Wafer cleaning device

Abstract

The invention discloses a wafer cleaning device. The wafer cleaning device comprises a supporting piece; the positioning assembly is arranged on the supporting piece and is used for positioning a wafer; the cleaning assembly comprises a first cleaning part and a second cleaning part, and the first cleaning part and the second cleaning part are both movably arranged on the supporting piece; the driving mechanism is arranged on the supporting piece, connected with the cleaning assembly and used for driving the first cleaning part and the second cleaning part to move in the first direction so as to enable the first cleaning part and the second cleaning part to sequentially clean the wafer in the first direction in the cleaning process; and the first cleaning part and the second cleaning part are driven to swing at the bottom of the wafer in the cleaning process. The method is used for pre-cleaning the middle part of the wafer before the wafer is cleaned, and the cleaning effect of the middle part of the wafer can be ensured while the cleaning efficiency of the wafer can be improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and in particular to a wafer cleaning apparatus. Background Technology

[0002] In batch processing, multiple semiconductor wafers are immersed vertically in a processing solution. Therefore, if contaminants adhere to the surface of the semiconductor wafers, these contaminants can diffuse into the processing solution and potentially re-adhere to the device formation area on the surface of the semiconductor wafers.

[0003] Patent application CN202311027212.4 discloses a wafer double-sided cleaning system and method, including: a base, a cleaning area and a cleaning robotic arm for cleaning wafers on the base, a support device for supporting wafers in the cleaning area, and a flipping device for flipping the wafers; when the wafer needs to be flipped, the support device blows the wafer from below to suspend it, and the flipping device cooperates with the support device to flip the wafer. The advantages are: by adding a flipping device to the wafer cleaning system and improving the support device, the wafer can be flipped during the cleaning process, thus achieving double-sided cleaning of the wafer; at the same time, by improving the clamping method, the support device suspends the wafer and clamps it in conjunction with the flipping device, avoiding damage caused by the wafer colliding with the processing table during clamping, thus improving product yield.

[0004] In actual cleaning processes, the center of the wafer is the key area to be cleaned, while double-sided cleaning directly cleans both sides of the wafer, making it impossible to specifically clean the center of the wafer.

[0005] Therefore, it is necessary to provide a new wafer cleaning apparatus to solve the aforementioned problems existing in the prior art. Summary of the Invention

[0006] The purpose of this invention is to provide a wafer cleaning apparatus for pre-cleaning the middle part of the wafer before wafer cleaning, which can improve the cleaning efficiency of the wafer while ensuring the cleaning effect of the middle part of the wafer.

[0007] To achieve the above objectives, the technical solution of the present invention is as follows: A wafer cleaning apparatus includes a support member; A positioning component, disposed on the support member, is used to position the wafer; The cleaning assembly includes a first cleaning section and a second cleaning section, both of which are movably disposed on the support member; A driving mechanism, disposed on the support member and connected to the cleaning assembly, is used to drive the first cleaning part and the second cleaning part to move along a first direction so that the first cleaning part and the second cleaning part sequentially clean the wafer along the first direction during the cleaning process; and to drive the first cleaning part and the second cleaning part to swing at the bottom of the wafer during the cleaning process.

[0008] By adopting the above technical solution, the central area of ​​the wafer is cleaned sequentially by the first cleaning unit and the second cleaning unit using the same or different cleaning methods, pre-cleaning the wafer for the formal cleaning process. This shortens the time for subsequent cleaning processes, improves cleaning efficiency, and reduces the cleaning area in subsequent cleaning, thus shortening the overall wafer cleaning time. Furthermore, the first and second cleaning units can be configured as different cleaning devices to facilitate changing different cleaning methods for the wafer, thereby improving cleaning efficiency.

[0009] Optionally, the drive mechanism includes: Guide members are provided on the support members; The first movable member is movably disposed on the guide member along the first direction; The second movable member is rotatably disposed on the first movable member and is used to fix the cleaning assembly; A swinging device is provided on the first moving member and connected to the second moving member to drive the second moving member to rotate on the first moving member; A driving device is provided on the support member and connected to the first moving member, driving the first moving member to move along the first direction on the guide member, so that the second moving member and the cleaning assembly move along the first direction; the swinging device is used to drive the second moving member to rotate on the first moving member, so that the cleaning assembly swings around the rotation axis of the second moving member during the movement along the first direction.

[0010] Optionally, the second moving member is provided with a control component, the control component including: A supply component is provided on the second movable component, one end of which is connected to the first cleaning section, and the other end is used to connect to the liquid supply device. The liquid from the liquid supply device flows through the supply component and is discharged through the first cleaning section to clean the wafer. A control component is disposed on the second moving member and connected to the second cleaning section, for driving the second cleaning section to move in the vertical direction. When the second cleaning section contacts the bottom of the wafer, the control component drives the second cleaning section to rotate in order to clean the wafer.

[0011] Optionally, the control component includes: A first controller is disposed on the second moving member and connected to the second cleaning unit to drive the second cleaning unit to move vertically to contact the wafer; A second controller is disposed on the second moving member. The second controller has a control lever that passes through the second cleaning section, so that the second cleaning section is movably disposed on the second controller in the vertical direction. The second controller is used to drive the second cleaning section to rotate in order to clean the wafer. A sensor is located at the end of the second controller to detect the pressure exerted on the wafer by the second cleaning unit.

[0012] Optional, also includes: A first baffle is disposed on the second movable member and positioned between the cleaning assembly and the control assembly to separate the cleaning assembly and the control assembly; A second baffle is arranged around the first baffle to form a storage space for collecting the liquid from the first cleaning section.

[0013] Optionally, the first baffle is provided with a first drying element and a second drying element, the first drying element being arranged around the first cleaning part; the second drying element being arranged around the second cleaning part; both the first drying element and the second drying element are provided with a plurality of air holes, the air holes being used to spray airflow so that the first drying element and the first cleaning part form an independent cleaning area, and the second drying element and the second cleaning part form an independent cleaning area.

