Chip high and low temperature testing device

Abstract

The embodiment of the application provides a kind of chip high-low temperature testing device, it is related to chip testing technical field.A kind of chip high-low temperature testing device, including drum, and the base being arranged below drum, base is the top opening, is opened with heating cavity downward, and still be equipped with the heater capable of heating in the inside of heating cavity, the outer peripheral surface of drum is uniformly fixed with test table, the outer peripheral surface top of drum is fixed with electric push rod, wherein the electric push rod is vertically located above test table, and still be equipped with test cylinder in the end of electric push rod, and the inside of test cylinder is hollow structure setting, still be fixed with test cover in the end of test cylinder, simultaneously still be equipped with the flow guide pipe capable of heat diversion in the inside of drum, wherein the end opening of flow guide pipe is resisted to the outer surface of test cylinder, by drum rotation, high temperature, low temperature test station is quickly switched, avoid the thermal inertia of traditional oven whole temperature rising, greatly shorten test cycle, improve test efficiency.

Description

Technical Field

[0001] This invention belongs to the field of chip testing technology, and in particular relates to a chip high and low temperature testing device. Background Technology

[0002] With the development of chip technology, the application fields of chips have expanded to extreme environments such as automotive electronics, aerospace, industrial control, and 5G communications. These application scenarios require chips to maintain stable and reliable operation over a wide temperature range. Therefore, high and low temperature testing has become an indispensable critical step before chips leave the factory, used to verify their electrical characteristics, functional integrity, and long-term reliability under different temperature conditions.

[0003] In the existing technology (publication number CN116773998A, patent application titled "Changing Temperature Chip Testing System"), chip testing efficiency is improved while the stability of the test data is further enhanced, thereby improving data consistency and comparability. However, in implementing this technical solution, at least the following problems were found in the existing technology.

[0004] However, the aforementioned testing devices have significant limitations. Most devices can only provide a single temperature environment for testing, making the process extremely cumbersome and time-consuming when high-temperature and low-temperature tests need to be performed sequentially. Furthermore, this testing method, based on the temperature change of the entire cavity, cannot simulate real-world temperature shock environments, as chips may encounter drastic temperature changes in practical applications. Therefore, the aforementioned testing devices cannot perform high and low temperature tests. Summary of the Invention

[0005] This application aims to at least address one of the technical problems existing in the prior art that prevent high and low temperature testing of chips. To this end, this application proposes a chip high and low temperature testing device.

[0006] To achieve the above objectives, the specific technical solution of the present invention is as follows: A chip high and low temperature testing device includes a rotating cylinder and a base disposed below the rotating cylinder. The base has a top opening and a heating chamber opening downwards. A heater capable of heating is disposed inside the heating chamber. A test stage is uniformly fixed on the outer circumferential surface of the rotating cylinder. An electric push rod is fixed at the top of the outer circumferential surface of the rotating cylinder. The electric push rod is vertically positioned above the test stage. A test cylinder is disposed at the end of the electric push rod. The interior of the test cylinder has a hollow structure. A test cover is fixed at the end of the test cylinder. A heat guide tube capable of diverting heat is disposed inside the rotating cylinder. One end of the heat guide tube is open and contacts the outer surface of the test cylinder.

[0007] Preferably, the fixing hole above the test platform is opened on the outer circumferential surface of the rotating cylinder, and one end of the guide tube passes through the fixing hole. The top opening of the heating chamber is fixed with a fixing cover, and a support rod extends upward from the center of the fixing cover. The top of the support rod passes through the bottom plate two fixed at the bottom of the rotating cylinder, and a temperature measuring hole passes downward through the surface of the fixing cover.

[0008] Preferably, an air inlet is provided on the outer surface of the test cylinder opposite to the fixing hole, a push groove is provided on the outer peripheral surface of the test cover, a chip power-on groove is provided on the surface of the test stage, and a limit strip is fixed on both sides of the chip power-on groove, wherein a limit groove is provided on the surface of the two opposite limit strips.

[0009] Preferably, the test cylinder has a telescopic opening extending downwards from the top, and a fan cylinder capable of telescopic displacement is provided at the opening of the telescopic opening. The top of the fan cylinder is fixedly connected to the end of the electric push rod, and a heat-conducting plate is fixedly located at the bottom of the fan cylinder.

