Substrate mapping apparatus and method thereof

Abstract

A semiconductor wafer mapping apparatus and method, the apparatus comprising: a frame forming a wafer loading opening in communication with a loading station for a substrate carrier arranged to hold more than one wafer vertically distributed in the substrate carrier for loading through the wafer loading opening; a movable arm movably mounted to the frame so as to move relative to the wafer loading opening, and having at least one end effector movably mounted to the movable arm so as to load the wafer from the substrate carrier through the wafer loading opening; an image acquisition system comprising an array of cameras arranged on a common support, and each camera is fixed relative to the common support, the common support being stationary relative to each camera of the array of cameras, where each respective camera is positioned with a field of view, the field of view is arranged to be viewed through the wafer loading opening with the common support positioned by the movable arm.

Description

[0001] This application is a divisional application of the invention patent application filed on June 30, 2021, with application number 202180053513.7 and title "Substrate Mapping Apparatus and Method Thereof". Technical Field

[0002] The exemplary embodiments generally relate to semiconductor manufacturing equipment, and more specifically to the identification of substrates in semiconductor manufacturing equipment. Background Technology

[0003] There are various locations within a semiconductor manufacturing apparatus where a single substrate or a stack of substrates (such as, for example, wafers, markers, film frames, trays, etc.) can be held. The physical state of the substrate at each of these locations can be one of many states, including but not limited to absence, presence, double trenches, intersecting trenches, and displacement / tilt. Typically, the physical state of each substrate at its holding location is determined (or mapped) to facilitate substrate handling within the semiconductor manufacturing apparatus.

[0004] For example, one example of substrate mapping for a single substrate on a robot end effector involves vacuum suction, where a vacuum chuck contacts the back side of the substrate. The vacuum pressure level of the chuck determines the substrate state—whether it is present or absent in this case—by opening a valve on the vacuum line of the end effector (vacuum suction does not detect substrate displacement). Vacuum suction can lead to erroneous readings when the contact between the substrate and the vacuum chuck is not tightly sealed. Furthermore, there is a time interval of several hundred milliseconds between activating the vacuum valve and establishing a steady-state vacuum pressure level to determine the presence of a substrate on the end effector. As can be appreciated, several hundred milliseconds across multiple wafers negatively impact substrate throughput through semiconductor manufacturing equipment.

[0005] Typically, beam-cutting techniques are employed to map substrate stacks (with gaps between each of the stacked substrates) held at a loadport, such as in a substrate cassette or carrier. Here, a beam extends from a transmitter to a receiver in a direction parallel to the substrate plane. The transmitter and receiver can be referred to as beam-through sensors. The beam-through sensor moves up or down along one side of the substrate stack such that the beam engages with and is disconnected by the substrate (a break in the beam indicates the presence of the substrate). While beam-cutting techniques can detect many of the substrate states mentioned above, they are sensitive to the angle of the beam relative to the substrate plane, making precise alignment of the beam with the substrate plane desirable. Extending the beam-through sensor to the substrate holding position and retracting it from the substrate holding position takes at least several seconds, and the correlation of beam disconnection and recovery events for each substrate position typically requires controlled and slow motion profiles of the beam-through sensor, all of which negatively impact substrate throughput.

[0006] Both vacuum suction and beam-cutting techniques involve complexities in mechanical design. For example, vacuum suction employs a vacuum supply for substrate handling equipment and involves wiring vacuum lines to end effectors via substrate transport arms. Beam-cutting involves the extension and retraction of moving parts and beam sensors. This increased complexity raises the cost of manufacturing and maintaining semiconductor processing equipment.

[0007] In addition to the above, in advanced semiconductor manufacturing technologies, substrates are provided with varying thicknesses. These varying substrate thicknesses pose challenges to beam-breaking techniques in determining the map where the substrate remains. For example, a thin substrate may have a thickness that does not completely block the beam, leading to misidentification of a non-existent substrate.

[0008] Imaging systems are also used for substrate mapping; however, in conventional image mapping systems, such as those that image the substrate through a loading port opening, the image of the substrate facing the top (or bottom) of the substrate stack may be distorted, or some substrates may be obstructed by the view of the substrates located above or below. There may also be problems with light reflection from the interior of the substrate and / or substrate carrier, which may obscure substrate detection.

[0009] Furthermore, in semiconductor manufacturing facilities, various types of substrates (as described above) are transported via substrate transporters (e.g., robots) equipped with end effectors, with the substrates resting on the end effectors for transport. To transport the substrates, the substrate transporter extends the end effector into a small space below (or, for some applications, above) the substrate (e.g., on a substrate carrier, process module, or other suitable substrate holding surface) to pick it up. When the substrate is flat, there is no problem using an end effector to pick it up; however, as described above, in advanced semiconductor manufacturing technologies, substrates are provided with varying thicknesses and may not be flat. For example, in advanced packaging, thinned substrates, reconstructed substrates, and fan-out substrates may be bent / warped by several millimeters. This warping can prevent the end effector from extending into the small space below (or above) the substrate to pick it up. Summary of the Invention

[0010] According to one or more aspects of this disclosure, a semiconductor wafer mapping apparatus includes: a frame forming a wafer loading opening communicating with a loading station for a substrate carrier, the substrate carrier being configured to hold more than one wafer vertically distributed within the substrate carrier for loading through the wafer loading opening; a movable arm movably mounted to the frame for movement relative to the wafer loading opening, and having at least one end effector movably mounted to the movable arm for loading a wafer from the substrate carrier through the wafer loading opening; and an image acquisition system including a camera array arranged on a common support, each camera being fixed relative to the common support, the common support being stationary relative to each camera in the camera array, wherein each respective camera is positioned with a field of view configured to observe different individual portions of the substrate carrier having wafer trenches for holding at least one of the more than one wafers, through the wafer loading opening when the common support is positioned at a common position by the movable arm. The distinct individual portions are separate from and distinct from the portions of the substrate carrier with different wafer slots, the distinct wafer slots being used to hold wafers different from the at least one wafer as observed by each other camera when the common support is in a common position, and to image each wafer held in the substrate carrier by a camera array when the common support is in a common position; and an illumination source connected to the common support, configured to illuminate the outer edge of each wafer in the substrate carrier through a wafer loading opening when the common support is in a common position, the edges marking the upper and lower edge boundaries of the outer edge of the wafer, the illumination source being positioned relative to each camera such that the outer edge directs the edge illumination reflected from the illumination source toward each camera, and optically blanks the background reflected light observed by each camera through the wafer loading opening when the common support is in a common position at the upper and lower edge boundaries; wherein the outer edge of the wafer is defined with significant (in relief) image contrast using the upper and lower edge boundaries, the image contrast being formed by and between the edge reflections registered by each camera and the optically blanked background, to perform edge detection on each wafer in the substrate carrier when the common support is in a common position.

[0011] According to one or more aspects of this disclosure, each different individual portion observed by a respective camera of a camera array has a different set of wafer slots corresponding to the individual portion and the respective camera, which are vertically distributed at a predetermined reference height observed by the respective camera.

[0012] According to one or more aspects of this disclosure, the semiconductor wafer mapping apparatus further includes a controller communicatively coupled to a movable arm to move the movable arm relative to a frame and position a common support at a common location.

[0013] According to one or more aspects of this disclosure, a movable arm is the arm of a wafer transport robot having an end effector for loading a wafer into a substrate carrier through a wafer loading opening and unloading a wafer from the substrate carrier.

[0014] According to one or more aspects of this disclosure, the illumination source is positioned relative to a respective camera such that optical blanking is performed on light reflected from the flat surface of the wafer inserted in the substrate and each other wafer in each image captured by the respective camera of a different individual portion of the substrate carrier.

[0015] According to one or more aspects of the present invention, a semiconductor wafer mapping apparatus includes: a frame forming a wafer loading opening communicating with a loading station for a substrate carrier, the substrate carrier being configured to hold more than one wafer vertically distributed within the substrate carrier for loading through the wafer loading opening; a movable arm movably mounted to the frame for movement relative to the wafer loading opening, and having at least one end effector movably mounted to the movable arm for loading a wafer from the substrate carrier through the wafer loading opening; and an image acquisition system including a camera array arranged on a common support, wherein each camera is fixed relative to the common support, the common support being stationary relative to each camera in the camera array, wherein each respective camera... The positioning has a field of view, which is configured to observe corresponding different individual portions of the substrate carrier through a wafer loading opening when the common support is positioned at a common location by a movable arm. Each corresponding different individual portion has at least one corresponding wafer slot that is different from at least one other wafer slot in each other corresponding different individual portion of the substrate carrier. Each portion of the corresponding different individual portion is observed from the common location by means of a corresponding camera through the wafer loading opening, such that the image captured by each corresponding camera of the corresponding different individual portion excludes each other different individual portion observed by each other corresponding camera. Each wafer in each slot of the substrate carrier is imaged by a camera array when the common support is in the common location.

[0016] According to one or more aspects of this disclosure, the semiconductor wafer mapping apparatus further includes an illumination source connected to a common support, the illumination source being configured to illuminate the outer edge of each wafer in the substrate carrier through a wafer loading opening when the common support is in a common location, the outer edge marking the upper edge boundary and lower edge boundary of the outer edge of the wafer, wherein the illumination source is positioned relative to each respective camera, and the images of corresponding individual different portions captured by each respective camera are configured such that the outer edge directs the edge illumination reflected from the illumination source toward the respective camera, and optically blanks the background reflected light in the images of the individual different portions captured by the respective cameras through the wafer loading opening at the upper edge boundary and lower edge boundary when the common support is in a common location.

[0017] According to one or more aspects of this disclosure, the outer edge of a wafer is significantly defined by an upper edge boundary and a lower edge boundary with image contrast, the image contrast being formed by edge reflections registered by each respective camera and background optically blanked and therebetween, to perform edge detection on each wafer in a substrate carrier with a common support located in a common position.

[0018] According to one or more aspects of this disclosure, each of the corresponding different individual parts is imaged by only one corresponding camera in the array.

[0019] According to one or more aspects of this disclosure, each wafer in at least one wafer held in a corresponding wafer bay in a corresponding different separate part is imaged by only one of the corresponding cameras in a camera array.

[0020] According to one or more aspects of this disclosure, the semiconductor wafer mapping apparatus further includes a controller communicatively coupled to a camera array and programmed with a corresponding camera calibration, each corresponding camera calibration having a baseline image of the corresponding camera that differs from the baseline image of each other corresponding camera, the baseline image defining predetermined baseline characteristics for each wafer in at least one of the at least one corresponding slot in the corresponding individually distinct portion imaged by the corresponding camera.

