A smart card contactless module packaging device and packaging process

Abstract

The application discloses a kind of intelligent card non-contact module packaging device and packaging process, it is related to electronic packaging process technical field.The intelligent card non-contact module packaging device and packaging process, including holster, each holster is away from the end of wire gun head Half concave cavity with semicircular table shape, the upper end of the half concave cavity is the small diameter end of closure, the lower end is the large diameter end of opening, the small diameter end of closure forms cutter, two groups of holster are closed when cutter is used to cut off gold wire, and two half concave cavities form completed forming cavity, so that gold liquid forms gold ball in forming cavity.By the drive of driving assembly, driving holster can be radially opened and closed, on the one hand, gold wire is cut off flush, to avoid generating excess flow welding, on the other hand, while cutting off, molten gold liquid is polymerized to form gold ball, to avoid producing sharp protrusions, to provide smooth connection surface for subsequent gold wire and gold ball re-welding, to improve stability, accuracy in chip bonding welding process.

Description

Technical Field

[0001] This invention relates to the field of electronic packaging technology, specifically to a smart card contactless module packaging device and packaging process. Background Technology

[0002] Current smart card contactless module packaging involves fixing the chip (die) to the chip pad of the lead frame using thermosetting epoxy resin. A standard forward soldering method is used, employing ultrasonic waves, heating, and physical impact to fuse the gold wires to the silver plating of the lead frame. Then, a thermosetting encapsulation process is used to protect the chip and gold wires. Finally, a die-cutting process is used to separate the module from the lead frame, and each packaged module undergoes various electrical performance tests to ensure the final packaged product is qualified.

[0003] For example, Chinese patent CN110729207A discloses a bonding method for wire bonding in packaging. This process involves applying conductive adhesive to the bonding area of ​​an aluminum electrode, then pressing multiple grooves into the end of a gold wire, embedding the grooved end of the gold wire in the conductive adhesive, and pressing it against the aluminum electrode. Then, the gold wire, aluminum electrode, and conductive adhesive are heated by ultrasonic waves to cure the conductive adhesive and bond the gold wire to the aluminum electrode. Finally, the excess gold wire is cut off to achieve bonding between the chip and the substrate.

[0004] For example, Chinese patent CN106252246B discloses a solder ball-wrapped wire bonding process and chip packaging method. This process uses a ball bonding machine to heat the solder wire. A solder ball is pre-planted in each bonding area of ​​the chip that requires wire bonding. Then, the ball bonding machine is used to heat the solder wire and stack bonding balls on the solder ball. After stacking the bonding balls, the wire is arched upwards and pulled into an arc to the frame pin to form a wire arc. At the same time, the wire arc does not contact the chip, and the frame pin forms a crescent-shaped solder joint. Subsequently, the chip is placed in a reflow soldering machine for reflow soldering to complete the wire bonding process.

[0005] However, existing chip bonding methods often result in spikes forming on the broken spherical surface of the solder wire during ball bonding, leading to a smaller contact area during subsequent bonding. Furthermore, the way the solder wire is moved and displaced relative to the solder joint during the breakage process can cause the molten solder to flow, resulting in run-on solder joints and excess solder joints. This makes the connection of the solder joints unstable during the bonding process. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a smart card contactless module packaging device and packaging process, solving the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a smart card contactless module packaging device and packaging process.

[0008] On one hand, the present invention provides a smart card contactless module packaging device, including a wire-ejecting gun head for ejecting gold wire, and a gun sleeve, which is provided in two pairs and located on both sides of the wire-ejecting end of the wire-ejecting gun head. The two pairs of gun sleeves can open and close radially. Each gun sleeve has a semi-concave cavity in the shape of a semi-circular frustum at the end away from the wire-ejecting gun head. The upper end of the semi-concave cavity is a small-diameter end with a closed opening, and the lower end is a large-diameter end with an open opening. The small-diameter end with the closed opening forms a cutter. When the two sets of gun sleeves are closed, the cutter is used to cut the gold wire, and the two semi-concave cavities form a complete forming cavity, so that the gold liquid forms a gold ball in the forming cavity.

[0009] Furthermore, it also includes: a first active wire feeding wheel, which is located on the wire feeding path of the gold wire, and a first driven wire feeding wheel that moves relative to it on one side of the first active wire feeding wheel. During the process of cutting the gold wire and shaping the gold liquid into a gold ball, the first active wire feeding wheel and the first driven wire feeding wheel clamp the wire but do not feed the wire. At the same time as the holster opens and closes instantaneously, the first active wire feeding wheel and the first driven wire feeding wheel feed out a specified length of gold wire; a second active wire feeding wheel, which is offset from the first active wire feeding wheel and located on the gold wire feeding path. A second driven wire feeding wheel that moves relative to it on one side of the second active wire feeding wheel. When the first active wire feeding wheel and the first driven wire feeding wheel clamp the gold wire, the second driven wire feeding wheel disengages from the second active wire feeding wheel and does not clamp the gold wire.

[0010] Furthermore, it also includes: a collar, which can be fitted onto the holster and move along the holster axis; and a ridge, located at the top of the holster, used to convert the moving force of the collar into a counter-thrust, so that when the collar moves along the ridge, it pushes the holster to close, and after the holster is closed, it can continue to move along the holster to keep the holster closed.