[0010] Preferably, the heat-conducting plate is hollow inside, and a cooling plate is fixed on the bottom surface of the inner cavity of the heat-conducting plate. At the same time, heat dissipation fins are fixed on the upper surface of the heat-conducting plate, and a magnetic block is fixed at the edge of the upper surface of the heat-conducting plate.

[0011] Preferably, a guide plate is fixed to the outer circumferential surface of the support rod, and a telescopic hole is provided on the outer circumferential surface of the rotating cylinder above the test platform. The telescopic hole is located between the fixed hole and the test platform, and a push rod capable of telescopic displacement is provided inside the telescopic hole.

[0012] Preferably, the upper surface of the test stage has a feeding groove that runs through it. The feeding groove is located between the chip power-on groove and the second limiting strip. At the same time, one end of the push rod is fixed with a push plate, which is located above the opening of the feeding groove. The other end of the push rod extends to the guide plate. A spring is fixed between the push rod and the outer circumferential surface of the guide tube.

[0013] Preferably, the surface of the fixed cover is provided with heat conduction holes facing downward, wherein the heat conduction holes are at the same angle as the protruding guide plate, and a turntable is fixed at the lower part of the outer peripheral surface of the support rod. At the same time, a friction block protrudes upward from the outer peripheral edge of the turntable, and the friction block is vertically located below the protrusion of the guide plate.

[0014] Preferably, the inside of the guide tube is provided with a rotating shaft II, and fan blades and crown gears are fixed at the top and bottom of the guide tube, respectively.

[0015] Preferably, a gear one is meshed with the lower part of the crown gear, and a rotating shaft one extends from the center of the gear one through the guide tube to the top of the turntable, and a friction disc is fixed to the free end of the rotating shaft one.

[0016] The chip high and low temperature testing device of the present invention has the following advantages:

[0017] 1. This chip high and low temperature testing device can quickly switch between high and low temperature testing positions by rotating a drum, avoiding the thermal inertia of the overall temperature rise and fall of traditional temperature chambers, greatly shortening the testing cycle and improving testing efficiency.

[0018] 2. This chip high and low temperature testing device uses an independent guide tube to directionally deliver high temperature airflow, and during low temperature testing, it directly contacts the cooling plate for cooling, ensuring accurate and efficient temperature transfer and reducing environmental interference.

[0019] 3. This chip high and low temperature testing device automatically dries the condensate after testing and automatically removes residual water stains and impurities through a scraper, cleaning roller and other structures, ensuring the test stand is clean and improving the reliability of subsequent tests and the quality of chip surface treatment.

[0020] 4. This chip high and low temperature testing device integrates a push rod and spring structure to realize automatic chip ejection. Combined with scraping and moisture absorption design, it ensures a smooth and clean feeding process, reduces manual intervention, and improves the overall automation level. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the rotating drum structure of the present invention;

[0024] Figure 3 This is an exploded view of the rotating cylinder and base of the present invention;

[0025] Figure 4 This is a schematic diagram of the test bench structure of the present invention;

[0026] Figure 5 This is a top view of the rotating cylinder structure of the present invention;

[0027] Figure 6 For the purposes of this invention Figure 5 Schematic diagram of the cross-sectional structure of the middle AA section;

[0028] Figure 7 This is a schematic diagram of the exploded structure of the electric push rod and test cylinder of the present invention;

[0029] Figure 8 For the present invention Figure 3 Enlarged structural diagram at point A in the middle;

[0030] Figure 9 This is a schematic diagram of the guide plate structure of the present invention;

[0031] Figure 10 For the present invention Figure 9 Enlarged structural diagram at point B;

[0032] Figure 11 This is a schematic diagram of the push rod structure of the present invention;

[0033] Figure 12 For the present invention Figure 4 Enlarged structural diagram at point C;

[0034] Figure 13 This is a schematic diagram of the test cover structure from below according to the present invention;

[0035] Figure 14 For the present invention Figure 13 Enlarged structural diagram at point D.

