compound is used. An insulating adhesive layer is placed between the side of the test probe and the inner wall of the receiving hole to avoid direct contact between the probe and the metal base. A spring and limiting structure are set inside the probe to achieve insulation and stable connection.
It achieves stable transmission of high-frequency signals, enhances waterproof, dustproof, and corrosion-resistant effects, and strengthens the connection between the probe and the base, reducing signal reflection and crosstalk.
Smart Images

Figure CN121027786A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of chip testing device, in particular to a glue-filling coaxial testing device and a manufacturing process thereof. BACKGROUND
[0002] In the field of chip testing, the chip testing device usually has the testing probe directly installed (usually welded or pressed) on the inner side of the bottom of the base (also called "probe plate" or "base plate") made of metal. For high-frequency testing (such as RF chip, high-speed digital chip), the impedance control of the signal path is crucial. The direct welding of the probe and the base will introduce a discontinuous impedance point, causing serious signal reflection and deteriorating signal quality. In addition, the metal base usually serves as a ground layer. The direct connection of the probe to the ground layer can easily cause problems such as ground bounce when processing high-speed signals. At the same time, there is a lack of effective shielding design between the dense probes, which can easily cause signal crosstalk. SUMMARY
[0003] In order to solve the above problems, the present application provides a glue-filling coaxial testing device, which comprises a base, a containing groove recessed inwardly is arranged on the top of the base, a limiting groove is arranged on the bottom of the containing groove, the containing groove is used to prevent displacement of the chip in the containing groove, a plurality of containing holes are arranged on the bottom of the limiting groove according to a predetermined interval, the containing holes penetrate the bottom of the limiting groove, a testing probe is arranged in the containing hole, and an insulating glue layer is arranged between the side of the testing probe and the inner wall of the containing hole.
[0004] Further, the testing probe comprises a tube body, a first needle body is arranged at one end of the tube body, the first needle body is fixedly connected with the tube body, the first needle body is used to contact the tested chip, a second needle body is arranged at the other end of the tube body away from the first needle body, the tube body partially wraps the first needle body and the second needle body respectively, the second needle body can move along the inner wall of the tube body inside the tube body, a spring is arranged between the first needle body and the second needle body, and the insulating glue layer is arranged between the tube body and the first needle body and the inner wall of the containing hole.
[0005] Further, one end of the second needle body close to the first needle body extends a limiting piece along the tube body, one end of the spring is sleeved on the limiting piece, the limiting piece comprises a side wall protruding along the second needle body towards the first needle body, and a taper part connected with the side wall, one end of the spring is sleeved on the side wall, and the taper part penetrates into the spring.
[0006] Further, a second limiting ring is outwardly protruded on the outer wall of the second needle body, and a bending part is formed on the inner side of the tube body near the end of the tube body.
[0007] Further, the first needle body comprises a contact part and a wrapping part, the contact part is located outside the tube body, the wrapping part is wrapped by the tube body, a first limiting ring is outwardly protruded on the outer wall between the contact part and the wrapping part, and the first limiting ring is abutted on the tube wall of the tube body when the first needle body is connected with the tube body.
[0008] Further, a ring-shaped limiting part is arranged on the outer wall of the wrapping part, and a plurality of protruding parts capable of cooperating with the limiting part are protruded on the inner wall of the tube body, and the protruding parts are embedded in the limiting part when the wrapping part is wrapped by the tube body.
[0009] Further, the number of the protruding parts is four and the protruding parts are arranged at intervals of 90 degrees.
[0010] Further, a plurality of tapered parts are arranged on the contact part.
[0011] The application also provides a manufacturing process of the glue-filling coaxial test device, comprising the following steps: step one, a containing groove is formed by first stamping from the top of the base, a limiting groove is formed by second stamping on the bottom of the containing groove, and a plurality of containing holes are formed by drilling on the bottom of the limiting groove according to a preset interval; step two, liquid insulating glue material is filled into the containing holes, and the insulating glue material is cooled to form a solid state after filling the containing holes; and step three, the solid insulating glue material is drilled along the direction of the containing hole, and the test probe is placed into the hole, so that an insulating glue layer is formed between the side part of the test probe and the inner wall of the containing hole.
[0012] Compared with the prior art, the application has the following beneficial effects: The insulating glue layer is arranged between the side wall of the test probe and the inner wall of the containing hole, so that the probe does not directly contact the base made of metal material, insulation is effectively achieved, the characteristics of metal shielding signal are added, high-frequency signal transmission effect can be achieved in the test process, better waterproof, dustproof and corrosion-resistant effects can be achieved, and the connection between the test probe and the base is reinforced.
