A mainboard automatic function test machine

Abstract

The application discloses a kind of mainboard automation function test machines, belong to test equipment technical field, including test table, the top surface of the test table is fixed with multiple struts, multiple struts top surface is provided with test electric control box, the top surface of the test table is fixed with support, support one side is connected with transfer assembly, transfer assembly one side is connected with telescopic material taking assembly, the top surface of the test table is provided with test mechanism for detecting mainboard, the top surface of the test table is provided with transfer correction assembly for positioning mainboard. Through transfer assembly, material taking assembly, transfer correction assembly and test mechanism collaborative design, realize mainboard pick-and-place, correction, test integration, improve the overall efficiency of mainboard test;Upper measurement component realizes "rise (pick-and-place) -drop (test)" double-state switching by first electric slide, combined with material taking assembly telescopic to transfer correction assembly pick-and-place mainboard, reduce the overall translation frequency of material taking assembly.

Description

Technical Field

[0001] This application relates to the field of testing equipment technology, and more specifically, to an automated functional testing machine for motherboards. Background Technology

[0002] Automated motherboard functional testing machines are indispensable core equipment in the electronics manufacturing industry. They are mainly used for automated testing of key indicators such as circuit continuity, chip functionality, and interface performance of various electronic motherboards (such as computer motherboards, mobile phone motherboards, and industrial control motherboards). Their core value lies in replacing traditional manual testing, achieving greater efficiency, accuracy, and scalability in the motherboard testing process. This is especially crucial in mass production in industries such as consumer electronics and communication equipment, directly determining product quality and production efficiency. With the rapid development of electronic technology, motherboards are becoming increasingly integrated and thinner, placing more stringent demands on the testing machine's stability in handling components, positioning accuracy, testing efficiency, and non-destructive testing capabilities.

[0003] In the existing technology, motherboard testing machines mostly use a fixed-length robotic arm or transfer structure in the material picking and positioning stage, combined with a vacuum nozzle to lift and move the motherboard to achieve material picking and transfer. Then, the motherboard is transferred and placed directly on the test carrier, and the motherboard is adjusted and positioned on the test carrier to ensure the accuracy of motherboard testing. Finally, after the test is completed, the tested motherboard is transferred and placed on the unloading tray for collection.

[0004] However, existing testing machines have the following shortcomings:

[0005] 1. When transferring the motherboard, a series of operations such as picking up, placing and unloading materials are required by moving to multiple positions. This causes the fixed-length robotic arm or the entire transfer structure to need to perform high-frequency translation operations, which increases the possibility of translation position deviation and makes it difficult to guarantee the accuracy of each motherboard transfer operation.

[0006] 2. The positioning operation was performed only after the motherboard was transferred and placed on the test carrier board, which reduced the accuracy and stability of the material transfer before testing and reduced the efficiency of motherboard testing.

[0007] In view of this, we propose an efficient and accurate automated functional testing machine for motherboards. Summary of the Invention

[0008] 1. Technical problems to be solved

[0009] The purpose of this application is to provide an automated motherboard functional testing machine that solves the technical problems mentioned in the background section.

[0010] 2. Technical Solution

[0011] This application provides an automated functional testing machine for motherboards, including a test bench. Multiple support columns are fixed on the top surface of the test bench, and a test control box is arranged between the top surfaces of the multiple support columns. A bracket is fixed on the top surface of the test bench, a transfer component is connected to one side of the bracket, and a retractable material picking component is connected to one side of the transfer component. A test mechanism for testing the motherboard is provided on the top surface of the test bench, and a transfer and calibration component for positioning the motherboard is provided on the top surface of the test bench.

[0012] The testing mechanism includes a first pad fixed to the top surface of the test bench, a first support plate fixed to the top surface of the first pad, a fixed load assembly for placing the motherboard on the top surface of the first support plate, a first slide rail fixed to one side of the fixed load assembly, a first electric slider slidably connected to one side of the first slide rail, and an upper testing assembly connected to the side wall of the first electric slider. The upper testing assembly can be moved in two states via the first electric slider:

[0013] In the first state, the upper test component rises and is spaced on top of the fixed load component. The material picking component is pushed and set on top of the fixed load component by the transfer component. One side of the material picking component is set on top of the transfer and correction component by an extension, which is used to pick up and place the motherboard on the fixed load component.

[0014] In the second state, the upper test component descends and is attached to the top surface of the fixed load component for testing motherboard functions.

[0015] Furthermore, the material handling assembly includes a second support plate fixedly connected to one side of the transfer assembly, a third support plate fixedly fixed to the top surface of the second support plate, a guide rail fixed to the side wall of the second support plate, a pneumatic rod provided on the side wall of the third support plate, the telescopic end of the pneumatic rod penetrating and connected to the interior of the third support plate, an extension plate connected to the telescopic end of the pneumatic rod, the extension plate slidably connected to the interior of the guide rail, a suction component provided on the side of the extension plate away from the guide rail, a first guide rod connected to one side of the extension plate, and the first guide rod penetrating and connected to the interior of the third support plate.

[0016] Furthermore, the suction component includes an air pump located on the top surface of the extended plate away from the guide rail. An air guide pipe is connected through the bottom surface of the air pump, and a vacuum box is connected through the bottom end of the air guide pipe. A suction nozzle is elastically slidably connected to the bottom surface of the vacuum box. The inside of the suction nozzle is connected through the inside of the vacuum box. Four suction nozzles are arranged in a rectangular pattern, and a fixing block is fixed between two adjacent suction nozzles.

[0017] Furthermore, the fixed load assembly includes a test plate disposed on the top surface of the first support plate. A fixed pusher is disposed through the top surface of the test plate. The top surface of the test plate is provided with two transfer areas and two test areas. Two L-shaped positioning blocks are mirrored on the top surface of the test areas of the test plate. Two pushing areas are disposed on the top of the fixed pusher. One side of the fixed pusher is pushed and translated by the upper test assembly to make the pushing area translate from the transfer area of ​​the test plate to the test area.