[0021] According to one or more aspects of this disclosure, a controller is configured to register the calibration of each corresponding camera, wherein a calibration wafer characterizing the baseline image of the corresponding camera is disposed in each of the at least one corresponding slot in a corresponding separate portion, and imaging is performed using the corresponding camera, which defines the baseline image of the corresponding camera registered by the controller.

[0022] According to one or more aspects of this disclosure, a method includes: providing a frame having a wafer loading opening communicating with a loading station for a substrate carrier, the substrate carrier being configured to hold more than one wafer vertically distributed within the substrate carrier for loading through the wafer loading opening; providing a movable arm movably mounted to the frame for movement relative to the wafer loading opening and having at least one end effector movably mounted to the movable arm for loading a wafer from the substrate carrier through the wafer loading opening; providing an image acquisition system including a camera array arranged on a common support, each camera being fixed relative to the common support, the common support being stationary relative to each camera of the camera array; moving the movable arm such that each corresponding camera is positioned with a field of view, the field of view being configured to observe different separate portions of the substrate carrier having wafer slots for holding at least one of the more than one wafers through the wafer loading opening when the common support is positioned at a common position by the movable arm, the different separate portions being separate from and different from portions of the substrate carrier having different wafer slots, the different wafer slots being separate from and different from portions of the substrate carrier having different wafer slots. A circular groove is used to hold a wafer different from the at least one wafer as observed by each other camera when the common support is in a common position, and to image each wafer held in the substrate carrier by a camera array when the common support is in a common position; and to illuminate the outer edge of each wafer in the substrate carrier through a wafer loading opening using an illumination source connected to the common support when the common support is in a common position, the edge marking the upper and lower edge boundaries of the outer edge of the wafer, the illumination source being positioned relative to each camera such that the outer edge directs the edge illumination reflected from the illumination source toward each camera, and optically blanking the background reflected light observed by each camera through the wafer loading opening when the common support is in a common position at the upper and lower edge boundaries; wherein the outer edge of the wafer is significantly defined by the upper and lower edge boundaries with image contrast, the image contrast being formed by and between the edge reflections registered by each camera and the optically blanked background, to perform edge detection for each wafer in the substrate carrier when the common support is in a common position.

[0023] According to one or more aspects of this disclosure, each different individual portion observed by a respective camera of a camera array has a different set of wafer slots corresponding to the individual portion and the respective camera, which are vertically distributed at a predetermined reference height observed by the respective camera.

[0024] According to one or more aspects of this disclosure, the method further includes using controller commands communicatively coupled to the movable arm to move the movable arm relative to the frame in order to position the common support at a common location.

[0025] According to one or more aspects of this disclosure, a movable arm is the arm of a wafer transport robot having an end effector for loading a wafer into a substrate carrier through a wafer loading opening and unloading a wafer from the substrate carrier.

[0026] According to one or more aspects of this disclosure, the illumination source is positioned relative to a respective camera such that optical blanking is performed on light reflected from the flat surface of the wafer inserted in the substrate and each other wafer in each image captured by the respective camera of a different individual portion of the substrate carrier. Attached Figure Description

[0027] The foregoing aspects and other features of the disclosed embodiments are explained in the following description taken in conjunction with the accompanying drawings, wherein:

[0028] Figure 1A , 1B 1C is an exemplary substrate processing apparatus incorporated into aspects of this disclosure;

[0029] Figure 2A , 2B 2C is based on aspects of this disclosure. Figure 1A , 1B A schematic diagram illustrating a machine vision system and one or more illuminators for a substrate processing apparatus of 1C;

[0030] Figure 3A , 3B 3C and 3D are based on aspects of this disclosure. Figure 2A , 2B A schematic diagram illustrating a 2C machine vision system and one or more illuminators;

[0031] Figure 4A Based on aspects of this disclosure Figure 2A , 2B Demonstration images of substrates captured by 2C machine vision systems;

[0032] Figure 4B Based on the aspects of this disclosure Figure 4A The image demonstrates the intensity profile;

[0033] Figure 5 Based on aspects of this disclosure Figure 2A , 2B A demonstrative comparison of the original contour of the imaging substrate and the corresponding real contour of the imaging substrate in a 2C machine vision system.

[0034] Figure 6A This is an exemplary image of a substrate stack having an upper edge boundary and a lower edge boundary of the substrate and an optically blanked background, according to aspects of this disclosure;

[0035] Figure 6B and 6C These are exemplary images of substrates in a substrate stack according to aspects of this disclosure;

[0036] Figure 6D This is an example of image optimization according to aspects of this disclosure, showing the optimization of an image of a substrate stack in order to isolate the edges from the background of the image;

[0037] Figure 6E It is in the area of ​​interest according to aspects of this disclosure. Figure 6D Example of an isolated edge;

[0038] Figure 6F This is an example of image optimization according to aspects of this disclosure, wherein a common substrate holding groove of the carrier is present. Figure 6D The isolation edge is connected to and presents the boundary of the corresponding substrate retaining groove;

[0039] Figure 7A Based on the aspects of this disclosure Figure 2A , 2B Demonstration illustrations of one or more 2C illuminators;

[0040] Figure 7B Based on the aspects of this disclosure Figure 7A A schematic diagram of the exemplary optical path of one or more of the illuminators;

[0041] Figure 8A Based on the aspects of this disclosure Figure 1A , 1B A schematic diagram of a demonstration transport arm for a substrate processing apparatus of type 1C;

[0042] Figure 8B Based on the aspects of this disclosure Figure 8A A schematic diagram illustrating the optical path of one or more illuminators in one or more of the transport arm;

[0043] Figure 9A , 9B 9C and 9D are exemplary schematic diagrams of the original edge profile and true profile of a substrate imaged from different angles according to aspects of this disclosure;

[0044] Figure 10 , 11 12 and 13 are exemplary illustrations of the original edge contours and corrected true contours according to aspects of this disclosure;

[0045] Figure 14 This is a sample flowchart of the method according to aspects of this disclosure;

[0046] Figure 15A , 15B The illustrations 15C and 15D are exemplary baseline images of substrate supports according to aspects of this disclosure; and

[0047] Figure 16A and 16B This is a schematic diagram of raw and true contour images of a substrate taken by multiple cameras according to aspects of this disclosure, each camera capturing an image of a corresponding different individual region of the substrate carrier. Detailed Implementation

[0048] Figure 1A , 1B The illustrations 1C show exemplary substrate processing apparatuses 100, 150, and 165 according to aspects of this disclosure. While aspects of this disclosure will be described with reference to the accompanying drawings, it should be understood that aspects of this disclosure can be embodied in various forms. Furthermore, elements or materials of any suitable size, shape, or type can be used.

[0049] refer to Figure 1A , 1B 1C and 2A, aspects of this disclosure provide a substrate mapping apparatus 181 (also referred to herein as a semiconductor wafer mapping apparatus) for performing substrate mapping and / or substrate edge contouring, comprising a machine vision system 200 (also referred to herein as an image acquisition system) and at least one illuminator 220 (e.g., a distributed direct or indirect light source, including but not limited to LEDs, fluorescent lamps, floodlights, light arrays, etc., or combinations thereof). According to aspects of this disclosure, the machine vision system 200 includes at least one camera 210 (or any suitable image acquisition sensor). The at least one illuminator 220 and the at least one camera 210 of the machine vision system 200 are positioned at one or more locations to capture images of a substrate stack 270 disposed at any suitable location on a substrate processing apparatus 100, 150, 165. In some aspects, the at least one camera 210 is a camera array 277 as described herein (also referred to herein as a camera system or an array of cameras). By performing any suitable analysis / processing on the captured images of the substrate S (also referred to herein as the wafer) in the substrate stack 270, the true edge contour 500T of the substrate S in the substrate stack 270 can be obtained, for example, from the actual edge contour 500T (see Figure 5 (Or in some respects, the corrected true edge profile 500TC, such as, for example) Figure 10The substrate mapping 280 (referred to herein as a map) determines the substrate S in the substrate stack 270. As will be appreciated from this disclosure, the substrate mapping device 181 disclosed herein overcomes the shortcomings of conventional substrate mappers, such as those mentioned above. The substrate mapping device 181 of this disclosure has essentially no moving parts and can be integrated into any suitable semiconductor manufacturing apparatus (referred herein as a substrate processing apparatus), such as substrate processing apparatus 100, 150, 165 (or one or more components thereof), while providing the opportunity to enhance substrate mapping through software, essentially without requiring hardware upgrades. As will also be described herein, aspects of this disclosure provide advanced mapping applications, including but not limited to measuring the contours of substrate edges that may be uneven.

[0050] This disclosure also provides for the measurement of the edge profile of the substrate S, enabling adjustment of the substrate transporter 180 (see...). Figure 1A The end effector 180E (see also) Figure 8A The substrate maintains the distance TD between teeth 180ET1 and 180ET2 (see...). Figure 1A The end effector is used to pick up warped / bowed substrates. A suitable example of an end effector with adjustable teeth can be found in U.S. Patent Application No. 15 / 693871, filed September 1, 2017, entitled “Substrate Processing Apparatus,” the disclosure of which is incorporated herein by reference in its entirety. A suitable example of a substrate transporter 180 having an end effector with adjustable substrate holding teeth 180ET1, 180ET2 incorporated herein by reference is described in U.S. Patent Application No. 14 / 928352, filed October 30, 2015, entitled “Wafer Aligner,” the disclosure of which is incorporated herein by reference in its entirety. As will be described herein, the at least one camera 210 and the at least one illuminator 220 are positioned to capture images of the substrates S or substrate stack 270 across the width of one or more substrates S. The edge profile of each substrate S is defined based on the processed images. Based on the edge profile of one or more substrates, the available space below each substrate S across its width is determined in any suitable manner. Under the control of any suitable controller, such as controller 199, substrate transporter 180 commands adjustment of the distance TD between substrate holding teeth 180TE1, 180TE2 of end effector 180E (see...). Figure 1A This allows the teeth to extend into the region beneath the warped / bent substrate S, with a gap that allows the end effector 180E to extend beneath the substrate S.