[0014] Optionally, the second movable member is provided with a plurality of receiving members that are movably arranged in the vertical direction, and the receiving members penetrate the first baffle. In this process, multiple receiving components move upward in a vertical direction, the wafer is placed on the receiving components, and the multiple receiving components drive the wafer downward in a vertical direction, so that the wafer comes into contact with the positioning component.

[0015] Optionally, the positioning component includes: The positioning rods are symmetrically arranged on the support member and distributed on both sides of the cleaning assembly; An adsorption element is disposed at the top of the positioning rod and is used to contact the wafer to adsorb the wafer.

[0016] Optionally, the support member is symmetrically provided with waterproof baffles; the waterproof baffles include: A support frame, movably disposed on the support member along a first direction; A baffle portion is fixedly disposed on the top of the support frame; an isolation groove is formed on the baffle portion, and the isolation groove corresponds to the position of the wafer; A gas supply component is fixedly installed on the baffle portion. One end is connected to the isolation groove, and the other end is used to connect to the supply device, so that the gas from the supply device flows through the gas supply component and the isolation groove and is then sprayed onto the upper surface of the wafer.

[0017] Optionally, the driving device includes: A transmission wheel is symmetrically arranged along a first direction, and the transmission wheel is rotatably disposed on the support member; A conveyor belt is fitted onto symmetrically arranged drive wheels so that when one drive wheel rotates, the other drive wheel rotates synchronously. A drive unit is fixedly mounted on the support member and connected to one of the transmission wheels to drive the transmission wheel to rotate. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the main structure of a wafer cleaning apparatus according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a waterproof baffle according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the installation position of a swing device according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the connection structure between a control component and a second cleaning unit according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of a wafer cleaning apparatus in the first cleaning section according to an embodiment of the present invention. Figure 6 This is a schematic diagram of the structure of a wafer cleaning apparatus according to an embodiment of the present invention, where the first cleaning section is far away from the wafer and the second cleaning section is close to the wafer. Figure 7 This is a schematic diagram of the structure of a wafer cleaning apparatus in the second cleaning section according to an embodiment of the present invention. Figure 8 This is a schematic diagram of the structure of a wafer cleaning device according to an embodiment of the present invention, after cleaning is completed, a first drying element and a second drying element are dried, and the first drying element moves to the bottom of the wafer; Figure 9 This is a schematic diagram of the structure of a wafer cleaning device resetting after cleaning, according to an embodiment of the present invention.

[0019] Figure label: 100. Support component; 110. Positioning assembly; 111. Positioning rod; 112. Adsorption component; 121. First cleaning section; 122. Second cleaning section; 131. Guide component; 132. First moving component; 133. Second moving component; 134. Swinging device; 135. Driving device; 136. Transmission wheel; 137. Conveyor belt; 138. Driver; 139. Adjusting component; 210. Supply component; 221. First controller; 222, Second controller; 223, Sensor; 224, Control lever; 225, Vertical guide rail; 226, Vertical stop; 310, First baffle; 311, First drying element; 312, Second drying element; 314, Receiving element; 315, Pusher; 320, Second baffle; 400, Waterproof baffle; 410, Support frame; 420, Baffle section; 430, Air supply element; 440, Isolation tank; 500, Leakage sensor. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects.

[0021] The following is in conjunction with the appendix Figure 1-9 The specific embodiments of the present invention will be further described in detail below.

[0022] Embodiments of the present invention provide a wafer cleaning apparatus for cleaning wafers. Specifically, this wafer cleaning apparatus is used for pre-cleaning the wafer. In the prior art, the wafer cleaning process directly cleans the front and back sides of the wafer. However, this wafer cleaning apparatus cleans the central area of ​​the back side of the wafer for pre-cleaning. After pre-cleaning, in the next cleaning process, the remaining areas of the back side and the front side of the wafer are cleaned. Pre-cleaning the central area of ​​the back side of the wafer reduces process steps, shortens process time, and improves cleaning efficiency for subsequent double-sided cleaning. The wafer cleaning apparatus includes a support member 100. Positioning component 110, disposed on support 100, is used to position the wafer; The cleaning assembly includes a first cleaning part 121 and a second cleaning part 122, both of which are movably disposed on the support member 100. A drive mechanism, located on the support member 100 and connected to the cleaning assembly, is used to drive the first cleaning part 121 and the second cleaning part 122 to move along a first direction, so that the first cleaning part 121 and the second cleaning part 122 sequentially clean the wafer along the first direction during the cleaning process; and to drive the first cleaning part 121 and the second cleaning part 122 to swing at the bottom of the wafer during the cleaning process.

[0023] In some embodiments, the first direction is the radial direction of the wafer. In some more specific embodiments, the first direction is exemplified by the longitudinal direction of the support 100.

[0024] In some embodiments, the support member 100 is plate-shaped, and the support frame 410 is provided with a positioning component 110. The positioning component 110 is used to support and position the wafer. During the cleaning process, the wafer is placed on the positioning component 110. The positioning component 110 supports the wafer air passage, so that there is a gap between the wafer and the end face of the support member 100. At the same time, after the wafer is placed on the positioning component 110, the end face of the wafer facing the support member 100 is the back side of the wafer, which facilitates the cleaning process of the back side of the wafer.

[0025] The first cleaning section 121 and the second cleaning section 122 are spaced apart and can move synchronously. During the cleaning process, both the first cleaning section 121 and the second cleaning section 122 can clean the wafer. Specifically, during the cleaning process, the first cleaning section 121 and the second cleaning section 122 move along a first direction, so that the first cleaning section 121 and the second cleaning section 122 pass through the wafer sequentially, thereby cleaning the wafer.

[0026] In some specific embodiments, the cleaning methods of the first cleaning unit 121 and the second cleaning unit 122 are the same.

[0027] In some specific embodiments, the cleaning methods of the first cleaning unit 121 and the second cleaning unit 122 are different. The specific cleaning methods can be nozzle cleaning, ultrasonic cleaning or brush cleaning, etc.