[0018] Furthermore, the fixed-push component includes two insert plates that are slidably inserted into the test carrier plate. A slanted push plate is fixed across the sidewalls of the two insert plates. The top surface of the slanted push plate is a slanted structure. The slanted push plate is pushed and translatably inserted into the test carrier plate by the upper test component. Two insert posts are fixed on one side of the slanted push plate. The insert posts are inserted into the test carrier plate. A first spring connects one end of the insert post to the inside of the test carrier plate. Two fixed-push groups are fixed on the top surface of the insert plates. The fixed-push groups include a first fixed-push block and a second fixed-push block fixed on the top surface of the insert plates. The first fixed-push block and the second fixed-push block are slidably connected to the top surface of the test carrier plate. The first fixed-push block and the second fixed-push block are spaced apart and form a pushing area between them. The width of the pushing area is greater than the width of the transfer area and the test area.

[0019] Furthermore, the test carrier plate has two material picking slots on its top surface, which are respectively located inside the two transfer areas of the test carrier plate.

[0020] Furthermore, a plasma air outlet channel is provided through the bottom surface of the material receiving tank.

[0021] Furthermore, the upper testing component includes a fixed frame fixed to the side wall of the first electric slider, a slanted push frame fixed to the bottom surface of the fixed frame, a slanted structure provided on the inner wall of the slanted push frame, the slanted structure of the slanted push frame being parallel to the slanted structure of the slanted push plate, the slanted push plate being pushed and translated into the test plate by the slanted push frame, a pressure testing plate being inserted and fixed inside the fixed frame, the pressure testing plate having a through hole structure inside, a first fixing frame fixed to the inner wall of the fixed frame, two scanning guns being provided on one side of the first fixing frame, the scanning guns being located at the top of the through hole structure of the pressure testing plate, and the two scanning guns being located at the top of the two test areas respectively.

[0022] Furthermore, the transfer calibration component includes a second pad fixed to the top surface of the test bench, a calibration platform fixed to the top surface of the second pad, a liftable feeding component connected through the top surface of the calibration platform, two calibration zones set at the top of the feeding component, the two sides of the calibration zones being through structures, four calibration blocks fixed in a rectangular distribution on the top surface of the calibration platform, and the calibration zones being set in two states by the lifting and lowering of the feeding component.

[0023] In the first state, the calibration area is lowered and positioned between the two calibration blocks so that the two calibration blocks stop on both sides of the through structure of the calibration area, which is used to position the motherboard between the calibration area and the two calibration blocks.

[0024] In the second state, the correction zone is raised and positioned on top of the two correction blocks, with the correction zone and the transfer zone located on the same horizontal center line.

[0025] Furthermore, the feeding component includes two lifting plates slidably inserted into the calibration platform. An inclined top plate is fixed across the side walls of the two lifting plates. Two correction grooves are fixed across the top surfaces of the two lifting plates. The correction grooves are slidably inserted into the top surface of the calibration platform and are positioned between two correction blocks. Limiting plates are fixed at an inclination on both sides of the top surface of the correction grooves. The two limiting plates are mirror images of the vertical centerline of the correction grooves. A correction zone is fixed between the top surface of the correction grooves and the two limiting plates. Two second guide rods are fixed on the top surface of the lifting plates. The second guide rods are connected through the top surface of the calibration platform. A second spring is sleeved on the outer wall of the second guide rod. The bottom end of the second spring is connected to the top surface of the calibration platform. A connecting plate is fixed across the top of the two second guide rods and is positioned between the two correction grooves. Two stops are fixed on the top surface of the connecting plate. The connecting plate is pushed up by the second guide rods so that the stops rise to stop the fixed blocks.

[0026] The suction component also includes two second fixing frames connected to one side of the vacuum box. The outer wall of the second fixing frame is rotatably connected to a first roller, and the inner wall of the second fixing frame is rotatably connected to a second roller.

[0027] The bottom surface of the inclined top plate is provided with two inclined structures in a stepped distribution. The inclined top plate is pushed up along the two inclined structures by a second roller.

[0028] Furthermore, the transfer assembly includes a second slide rail that is laterally fixed to one side of the bracket, a second electric slider that is slidably connected to one side of the second slide rail, a third slide rail that is vertically fixed to the side wall of the second electric slider, a third electric slider that is slidably connected to one side of the third slide rail, and the side wall of the third electric slider that is fixedly connected to the second support plate.

[0029] 3. Beneficial effects

[0030] One or more technical solutions provided in this application have at least the following technical effects or advantages:

[0031] 1. Through the collaborative design of the transfer component, the picking component, the transfer and calibration component, and the testing mechanism, the motherboard picking, calibration, and testing are integrated, improving the overall testing efficiency of the motherboard; the upper testing component realizes the dual-state switching of "rising (picking and placing) - falling (testing)" through the first electric slider, and combined with the retractable picking component to the transfer and calibration component to pick up and place the motherboard, the overall translation frequency of the picking component is reduced, and the transfer and calibration component is used to ensure the accuracy of motherboard positioning and transfer; the fixed-load component of the testing mechanism provides a stable placement platform, and the cooperation of multiple components reduces manual intervention.

[0032] 2. The material handling component is driven by a pneumatic rod to slide the extension plate along the guide rail. The first guide rod assists in guiding the material handling component to ensure smooth translation without shaking during the extension and retraction process. The extension and retraction length can be adjusted according to the distance between the test bench and the calibration bench to adapt to different test scenarios. It also allows the material handling component to extend and retract independently, reducing the overall translation frequency of the material handling component. This reduces the positional deviation caused by multiple translation frequencies and improves the accuracy and stability of the motherboard transfer.