[0051] Typically, as described in more detail herein, aspects of this disclosure employ the at least one camera 210 to capture images of the outer edge 233 of the substrate while the substrate is illuminated by the at least one illuminator 220. Here, any suitable controller (e.g., controller 199) uses any suitable algorithm, such as the algorithm described herein, to define the substrate edge profile from the captured images(s). The number of data points on the outer edge 233 of each substrate imaged by the at least one camera 210 is maximized by employing distributed and diffuse illumination across the substrate width W, wherein multiple exposure techniques (e.g., adjusting exposure speed, aperture, etc.) are employed for different segments of the substrate width. The accuracy of the data points on the outer edge 233 of each substrate S is maximized by an algorithm (e.g., programmed into controller 199) that captures and stores the edge profile of a standard substrate as spatial calibration data 281 (as described in more detail herein). During operation of the substrate mapping device 181 for determining the map 280 and / or edge profile, the measured original substrate profile is compared with the spatial calibration data 281 to determine the corrected true profile 500TC of the substrate S (see Figure 10-13 The original profile is the edge profile of the substrate as seen by the corresponding camera (i.e., the projection of the three-dimensional substrate edge onto the two-dimensional plane of the camera's field of view—see...). Figure 5 On the left side of the middle, and also see the left side of the middle. Figure 9B-9D The true profile 500T and / or the corrected true profile 500TC are what the end effector 180E of the substrate transporter 180 “sees” when picking up the substrate S (i.e., the orthographic projection of the three-dimensional substrate edge onto the extension / contraction plane of the end effector 180E—see [link to documentation]). Figure 5 On the right and also see Figure 9A ).

[0052] refer to Figure 1A , 1B References 1C and 1C describe aspects of this disclosure with respect to substrate processing apparatuses 100, 150, and 165; however, aspects of this disclosure are equally applicable to sorting machines in which a plurality of carriers 110 are coupled to a transfer chamber 130, and substrates are moved within the transfer chamber 130 from one carrier 110 to another by a substrate transporter 180 (e.g., to arrange substrates in one or more carriers according to a predetermined sequence / order), wherein substrate processing (e.g., processes 140, 160, 170) is not included in the sorting machine. Figure 1AThe substrate processing apparatus 100 includes a loading port 120, a transport chamber 130, and any suitable line-front-end process 140 (e.g., generally including thin-film processes using vacuum, such as etching, chemical vapor deposition, plasma vapor deposition, implantation, metrology, rapid thermal processing, dry-strip atomic layering, oxidation / diffusion, nitride formation, photolithography, epitaxy, or other thin-film processes for fabricating individual semiconductor structures patterned in a semiconductor, up to but not including the deposition of metal interconnect layers). The loading port 120 is coupled to the transport chamber 130 and configured to interface any suitable substrate cassette or carrier 110 to the transport chamber 130. The transport chamber 130 is coupled to the line-front-end process 140 and includes any suitable openings and / or valves through which the substrate is transferred between the transport chamber 130 and the line-front-end process 140.

[0053] Transport chamber 130 includes substrate transporter 180 configured to transport substrate S between substrate carrier 110 and line front-end process 140. Here, substrate transporter 180 includes transport arm 180TA having end effector 180E for loading substrate S into and unloading substrate S from substrate carrier 110 through opening 888 of loading port 120. As described above, a suitable example of substrate transporter 180 can be found in U.S. Patent Application No. 14 / 928352, filed October 30, 2015, entitled “Wafer Aligner,” the entire disclosure of which is incorporated herein by reference. See also, for example, [reference to...]. Figure 8A and 8B The disclosed embodiments of the atmospheric transport robot 180 will be described in relation to the present invention. However, it should be understood that aspects of the disclosed embodiments are equally applicable to vacuum transport robots, such as those found in inline front-end process 140, inline back-end process 160, and inline back-end process 170. As will be appreciated, the substrate transporter 180 is mounted to a linear slider 850 or a boom arm BA (e.g., as described in U.S. Patent Application No. 14 / 377987, filed August 11, 2014, entitled “Substrate Processing Apparatus,” the disclosure of which is incorporated herein by reference in its entirety) so as to be movable in at least the X and / or Y directions, and in other respects so that the substrate transporter is fixed from movement in the X and / or Y directions. The configurations shown are for illustrative purposes only, and the arrangement, shape, and placement of the components shown may be varied as needed without departing from the scope of the invention.

[0054] As in Figure 1A-1CAs can be seen in 8A, in one aspect, the substrate transporter 180 is movably mounted to the frame 800 of the transport chamber 130, or in other aspects, movably mounted to the frame of any suitable module of the substrate processing apparatus 100, 150, 165. As will be appreciated, the frame 800 includes one or more openings 888 (also referred to herein as wafer loading openings) communicating with a loading port 120 (also referred to herein as a loading station) of the substrate carrier 110, which is disposed on the loading port 120 to hold one or more substrates S in a vertically distributed arrangement (as described herein) for loading into the substrate processing apparatus 100 (and similarly, into the substrate processing apparatuses 150, 165 described herein) through the openings 888. The substrate transporter 180 includes a transport arm 180TA (also referred to herein as a movable arm), which, in one aspect, is mounted to a carriage 863 such that the transport arm 180TA is movably mounted to the frame 800. In one aspect, the carriage 863 is mounted to the linear slider 850 for movement in the X direction, while in other aspects, the carriage 863 is mounted to the frame 800 for fixation in the X (and / or Y) direction. In one aspect, any suitable actuator 867 is mounted to the frame 800 and drivenly connected to the carriage 863 via any suitable transmission for movement of the transport arm 180TA in the X direction. In this aspect, the transmission is a belt and pulley transmission, and the actuator is a rotary actuator, but in other aspects, the actuator 867 is a linear actuator driven by any suitable transmission or drivenly connected to the carriage 863 in the absence of a transmission (e.g., where the carriage includes a drive portion of the linear actuator). Here, the transport arm 180TA includes a rotary actuator 862, a Z-drive column 830, a slider body 820, and one or more end effectors 180E. Rotary actuator 862 is any suitable rotary actuator mounted to carriage 863, and Z-drive column 830 is mounted to the output end of rotary actuator 862 for rotation about axis θ (e.g., the θ direction) in the direction of arrow T. Slider body 820 is movably mounted to Z-drive column 830, wherein Z-drive column 830 includes any suitable drive motor and / or transmission for moving slider body 820 in the Z direction.

[0055] The one or more (e.g., at least one) end effectors 180E are movably mounted to the slider body 820 in any suitable manner to extend and retract in the R direction (note that the R direction rotates about axis θ such that the extension of the (one or more) end effectors 180E can be aligned with the X or Y axis, or at any suitable angle of rotation in the XY plane). Although only two end effectors 180E are illustrated for illustrative purposes, it should be understood that any suitable number of end effectors can be mounted to the slider body 820. As will be appreciated, the one or more end effectors 180E, together with the transport arm 180TA, move as a unit in a first direction (e.g., one or more of the X, Y, and Z directions) relative to the frame 800, and linearly move back and forth relative to the transport arm 180TA in a second direction different from the first direction (e.g., the R direction). The slider body 820 includes one or more linear actuators 825 configured to move each end effector 180E independently in the R direction. The one or more linear actuators 825 are any suitable actuator(s) with any suitable transmission, in one aspect being substantially similar to those described in, for example, U.S. Provisional Patent Application No. 61 / 917056 entitled “Substrate Transport Device”, filed December 17, 2013, the disclosure of which is incorporated herein by reference in its entirety. End effectors 180E are arranged on the slider body 820 such that they are stacked one on top of the other to have a common telescopic axis R. The end effectors may also include a distance TD for adjusting the distance between end effector teeth 180ET1, 180ET2 (see... Figure 1A Any suitable driver, as described in U.S. Patent Application No. 15 / 693871 entitled “Substrate Processing Apparatus”, filed September 1, 2017, the disclosure of which is incorporated herein by reference in its entirety.

[0056] The carrier 110 can be any suitable carrier 110, such as a front-opening carrier (in Figure 1A and 1BThe carrier 110 may be substantially similar to the carrier described in U.S. Patent No. 9,105,673, issued August 11, 2015, entitled “Side-Opening Uniform Carrier”, the disclosure of which is incorporated herein by reference in its entirety. In one aspect, the transport chamber 130 has the same atmosphere (e.g., a vacuum atmosphere) as the line front-end process 140; in other aspects, the transport chamber has an atmospheric environment, and the line front-end process 140 includes any suitable loading lock for transferring the substrate S between the line front-end process 140 and the transport chamber 130 without degrading the processing atmosphere of the line front-end process 140.

[0057] refer to Figure 1B The substrate processing apparatus 150 includes a loading port 120 (similar to the loading port described herein), a transport chamber 130 (similar to the transport chamber described herein), and any suitable line-back-end process 160 (e.g., generally associated with the fabrication of a metal interconnect layer of a semiconductor structure formed by a line-front-end process 140, and including any suitable processing steps after the line-front-end process up to and including the fabrication of a final passivation layer). The loading port 120 is coupled to the transport chamber 130 and configured to interface any suitable substrate carrier 110 to the transport chamber 130. The transport chamber 130 is coupled to the line-back-end process 160 and includes any suitable openings and / or valves through which the substrate is transferred between the transport chamber 130 and the line-back-end process 160. The transport chamber 130 includes a substrate transporter 180 (e.g., the substrate transporter described above) configured to transfer the substrate between the carrier 110 and the line-back-end process 160. The carrier 110 can be any suitable carrier 110, such as a front-opening carrier (in Figure 1A and 1B The carrier 110 may be substantially similar to the carrier described in U.S. Patent No. 9,105,673, issued August 11, 2015, entitled “Side-Opening Uniform Carrier”, the disclosure of which is incorporated herein by reference in its entirety. In one aspect, the transport chamber 130 has the same atmosphere (e.g., a vacuum atmosphere) as the line-back-end process 160; however, in other aspects, the transport chamber has an atmospheric environment, and the line-back-end process 160 includes any suitable loading lock for transferring the substrate S between the line-back-end process 160 and the transport chamber 130 without degrading the processing atmosphere of the line-back-end process 160.

[0058] refer to Figure 1CThe substrate processing apparatus 165 includes a loading port 120 (similar to the loading port described herein), a transport chamber 130 (similar to the transport chamber described herein), and any suitable back-end process 170 (e.g., generally including substrate testing, substrate polishing, chip separation, chip testing, IC (integrated circuit) packaging, and final testing). The loading port 120 is coupled to the transport chamber 130 and configured to interface any suitable substrate carrier 110 to the transport chamber 130. The transport chamber 130 is coupled to the back-end process 170 and includes any suitable openings and / or valves through which the substrate S is transferred between the transport chamber 130 and the back-end process 170. The transport chamber 130 includes a substrate transporter 180 (e.g., the substrate transporter described above) configured to transfer the substrate between the carrier 110 and the back-end process 170. The carrier 110 can be any suitable carrier 110, such as a front-opening carrier as described above (in... Figure 1A and Figure 1B The carrier 110 may be substantially similar to the carrier described in U.S. Patent No. 9,105,673, issued August 11, 2015, entitled “Side-Opening Uniform Pod”, the disclosure of which is incorporated herein by reference in its entirety.