[0011] Furthermore, it also includes: an energy storage box located on one side of the first active wire feeding wheel, the energy storage box having a mainspring inside for providing wire feeding power after the first active wire feeding wheel and the first driven wire feeding wheel clamp the gold wire, and a buckle on the inner ring of the mainspring; a ratchet located on the inner ring of the mainspring, a groove forming on one side of the ratchet teeth and an arc surface forming on the other side of the ratchet teeth, so that when the ratchet rotates along the groove, the groove engages with the buckle, driving the mainspring to tighten and store power, and when the ratchet rotates in the opposite direction along the arc surface, the buckle deforms and makes way along the slope of the arc surface, maintaining the mainspring in a reset and relaxed state.

[0012] Furthermore, it also includes a drive assembly, which is disposed on the wire feeding path of the gold wire and is used to drive the opening and closing of the holster, the relative movement and rotation of the first active wire feeding wheel and the first driven wire feeding wheel, and the relative movement of the second active wire feeding wheel and the second driven wire feeding wheel. The drive assembly includes: a drive arm disposed on one side of the wire feeding path of the gold wire; a snap fastener disposed at one end of the drive arm and used to drive the radial opening and closing of the holster; a rack disposed at the other end of the drive arm and used to drive the spring to tighten and store power, causing the spring to release the stored power, driving the first active wire feeding wheel and the first driven wire feeding wheel to rotate, automatically pushing the gold wire out to a specified length; a first wedge, of which two sets are provided and staggered on the drive arm, used to drive the first driven wire feeding wheel to move relative to the first active wire feeding wheel; and a second wedge, of which two sets are provided, staggered from the first wedge and staggered on the drive arm, used to drive the second driven wire feeding wheel to move relative to the second active wire feeding wheel.

[0013] Furthermore, the drive assembly also includes: a lifting guide rail, which is located on one side of the moving path of the buckle and has a lifting slide along its guide rail direction. The lifting slide is used to drive the collar to move along the axial direction of the gun holster; a slider, which is located on one side of the lifting slide and can slide telescopically within the lifting slide. A stop is provided on one side of the slider, so that the stop is driven by the buckle's thrust to move the lifting slide; and a movable wedge, which is located on the other side of the slider. The movable wedge can slide relative to the fixed wedge fixed on the lifting guide rail, pushing the stop and the rack to separate and release the thrust on the lifting slide.

[0014] Furthermore, the drive assembly further includes: a first slide, located on the moving path of the first wedge, and forming a first clearance cavity within the first slide, such that the first clearance cavity is pushed by the slope of the first wedge, pushing the first driven wire feed wheel to move towards the first active wire feed wheel to clamp the gold wire; a drive shaft, located on one side of the moving path of the rack and fixedly connected to the ratchet, used to convert the moving force of the rack into the stored energy of the spring; and a driven shaft, located on the central axis of the first active wire feed wheel, with a gear pair between the driven shaft and the drive shaft, such that after the first driven wire feed wheel and the first active wire feed wheel clamp the gold wire, the spring releases its stored energy, driving the first active wire feed wheel and the first driven wire feed wheel to rotate and automatically push the gold wire out to a specified length.

[0015] Furthermore, the drive assembly also includes a second slide table disposed on the moving path of the second wedge block, and a second clearance cavity is formed in the second slide table, so that the second slide table is pushed by the slope of the second wedge block to push the second driven wire feeding wheel away from the second active wire feeding wheel, thereby providing clearance for the automatic wire feeding of gold wire.

[0016] Furthermore, it also includes a welding platform, which is located below the wire ejector head and is used to support the encapsulated chip and the lead frame chip carrier.

[0017] On the other hand, the present invention also provides a smart card contactless module packaging process, comprising the following steps:

[0018] Step 1: Select epoxy resin with 40-45um spacing particles and heat-cur and bond the chip to the lead frame chip carrier.

[0019] Step 2: Place the encapsulated chip and the lead frame chip carrier on the soldering platform. Use the wire feed gun to feed the gold wire to connect the solder joints between the chip and the lead frame chip carrier. Before connecting the first solder joint on the chip with the gold wire, solder the second solder joint on the lead frame chip carrier. After soldering, drive the gun sleeve to close radially and use the cutter to cut the gold wire. At the same time as cutting, the forming cavity polymerizes the gold liquid on the second solder joint to form gold balls. Then drive the gun sleeve to open and close radially to reset. At this time, the gold wire is automatically pushed out to the specified length under the drive of the first active wire feed wheel and the first driven wire feed wheel, preparing for the next soldering.

[0020] Step 3: After gold balls are burned onto the second solder joint of the lead frame chip carrier, gold wires are used to connect the first solder joint on the chip to the second solder joint on the lead frame chip carrier.