[0033] 3. The test carrier board has two transfer areas and two test areas. Together with the push-pull component, it can realize parallel operation of material picking and testing. By placing the motherboard to be tested in the transfer area, the material picking component only needs to move linearly to pick up and place the motherboard, which improves the efficiency of the material picking component in picking up and placing the motherboard. When placing the motherboard in the transfer area, the push-pull component is pushed by the upper test component to automatically push the motherboard from the transfer area to the test area without additional driving, which improves the convenience of motherboard testing.

[0034] 4. The transfer and correction component achieves precise correction of the main board through the correction block and the feeding component. The correction area of ​​the feeding component is open on both sides, the correction block stops both sides of the main board, and the limit plate guides, which improves the accuracy of the correction and positioning of the transfer plate. The feeding component can be raised and lowered. After correction, it rises to the same horizontal line as the transfer area and releases the stop of the correction block, which makes it easy for the material picking component to move and pick up the material. No additional lifting mechanism is required, making the operation efficient and convenient.

[0035] 5. The feeding component is linked to the feeding assembly via the second roller, the inclined top plate, and the feeding component. When the feeding assembly moves horizontally, the second roller pushes the inclined top plate upward, causing the lifting plate and the correction tank to rise, releasing the positioning of the main board by the correction block, facilitating the transfer of the main board. This eliminates the need for a motor drive, resulting in a fast response and improved work efficiency. The second roller rolls along the two inclined surfaces, pushing the inclined top plate upward in a stepped manner, ensuring the main board rises stably and without deviation, guaranteeing the positioning accuracy of the main board. The second spring assists in the descent, achieving a stepped reset and preventing friction between the main board and the correction tank. The stop block rises with the connecting plate to stop the fixing block, allowing the suction nozzle to slide on the vacuum box and remain positioned at the top of the correction tank. Simultaneously, the correction tank rises until the main board and the suction nozzle are in contact, thus preventing relative friction between the suction nozzle and the main board and improving the safety and stability of the suction nozzle's suction of the main board. The first roller rolls on the pad plate as the feeding assembly moves, reducing bumps and ensuring stable adsorption of the main board. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the structure of an automated functional testing machine for motherboards according to the present invention.

[0037] Figure 2 This is a schematic diagram of the material handling component of the present invention transferring the main board to the top of the load-bearing component.

[0038] Figure 3 This is a schematic diagram of the material handling component structure of the present invention.

[0039] Figure 4 This is a schematic diagram of the material suction component of the present invention.

[0040] Figure 5 This is a schematic diagram of the internal structure of the testing mechanism of the present invention in the testing state.

[0041] Figure 6 This is a schematic diagram of the internal structure of the fixed-load component of the present invention.

[0042] Figure 7 This is a schematic diagram of the structure of the pusher component of the present invention pushing the motherboard to the transfer area.

[0043] Figure 8 This is a schematic diagram of the structure of the push-pull component of the present invention pushing the motherboard to the test area.

[0044] Figure 9 This is a schematic diagram of the structure of the suction component of the present invention transferring the main board state on the transfer and correction assembly.

[0045] Figure 10 This is a schematic diagram of the internal structure of the relay correction component of the present invention.

[0046] Figure 11 This is a schematic diagram of the material handling component of the present invention extending to the top of the transfer and correction component.

[0047] Figure 12 This is a schematic diagram of the structure of the material handling component of the present invention, showing the transfer of the motherboard unloading state.

[0048] Explanation of the numbers in the diagram: 100, Test stand; 200, Test mechanism; 210, First pad; 220, First support plate; 230, Fixed load assembly; 231, Test carrier plate; 2311, Material chute; 2312, Plasma exhaust channel; 232, Positioning block; 233, Fixed push component; 234, Inclined push plate; 235, Insert post; 236, First spring; 237, Insert plate; 238, First fixed push block; 239, Second fixed push block; 240, First slide rail; 250, First electric slider; 260, Upper test assembly; 261, Fixing frame; 262, First fixing bracket; 263, Scanner; 264, Pressure test plate; 265, Inclined push frame; 300, Support; 400, Transfer assembly; 410, Second slide rail; 420, Second electric slider; 430, Third slide rail; 440, Third electric... 500. Slider; 510. Material handling assembly; 520. Second support plate; 530. Third support plate; 540. Guide rail; 550. Pneumatic rod; 560. First guide rod; 570. Outer plate; 571. Suction component; 572. Air pump; 573. Air duct; 574. Vacuum box; 575. Suction nozzle; 5741. Fixing block; 575. Second fixing frame; 576. First roller; 577. Second roller Wheel; 600, Transfer and calibration assembly; 610, Second pad; 620, Calibration platform; 621, Calibration block; 630, Discharge component; 631, Inclined top plate; 632, Lifting plate; 633, Second guide rod; 634, Second spring; 635, Calibration groove; 636, Limiting plate; 637, Connecting plate; 638, Stop block; 700, Support column; 800, Test electrical control box; 900, Discharge tray. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0050] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0051] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or a link; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0052] Reference Figures 1-12 This application provides an automated functional testing machine for motherboards, including a test bench 100. Multiple support columns 700 are fixed on the top surface of the test bench 100, and a test control box 800 is arranged between the top surfaces of the multiple support columns 700. A bracket 300 is fixed on the top surface of the test bench 100, a transfer component 400 is connected to one side of the bracket 300, and a retractable material picking component 500 is connected to one side of the transfer component 400. A test mechanism 200 for testing motherboards is arranged on the top surface of the test bench 100, and a transfer and calibration component 600 for positioning motherboards is arranged on the top surface of the test bench 100.