[0059] refer to Figure 2A , 2BIn accordance with 2C, the substrate mapping device 181 is described with respect to a substrate S or substrate stack 270 held in a substrate carrier 110, wherein the substrate carrier 110 is situated on and engaged with a loading port 120; however, in other respects, the substrate S or substrate stack 270 may be positioned at any suitable location in the substrate processing devices 100, 150, 165, including but not limited to any suitable substrate buffer, substrate aligner, loading lock, and any other location in which one or more substrates S are held. As described above, the substrate mapping device 181 includes at least one camera 210 and at least one illuminator 220 coupled to any suitable controller (e.g., controller 199), substrate processing devices 100, 150, 165. As will be described herein, the substrate S or substrate stack 270 is illuminated by the at least one illuminator 220 such that the at least one camera captures at least one image of the substrate(s) edge(s) illuminated by the at least one illuminator 220. Signals representing the image are transmitted from the at least one camera 210 to the controller 199 to process the image using any suitable image processing algorithm and extract (or otherwise determine) a map 280 from the image. The map 280 is stored in or accessible by any suitable memory 199M of the controller 199, allowing the controller 199 to command the substrate transport device to move based on the state of each substrate in the substrate S or substrate stack 270 as determined by the map 280. As will be described herein, in one or more aspects, a single camera and illuminator pair is used to image (one or more) substrates S and determine the map, while in other aspects, more than one camera and / or more than one illuminator is used. In some aspects, depending on the substrate type (e.g., thickness, shape, material, etc.) and the environment surrounding the substrate (e.g., within carrier 110, within an open rack, etc.), more than one image of the substrate S or substrate stack 270 is captured and analyzed as described herein to determine the map 280. For illustrative purposes only, the description provided herein assumes analysis of only a single image; however, as stated above, more than one image may be compared, overlaid, etc., and analyzed in a manner similar to that described herein without departing from the spirit of this disclosure. Furthermore, for ease of explanation, the analysis of substrate stack 270 is described in this disclosure; however, the analysis of a single substrate S is substantially similar to the analysis described herein.

[0060] As will be described herein, map 280 is determined or otherwise generated to determine the state of each substrate S in each holding slot of substrate stack 270. Images of substrate stack 270 are captured at any suitable location relative to substrate stack 270(one or more) using at least one camera 210 and at least one illuminator 220, such that the outer edge 233 of substrate S in substrate stack 270 is captured in the image (e.g., see image 400 in FIG. 4). The image is processed by controller 199 in any suitable manner (such as those described herein) to identify the outer edge 233 of substrate S, wherein controller 199 performs at least partial definition of the outer edge 233 based on the image.

[0061] As briefly mentioned above, and also refer to Figure 5 For each holding slot of the substrate stack 270 (note that there are one or more holding slots (n, n+1, n+2, ...); each holding slot has a predetermined height relative to the loading port reference position, as shown in... (As specified in the standard) defined by a substrate carrier 110 or other substrate support, and arranged to support respective substrates S in a substrate stack 270, wherein there is a predetermined distance or pitch between the substrates S), edge data of each substrate S (e.g., see Figure 5 The state of substrate S in the holding tank is determined based on the following exemplary substrate mapping rule:

[0062] If no substrate edge 500 is detected in the image (the substrate edge 500 in the image is the outer edge 233 of the substrate S in the substrate stack 270), the state of the substrate S for any given holding groove is non-existent (i.e., no substrate exists);

[0063] If a single substrate edge 500 is detected in the image or if a shape line (indicating the substrate edge 500) is detected in the image overlapping with the retaining groove baseline 510, then the state of substrate S in any given retaining groove is present (i.e., a single substrate is present in the retaining groove).

[0064] If two substrate edges 500 are detected in the image or the thickness of the substrate S detected in the image is, for example, twice the expected substrate thickness (or any suitable multiple), the state of the substrate S in any given holding groove is double (i.e., two substrates S are set in the same holding groove, one on top of the other).

[0065] In the case where the shape line (indicating substrate edge 500) is not parallel to the baseline 510 of the retaining groove, the state of substrate S in any given retaining groove is intersecting (i.e., intersecting grooves, where one substrate spans two grooves (e.g.)). Figure 5 (Place slots n+2 and n+3 in the middle);

[0066] In any given holding groove, the state of the substrate S is displaced or tilted (i.e., the substrate has slid out from its nominal position in the holding groove) when the shape line (indicating the substrate edge 500) is parallel to the groove baseline 510 but vertically displaced (such parallelism can be detected when the at least one camera 210 observes the substrate S from a certain angle (i.e., from above or below the substrate S).

[0067] Note that the state of each substrate S in each holding groove collectively forms map 280.

[0068] refer to Figure 2A , 2B According to aspects of this disclosure, 2C and 3A, the at least one camera 210 is mounted in one or more planes, a near plane 300 and a far plane 301. The near plane 300 is adjacent to the substrate carrier 110 (e.g., situated on the loading port 120), while the far plane 301 is further away from the substrate carrier 110. The near plane 300 is any suitable distance Y1 closest to the opening 399 of the substrate carrier 110, wherein all substrates S stacked within the substrate carrier 110 are captured in the camera 210 with a wide-angle lens, and these substrates S substantially fill the field of view (FOVW) of the camera 210 (see...). Figure 3C The far plane 301 is any suitable distance Y2 closest to the opening 399 of the substrate carrier 110, wherein all the substrates S stacked within the substrate carrier 110 are captured in the camera 210 equipped with a telephoto lens, and these substrates S substantially fill the field of view (FOVT) of the camera 210 (see...). Figure 3D As may be appreciated, distances Y1 and Y2 can be determined based on the height of the substrate stack 270 and the focal lengths of the corresponding wide-angle and telephoto lenses. According to this disclosure, the mounting position of the at least one camera 210 in the X direction is substantially along the vertical (Z-axis) centerline 371 of the substrate stack 270 (not shown for clarity). Figure 3A As shown in the diagram, but substantially coinciding with the vertical centerline of the substrate carrier 110; however, in other respects, the at least one camera 210 may be mounted on one or more sides (e.g., the left or right) of the vertical centerline 371. The mounting position of the at least one camera 210 in the Z direction may be substantially flush with the horizontal center plane 370 (XY plane) of the substrate carrier 110; however, in other respects, the at least one camera 210 may be mounted above or below the center plane 370. Figure 2B A single camera 210 is shown mounted flush with the horizontal center plane 370, while Figure 2C The image shows camera 210B mounted on horizontal center plane 370, camera 210A mounted above horizontal center plane 370, and camera 210C mounted below horizontal center plane 370 (note that...). Figure 2B and 2C (This applies to both the near plane 300 and the far plane 301). In other respects, more or fewer cameras may be used. The one or more cameras described herein are generally referred to as at least one camera 210 (including a single camera or a system / array of cameras 210A, 210B, 210C, etc.).

[0069] In one or more aspects, at least one of the at least one cameras 210 is mounted at a lower center position LC to image the substrate stack 270 in an angularly upward direction. At the lower center position LC, the resulting image substantially eliminates background noise caused by, for example, ambient reflections (such as reflections from the interior of the carrier 110) and / or the top surface of the substrate (which may include a die grip pattern). Here, the substrate is illuminated from one or more of these positions (e.g., upper left UL, upper center UC, upper right UR, middle left ML, middle center MC, middle right MR, lower left LL, lower center LC, and lower right LR). In one or more aspects, at least one of the at least one camera 210 is mounted at an upper center position UC, wherein the substrate stack is illuminated from one or more of the lower positions LL, LC, LR and intermediate positions ML, MC, MR, such that background noise or imaging from the top surface of the substrate is suppressed (e.g., the top surface of the substrate is projected in shadow in a manner similar to that described in U.S. Patent Application No. 16 / 570453, filed September 13, 2019, entitled “Method and Apparatus for Substrate Alignment,” the disclosure of which is incorporated herein by reference in its entirety). In one or more aspects, at least one of the at least one camera 210 is mounted at an intermediate center position MC, wherein the substrate stack 270 is illuminated from one or more of the lower positions LL, LC, LR, to suppress at least background noise or imaging from the top surface of the substrate S. In other aspects, the at least one camera 210 may be located at any number and combination of mounting positions UL, UC, UR, ML, MC, MR, LL, LC, LR on the near plane 300 and / or the far plane 301 (e.g., in cases where the at least one camera 210 comprises more than one camera); however, in the case where the at least one camera 210 is mounted at a central location MC on the near plane 300, the at least one camera 210 is mounted to a loading port gate 120D of the loading port, such that the at least one camera moves with the loading port gate along the substrate transport path to and from the substrate cassette 110. Here, as the loading port gate 120D moves to open and close the loading port / substrate carrier, the at least one camera 210 images the substrate stack 270 (with one or more images).

[0070] refer to Figure 1A-1C And 2C, the at least one camera 210 is mounted in a fixed position within the substrate processing apparatus 100, 150, 165 (so as to be fixed relative to the substrate stack 270) (see 2C). Figure 1A-1C The at least one camera 210 may also be mounted to a movable component of the substrate processing apparatus 100, 150, 165 (e.g., loading port gate 120D and / or substrate transporter 180) (see...). Figure 1A-1C Here, the movable component positions the at least one camera 210 at a desired location UL, US, UR, ML, MC, MR, LL, LC, LR on the near plane 300 and / or the far plane 301 in order to image the substrate stack 270. Figure 2C An example is shown in which a camera array 277, comprising more than one camera 210A, 210B, 210C, is located on a substrate transporter 180. Here, the camera array 277 is located on a common support 244 (in this respect, a Z-drive column 830) of the substrate transporter 180 (where "common support" refers to a single support to which each camera in the camera array 277 is mounted, such that the cameras share this single support); however, in other respects, when fixedly mounted in the transport chamber 130, the camera array 277 may be mounted to any common support of the substrate processing apparatuses 100, 150, 165, and when movably mounted, the camera array may be mounted to any movable structure of the substrate processing apparatuses 100, 150, 165. Each camera 210A, 210B, 210C is fixed to (or fixed relative to) the common support 244. The common support 244 is stationary relative to each camera 210A, 210B, 210C of the camera array 277 (i.e., there is no relative movement between the cameras 210A, 210B, 210C and the common support).