[0028] In some embodiments, the drive mechanism is connected to the cleaning assembly and can drive the cleaning assembly to move along a first direction on the support 100. Simultaneously, during the movement of the cleaning assembly along the first direction, it can drive the cleaning assembly to reciprocate in the horizontal direction. Specifically, the drive mechanism drives the first cleaning section 121 and the second cleaning section 122 to move in the first direction, allowing the first cleaning section 121 and the second cleaning section 122 to sequentially pass over the wafer in the first direction, thereby facilitating wafer cleaning. To enhance the cleaning effect, while the first cleaning section 121 and the second cleaning section 122 are cleaning the wafer, the drive mechanism can also drive the first cleaning section 121 and the second cleaning section 122 to swing at the bottom of the wafer, i.e., to reciprocate on the back side of the wafer, increasing the cleaning range of the first cleaning section 121 and the second cleaning section 122, and simultaneously increasing the cleaning efficiency of the first cleaning section 121 and the second cleaning section 122.

[0029] The drive mechanism includes: Guide component 131 is provided on support component 100; The first movable member 132 is movable along the first direction and is disposed on the guide member 131; The second movable member 133 is rotatably disposed on the first movable member 132 and is used to fix the cleaning assembly; The swing device 134 is disposed on the first moving member 132 and connected to the second moving member 133, so as to drive the second moving member 133 to rotate on the first moving member 132; A driving device 135 is provided on the support member 100 and connected to the first moving member 132. It drives the first moving member 132 to move along the first direction on the guide member 131, so that the second moving member 133 and the cleaning assembly move along the first direction. A swinging device 134 is used to drive the second moving member 133 to rotate on the first moving member 132, so that the cleaning assembly swings around the axis of the second moving member 133 during the movement along the first direction.

[0030] Specifically, the guide member 131 can be plate-shaped, rod-shaped, strip-shaped, etc., without limitation, as long as it can restrict the direction. The length direction of the guide member 131 is parallel to the first direction; the first moving member 132 is movably disposed on the guide member 131, and the first moving member 132 can move along the length direction of the guide member 131. In some embodiments, the guide member 131 is a guide rail, and the first moving member 132 is a slider slidably disposed on the guide rail, thereby enabling the first moving member 132 to move along the length direction of the guide member 131.

[0031] In some embodiments, a second moving member 133 is rotatably mounted on the first moving member 132, so that when the first moving member 132 moves along the length direction of the guide member 131, it can drive the second moving member 133 to move synchronously with the first moving member 132. Simultaneously, a cleaning assembly is mounted on the second moving member 133, so that the first moving member 132 can drive the second moving member 133 and the cleaning assembly to move synchronously during its movement. Since the second moving member 133 is rotatable, it rotates during the movement of the cleaning assembly to achieve the oscillation of the cleaning assembly. Specifically, a swinging device 134 is also fixedly mounted on the first moving member 132. The fixing method can be adhesive, snap-fit, or bolted, etc., without limitation, as long as the position of the swinging device 134 on the first moving member 132 does not change. The swinging device 134 is connected to the second moving member 133 and is used to drive the second moving member 133 to rotate on the first moving member 132 to achieve the oscillation of the second moving member 133. In some specific embodiments, the swing device 134 is a motor. The swing device 134 is fixedly mounted on the first moving member 132, and the second moving member 133 is fixedly mounted on the rotating shaft of the swing device 134. The rotating shaft of the swing device 134 is vertically arranged so that the swing device 134 can drive the second moving member 133 to rotate when it is started. By controlling the rotation angle of the rotating shaft of the swing device 134, it can reciprocate within a certain angle range, thereby realizing the swing of the second moving member 133. In some specific embodiments, the swing device 134 is a motor, the swing device 134 is fixedly mounted on the first moving member 132, and the rotating shaft of the swing device 134 is horizontally arranged. A reducer is also keyed to the rotating shaft of the swing device 134. More specifically, the reducer is a bevel gear reducer. The bevel gear reducer can convert the horizontal rotational motion of the swing device 134 into vertical rotational motion through the meshing of the bevel gears, thereby driving the second moving member 133 to rotate on the first moving member 132. By controlling the rotation angle of the rotating shaft of the swing device 134, it can be made to reciprocate within a certain angle range, thereby realizing the swing of the second moving member 133.

[0032] More specifically, the driving device 135 is connected to the first moving member 132 and is used to drive the first moving member 132 to move along the first direction on the guide member 131, thereby driving the cleaning component to move. The driving device 135 can be a linear electric cylinder or a gear rack, etc., and is not limited here, as long as the driving device 135 can drive the first moving member 132 to move along the first direction on the guide member 131. The transmission method used in this embodiment will be described in detail later.

[0033] The second moving part 133 is provided with a control component, which includes: The supply component 210 is located on the second moving component 133. One end is connected to the first cleaning section 121, and the other end is used to connect to the liquid supply device. The liquid from the liquid supply device flows through the supply component 210 and is discharged through the first cleaning section 121 to clean the wafer. A control component is provided on the second moving member 133 and connected to the second cleaning section 122. It is used to drive the second cleaning section 122 to move in the vertical direction. When the second cleaning section 122 contacts the bottom of the wafer, the control component drives the second cleaning section 122 to rotate in order to clean the wafer.

[0034] To facilitate the wafer cleaning process, in some embodiments, a control component is used to control the first cleaning unit 121 and the second cleaning unit 122 to clean the wafer. The supply unit 210 is fixedly mounted on the second moving unit 133, and its fixing method can be adhesive, snap-fit, or bolted, etc., without limitation, as long as the position of the supply unit 210 on the second moving unit 133 does not change and the movement of the second moving unit 133 can drive the movement of the supply unit 210. One end of the supply unit 210 is connected to the first cleaning unit 121, and the other end is connected to the liquid supply device; that is, the first cleaning unit 121 is a nozzle, and the liquid supply device is located outside the wafer cleaning device to provide cleaning fluid. Specifically, the liquid supply device and the supply unit 210 are connected by a pipe so that the liquid supply device can maintain liquid supply to the supply unit 210 during the movement of the first cleaning unit 121. The liquid supplied by the liquid supply unit enters the supply component 210 through a pipe, and then enters the first cleaning unit 121 through the supply component 210, so as to be sprayed out from the first cleaning unit 121 to clean the wafer. In some specific embodiments, the supply component 210 can be a solenoid valve, or other devices that can control the flow of liquid. There are no restrictions here, as long as it can realize the transmission and control of the flow of liquid.