[0036] Explanation of markings in the diagram: 1. Base plate one; 11. Protective cover; 12. Base; 121. Heating chamber; 122. Return port; 123. Fixing seat; 13. Return pipe; 14. Fixing cover; 141. Support rod; 142. Conductive slip ring; 143. Conductive bracket; 144. Temperature measuring hole; 145. Guide plate; 146. Heat conduction hole; 147. Turntable; 148. Friction block; 15. Heater; 16. Guide pipe; 161. Rotating shaft two; 162. Fan blade; 163. Crown gear; 17. Telescopic hole; 18. Fixing hole; 2. Rotating cylinder; 21. Gear ring; 22. Test platform; 221. Limiting strip one; 222. Chip power-on slot; 223. Limiting bar II; 224. Limiting groove; 225. Discharge groove; 23. Base plate II; 3. Electric push rod; 4. Test cylinder; 41. Test cover; 42. Air inlet; 43. Fan cylinder; 431. Heat-conducting plate; 432. Fan; 44. Telescopic port; 45. Push groove; 451. Water absorption component; 46. Lifting groove; 5. Push rod; 51. Push plate; 511. Rotating groove; 512. Cleaning roller; 513. Roller; 514. Rotating shaft III; 52. Spring I; 6. Rotating shaft I; 61. Friction disc; 62. Gear I; 7. Scraper; 71. Gear II; 72. Rack; 721. Top rod; 722. Spring II; 8. Snap ring assembly. Detailed Implementation

[0037] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0038] like Figures 1-5As shown, a chip high and low temperature testing device of the present invention includes a base 12 and a base plate 1 fixed to the bottom surface of the base 12. The base plate 1 is used to fix the base 12. A rotating cylinder 2 is coaxially arranged above the base 12. A protective cover 11 extends upward from the base plate 1 and is fitted onto the outer circumferential surface of the rotating cylinder 2. A test stage 22 is uniformly fixed on the outer circumferential surface of the rotating cylinder 2. The chip can be placed on the test stage 22, thereby serving as a test platform for the chip.

[0039] A gear ring 21 is fixed on the top of the outer circumference of the rotating drum 2, and a motor is fixed on the inner top surface of the protective cover 11. At the same time, a gear component that drives the gear ring 21 is fixed at the power output end of the motor. Therefore, when the motor is running, it can drive the gear component. As the gear component rotates, it drives the gear ring 21, and then the rotating drum 2 can rotate slowly.

[0040] The base 12 has a top opening and a heating chamber 121 extending downwards. A fixing cover 14 is fixed to the top opening of the heating chamber 121 by bolts. The bottom of the rotating cylinder 2 is placed above the fixing cover 14. A retaining ring assembly 8 is fixed to the upper edge of the fixing cover 14. The bottom of the rotating cylinder 2 expands outwards and extends below the right-angled retaining ring assembly 8. The retaining ring assembly 8 can limit the rotation of the rotating cylinder 2.

[0041] like Figures 2-7 and Figure 12 As shown, an electric push rod 3 is fixed to the top of the outer circumference of the rotating cylinder 2. The electric push rod 3 is vertically positioned above the test platform 22. A test cylinder 4 is located at the end of the electric push rod 3, and the interior of the test cylinder 4 is hollow. A test cover 41 is fixed to the end of the test cylinder 4. The test cover 41 has an opening at the bottom and can cover the test platform 22. A chip power-conducting groove 222 is provided on the surface of the test platform 22 in the covered area. The chip can be powered through the chip power-conducting groove 222. Limiting strips 221 are fixed on both sides of the chip power-conducting groove 222. Limiting grooves 224 are formed on the surfaces of the two opposing limiting strips 221. Therefore, when the chip needs to be tested, the chip can be pushed into the limiting grooves 224 and moved above the chip power-conducting groove 222. A second limiting strip 223 is fixed at the end of the chip being pushed in and moved.

[0042] A support rod 141 extends upward from the center of the fixed cover 14. The top of the support rod 141 passes through the bottom plate 23 fixed at the bottom of the rotating cylinder 2. A conductive slip ring 142 is also fixed at the top of the support rod 141. A conductive bracket 143 that can rotate around the conductive slip ring 142 is mounted on the outer circumference of the conductive slip ring 142. The wires extend through the conductive bracket 143 to the chip power slot 222 to supply power to it.