[0013] Additional aspects and advantages of the application will be given in the following description part, some of which will become apparent from the following description, or will be understood by those skilled in the art through the practice of the application. BRIEF DESCRIPTION OF DRAWINGS
[0014] In order to make the technical solutions in the embodiments of the present application or the prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description only need to explain some embodiments of the present application, and all other embodiments obtained by those of ordinary skill in the art without any creative work based on these drawings also belong to the protection scope of the present application.
[0015] Figure 1 It is a schematic diagram of the overall structure of the present application. Figure 2 It is a partial enlarged view of part A of the schematic diagram of the overall structure of the present application. Figure 3 It is a sectional view of the overall structure of the present application. Figure 4 It is an exploded view of the structure of the test probe of the present application. Figure 5 It is a schematic diagram of the structure of the tube body and the second needle body of the present application. Figure 6 It is a schematic diagram of the structure of the tube body and the first needle body of the present application. Figure 7 It is a sectional view of the structure of the test probe of the present application.
[0016] The reference signs and names in the drawings are as follows: Base 10, accommodating groove 11, limiting groove 12, accommodating hole 13, test probe 20, insulating adhesive layer 30, tube body 100, first needle body 200, second needle body 300, spring 400, limiting member 310, side wall 311, tapered portion 312, second limiting ring 320, curved portion 110, contact portion 210, wrapping portion 220, first limiting ring 230, limiting portion 221, protruding portion 120, tapered portion 211. DETAILED DESCRIPTION
[0017] The technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without any creative work belong to the protection scope of the present application.
[0018] The present application will be described in more detail. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element or one or more intermediate elements can be present therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element or one or more intermediate elements can be present therebetween.
[0019] In the description of the present application, it should be noted that the orientation words such as "front, back, up, down, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicated orientation or positional relationship are generally based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, without the opposite description, these orientation words do not indicate and imply that the device or element referred to must have a particular orientation or be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer of the contour of each component. In the description of the present application, it should be noted that the use of "first", "second" and the like to limit the parts is only for the convenience of distinguishing the corresponding parts, and the above words have no special meaning unless otherwise stated, therefore cannot be understood as a limitation on the scope of protection of the present application. In the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.
[0020] Unless otherwise defined, all technical and scientific terms used in the specification are the same as those commonly understood by those skilled in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing the specific embodiments and are not used to limit the present application.
[0021] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as there is no conflict.
[0022] The preferred embodiments of the present application will be further described with reference to the accompanying drawings. The preferred embodiments of the present application will be further described with reference to the accompanying drawings. Figures 1 to 3 As shown in the drawings, the glue-filled coaxial test device comprises a base 10, an accommodating groove 11 recessed inward is arranged on the top of the base 10, a limiting groove 12 is arranged on the bottom of the accommodating groove 11, the accommodating groove 11 is used to prevent displacement of the chip in the accommodating groove 11, a plurality of accommodating holes 13 are arranged on the bottom of the limiting groove 12 according to a predetermined interval, the accommodating holes 13 penetrate through the bottom of the limiting groove 12, a test probe 20 is arranged in the accommodating hole 13, and an insulating glue layer 30 is arranged between the side of the test probe 20 and the inner wall of the accommodating hole 13.
[0023] In the working state of the present embodiment, the test probe 20 is first installed into the accommodating hole 13, then the insulating glue layer 30 is arranged between the side of the test probe 20 and the inner wall of the accommodating hole 13, then the chip to be tested is placed into the limiting groove 12, so that the chip to be tested and the test probe 20 are in contact with each other, when testing is needed, the pressing block of the test equipment is pressed into the accommodating groove 11, so that it covers the chip to be tested from the top, thereby ensuring the contact between the chip to be tested and the test probe 20.
[0024] Compared with the prior art, the application sets the insulating adhesive layer 30 between the side of the test probe 20 and the inner wall of the accommodating hole 13, so that the probe does not directly contact the base 10 made of metal, insulation is effectively achieved, the characteristic of metal shielding signal is added, transmission of high-frequency signals can be achieved in the test process, and better waterproof, dustproof and corrosion-resistant effects can be achieved, and the connection between the test probe 20 and the base 10 is reinforced.