[0035] A control component is located on the second moving member 133 and is connected to the second cleaning section 122, enabling the second cleaning section 122 to move. Specifically, after the wafer is placed on the positioning assembly 110, there is a gap between the back side of the wafer and the second cleaning section 122. The control component controls the second cleaning section 122 to move vertically until it contacts the back side of the wafer. At this point, the control component controls the second cleaning section 122 to rotate, thereby cleaning the wafer. In some specific embodiments, the second cleaning section 122 is a brush head, and it rotates to clean the wafer. In some more specific embodiments, the first cleaning section 121 first cleans the wafer, while the cleaning assembly moves, causing the second cleaning section 122 to clean the wafer; that is, spray cleaning is performed first, followed by brush cleaning, thereby improving the cleaning efficiency of the wafer.

[0036] To facilitate control of the movement of the second cleaning unit 122, the control components include: The first controller 221 is located on the second moving member 133 and connected to the second cleaning unit 122 to drive the second cleaning unit 122 to move vertically to contact the wafer. The second controller 222 is disposed on the second moving member 133. The second controller 222 has a control lever 224, which passes through the second cleaning section 122 so that the second cleaning section 122 is movably disposed on the second controller 222 in the vertical direction. The second controller 222 is used to drive the second cleaning section 122 to rotate in order to clean the wafer. Sensor 223 is located at the end of the second controller 222 to detect the pressure of the second cleaning section 122 on the wafer.

[0037] In some embodiments, the first controller 221 is fixedly mounted on the second moving member 133. The fixing method can be adhesive, snap-fit, or bolted, and is not limited thereto, as long as the position of the first controller 221 on the second moving member 133 does not move. The first controller 221 is used to drive the second cleaning section 122 to move vertically until it contacts the wafer. In some specific embodiments, the first controller 221 is an electric cylinder or a pneumatic cylinder, used to push the second cleaning section 122 to move vertically.

[0038] In some embodiments, the second controller 222 is fixedly mounted on the second moving member 133. The fixing method can be adhesive, snap-fit, or bolted, etc., and is not limited thereto, as long as the position of the second controller 222 on the second moving member 133 does not move. When the second cleaning section 122 contacts the wafer, the second controller 222 drives the second cleaning section 122 to rotate, thereby cleaning the wafer. In some specific embodiments, the second controller 222 is a motor, and the motor shaft is the control lever 224. The control lever 224 passes through the second cleaning section 122, allowing the second cleaning section 122 to rise or fall vertically relative to the control lever 224, so that the first starter can drive the second cleaning section 122 to move vertically. In some more specific embodiments, in order to facilitate the second controller 222 to drive the second cleaning part 122 to rotate, the cross-sectional shape of the control rod 224 can be set to be polygonal, so that the second cleaning part 122 can move vertically on the control rod 224, and the rotation of the control rod 224 can drive the second cleaning part 122 to rotate; or a protrusion is provided on the side wall of the control rod 224, and a groove is provided vertically inside the second cleaning part 122, and the protrusion can slide vertically in the groove, so that the second cleaning part 122 can move vertically on the control rod 224, and the rotation of the control rod 224 can drive the second cleaning part 122 to rotate.

[0039] In some embodiments, a sensor 223 is provided at the end of the second controller 222. The sensor 223 does not interfere with the movement of the control lever 224. When there is no wafer cleaning process, for example, when the wafer is first placed on the positioning assembly 110, there is a gap between the second cleaning section 122 and the wafer, that is, the bottom of the second cleaning section 122 is in contact with the sensor 223. The output value of the sensor 223 is set to N at this time. During the wafer cleaning process, that is, when the second cleaning section 122 is in contact with the wafer, the first driver drives the second cleaning section 122 to move, causing the second cleaning section 122 to separate from the sensor 223. The output value of the second sensor 223 begins to decrease until it decreases to 0. During the movement of the second cleaning section 122 toward the wafer and during the wafer cleaning process, the pressure of the second cleaning section 122 on the wafer can be determined by the output value of the sensor 223. Furthermore, by controlling the second controller 222, the pressure of the second cleaning section 122 on the wafer can be controlled, which facilitates the wafer cleaning process.

[0040] In some specific embodiments, to facilitate the vertical movement of the second cleaning unit, the second moving member 133 is provided with a vertical slide rail, wherein the length direction of the vertical slide rail is vertically arranged, and a vertical stop 226 is slidably arranged on the vertical slide rail. The vertical stop 226 can slide on the vertical slide rail in the vertical direction, and at the same time, the vertical stop 226 is connected to the second cleaning unit 122; at the same time, the second cleaning unit 122 and the vertical stop 226 can rotate relative to each other. For example, the bottom of the second cleaning unit 122 is rotatably disposed on the vertical stop 226, and the control rod 224 passes through the vertical stop 226 and is connected to the second cleaning unit 122, so that when the control rod 224 rotates, it can drive the second cleaning unit 122 to rotate. The first controller 221 is connected to the vertical stop 226 to drive the vertical stop 226 to move on the vertical guide rail 225. In some more specific embodiments, the first controller 221 is selected as a low-friction cylinder; the vertical slide rail is selected as an anti-creep guide rail, thereby reducing the pressure change during the cleaning process of the second cleaning section 122 on the wafer, improving the stability of substrate cleaning, and avoiding the problem of wafer flying caused by unstable pressure.

[0041] Since the first cleaning unit 121 can spray liquid, it is necessary to collect the waste cleaning solution during the cleaning process; therefore, the wafer cleaning apparatus is characterized by further comprising: The first baffle 310 is disposed on the second moving member 133 and placed between the cleaning assembly and the control assembly to separate the cleaning assembly and the control assembly; The second baffle 320 is arranged around the first baffle 310 to form a storage space for collecting the liquid from the first cleaning section 121.