[0021] The present invention has the following beneficial effects:

[0022] (1) The smart card contactless module packaging device and packaging process, through the driving component, the driving gun sleeve can be opened and closed radially, so that after the gold wire melts to the solder point, it cuts the gold wire flush to avoid excess solder flow. At the same time as cutting, the molten gold liquid is polymerized to form gold balls to avoid sharp protrusions, providing a smooth connection surface for subsequent re-welding of gold wire and gold balls, improving the stability and accuracy of chip bonding process, and improving the bonding quality.

[0023] (2) The smart card contactless module packaging device and packaging process, through the driving component, drives the gun sleeve to close, and at the same time drives the first driven wire feeding wheel to approach the first active wire feeding wheel, so that it changes from the traction state of the gold wire to the clamping state of the gold wire, and stores force during the clamping process, so that while the gun sleeve opens and closes and resets, the gold wire is automatically pushed out to a specified length, which prepares for the next gold wire to be melted into a gold ball or bonded connection, ensuring the accuracy of the length required for the gold wire to be melted each time.

[0024] (3) The smart card contactless module packaging device and packaging process, through the driving component, drives the first driven wire feeding wheel to move closer to the first active wire feeding wheel, and at the same time drives the second driven wire feeding wheel to move away from the second active wire feeding wheel, so that it changes from the clamping state to the traction state, providing a channel for the automatic wire feeding of gold wire, and after the gold wire is automatically fed to the specified length, it resets and maintains the clamping state of the gold wire, providing a continuous wire feeding thrust for the gold wire connecting the chip and the solder joint on the chip frame, reducing the number of control times in the gold wire feeding process, saving control time, improving bonding and welding efficiency, and at the same time reducing the drive operation during device electrical control and reducing data error situations.

[0025] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of the present invention;

[0027] Figure 2 This is a schematic diagram of the assembly of the gun holster and the wire feed wheel in this invention;

[0028] Figure 3 This is a schematic diagram of the drive mechanism of the gun holster and the wire feed wheel in this invention;

[0029] Figure 4 This is a plan view of the drive mechanism of the gun holster and the wire feed wheel in this invention;

[0030] Figure 5 This is a schematic diagram of the first dynamic movement of the two sets of wire feeding wheels in this invention;

[0031] Figure 6 This is a schematic diagram of the second dynamic movement of the two sets of wire feeding wheels in this invention;

[0032] Figure 7 This is a partial structural diagram of the driving component in this invention;

[0033] Figure 8 This is a schematic diagram of the first structure of the driving collar of the driving component in this invention;

[0034] Figure 9 This is a schematic diagram of the second structure of the driving component driving collar in this invention;

[0035] Figure 10 This is a schematic diagram of the third structure of the driving component driving collar in this invention;

[0036] Figure 11 This is a schematic diagram of the first assembly of the collar and the holster in this invention;

[0037] Figure 12 This is a second assembly diagram of the collar and the holster in this invention;

[0038] Figure 13 This is a schematic diagram of the collar structure in this invention;

[0039] Figure 14 This is a first exploded view of the holster in this invention;

[0040] Figure 15 This is a second exploded view of the holster in this invention;

[0041] Figure 16 This is a first assembly diagram of the gear pair in this invention;

[0042] Figure 17 This is a second assembly diagram of the gear pair in this invention;

[0043] Figure 18 This is a schematic diagram of the assembly of the ratchet and the mainspring in this invention;

[0044] Figure 19 This is a schematic diagram of the first driving state of the ratchet and the mainspring in this invention;

[0045] Figure 20 This is a schematic diagram of the second driving state of the ratchet and the mainspring in this invention.

[0046] In the diagram, 1. X-axis guide rail; 2. Z-axis guide rail; 3. Y-axis guide rail; 4. Welding platform; 5. Support plate; 6. Ultrasonic transducer; 7. Wire feed gun head; 8. First active wire feed wheel; 9. First driven wire feed wheel; 10. Second active wire feed wheel; 11. Second driven wire feed wheel; 12. First driving gear; 13. First driven gear; 14. Second driving gear; 15. Second driven gear; 16. Lower pressure arm; 17. Collar; 18. Gun holster; 19. Electric push rod; 20. Drive arm; 21. Clamp; 22. Rack; 23. First wedge; 24. Second wedge; 25. Lifting guide rail; 26. Lifting slide; 27. First guide rod; 28. First spring; 29. 30. First differential gear; 31. Second differential gear; 32. Third differential gear; 33. Fourth differential gear; 34. Driven shaft; 35. First slide table; 36. First clearance cavity; 37. Second slide table; 38. Second clearance cavity; 39. Wire feeding motor; 40. Stop block; 41. Movable wedge block; 42. Fixed wedge block; 43. Second guide rod; 44. Second spring; 45. Slider; 46. Cutter; 47. Forming cavity; 48. Wire clamp cavity; 49. Spring; 50. Ridge; 51. Support slide table; 52. Limiting sleeve; 53. Encapsulation cavity; 54. Energy storage box; 55. Drive shaft; 56. Ratchet; 57. Spring; 58. Bend; 59. Slot; 60. Arc surface; 61. Ball bearing. Detailed Implementation

[0047] like Figures 1-20The present invention provides a technical solution: a smart card contactless module packaging device and packaging process.