[0071] In one aspect, any suitable camera controller 278 is located on the substrate transporter 180 and coordinated by any suitable controller such as controller 199; in other aspects, the camera controller 278 is incorporated into controller 199. In one or more aspects, the at least one illuminator 220 is mounted to the substrate transporter 180 or in a fixed position within the substrate processing apparatus 100, 150, 165.

[0072] With at least one camera 210 and, in some aspects, at least one illuminator 220 mounted to the substrate transporter 180, the substrate transporter 180 transports at least a portion of the machine vision system 200 to any desired location within the substrate processing apparatus 100, 150, 165 to hold the substrate stack 270. Mounting at least one camera 210 and, in some aspects, at least one illuminator 220 to the substrate transporter 180 reduces the number of cameras and illuminators (e.g., in cases where the substrate processing apparatus 100, 150, 165 has multiple loading ports for holding the substrate carrier 110 and mapping the substrate stack 270), and provides optimal positioning of the at least one camera 210 and the at least one illuminator 220 (e.g., unobstructed field of view at any one or more of positions UL, US, UR, ML, MC, MR, LL, LC, LR on the near plane 300 and / or far plane 301), regardless of the construction of the robotic environment (i.e., the interior of the substrate processing apparatus 100, 150, 165).

[0073] In such Figure 2C The example shown (see also) Figure 8A and 8B Each corresponding camera 210A, 210B, 210C is mounted on the Z-drive post 830 of the substrate transporter 180, such that the fields of view FOVA, FOVB, FOVC extend in a direction parallel to or along the central plane 370 of the substrate carrier 110 (e.g., perpendicular to the extension axis of the end effector of the substrate transporter). Here, the fields of view FOVA, FOVB, FOVC are located on the Z-drive post 830 (i.e., common support 244) so ​​as to allow passage through the transfer arm 180TA ( Figure 8A Position the Z-drive column 830 relative to the opening 888 at the common position CP (see...). Figure 8B —Where, "common location" refers to a single location of the substrate transporter such that, in the case of cameras 210A, 210B, 210C mounted on the common support 244 depending on that single location of the common support 244, different individual portions of the substrate carrier 110 can be observed through opening 888 (e.g., see...). Figure 2C Regions RA, RB, RC and Figure 6EThe representative regions of interest (i.e., any one of regions RA, RB, RC) are defined. Each distinct individual region RA, RB, RC has a substrate groove for holding at least one or more substrates S. These regions are separate from and different from portions of the substrate carrier 110 with different substrate holding grooves for holding substrates S different from the at least one or more substrates S in the regions / portions observed by each of the other cameras 210A, 210B, 210C when the Z-axis driver 830 is in the common position CP. Each substrate S held in the substrate carrier 110 is imaged by the camera array 277 when the Z-axis driver 830 is in the common position CP. In some aspects, each corresponding distinct individual portion is imaged by only one of the corresponding cameras 210A, 210B, 210C of the camera array 277 (although the fields of view may overlap, the image can be cropped so that each corresponding distinct individual portion is imaged by only one of the corresponding cameras 210A, 210B, 210C; while in other aspects, the fields of view do not overlap). In some aspects, at least one substrate S held in a corresponding wafer trench of the corresponding distinct individual portion is imaged by only one of the corresponding cameras 210A, 210B, 210C of the camera array 277 (again, note that although the fields of view may overlap, the image can be cropped so that each corresponding distinct individual portion is imaged by only one of the corresponding cameras 210A, 210B, 210C; while in other aspects, the fields of view do not overlap). Here, the controller 199 can be communicatively coupled to the transport arm 180TA to move the transport arm 180TA relative to the frame 800 (see Figure 8) and position the common support 244 at the common position CP.

[0074] Each distinct individual portion of the substrate carrier 110 and the substrate stack 270 therein, as observed by the respective cameras 210A, 210B, 210C of the camera array 277, has a different set of wafer trenches corresponding to the individual portion and the respective cameras 210A, 210B, 210C, which are vertically distributed at a predetermined reference height observed by the respective cameras 210A, 210B, 210C. The predetermined reference height is derived from, for example, a reference position at the loading port 120 where the substrate carrier 110 is located. The standard establishes heights corresponding to different holding slot numbers (in this example, for a 25-slot substrate carrier). For example, each field of view (FOVA, FOVB, FOVC) of the respective cameras 210A, 210B, 210C captures a corresponding region of interest (RA, RB, RC) within the interior 222 of the substrate carrier 110 (and the substrate stack 270 therein). In one or more aspects, images of corresponding different individual portions captured by each respective camera 210A, 210B, 210C exclude each other different individual portion observed by each other respective camera 210A, 210B, 210C, and each substrate in each slot of the substrate carrier 110 is imaged by the camera array 277 with the common support 244 located at a common position CP. In this example, the substrate carrier 110 is a 25-slot substrate carrier, and the region of interest (RC) corresponds to holding slots 1-8, the region of interest (RB) corresponds to holding slots 9-17, and the region of interest (RA) corresponds to holding slots 18-25. The fields of view (FOVA, FOVB, FOVC) may overlap by any desired amount to provide substantially complete coverage of the interior 222 (in some respects, this increases the amount of image information and increases the resolution of the resulting map 280); while in other respects, as described herein, the fields of view may be used for image processing without overlap or cropping. In this respect, as described herein, image processing is performed on each image captured by the respective cameras 210A, 210B, 210C, wherein the controller 199 combines the respective processed images to generate a map 280 of the substrate stack 270 within the substrate carrier 110.

[0075] Although Figure 2C Cameras 210A, 210B, and 210C are shown as one on top of another (e.g., in positions UC, MC, LC), but in other respects (these also apply to fixed-mount cameras), they can be mounted in any number of positions UL, US, UR, ML, MC, MR, LL, LC, LR to form a one-dimensional vertical camera array (in the Z direction), a one-dimensional horizontal camera array (e.g., in the X direction), or a two-dimensional camera array (e.g., in the XZ plane). As will be appreciated, generally, for a circular substrate, when viewed through opening 888, as the outer edge 233 of the substrate bends away from the at least one camera 210, the leftmost FL and rightmost FR of the substrate (see...) Figure 2AThe illumination may be dimmer. If the edge signal obtained by the at least one camera 210 drops below any suitable predetermined threshold, additional images of the substrate can be captured using longer exposure times and / or a larger camera aperture. It will be appreciated that longer exposure times and / or larger apertures may result in overexposure of the central region WC of the substrate in the image, whereby combining several images (low-exposure and high-exposure images) or combining different vertical segments of different images using any suitable image processing algorithm, including but not limited to high dynamic range (HDR) algorithms, can produce a resulting image with uniform exposure highlighting the substrate edge 233. Therefore, cameras located at different positions (UL, US, UR, ML, MC, MR, LL, LC, LR) can be programmed with different aperture sizes and / or exposure speeds optimized for different regions of the substrate stack / substrate carrier. For example, a camera closer to the at least one illuminator 220 may have a slower exposure speed and / or a smaller aperture compared to a camera farther from the at least one illuminator 220, in order to substantially prevent overexposure of the image, thereby preventing substrate edge detection. As can be appreciated, the exposure speed and / or aperture size of cameras located at different positions can be determined such that the resulting combined image has consistent exposure and contrast for image features that are generally present throughout the entire image (see...). Figure 4A ).

[0076] refer to Figure 2A , 3B 7. The substrate S is illuminated by at least one illuminator 220 (also referred to herein as an illumination source), and the image is captured by the at least one camera 210 in such a manner that the signal in the image corresponding to the substrate edge 500 is maximized and the signal in the image corresponding to the background (including the environment around the substrate S, the top / bottom of the substrate S, any chip grid pattern on the substrate S, etc.) is minimized, for example, to produce a high-contrast image emphasizing the edge 500. An example of high-contrast imaging is described in U.S. Patent Application No. 16 / 570453, which is previously incorporated herein by reference. As will also be described herein, the at least one illuminator is configured to provide diffuse illumination across the width W of each substrate S (when viewed from the smaller side of the substrate—see, for example, see...). Figure 4A Wherein, the width W is the visible width of (one or more) substrates S held in the substrate holding position. As will be appreciated, the at least one illuminator 220 may be positioned within the substrate processing apparatus 100, 150, 165 in a manner substantially similar to that described herein with respect to cameras 210, 210A, 210B, 210C.

[0077] As an example, see reference Figure 2A , 2B2C, 3B, and 8A, the at least one illuminator 220 is connected to a common support 244 and configured to illuminate the outer edge 233 of each substrate S in the substrate carrier 110 through an opening 888 when the common support 244 is located in a common position CP (see 2C, 3B, and 8A). Figure 2A-2C (The term "outer" is relative to the substrate carrier 110 and refers to the edge portion of the substrate visible through the opening 888.) The outer edge 233 indicates the upper and lower edge boundaries 233U and 233L of the outer edge 233 of the corresponding substrate S (see...) Figure 2A The at least one illuminator 220 is positioned relative to each camera 210, 210A, 210B, 210C such that the outer edge 233 directs the edge illumination reflected from the at least one illuminator 220 toward the cameras 210, 210A, 210B, 210C, and optically blanks the background reflected light observed by each camera 210, 210A, 210B, 210C through the opening 888 at the upper edge boundary 233U and the lower edge boundary 233L, provided that the common support 244 is located in the common position CP. The at least one illuminator 220 is positioned relative to the respective cameras 210A, 210B, 210C such that in each image captured by the respective cameras 210A, 210B, 210C at different individual portions of the substrate carrier 110 (e.g., see in...), Figure 4A and 6B Optical blanking is performed on light reflected from the planar surfaces SP1, SP2 (e.g., the top and bottom principal planar surfaces) of the substrate S inserted into (or otherwise held in) the substrate carrier 110, as shown in the image -6E. For example, Figure 6E The region of interest in the text is explained. Figure 2C Any one or more regions RA, RB, RC in the data (see also: Figure 16A and 16B In this configuration, images from each camera 210A, 210B, 210C image a portion of the corresponding field of view FOVA, FOVB, FOVC (although the field of view may be larger than the captured image), wherein optical blanking is performed on light reflected from the substrate S (and any background of the carrier) in the substrate carrier 110 and the planar surfaces SP1, SP2 of each other substrate S. Here, the outer edge 233 of the substrate S is significantly defined by image contrast or otherwise indicates the upper edge boundary and the lower edge boundary 233U, 233L (e.g., see...). Figures 6A-6C Image contrast is formed by edge reflections and optically blanked backgrounds registered by each camera 210, 210A, 210B, 210C and between them, so as to perform edge detection on each substrate S in the substrate carrier 110 when the common support 244 is located at the common position CP.