[0042] The first baffle 310 and the second baffle 320 cooperate to collect the liquid sprayed from the first cleaning section 121. Specifically, the first baffle 310 is disposed on the second moving member 133 and positioned between the cleaning assembly and the control assembly. More specifically, the first baffle 310 can be fixedly disposed on the second moving member 133, and the fixing method can be adhesive, snap-fit, or bolted, etc., without limitation, as long as the position of the first baffle 310 on the second moving member 133 does not shift. Since the first cleaning section 121 is a nozzle, it passes through the first baffle 310, which separates the first cleaning section 121 from the supply member 210. The second cleaning section 122 is a brush head, so the first baffle 310 has a mounting hole, through which the second cleaning section 122 passes and can move vertically within the mounting hole, thus separating the second cleaning section 122 from the control assembly. Therefore, the first baffle 310 can initially block the liquid. More specifically, the second baffle 320 surrounds the first baffle 310, forming a storage space. The upper end of the second baffle 320 is flush with or slightly higher than the upper end of the first baffle 310, creating a storage space between the sidewalls of the second baffle 320 and the first baffle 310 to facilitate the collection of liquid generated by the first cleaning section 121. A drain port is provided at the bottom of the storage space to drain the collected liquid. In some more specific embodiments, a leak sensor 500 is provided within the storage space, and a leak sensor 500 is also provided on the supply component 210 to detect whether liquid leakage has occurred. In some more specific embodiments, the leak sensor 500 is located on the support component 100 to detect whether liquid leakage has occurred. When leaking liquid comes into contact with the leak sensor 500, the leak sensor 500 will trigger an alarm or transmit a leak signal to the control unit.

[0043] In some embodiments, the first cleaning section 121 passes through the first baffle 310 while maintaining a seal, and the sealing method includes gas sealing, sealing ring sealing, etc.; the second cleaning section 122 maintains a dynamic seal with the mounting hole.

[0044] Since the first cleaning section 121 can spray liquid, it is also necessary to remove the liquid from the wafer surface in a timely manner during the cleaning process. In order to facilitate the removal of liquid from the wafer, the first baffle 310 is provided with a first drying element 311 and a second drying element 312. The first drying element 311 is arranged around the first cleaning section 121; the second drying element 312 is arranged around the second cleaning section 122. Both the first drying element 311 and the second drying element 312 are provided with multiple air holes for spraying airflow, so that the first drying element 311 and the first cleaning section 121 form an independent cleaning area, and the second drying element 312 and the second cleaning section 122 form an independent cleaning area.

[0045] In some embodiments, the first drying element 311 has the same shape as the second drying element 312, and both the first drying element 311 and the second drying element 312 are annular. Both the first drying element 311 and the second drying element 312 are fixedly disposed on the first baffle 310. The position of the first drying element 311 corresponds to the position of the first cleaning section 121, and the position of the second drying element 312 corresponds to the position of the second cleaning section 122. Specifically, the first drying element 311 is disposed around the first cleaning section 121, that is, the first cleaning section 121 passes through the first drying element 311. During the cleaning process of the first cleaning section 121, the first drying element 311 restricts the liquid sprayed from the first cleaning section 121, thereby limiting the range of the liquid sprayed from the first cleaning section 121. The second drying element 312 is arranged around the second cleaning section 122, that is, the second cleaning section 122 is inserted inside the second drying element 312. During the cleaning process of the second cleaning section 122, since the second cleaning section 122 can rotate and there is liquid residue on the wafer, the second cleaning section 122 will also splash liquid during the cleaning process. The second drying element 312 also plays the role of intercepting liquid.

[0046] In some specific embodiments, both the first drying element 311 and the second drying element 312 are provided with multiple air holes; the first drying element 311 is used as an example for description. The interior of the first drying element 311 is hollow, and multiple air holes are opened on the first drying element 311. The multiple air holes are evenly distributed along the circumference of the first drying element 311, and the hollow first drying element 311 is connected to an external air supply device. The air supply device is used to provide gas, which enters the first drying element 311 and is ejected through the air holes. In some more specific embodiments, the multiple air holes are all located on the top of the first drying element 311. During the cleaning process, the first cleaning part 121 sprays cleaning liquid onto the wafer. The cleaning liquid diffuses at the bottom of the wafer. At this time, the airflow ejected from the air holes on the first drying element 311 forms an air wall, preventing the cleaning liquid from passing through the air wall, that is, confining the cleaning liquid within the range of the first drying element 311 for cleaning. Meanwhile, a portion of the first drying element 311 is fixedly disposed on the first baffle 310, and the other portion extends to the outside of the first baffle 310 and is placed within the storage space, so that the cleaning liquid can be intercepted by the first drying element 311 and then enter the first storage space for collection. In some more specific embodiments, multiple vents can be evenly disposed on the sidewall of the first drying element 311, and the vents are inclined so that when air is ejected from the vents, an air wall is formed between the ejected air and the bottom of the wafer to block the liquid. Furthermore, when the first cleaning section 121 is not working, the air ejected from the vents can also be controlled to dry the wafer. In addition, it can also block external contaminants, such as liquid outside the cleaning area, and can quickly dry the substrate, shortening the cleaning time. In some more specific embodiments, the second drying element 312 has the same function as the first drying element 311, that is, to intercept the liquid thrown out during the rotation of the second cleaning section 122, while blocking external contaminants and drying the wafer.

[0047] To facilitate wafer fixation, the positioning assembly 110 includes: The symmetrically arranged positioning rods 111 are located on the support member 100 and distributed on both sides of the cleaning assembly; The adsorption element 112 is located on the top of the positioning rod 111 and is used to contact the wafer to adsorb the wafer.

[0048] Specifically, the positioning rod 111 is vertically arranged and fixed to the support member 100. The fixing method can be adhesive, snap-fit, or bolted, etc., without limitation, as long as the position of the positioning rod 111 on the support member 100 does not shift. There are two positioning rods 111, symmetrically arranged about the first direction, and distributed on both sides of the cleaning assembly. This allows the cleaning assembly to pass under the wafer after the positioning rods 111 support it, for cleaning the wafer.

