Wafer feeding and discharging device and detection system thereof

Abstract

The application discloses a wafer loading and unloading device and a detection system thereof, and relates to the technical field of semiconductor processing equipment. The wafer loading and unloading device uses three vertically arranged soft rods with multiple annular grooves on the sidewalls to jointly bear multiple wafers. The three soft rods are controlled to move up and down and the spacing between the three soft rods is adjusted as required. The spatial position of the wafers at the same height of the three soft rods is limited by simultaneously applying pressure to the wafers at the same height. A hard elbow pipe is arranged at the top of the soft rod to guide the moving direction of the soft rod. When the soft rod is bent under the guidance, the wafers positioned by the soft rod are exposed so that the wafers are clamped by a clamp and are transported away. In the whole use process of the device, the annular grooves are used to contact the wafers, and the wafers are pre-positioned without frequent transfer. The wafer loading and unloading device has the technical effects of convenient use, simple wafer transfer process, small occupied space, high operation efficiency, difficulty in damaging the bottom surface of the wafer and strong applicability to wafers of different specifications.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing equipment, in particular to a wafer loading and unloading device and a detection system thereof. BACKGROUND

[0002] In wafer production, first, a silicon ingot is sliced by a wafer saw; after slicing, chemical etching is performed to remove crystal damage in the processing step, the wafer front surface and back surface are removed by grinding to remove saw marks and surface defects, and finally, polishing is performed to form a wafer; after the wafer is manufactured, the structure of the die needs to be detected; in the prior art, in order to improve the detection efficiency and reduce the labor intensity, an automatic wafer transfer device is generally used to assist the detection of the wafer.

[0003] A wafer detection system and method disclosed in a Chinese patent No. 202211239861.6 includes a wafer pre-adjusting device, a wafer detection device, a wafer taking and placing device, and a wafer loading and unloading device; in the entire wafer detection process, only the wafer to be detected needs to be placed on the wafer loading and unloading device, the wafer detection system can automatically transfer the wafer to be detected, adjust the orientation of the wafer to be detected, and perform related detection, and finally transport the detected wafer to the wafer loading and unloading device, thereby automating the entire wafer detection process and improving the detection efficiency.

[0004] Although the above-mentioned patent discloses a scheme that can realize automatic transfer of the wafer, the wafer needs to go through multiple steps of loading, pre-positioning, transferring, positioning, and testing in sequence during the transfer process, the process is complicated, the actions are not coherent, the equipment occupies a large space, the running efficiency is low, and the wafer is easily damaged during the transfer process due to the frequent contact with the bottom surface of the wafer; and due to the limitation of its own structure, it can only adapt to single-specification wafers, and the processing capacity for different wafers is limited, and the applicability is poor.

[0005] Therefore, there is a need for a wafer loading and unloading device that is convenient to use, simple to transfer wafers, occupies a small space, has high work efficiency, is not easy to damage the bottom surface of the wafer, and has strong applicability for different specifications of wafers. SUMMARY

[0006] The wafer loading and unloading device provided by the embodiments of the present application solves the technical problems of the prior art that the wafer automatic transfer device designed to assist wafer detection has a complicated work process, occupies a large space, has low running efficiency, is easy to damage the bottom surface of the wafer, and has poor applicability; and achieves the technical effects that the wafer loading and unloading device is convenient to use, simple to transfer wafers, occupies a small space, has high work efficiency, is not easy to damage the bottom surface of the wafer, and has strong applicability for different specifications of wafers.

[0007] The embodiment of the application provides a wafer feeding and discharging device, two in number, one for wafer feeding and the other for wafer discharging, which comprises a base carrier, a lifting plate assembly for driving the wafer carrying assembly to move up and down, a limiting tube assembly, a guide tube assembly, a wafer carrying assembly and a squeezing positioning assembly;

[0008] The limiting tube assembly comprises a connecting block positioned on the base carrier and three limiting units; the limiting units are positioned radially on the circumference of the connecting block and are provided with telescopic rods with vertically positioned tube bodies at one end;

[0009] The wafer carrying assembly comprises three vertically positioned rod-shaped carrying units; the carrying unit comprises a base hard rod and a carrying soft rod penetrating the tube body of the limiting unit and positioned on the top of the base hard rod;

[0010] The carrying soft rod comprises a soft magnetic material inner core and an outer sleeve; a row of annular limiting grooves are arranged on the outer wall of the outer sleeve;

[0011] The guide tube assembly is a combination of a plate body and a tube body, which guides the carrying soft rod of the wafer carrying assembly to change from straight to curve at a position close to the top of the wafer feeding and discharging device, thereby exposing the topmost wafer;

[0012] The squeezing positioning assembly is used for applying horizontal pressure to the carrying soft rod at a position close to the bottom of the tube body of the guide tube assembly, thereby squeezing and positioning the wafer.