[0048] On one hand, the present invention provides a smart card contactless module packaging device;

[0049] like Figures 1-6 As shown, a smart card contactless module packaging device includes a wire ejector head 7 for ejecting gold wires. The wire ejector head 7 is mounted on a support plate 5, and an ultrasonic transducer 6 supporting the wire ejector head 7 is mounted on the support plate 5. A Y-axis guide rail 3 is mounted on one side of the support plate 5, and a Z-axis guide rail 2 is mounted on the other side of the Y-axis guide rail 3. A welding platform 4 is mounted below the wire ejector head 7, and the welding platform 4 is supported and moved by an X-axis guide rail 1. The encapsulated chip and the lead frame chip carrier are placed on the welding platform 4. The three-way drive of the X-axis guide rail 1, Z-axis guide rail 2, and Y-axis guide rail 3 drives the wire ejector head 7 and the welding platform 4 to move relative to each other in three-dimensional space, so that the gold wires are connected to the solder joints of the chip and the lead frame chip carrier respectively.

[0050] It should be noted that it also includes a spark rod, which uses the high-temperature electric arc generated by the spark rod to melt the end of the gold wire, so that the end of the gold wire forms a liquid gold ball, so that the liquid gold wire is connected to the solder joint, and under the heat, pressure and ultrasonic energy, the gold ball is bonded to the solder joint.

[0051] Furthermore, two pairs of sleeves 18 are provided on both sides of the wire-exiting end of the wire-exiting head 7, and the two pairs of sleeves 18 can open and close radially. Each sleeve 18 has a semi-concave cavity in the shape of a semi-circular frustum at the end away from the wire-exiting head 7. The upper end of the semi-concave cavity is a small-diameter end that is sealed, and the lower end is a large-diameter end that is open. The small-diameter end that is sealed forms a cutter 45. When the two sets of sleeves 18 are closed, the cutter 45 is used to cut the gold wire, and the two semi-concave cavities form a completed forming cavity 46, so that the gold liquid forms a gold ball in the forming cavity 46.

[0052] In addition, a first active wire feeding wheel 8 is provided on the wire feeding path of the gold wire, and a first passive wire feeding wheel 9 is provided on one side of the first active wire feeding wheel 8, which moves relative to it. During the process of cutting the gold wire and shaping the gold liquid into a gold ball, the first active wire feeding wheel 8 moves towards the first passive wire feeding wheel 9, so that it changes from a state of pulling the gold wire to a state of clamping the gold wire. At the same time as clamping, the first active wire feeding wheel 8 is charged, so that when the subsequent holster 18 opens and closes instantaneously, the first active wire feeding wheel 8 and the first passive wire feeding wheel 9 release the charged force and feed out a specified length of gold wire, so as to prepare for the next bonding connection of the gold wire.

[0053] In addition to the above, a second active wire feeding wheel 10 is provided on the gold wire feeding path that is offset from the first active wire feeding wheel 8. A second passive wire feeding wheel 11 that moves relative to the second active wire feeding wheel 10 is provided on one side of the second active wire feeding wheel 10. During the process of cutting the gold wire and shaping the gold liquid into a gold ball, the first passive wire feeding wheel 9 moves away from the first active wire feeding wheel 8, so that it changes from a clamping state to a traction state for the gold wire, providing the channel required for automatic gold wire feeding. After the subsequent automatic gold wire feeding is completed, it returns to the clamping state, providing a continuous wire feeding thrust for the gold wire connecting the chip and the solder joint on the chip frame, reducing the number of control operations during the gold wire feeding process.

[0054] like Figures 2-3 , Figures 7-15 As shown, to achieve the cutting of gold wires after bonding and the shaping of molten gold into spheres, a movable collar 17 is provided along the axial direction of the collar 18, and a ridge 49 is provided at the top of the collar 18. When the collar 17 moves down along the ridge 49, it moves along the ridge surface of the ridge 49, applying pressure to the ridge surface. Under the pressure, the collar 18 closes, causing the cutters 45 at the bottom of the two sets of collars 18 to engage and cut the gold wires. Simultaneously, the forming cavity 46 closes, shaping the molten gold into gold spheres. After the holster 18 is closed, the collar 17 continues to move along the holster 18, keeping the holster 18 continuously closed (the inner ring of the collar 17 is provided with at least one set of balls 60, which apply an opening and closing thrust to the holster 18. Due to the rolling characteristics of the balls 60, their movement along the holster 18 is smoother and there is no obstruction). This provides time for the gold ball to be molded and cooled. After the gold ball is formed, the collar 17 quickly returns to its original position along the holster 18, allowing the holster 18 to open and close instantaneously, providing the channel required for the automatic wire output of the gold wire.

[0055] It should be noted that a wrapping cavity 52 is also formed inside the holster 18, so that the holster 18 can fit perfectly with the wire-ejecting head 7, so that the cutter 45 and the forming cavity 46 close synchronously. At the same time, a wire clamping cavity 47 is also formed between the cutter 45 and the wrapping cavity 52. ​​While cutting the gold wire, the wire clamping cavity 47 is used to clamp and fix the gold wire at the exit end of the wire-ejecting head 7, so that the gold wire maintains a stable state and is not disturbed or moved by other components.