[0049] More specifically, the top of the positioning rod 111 is equipped with an adsorption element 112. To facilitate wafer fixation, each positioning rod 111 has two adsorption elements 112 on its top, and the two adsorption elements 112 are symmetrically arranged on the top of the positioning rod 111. The adsorption element 112 can be connected to an external vacuum device. When the wafer comes into contact with the adsorption element 112, the external vacuum device evacuates the adsorption element 112 to achieve wafer adsorption. In addition, electrostatic adsorption can also be used, without limitation, as long as it can fix the position of the wafer.

[0050] In order to facilitate placing the wafer on the positioning rod 111 and fixing it with the adsorption member 112, the second moving member 133 is provided with multiple receiving members 314 that can move in the vertical direction, and the receiving members 314 penetrate the first baffle 310. In this process, multiple receiving components 314 move upward in a vertical direction, the wafer is placed on the receiving components 314, and the multiple receiving components 314 drive the wafer to move downward in a vertical direction, so that the wafer comes into contact with the positioning component 110.

[0051] In some embodiments, the second movable member 133 is provided with a plurality of receiving members 314, which can rise or fall vertically. The first baffle 310 has a plurality of through holes, each corresponding to a plurality of receiving members 314, through which the receiving members 314 can pass. Meanwhile, the second movable member 133 is fixedly provided with a pusher 315, which is connected to the receiving members 314 to push the receiving members 314 to move vertically.

[0052] In some specific embodiments, the actuator 315 is an electric cylinder, and each actuator 315 corresponds to a receiving member 314, and the two are fixed to each other.

[0053] In some specific embodiments, the actuator 315 is an electric cylinder, and multiple receiving parts 314 correspond to one actuator 315.

[0054] The pusher 315 starts and drives the receiving part 314 to rise vertically, contact the wafer and support the wafer. After contacting the wafer, the pusher 315 drives the receiving part 314 to fall vertically, driving the wafer to fall synchronously until the wafer contacts the adsorption part 112 and is fixed by the adsorption part 112.

[0055] In some more specific embodiments, multiple receiving elements 314 are disposed between the first drying element 311 and the second drying element 312, so as not to interfere with the cleaning process.

[0056] To facilitate the movement of the first moving member 132 by the driving device 135, the driving device 135 includes: A transmission wheel 136 is symmetrically arranged along the first direction and is rotatably mounted on the support member 100. The conveyor belt 137 is fitted onto symmetrically arranged drive wheels 136 so that when one drive wheel 136 rotates, the other drive wheel 136 rotates synchronously. The drive unit 138 is fixedly mounted on the support member 100 and connected to one of the transmission wheels 136 to drive the transmission wheel 136 to rotate.

[0057] Specifically, both drive wheels 136 are rotatably mounted on the support member 100 via a rotating shaft, and the conveyor belt 137 is sleeved on the drive wheels 136. When one drive wheel 136 rotates, the other drive wheel 136 can rotate synchronously. At this time, the conveyor belt 137 rotates around the two drive wheels 136. In order to facilitate the movement of the first moving member 132, the first moving member 132 is fixed to a portion of the conveyor belt 137. The fixing method can be adhesive, snap-fit, or bolted, etc., without limitation, as long as there is no relative movement between the first moving member 132 and the portion of the conveyor belt 137 that fixes the first moving member 132. This allows the conveyor belt 137 to drive the first moving member 132 to move along the first direction on the guide member 131 during movement, thereby facilitating the control of the movement of the first cleaning section 121 and the second cleaning section 122. More specifically, a drive 138 is fixedly mounted on the support member 100. The fixing method can be adhesive, snap-fit, or bolted, etc., without limitation, as long as the position of the drive 138 on the support member 100 does not shift. In some specific embodiments, the drive 138 is a motor, and the shaft of the drive member is keyed to one of the transmission wheels 136 to drive its rotation, thereby driving the first moving member 132 to reciprocate along a first direction on the guide member 131. It is worth noting that the reciprocating motion here refers to the reciprocating motion achieved by the change in the rotation direction of the motor shaft.

[0058] In some embodiments, the guide 131 is a wide-width guide rail, which has higher stability and anti-overturning capability. The actuator 138 is equipped with an absolute encoder, which can accurately determine the position of the second cleaning section 122 and the first cleaning section 121 in the system, thereby achieving stable control of the cleaning process. In some specific embodiments, the encoder is a potentiometer, a laser rangefinder, or other device capable of position detection.

[0059] In some specific embodiments, the support member 100 is further provided with an adjusting member 139, which is connected to one of the drive wheels 136 to adjust the position of the drive wheel 136, thereby adjusting the tension of the conveyor belt 137. More specifically, one of the two drive wheels 136 is connected to the drive unit 138, and the other is connected to the adjusting member 139. In some more specific embodiments, the process of the adjusting member 139 is existing technology, for example, using the elastic deformation of a spring to generate tension. When the conveyor belt 137 is slack, the spring contracts, bringing the tensioning wheel closer to the conveyor belt 137; when the conveyor belt 137 is tensioned, the spring extends, moving the tensioning wheel away from the conveyor belt 137. This achieves tensioning; the specific details are not elaborated here.

[0060] During the cleaning process, in order to reduce liquid splashing onto the front side of the wafer, i.e., the top surface of the wafer, waterproof baffles 400 are symmetrically provided on the support 100; the waterproof baffles 400 include: The support frame 410 is movable along the first direction and is mounted on the support member 100; The baffle portion 420 is fixedly mounted on the top of the support frame 410; the baffle portion 420 is provided with an isolation groove 440, which corresponds to the position of the wafer; The gas supply component 430 is fixedly installed on the baffle portion 420. One end is connected to the isolation groove 440, and the other end is used to connect to the supply device so that the gas from the supply device flows through the gas supply component 430 and the isolation groove 440 and is then sprayed onto the upper surface of the wafer.