[0013] Further, the lifting plate assembly is positioned at a position close to the bottom of the base carrier and comprises a lifting plate and a plate displacement assembly; the lifting plate is a horizontally arranged hard plate body, and the surface in contact with the wafer carrying assembly is a plane, which moves up and down under the driving of the plate displacement assembly; and the plate displacement assembly is fixed on the base carrier.

[0014] Further, the limiting unit comprises a telescopic carrier rod and a vertically positioned limiting tube;

[0015] The telescopic carrier rod is a telescopic rod limited to be telescoped by a control unit and is horizontally arranged, one end of which is positioned on the connecting block;

[0016] The vertically positioned limiting tube is a vertically arranged hard tube body, which is positioned at the end of the telescopic carrier rod far away from the connecting block, and the inner diameter is greater than the diameter of the carrying soft rod of the wafer carrying assembly and the difference is less than 4 mm.

[0017] Further, the guide tube assembly comprises three guide units corresponding to the limiting units one by one;

[0018] The guide unit comprises a guide elbow, a vertically positioned connecting plate and a connecting elbow plate;

[0019] The vertically positioned connecting plate is a strip-shaped hard plate body, which is vertically arranged and has a circular arc cross section.

[0020] The vertical adapter plate is located on the side of the soft rod carrier away from the wafer;

[0021] The bottom of the vertical adapter plate is fixed to the top of the vertical limiting tube;

[0022] The adapter bending plate is used to connect the guide bending tube and the vertical adapter plate, is vertically arranged, and has a overall shape of a vertical line, a bottom is fixed to the top of the vertical adapter plate, and a cross section is in an arc shape;

[0023] The guide bending tube is used to guide the movement of the soft rod carrier and control the bending direction thereof, is an arc-shaped circular tube, is vertically arranged, and a bottom is fixed to the top of the adapter bending plate, and the combination of the adapter bending plate and the guide bending tube is still in an arc shape;

[0024] The vertical adapter plate and the adapter bending plate are both made of ferromagnetic materials.

[0025] Further, the number of the extrusion positioning assemblies is three, and each corresponds to a carrier unit, and the extrusion positioning assembly comprises a support frame, a contact body, and a contact body displacement assembly;

[0026] The guide unit is provided with a through slot for the contact body to penetrate;

[0027] The support frame is a hard support frame and is fixed to the guide unit;

[0028] The contact body is used to extrude the soft rod carrier, and is driven by the contact body displacement assembly to approach or move away from the soft rod carrier;

[0029] The contact body displacement assembly is positioned on the support frame;

[0030] The three extrusion positioning assemblies simultaneously apply pressure to the soft rod carrier at the same force, and then the spatial position of the wafer close to the contact body is determined by limiting the position of the soft rod carrier.

[0031] Preferably, a reinforcing assembly is further included;

[0032] The reinforcing assembly comprises a ring-shaped frame body, a combined support, and a reinforcing telescopic rod;

[0033] The ring-shaped frame body is a horizontally arranged hard ring-shaped frame body and is arranged close to the bottom of the guide bending tube;

[0034] The combined support is fixed to the ring-shaped frame body and is also fixed to the base carrier;

[0035] The number of the reinforcing telescopic rods is multiple, each corresponds to a guide bending tube, is positioned on the ring-shaped frame body, and one end is positioned on the guide bending tube.

[0036] Preferably, the adapter block is cylindrical; part of the telescopic carrier rod is fixed on the adapter block, and the other telescopic carrier rod is rotatably connected to the adapter block and rotates around the axis of the adapter block;

[0037] The limiting tube assembly further comprises a carrier rod rotating assembly for driving the telescopic carrier rod rotatably connected to the adapter block to rotate;

[0038] When it is needed to load wafers into the wafer loading and unloading device or unload wafers from the wafer loading and unloading device, the wafers can be put into or taken out from the top of the wafer loading and unloading device one by one, or the telescopic carrier rod can be controlled to rotate to expose the space for the wafers to enter or exit, and the wafers can be stored or taken out from one side of the wafer loading and unloading device.

[0039] Preferably, the carrier soft rod is composed of multiple segments, and the multiple segments of the outer sleeve soft tube are magnetically attracted together;

[0040] The abutting body comprises an abutting wheel and a wheel body support; the abutting wheel is a vertically arranged cylindrical wheel body; and the wheel body support is a hard frame body in the shape of a Chinese character and is fixed on the abutting body displacement assembly;

[0041] The abutting wheel is driven by the motor to rotate; after the abutting wheel abuts against the carrier soft rod, it drives the abutted one or two segments of the carrier soft rod to rotate.