[0043] A mounting base 123 is fixed to the bottom surface of the inner cavity of the heating chamber 121. Holes are provided on the outer periphery of the mounting base 123 for airflow communication. A heater 15 is also fixed above the mounting base 123, providing the necessary heat for the test. A temperature measuring hole 144 extends downwards through the surface of the mounting cover 14. A return temperature port 122, located on the outer periphery of the base 12, extends upwards towards the test platform 22, with a return temperature pipe 13 at the same angle as the temperature measuring hole 144. One end of the return temperature pipe 13 communicates with the return temperature port 122.

[0044] A fixing hole 18 is located above the test platform 22 and is opened on the outer peripheral surface of the rotating cylinder 2. At the same time, a guide tube 16 extends from the base plate 23 towards the fixing hole 18. The guide tube 16 is hollow and open at both ends, and the through hole opened on the bottom surface of the base plate 23 communicates with the guide tube 16. Therefore, after the rotating cylinder 2 rotates, the guide tube 16 is displaced and can communicate with the temperature measuring hole 144.

[0045] An air inlet 42 is provided on the outer surface of the test cylinder 4 opposite to the fixing hole 18, and a pushing groove 45 is provided on the outer peripheral surface of the test cover 41. Therefore, when the chip needs to be tested at high temperature, the chip is pushed above the chip power-on slot 222, and then the electric push rod 3 is operated. The electric push rod 3 pushes the test cover 41 at its end to cover the chip power-on slot 222. Then the air inlet 42 is connected to the guide tube 16. Then the motor drives the rotating cylinder 2. After the rotating cylinder 2 rotates, the guide tube 16 on the surface of the base plate 23 moves and is connected to the temperature measuring hole 144. Then the heat generated by the heater 15 can be cooled by the fan above the heater 15 and blown to the guide tube 16. Since the other end of the guide tube 16 is connected to the air inlet 42 and the test cover 41 is placed above the chip, the high temperature can be blown vertically to the chip, thereby performing high temperature testing. At the same time, the high-temperature gas discharged through the push groove 45 can be returned through the return pipe 13, thereby accelerating the airflow heating time. After the high-temperature test is completed, as the base plate 23 rotates, the guide pipe 16 passes over the temperature measuring hole 144, which can reduce heat loss.

[0046] like Figure 7As shown, a telescopic opening 44 extends downwards from the top of the test cylinder 4. A telescopic fan cylinder 43 is located at the opening of the telescopic opening 44. The top of the fan cylinder 43 is fixedly connected to the end of the electric push rod 3. A heat-conducting plate 431 is fixed at the bottom of the fan cylinder 43. The heat-conducting plate 431 is hollow inside, and a cooling fin is fixed to the bottom surface of the inner cavity of the heat-conducting plate 431. Heat dissipation fins are fixed to the upper surface of the heat-conducting plate 431, and heat is dissipated above the heat dissipation fins by a fan 432. A magnetic block is fixed at the edge of the upper surface of the heat-conducting plate 431. The area of ​​the heat-conducting plate 431 is the same as the inside of the test cylinder 4, and the magnetic block can then be attracted to the bottom surface of the opening of the telescopic opening 44. Therefore, after the chip has undergone high-temperature testing, the electric push rod 3 continues to move downwards. The pushing force of the electric push rod 3 causes the magnetic force of the magnetic block to disengage from the top surface of the telescopic opening 44. As the heat-conducting plate 431 moves downwards, the bottom surface of the heat-conducting plate 431 comes into contact with the chip, and then a low-temperature test is performed on it, thereby achieving the high and low temperature testing effect of the device. Moreover, as the rotating drum 2 rotates continuously, the continuity of the test is improved.

[0047] like Figures 3-8 As shown, a guide plate 145 is fixed on the outer circumferential surface of the support rod 141. At the same time, a telescopic hole 17 is provided on the outer circumferential surface of the rotating cylinder 2 above the test platform 22. The telescopic hole 17 is located between the fixed hole 18 and the test platform 22. A push rod 5 capable of telescopic displacement is provided inside the telescopic hole 17.