[0053] The testing mechanism 200 includes a first pad 210 fixed to the top surface of the testing platform 100, a first support plate 220 fixed to the top surface of the first pad 210, a fixed load assembly 230 for placing the motherboard on the top surface of the first support plate 220, a first slide rail 240 fixed to one side of the fixed load assembly 230, a first electric slider 250 slidably connected to one side of the first slide rail 240, and an upper testing assembly 260 connected to the side wall of the first electric slider 250. The upper testing assembly 260 can be moved via the first electric slider 250 and has two states:

[0054] In the first state, the upper test component 260 rises and is spaced at the top of the fixed load component 230. The material picking component 500 is pushed and set at the top of the fixed load component 230 by the transfer component 400, and one side of the material picking component 500 is set at the top of the transfer and correction component 600 by extending outward, for picking up and placing the motherboard on the fixed load component 230.

[0055] In the second state, the upper test component 260 descends and is attached to the top surface of the fixed load component 230 for testing the motherboard function;

[0056] Through the collaborative design of the transfer component 400, the picking component 500, the transfer and calibration component 600, and the testing mechanism 200, the motherboard picking, calibration, and testing are integrated, improving the overall testing efficiency of the motherboard. The upper testing component 260 achieves dual-state switching of "rising (picking and placing) - falling (testing)" through the first electric slider 250. Combined with the retractable picking component 500 to the transfer and calibration component 600 for picking and placing motherboards, the overall translation frequency of the picking component 500 is reduced, and the transfer and calibration component 600 is used to ensure the accuracy of motherboard positioning and transfer. The fixed-load component 230 of the testing mechanism 200 provides a stable placement platform, and the cooperation of multiple components reduces manual intervention.

[0057] In this embodiment, the material handling component 500 includes a second support plate 510 fixedly connected to one side of the transfer component 400, a third support plate 520 fixedly fixed to the top surface of the second support plate 510, a guide rail 530 fixedly fixed to the side wall of the second support plate 510, a pneumatic rod 540 provided on the side wall of the third support plate 520, the telescopic end of the pneumatic rod 540 penetratingly connected to the interior of the third support plate 520, an extension plate 560 connected to the telescopic end of the pneumatic rod 540, the extension plate 560 slidably connected to the interior of the guide rail 530, a suction component 570 provided on the side of the extension plate 560 away from the guide rail 530, a first guide rod 550 connected to one side of the extension plate 560, and the first guide rod 550 penetratingly connected to the interior of the third support plate 520.

[0058] The material handling assembly 500 drives the extension plate 560 to slide along the guide rail 530 via the pneumatic rod 540. The first guide rod 550 assists in guiding the material handling component 570 to move smoothly without shaking during the extension and retraction process. The extension and retraction length can be adjusted according to the distance between the test platform 100 and the calibration platform 620 to adapt to different test scenarios. It also allows the material handling component 570 to extend and retract independently, reducing the overall translation frequency of the material handling assembly 500. This reduces the positional deviation caused by multiple translation frequencies and improves the accuracy and stability of the motherboard transfer.

[0059] In this embodiment, the suction component 570 includes an air pump 571 disposed on the top surface of the extended plate 560 away from the guide rail 530. An air guide pipe 572 is connected through the bottom surface of the air pump 571, and a vacuum box 573 is connected through the bottom end of the air guide pipe 572. A suction nozzle 574 is elastically slidably connected to the bottom surface of the vacuum box 573. The interior of the suction nozzle 574 is connected to the interior of the vacuum box 573. Four suction nozzles 574 are arranged in a rectangular pattern, and a fixing block 5741 is fixed between two adjacent suction nozzles 574. The suction component 570 uses four suction nozzles 574 arranged in a rectangular pattern, utilizing two suction nozzles 574 simultaneously to grip the main board, increasing the adsorption area, ensuring uniform force on the main board, and guaranteeing the stability of the main board transfer. The elastically slidably connected suction nozzles 574 can move on the vacuum box 573, preventing relative friction between the suction nozzles 574 and the main board when the vacuum box 573 moves the suction nozzles 574, thereby ensuring the integrity of the main board.

[0060] In this embodiment, the fixed load component 230 includes a test plate 231 disposed on the top surface of the first support plate 220. A fixed push component 233 is disposed through the top surface of the test plate 231. Two transfer areas and two test areas are disposed on the top surface of the test area of ​​the test plate 231. Two L-shaped positioning blocks 232 are mirrored on the top surface of the test area of ​​the test plate 231. Two pushing areas are disposed on the top of the fixed push component 233. One side of the fixed push component 233 is pushed and translated by the upper test component 260, so that the pushing area is translated from the transfer area of ​​the test plate 231 to the test area.

[0061] The test carrier board 231 has two transfer areas and two test areas. Together with the push component 233, it can realize parallel operation of material picking and testing. By placing the motherboard to be tested in the transfer area, the material picking component 500 only needs to move linearly to pick up and place the motherboard, which improves the efficiency of picking up and placing motherboards by the material picking component 500. When placing the motherboard in the transfer area, the push component 233 is pushed by the upper test component 260 to automatically push the motherboard from the transfer area to the test area without additional driving, which improves the convenience of motherboard testing.

[0062] In this embodiment, the fixed-push component 233 includes two insert plates 237 slidably inserted into the test carrier plate 231. A sloping push plate 234 is fixedly spanned between the side walls of the two insert plates 237. The top surface of the sloping push plate 234 is a sloping structure. The sloping push plate 234 is pushed and translated into the test carrier plate 231 by the upper test component 260. Two insertion posts 235 are fixed on one side of the sloping push plate 234. The insertion posts 235 are inserted into the test carrier plate 231. One end of the insertion post 235... A first spring 236 is connected to the interior of the test carrier plate 231. Two sets of fixed-push groups are fixed on the top surface of the insert plate 237. The fixed-push groups include a first fixed-push block 238 and a second fixed-push block 239 fixed on the top surface of the insert plate 237. The first fixed-push block 238 and the second fixed-push block 239 are slidably connected to the top surface of the test carrier plate 231. The first fixed-push block 238 and the second fixed-push block 239 are spaced apart and a pushing area is formed between them. The width of the pushing area is greater than the width of the transfer area and the test area.