[0042] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0043] By providing a wafer loading and unloading device, the device uses three vertically arranged soft rods with multiple annular grooves on the side walls and the same structure to jointly carry multiple wafers, the three soft rods are controlled to move up and down and the spacing between them is adjusted as needed; the space position of the wafers at the same height is limited by simultaneously pressing the three soft rods at the same height; a hard elbow pipe for guiding the moving direction of the soft rod is arranged at the top of the soft rod, and when the soft rod bends under the guidance, the wafers positioned by the soft rod are exposed to be clamped by the clamp and carried away; the use process of the whole device uses the annular grooves to contact the wafers and does not need to be frequently transferred to achieve the pre-positioning; the technical problems of the prior art, such as complicated operation process, large occupied space, low operation efficiency, easy damage to the bottom surface of the wafer, and poor applicability of the wafer automatic transfer equipment designed to assist wafer detection, are effectively solved; and the technical effects of convenient use of the wafer loading and unloading device, simple wafer transfer process, small occupied space, high operation efficiency, no easy damage to the bottom surface of the wafer, and strong applicability to different specifications of wafers are achieved. BRIEF DESCRIPTION OF DRAWINGS

[0044] Figure 1 It is an appearance structure schematic diagram of the wafer loading and unloading device of the present application;

[0045] Figure 2 Fig. 9 is a schematic view of the internal structure of the wafer loading and unloading device of the present application;

[0046] Figure 3 Fig. 10 is a schematic view of the bottom structure of the wafer loading and unloading device;

[0047] Figure 4 Fig. 11 is a sectional view of the wafer loading and unloading device;

[0048] Figure 5 Fig. 12 is a schematic view of the structure of the extrusion positioning assembly;

[0049] Figure 6 Fig. 13 is a schematic view of the structure of the bearing soft rod;

[0050] Figure 7 Fig. 14 is a schematic view of the layout relationship of the sliding clamping body on the wafer carrier;

[0051] Figure 8 Fig. 15 is a schematic view of the layout relationship of the lifting support plate on the wafer carrier;

[0052] Figure 9 Fig. 16 is a schematic view of the structure of the bearing rod rotating assembly;

[0053] Figure 10 Fig. 17 is a schematic view of the positional relationship between the extrusion positioning assembly and the bearing soft rod;

[0054] Figure 11 Fig. 18 is a schematic view of the state of the wafer loading and unloading device of the present application when directly loading and unloading on the wafer carrier;

[0055] Figure 12 Fig. 19 is a schematic view of the positional relationship between the wafer loading and unloading device of the present application and the wafer carrier when directly loading and unloading on the wafer carrier;

[0056] Figure 13 Fig. 20 is a schematic view of the positional relationship between the suction block and the lifting plate.

[0057] In the drawings:

[0058] wafer 001, wafer carrier 002, sliding clamping body 003, lifting support plate 004, base carrier 100, lifting plate 210, plate displacement assembly 220, link block 310, support carrier 320, telescopic bearing rod 330, vertically arranged limiting tube 340, bearing rod rotating assembly 350, guide elbow 410, vertically arranged link plate 420, link elbow plate 430, through slot 440, base hard rod 510, suction block 511, bearing soft rod 520, inner core 521, outer sleeve 522, limiting slot 523, support frame 610, abutting body 620, abutting wheel 621, wheel body support 622, abutting body displacement assembly 630, annular frame 710, displacement guide rail 711, combined support 720, reinforced telescopic rod 730. DETAILED DESCRIPTION

[0059] For the purpose of promoting the understanding of the present application, the present application will be described in further detail below with reference to the attached drawings; in these drawings, there are shown preferred embodiments of the present application; however, the present application can be implemented in many different forms and is not limited to the embodiments described herein; rather, these embodiments are provided so as to make the disclosure of the present application more thorough and complete.

[0060] It should be noted that the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only embodiments.

[0061] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs; the terms used herein in the specification only for the purpose of describing specific embodiments and are not intended to limit the present application; the term "and / or" used herein includes any and all combinations of one or more related listed items.

[0062] Embodiment one

[0063] As shown in Figures 1 to 6 , the number of wafer loading and unloading devices of the present application is two, one for wafer loading and one for wafer unloading; the wafer is indicated by mark 001 in the middle; the wafer loading and unloading device includes a base carrier 100, a lifting plate assembly, a limiting tube assembly, a guide tube assembly, a wafer carrying assembly, an extrusion positioning assembly, a power assembly and a control unit. Figure 1

[0064] The base carrier 100 is tubular, barrel-shaped or frame structure, used to carry and support other components of the wafer loading and unloading device, preferably a vertical hard tube body.

[0065] As shown in Figure 2 and Figure 3 , the lifting plate assembly is used to drive the wafer carrying assembly to move up and down, positioned near the bottom of the base carrier 100, including a lifting plate 210 and a plate displacement assembly 220; the lifting plate 210 is a horizontal hard plate body, the surface in contact with the wafer carrying assembly is a plane, which moves up and down under the driving of the plate displacement assembly 220; the plate displacement assembly 220 is fixed on the base carrier 100 and positioned on the surface of the lifting plate 210 away from the wafer carrying assembly; the plate displacement assembly 220 is preferably a vertical hard telescopic rod, which is controlled to extend and retract under the coordinated control of the control unit and the power assembly, thereby driving the lifting plate 210 to move.