[0056] Furthermore, a limiting sleeve 51 is provided on the wire-exiting head 7, which slides relative to the support slide 50 located on the upper end of the sleeve 18. By using the limiting sliding combination of the limiting sleeve 51 and the support slide 50, the two sets of sleeves 18 can maintain radial opening and closing movement. At the same time, a spring 48 with a "Z"-shaped structure is provided between the two sets of sleeves 18 to provide opening and closing driving force for the opening and closing of the two sets of sleeves 18.

[0057] As a further embodiment of this invention, a drive assembly is provided on the gold wire feeding path to drive the opening and closing of the gun sleeve 18. The drive assembly includes a drive arm 20 located on one side of the gold wire feeding path. An electric push rod 19 is provided on one side of the drive arm 20 to provide its movement, and a buckle 21 is provided at one end of the drive arm 20. The electric push rod 19 drives the drive arm 20 to move, causing the buckle 21 to move downward, thereby generating a driving force to drive the gun sleeve 18 to open and close radially.

[0058] Furthermore, the drive assembly also includes a lifting guide rail 25 located on one side of the moving path of the snap fastener 21, and a lifting slide 26 is provided along the guide rail direction. A first guide rod 27 is provided below the lifting slide 26, and a lower pressure arm 16 for supporting the collar 17 is provided at the other end of the first guide rod 27. A first spring 28 that can be compressed as the lifting slide 26 moves downward is sleeved on the outside of the first guide rod 27. At the same time, a slider 44 is also provided on one side of the lifting slide 26, and a second guide rod 4 with the lifting slide 26 built into it is provided on one side of the slider 44. 2. The elastic force of the second spring 43 allows the slider 44 to slide within the lifting slide 26. A stop 39 is provided on one side of the slider 44, causing the lifting slide 26 to move under the pushing force of the buckle 21. A movable wedge 40 is provided on the other side of the slider 44, which can slide relative to the fixed wedge 41 fixed to the lifting guide rail 25, pushing the stop 39 away from the buckle 21 and releasing the pushing force on the lifting slide 26. Simultaneously, as the buckle 21 moves downwards... The movable wedge 40 contacts the stop block 39 and applies pressure, pushing the lifting slide 26 to slide downward along the lifting guide rail 25. This, in turn, pushes the collar 17 to slide downward along the axial direction of the holster 18, allowing the collar 17 to apply a continuous closing thrust to the holster 18. Simultaneously, as the lifting slide 26 continues to move downward, the movable wedge 40 and the fixed wedge 41 move relative to each other, pushing the slider 44 to retract inward into the lifting slide 26. This causes the stop block 39 to retract synchronously and separate from the buckle 21, releasing the thrust on the lifting slide 26. Then, the lifting slide 26 is reset under the elastic support of the second spring 43, causing the collar 17 to move in the opposite direction and reset, and the gun holster 18 to quickly reset and open, providing a channel for the automatic wire output of the gold wire (while the buckle 21 is reset in the opposite direction and contacts the stop block 39 again, by forming a sloping concave platform on the bottom contact surface of the stop block 39 in advance, when the buckle 21 slides along the sloping concave platform, the stop block 39 elastically contracts and makes room under the elastic force combination of the second guide rod 42 and the second spring 43, providing room for the reset of the buckle 21).

[0059] like Figures 3-7 , Figures 16-20As shown, to achieve automatic wire feeding after gold wire bonding, an energy storage box 53 is provided on one side of the first active wire feeding wheel 8. A spring 56 is provided inside the energy storage box 53 to provide the wire feeding power after the first active wire feeding wheel 8 and the first driven wire feeding wheel 9 clamp the gold wire. A buckle 57 is provided on the inner ring of the spring 56. Simultaneously, a ratchet 55 is provided on the inner ring of the spring 56. A groove 58 is formed on one side of the ratchet teeth of the ratchet 55. When the ratchet 55 rotates along the groove 58, the groove 58 engages with the buckle 57, driving the spring 56 to tighten and store power (e.g., ...). Figure 19 As shown), while the holster 18 is reset and opening / closing, the spring 56 releases its stored power, pushing the first active wire feed wheel 8 and the first driven wire feed wheel 9 to rotate in opposite directions (the first active wire feed wheel 8 and the first driven wire feed wheel 9 are respectively provided with a first active gear 12 and a first driven gear 13 that can mesh with each other on their central shafts, so that when the first driven wire feed wheel 9 moves toward the first active wire feed wheel 8 to clamp the gold wire, the first active gear 12 and the first driven gear 13 mesh synchronously, driving the first active wire feed wheel 8 and the first driven wire feed wheel 9 to rotate in opposite directions), automatically pushing the gold wire out to a specified length, preparing in advance for the next bonding connection of the gold wire.

[0060] Furthermore, an arc surface 59 is formed on the other side of the ratchet teeth of ratchet 55. When ratchet 55 rotates in the opposite direction along the arc surface 59, the buckle 57 deforms along the slope of the arc surface 59 to make way, maintaining the reset and relaxed state of the mainspring 56. After the mainspring 56 pushes ratchet 55 to release the stored force, when ratchet 55 continues to rotate in the opposite direction, the arc surface 59 of ratchet 55 pushes the buckle 57 to deform, providing rotational space for the reverse rotation of ratchet 55. At this time, the mainspring 56 maintains the reset and relaxed state (as shown in the image). Figure 20 (As shown).