[0063] When the upper component 260 descends, the inclined push plate 234 is pushed and translated by the inclined surface, which drives the insert plate 237 and the fixed push block to push the main board. The first spring 236 buffers the pushing force to avoid rigid impact. After pushing, the first spring 236 resets and drives the fixed push block back to its position without manual intervention. The first fixed push block 238 and the second fixed push block 239 form a pushing area, which is wider than the transfer area and the test area to ensure a smooth transition of the main board.

[0064] In this embodiment, the test carrier plate 231 has two picking slots 2311 on its top surface, and the two picking slots 2311 are respectively set inside the two transfer areas of the test carrier plate 231. The picking slots 2311 are set in the transfer areas of the test carrier plate 231. When the motherboard is placed, its edge is suspended above the picking slots 2311, which reduces the contact area with the carrier plate, reduces the adsorption and adhesion, and facilitates the separation of the picking component 500. During manual re-inspection, the motherboard can be directly picked out from the picking slots 2311 without prying, which is convenient.

[0065] In this embodiment, a plasma air outlet channel 2312 is provided through the bottom surface of the material picking tank 2311; the bottom surface of the material picking tank 2311 is provided with a plasma air outlet channel 2312, and an external plasma fan blows plasma air onto the motherboard surface through the channel, so that dust removal and static electricity removal are completed simultaneously during the process of picking up and placing the motherboard by the material picking component 500, without the need for additional procedures.

[0066] In this embodiment, the upper testing component 260 includes a fixed frame 261 fixed to the side wall of the first electric slider 250. A slanted push frame 265 is fixed to the bottom surface of the fixed frame 261. The inner wall of the slanted push frame 265 is provided with a slanted structure. The slanted structure of the slanted push frame 265 is arranged parallel to the slanted structure of the slanted push plate 234. The slanted push plate 234 is pushed and translated into the test plate 231 through the slanted push frame 265. A pressure testing plate 264 is inserted and fixed inside the fixed frame 261. The pressure testing plate 264 is provided with a through hole structure inside. A first fixing frame 262 is fixed to the inner wall of the fixed frame 261. Two scanning guns 263 are provided on one side of the first fixing frame 262. The scanning guns 263 are located at the top of the through hole structure of the pressure testing plate 264. The two scanning guns 263 are respectively located at the top of the two test areas.

[0067] The upper test component 260 integrates pressure testing and scanning functions. The pressure test board 264 is attached to the motherboard to realize functional testing. The two scanning guns 263 in the fixed frame 261 correspond to two test areas and scan the motherboard information synchronously without the need for additional equipment. The inclined surface of the inner wall of the inclined push frame 265 is parallel to the inclined surface of the inclined push plate 234, ensuring that the inclined push plate 234 moves stably without deviation when pushed.

[0068] In this embodiment, the transfer calibration component 600 includes a second pad 610 fixed to the top surface of the test bench 100. A calibration platform 620 is fixed to the top surface of the second pad 610. A liftable feeding component 630 is connected through the top surface of the calibration platform 620. Two calibration areas are provided on the top of the feeding component 630. The two sides of the calibration areas are through structures. Four calibration blocks 621 are fixed in a rectangular distribution on the top surface of the calibration platform 620. The calibration areas are raised and lowered by the feeding component 630 to two states.

[0069] In the first state, the calibration area is lowered and positioned between the two calibration blocks 621 so that the two calibration blocks 621 stop on both sides of the through structure of the calibration area, which is used to position the motherboard between the calibration area and the two calibration blocks 621.

[0070] In the second state, the correction zone is raised and set on the top of the two correction blocks 621, and the correction zone and the transfer zone are located on the same horizontal center line.

[0071] The transfer and calibration component 600 achieves precise calibration of the main board through the calibration block 621 and the feeding component 630. The calibration area of ​​the feeding component 630 is open on both sides, the calibration block 621 stops both sides of the main board, and the limiting plate 636 guides, improving the accuracy of the calibration and positioning of the transfer plate. The feeding component 630 can be raised and lowered. After calibration, it rises to the same horizontal line as the transfer area and releases the stop of the calibration block 621, which facilitates the material picking component 500 to move and pick up the material. No additional lifting mechanism is required, making the operation efficient and convenient.

[0072] In this embodiment, the feeding component 630 includes two lifting plates 632 slidably inserted into the calibration platform 620. An inclined top plate 631 is fixed across the sidewalls of the two lifting plates 632. Two correction grooves 635 are fixed across the top surfaces of the two lifting plates 632. The correction grooves 635 are slidably inserted into the top surface of the calibration platform 620 and are positioned between the two correction blocks 621. Limiting plates 636 are inclinedly fixed to the top surfaces of both sides of the correction grooves 635. The two limiting plates 636 are mirror images of the vertical centerline of the correction grooves 635. The top surface of the correction grooves 635 and the two limiting plates 636 are aligned. The area between 36 is fixed to form a calibration zone. Two second guide rods 633 are fixed on the top surface of the lifting plate 632. The second guide rods 633 are connected through to the top surface of the calibration platform 620. A second spring 634 is sleeved on the outer wall of the second guide rod 633. The bottom end of the second spring 634 is connected to the top surface of the calibration platform 620. A connecting plate 637 is fixed across between the top ends of the two second guide rods 633. The connecting plate 637 is set between the two calibration slots 635. Two stops 638 are fixed on the top surface of the connecting plate 637. The connecting plate 637 is pushed up by the second guide rods 633 so that the stops 638 rise to stop the fixing block 5741.