[0066] As shown in Figure 1 , Figure 2 and​Figure 4 The limiting tube assembly is used to limit the position of the wafer carrying assembly, thereby making it applicable to different specifications of wafers, and includes the adapter block 310, the support carrier 320, and three limiting units;

[0067] The adapter block 310 is a hard block located directly above the lifting plate 210 and serves to carry and position the three limiting units. It is fixed to the base carrier 100 through the support carrier 320 at the bottom of the adapter block 310. The adapter block 310 is preferably a vertically arranged hard cylinder. The support carrier 320 is a hard support.

[0068] The limiting units are positioned radially around the circumference of the adapter block 310. The limiting units include the telescopic carrier 330 and the vertically arranged limiting tube 340. The telescopic carrier 330 is a telescopic rod limited by the control unit for telescopic extension and is horizontally arranged with one end positioned on the adapter block 310. The vertically arranged limiting tube 340 is a vertically arranged hard tube positioned at the end of the telescopic carrier 330 away from the adapter block 310. It is used to limit the carrying unit of the wafer carrying assembly and guide the carrying unit to move up and down. The inner diameter of the limiting tube is greater than the diameter of the carrying soft rod 520 of the wafer carrying assembly with a difference of less than 4 mm. By adjusting the telescopic amount of the telescopic carrier 330, the wafer loading and unloading device of the present application can be adapted to different specifications of wafers.

[0069] Preferably, the spacing between the limiting units is the same.

[0070] Preferably, the top end and the bottom end of the vertically arranged limiting tube 340 are provided with horn-shaped guide tubes.

[0071] As shown in Figure 1 , Figure 2 and Figure 4 The guide tube assembly is used to guide the stable movement of the carrying unit and to bend as needed, and includes three guide units. The three guide units correspond one-to-one to the three limiting units.

[0072] The guiding unit includes a guiding bend 410, a vertical connecting plate 420, and a connecting bend 430. The vertical connecting plate 420 is a strip-shaped rigid plate, vertically arranged, with an arc-shaped cross-section. The curved surface near the supporting flexible rod 520 matches the outer wall curved surface of the supporting flexible rod 520. The vertical connecting plate 420 is located on the side of the supporting flexible rod 520 away from the wafer. The bottom of the vertical connecting plate 420 is fixed to the top of the vertical limiting tube 340. The connecting bend 430 is used to connect the guiding bend 410 and the vertical connecting plate 420, is vertically arranged, and has an overall shape resembling a horizontal line. The bottom of the connecting plate 420 is fixed to the top of the vertical connecting plate 420. The cross-section is arc-shaped and the curved surface near the supporting flexible rod 520 matches the outer wall curved surface of the supporting flexible rod 520. The guide bend 410 is used to guide the movement of the supporting flexible rod 520 and control its bending direction. It is an arc-shaped round tube with an inner diameter larger than the diameter of the supporting flexible rod 520 and a difference of less than 4 mm. It is vertically set and the bottom is fixed to the top of the connecting bend 430. The combination with the connecting bend 430 is still arc-shaped. The materials of the vertical connecting plate 420 and the connecting bend 430 are both ferromagnetic.

[0073] like Figure 1 , Figure 2 and Figure 4 As shown, the wafer carrier assembly is used to support the wafer and includes three carrier units; the three carrier units correspond one-to-one with three guiding units and three limiting units;

[0074] The load-bearing unit includes a basic rigid rod 510 and a load-bearing flexible rod 520;

[0075] The basic rigid rod 510 is a rigid straight rod, vertically arranged, with a diameter less than or equal to the diameter of the supporting flexible rod 520, and a hemispherical bottom or a caster wheel positioned thereon; the bottom of the basic rigid rod 510 is directly or indirectly in close contact with the top of the lifting plate 210;

[0076] The bottom of the load-bearing flexible rod 520 is fixed to the top of the basic rigid rod 510, and the top is inserted into the guide bend 410;

[0077] like Figure 6 As shown, the supporting flexible rod 520 includes an inner core 521 and an outer flexible tube 522;

[0078] The inner core 521 is a rod made of soft magnetic material;

[0079] The outer flexible tube 522 is a rubber tube, preferably made of silicone, which is fitted over and covers the inner core 521. The presence of the inner core 521 can prevent (reduce) the bearing flexible rod 520 from being compressed along the axial direction, and at the same time allow the bearing flexible rod 520 to adhere to the vertical connecting plate 420 and the connecting bend plate 430 under the influence of magnetic force.

[0080] The outer wall of the outer flexible tube 522 is provided with a row of limiting grooves 523; the limiting grooves 523 are annular grooves with a V-shaped longitudinal section; the three limiting grooves 523 at the same height on the three supporting flexible rods 520 of the three supporting units position a wafer.