[0078] like Figure 2A and 3B As shown, in one aspect, the at least one illumination source 220 is at least one shaped illumination line 369. In the example shown, the shaped illumination line 369 is disposed in one or more of the upper and lower positions in the near plane 300; however, in other aspects, the shaped illumination line 369 may be disposed in one or more of the upper and lower positions in the far plane 301, or in an intermediate position between one or more planes of the near plane 300 and the far plane 301. The shape of the shaped illumination line 369 conforms to the outer edge 233 of the substrate S held within the substrate carrier 110; however, in other aspects, the shaped illumination line 369 may have any suitable shape for illuminating the substrate S in the manner described herein.

[0079] refer to Figure 8A and 8B The at least one illuminator 220 includes at least one vertically (Z-axis) oriented illuminator 220V1, 220V2 and at least one horizontally (in the XY plane) oriented illuminator 220H. Here, cameras 210A, 210B, 210C (although three are shown, there can be two or more cameras for imaging two or more different individual carrier regions) are arranged in the upper center position UC, the middle center position MC, and the lower center position LC (see...). Figure 3A and 3B The illumination is provided by two illuminators 220V1 and 220V2, which extend from the upper right position UR to the lower right position LR and from the upper left position UL to the lower left position LL, respectively, to form two illumination lines. Illuminator 220H is positioned above cameras 210A, 210B, and 210C to illuminate from any suitable angle β (as shown in the image). Figure 8B In the example shown, angle β is relative to the XY plane (but in other respects, this angle can be relative to the Z-axis) to illuminate the outer edge 233 of each substrate S. Here, illuminators 220H are arranged to illuminate the substrate S such that cameras 210A, 210B, 210C detect the substrate S1 sliding out of the carrier 110, while illuminators 220V1, 220V2 illuminate the outer edge 233 in a manner that substantially prevents or otherwise blanks (e.g., from the interior of the carrier, the top of the substrate, or the bottom of the substrate) background reflections.

[0080] In one aspect, it can also be referred to Figure 7A and 7B Illuminators 220V1 and 220V2 are arranged to guide diffuse light in any suitable direction (i.e., at any suitable angle) in the XY plane so as to illuminate the edge 233 of substrate S through opening 888 (see Figure 7AFor exemplary purposes, such as Figure 7B As shown, illuminators 220V1, 220V2 are arranged to emit diffuse light in one or more directions inclined relative to the plane 888P of the opening 888. In the example shown, the illuminators emit light in a direction at any suitable angle α outward relative to the centerline 110C of the substrate carrier 110. In the example shown, the angle α is the same for both illuminators 220V1, 220V2; however, in other respects, the angle α of illuminator 220V1 may differ from the angle α of illuminator 220V2. Here, the light from illuminators 220V1, 220V2 is arranged vertically such that the light reaches all substrates S in the substrate holding slots of the substrate carrier 110 and is not blocked by vertically adjacent substrates. In this respect, the light from illuminators 220V1 and 220V2 is directed towards reflective surfaces 750 and 751 within the transmission chamber 130, such that the light is reflected by reflective surfaces 750 and 751 to the edge 233 of the substrate S (now indirect light), thereby substantially eliminating reflections from the interior of the substrate carrier 110 as seen by cameras 210A, 210B, and 210C. In other respects, illuminators 220V1 and 220V2 are equipped with diffusers or other light scattering devices that provide indirect or diffuse light to the substrate edge 233 in a manner that substantially eliminates reflections from the interior of the substrate carrier 110 as seen by cameras 210A, 210B, and 210C. The effect obtained by imaging in the corresponding different individual regions / parts RA, RB, and RC by each camera 210A, 210B, and 210C is that the substrate edge reflections optically blank the background, thereby significantly defining the boundary of each substrate edge with image contrast.

[0081] In one or more aspects, illuminators 220, 220V1, 220V2, 220H, and 369 are coupled to controller 199 for dynamic control (e.g., turning on and off) and / or adjustment (e.g., intensity adjustment). Controller 199 is configured to cycle one or more of the illuminators 220, 220V1, 220V2, 220H, and 369 or portions thereof to individually or in combination illuminate different portions of the substrate stack 270 being imaged (e.g., individually illuminating the top segment, bottom segment, middle segment, or any combination thereof, such as substantially simultaneously illuminating the top and middle segments, top and bottom segments, or illuminating one or more of these different segments in any suitable sequence, wherein the segments are illuminated individually or in combination). Controller 199 is configured to maintain the intensity of illumination from one or more of the illuminators 220, 220V1, 220V2, 220H, and 369 at a static (e.g., substantially constant intensity) or dynamically change its intensity. When dynamically changing the intensity of one or more of the illuminators 220, 220V1, 220V2, 220H, and 369, the intensity can be varied along the X, Y, and / or Z directions of the illuminators 220, 220V1, 220V2, 220H, and 369, including different illumination intensities on different sides of the housing 110. In one or more aspects, the dynamic change in intensity can be regular (e.g., in a regular sequence such as high-low, where for each slot of the housing 110, the illumination is high at a reference line (e.g., a baseline), and decreases (e.g., low) away from each reference line). In other aspects, the illumination can be dynamically changed irregularly at corresponding slot reference lines in a series of slot reference lines, such as high-high-high-low. Furthermore, different illuminators 220, 220V1, 220V2, 220H, and 369 can employ different types of spectra (e.g., infrared light, visible white light, visible colored light, etc.) to enhance image contrast. Each illuminator 220, 220V1, 220V2, 220H, and 369 can be independently controlled via controller 199 for one or more of the intensity and spectrum.

[0082] Now for reference Figure 5 , 4A Images 4B and 6A are processed by controller 199 (e.g., final image, original image, or recombined image) to define the edge contour of outer edge 233. As will be appreciated, any suitable image processing can be applied to these images to enhance the contrast of outer edge 233 of substrate S relative to the background. Examples of image processing that can be applied to images to enhance contrast include, but are not limited to, grayscale filters, contrast stretching, and intensity transition edge filters. Figure 6AAn example application of an intensity transition edge filter is provided, in which two intensity transitions (e.g., representing the upper and lower edge boundaries 233U and 233L of each substrate) are used to identify each outer edge 233. (See example in...) Figure 6A As can be seen, two substrates, one on top of the other (i.e., in a "double" state), are located in the substrate holding groove 13 of the substrate carrier 110.

[0083] The substrate edge profile is generated in the original view / profile (using one or more suitable edge construction / image processing algorithms). A spatial correction algorithm is applied to the original profile using spatial calibration data to generate a true substrate edge profile independent of the position of the at least one camera 210 (for use by the controller when commanding the positioning end effector 180E to pick up the substrate S). Here, multiple camera optical recognition systems (such as the system described herein) generate substantially the same true profile 500T from different original profiles in images taken by different cameras.

[0084] The edge definition algorithm programmed into controller 199 is identical for substrate mapping and edge contour definition. In one or more aspects, vertical image slices 410-416 of the image are analyzed to detect outer edges 233. Substrate mapping can be performed using one or more slices from vertical slices 410-416, while edge contour definition is performed using more than one slice from vertical slices 410-416. Note that this is for illustrative purposes only. Figure 4A Seven vertical slices are shown, while in other respects, more or fewer than seven slices (or two or three slices) may be used. To define the edge 233 of the substrate S for mapping and edge contouring, the image 499 is cut into vertical slices 410-416, which are narrow vertical strips of the image 499 taken at predetermined positions relative to the width 499W of the image 499. For each slice 410-416, the controller 199 averages the intensity of the image pixels along the horizontal direction 495 (the terms horizontal and vertical are for reference only and for ease of interpretation) to generate an intensity profile 480 as a function of the vertical position within the slices 410-416. Figure 4B The image shows an intensity profile 480 for a portion of the substrate stack, for example, slice 410, where a peak 489 is observed compared to the background level 488 (for clarity, in...). Figure 4B Only some of the peaks are marked in the image to identify each substrate edge 433 (corresponding to the outer edge 233). The thickness of each substrate S can be determined based on the width of the corresponding peak substrate, where, as in... Figure 4BAs can be seen, the width of the peak corresponding to the groove 13 in the substrate stack 270 is approximately twice the expected thickness of the substrate S (wherein the pixel size of the image can be converted to inches or millimeters by the controller 199 in any suitable manner (e.g., by image identification of substrate cell features of known size), which indicates that there are two substrates S in the same groove, one on top of the other (e.g., in Figure 5 (The "double" state shown). Figure 4B It can also be seen that peak 489, which corresponds to groove 13, includes "double peaks", which also indicates that there are two substrates S in the same groove, one on top of the other.

[0085] After establishing the intensity profile 480 and determining the peaks 489, for each substrate hold groove, the controller 199 searches / determines which peaks have vertical positions closest to the predetermined baseline height of the corresponding substrate holding groove (the predetermined vertical position within the cell where the substrate will be held, i.e., the groove height). Here, the peaks are correlated with the substrate hold groove height to determine whether the substrate is held in the corresponding substrate holding groove. When a peak is found and correlated with the substrate holding height, the original edge profile of the substrate in the corresponding substrate holding groove is formed along the position of the peak in the intensity distribution 480. For example, in Figure 4B The height of slot 18 was identified, with peak 489A being approximately centered relative to the height of slot 18, causing controller 199 to correlate peak 489A with slot 18 to indicate the presence of substrate in slot 18. Controller 199 determines the true edge profile 500T of any given substrate S by subtracting the vertical position of the calibrated baseline (at the same horizontal position in the image slice) from the vertical position of the original profile (for a given substrate S in the horizontal position of the image slice) of each data point in the intensity profile 480 (of the original profile). Figure 5 The controller 199 determines the thickness of a given substrate S as the average of the thicknesses measured from all data points on the corresponding original profile.