[0025] Further to the above embodiment, as shown in Figure 3 , Figure 4 and Figure 7 , the test probe 20 comprises a pipe body 100, one end of the pipe body 100 is provided with a first needle body 200, the first needle body 200 is fixedly connected with the pipe body 100, the first needle body 200 is used to contact the tested chip, the other end of the pipe body 100 away from the first needle body 200 is provided with a second needle body 300, the pipe body 100 partially wraps the first needle body 200 and the second needle body 300 respectively, and the second needle body 300 can move along the inner wall of the pipe body 100 inside the pipe body 100, a spring 400 is arranged between the first needle body 200 and the second needle body 300, the insulating adhesive layer 30 is arranged between the pipe body 100 and the first needle body 200 and the inner wall of the accommodating hole 13, when testing, the first needle body 200 contacts the tested product, the second needle body 300 is connected to the circuit board, when the first needle body 200 contacts the tested product, the first needle body 200 and the pipe body 100 move downward as a whole because the first needle body 200 is fixedly connected with the pipe body 100, one end of the spring 400 inside the pipe body 100 is compressed, so as to drive the other end to provide pressure to the second needle body 300, in this process, because the insulating adhesive layer 30 is arranged between the pipe body 100 and the first needle body 200 and the inner wall of the accommodating hole 13, and the second needle body 300 is in a suspended state, the probe does not directly contact the inner wall of the accommodating hole 13 made of metal, and insulation is effectively achieved.
[0026] Further to the above embodiment, as shown in Figure 5 and Figure 7As shown, the second needle body 300 extends along the tube body 100 with a limiting member 310 at one end close to the first needle body 200, and one end of the spring 400 is sleeved on the limiting member 310. The limiting member 310 comprises a side wall 311 protruding towards the first needle body 200 along the second needle body 300, and a taper part 312 connecting the side wall 311. One end of the spring 400 is sleeved on the side wall 311, and the taper part 312 is inside the spring 400. When the spring 400 is compressed and deviated, the side wall 311 limits the deviation of the spring 400 due to the spring 400 being sleeved on the side wall 311, thereby ensuring the stability of the spring 400 contacting the second pillow.
[0027] Further to the above embodiment, as shown in Figure 5 and Figure 7 A second limiting ring 320 is protruded outwardly on the outer wall of the second needle body 300. A bending part 110 is formed on the inner side of the tube body 100 close to the second needle body 300. When the spring 400 is compressed, the bending part 110 can block one side of the second limiting ring 320, thereby preventing the second needle body 300 from being pulled out of the tube body 100.
[0028] Further to the above embodiment, as shown in Figure 6 and Figure 7 The first needle body 200 comprises a contact part 210 and a wrapping part 220. The contact part 210 is outside the tube body 100, and the wrapping part 220 is wrapped by the tube body 100. A first limiting ring 230 is protruded outwardly on the outer wall between the contact part 210 and the wrapping part 220. When the first needle body 200 is connected with the tube body 100, the first limiting ring 230 abuts against the tube wall of the tube body 100, thereby preventing the first needle body 200 from entering the inside of the tube body 100 when contacting the product under test.
[0029] Further to the above embodiment, as shown in Figure 6 and Figure 7 A ring-shaped limiting part 221 is arranged on the outer wall of the wrapping part 220, and a plurality of protruding parts 120 are protruded on the inner wall of the tube body 100 and can cooperate with the limiting part 221. When the wrapping part 220 is wrapped by the tube body 100, the protruding parts 120 are embedded in the limiting part 221, thereby further improving the stability of the connection between the first needle body 200 and the tube body 100.
[0030] Further based on the above embodiment, the number of the convex parts 120 is four and they are arranged at intervals of 90 degrees, so that the connection between the first needle body 200 and the tube body 100 is more stable.
[0031] Further based on the above embodiment, as shown in Figure 6 and Figure 7 The contact part 210 is provided with a plurality of tapered parts 211, which can make the contact part 210 more accurately contact the contact of the product to be tested. The application also provides a manufacturing process of the glue-filling coaxial test device, which comprises the following steps: Step one: the first stamping is performed from the top of the base 10 to form the containing groove 11, the second stamping is performed on the bottom of the containing groove 11 to form the limiting groove 12, and the bottom of the limiting groove 12 is drilled according to a preset interval to form a plurality of containing holes 13; Step two: the liquid insulation glue material is filled into the containing holes 13, and after the containing holes 13 are filled, the insulation glue material is cooled to form a solid state; Step two: along the direction of the containing holes 13, the solid-state insulation glue material is drilled, and then the test probe 20 is placed into the hole, so that an insulation glue layer 30 is formed between the side of the test probe 20 and the inner wall of the containing hole 13.