[0081] like Figure 5 As shown, the extrusion positioning assembly is used to apply pressure to the supporting flexible rod 520 near the top of the vertical connecting plate 420 to achieve wafer positioning at that height; there are three extrusion positioning assemblies, corresponding one-to-one with the supporting unit, including a support frame 610, an abutment 620, and an abutment displacement assembly 630; the guide unit is provided with a through groove 440 for the abutment 620 to enter; the through groove 440 is a through groove, located on the vertical connecting plate 420 and / or the guide bend 410 and near the top of the vertical connecting plate 420; the support frame 610 is a rigid support. The frame, which supports the contact body displacement assembly 630, is fixed on the guide unit. The contact body 620 is used to abut and compress the bearing flexible rod 520, preferably in the form of a plate, and moves closer to or away from the bearing flexible rod 520 under the action of the contact body displacement assembly 630. The contact body displacement assembly 630 is positioned on the support frame 610 and is preferably a telescopic rod structure that extends and retracts under the control of the control unit. The three compression positioning assemblies simultaneously apply pressure to the bearing flexible rod 520 with the same force, thereby determining the spatial position of the wafer close to the contact body 620 by restricting the position of the bearing flexible rod 520.

[0082] The power assembly is used to provide power for the operation of each component of the wafer loading and unloading device of this application, and the control unit plays the role of controlling the coordinated operation of each component of the wafer loading and unloading device. Both are existing technologies and will not be described in detail here.

[0083] Preferably, the control unit is a combination of a programmable logic controller and control buttons.

[0084] A wafer inspection system includes two wafer loading / unloading devices as described in this application, and also includes a wafer clamping and shifting assembly, an inspection device, and a wafer stage 002. The wafer clamping and shifting assembly, the inspection device, and the wafer stage 002 are all prior art. The wafer clamping and shifting assembly is a multi-joint robotic arm with a three-jaw gripper at the arm head. The wafer stage 002 is used to carry the wafer for subsequent inspection. The inspection device is used to perform thickness inspection, warpage inspection, defect inspection, chip resistance inspection, probe inspection, surface morphology inspection, and / or surface roughness inspection on the wafer. Different inspection configurations are equipped with corresponding inspection devices to form different wafer inspection systems.

[0085] Furthermore, such as Figure 7As shown, the wafer carrier 002 is a platform, on which three sliding clamping bodies 003 are arranged; the sliding clamping bodies 003 are slidingly positioned on the wafer carrier 002, and controlled to move towards each other to clamp the wafer.

[0086] Further, as shown in Figure 8 As shown, the wafer carrier 002 is a platform, in the center of which a groove is arranged for accommodating a lifting plate 004 and a bearing assembly thereof; the bearing assembly of the lifting plate 004 is positioned in the groove of the wafer carrier 002, and preferably is a telescopic rod structure; the lifting plate 004 is a hard plate body with a flat top surface, and is positioned on the top of the bearing assembly; when the lifting plate 004 is lowered to the lowest position, it is lower than the top surface of the wafer carrier 002; when the wafer carrier 002 needs to carry a wafer, the lifting plate 004 is first controlled to be lifted, and then is lowered after the wafer from the wafer clamping and shifting assembly is contacted, so that the wafer is placed on the wafer carrier 002.

[0087] When the wafer loading and unloading device is used, one of the two wafer loading and unloading devices is used to output wafers to be detected, and the other is used to store the wafers after detection; for the convenience of description, the two wafer loading and unloading devices are defined as a first device and a second device respectively; in the initial state, the first device stores wafers, and the edges of the wafers are filled into the limiting grooves 523 and are thus constrained; when detection is needed, the lifting plate 210 is controlled to move upwards to gradually lift the bearing soft rod 520 and insert it into the guide elbow 410; during the upward movement of the lifting plate 210, the pressing positioning assembly frequently operates to frequently press the bearing soft rod 520 close to it, so that the wafer at the same height as the abutting body 620 is quickly positioned (aligned); thereafter, the position of the bearing soft rod 520 close to the joint elbow plate 430 is guided to change from straight to bent, so that the wafer at the top of the first device is exposed (at this time, the limiting groove 523 only bears the wafer at the top of the first device, and does not limit the wafer to be taken out from the top of the first device); thereafter, the wafer clamping and shifting assembly clamps the wafer at the top of the first device and moves it to the wafer carrier 002 for testing; after the testing is completed, the wafer clamping and shifting assembly places the wafer after the testing on the top of the second device and makes the edges of the wafer filled into the limiting grooves 523 of the three bearing soft rods 520; thereafter, the lifting plate 210 of the second device is controlled to move downwards by a certain distance to make room for the second device to carry new wafers after the testing.

[0088] When it is needed to load wafers into the first device or to pour out the wafers in the second device, the first device and the second device can be directly removed and used as containers.