[0073] The suction component 570 also includes two second fixing frames 575 connected to one side of the vacuum box 573. The outer wall of the second fixing frame 575 is rotatably connected to a first roller 576, and the inner wall of the second fixing frame 575 is rotatably connected to a second roller 577.

[0074] The bottom surface of the inclined top plate 631 is provided with two inclined structures in a stepped distribution. The inclined top plate 631 is pushed upward along the two inclined structures by the second roller 577.

[0075] The feeding component 630 is linked to the picking component 500 via the second roller 577, the inclined top plate 631, and the second roller 577. When the picking component 500 moves horizontally, the second roller 577 pushes the inclined top plate 631 upward, which in turn drives the lifting plate 632 and the correction groove 635 upward, releasing the positioning of the main board by the correction block 621, facilitating the transfer of the main board. This eliminates the need for a motor drive, resulting in a fast response and improved work efficiency. The second roller 577 rolls along the two inclined surfaces to push the inclined top plate 631 upward in a stepped manner, ensuring stable and non-deviation-free upward movement of the main board and guaranteeing its positioning accuracy. The second spring 634 assists in the descent. This achieves a stepped reset, preventing friction between the motherboard and the calibration tank 635. The stop block 638 rises with the connecting plate 637 to stop the fixing block 5741, allowing the suction nozzle 574 to slide on the vacuum box 573 and remain positioned at the top of the calibration tank 635. At the same time, the calibration tank 635 rises until the motherboard and the suction nozzle 574 are in contact, thereby preventing relative friction between the suction nozzle 574 and the motherboard and improving the safety and stability of the suction nozzle 574 in picking up the motherboard. The first roller 576 rolls on the pad as the material picking component 500 moves, reducing bumps and ensuring stable motherboard adsorption.

[0076] In this embodiment, the transfer component 400 includes a second slide rail 410 horizontally fixed to one side of the bracket 300, a second electric slider 420 slidably connected to one side of the second slide rail 410, a third slide rail 430 vertically fixed to the side wall of the second electric slider 420, a third electric slider 440 slidably connected to one side of the third slide rail 430, and the side wall of the third electric slider 440 fixedly connected to the second support plate 510. By setting the second slide rail 410 and the third slide rail 430 for guidance, and by preset the stroke of the second electric slider 420 and the position of the third electric slider 440, the stability and accuracy of the overall movement of the material handling component 500 are ensured.

[0077] Specifically, according to Figures 1-12 As shown, the third electric slider 440 is first started to lift and lower, the overall picking height of the picking component 500 is preset, the stroke of the second electric slider 420 is set, and after the second electric slider 420 moves once, the non-extended suction component 570 is moved to the top of the test carrier plate 231, and the four suction nozzles 574 reach the top of the two pushing areas of the test carrier plate 231 respectively. Then the pneumatic rod 540 is started to push the extension plate 560 to extend and move, so that the suction component 574 extends and moves to the top of the calibration table 620, and the four suction nozzles 574 reach the top of the two calibration areas on the calibration table 620 respectively, completing the positioning calibration of the suction nozzles 574.

[0078] Two motherboards to be tested are placed inside two calibration slots 635 respectively. Guided by the sliding limit plate 636 and the stops of the two calibration blocks 621, the motherboards are calibrated and placed within the calibration area. Then, the second electric slider 420 is activated to move the material handling assembly 500 horizontally. Simultaneously, the pneumatic rod 540 is activated to push the suction nozzle 574 to move rapidly horizontally. At the same time, the external plasma fan is activated, blowing plasma air through the plasma outlet channel 2312 to the top of the material handling slot 2311. As the suction nozzle 574 moves past the top of the material handling slot 2311, it is cleaned of dust and static electricity by the plasma air. The suction nozzle 574 moves towards the top of the calibration slot 635, while the first roller 576 rolls sequentially on the first pad 210 and the second pad 610. Roller 577 pushes inclined top plate 631 to rise in a stepped manner. Two lifting plates 632 rise inside calibration platform 620. Second guide rod 633 rises and stretches second spring 634. Lifting plate 632 drives two calibration slots 635 to rise. Calibration slots 635 drive the calibrated main plate to rise and make the main plate extend from between the two calibration blocks 621. At the same time, second guide rod 633 drives connecting plate 637 to rise. Stop block 638 rises with connecting plate 637 to stop fixing block 5741, so that suction nozzle 574 slides on vacuum box 573 and remains positioned at the top of calibration slot 635. Second roller 577 rolls further along inclined surface to inclined top plate 631, so that calibration slot 635 rises further until main plate and suction nozzle 574 are in contact.

[0079] Restart the air pump 571, and the suction nozzle 574 sucks up the main board through negative pressure. Then start the pneumatic rod 540 to pull the extension plate 560, and pull the suction component 570, which has two main boards, back to the top of the test carrier plate 231. At the same time, during the separation of the second roller 577 from the inclined plate 631, the inclined plate 631 descends in a stepped manner to avoid friction between the main board and the calibration tank 635 during the movement of the main board. Until the suction nozzle 574 moves the main board horizontally to the transfer area of ​​the test carrier plate 231, the plasma air blown out by the plasma outlet channel 2312 will remove dust and static electricity from the main board. Then turn off the air pump 571, release the main board on the test carrier plate 231, and start the second electric slider 420 to reset the material picking component 500 as a whole.