[0061] As a further embodiment, the drive assembly is also used to drive the first driven wire feed wheel 9 to move relative to the first active wire feed wheel 8. A first wedge block 23 is provided on the support arm of the drive arm 20. Two sets of the first wedge blocks 23 are staggered on the drive arm 20. Simultaneously, a first slide table 34 is provided along the moving path of the first wedge block 23, and a first clearance cavity 35 is formed within the first slide table 34. During the downward movement of the first wedge block 23 by the drive arm 20, the first clearance cavity 35 is pushed by the slope thrust of the upper first wedge block 23, causing the first slide table 34 to move, thus moving the first driven wire feed wheel 9 towards the first active wire feed wheel 8 to clamp the gold wire (e.g., ...). Figure 6 As shown), the process transitions from a traction state to a clamping state for the gold wire, preparing for automatic wire feeding. After automatic wire feeding, when the drive arm 20 drives the first wedge 23 to move upwards and reset, the first clearance cavity 35 receives the sloping thrust of the lower first wedge 23, pushing the first slide 34 to reset in the opposite direction. This causes the first driven wire feeding wheel 9 to move away from the first active wire feeding wheel 8 (as shown). Figure 5 As shown), it maintains its traction on the gold wire.

[0062] Furthermore, the drive assembly is also used to drive the first driven wire feed wheel 9 and the first driven wire feed wheel 8 to output the gold wire after clamping it. A rack 22 is also provided at the other end of the drive arm 20. Simultaneously, a drive shaft 54 ​​is provided on one side of the rack 22's movement path. The drive shaft 54 ​​is fixedly connected to a ratchet 55. A driven shaft 33 is provided on the central axis of the first driven wire feed wheel 8. A gear pair is provided between the driven shaft 33 and the drive shaft 54. The gear pair consists of a first differential gear 29, a second differential gear 30, and a third differential gear 30. The system consists of a first differential gear 29 on the drive shaft 54 ​​and capable of meshing with the rack 22. The fourth differential gear 32 is on the driven shaft 33 and meshes with the first differential gear 29 while the drive arm 20 moves the rack 22 downward, generating a driving force to rotate the drive shaft 54. During the rotation of the drive shaft 54, the ratchet 55 is driven to rotate, tightening the spring 56 and storing power. (At this time, during the rotation of the first differential gear 29, the second differential gear...) The meshing of the first differential gear 30, the third differential gear 31, and the fourth differential gear 32 drives the first active wire feed wheel 8 on the driven shaft 33. Since the first active wire feed wheel 8 and the first driven wire feed wheel 9 do not clamp the gold wire, the rotation of the first active wire feed wheel 8 does not drive the gold wire to move at this time. After the rack 22 continues to move downwards and separates from the first differential gear 29, the first driven wire feed wheel 9 and the first active wire feed wheel 8 clamp the gold wire, and the stored power of the spring 56 is released. The acceleration of the gear pair drives the driven shaft 33 to rotate, which in turn drives the first active wire feed wheel 8 to rotate. By utilizing the opposing rotation of the first driven wire feed wheel 9 and the first active wire feed wheel 8, the gold wire is automatically pushed out to a specified length. When the subsequent drive arm 20 moves the rack 22 upward to reset, the rack 22 meshes with the first differential gear 29 in the opposite direction. The reverse thrust of the rack 22 on the ratchet 55, under the deformation and relocation of the arc surface 59 and the bend 57, will not generate a tightening force on the spring 56, maintaining its reset and relaxed state.

[0063] like Figures 3-7 As shown, to achieve continuous wire feeding after automatic wire feeding, the drive assembly is also used to drive the relative movement of the second active wire feeding wheel 10 and the second driven wire feeding wheel 11. Two sets of interlocking second wedges 24 are also provided on the drive arm 20 to drive the second driven wire feeding wheel 11 to move relative to the second active wire feeding wheel 10. Simultaneously, a second slide 36 is provided along the movement path of the second wedges 24, and a second clearance cavity 37 is formed within the second slide 36. The second slide 36 is pushed by the slope force of the second wedges 24, causing it to move. When the drive arm 20 moves the second wedges 24 downwards, the second clearance cavity 37 is pushed by the upper second wedges 24, causing the second slide 36 to move, thus moving the second driven wire feeding wheel 11 away from the second active wire feeding wheel 10, changing from a clamping state to a traction state, providing a channel for automatic wire feeding (e.g., ...). Figure 6As shown), when the subsequent drive arm 20 drives the second wedge 24 to move upward and reset, the second clearance cavity 37 is pushed by the lower second wedge 24, which pushes the second slide 36 to move in the opposite direction, so that the second driven wire feed wheel 11 moves towards the second active wire feed wheel 10, changing from the traction state of the gold wire to the clamping state (the second active wire feed wheel 10 and the second driven wire feed wheel 11 are respectively provided with a second active gear 14 and a second driven gear 15 that can mesh with each other, so that when the second driven wire feed wheel 11 moves towards the second active wire feed wheel 10 to clamp the gold wire, under the drive of the wire feed motor 38 on the other side of the central shaft of the second active wire feed wheel 10, the second active wire feed wheel 10 and the second driven wire feed wheel 11 are driven to rotate in opposite directions), providing a continuous mechanical wire feeding force for the gold wire connecting the chip and the solder joint on the chip frame.