[0089] Further, as shown in Figure 1 and Figure 9As shown, in order to guide the tube assembly more stable and further ensure the stability of the wafer loading and unloading device of the application; the wafer loading and unloading device further comprises a reinforcing assembly; the reinforcing assembly comprises a ring-shaped frame body 710, a combined support 720 and a reinforcing telescopic rod 730; the ring-shaped frame body 710 is a horizontal hard annular frame body, which covers all the guide units and is arranged near the bottom of the guide elbow pipe 410; the combined support 720 is a hard frame body, which is in the shape of a plate, a rod or a frame structure, is fixed on the ring-shaped frame body 710 and the base carrier 100 at the same time, and plays a role of bearing and supporting the ring-shaped frame body 710; the reinforcing telescopic rod 730 is in a one-to-one correspondence with the guide elbow pipe 410, is a telescopic rod controlled by the control unit to extend and retract, is positioned on the ring-shaped frame body 710 and one end of the reinforcing telescopic rod 730 is positioned on the guide elbow pipe 410; the reinforcing telescopic rod 730 extends and retracts synchronously with the telescopic carrier rod 330, thereby adapting to wafers of different specifications.

[0090] In order to facilitate the efficient loading of the wafer into the wafer loading and unloading device of the application and the efficient pouring out of the wafer from the wafer loading and unloading device, preferably, as shown in the drawings, Figure 9 As shown, the connection block 310 is in the shape of a cylinder; part of the telescopic carrier rod 330 is fixed on the connection block 310, and the other telescopic carrier rods 330 are rotationally connected to the connection block 310 and rotate around the axis of the connection block 310; the limiting tube assembly further comprises a carrier rod rotating assembly 350; the carrier rod rotating assembly 350 is used to drive the telescopic carrier rod 330 rotationally connected to the connection block 310 to rotate; when it is needed to load wafers into the wafer loading and unloading device or unload the wafers from the wafer loading and unloading device, the wafers can be put into or taken out from the wafer loading and unloading device one by one from the top of the wafer loading and unloading device, or the telescopic carrier rod 330 can be controlled to rotate to expose the space for the wafers to enter and exit, and the wafers can be stored or taken out from one side of the wafer loading and unloading device; when the wafers are stored or taken out from one side of the wafer loading and unloading device, if the positions of the wafers in the wafer frame match the limiting grooves 523 on the carrier soft rod 520, the wafers can be directly stored or taken out in the form of a whole frame.

[0091] Further, the carrier rod rotating assembly 350 is in the form of a telescopic rod structure, is controlled by the control unit to extend and retract, one end of the carrier rod rotating assembly 350 is hinged to the telescopic carrier rod 330 fixed on the connection block 310, and the other end of the carrier rod rotating assembly 350 is hinged to the telescopic carrier rod 330 rotationally connected to the connection block 310, and the carrier rod rotating assembly 350 drives the telescopic carrier rod 330 to rotate when it extends and retracts.

[0092] Further, the ring-shaped frame body 710 is provided with an arc-shaped displacement guide rail 711; the reinforcing telescopic rod 730 is slidingly positioned on the displacement guide rail 711, and the reinforcing telescopic rod 730 rotates with the telescopic carrier rod 330 when the telescopic carrier rod 330 rotates.

[0093] Preferably, in order to facilitate the low-cost replacement of the damaged soft rod 520, the soft rod 520 is composed of multiple segments, and the multiple segments of the outer sleeve soft tube 522 are magnetically attracted together.

[0094] Preferably, as shown in Figure 10 The abutting body 620 includes an abutting wheel 621 and a wheel body support 622; the abutting wheel 621 is a vertical cylindrical wheel body, which is rotationally connected to the wheel body support 622; the wheel body support 622 is a hard bracket body in the shape of a Chinese character "fang", which serves to support and bear the abutting wheel 621, and is fixed to the abutting body displacement assembly 630.

[0095] Preferably, the outer wall of the soft rod 520 and the outer wall of the abutting wheel 621 are densely covered with anti-slip lines; the abutting wheel 621 is internally provided with a motor, which drives the rotation of the abutting wheel 621; after the abutting wheel 621 abuts against the soft rod 520, it drives the rotation of the abutted one or two segments of the soft rod 520; the rotation while being squeezed can further reduce the damage to the wafer caused by squeezing, and can assist the wafer to be positioned faster and more stably, thereby further ensuring the accuracy of positioning.

[0096] Preferably, the motor driving the rotation of the abutting wheel 621 is provided with a torque detection function, and the motor is signal-connected to the control unit; if it is found that a large torque is required to drive the rotation of the one or two segments of the soft rod 520, it indicates that there is a partial wafer placement in the wafer loading and unloading device, which is inclined or even misaligned; at this time, the control unit sends an alarm message.

[0097] Preferably, a pressure sensor is positioned between the wheel body support 622 and the abutting body displacement assembly 630; the pressure sensor is signal-connected to the control unit, and the presence of the pressure sensor can provide a reference basis for the control unit to control the amount of movement of the abutting body 620.

[0098] The technical solutions in the embodiments of the present application have at least the following technical effects or advantages:

[0099] The technical problems of the prior art, such as complicated operation process, large space occupation, low running efficiency, easy damage to the bottom surface of the wafer, and poor applicability of the wafer automatic transfer device designed to assist wafer detection, are solved; the technical effects of convenient use of the wafer loading and unloading device, simple wafer transfer process, small space occupation, high operation efficiency, no easy damage to the bottom surface of the wafer, and strong applicability to different specifications of wafers are achieved.