[0080] Then, the first electric slider 250 is activated, pushing the fixed frame 261 down. The inclined push frame 265 is also lowered and pushes the inclined push plate 234 using the inclined surface. The inclined push plate 234 moves towards the test carrier plate 231. The insert post 235 is inserted into the test carrier plate 231 and compresses the first spring 236. The inclined push plate 234 simultaneously pushes the two insert plates 237 to move. The insert plates 237 drive the first fixed push block 238 and the second fixed push block 239 to move. The first fixed push block 238 pushes the main board from the transfer area to the test area. The main board moves from the top of the material pick-up slot 2311 to the plane position of the test carrier plate 231, ensuring that the main board is placed stably and improving the stability of the main board test. The main board is positioned by the positioning block 232 until the pressure test plate 264 is in contact with the test carrier plate 231 to test the performance of the main board. The scanner 263 is then turned on to scan and test the main board.

[0081] After the mainboard is inspected, the first electric slider 250 pushes the upper test component 260 to rise as a whole, the inclined push frame 265 rises and separates from the inclined push plate 234, the compressed first spring 236 pushes out the insert 235, the inclined push plate 234 drives the two insert plates 237 to move horizontally, the second fixed push block 239 first moves horizontally to fit with the mainboard, and then continues to move to push the mainboard to the transfer area, so that the mainboard returns to the top of the material pick-up slot 2311 and pushes the mainboard out between the two positioning blocks 232;

[0082] Start the second electric slider 420 to move the suction nozzle 574 to the top of the main board, start the air pump 571, and blow out plasma air in conjunction with the plasma air outlet channel 2312. Use the air force to help the main board and the suction nozzle 574 fit together, ensuring that the suction nozzle 574 firmly sucks the main board. Then move the second electric slider 420 back to its original position, transfer the main board and release it onto the feeding tray 900 to complete the test of the main board.

[0083] Staff can also use their gloved fingers to directly pick up the motherboard from the material picker 2311 and take it out for sampling re-inspection. At the same time, the plasma air blown out from the plasma air outlet 2312 removes static electricity from the fingers to ensure the accuracy of the sampling re-inspection of the motherboard.

[0084] Throughout the entire process of picking up, transferring, and testing the motherboard, the 574 nozzle only needs to be moved horizontally, avoiding lifting and lowering of the motherboard. This prevents the impact of friction, collision, and vibration that may occur during picking up and putting down materials on the motherboard, thus ensuring the stability of the motherboard structure and the accuracy of the test.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A motherboard automated functional test machine, characterized by: Including test platform (100), the top of the test platform (100) is fixed with a plurality of supports (700), a plurality of supports (700) are arranged between the top of the test platform (100), the top of the test platform (100) is fixed with a support (300), one side of the support (300) is connected with a transfer assembly (400), one side of the transfer assembly (400) is connected with a telescopic material taking assembly (500), the top of the test platform (100) is provided with a test mechanism (200) for detecting the mainboard, and the top of the test platform (100) is provided with a transfer correction assembly (600) for positioning the mainboard; The test mechanism (200) comprises a first backing plate (210) fixed to the top of the test platform (100), a first support plate (220) is fixed to the top of the first backing plate (210), a positioning assembly (230) for placing the mainboard is arranged on the top of the first support plate (220), a first sliding rail (240) is fixed to one side of the positioning assembly (230), a first electric sliding block (250) is slidably connected to one side of the first sliding rail (240), an upper test assembly (260) is connected to the side wall of the first electric sliding block (250), and the upper test assembly (260) is movably arranged in two states by the first electric sliding block (250): In the first state, the upper test assembly (260) rises and is located on the top of the positioning assembly (230), the material taking assembly (500) is pushed to be arranged on the top of the positioning assembly (230) by the transfer assembly (400), and the material taking assembly (500) is arranged on the top of the transfer correction assembly (600) by extension, for taking and placing the mainboard on the positioning assembly (230); In the second state, the upper test assembly (260) is lowered and is arranged on the top of the positioning assembly (230), for detecting the function of the mainboard; The material taking assembly (500) comprises a second support plate (510) fixedly connected to one side of the transfer assembly (400), a third support plate (520) is fixed to the top of the second support plate (510), a guide rail (530) is fixed to the side wall of the second support plate (510), a pneumatic rod (540) is arranged on the side wall of the third support plate (520), the telescopic end of the pneumatic rod (540) penetrates into the third support plate (520), the telescopic end of the pneumatic rod (540) is connected with an extension plate (560), the extension plate (560) is slidably connected to the inside of the guide rail (530), the extension plate (560) is provided with a material suction part (570) away from one end of the guide rail (530), the extension plate (560) is fixed with a vertical plate close to one end of the guide rail (530), the vertical plate is connected with a first guide rod (550), and the first guide rod (550) penetrates into the third support plate (520).

2. The mainboard automatic function test machine according to claim 1, characterized in that: The suction component (570) comprises an air pump (571) arranged on the top surface of the outer extension plate (560) away from the guide rail, the bottom surface of the air pump (571) is connected with a gas guide pipe (572) in a penetrating mode, the bottom end of the gas guide pipe (572) is connected with a vacuum box (573) in a penetrating mode, the bottom surface of the vacuum box (573) is connected with a suction nozzle (574) in an elastic sliding mode, the suction nozzle (574) is connected with the vacuum box (573) in a penetrating mode, and the suction nozzle (574) is arranged in a rectangular mode and has four suction nozzles (574), and the two adjacent suction nozzles (574) are fixedly connected with a fixed block (5741).

3. The mainboard automatic functional test machine according to claim 2, characterized in that: The test carrier plate (231) top surface is provided with two transfer areas and two test areas, the test area top surface of the test carrier plate (231) is mirror-symmetrically provided with two L-shaped positioning blocks (232), the top of the test carrier plate (231) is provided with two pushing areas, and the test carrier plate (231) is pushed and translated by the upper test assembly (260) on one side to make the pushing area translate from the transfer area to the test area of the test carrier plate (231).