[0064] On the other hand, the present invention also provides a smart card contactless module packaging process, comprising the following steps:

[0065] Step 1: Select epoxy resin with spacer particles of 40-45um in diameter (the conventionally used spacer particles are 10-15um in diameter. Replacing them with spacer particles of 40-45um in diameter can increase the adhesive layer thickness by 10-20um, thereby solving the problem of chip damage caused by the chip edges touching the clamps during chip cutting). Then, heat-cure and bond the chip to the lead frame chip carrier.

[0066] Step 2: Place the encapsulated chip and lead frame chip carrier on the welding platform 4. Use the wire feed gun 7 to feed the gold wire to connect the solder joints between the chip and the lead frame chip carrier. Before connecting the first solder joint on the chip with the gold wire, weld on the second solder joint on the lead frame chip carrier. After welding, drive the gun sleeve 18 to close radially and use the cutter 45 to cut the gold wire. At the same time as cutting, the forming cavity 46 polymerizes the gold liquid on the second solder joint to form gold balls. Then drive the gun sleeve 18 to open and close radially to reset. At this time, the gold wire is automatically pushed out to the specified length under the drive of the first active wire feed wheel 8 and the first driven wire feed wheel 9 to prepare for the next welding.

[0067] Step 3: After gold balls are burned onto the second solder joint of the lead frame chip carrier, gold wires are used to connect the first solder joint on the chip to the second solder joint on the lead frame chip carrier. (By pre-burning gold balls onto the second solder joint on the lead frame chip carrier, the contact area between the solder joints is increased, which more fully realizes the fusion between the gold wire and the silver plating. When the second solder joint is welded again, the molecular bond between the gold wire and the gold ball on the substrate is realized. The fusion between gold of the same element can maximize the quality of the wire bonding and avoid poor circuit connection. In addition, the arc height stability of this type of wire arc is good and can be mass-produced.)

Claims

1. A smart card contactless module packaging device, comprising a wire feeding head (7) for feeding gold wire, characterized in that, It also includes a gun holster (18), which has two pairs and is located on both sides of the wire exit end of the wire exit head (7). The two pairs of gun holsters (18) can open and close radially. Each gun holster (18) has a semi-circular concave cavity at the end away from the wire exit head (7). The upper end of the concave cavity is a small diameter end that is sealed, and the lower end is a large diameter end that is open. The small diameter end that is sealed forms a cutter (45). When the two sets of gun holsters (18) are closed, the cutter (45) is used to cut the gold wire, and the two concave cavities form a completed forming cavity (46), so that the gold liquid forms a gold ball in the forming cavity (46). Also includes: The first active wire feeding wheel (8) is located on the wire feeding path of the gold wire, and a first driven wire feeding wheel (9) that moves relative to it is provided on one side of the first active wire feeding wheel (8). During the process of cutting the gold wire and shaping the gold liquid into a gold ball, the first active wire feeding wheel (8) and the first driven wire feeding wheel (9) clamp and do not feed wire. At the same time as the gun sleeve (18) opens and closes instantaneously, the first active wire feeding wheel (8) and the first driven wire feeding wheel (9) feed out a specified length of gold wire. The second active wire feeding wheel (10) is offset from the first active wire feeding wheel (8) and is located on the gold wire feeding path. A second driven wire feeding wheel (11) that moves relative to the second active wire feeding wheel (10) is provided on one side of the second active wire feeding wheel (10). When the first active wire feeding wheel (8) and the first driven wire feeding wheel (9) clamp the gold wire, the second driven wire feeding wheel (11) disengages from the second active wire feeding wheel (10) and does not clamp the gold wire.

2. The smart card contactless module packaging device according to claim 1, characterized in that, Also includes: The collar (17) can be fitted onto the holster (18) and move along the axial direction of the holster (18); The ridge (49), located at the top of the holster (18), is used to convert the moving force of the collar (17) into a counter-thrust, so that when the collar (17) moves along the ridge (49), it pushes the holster (18) to close, and after the holster (18) is closed, it can continue to move along the holster (18) so that the holster (18) is continuously closed.

3. The smart card contactless module packaging device according to claim 2, characterized in that, Also includes: The energy storage box (53) is located on one side of the first active wire feeding wheel (8). The energy storage box (53) is equipped with a spring (56) to provide the wire feeding power after the first active wire feeding wheel (8) and the first driven wire feeding wheel (9) clamp the gold wire. A buckle (57) is provided on the inner ring of the spring (56). The ratchet (55) is located inside the mainspring (56). A groove (58) is formed on one side of the ratchet teeth of the ratchet (55), and an arc surface (59) is formed on the other side of the ratchet teeth of the ratchet (55). When the ratchet (55) rotates along the groove (58), the groove (58) engages with the buckle (57), driving the mainspring (56) to tighten and store power. When the ratchet (55) rotates in the opposite direction along the arc surface (59), the buckle (57) deforms along the slope of the arc surface (59) to make way, maintaining the reset and relaxed state of the mainspring (56).