[0086] In one or more aspects, reference Figure 6B , 6CThe 6D edge definition algorithm includes (e.g., using controller 199) dividing the raw image from the at least one camera 210 into a central region 600M, a left region 600L, and a right region 600R. The left region 600L is substantially illuminated by illuminator 220V2, the right region 600R is substantially illuminated by illuminator 220V1, and the central region 600M is substantially illuminated by illuminator 220H; however, in other respects, regions 600M, 600L, and 600R may be illuminated by any one or more illuminators described herein in any suitable manner. Here, for each of the central region 600M, left region 600L, and right region 600R, the aforementioned state is determined (e.g., in a manner similar to that described above with respect to image intensity contours). Substrates positioned below (or above, depending on the camera and / or illumination angle) the substrate sliding out of the substrate carrier 110 may be hidden outside the field of view by the sliding substrate and may not be detectable in the central region 600M, but those hidden substrates may be detectable in the left region 600L and the right region 600R (see [reference]). Figure 6B ).like Figure 6B As shown, the fourth substrate (or wafer) at the top of the image (identified as "detected wafer (slipped out)") has slipped out of the substrate carrier 110 and blocks light from illuminating the substrate below the slipped-out substrate in the middle region 600M; however, the substrate located below the slipped-out substrate is visible in the left region 600L and the right region 600R. Here, as Figure 6B As shown, when a substrate is detected in both the left region 600L and the right region 600R for any given slot, the substrate of that given slot is detected (i.e., identified as present). For any given slot, reflections detected in the middle region 600M but not detected in the left region 600L and the right region 600R are mapped as non-existent (e.g., empty slot) (see...). Figure 6C ). For example in Figure 6C As can be seen, the regions in the image corresponding to the substrate holding slots that have reflections in the middle region 600M but no corresponding reflections in the left region 600L and right region 600R are mapped to empty slots (i.e., the substrate does not exist).

[0087] Figure 6DAn image captured by at least one camera 210 located in the central center MC of the far plane 301 is shown. This image has been optimized by the controller 199 (using any suitable image processing, such as that described herein), and shows substrate edges detected in the central region 600M, left region 600L, and right region 600M. The controller 199 is configured to detect substrate edges within any suitable region of interest (including each of the central region 600M, left region 600L, and right region 600M) within the captured image (using any suitable image processing, such as that described herein). Figure 6E As shown. (As in...) Figure 6F As can be seen, the controller 199 is configured to connect the edges detected in each of the middle region 600M, the left region 600L, and the right region 600M (corresponding to the substrate holding grooves of the substrate carrier 110 with groove boundaries known to the controller) to determine the presence of the substrate.

[0088] use Figure 6B and 6C One or more of the middle region 600M, left region 600L, and right region 600R are used to detect substrate warping / bending as described herein.

[0089] At this point, in the edge-limiting algorithm, sufficient data is obtained to perform substrate mapping of the state of substrate S in substrate box 110 by adopting the exemplary substrate mapping rules described above.

[0090] Note that for substrate edge contouring, further data (in addition to the data obtained for mapping) is needed to determine substrate bends / warpages that may hinder substrate pickup. As mentioned above, the original contour of the substrate may depend on the position of the at least one camera 210 imaging the substrate. The controller 199 is configured to obtain data from the original contour (see...) Figure 5 Spatial correction is applied to transform the original contour into a camera-independent, corrected, true contour. (See 500TC) Figure 10-13 ). Figures 9A-9C The example provided is a comparison between the original (edge) contour and the true (edge) contour. Figure 9A The true edge profile 500T of each substrate S in the substrate stack 270 is shown. The true edge profile 500T is substantially equivalent to being located on the far plane 301 ( Figure 3A and 3BThe original image is taken from a camera 210 (equipped with a telephoto lens) positioned at the center MC on the image. For illustrative purposes only, the telephoto lens is a lens with a focal length of approximately 100mm or greater and that of a full-frame camera (i.e., a camera with an image sensor format the same size as 35mm format film); however, in other respects, the focal length of the telephoto lens may be greater than or less than approximately 100mm. Here, the curvature of the substrate edge is not apparent because the direction of the three-dimensional to two-dimensional projection is generally parallel to the substrate plane. Figure 9B The original image of a camera 210 (equipped with a wide-angle lens) located at the center position MC of near plane 300 is shown. For illustrative purposes only, a wide-angle lens is a lens with a focal length of about 28mm or less that is used with a full-frame camera; however, in other respects, the focal length of a wide-angle lens may be greater than or less than about 28mm. Figure 9C This is an illustration of the original image from a camera 210 (equipped with a wide-angle lens) located at the lower center position LC on the near plane 300, with its field of view pointing upward (at an angle) toward the substrate S in the substrate stack 270. Figure 9D This is an illustration of the original image from a camera 210 (equipped with a wide-angle lens) located at the upper center position LC on the near-plane 300, with its field of view pointing downwards (at an angle) towards the substrate S in the substrate stack 270. Here, the original view from the wide-angle lens (from the near-plane 300) illustrates the effect of a three-dimensional object projected onto the two-dimensional image plane of the camera's field of view. (As from...) Figure 9B-9D It is evident that the shape of the substrate becomes visible when the 3D-to-2D projection lines are no longer parallel due to proximity to camera 210, for example. The farther the substrate is from the camera, the more pronounced its 3D shape becomes. As the substrate is positioned further away from the camera (e.g., at...), the shape becomes more apparent. Figure 9B-9D As shown in the diagram, the viewing angle also changes, in which the substrate that is farther away appears smaller than the substrate that is closer to the camera 210. Figure 9B-9D The substrate in the original image may also be distorted due to the characteristics of a wide-angle lens (e.g., barrel distortion).

[0091] The above can be corrected by applying spatial calibration data 281 to the original image using the controller 199. Figure 9B-9D The deformation of the substrate edge is shown. Controller 199 is configured to transform the original profile into a corrected true profile 500TC using an empirical method, wherein the corrected true profile 500TC provides substrate warpage / bending determination and end-effector adjustment for picking up and placing the warped / bent substrate S. The empirical method includes initial spatial calibration and spatial correction during runtime when measuring the substrate profile.

[0092] The controller 199 is communicatively coupled to the camera array 277 and programmed using each corresponding camera calibration (also referred to herein as spatial calibration data 281), each corresponding camera calibration having a baseline image for the corresponding camera 210A, 210B, 210C (see below). Figure 5 and Figure 10 The baseline 510 shown, wherein each baseline 510 of the corresponding substrate carrier 110 groove collectively forms a baseline image. Figure 15A , 15B Examples of baseline images are provided in 15C and 15D (note that these baseline images correspond to, for illustrative purposes only). Figure 9A , 9B Original and true outlines of 9C and 9D. Baseline images of each corresponding camera 210A, 210B, 210C ( Figures 15A-15D The baseline images of four cameras are shown, one camera located at the center CM of the far plane 301, and three cameras located at the center CM, upper center US, and lower center LC of the near plane, which differ from the baseline images of each of the other corresponding cameras 210A, 210B, and 210C (as shown in...). Figures 15A-15D (as is evident from the image), and for the corresponding individual different portions of the substrate carrier 110 imaged by the respective cameras 210A, 210B, 210C (see...). Figure 2C Regions RA, RB, RC and Figure 6E Each substrate S in at least one corresponding slot of at least one corresponding slot (region of interest in the image) defines a predetermined baseline characteristic. As will be described herein, controller 199 is configured (e.g., in any suitable memory) to register spatial calibration data 281 for each corresponding camera 210A, 210B, 210C, wherein calibration wafer 1500 characterizing baseline images of the corresponding cameras 210A, 210B, 210C is disposed in each slot of at least one corresponding slot of a corresponding separate portion, and imaging is performed using the corresponding cameras 210A, 210B, 210C that define the baseline images of the corresponding cameras 210A, 210B, 210C registered by controller 199.

[0093] You can also refer to Figure 10-13 Initial spatial calibration is obtained by capturing the original contour of its true profile 500T and the original contour of a flat substrate (e.g., a known flat calibration wafer 1500 without bending / warping) within the substrate stack 270. The original baseline or calibration image serves as spatial calibration data 281 for each corresponding camera 210A, 210B, 210C (see [reference]). Figure 2A The data is stored in controller 199 (or memory 199M accessible by controller 199). The edge profile of the calibration wafer 1500 corresponding to each substrate holding groove is formed as shown in, for example... Figure 5 and Figure 10-13 The baseline image and baseline 510 position (i.e., the expected position of the corresponding substrate in the substrate carrier obtained from the baseline image) for each substrate are shown. Generally, spatial calibration is performed after camera mounting, and if the camera position or angle changes after initial mounting, spatial calibration is rerun. In one or more aspects, the calibration wafer 1500 is integrally formed with or otherwise fixed to a calibration cassette (which is substantially similar to cassette 110, but the calibration wafer is fixed in a predetermined position therein). Here, the calibration wafer 1500 may be a partial wafer coupled to the carrier to form the leading edge of the wafer scanned / inspected in the calibration image in the manner described herein. Here, the calibration cassette, together with the integral calibration wafer, forms a calibration wafer holder, which sits as a unit on the loading port. In other aspects, the calibration wafer 1500 may be integrally formed as a stack of wafers inserted into the cassette as rack units, wherein the calibration wafers integrally formed in the integral wafer stack have a predetermined spacing and vertical alignment. Here, the integrally formed wafer stack can be placed on and / or removed from the slot of the box 110 as a rack unit.

[0094] During operation, when measuring the substrate edge profile (e.g., for mapping and / or edge contouring), controller 199 performs spatial correction on the original image / profile, wherein controller 199 applies spatial calibration data 281 to correct the original profile of the substrate and obtains the corrected true profile 500TC by subtracting the original profile of the substrate in the given slot from the baseline 510 of the given slot (e.g., where any deviation of the measured original profile 500 from the baseline 510 represents substrate bending / warping as indicated in the corrected true profile 500TC (see...). Figure 10 (right side)

[0095] The spatial corrections described herein provide at least the equivalent transformation from a wide-angle lens projected at close range (e.g., in the near plane 300) to a telephoto lens projected at a distant range (e.g., in the far plane 301), corrections for perspective effects corresponding to the camera's angle and distance relative to the imaged substrate, corrections for barrel distortion introduced by the wide-angle lens, and corrections for mechanical variations in position and orientation during camera mounting. Figure 11-13 The figures show experimental data obtained by employing spatial correction in edge contouring, illustrating the effectiveness of the spatial correction described in this paper. Figure 11 The original outline 500 of the three substrates spanning the width of the substrate box 110 is shown. Figure 12 It shows Figure 11 The intermediate substrate (e.g., the trench 13 substrate). Figure 13The corrected true profile 500TC of the substrate in trench 13 is shown, exhibiting warping / bending. Furthermore, note that spatial correction can be applied before or after image processing by cutting the image into vertical image slices 410-416.