4. The automatic function test machine for a mainboard according to claim 3, characterized in that: The test carrier plate (231) top surface is provided with two transfer areas and two test areas, the test area top surface of the test carrier plate (231) is mirror-symmetrically provided with two L-shaped positioning blocks (232), the top of the test carrier plate (231) is provided with two pushing areas, and the test carrier plate (231) is pushed and translated by the upper test assembly (260) on one side to make the pushing area translate from the transfer area to the test area of the test carrier plate (231).

5. The automatic functional test machine for a motherboard according to claim 4, wherein: The test carrier plate (231) top surface is provided with two transfer areas and two test areas, the test area top surface of the test carrier plate (231) is mirror-symmetrically provided with two L-shaped positioning blocks (232), the top of the test carrier plate (231) is provided with two pushing areas, and the test carrier plate (231) is pushed and translated by the upper test assembly (260) on one side to make the pushing area translate from the transfer area to the test area of the test carrier plate (231).

6. The automatic function test machine for a mainboard according to claim 5, characterized in that: The test carrier plate (231) top surface is provided with two transfer areas and two test areas, the test area top surface of the test carrier plate (231) is mirror-symmetrically provided with two L-shaped positioning blocks (232), the top of the test carrier plate (231) is provided with two pushing areas, and the test carrier plate (231) is pushed and translated by the upper test assembly (260) on one side to make the pushing area translate from the transfer area to the test area of the test carrier plate (231). The test carrier plate (231) top surface is provided with two transfer areas and two test areas, the test area top surface of the test carrier plate (231) is mirror-symmetrically provided with two L-shaped positioning blocks (232), the top of the test carrier plate (231) is provided with two pushing areas, and the test carrier plate (231) is pushed and translated by the upper test assembly (260) on one side to make the pushing area translate from the transfer area to the test area of the test carrier plate (231).

7. The automatic function test machine for a mainboard according to claim 4, characterized in that: The upper measuring assembly (260) comprises a fixed frame (261) fixed to the side wall of the first electric sliding block (250), the bottom surface of the fixed frame (261) is fixed with an inclined pushing frame (265), the inner wall of the inclined pushing frame (265) is provided with an inclined surface structure, the inclined surface structure of the inclined pushing frame (265) is arranged in parallel with the inclined surface structure of the inclined pushing plate (234), the inclined pushing plate (234) is pushed to translate and is inserted into the inside of the test carrier plate (231) through the inclined pushing frame (265), the inside of the fixed frame (261) is inserted and fixed with a pressure measuring plate (264), the inside of the pressure measuring plate (264) is provided with a through hole structure, the inner wall of the fixed frame (261) is fixed with a first fixed frame (262), the first fixed frame (262) is provided with two scanning guns (263) on one side, the scanning guns (263) are arranged on the top of the through hole structure of the pressure measuring plate (264), and the two scanning guns (263) are arranged on the top of the two test areas respectively.

8. The automatic function test machine for a mainboard according to claim 3, characterized in that: The transfer correction assembly (600) comprises a second backing plate (610) fixed to the top surface of the test table (100), the top surface of the second backing plate (610) is fixed with a calibration table (620), the top surface of the calibration table (620) is connected with a liftable discharging component (630) in a penetrating mode, the top of the discharging component (630) is provided with two correction areas, the two correction areas are provided with a penetrating structure on the two sides, the top surface of the calibration table (620) is fixed with four correction blocks (621) in a rectangular distribution, and the correction areas are provided with two states in the lifting mode of the discharging component (630); In the first state, the correction areas are arranged between the two correction blocks (621) in a descending mode, so that the two correction blocks (621) are stopped on the two sides of the penetrating structure of the correction areas, and the main board is positioned and placed between the correction areas and the two correction blocks (621); In the second state, the correction areas are arranged on the top of the two correction blocks (621) in a rising mode, and the correction areas and the transfer areas are located on the same horizontal center line.

9. The mainboard automatic functional test machine according to claim 8, characterized in that: The feeding component (630) comprises two lifting plates (632) slidingly inserted into the calibration table (620), a slanting top plate (631) is fixed across the sidewalls between the two lifting plates (632), two correction groove bodies (635) are fixed across the top surfaces of the two lifting plates (632), the correction groove bodies (635) are slidingly inserted into the top surface of the calibration table (620), the correction groove bodies (635) are arranged between the two correction blocks (621), the top surfaces of the two sides of the correction groove bodies (635) are both fixedly inclined with the limiting plates (636), the two limiting plates (636) are arranged in mirror image about the vertical middle line of the correction groove bodies (635), the top surface between the correction groove bodies (635) and the two limiting plates (636) is fixed to form a correction area, the top surface of the lifting plate (632) is fixed with two second guide rods (633), the second guide rods (633) are connected to the top surface of the calibration table (620) in penetration, the outer wall of the second guide rod (633) is sleeved with the second spring (634), the bottom end of the second spring (634) is connected to the top surface of the calibration table (620), the top ends between the two second guide rods (633) are fixed with the connecting plate (637), the connecting plate (637) is arranged between the two correction groove bodies (635), the top surface of the connecting plate (637) is fixed with the two stop blocks (638), the connecting plate (637) is pushed up through the second guide rod (633) to make the stop blocks (638) rise to stop the fixed block (5741); The feeding component (570) further comprises two second fixing frames (575) connected to one side of the vacuum box (573), the outer wall of the second fixing frame (575) is rotatably connected with the first roller (576), and the inner wall of the second fixing frame (575) is rotatably connected with the second roller (577); The bottom surface of the slanting top plate (631) is arranged with two inclined surface structures in a stepped distribution, and the slanting top plate (631) is rolled and pushed up along the two inclined surface structures through the second roller (577).

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