[0061] In some embodiments, two waterproof baffles 400 are provided, respectively distributed on both sides of the cleaning assembly along the first direction, and do not interfere with the movement of the cleaning assembly. Specifically, the support member 100 is provided with a guide rail, the length direction of which is parallel to the first direction, and a guide block is provided on the guide rail, which can slide along the length direction of the guide rail. The support frame 410 is fixedly mounted on the guide block so that the support frame 410 can move synchronously with the guide block. In some specific embodiments, two guide rails are provided, symmetrical about the first direction, to facilitate the movement of the support frame 410.

[0062] In some more specific embodiments, the baffle portion 420 is fixedly mounted on the top of the support frame 410, and the support frame 410 can drive the baffle portion 420 to move synchronously when it moves. The opposing sidewalls of the two baffle portions 420 are both arc-shaped and adapted to the shape of the wafer. At the same time, the baffle portion 420 is provided with an isolation groove 440, which can be directly opposite the top surface of the wafer (i.e., the front surface of the wafer) or directly opposite the sidewall of the wafer. More specifically, the baffle portion 420 is also provided with an air supply component 430. One end of the air supply component 430 is connected to the isolation groove 440, and the other end is connected to an external air supply device. The gas supplied by the air supply device enters the isolation groove 440 through the air supply component 430 and is blown out through the isolation groove 440 to the sidewall or top surface of the wafer to isolate the front and back surfaces of the wafer and reduce the possibility of contamination on the front surface of the wafer. Furthermore, a cylinder or electric cylinder is fixedly installed on the support 100 and connected to the guide block to push the guide block to move on the support 100, thereby enabling the two waterproof baffles 400 to cooperate and move on the support 100. During the cleaning process, the two waterproof baffles 400 move away from each other, providing lifting space for the wafer and not interfering with the wafer placement and removal process. After the wafer is fixed, the two waterproof baffles 400 move closer to each other and spray gas from the isolation groove 440, thereby isolating the front and back of the wafer and reducing the possibility of the wafer being contaminated during the cleaning process.

[0063] During the cleaning process, the receiving member 314 moves vertically and extends from the first baffle 310 to receive the wafer. After the wafer is placed on the receiving member 314, the receiving member 314 descends until the wafer contacts the adsorption member 112, which then fixes the wafer in place. At this time, the driving device 135 drives the cleaning assembly to move in the first direction, so that the nozzle of the first cleaning section 121 is directly facing the center of the wafer. The first cleaning section 121 is then activated, spraying cleaning fluid to clean the center of the wafer. Simultaneously, gas is introduced into the first drying member 311. The air wall formed by the first drying member 311 limits the cleaning range of the cleaning fluid while also drying the wafer. After both the first cleaning section 121 and the first drying member 311 are activated, the swing device 134 is activated to swing the cleaning assembly horizontally, causing the first cleaning section 121 in the cleaning assembly to swing back and forth around the axis of the cleaning assembly, with the swing range within the area where the wafer is located, to further improve the cleaning effect on the wafer. Simultaneously, the driving device 135 drives the cleaning assembly to resume movement in the first direction until the first cleaning section 121 leaves the area where the wafer is located, and the second cleaning section 122 moves to the cleaning area at the bottom of the wafer. At this time, the first cleaning section 121 stops cleaning the wafer, and the brush head in the second cleaning section 122 starts to rotate and clean the cleaning area in the middle of the wafer. At this time, the second drying element 312 is activated. Since there is residual liquid on the wafer, the liquid will splash during the rotation of the brush head. The second drying element 312 has the function of limiting the range of liquid splashing and can also dry the liquid. The driving device 135 continues to drive the cleaning assembly to continue moving in the above-mentioned direction until the second cleaning section 122 completes the cleaning of the middle of the wafer. At this time, the second cleaning unit 122 stops working, and the driving device 135 drives the cleaning components to move in the opposite direction. The first drying unit 311 and the second drying unit 312 continue to work, drying the bottom of the wafer, that is, blowing the water on the wafer dry. In the combined motion of translation and rotation, the first drying unit 311 and the second drying unit 312 can achieve cleaning of different central area ranges of the wafer, and can prevent internal dirty liquid from entering the outside, and can also prevent external contamination from entering, thus blocking cross-contamination.

[0064] The implementation principle of the wafer cleaning apparatus in this application embodiment is as follows: The first cleaning unit 121 is activated, spraying cleaning fluid to clean the middle part of the wafer. Simultaneously, gas is introduced into the first drying unit 311. The air wall formed by the first drying unit 311 restricts the cleaning range of the cleaning fluid while also drying the wafer. After both the first cleaning unit 121 and the first drying unit 311 are activated, the oscillation device 134 is activated, causing the cleaning assembly to oscillate horizontally. This causes the first cleaning unit 121 in the cleaning assembly to oscillate back and forth around the axis of the cleaning assembly, with the oscillation range within the area where the wafer is located, thereby further improving the cleaning effect on the wafer. At the same time, the driving device 135 drives the cleaning assembly to restart its movement in the first direction until the first cleaning unit 121 leaves the area where the wafer is located, and the second cleaning unit 122 moves to the cleaning area at the bottom of the wafer. At this point, the first cleaning unit 121 stops cleaning the wafer, and the brush head in the second cleaning unit 122 begins to rotate, cleaning the central cleaning area of ​​the wafer. The second drying unit 312 then activates. Because there is residual liquid on the wafer, the rotating brush head causes liquid to splash. The second drying unit 312 limits the range of liquid splashing and simultaneously dries the liquid. The driving device 135 continues to move the cleaning assembly in the aforementioned direction until the second cleaning unit 122 has completed cleaning the central area of ​​the wafer. At this point, the second cleaning unit 122 stops working, and the driving device 135 moves the cleaning assembly in the opposite direction. The first drying unit 311 and the second drying unit 312 continue to operate, drying the bottom of the wafer, i.e., blowing away the water on the wafer. The cleaning process employs two cleaning methods: nozzles in the first cleaning unit 121 and brushes in the second cleaning unit 122, improving the cleanliness of the cleaning process. Pre-cleaning the central area reduces the cleaning area in subsequent cleaning processes, shortens the overall wafer cleaning time, and improves substrate cleaning efficiency. The first drying unit 311 and the second drying unit 312 not only block contamination but also quickly dry the substrate, shortening the cleaning time. Simultaneously, the waterproof baffle 400 can move rapidly left and right, stably protecting the substrate from contamination and ensuring no interference during substrate transfer, effectively preventing dirty liquid contamination and avoiding secondary contamination, thus improving the cleanliness of the cleaning process. Furthermore, the use of a low-friction cylinder in the second cleaning unit 122 effectively reduces pressure fluctuations in the brush head during the cleaning process, preventing issues such as wafer slippage and improving the safety of the cleaning process.