[0048] A feeding groove 225 runs through the upper surface of the test stage 22. The feeding groove 225 is located between the chip power-on groove 222 and the limiting strip 223. At the same time, one end of the push rod 5 is fixed with a push plate 51, which is located above the opening of the feeding groove 225. The other end of the push rod 5 extends to the guide plate 145. A spring 52 is fixed between the push rod 5 and the outer peripheral surface of the guide tube 16. The guide plate 145, which passes through the low temperature test area, is set outward in a protruding structure. Therefore, after the chip has undergone high and low temperature tests, the electric push rod 3 can retract upward, and the heat-conducting plate 431 can then seal the telescopic opening 44 again. As the rotating drum 2 continues to rotate, one end of the push rod 5 can pass through the protruding guide plate 145. Then, the push rod 5 can compress the spring 52 and push the push plate 51. Under the push of the push plate 51, the chip can be moved out of the de-energized chip power-on groove 222, which makes it convenient for the operator to remove the chip for feeding.

[0049] like Figures 6-10 As shown, a heat-conducting hole 146 is also provided on the surface of the fixed cover 14, and the heat-conducting hole 146 is located at the same angle as the protruding guide plate 145. A turntable 147 is also fixed on the lower part of the outer peripheral surface of the support rod 141, and a friction block 148 protrudes upward from the outer peripheral edge of the turntable 147. The friction block 148 is located vertically below the protrusion of the guide plate 145.

[0050] A rotatable shaft 161 is located inside the guide tube 16. One end of the shaft 161 passes through a bracket inside the guide tube 16, allowing the guide tube 16 to rotate. A fan blade 162 and a crown gear 163 are fixed at the top and bottom of the guide tube 16, respectively. A gear 62 is meshed below the crown gear 163. A shaft 6 passes through the guide tube 16 from the center of gear 62. One end of the shaft 6 also passes through a bracket fixed on the base plate 23, which supports the rotation of the shaft 6. The other end of the shaft 6 extends above the turntable 147, and a friction disc 61 is fixed to the free end of the shaft 6. The outer circumference of the friction disc 61 rubs against the friction block 148 after passing through it, subsequently driving the fan blade 162 to rotate. Therefore, after the chip undergoes low-temperature testing, the heat generated by the heater 15 can be blown upwards onto the chip through the heat pipe 16 after the rotating drum 2 passes above the heat conduction hole 146, thus drying the condensate on the chip caused by the low temperature. During rotation, the friction disk 61 and the friction block 148 come into contact with each other, which causes the gear 62 to drive the upper meshing crown gear 163. Subsequently, the crown gear 163 rotates and causes the fan blade 162 to assist in accelerating the flow of hot air and speeding up the drying of the condensate on the chip.

[0051] like Figure 11 As shown, a rotating groove 511 is formed on the bottom surface of the push plate 51, and a rotatable cleaning roller 512 is provided inside the rotating groove 511. A rotating shaft 514 extends from the center of the cleaning roller 512 to both ends, and the two ends of the rotating shaft 514 pass through the two ends of the push plate 51 respectively. A roller 513 is fixed at the end of the rotating shaft 514, and the upper part of the outer circumferential surface of the roller 513 abuts against the upper part of the limiting groove 224. Therefore, when the push plate 51 pushes the chip down by the push rod 5, the roller 513 abuts against the upper part of the limiting groove 224, and then the cleaning roller 512 can rotate. As the chip is pushed out, and the push rod 5 is pulled back by the spring 52, the cleaning roller 512 can clean the impurities above the chip power-on groove 222 to the discharge groove 225, thereby improving the effect of subsequent chip power-on testing.

[0052] like Figures 13-14As shown, a water-absorbing component 451 is fixed to the top of the push groove 45, and a scraper 7 is provided below the water-absorbing component 451. At the same time, a lifting groove 46 is opened upward from the bottom surface of the test cover 41. Gears 71 are fixed to both ends of the scraper 7. The gears 71 are located in the lifting groove 46, and the scraper 7 rotates around the gears 71. A rack 72 is meshed with one side of the outer circumference of the gears 71. A push rod 721 is fixed downward from the bottom surface of the rack 72. The push rod 721 extends out of the lifting groove 46, and a spring 722 is sleeved on the outer surface of the push rod 721. The two ends of the spring 722 are fixedly connected to the bottom surface of the rack 72 and the bottom surface of the inner cavity of the lifting groove 46, respectively. Therefore, after the chip is placed in the chip power-on slot 222 and the test cover 41 is placed downwards on top of the chip, the bottom surface of the push rod 721 is subjected to force, which pushes the rack 72 upwards. Then the rack 72 pushes the gear 71. After the gear 71 rotates, the scraper 7 is set in a vertical structure. As the push plate 51 pushes the chip out, the scraper 7 can scrape off the condensate on the surface of the chip, further accelerating the drying of the chip surface. After the chip test is completed, the test cover 41 is lifted upwards, and then the scraper 7 rotates in the opposite direction, so that the water stains scraped off by the scraper 7 are absorbed by the water absorption member 451.