[0100] Embodiment two

[0101] In order to further simplify the wafer loading and unloading process and avoid the influence of the wafer clamping displacement assembly on the position accuracy of the wafer placement, as shown in Figures 11 to 13As shown, the embodiments of the present application make the following improvements on the basis of the above embodiments:

[0102] The setting of the wafer clamping and shifting assembly is cancelled;

[0103] The two wafer loading and unloading devices in the above embodiments are inverted as a whole, and the guide elbow 410 is located at the lowermost part of the wafer loading and unloading device and is a C-shaped elbow. The two wafer loading and unloading devices are respectively detachably positioned on two multi-joint mechanical arms, and the two mechanical arms are arranged close to the wafer table 002.

[0104] One end of the base hard rod 510 close to the lifting plate 210 is positioned with an attracting block 511; the attracting block 511 is a magnet block or has a built-in magnet.

[0105] Further, a plurality of cow eye balls are positioned on the surface of the attracting block 511 close to the lifting plate 210; the lifting plate 210 is made of ferromagnetic material; and the cow eye balls on the attracting block 511 always abut against the lifting plate 210.

[0106] The wafer table 002 is a platform, and a recess for accommodating the lifting support plate 004 and its bearing assembly is arranged at the center position of the wafer table 002; the bearing assembly of the lifting support plate 004 is positioned in the recess of the wafer table 002 and is preferably a telescopic rod structure; the lifting support plate 004 is a hard plate body with a flat top surface and is positioned on the top of the bearing assembly; the lifting support plate 004 can be lower than the top surface of the wafer table 002; when the wafer table 002 needs to carry a wafer, the lifting support plate 004 is first lifted, and then is lowered after the wafer from the wafer clamping and shifting assembly is contacted, so that the wafer is placed on the wafer table 002.

[0107] When the wafer on the first device needs to be transferred to the wafer table 002, the first device is controlled to directly move to the upper side of the wafer table 002, and the wafer is unloaded from the bottom of the first device in cooperation with the lifting support plate 004; when the wafer on the wafer table 002 needs to be transferred to the second device, the second device is controlled to directly move to the upper side of the wafer table 002, and the wafer is loaded into the second device from the bottom of the second device in cooperation with the lifting support plate 004.

[0108] The above only describes the preferred embodiments of the present application and is not used to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer on-off device, characterized by: Two, one for the wafer loading, one for the wafer unloading, including the base carrier (100), lift plate assembly for driving wafer carrier assembly up and down, limiting tube assembly, guide tube assembly, wafer carrier assembly, extrusion positioning assembly; The limiting tube assembly includes an adapter block (310) positioned on the base carrier (100) and three limiting units; The limiting unit is positioned radially on the circumference of the adapter block (310), and the telescopic rod with a vertically positioned tube body is provided at one end; The wafer carrier assembly includes three vertically positioned rod-shaped carrier units; The carrier unit includes a base hard rod (510) and a carrier soft rod (520) penetrating the tube body of the limiting unit and positioned at the top of the base hard rod (510); The carrier soft rod (520) includes a soft magnetic material inner core (521) and an outer sleeve hose (522); A row of annular limiting grooves (523) are provided on the outer wall of the outer sleeve hose (522); The guide tube assembly is a combination of a plate body and a tube body, guiding the carrier soft rod (520) of the wafer carrier assembly to change from straight to curve at a position close to the top of the wafer loading and unloading device, thereby exposing the topmost wafer; The extrusion positioning assembly is used to apply horizontal pressure to the carrier soft rod (520) at a position close to the bottom of the tube body of the guide tube assembly, thereby extruding and positioning the wafer.

2. The wafer on-off device of claim 1, wherein: The lifting plate assembly is positioned at a position close to the bottom of the base carrier (100) and includes a lifting plate (210) and a plate displacement assembly (220); The lifting plate (210) is a horizontally arranged hard plate body, and the surface in contact with the wafer carrier assembly is a plane, which moves up and down under the drive of the plate displacement assembly (220); The plate displacement assembly (220) is fixed on the base carrier (100).

3. The wafer on / off loading device of claim 2, wherein: The limiting unit includes a telescopic carrier rod (330) and a vertically positioned limiting tube (340); The telescopic carrier rod (330) is a telescopic rod limited to be telescoped by a control unit, which is horizontally arranged and positioned at one end of the adapter block (310); The vertically positioned limiting tube (340) is a vertically arranged hard tube body positioned at one end of the telescopic carrier rod (330) away from the adapter block (310), and the inner diameter is greater than the diameter of the carrier soft rod (520) of the wafer carrier assembly with a difference of less than 4 mm.