4. The smart card contactless module packaging device according to claim 2, characterized in that, It also includes a drive assembly, which is located on the wire feeding path of the gold wire and is used to drive the opening and closing of the holster (18), the relative movement and rotation of the first active wire feeding wheel (8) and the first driven wire feeding wheel (9), and the relative movement of the second active wire feeding wheel (10) and the second driven wire feeding wheel (11). The driving component includes: Drive arm (20), the drive arm (20) is located on one side of the gold wire feeding path; A snap fastener (21) is provided at one end of the drive arm (20) and is used to drive the gun holster (18) to open and close radially; Rack (22), the rack (22) is located at the other end of the drive arm (20) and is used to drive the spring (56) to tighten and store power, so that the spring (56) releases the stored power and drives the first active wire feeding wheel (8) and the first driven wire feeding wheel (9) to rotate, so that the gold wire is automatically pushed out to a specified length; The first wedge (23) has two sets and is staggered on the drive arm (20) to drive the first driven wire feed wheel (9) to move relative to the first active wire feed wheel (8); The second wedge (24) is provided in two sets. The second wedge (24) is staggered from the first wedge (23) and is alternately arranged on the drive arm (20) to drive the second driven wire feed wheel (11) to move relative to the second active wire feed wheel (10).

5. The smart card contactless module packaging device according to claim 4, characterized in that, The driving component also includes: The lifting guide rail (25) is located on one side of the moving path of the buckle (21) and a lifting slide (26) is provided along its guide rail direction. The lifting slide (26) is used to drive the collar (17) to move axially along the gun sleeve (18). The slider (44) is located on one side of the lifting slide (26) and can slide in and out of the lifting slide (26). A stop (39) is provided on one side of the slider (44), so that the stop (39) is pushed by the pressure buckle (21) to drive the lifting slide (26) to move. The movable wedge (40) is located on the other side of the slider (44). The movable wedge (40) can slide relative to the fixed wedge (41) fixed on the lifting guide rail (25), pushing the stop (39) and the rack (22) to separate and release the thrust on the lifting slide (26).

6. The smart card contactless module packaging device according to claim 4, characterized in that, The driving component also includes: The first slide (34) is located on the moving path of the first wedge (23) and forms a first relief cavity (35) in the first slide (34), so that the first relief cavity (35) is pushed by the slope of the first wedge (23) to push the first driven wire feeding wheel (9) to move towards the first active wire feeding wheel (8) to clamp the gold wire; The drive shaft (54) is located on one side of the moving path of the rack (22) and is fixedly connected to the ratchet (55) to convert the moving force of the rack (22) into the storage capacity of the spring (56); Driven shaft (33) is located on the central axis of the first active wire feeding wheel (8), and a gear pair is provided between the driven shaft (33) and the active shaft (54). After the first driven wire feeding wheel (9) and the first active wire feeding wheel (8) clamp the gold wire, the spring (56) releases its stored energy and drives the first active wire feeding wheel (8) and the first driven wire feeding wheel (9) to rotate and automatically push the gold wire out to a specified length.

7. The smart card contactless module packaging device according to claim 4, characterized in that, The drive assembly also includes a second slide (36) located on the moving path of the second wedge (24), and a second clearance cavity (37) is formed in the second slide (36), so that the second slide (36) is pushed by the slope of the second wedge (24) to push the second driven wire feeding wheel (11) away from the second active wire feeding wheel (10) to provide clearance for the automatic wire feeding of gold wire.

8. The smart card contactless module packaging device according to claim 7, characterized in that, It also includes a welding platform (4), which is located below the wire ejector head (7) and is used to support the encapsulated chip and the lead frame chip carrier.

9. A smart card contactless module packaging process, applicable to the smart card contactless module packaging device according to any one of claims 1-8, characterized in that, Includes the following steps: Step 1: Select epoxy resin with 40-45um spacing particles and heat-cur and bond the chip to the lead frame chip carrier. Step 2: Place the encapsulated chip and the lead frame chip carrier on the welding platform (4). Use the wire feeding gun (7) to feed the gold wire to connect the solder joint between the chip and the lead frame chip carrier. Before connecting the first solder joint on the chip with the gold wire, weld the second solder joint on the lead frame chip carrier. After welding, drive the gun sleeve (18) to close radially and use the cutter (45) to cut the gold wire. At the same time as cutting, the forming cavity (46) polymerizes the gold liquid on the second solder joint to form a gold ball. Then drive the gun sleeve (18) to open and close radially to reset. At this time, the gold wire is automatically pushed out to the specified length under the drive of the first active wire feeding wheel (8) and the first driven wire feeding wheel (9) to prepare for the next welding. Step 3: After gold balls are burned onto the second solder joint of the lead frame chip carrier, gold wires are used to connect the first solder joint on the chip to the second solder joint on the lead frame chip carrier.

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