[0032] The details of the above exemplary embodiments, and without departing from the spirit or essential characteristics of the application, can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the application.
Claims
1. A coaxial testing device for glue dispensing, characterized in that, Includes a base (10), with an inwardly recessed receiving groove (11) on the top of the base (10) and a limiting groove (12) at the bottom of the receiving groove (11). The receiving groove (11) is used to prevent the chip from being displaced within the receiving groove (11). Several receiving holes (13) are arranged at a preset interval at the bottom of the limiting groove (12). The receiving holes (13) penetrate the bottom of the limiting groove (12). A test probe (20) is provided in the receiving hole (13). An insulating adhesive layer (30) is provided between the side of the test probe (20) and the inner wall of the receiving hole (13).
2. The coaxial potting test device according to claim 1, characterized in that, The test probe (20) includes a tube (100), one end of which is provided with a first needle body (200), which is fixedly connected to the tube (100) and is used to contact the chip under test. The other end of the tube (100) away from the first needle body (200) is provided with a second needle body (300). The tube (100) forms a partial enclosure with the first needle body (200) and the second needle body (300), and the second needle body (300) can move along the inner wall of the tube (100) inside the tube (100). A spring (400) is provided between the first needle body (200) and the second needle body (300). The insulating adhesive layer (30) is provided between the tube (100) and the first needle body (200) and the inner wall of the receiving hole (13).
3. The coaxial potting test device according to claim 2, characterized in that, The second needle body (300) extends along the tube body (100) from one end near the first needle body (200) with a limiting member (310). One end of the spring (400) is sleeved on the limiting member (310). The limiting member (310) includes a side wall (311) protruding along the second needle body (300) toward the first needle body (200) and a cone (312) connecting the side wall (311). One end of the spring (400) is sleeved on the side wall (311), and the cone (312) extends into the interior of the spring (400).
4. The coaxial potting test device according to claim 2, characterized in that, A second limiting ring (320) protrudes outward on the outer wall of the second needle body (300), and a curved part (110) is formed by bending one end of the tube body (100) near the second needle body (300) towards the inside of the tube body (100).
5. The coaxial potting test device according to claim 2, characterized in that, The first needle body (200) includes a contact portion (210) and a wrapping portion (220). The contact portion (210) is located outside the tube body (100), and the wrapping portion (220) is wrapped by the tube body (100). A first limiting ring (230) protrudes outward on the outer wall between the contact portion (210) and the wrapping portion (220). When the first needle body (200) is connected to the tube body (100), the first limiting ring (230) abuts against the tube wall of the tube body (100).
6. The coaxial potting test device according to claim 5, characterized in that, An annular limiting part (221) is provided on the outer wall of the wrapping part (220), and a number of protrusions (120) that can cooperate with the limiting part (221) are raised on the inner wall of the tube body (100). When the wrapping part (220) is wrapped by the tube body (100), the protrusions (120) are embedded in the limiting part (221).
7. The coaxial potting test device according to claim 6, characterized in that, The number of protrusions (120) is 4, and they are spaced 90 degrees apart.
8. The coaxial potting test device according to claim 5, characterized in that, The contact portion (210) is provided with a plurality of tapered portions (211).
9. A manufacturing process for a coaxial potting test device, characterized in that, Includes the following steps: Step 1: A receiving groove (11) is formed by first stamping from the top of the base (10), and a limiting groove (12) is formed at the bottom of the receiving groove (11). Several receiving holes (13) are formed at the bottom of the limiting groove (12) according to a preset interval. Step 2: Pour the liquid insulating material into the receiving hole (13) until it fills the receiving hole (13), and then cool the insulating material to form a solid. Step 3: After drilling a hole in the solid insulating material along the direction of the receiving hole (13), place the test probe (20) into the hole so that an insulating layer (30) is formed between the side of the test probe (20) and the inner wall of the receiving hole (13).
Citation Information
Patent Citations
Integrated circuit test device and conductor component thereof
CN106802391A
Coaxial structure test seat
CN113156174A
Device for chip testing
CN113376504A
Injection molding type assembly test probe and production method thereof
CN119780488A