[0096] As described above, the controller 199 employs the substrate profile when commanding the substrate transporter 180 to pick up the substrate. Here, the controller 199 can do this by placing the teeth 180TE1, 180TE2 as shown in... Figure 13 The exemplary locations shown (e.g., where there is sufficient space to insert teeth under the substrate) command the end effector 180E of the substrate transporter to widen / increase the 510TC teeth 180TE1, 180TE2 based on the corrected true profile of the substrate (see Figure 1A The distance TD between ) (see Figure 1A ), to accommodate any warpage / bending in the substrate (e.g., such as in Figure 13 In the substrate of trench 13).

[0097] refer to Figure 1A-1C Examples 2A-2C, 8A, 8B, and 14 will describe exemplary substrate mapping / edge contouring operations. A frame 800 is provided to form an opening 888 (e.g., a wafer loading opening), the opening 888 communicating with the loading port 120. Figure 14 (Block 1400). As described herein, loading port 120 is configured to hold substrate carrier 110, wherein substrate carrier 110 holds more than one substrate S vertically distributed within substrate carrier 110 for loading into substrate processing apparatuses 100, 150, 165 through opening 888. A transport arm 180TA (e.g., a movable arm) is provided and mounted to frame 800 (block 1400). Figure 14 (block 1405) so as to move relative to opening 888. As described, transport arm 180TA includes end effector 180E, which is movably mounted to transport arm 180TA to load substrate from substrate carrier 110 to substrate processing apparatus 100, 150, 165 (and vice versa) through opening 888.

[0098] Provide machine vision system 200 (e.g., image acquisition system) Figure 14(Block 1410) The machine vision system 200 includes at least one camera 210. For illustrative purposes, the method is described with respect to camera array 277, but it should be understood that the method is equally applicable to images captured by a single camera. As described above, each respective camera 210A, 210B, 210C is positioned to have fields of view FOVA, FOVB, FOVC, which are configured to observe, through opening 888, different individual portions of the substrate carrier 110 having wafer trenches for holding at least one of the more than one substrate S, when the common support 244 is positioned at the common position CP by transport arm 180TA. These different individual portions are separate from and different from portions of the substrate carrier 110 with different wafer trenches for holding substrates S different from the at least one substrate S, as observed by each of the other cameras 210A, 210B, 210C, when the common support 244 is at the common position CP, and to image each substrate S held in the substrate carrier 110 by camera array 277.

[0099] Provide the at least one illuminator 220 ( Figure 14 (See box 1415), the at least one illuminator 220 is connected to the common support 244. As described above, the at least one illuminator is configured to illuminate the outer edge 233 of each substrate S in the substrate carrier 110 through the opening 888 when the common support 244 is in the common position CP. This edge marks the upper edge boundary and lower edge boundaries 233U, 233L of the outer edge 233 of the substrate S. The at least one illuminator 220 is positioned relative to each corresponding camera 210A, 210B, 210C, and through corresponding separate different portions of each corresponding camera 210A, 210B, 210C (e.g., see...). Figure 2C Regions RA, RB, RC and Figure 6E The image of the region of interest (GRI) is configured such that the outer edge 233 directs the edge illumination reflected from the at least one illuminator 220 toward the respective cameras 210A, 210B, 210C, and optically blanks the background reflected light at the upper edge boundary 233U and lower edge boundary 233L in images of individual different portions of the substrate carrier 110 captured by the respective cameras 210A, 210B, 210C through the opening 888 when the common support 244 is in the common position CP. As described herein, the outer edge 233 of the substrate S is significantly defined by the upper edge boundary and the lower edge boundary 233U, 233L with image contrast formed by the edge reflections registered by each camera 210A, 210B, 210C and the optically blanked background therebetween, to perform edge detection for each substrate S in the substrate carrier 110 when the common support 244 is in the common position CP.

[0100] When the substrate carrier 110 is positioned on the loading port 120, the controller 199 commands the transport arm 180TA to move, so that the transport arm 180TA is positioned relative to the opening 888. Figure 14 (box 1420) so as to image the substrate S within the carrier 110 through the opening 888. The substrate S is illuminated by the at least one illuminator 220, and different individual regions are captured by the camera array 277 by means of the opening 888 (e.g., see...). Figure 2C Images of substrate S in regions RA, RB, RC (in the image). Figure 14 (Box 1425). After capturing raw images of the substrate in each distinct individual region, controller 199 is configured to perform one or more actions, namely determining the substrate map and determining substrate warp / bend. As described herein, the substrate mapping and warp / bend determination can be performed in any suitable order relative to each other, such as when both need to be determined.

[0101] Regarding substrate mapping, controller 199 determines intensity profile 480 for each of the different individual regions (e.g., regions RA, RB, RC) in a manner described herein (see [document name missing]). Figure 4A and 4B ()( Figure 14 (Box 1430). From the intensity profile 480, the controller 199 determines the true edge profile 500T in the manner described herein. Figure 14 (box 1440), thereby determining the substrate map 280 of each distinct individual region and the entire substrate carrier 110. Figure 14 (Box 1442). By applying substrate mapping rules to the real edge contour 480 using any suitable image processing algorithm, as described herein, the controller 199 determines the substrate state (e.g., absent, present, double, intersecting, shifted) from the substrate map 280. Figure 14 (Box 1445). Brief Reference Figure 16B The controller 199 is configured to compare the adjacent substrate holding positions of adjacent different individual regions to determine, for example, intersecting trench substrates spanning between adjacent different individual regions. For example, as in... Figure 16BAs can be seen, slots 8 and 9 in different individual regions RC and RB are adjacent to each other, and in some respects, there may be substrates with intersecting slots between slots 8 and 9. Controller 199 is configured to employ the wafer mapping rules described herein in determining the substrate map 280 and state of the substrate S in the substrate carrier 110, such as when multiple cameras 210A, 210B, 210C are used to capture images in different individual regions RA, RB, RC, forming boundary slots between adjacent different individual regions (in this example, different individual regions RC and RB, and the boundary slots are slots 8 and 9).

[0102] Note that when imaging the substrate S, capturing images in different individual regions (e.g., multiple images from different cameras that cover corresponding individual regions and are combined to form a substrate map) provides less distortion of the substrate S compared to imaging the entire substrate carrier 110 in a single image. For example, Figure 16A The original contour images of substrate S captured by cameras 210A, 210B, and 210C for each corresponding different individual region RA, RB, and RC are shown. Figure 16B The images show the true contour images of substrate S captured by cameras 210A, 210B, and 210C for each corresponding individual region RA, RB, and RC. The distortion of the substrate contour in each of the different individual regions RA, RB, and RC is compared with... Figures 9B-9C When comparing the original contours, it can be seen that when multiple cameras 210A, 210B, 210C are used to image different individual regions RA, RB, RC at one time, compared to imaging all substrates S in the substrate carrier 110 at a time with a single camera, there is less substrate deformation (i.e., between the original contour and the true contour).

[0103] Regarding the determination of substrate warpage / bending, in the absence of spatial calibration data 281 for each camera 210A, 210B, 210C at the loading port 120 where substrate cassette 110 is located, controller 199 obtains / determines spatial calibration data 281 for each camera 210A, 210B, 210C in the manner described herein. Figure 14 (Box 1455). Controller 199 determines the intensity profile 480 of the substrate S held in the substrate carrier 210 (in each different individual region) located on the loading port 210 in a manner described herein (see...). Figure 4A and 4B ()( Figure 14 (Box 1430). Spatial calibration data 281 is applied to the captured image (at least by means of the substrate on which it is imaged, as identified by intensity distribution 480) Figure 14(Box 1460) to determine a corrected true edge profile 500TC for imaging the substrate S. For example, camera 210A corresponds to different individual regions RA, camera 210B corresponds to different individual regions RB, and camera 210C corresponds to different individual regions RC. Spatial correction data 281 of camera 210A is applied to different individual regions RA, spatial correction data 281 of camera 210B is applied to different individual regions RB, and spatial correction data 281 of camera 210C is applied to different individual regions RC. Any substrate warpage / bending of the substrate in the different individual regions RA, RB, RC is determined from the corrected true edge profile 500TC of the substrate S by controller 199 in any suitable manner (e.g., using image processing described herein). Figure 14 (Box 1467). Controller 199 uses warp / bending determination to adjust the distance TD (or pitch) between end effector teeth 180ET1 and 180ET2 (see... Figure 1A ), to pick up warped / bent substrate S( Figure 14 (Box 1470).

[0104] It should be understood that the above description is illustrative of only aspects of this disclosure. Various alternatives and modifications can be conceived by those skilled in the art without departing from these aspects. Therefore, these aspects are intended to include all such alternatives, modifications, and variations that fall within the scope of any appended claims. Furthermore, the mere fact that different features are recited in dissimilar dependent or independent claims does not indicate that combinations of these features cannot be advantageously used, such combinations still remaining within the scope of these aspects.

Claims

1. A method comprising: A frame for a semiconductor substrate transport device is provided, the frame forming a substrate loading opening communicating with a loading station for a substrate carrier, the substrate carrier being configured to hold more than one substrate stacked in the substrate carrier for loading through the substrate loading opening; A movable door is provided, which is movably connected to the frame to open and close the substrate loading opening; A movable arm is provided, which is movably mounted to the frame for movement relative to the substrate loading opening, and has at least one end effector movably mounted to the movable arm for loading a substrate from a substrate carrier through the substrate loading opening; Each substrate held in the substrate carrier is imaged using an image acquisition system comprising at least one camera having a field of view, the camera being arranged to observe, through the substrate loading opening, a substrate groove for holding at least one of the more than one substrates in the substrate carrier using at least one camera positioned by the movable gate. as well as Using an illumination source connected to and positioned by the movable gate, the edge contour of each substrate in the substrate carrier is illuminated through the substrate loading opening. The edge contour marks the upper and lower edge boundaries of the edge contour of the substrate. The illumination source is positioned relative to the at least one camera and by the movable gate such that the outer edge of the substrate directs the edge illumination reflected from the illumination source toward the at least one camera, and optical blanking is performed on the background reflected light observed by the at least one camera through the substrate loading opening at the upper and lower edge boundaries. The edge profile of the substrate is defined by the upper edge boundary and the lower edge boundary with significant image contrast, the image contrast being formed by and between edge reflections registered by the at least one camera and optically blanked background, to determine one or more of the warp and bending amounts of a corresponding substrate selected from the stacked substrates based on the image of the edge profile.

Images