[0053] The working principle of a chip high and low temperature testing device is as follows: When the chip needs to be tested at high temperature, the chip is pushed above the chip power-on slot 222. Then the electric push rod 3 is operated, and the test cover 41 at the end of the electric push rod 3 can be placed above the chip power-on slot 222. Then the air inlet 42 is connected to the guide tube 16. Then the motor drives the rotating drum 2. After the rotating drum 2 rotates, the guide tube 16 on the surface of the base plate 23 moves and can be connected to the temperature measuring hole 144. Then the heat generated by the heater 15 can be cooled by the fan above the heater 15 and blown to the guide tube 16. Since the other end of the guide tube 16 is connected to the air inlet 42 and the test cover 41 is placed above the chip, the high temperature can be blown vertically to the chip, thereby conducting high temperature testing.

[0054] After the chip has undergone high-temperature testing, the electric push rod 3 continues to move downwards. The pushing force of the electric push rod 3 causes the magnetic force of the magnetic block to disengage from the top surface of the telescopic opening 44. As the heat-conducting plate 431 moves downwards, the bottom surface of the heat-conducting plate 431 comes into contact with the chip. Then the cooling chip runs to perform low-temperature testing, thereby achieving the high and low temperature testing effect of the device. Moreover, as the rotating drum 2 rotates continuously, the continuity of the test is improved.

[0055] After the chip has undergone high and low temperature testing, the electric push rod 3 can retract upwards, and the heat conduction plate 431 can then seal the telescopic opening 44 again. As the rotating drum 2 continues to rotate, one end of the push rod 5 can pass through the protruding guide plate 145. Then the push rod 5 can compress the spring 52 and push the push plate 51. Under the push of the push plate 51, the chip can be moved out of the de-energized chip slot 222, which makes it easier for the operator to remove the chip and unload it.

[0056] After the chip undergoes a low-temperature test, the heat from the heater 15 is blown upwards onto the chip via the heat pipe 16 after the rotating drum 2 passes above the heat conduction hole 146. This dries the condensate on the chip caused by the low temperature. During rotation, the friction disk 61 and the friction block 148 come into contact with each other, which causes the gear 62 to drive the upper meshing crown gear 163. Subsequently, the crown gear 163 rotates and causes the fan blades 162 to assist in accelerating the flow of hot air and speeding up the drying of the condensate on the chip.

[0057] Meanwhile, after the chip is placed in the chip power-on slot 222 and the test cover 41 is placed downwards on top of the chip, the bottom surface of the push rod 721 is subjected to force to push the rack 72 upwards. Then the rack 72 pushes the gear 71. After the gear 71 rotates, the scraper 7 is set in a vertical structure. As the push plate 51 pushes the chip out, the scraper 7 can scrape off the condensate on the surface of the chip, further accelerating the drying of the chip surface. After the chip test is completed, the test cover 41 is lifted upwards, and then the scraper 7 rotates in the opposite direction, so that the water stains scraped off by the scraper 7 are absorbed by the water absorption component 451.

[0058] Finally, when the pusher plate 51 pushes the chip down through the pusher rod 5, the roller 513 touches the upper part of the limiting groove 224, and then the cleaning roller 512 can rotate. As the chip is pushed out, the pusher rod 5 is pulled back by the spring 52, and the cleaning roller 512 can clean the impurities above the chip power-on groove 222 to the discharge groove 225, thereby improving the effect of subsequent chip power-on testing.

[0059] It is understood that the present invention has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the invention. Furthermore, under the teachings of the present invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of the present invention.