4. The wafer on / off loading device of claim 3, wherein: The guide tube assembly includes three guide units corresponding to the limiting units; The guide unit includes a guide elbow (410), a vertically positioned adapter plate (420), and an adapter elbow (430); The vertically positioned adapter plate (420) is a strip-shaped hard plate body vertically arranged with a circular arc cross section; The vertically positioned adapter plate (420) is located on the side of the carrier soft rod (520) away from the wafer; The bottom of the vertically positioned adapter plate (420) is fixed on the top of the vertically positioned limiting tube (340); The adapter elbow (430) is used to connect the guide elbow (410) and the vertically positioned adapter plate (420), is vertically arranged, has a overall shape of a vertical line, and has a circular arc cross section with the bottom fixed on the top of the vertically positioned adapter plate (420). The guide elbow (410) is used for guiding the movement of the bearing soft rod (520) and controlling the bending direction of the bearing soft rod (520), and is an arc-shaped circular pipe arranged vertically and fixed at the top of the connecting elbow plate (430) to form an arc shape with the connecting elbow plate (430); The vertical connecting plate (420) and the connecting elbow plate (430) are both made of ferromagnetic materials.

5. The wafer on / off loading device of claim 4, wherein: The number of the extrusion positioning assemblies is three, and each of the extrusion positioning assemblies corresponds to one bearing unit and comprises a support frame (610), a contact body (620) and a contact body displacement assembly (630). The guide unit is provided with a through slot (440) for the contact body (620) to probe into. The support frame (610) is a hard support frame fixed on the guide unit. The contact body (620) is used for extruding the bearing soft rod (520) and is driven by the contact body displacement assembly (630) to move close to or away from the bearing soft rod (520). The contact body displacement assembly (630) is positioned on the support frame (610). The three extrusion positioning assemblies simultaneously apply pressure to the bearing soft rod (520) with the same force, so as to determine the spatial position of the wafer close to the contact body (620) by limiting the position of the bearing soft rod (520).

6. The wafer on / off loading device of claim 4, wherein: The reinforcing assembly further comprises a ring-shaped frame body (710), a combined support (720) and a reinforcing telescopic rod (730). The ring-shaped frame body (710) is a horizontal hard ring-shaped frame body arranged close to the bottom of the guide elbow (410). The combined support (720) is fixed on the ring-shaped frame body (710) and the base carrier (100). The number of the reinforcing telescopic rods (730) is multiple, and each of the reinforcing telescopic rods (730) corresponds to one guide elbow (410) and is positioned on the ring-shaped frame body (710) and one end of each of the reinforcing telescopic rods (730) is positioned on the guide elbow (410). The connecting block (310) is a cylindrical shape; some telescopic carrier rods (330) are fixed on the connecting block (310), and the other telescopic carrier rods (330) are rotatably connected to the connecting block (310) and rotate around the axis of the connecting block (310); 7. The wafer on-load off-load device of claim 1, wherein: The limiting tube assembly further comprises a carrier rod rotating assembly (350) used for driving the telescopic carrier rod (330) rotatably connected to the connecting block (310) to rotate. When the wafer feeding and discharging device needs to be loaded with wafers or the wafers on the wafer feeding and discharging device need to be unloaded, the wafers can be put into or taken out from the wafer feeding and discharging device one by one from the top of the wafer feeding and discharging device, or the telescopic carrier rod (330) can be controlled to rotate to expose a space for the wafers to enter or exit, and the wafers can be stored or taken out from one side of the wafer feeding and discharging device. The bearing soft rod (520) is composed of multiple segments and multiple outer sleeve soft tubes (522) are magnetically attracted together.

8. The wafer on / off loading device of claim 5, wherein: The contact body (620) comprises a contact wheel (621) and a wheel body support (622); the contact wheel (621) is a vertically arranged cylindrical wheel body; and the wheel body support (622) is a hard-shaped support fixed on the contact body displacement assembly (630). The contact wheel (621) rotates under the driving of a motor. ​ The abutting wheel (621) abuts the carrying soft rod (520) to drive it to rotate one or two sections of the carrying soft rod (520).

9. A wafer inspection system, characterized by: The wafer loading and unloading device comprises two wafer loading and unloading devices as claimed in any one of claims 1 to 7, a wafer clamping and shifting assembly, a detection device and a wafer carrier (002). The wafer clamping and shifting assembly is a multi-joint robot arm with a three-jaw chuck as the arm head; the wafer carrier (002) is used for carrying wafers for subsequent detection. The wafer carrier (002) is a platform, which is provided with three sliding clamping bodies (003) or a lifting supporting plate (004).

10. The wafer inspection system of claim 9, wherein: The two wafer loading and unloading devices are both inverted as a whole; the two wafer loading and unloading devices are respectively detachably positioned on two multi-joint robot arms, which are both arranged close to the wafer carrier (002). The end of the base hard rod (510) close to the lifting plate assembly is positioned with an attracting block (511); the attracting block (511) is a magnet block or an inner magnet. The wafer carrier (002) is a platform, which is provided with a groove in the center position for accommodating the lifting supporting plate (004) and its carrying assembly, and is also provided with the lifting supporting plate (004) and its carrying assembly.

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