[0065] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A wafer cleaning apparatus, characterized by comprising: The support (100) comprises: A positioning assembly (110) is arranged on the support (100) and used for positioning a wafer; A cleaning assembly comprises a first cleaning part (121) and a second cleaning part (122), and the first cleaning part (121) and the second cleaning part (122) are movably arranged on the support (100); A driving mechanism is arranged on the support (100) and connected with the cleaning assembly, and used for driving the first cleaning part (121) and the second cleaning part (122) to move along a first direction, so that the first cleaning part (121) and the second cleaning part (122) clean the wafer along the first direction in sequence in a cleaning process, and the first cleaning part (121) and the second cleaning part (122) swing at the bottom of the wafer in the cleaning process.

2. The wafer cleaning apparatus according to claim 1, wherein The driving mechanism comprises: A guide member (131) is arranged on the support (100); A first moving member (132) is movably arranged on the guide member (131) along the first direction; A second moving member (133) is rotatably arranged on the first moving member (132) and used for fixing the cleaning assembly; A swinging device (134) is arranged on the first moving member (132) and connected with the second moving member (133), so as to drive the second moving member (133) to rotate on the first moving member (132); A driving device (135) is arranged on the support (100) and connected with the first moving member (132), so as to drive the first moving member (132) to move along the first direction on the guide member (131), so that the second moving member (133) and the cleaning assembly move along the first direction; the swinging device (134) is used for driving the second moving member (133) to rotate on the first moving member (132), so that the cleaning assembly swings around the rotation shaft of the second moving member (133) in the process of moving along the first direction.

3. The wafer cleaning apparatus according to claim 2, wherein The second moving member (133) is provided with a control assembly, and the control assembly comprises: A supply member (210) is arranged on the second moving member (133), one end of the supply member (210) is connected with the first cleaning part (121), and the other end of the supply member (210) is used for being connected with a liquid supply device; liquid of the liquid supply device flows through the supply member (210) and is discharged through the first cleaning part (121), so as to clean the wafer; A control part is arranged on the second moving member (133) and connected with the second cleaning part (122), and used for driving the second cleaning part (122) to move along a vertical direction; when the second cleaning part (122) contacts the bottom of the wafer, the control part drives the second cleaning part (122) to rotate, so as to clean the wafer.

4. The wafer cleaning apparatus according to claim 3, wherein The control part comprises: A first controller (221) is arranged on the second moving member (133) and connected with the second cleaning part (122), so as to drive the second cleaning part (122) to move along the vertical direction and contact the wafer; A second controller (222) is arranged on the second moving member (133), and the second controller (222) has a control rod (224) penetrating the second cleaning part (122) so that the second cleaning part (122) is arranged on the second controller (222) and is movable in the vertical direction, and the second controller (222) is used to drive the second cleaning part (122) to rotate so as to clean the wafer; A sensor (223) is arranged on the end of the second controller (222) to detect the pressure of the second cleaning part (122) on the wafer.

5. The wafer cleaning apparatus according to claim 3, wherein Further comprising: A first cover (310) is arranged on the second moving member (133) and is arranged between the cleaning assembly and the control assembly so as to separate the cleaning assembly and the control assembly; A second cover (320) is arranged around the first cover (310) to form a receiving space for collecting the liquid of the first cleaning part (121).

6. The wafer cleaning apparatus according to claim 5, wherein The first cover (310) is provided with a first drying member (311) and a second drying member (312), the first drying member (311) is arranged around the first cleaning part (121), the second drying member (312) is arranged around the second cleaning part (122), and the first drying member (311) and the second drying member (312) are both provided with a plurality of air holes for spraying air flow so that the first drying member (311) and the first cleaning part (121) form an independent cleaning area, and the second drying member (312) and the second cleaning part (122) form an independent cleaning area.

7. The wafer cleaning apparatus of claim 5, wherein A plurality of receiving members (314) are arranged on the second moving member (133) and are movable in the vertical direction, and the receiving members (314) penetrate the first cover (310); Wherein, the plurality of receiving members (314) move upward in the vertical direction, the wafer is placed on the receiving members (314), the plurality of receiving members (314) drive the wafer to move downward in the vertical direction so that the wafer contacts the positioning assembly (110).

8. The wafer cleaning apparatus of claim 1, wherein The positioning assembly (110) comprises: Symmetrically arranged positioning rods (111) are arranged on the support member (100) and are distributed on both sides of the cleaning assembly; Suction members (112) are arranged on the top of the positioning rods (111) and are used to contact the wafer to adsorb the wafer.

9. The wafer cleaning apparatus of claim 1, wherein Symmetrically arranged waterproof baffles (400) are arranged on the support member (100); the waterproof baffles (400) comprise: Support frames (410) are arranged on the support member (100) and are movable in the first direction; Baffle parts (420) are fixedly arranged on the top of the support frames (410); the baffle parts (420) are provided with isolation grooves (440) corresponding to the positions of the wafers. A gas supply member (430) is fixed to the baffle plate (420) and has one end in communication with the isolation groove (440) and the other end in communication with a supply device so that the gas from the supply device flows through the gas supply member (430) and the isolation groove (440) and is sprayed onto the upper surface of the wafer.

10. The wafer cleaning apparatus of claim 2, wherein The belt driving device (135) comprises: Symmetrically arranged driving wheels (136) rotatably arranged on the support (100); A conveyor belt (137) sleeved on the symmetrically arranged driving wheels (136) so that when one of the driving wheels (136) rotates, the other driving wheel (136) rotates synchronously; A belt driver (138) fixed to the support (100) and connected with one of the driving wheels (136) to drive the driving wheel (136) to rotate.

Images