Claims

1. A chip high and low temperature testing device, comprising a rotating cylinder (2) and a base (12) disposed below the rotating cylinder (2), characterized in that: The base (12) has an opening at the top and a heating chamber (121) is provided downwards. Inside the heating chamber (121) is a heater (15) that can generate heat. Test platforms (22) are evenly fixed on the outer circumference of the rotating cylinder (2). An electric push rod (3) is fixed at the top of the outer circumference of the rotating cylinder (2). The electric push rod (3) is vertically located above the test platform (22). At the end of the electric push rod (3) is a test cylinder (4). The interior of the test cylinder (4) is hollow. At the end of the test cylinder (4) is a test cover (41). Inside the rotating cylinder (2) is a guide tube (16) that can divert heat. One end of the guide tube (16) is in contact with the outer surface of the test tube (4). The top of the test tube (4) is provided with a telescopic opening (44) extending downwards. At the same time, a fan tube (43) capable of telescopic displacement is provided at the opening of the telescopic opening (44). The top of the fan tube (43) is fixedly connected to the end of the electric push rod (3). A heat-conducting plate (431) is also fixed at the bottom of the fan tube (43). The interior of the heat-conducting plate (431) is hollow. A cooling plate is fixed on the bottom surface of the inner cavity of the heat-conducting plate (431). At the same time, a heat dissipation fin is fixed on the upper surface of the heat-conducting plate (431). A magnetic block is also fixed at the edge of the upper surface of the heat-conducting plate (431).

2. The chip high and low temperature testing device according to claim 1, characterized in that: The fixing hole (18) above the test platform (22) is opened on the outer circumference of the rotating drum (2), and one end of the guide tube (16) passes through the fixing hole (18). The top opening of the heating chamber (121) is fixed with a fixing cover (14). A support rod (141) extends upward from the center of the fixing cover (14). The top of the support rod (141) passes through the bottom plate (23) fixed at the bottom of the rotating drum (2). A temperature measuring hole (144) passes downward through the surface of the fixing cover (14).

3. The chip high and low temperature testing device according to claim 2, characterized in that: An air inlet (42) is provided on the outer surface of the test tube (4) opposite to the fixing hole (18). A push groove (45) is provided on the outer peripheral surface of the test cover (41). A chip power-on groove (222) is also provided on the surface of the test stage (22). Limiting strips (221) are fixed on both sides of the chip power-on groove (222). Limiting grooves (224) are provided on the surfaces of the two opposite limiting strips (221).

4. The chip high and low temperature testing device according to claim 3, characterized in that: The outer periphery of the support rod (141) is fixed with a guide plate (145), and a telescopic hole (17) is provided on the outer periphery of the rotating cylinder (2) above the test platform (22). The telescopic hole (17) is located between the fixed hole (18) and the test platform (22), and a push rod (5) capable of telescopic displacement is provided inside the telescopic hole (17).

5. The chip high and low temperature testing device according to claim 4, characterized in that: The upper surface of the test stage (22) is perforated by a feeding groove (225), which is located between the chip power-on groove (222) and the second limiting strip (223). At the same time, one end of the push rod (5) is fixed with a push plate (51), which is located above the opening of the feeding groove (225), and the other end of the push rod (5) extends to the guide plate (145). A spring (52) is fixed between the push rod (5) and the outer peripheral surface of the guide tube (16).

6. The chip high and low temperature testing device according to claim 5, characterized in that: The surface of the fixed cover (14) is provided with a heat conduction hole (146) facing downwards. The heat conduction hole (146) is located at the same angle as the protruding guide plate (145). A turntable (147) is fixed at the lower part of the outer peripheral surface of the support rod (141). At the same time, a friction block (148) protrudes upwards from the outer peripheral edge of the turntable (147). The friction block (148) is located vertically below the protrusion of the guide plate (145).

7. The chip high and low temperature testing device according to claim 6, characterized in that: The guide tube (16) is equipped with a rotating shaft (161) inside, and a fan blade (162) and a crown gear (163) are fixed at the top and bottom of the guide tube (16), respectively.

8. The chip high and low temperature testing device according to claim 7, characterized in that: The crown gear (163) is meshed with a gear (62) below it. A shaft (6) extends through the guide tube (16) from the center of the gear (62). The other end of the shaft (6) extends to the top of the turntable (147), and a friction disc (61) is fixed at the free end of the shaft (6).

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